Low mutual coupling phased array antenna unit and phased array antenna

Abstract

The embodiment of the present application provides a low mutual coupling phased array antenna unit and a phased array antenna, and belongs to the technical field of microwave antennas.The antenna unit comprises a first component and a second component comprising a radiating element.A first metal floor, a first dielectric substrate and a second metal floor in the first component are pressed together in a bottom-up order.A feeding structure is arranged on the second metal floor.A wave absorbing plate is inlaid between the first metal floor, the first dielectric substrate and the second metal floor, and the feeding structure is located in the wave absorbing plate, so that a kind of wave absorbing material is added around the feed line to absorb the coupling between antenna units, and the isolation between antenna units is reduced.Meanwhile, the inlaid mode of the wave absorbing plate does not occupy additional space, and can be applied to miniaturization and integration.In addition, the wave absorbing plate does not exist the condition of leaking electromagnetic signal, and will not affect the performance of the subsequent circuit.

Description

Technical Field

[0001] This invention relates to the field of microwave antenna technology, and more specifically, to a low mutual coupling phased array antenna element and a phased array antenna. Background Technology

[0002] Phased array antennas have been extensively studied by antenna researchers due to their ability to flexibly control beams and are frequently designed for practical applications such as positioning and tracking. Microstrip antennas are widely used as phased array antenna elements because of their small size, flexible structure, ease of modifying electrical performance, and ease of integration. In microstrip antenna arrays, antenna elements are typically placed close together to reduce the array size, but this increases mutual coupling between antenna elements. Therefore, reducing mutual coupling is a crucial issue in microstrip antenna array design.

[0003] Several methods for suppressing coupling have been proposed. The first is to introduce additional circuitry as a decoupling network into the feed structure. However, this method occupies a large amount of space and is not suitable for miniaturization and integration. The second is to etch defective ground structures onto the antenna's metallic ground plane, utilizing the high impedance characteristics of these defective ground structures to reduce mutual coupling between antenna elements. However, this method leaks electromagnetic signals onto the back-side circuitry, affecting the performance of subsequent circuits. The third method is to add some band-stop resonant structures between the antenna elements to improve mutual coupling. However, this method affects the radiation characteristics of the antenna elements themselves. Summary of the Invention

[0004] The present invention aims to provide a low mutual coupling phased array antenna element and a phased array antenna, which can reduce the mutual coupling between antenna elements in the antenna array design, while ensuring that the antenna element is suitable for miniaturization and integration, as well as the radiation characteristics of the antenna element and the performance of the subsequent circuit.

[0005] The embodiments of the present invention provide the following technical solutions:

[0006] In a first aspect, embodiments of the present invention provide a low mutual coupling phased array antenna element, including a first component and a second component;

[0007] The second component includes a radiating element;

[0008] The first component includes a first metal ground plane, a first dielectric substrate, an absorbing plate, a second metal ground plane, and a power supply structure.

[0009] The first metal floor, the first dielectric substrate, and the second metal floor are pressed together in a bottom-to-top order;

[0010] The power supply structure is disposed on the surface of the second metal ground plate away from the first dielectric substrate;

[0011] The first metal floor, the first dielectric substrate, and the second metal floor are all provided with through-hole absorbing cavities. The absorbing plate is hollowed out in the middle and is embedded between the first metal floor, the first dielectric substrate, and the second metal floor through the absorbing cavities.

[0012] The absorbing plate is made of a wave-absorbing material, and the power supply structure is located inside the absorbing plate.

[0013] Furthermore, the first component also includes a plurality of first decoupling components with a central cutout, the plurality of first decoupling components being disposed on the first metal floor and passing through the first dielectric substrate and the second metal floor in sequence.

[0014] Furthermore, both the inner and outer surfaces of the first decoupling component are copper-plated.

[0015] Furthermore, the second component also includes a third metal ground plane, a second dielectric substrate, and a fourth metal ground plane, and the low mutual coupling phased array antenna unit also includes an adhesive plate;

[0016] The third metal floor, the second dielectric substrate, and the fourth metal floor are pressed together in a bottom-to-top order;

[0017] The third metal floor and the second metal floor are bonded together by the adhesive plate;

[0018] The radiating element is disposed on the surface of the fourth metal floor away from the second dielectric substrate.

