Touch device and electronic device

Abstract

The embodiment of the present application provides a touch device and an electronic device, the touch device comprises a touch panel, a first circuit board, a pressure sensor and an elastic support plate; the touch panel is used for receiving a touch signal; the side of the first circuit board facing the touch panel is provided with a solder pad, the solder pad is welded and fixed with the touch panel; the pressure sensor is arranged on the side of the first circuit board facing the touch panel; and the elastic support plate is fixedly arranged on the surface of the side of the first circuit board away from the touch panel. The touch device in the embodiment of the present application has the advantage of being thinner.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, specifically to a touch device and an electronic device. Background Technology

[0002] A laptop computer, also known as a portable computer, handheld computer, or lap computer, is characterized by its small size.

[0003] In related technologies, to improve the portability of laptops, in addition to a keyboard, a touchpad is often included, allowing users to operate the laptop instead of a mouse. For example, users can press the touchpad to control the laptop to execute mouse button commands. However, touchpads are relatively thick, which cannot meet the requirements for thinner and lighter laptops. Summary of the Invention

[0004] In view of the above problems, embodiments of this application provide a touch device and an electronic device to solve the above technical problems.

[0005] In a first aspect, embodiments of this application provide a touch device, including:

[0006] The touchpad is used to receive touch signals.

[0007] The first circuit board has solder pads on the side facing the touch panel, and the solder pads are soldered and fixed to the touch panel;

[0008] A pressure sensor is disposed on the side of the first circuit board facing the touchpad; and

[0009] An elastic support plate is fixedly mounted on the side surface of the first circuit board facing away from the touch panel, which enables the touch device to be thinner.

[0010] Optionally, the distance between the first circuit board and the touch panel is greater than or equal to 0.05 mm and less than or equal to 0.3 mm, which can ensure that the touch device is thinner while reserving sufficient deformation space for the pressure sensor.

[0011] Optionally, the distance between the pressure sensor and the touch panel is greater than or equal to 0.05 mm and less than or equal to 0.3 mm, which can provide sufficient deformation space for the pressure sensor while ensuring that the touch device is thinner.

[0012] Optionally, the first circuit board and the touch panel are electrically connected via at least one of the solder pads, which facilitates wiring of the first circuit board and the touch panel and makes the touch device thinner.

[0013] Optionally, the pads include:

[0014] A first solder pad, through which the first circuit board and the touch panel are electrically connected; and

[0015] The second pad, through which the first circuit board and the touch panel are fixedly connected, makes the connection between the first circuit board and the touch panel more secure.

[0016] Optionally, the plurality of pads are located at different ends of the first circuit board along a first direction, which is perpendicular to the thickness direction of the first circuit board, so that the force on the first circuit board is more uniform and reasonable.

[0017] Optionally, the first circuit board is a flexible circuit board, which allows the first circuit board to deform well in conjunction with the elastic support plate to trigger the pressure sensor.

[0018] Optionally, all the pads are located at the same end of the first circuit board along a first direction, which is perpendicular to the thickness direction of the first circuit board, so that the connection between the first circuit board and the touch panel can be made more secure through multiple pads.

[0019] Optionally, the first circuit board is a rigid-flex board, and the pressure sensor is at least partially disposed on the flexible part of the rigid-flex board, so that when the first circuit board is soldered on one side, the first circuit board can be well deformed in conjunction with the elastic support plate to trigger the pressure sensor.

[0020] Optionally, at the same end of the first circuit board along the first direction, the second pad is provided on each side of the first circuit board along the second direction, and the first pad is provided in the middle part of the first circuit board along the second direction. The second direction and the first direction are perpendicular to the thickness direction of the first circuit board, which can improve the reliability of the first pad connection.

[0021] Optionally, the first circuit board includes two first sides disposed opposite each other along the first direction, and the distance between the first pad and the adjacent first side is greater than the distance between the second pad and the adjacent first side, which can improve the reliability of the first pad connection.

[0022] Optionally, along the first direction, the distance from the first pad to the middle of the first circuit board is greater than the distance from the second pad to the middle of the touch panel, which can improve the reliability of the first pad connection.

[0023] Optionally, the pressure sensor includes four pressure-sensitive resistors connected in a Wheatstone bridge configuration, with at least one of the pressure-sensitive resistors located at the midpoint of the first circuit board along the first direction, which can improve the sensitivity of the pressure sensor.

[0024] Optionally, the elastic support plate includes a first part and a second part connected together, the rigidity of the first part being less than that of the second part, and the pressure sensor's orthographic projection on the elastic support plate being at least partially located in the first part, thereby improving the sensitivity of the pressure sensor.

[0025] Optionally, the first part is provided with at least one of a groove, a notch, and an opening structure, which makes the rigidity of the first part less than that of the second part.

[0026] Secondly, embodiments of this application also provide an electronic device, including a touch device as described above, which enables the electronic device to be thinner.

[0027] Optionally, the electronic device further includes:

[0028] shell; and

[0029] The connector is fixedly connected to the housing.

[0030] The elastic support plate abuts against the connector on the side facing away from the first circuit board. The orthographic projection of the connector onto the plane of the elastic support plate at least partially overlaps with the orthographic projection of the pressure sensor onto the plane of the elastic support plate, which can improve the sensitivity of the pressure sensor.

[0031] Optionally, the connector includes a silicone component, which is connected and fixed to the connector to improve the sensitivity of the pressure sensor.

[0032] Optionally, the minimum distance between the orthographic projection of the connector on the plane of the elastic support plate and the orthographic projection of the pad on the plane of the elastic support plate is A, where A is greater than or equal to 0.5 mm, which can prevent damage to the wiring at the pad.