[0019] Furthermore, the power supply structure includes a metal body and a strip wire;

[0020] The strip line is disposed on the surface of the second metal floor near the adhesive plate;

[0021] The adhesive plate, the second metal ground plate, the first dielectric substrate, and the first metal ground plate are all provided with a power feeding cavity. The metal body is embedded between the adhesive plate, the second metal ground plate, the first dielectric substrate, and the first metal ground plate through the power feeding cavity, and the metal body abuts against the strip line.

[0022] Furthermore, the second component also includes a plurality of second decoupling components with a central cutout, all of which are disposed on the third metal floor and pass through the second dielectric substrate and the fourth metal floor in sequence.

[0023] Furthermore, both the inner and outer surfaces of the second decoupling component are copper-plated.

[0024] Furthermore, a through coupling gap is provided on the third metal floor.

[0025] Furthermore, both the metal body and the strip line are located within the microwave absorbing plate.

[0026] In a second aspect, embodiments of the present invention provide a phased array antenna, including a low mutual coupling phased array antenna element as described in the first aspect.

[0027] The low-coupling phased array antenna element and phased array antenna provided by the embodiments of the present invention, by setting a first component and a second component including a radiating element, wherein the first metal ground plate, the first dielectric substrate and the second metal ground plate in the first component are pressed together in a bottom-to-top order, and the feed structure is disposed on the second metal ground plate, thereby using the absorbing cavities formed on the first metal ground plate, the first dielectric substrate and the second metal ground plate to embed an absorbing plate between the first metal ground plate, the first dielectric substrate and the second metal ground plate, and placing the feed structure within the absorbing plate, thereby adding an absorbing material (i.e., the absorbing plate) around the feed line (i.e. the feed structure) to absorb the coupling between antenna elements and reduce the isolation between antenna elements. At the same time, the embedding method of the absorbing plate does not occupy additional space and can be applied to miniaturization and integration. In addition, the absorbing plate does not leak electromagnetic signals and will not affect the performance of subsequent circuits. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 A schematic diagram of the structure of a low mutual coupling phased array antenna element provided in an embodiment of the present invention is shown.

[0030] Figure 2 An exploded view of a low mutual coupling phased array antenna element provided in an embodiment of the present invention is shown.

[0031] Figure 3 A schematic diagram of the structure of the second metal floor provided in an embodiment of the present invention is shown.

[0032] Figure 4 An exploded view of the adhesive plate and the first component provided in an embodiment of the present invention is shown.

[0033] Figure 5 A schematic diagram of the structure of the third metal floor provided in an embodiment of the present invention is shown.

[0034] Reference numerals: 100-First component; 101-Feeding structure; 200-Second component; 01-First metal ground plane; 02-First dielectric substrate; 03-Absorbing plate; 04-Second metal ground plane; 05-Adhesive plate; 06-Third metal ground plane; 07-Second dielectric substrate; 08-Fourth metal ground plane; 09-First decoupling component; 10-Strip line; 11-Metal body; 12-Second decoupling component; 13-Radiating component; 14-Absorbing cavity; 15-Feeding cavity; 16-Coupling gap. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0037] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0038] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0039] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0040] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0041] Regarding the issue of reducing coupling between antenna elements in microstrip antenna array design, Mi Qian has proposed several methods to suppress coupling.

[0042] The first method involves introducing additional circuitry as a decoupling network into the antenna element's feeding structure. This method requires a significant amount of space and is not suitable for miniaturization and integration.

[0043] The second method involves etching a defective ground structure onto the antenna's metallic ground plane, utilizing the high impedance of this defective ground structure to reduce mutual coupling between antenna elements. However, etching this defective ground structure causes electromagnetic signal leakage onto the circuitry behind the metallic ground plane, affecting the performance of subsequent circuitry.

[0044] The third method is to improve mutual coupling by adding some band-stop resonant structures between the antenna elements. However, this method will affect the radiation characteristics of the antenna elements themselves.