[0033] Optionally, along the thickness direction of the touch panel, the distance between the side surface of the elastic support plate away from the first circuit board and the side surface of the touch panel facing the first circuit board is B, where B is greater than or equal to 0.5 mm and B is less than A, which can improve the sensitivity of the pressure sensor.

[0034] In this embodiment, since the touchpad and the first circuit board are soldered together, the gap between the touchpad and the first circuit board can be made extremely small. Therefore, an extremely thin pressure sensor is also set in the gap between the touchpad and the first circuit board, which makes the touch device thinner overall, and ultimately makes the electronic device with the touch device thinner.

[0035] These or other aspects of this application will become more apparent in the following description of the embodiments. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 A schematic diagram of a first structure of the touch device provided in an embodiment of this application is shown.

[0038] Figure 2 for Figure 1 An exploded view of the touch device shown.

[0039] Figure 3 for Figure 1 A schematic diagram of one structure of the first circuit board of the touch device shown.

[0040] Figure 4 This is a second structural schematic diagram of the touch device provided in the embodiments of this application.

[0041] Figure 5 for Figure 4 A schematic diagram of one structure of the first circuit board of the touch device shown.

[0042] Figure 6 This is a schematic diagram of the groove of the first circuit board provided in an embodiment of this application.

[0043] Figure 7 A schematic diagram of the notch in the first circuit board provided in an embodiment of this application.

[0044] Figure 8 This is a schematic diagram of the opening structure of the first circuit board provided in an embodiment of this application.

[0045] Figure 9 for Figure 8 The diagram shows the assembly of the first circuit board in the touch device.

[0046] Figure 10 This is a schematic diagram of another recess on the first circuit board provided in an embodiment of this application.

[0047] Figure 11 for Figure 8 Exploded view of the touch device.

[0048] Figure 12 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0049] Figure 13 This is another structural schematic diagram of an electronic device provided in an embodiment of this application.

[0050] Figure 14 for Figure 13 The exploded view of the electronic device shown.

[0051] Figure 15 for Figure 13 A schematic diagram of the structure of the first circuit board of the electronic device shown.

[0052] Figure 16 for Figure 13 A schematic diagram of the touch control device of the electronic device shown.

[0053] Figure 17 for Figure 13 The diagram shows the state of the touch device in the electronic device before it is pressed.

[0054] Figure 18 for Figure 13 The diagram shows the state of the touch device in the electronic device after it has been pressed. Detailed Implementation

[0055] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0056] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0057] In the embodiments of this application, it should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0058] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0059] In the description of the embodiments of this application, the words "example" or "for example" are used to indicate exemplification, illustration, or description. Any embodiment or design described as "example" or "for example" in the embodiments of this application is not to be construed as being more preferred or having more advantages than another embodiment or design. The use of the words "example" or "for example" is intended to present relative concepts in a clear manner.

[0060] Furthermore, in the embodiments of this application, "multiple" refers to two or more. Therefore, in the embodiments of this application, "multiple" can also be understood as "at least two". "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and is not limited to which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C.

[0061] It should be noted that in the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In addition, the character " / ", unless otherwise specified, generally indicates that the associated objects before and after it are in an "or" relationship.

[0062] It should be noted that in the embodiments of this application, "connection" can be understood as electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.

[0063] This application provides a touch device 1000 as an input device for an electronic device, allowing users to input control signals to the electronic device via the touch device 1000 to achieve human-computer interaction between the user and the electronic device. The electronic device can be a laptop, television, tablet computer, etc., and this application does not limit this to any particular type.

[0064] Please refer to Figure 1 , Figure 1This illustration shows a first structural schematic diagram of a touch device provided in an embodiment of this application. The touch device 1000 may include a touchpad 100, a first circuit board 200, a pressure sensor 300, and an elastic support plate 400.

[0065] A touchpad 100 is used to receive touch signals. A first circuit board 200 has a solder pad 21 on the side facing the touchpad 100, and the solder pad 21 is soldered and fixed to the touchpad 100. A pressure sensor 300 is disposed on the side of the first circuit board 200 facing the touchpad 100. An elastic support plate 400 is fixedly disposed on the surface of the first circuit board 200 facing away from the touchpad 100.

[0066] Therefore, after the touch device 1000 is installed on the corresponding electronic device, when the touchpad 100 is pressed, the touch device 1000 will move as a whole, such as downwards. During this process, the elastic support plate 400 is deformed by the pressure of the corresponding structure on the electronic device, and then the elastic support plate 400 drives the first circuit board 200 to deform, which in turn triggers the pressure sensor 300 on the first circuit board 200. When the touchpad 100 is not pressed, the elastic support plate 400 can provide good support for the first circuit board 200, thereby preventing the first circuit board 200 from accidentally deforming and triggering the pressure sensor 300. It can be seen that the touch device 1000 of this embodiment has the advantage of simple structure and can detect the pressing operation received by the touchpad 100 through the pressure sensor 300.

[0067] Based on this, it can also be understood that since the touchpad 100 and the first circuit board 200 are soldered through the solder pad 21, the gap between the touchpad 100 and the first circuit board 200 can be made extremely small. Therefore, the pressure sensor 300 set between the first circuit board 200 and the touchpad 100 can also be extremely thin, thereby making the touch device 1000 as a whole thinner, and ultimately making the electronic device with the touch device 1000 thinner.

[0068] In some embodiments, the touchpad 100 may include a touch panel and a second circuit board. The second circuit board is disposed on the side of the touch panel facing the first circuit board 200, and the second circuit board is soldered to the pads 21 of the touchpad 100.

[0069] The touch panel can be a capacitive touch panel. After the touch panel is electrically connected to the second circuit board, the touch panel can convert the user's touch signal into a capacitive signal and transmit it to the second circuit board, so that the second circuit board can receive the user's touch signal and transmit it to the processor of the electronic device. Then the processor of the electronic device can execute corresponding commands according to the user's touch operation.

[0070] The connection method between the touch panel and the second circuit board can be varied. For example, the touch panel and the second circuit board can be bonded together using an adhesive layer formed by glue, double-sided tape, etc., but this embodiment of the application does not limit this method.

[0071] Please continue to refer to this. Figure 2 , Figure 2 for Figure 1 The exploded view of the touch device is shown. In some embodiments, the pads 21 can be soldered to the surface of the touchpad 100 facing the first circuit board 200 using solder paste 22. For example, the pads 21 can be soldered to the surface of the second circuit board facing the first circuit board 200 using solder paste 22. In other words, the thickness of the solder paste 22 is the size of the gap between the touchpad 100 and the first circuit board 200. In this case, since the thickness of the solder paste 22 is relatively thin during soldering, the gap between the touchpad 100 and the first circuit board 200 is also very small, thereby making the touch device 1000 thinner and lighter overall.

[0072] For example, the gap between the touchpad 100 and the first circuit board 200 can be less than or equal to 0.3 mm, thereby ensuring that the overall thickness of the touch device 1000 is small. For instance, the gap between the touchpad 100 and the first circuit board 200 can be 0.3 mm, 0.295 mm, 0.27 mm, 0.266 mm, 0.25 mm, 0.243 mm, 0.23 mm, 0.21 mm, 0.19 mm, 0.167 mm, 0.148 mm, 0.13 mm, 0.121 mm, 0.1 mm, 0.095 mm, 0.094 mm, 0.088 mm, 0.087 mm, 0.081 mm, 0.08 mm, 0.076 mm, 0.075 mm, 0.073 mm, 0.069 mm, 0.06 mm, or 0.057 mm, etc., and this application embodiment does not limit this.

[0073] The gap between the touchpad 100 and the first circuit board 200 can be greater than or equal to 0.05 mm, thereby ensuring that there is sufficient gap between the touchpad 100 and the first circuit board 200 for the elastic support plate 400 and the first circuit board 200 to deform, so that the pressure sensor 300 can detect the user's pressing operation. For example, the gap between the touchpad 100 and the first circuit board 200 can be 0.05 mm, 0.052 mm, 0.057 mm, 0.059 mm, 0.06 mm, 0.061 mm, 0.064 mm, 0.066 mm, 0.068 mm, 0.07 mm, 0.072 mm, 0.075 mm, 0.079 mm, 0.08 mm, 0.089 mm, 0.095 mm, or 0.1 mm, and this embodiment does not limit this.

[0074] In some implementations, the gap between the touchpad 100 and the first circuit board 200 can be controlled by adjusting the thickness of the solder paste 22 at the pad 21. That is, the thickness of the solder paste 22 can be less than or equal to 0.1 mm, so that the gap between the touchpad 100 and the first circuit board 200 can be less than or equal to 0.1 mm. For example, the thickness of solder paste 22 can be 0.3 mm, 0.295 mm, 0.27 mm, 0.266 mm, 0.25 mm, 0.243 mm, 0.23 mm, 0.21 mm, 0.19 mm, 0.167 mm, 0.148 mm, 0.13 mm, 0.121 mm, 0.1 mm, 0.095 mm, 0.094 mm, 0.088 mm, 0.087 mm, 0.081 mm, 0.08 mm, 0.076 mm, 0.075 mm, 0.073 mm, 0.069 mm, 0.06 mm, or 0.057 mm, etc., and this application embodiment does not limit it in this way.

[0075] The thickness of the solder paste 22 can be greater than or equal to 0.05 mm, so that the gap between the touch panel 100 and the first circuit board 200 can be greater than or equal to 0.05 mm. For example, the thickness of the solder paste 22 can be 0.05 mm, 0.052 mm, 0.057 mm, 0.059 mm, 0.06 mm, 0.061 mm, 0.064 mm, 0.066 mm, 0.068 mm, 0.07 mm, 0.072 mm, 0.075 mm, 0.079 mm, 0.08 mm, 0.089 mm, 0.095 mm, or 0.1 mm, and this embodiment does not limit it.

[0076] Of course, in some other embodiments, the gap between the touchpad 100 and the first circuit board 200 may be greater than 0.3 mm, or less than 0.05 mm. This application embodiment does not limit this.

[0077] In some embodiments, the gap between the pressure sensor 300 and the touchpad 100 can be less than or equal to 0.3 mm. This avoids the overall thickness of the touch device 1000 being too large due to an excessively large gap between the pressure sensor 300 and the touchpad 100.

[0078] The gap between the pressure sensor 300 and the touchpad 100 can be greater than or equal to 0.05 mm. Therefore, even if the pressing stroke of the touchpad 100 is large during the user's pressing process, the pressure sensor 300 is not likely to come into contact with the touchpad 100 after the first circuit board 200 is deformed. This can prevent the thin pressure sensor 300 from being squeezed by the first circuit board 200 and the touchpad 100. Ultimately, this can prevent the pressure sensor 300 from detecting the wrong pressure and also prevent the pressure sensor 300 from being squeezed and damaged by the first circuit board 200 and the touchpad 100.

[0079] For example, the gap between the pressure sensor 300 and the touchpad 100 can be 0.05 mm, 0.052 mm, 0.057 mm, 0.059 mm, 0.06 mm, 0.061 mm, 0.064 mm, 0.066 mm, 0.068 mm, 0.07 mm, 0.072 mm, 0.075 mm, 0.079 mm, 0.08 mm, 0.089 mm, 0.095 mm, 0.1 mm, 0.121 mm, 0.13 mm, 0.148 mm, 0.167 mm, 0.19 mm, 0.21 mm, 0.23 mm, 0.243 mm, 0.25 mm, 0.266 mm, 0.27 mm, 0.295 mm, or 0.3 mm. This application embodiment does not limit this.