[0045] Based on the above considerations, this invention provides a low-coupling phased array antenna element, which can reduce the mutual coupling between antenna elements in antenna array design, while ensuring that the antenna element is suitable for miniaturization and integration, as well as the radiation characteristics of the antenna element and the performance of subsequent circuits. The low-coupling phased array antenna element is described below.

[0046] Please refer to Figure 1 and Figure 2 This embodiment provides a low mutual coupling phased array antenna element, including a first component 100 and a second component 200. The first component 100 can be understood as a feed array, and the second component 200 can be understood as an antenna array or a radiation array.

[0047] The second component 200 may include a radiating element 13.

[0048] The first component 100 may include a first metal floor 01, a first dielectric substrate 02, a wave-absorbing plate 03, a second metal floor 04, and a power supply structure 101.

[0049] The first metal ground plate 01, the first dielectric substrate 02, and the second metal ground plate 04 are pressed together in a bottom-to-top order. The power supply structure 101 is disposed on the surface of the second metal ground plate 04 away from the first dielectric substrate 02.

[0050] A through-hole absorbing cavity 14 is formed on the first metal ground plate 01, the first dielectric substrate 02, and the second metal ground plate 04. The absorbing plate 03 is hollowed out in the middle and is embedded between the first metal ground plate 01, the first dielectric substrate 02, and the second metal ground plate 04 through the absorbing cavity 14. That is, the absorbing plate 03 penetrates through the first metal ground plate 01, the first dielectric substrate 02, and the second metal ground plate 04.

[0051] It should be noted that the material of the wave-absorbing plate 03 is a wave-absorbing material. The feeding structure member 101 is located inside the wave-absorbing plate 03, and the thickness of the wave-absorbing plate 03 should not be greater than the sum of the thicknesses of the first metal floor 01, the first dielectric substrate 02, and the second metal floor 04.

[0052] In this embodiment, the thickness of the wave-absorbing plate 03 can be equal to the sum of the thicknesses of the first metal floor 01, the first dielectric substrate 02, and the second metal floor 04.

[0053] The shape of the wave-absorbing plate 03 can be regular shapes such as a "hui" character shape and an annular shape, or any irregular shape with a hollow in the middle. In this embodiment, no specific limitation is made.

[0054] In the above low mutual coupling phased array antenna unit, by embedding the wave-absorbing plate 03 between the first metal floor 01, the first dielectric substrate 02, and the second metal floor 04, and making the feeding structure member 101 located inside the wave-absorbing plate 03, a wave-absorbing material (i.e., the wave-absorbing plate 03) is added around the feeder (i.e., the feeding structure member 101) to absorb the coupling between antenna units and reduce the isolation between antenna units. At the same time, the embedding method of the wave-absorbing plate 03 does not additionally occupy space and is suitable for miniaturization and integration. In addition, the embedding method of the wave-absorbing plate 03 does not have the situation of leaking electromagnetic signals and does not affect the performance of the subsequent circuit.

[0055] Further, referring to Figure 2 , the second component 200 may further include a third metal floor 06, a second dielectric substrate 07, and a fourth metal floor 08. The third metal floor 06, the second dielectric substrate 07, and the fourth metal floor 08 are laminated together in the order from bottom to top.

[0056] Since the third metal floor 06 of the second component 200 is adjacent to the second metal floor 04 of the first component 100, in order to fix the third metal floor 06 and the second metal floor 04 together, the low mutual coupling phased array antenna unit may further include an adhesive plate 05. The third metal floor 06 and the second metal floor 04 are bonded by the adhesive plate 05. The adhesive plate 05 is made of an adhesive material and can bond the second metal floor 04 and the third metal floor 06 together to achieve fixation.

[0057] The radiating element 13 is disposed on the surface of the fourth metal floor 08 away from the second dielectric substrate 07.

[0058] In a possible embodiment, the radiating element 13 may be a radiating patch.

[0059] To further reduce coupling between antenna elements, in one possible implementation, the first component 100 may further include a plurality of first decoupling elements 09 with a central hole (i.e., a hole in the middle, with a structure similar to a pipe), the inner and outer surfaces of the plurality of first decoupling elements 09 being copper-plated. The plurality of first decoupling elements 09 are fixed and penetrate through the first metal ground plane 01, and the plurality of first decoupling elements 09 also sequentially penetrate through the first dielectric junction and the second metal ground plane 04.