[0080] In some implementations, the pressure sensor 300 may be a thin-film pressure sensor.

[0081] For example, the pressure sensor 300 can be made of conductive ink. Furthermore, the pressure sensor 300 can be formed on the surface of the first circuit board 200 by printing methods such as screen printing or other coating methods, thereby making the pressure sensor 300 thinner. Ultimately, the pressure sensor 300 can not only be accommodated in the very small gap between the first circuit board 200 and the touch panel 100, but can also be spaced apart from the touch panel 100.

[0082] Alternatively, the pressure sensor 300 can also be formed on the surface of the first circuit board 200 by sputtering, such as magnetron sputtering, etc., and this application embodiment does not limit this.

[0083] The above are some examples illustrating the gap size between the touchpad 100 and other components in the embodiments of this application. The following will further explain and illustrate the technical solutions of the embodiments of this application in conjunction with some optional structures of the pad 21.

[0084] In some embodiments, the first circuit board 200 and the touch panel 100 are electrically connected via at least one solder pad 21. Furthermore, when the first circuit board 200 and the touch panel 100 are connected, no additional ribbon cable or electrical connector is required, which not only facilitates the assembly of the touch device 1000 but also makes the touch device 1000 thinner and lighter.

[0085] Please continue to refer to this. Figure 3 , Figure 3 for Figure 1 This is a schematic diagram of a first circuit board of the touch device shown. Exemplarily, pad 21 may include a first pad 211, through which the first circuit board 200 and the touchpad 100 are electrically connected. The first pad 211 can also be understood as a signal pad. For example, the first pad 211 can serve as an input terminal, output terminal, power terminal, or ground terminal of the first circuit board 200, thereby realizing electrical signal transmission between the first circuit board 200 and the touchpad 100. This embodiment does not limit this. Correspondingly, solder paste 22 may include first solder paste 22 connected to the first pad 211.

[0086] Therefore, the touch device 1000 may further include a controller, which is electrically connected to the pressure sensor 300, so that the touch device 1000 can obtain the pressure detected by the pressure sensor 300 through the controller. In this case, the controller may be disposed on the first circuit board 200 and electrically connected to the pressure sensor 300 on the first circuit board 200; the controller may also be disposed on the touchpad 100 and electrically connected to the pressure sensor 300 on the first circuit board 200 through the first pad 211. This application embodiment does not limit this.

[0087] The solder pad 21 may also include a second solder pad 212, through which the first circuit board 200 and the touchpad 100 are fixedly connected. Therefore, the second solder pad 212 can also be understood as a fixing pad 21, to achieve a mechanical connection between the first circuit board 200 and the touchpad 100. Correspondingly, the solder paste 22 may also include a second solder paste 22 disposed on the second solder pad 212. Furthermore, the second solder pad 212 can reinforce the connection between the first circuit board 200 and the touchpad 100, preventing the touch device 1000 from malfunctioning due to the first solder pad 211 becoming loose, and also preventing the touchpad 100 from detaching entirely.

[0088] It should be noted that the pad 21 of the touch device 1000 may include only the first pad 211 mentioned above, or it may include both the first pad 211 and the second pad 212 mentioned above. This application embodiment does not limit this.

[0089] The number of pads 21 can be one or more, such as two, three, four or five, and this application embodiment does not limit this.

[0090] Taking the number of pads 21 as an example, pads 21 may include only the first pad 211.

[0091] Taking the number of pads 21 as an example, when the pads 21 include only the first pad 211, then the number of the first pads 211 is multiple.

[0092] Taking the number of pads 21 as an example, when the pads 21 include both the first pad 211 and the second pad 212, the number of the first pad 211 can be one and the number of the second pad 212 can be one, the number of the first pad 211 can be one and the number of the second pad 212 can be multiple, the number of the first pad 211 can be multiple and the number of the second pad 212 can be one, or the number of the first pad 211 can be multiple and the number of the second pad 212 can also be multiple. This application embodiment does not limit this.

[0093] Continuing with the example of multiple or at least two pads 21, the multiple pads 21 can be located at different ends of the first circuit board 200 along the first direction H1. The first direction H1 is perpendicular to the thickness direction of the touch panel 100. Therefore, it can also be understood that each end of the touch panel 100 in the length direction or each end in the width direction is soldered and fixed to at least one pad 21, thereby making the force on the touch panel 100 and the first circuit board 200 more uniform along the first direction H1, and thus making the connection between the touch panel 100 and the first circuit board 200 more stable.

[0094] Below, taking one end of the first circuit board 200 along the first direction H1 as the first end and the other end as the second end as an example, we will further illustrate how the multiple pads 21 are located at different ends of the first circuit board 200 along the first direction H1.

[0095] When the pad 21 includes only the first pad 211, it may be that there is one first pad 211 at the first end and one first pad 211 at the second end, or one first pad 211 at the first end and multiple first pads 211 at the second end, or multiple first pads 211 at the first end and multiple first pads 211 at the second end. This application embodiment does not limit this.

[0096] Next, taking the example of pad 21 including both first pad 211 and second pad 212, we will further illustrate the above-mentioned multiple pads 21 located at different ends of the first circuit board 200 along the first direction H1.

[0097] When pad 21 includes both first pad 211 and second pad 212, it can be that the first end only has first pad 211 and the second end only has second pad 212, or the first end only has first pad 211 and the second end has both first pad 211 and second pad 212, or the first end only has second pad 212 and the second end has both first pad 211 and second pad 212.

[0098] In other words, when pad 21 includes both first pad 211 and second pad 212, each end of touchpad 100 along the first direction H1 can be soldered and fixed to the first pad 211 and / or the second pad 212. Specifically, the number of first pad 211 and / or second pad 212 corresponding to each end of touchpad 100 along the first direction H1 can be one or more, and this embodiment does not limit this.

[0099] Please continue to refer to this. Figure 4 , Figure 4 This is a second structural schematic diagram of the touch device shown in the embodiment of this application. Alternatively, all the pads 21 can be located at the same end of the first circuit board 200 along the first direction H1. In this case, it can be understood that one end of the first circuit board 200 and the elastic support plate 400 along the first direction H1 is fixed, and the other end is suspended.

[0100] When all pads 21 are located at the same end of the first circuit board 200 along the first direction H1, the first circuit board 200 can be a rigid-flex board. The pressure sensor 300 is at least partially disposed on the flexible portion of the rigid-flex board.

[0101] Specifically, a rigid-flex PCB is a composite material formed by combining a flexible printed circuit board (FPC) and a rigid printed circuit board (PCB). The part of the rigid-flex PCB that does not have a rigid printed circuit board is the flexible part.

[0102] Specifically, the pressure sensor 300 is at least partially disposed on the flexible portion of the rigid-flex plate. It may be that the pressure sensor 300 is completely disposed on the flexible portion of the rigid-flex plate, or it may be partially disposed on the flexible portion of the rigid-flex plate. This application embodiment does not limit this.

[0103] It should also be noted that, in light of the above, the gap between the touchpad 100 and the first circuit board 200 can be greater than or equal to 0.05 mm. Therefore, when the first circuit board 200 is a rigid-flex board, in order to prevent the pressure sensor 300 from being damaged by collision with the touchpad 100 due to excessive displacement after the touchpad 100 receives a large pressing pressure, the gap between the touchpad 100 and the first circuit board 200 can be greater than 0.1 mm.

[0104] Correspondingly, the gap between the pressure sensor 300 and the touchpad 100 can also be greater than 0.1 mm.

[0105] It is understandable that, assuming all pads 21 are located at the first end of the first circuit board 200 along the first direction H1, if the first circuit board 200 is a rigid circuit board, after the user presses the touchpad 100, the elastic support plate 400 may be squeezed by the corresponding structure of the electronic device, causing the first circuit board 200 to rotate with the first end as the fulcrum and the second end towards the touchpad 100. In this case, the portion between the first and second ends of the first circuit board 200 will not deform or the deformation will be minimal, preventing the pressure sensor 300 from being triggered. In contrast, the rigid-flex board used in this embodiment can effectively concentrate the deformation of the first circuit board 200 in the flexible portion of the rigid-flex board after the user presses the touchpad 100, facilitating the detection or triggering of the pressure sensor 300.

[0106] Of course, when multiple pads 21 are located at different ends of the first circuit board 200 along the first direction H1, the first circuit board 200 can also be a rigid-flex board, and the pressure sensor 300 is at least partially disposed on the flexible part of the rigid-flex board. This application embodiment does not limit this.

[0107] Furthermore, when the multiple pads 21 are located at different ends of the first circuit board 200 along the first direction H1, the first circuit board 200 can also be a flexible circuit board, and this application embodiment does not limit this.

[0108] In some embodiments, at the same end of the first circuit board 200 along the first direction H1, a plurality of pads 21 can be arranged along the second direction H2. The second direction H2 and the first direction H1 are perpendicular to the thickness direction of the first circuit board 200. This makes the force on the touch panel 100 and the first circuit board 200 as a whole more uniform along the second direction H2, thereby making the connection between the touch panel 100 and the first circuit board 200 more stable.

[0109] Taking a square first circuit board 200 as an example, the first direction H1 can be the length direction of the first circuit board 200 and the second direction H2 can be the width direction of the first circuit board 200, or the first direction H1 can be the width direction of the first circuit board 200 and the second direction H2 can be the length direction of the first circuit board 200. It can also be understood that the first circuit board 200 may not be square, in which case the first direction H1 and the second direction H2 may not be the length or width direction of the first circuit board 200. This application does not limit this aspect.

[0110] Please continue to refer to this. Figure 5 , Figure 5for Figure 4 This is a schematic diagram of a first circuit board of the touch device shown. In some embodiments, a second pad 212 is provided on each side of the first circuit board 200 along the second direction H2 at the same end along the first direction H1, and a first pad 211 is provided in the middle portion of the first circuit board 200 along the second direction H2. The second direction H2 and the first direction H1 are perpendicular to the thickness direction of the first circuit board 200.

[0111] Therefore, it can be said that second pads 212 are provided on the outer side of the first pad 211 along the second direction H2 for auxiliary fixation. It is understood that the touchpad 100 and the first circuit board 200 are connected and fixed by multiple pads 21. After prolonged use or under excessive force, the outer pads 21 usually loosen first. Therefore, in this embodiment, the second pads 212 are located on the outer side of the second direction H2. Even after the outer pads 21 loosen, the mechanical and electrical connections between the first circuit board 200 and the touchpad 100 can still be achieved through the inner first pads 211, thus ensuring the normal use and operation of the touch device 1000, and improving the reliability and service life of the touch device 1000.

[0112] For example, each end of the first circuit board 200 along the first direction H1 may be provided with two second pads 212 and at least one first pad 211. In each end of the first circuit board 200 along the first direction H1, the two second pads 212 are spaced apart along the second direction H2, and at least one first pad 211 is located between the two second pads 212.