[0060] With the above configuration, the first decoupling component 09 can form a shielding cavity, thereby reducing electromagnetic signal leakage, reducing mutual coupling between antenna elements, improving the isolation between antenna elements, and reducing the coupling between antenna elements.

[0061] Similarly, to further reduce the coupling between antenna elements, in one possible implementation, refer to Figure 2 The second component 200 may also include a plurality of second decoupling members 12 with a central hole (i.e., with a hole in the middle, and a structure similar to a pipe), and the inner and outer surfaces of the plurality of second decoupling members 12 may be copper-plated. The plurality of second decoupling members 12 are fixed and penetrate through the third metal ground 06, and the plurality of second decoupling members 12 also penetrate through the second dielectric substrate 07 and the fourth metal ground 08 in sequence.

[0062] By setting the second decoupling component 12, the second decoupling component 12 can form a shielding cavity, thereby reducing the leakage of electromagnetic signals, thereby reducing the mutual coupling effect between antenna elements, improving the isolation between antenna elements, and reducing the coupling between antenna elements.

[0063] In one possible implementation, refer to Figure 2 and Figure 4 The power supply structure 101 may include a metal body 11 and a stripline 10, the stripline 10 being etched onto the surface of the second metal ground plane 04 near the adhesive plate 05. The etched stripline 10 is covered by a third metal ground plane 06 bonded together by the adhesive plate 05.

[0064] A power feeding cavity 15 is provided on the adhesive plate 05, the second metal ground plate 04, the first dielectric substrate 02 and the first metal ground plate 01, and the power feeding cavity 15 is through. The metal body 11 is embedded between the adhesive plate 05, the second metal ground plate 04, the first dielectric substrate 02 and the first metal ground plate 01 through the power feeding cavity 15, and the metal body 11 abuts against the strip line 10.

[0065] With the above settings, an electromagnetic wave signal is generated by the metal body 11 of the analog wave port. The electromagnetic wave signal is then transmitted on the stripline 10. At about a quarter wavelength of the stripline 10, the signal is fed upward through a slot to the radiating patch. Finally, the signal is radiated through the radiating patch, thus realizing the operation of the antenna unit.

[0066] It should be understood that the width and length of the strip 10 will be different under different parameter designs or performance requirements. That is, the width and length of the strip 10 can be adjusted according to actual needs. In this embodiment, no specific limitation is made.

[0067] Furthermore, in order to improve the shielding cavity effect of the first decoupling element 09, in one possible implementation, refer to Figure 3 and Figure 4 Multiple first decoupling elements 09 can be arranged at equal intervals around the stripline 10. Arranging the first decoupling elements 09 around the etched stripline 10 can greatly reduce electromagnetic signal leakage caused by the stripline 10 and reduce mutual coupling.

[0068] To further reduce the coupling between antenna elements, in one possible implementation, refer to Figure 5 A through coupling gap 16 is provided on the third metal floor 06.

[0069] In a preferred embodiment, the coupling gap 16 may be an "H"-shaped coupling gap 16.

[0070] The aforementioned device isolates stray emissions from the feed layer of the stripline 10, thereby preventing these emissions from affecting the radiation of the radiating patch. Furthermore, the feed structure and radiating section can be designed independently, increasing flexibility and effectively reducing cross-polarization levels.

[0071] Compared to conventional rectangular slots, the H-shaped coupling slot 16 has a smaller size, thus reducing back radiation and minimizing its impact on subsequent stages. Furthermore, the slots on both sides of the H-shaped coupling slot 16 act as reactive elements, and their size can be adjusted to achieve impedance matching and a wider bandwidth. In addition, the coupling slot 16 is excited by a stripline 10. Compared to microstrip line excitation, stripline 10 excitation has the advantage of confining electromagnetic waves, reducing coupling, and minimizing surface wave generation.