[0113] In some embodiments, the first circuit board 200 includes two first sides 23 disposed opposite each other along a first direction H1. The distance L1 between the first pad 211 and the adjacent first side 23 is greater than the distance L2 between the second pad 212 and the adjacent first side 23. Therefore, it can be simply understood that in the first direction H1, the outer edge of the second pad 212 is closer to the outer side of the first circuit board 200. Thus, even after the outer pad 21 is detached, the mechanical and electrical connections between the first circuit board 200 and the touchpad 100 are still achieved simultaneously through the inner first pad 211, thereby ensuring that the touch device 1000 can be used and operated normally, and thus improving the reliability and service life of the touch device 1000.

[0114] In some embodiments, along the first direction H1, the distance L3 from the first pad 211 to the middle of the first circuit board 200 is greater than the distance L4 from the second pad 212 to the middle of the first circuit board 200. Therefore, assuming all pads 21 of the touchpad 100 at the same end along the first direction H1 form a single connected unit, where both ends along the first direction H1 have the ends of the second pads 212 located on the outer side, even after the outer pads 21 become detached, the mechanical and electrical connections between the first circuit board 200 and the touchpad 100 are still achieved simultaneously through the inner first pads 211. This ensures the touch device 1000 can function normally, thereby improving its reliability and lifespan.

[0115] Of course, it is also understood that in some other implementations, the middle part of the first circuit board 200 along the first direction H1 may also be soldered with pads 21, such as the first pad 211 or the second pad 212. This application embodiment does not limit this.

[0116] In some embodiments, the pressure sensor 300 includes four pressure-sensitive resistors 31 connected in a Wheatstone bridge configuration, with at least one pressure-sensitive resistor 31 located at the midpoint of the first circuit board 200 along a first direction H1.

[0117] In other words, one pressure-sensitive resistor 31 may be located at the middle position of the first circuit board 200 along the first direction H1, and the other pressure-sensitive resistors 31 may be located at the ends of the first circuit board 200 along the first direction H1. Alternatively, two or three pressure-sensitive resistors 31 may be located at the middle position of the first circuit board 200 along the first direction H1, and the other pressure-sensitive resistors 31 may be located at the ends of the first circuit board 200 along the first direction H1. Or, all four pressure-sensitive resistors 31 may be located at the middle position of the first circuit board 200 along the first direction H1. This application embodiment does not limit this.

[0118] Understandably, when the pads 21 are located at different ends of the first circuit board 200 along the first direction H1, the middle portion of the elastic support plate 400, under stress, will use both ends of the first circuit board 200 along the first direction H1 as fulcrums for deformation, resulting in a larger deformation amplitude at the middle position of the elastic support plate 400 and the first circuit board 200 along the first direction H1. At this time, placing at least one pressure-sensitive resistor 31 at the middle position of the first circuit board 200 along the first direction H1 allows the pressure-sensitive resistor 31 to more sensitively detect the user's press operation on the touchpad 100.

[0119] Based on this, the first direction H1 can be the length direction of the first circuit board 200, thereby further increasing the deformation amplitude of the middle part of the first circuit board 200 in the first direction H1, so that the pressure-sensitive resistor 31 can more sensitively detect the user's operation of pressing the touchpad 100.

[0120] Of course, in some other embodiments, the pressure sensor 300 may be other forms of pressure sensor 300, and correspondingly, other forms of pressure sensor 300 may be located at least partially in the middle of the touch panel 100 along the first direction H1. This application embodiment does not limit this.

[0121] The above are examples of some optional structures at the first circuit board 200 in the embodiments of this application. The following will further explain the technical solution of the embodiments of this application in conjunction with some optional structures of the elastic support plate 400 in the embodiments of this application.

[0122] Please continue to refer to this. Figure 6 , Figure 6 This is a schematic diagram of the recess in the first circuit board provided in an embodiment of this application. In some embodiments, the elastic support plate 400 includes a first portion 41 and a second portion 42 connected together. The rigidity of the first portion 41 is less than the rigidity of the second portion 42. The orthographic projection of the pressure sensor 300 onto the elastic support plate 400 is at least partially located on the first portion 41. Therefore, after the touchpad 100 is pressed, the deformation of the elastic support plate 400 will be more concentrated at the less rigid first portion 41, thereby allowing the pressure sensor 300 to more sensitively detect the user's pressing operation on the touchpad 100.

[0123] Please continue to combine Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of the notch of the first circuit board provided in an embodiment of this application. Figure 8 This is a schematic diagram of the opening structure of the first circuit board provided in an embodiment of this application. For example, the first part 41 may be provided with at least one of a groove 411, a notch 412 and an opening structure 413, so that the rigidity of the second part 42 is less than the rigidity of the first part 41.

[0124] Specifically, the first part 41 may be provided with only one of the groove 411, notch 412 and opening structure 413, or the first part 41 may be provided with only two of the groove 411, notch 412 and opening structure 413, or the first part 41 may be provided with the groove 411, notch 412 and opening structure 413 at the same time. The embodiments of this application do not limit this.

[0125] Please continue to refer to this. Figure 9 and Figure 10 , Figure 9 for Figure 8 The diagram shows the assembly of the first circuit board in the touch device. Figure 10 This is another schematic diagram of a groove on the first circuit board provided in an embodiment of this application. The number of grooves 411 can be one or more, such as two, three, or four, and this embodiment of the application does not limit this.

[0126] Taking multiple grooves 411 as an example, multiple grooves 411 can be arranged along the first direction H1 in the middle position of the elastic support plate 400. Then the middle part of the elastic support plate 400 along the first direction H1 can also be understood as the first part 41 mentioned above, while the two ends of the elastic support plate 400 along the first direction H1 can be understood as a second part 42 mentioned above.

[0127] The shape of the groove 411 can be a rectangular groove or an arc groove, and this application embodiment does not limit it.

[0128] The opening of the groove 411 can face the first circuit board 200 or it can face away from the first circuit board 200. This application embodiment does not limit this. Of course, when the opening of the groove 411 faces away from the first circuit board 200, the sharp corner formed at the opening of the groove 411 can be avoided from squeezing the first circuit board 200 and causing the first circuit board 200 to have indentations or even be damaged.

[0129] The number of gaps 412 can be one or more, such as two, three or four, and this application embodiment does not limit this.

[0130] Taking multiple notches 412 as an example, multiple grooves 411 can be arranged along the first direction H1 in the middle position of the elastic support plate 400. Then the middle part of the elastic support plate 400 along the first direction H1 can also be understood as the first part 41 mentioned above, while the two ends of the elastic support plate 400 along the first direction H1 can be understood as a second part 42 mentioned above.

[0131] Specifically, the notch 412 can be provided on two sides of the middle portion of the elastic support plate 400 along the second direction H2. Then the middle portion of the elastic support plate 400 along the first direction H1 can also be understood as the first part 41 mentioned above, and the two ends of the elastic support plate 400 along the first direction H1 can be understood as a second part 42 mentioned above.

[0132] The shape of the notch 412 can be a rectangular notch or an arc notch, and this application embodiment does not limit it in this respect.

[0133] The number of opening structures 413 can be one or more, such as two, three or four, and this application embodiment does not limit this.

[0134] Taking multiple opening structures 413 as an example, the multiple opening structures 413 can be arranged in an array at the middle position of the elastic support plate 400 along the first direction. Then, the middle part of the elastic support plate 400 along the first direction H1 can also be understood as the first part 41 mentioned above, while the two ends of the elastic support plate 400 along the first direction H1 can be understood as a second part 42 mentioned above.

[0135] Specifically, the opening structure 413 can be a blind hole or a through hole, and this application embodiment does not limit it.

[0136] It is also understood that the elastic support plate 400 can be integrally molded. For example, the elastic support plate 400 can be molded by means of die casting, injection molding, CNC machining, etc., and has at least one of the grooves 411, notches 412 and opening structures 413.

[0137] Alternatively, the elastic support plate 400 can also be formed by combining multiple layers of elastic materials, but this application does not limit this embodiment.

[0138] It is also understandable that, given that the pads 21 are located at both ends of the first circuit board 200 along the first direction H1, the first part 41 can be located in the middle of the first circuit board 200 along the first direction H1.

[0139] Continuing with the example where the first direction H1 is the length direction of the first circuit board 200, after the middle portion of the elastic support plate 400 along the first direction H1 is subjected to force, the two ends of the elastic support plate 400 along its length will serve as the fulcrum for deformation. Therefore, compared to using the two ends of the elastic support plate 400 along its width as the fulcrum for deformation, this embodiment allows the deformation of the elastic support plate 400 to be more concentrated in the middle position along the first direction H1. Furthermore, since the elastic support plate 400 has at least one of a groove 411, a notch 412, and an opening structure 413 in its middle portion, the rigidity of the first portion 41 is relatively small. Therefore, the deformation of the elastic support plate 400 will be even more concentrated in the middle position along the first direction H1. Based on this, on the one hand, the sensitivity of the pressure sensor 300 can be greatly improved; on the other hand, the deformation at the pad 21 can be reduced, thereby preventing the pad 21 from loosening and improving the reliability and service life of the touch device 1000.

[0140] Of course, it is also understood that in some other embodiments, the rigidity of the first part 41 of the elastic support plate 400 may be equal to the rigidity of the second part 42. That is to say, the first part 41 of the elastic support plate 400 may not have a groove 411 or other structure provided, and this application embodiment does not limit this.

[0141] In some embodiments, the elastic support plate 400 may be made of steel; for example, the elastic support plate 400 may be made of stainless steel, spring steel, or other similar materials. Of course, the elastic support plate 400 may also be made of other elastic metal materials, elastic alloy materials, or elastic organic polymer materials, and this application embodiment does not limit this.

[0142] Please continue to refer to this. Figure 11 , Figure 11 for Figure 8 An exploded view of the touch device. In some embodiments, the elastic support plate 400 and the first circuit board 200 can be bonded together. For example, the touch device 1000 further includes an adhesive layer 500, through which the elastic support plate 400 and the first circuit board 200 are bonded together.

[0143] Specifically, the adhesive layer 500 can be formed by the curing of double-sided tape or other fluid adhesives, and this application embodiment does not limit this.

[0144] In some embodiments, the adhesive layer 500 can be made of a high-temperature resistant material. For example, the adhesive layer 500 can be an adhesive that can withstand temperatures up to 300°C. In the production process, the first circuit board 200 can be first bonded and fixed to the elastic support plate 400 to provide good shaping and fixing effect for the first circuit board 200, such as a flexible circuit board. Then, the first circuit board 200 is welded and fixed to the touch panel 100, thereby controlling the dimensional and positional tolerances of the touch device 1000 within a reasonable range. The high-temperature resistant adhesive layer 500 can prevent the adhesive layer 500 from failing due to heat during the welding process, thereby improving the yield and reliability of the touch device 1000.

[0145] Of course, in some other embodiments, the adhesive layer 500 may not be made of a high-temperature resistant material. For example, the first circuit board 200 and the touch panel 100 may be welded using a low-temperature cold soldering technique.