[0072] Furthermore, in order to improve the shielding effect of the second decoupling component 12, refer to Figure 2 and Figure 5 Multiple second decoupling elements 12 can be arranged at equal intervals around the coupling gap 16, that is, multiple second decoupling elements 12 can form a shielding area, and the coupling gap 16 and the radiating patch are both located within this shielding area. In this way, the electromagnetic signal leakage of the radiating part can be reduced.

[0073] The low-coupling phased array antenna element provided in this invention improves the isolation between antenna elements and reduces mutual coupling by embedding an absorbing plate 03 made of absorbing material around the feed line, thereby absorbing excess spurious emissions and resonances around the line. Furthermore, the first decoupling component 09 and the second decoupling component 12 reduce electromagnetic signal leakage, further improving isolation and reducing coupling. In addition, the coupling slot 16 and the stripline 10 reduce back radiation and confine electromagnetic waves, further reducing coupling and simultaneously reducing surface wave generation.

[0074] Based on the same inventive concept as the low mutual coupling phased array antenna element described above, in one possible embodiment, a phased array antenna is provided, which includes the low mutual coupling phased array antenna element provided in the above embodiment.

[0075] Based on the above configuration, phased array antennas can achieve miniaturization and integration while maintaining high isolation and low mutual coupling.

[0076] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A low-mutual-coupling phased array antenna element, characterized in that, Includes the first component and the second component; The second component includes a radiating element; The first component includes a first metal ground plane, a first dielectric substrate, an absorbing plate, a second metal ground plane, and a power supply structure. The first metal floor, the first dielectric substrate, and the second metal floor are pressed together in a bottom-to-top order; The power supply structure is disposed on the surface of the second metal ground plate away from the first dielectric substrate; The first metal floor, the first dielectric substrate, and the second metal floor are all provided with through-hole absorbing cavities. The absorbing plate is hollowed out in the middle and is embedded between the first metal floor, the first dielectric substrate, and the second metal floor through the absorbing cavities. The absorber plate is made of a wave-absorbing material, the power supply structure is located inside the absorber plate, and the thickness of the absorber plate is less than or equal to the sum of the thicknesses of the first metal ground plate, the first dielectric substrate, and the second metal ground plate. The first component further includes a plurality of first decoupling components with a central cutout. The plurality of first decoupling components are disposed on the first metal floor and pass through the first dielectric substrate and the second metal floor in sequence.

2. The low mutual coupling phased array antenna element according to claim 1, characterized in that, The inner and outer surfaces of the first decoupling component are both copper-plated.

3. The low mutual coupling phased array antenna element according to claim 1 or 2, characterized in that, The second component also includes a third metal ground plane, a second dielectric substrate and a fourth metal ground plane, and the low mutual coupling phased array antenna unit also includes an adhesive plate; The third metal floor, the second dielectric substrate, and the fourth metal floor are pressed together in a bottom-to-top order; The third metal floor and the second metal floor are bonded together by the adhesive plate; The radiating element is disposed on the surface of the fourth metal floor away from the second dielectric substrate.

4. The low mutual coupling phased array antenna element according to claim 3, characterized in that, The power supply structure includes a metal body and a strip wire; The strip line is disposed on the surface of the second metal floor near the adhesive plate; The adhesive plate, the second metal ground plate, the first dielectric substrate, and the first metal ground plate are all provided with a power feeding cavity. The metal body is embedded between the adhesive plate, the second metal ground plate, the first dielectric substrate, and the first metal ground plate through the power feeding cavity, and the metal body abuts against the strip line.

5. The low mutual coupling phased array antenna element according to claim 3, characterized in that, The second component also includes a plurality of second decoupling components with a central cutout. The plurality of second decoupling components are all disposed on the third metal floor and pass through the second dielectric substrate and the fourth metal floor in sequence.

6. The low mutual coupling phased array antenna element according to claim 5, characterized in that, The inner and outer surfaces of the second decoupling component are both copper-plated.

7. The low mutual coupling phased array antenna element according to claim 3, characterized in that, A through coupling gap is provided on the third metal floor.

8. The low mutual coupling phased array antenna element according to claim 4, characterized in that, Both the metal body and the strip line are located within the microwave absorbing plate.

9. A phased array antenna, characterized in that, Includes the low mutual coupling phased array antenna element as described in any one of claims 1 to 8.

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