[0146] In some embodiments, the thickness of the elastic support plate 400 can be greater than or equal to 0.15 mm and less than or equal to 0.25 mm, such as 0.2 mm. The thickness of the adhesive layer 500 can be greater than or equal to 0.04 mm and less than or equal to 0.06 mm, such as 0.05 mm. The thickness of the first circuit board 200 can be greater than or equal to 0.1 mm and less than or equal to 0.14 mm, such as 0.12 mm. Therefore, when the pressure sensor 300 is a thin-film pressure sensor formed on the surface of the first circuit board 200, the total thickness of the pressure sensor 300, the first circuit board 200, the adhesive layer 500, and the elastic support plate 400 can be controlled between 0.32 mm and 0.42 mm, thereby making the touch device 1000 thinner overall.

[0147] Please continue to refer to this. Figure 12 , Figure 12 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Based on the touch device 1000 described above, this application also provides an electronic device. The electronic device includes the touch device 1000 described above. It is understood that the structure of the touch device 1000 allows it to be thinner, and therefore the electronic device can also be made thinner accordingly. The electronic device can be a laptop computer, smartphone, tablet computer, home appliance, remote control for home appliance, gaming device, etc., and this application does not limit this to any particular type.

[0148] Please continue to refer to this. Figure 13 and Figure 14 , Figure 13 This is another structural schematic diagram of an electronic device provided in an embodiment of this application. Figure 14 for Figure 13 An exploded view of the electronic device is shown. In some embodiments, the electronic device further includes a housing 2000 and a connector 3000. The connector 3000 is fixedly connected to the housing 2000. The side of the elastic support plate 400 facing away from the first circuit board 200 abuts against the connector 3000. The orthographic projection of the connector 300 onto the plane of the elastic support plate 400 at least partially coincides with the orthographic projection of the pressure sensor 300 onto the plane of the elastic support plate 400.

[0149] During the pressing of the touchpad 100, the elastic support plate 400 is squeezed by the connector 3000, so that the deformation of the elastic support plate 400 is mainly concentrated in the part that abuts against the connector 3000, thereby enabling the pressure sensor 300 to detect the user's operation of pressing the touchpad 100 more sensitively.

[0150] Furthermore, the portion of the elastic support plate 400 that abuts against the connector 3000 can also be the aforementioned first portion 41, or in other words, the aforementioned first portion 41 is the portion of the elastic support plate 400 used to abut against the corresponding structure of the electronic device, thereby further concentrating the deformation of the elastic support plate 400, so that the pressure sensor 300 can more sensitively detect the user's operation of pressing the touchpad 100. Of course, in some other embodiments, the aforementioned first portion 41 may only partially abut against the connector 3000, or the first portion 41 and the connector 3000 may be misaligned; this application embodiment does not limit this.

[0151] In some embodiments, the orthographic projection of the connector 3000 onto the plane of the elastic support plate 400 may only partially coincide with the orthographic projection of the pressure sensor 300 onto the plane of the elastic support plate 400. For example, the orthographic projection of the connector 3000 onto the plane of the elastic support plate 400 may be partially misaligned with the orthographic projection of the pressure sensor 300 onto the plane of the elastic support plate 400.

[0152] For example, the pressure sensor 300 described above includes four pressure-sensitive resistors 31. Then, it is possible that only one, two, or three pressure-sensitive resistors 31 have their orthographic projections onto the plane where the elastic support plate 400 is located, which lie within the orthographic projection of the connector 3000 onto the plane where the elastic support plate 400 is located.

[0153] Alternatively, the orthographic projection of the connector 3000 onto the plane of the elastic support plate 400 may also coincide with the orthographic projection of the pressure sensor 300 onto the plane of the elastic support plate 400. This embodiment of the application does not limit this.

[0154] For example, the pressure sensor 300 described above includes four pressure-sensitive resistors 31. Therefore, the orthographic projection of the four pressure-sensitive resistors 31 onto the plane of the elastic support plate 400 may lie within the orthographic projection of the connector 3000 onto the plane of the elastic support plate 400.

[0155] In some embodiments, the connector 3000 may include a silicone component. When the touchpad 100 is pressed, the silicone component can also adapt well to the situation, so that the deformation of the elastic support plate 400 is more concentrated in the middle part, thereby allowing the pressure sensor 300 to detect the user's press on the touchpad 100 more sensitively.

[0156] The silicone component can be a ring-shaped structure, a cuboid structure, or a cylindrical structure; this application does not limit the specific type of structure.

[0157] Of course, in some other embodiments, the connector 3000 may also be made of other materials, and this application embodiment does not limit this.

[0158] In some embodiments, the connector 3000 can be fixedly connected to the resilient support plate 400, thereby allowing the touchpad 100 to be mounted and fixed on the electronic device. For example, the side surface of the connector 3000 facing the resilient support plate 400 is bonded and fixed to the resilient connector 3000.

[0159] It is also understandable that, in order to make the connection between the connector 3000 and the elastic support plate 400 more secure, the area of ​​the side surface of the connector 3000 facing the elastic support plate 400 can be increased.

[0160] For example, in some embodiments, the ratio of the area of ​​the side surface of the connector 3000 facing the elastic support plate 400 to the area of ​​the pressure sensor 300 can be greater than or equal to 1.5. For instance, the ratio of the area of ​​the side surface of the connector 3000 facing the elastic support plate 400 to the area of ​​the pressure sensor 300 can be 1.5, 1.57, 1.6, 1.8, 2, or 2.1, etc., and this application embodiment does not limit this.

[0161] Of course, in some other embodiments, the touch device 1000 can also be installed by connecting it to the housing 2000 of the electronic device through other structures, and this application embodiment does not limit this.

[0162] Please continue to refer to this. Figure 15 , Figure 15 for Figure 13 The diagram shows a schematic of the structure of the first circuit board of the electronic device. In some embodiments, the minimum distance between the orthographic projection of the connector 3000 onto the plane of the elastic support plate 400 and the orthographic projection of the pad 21 onto the plane of the elastic support plate 400 is A, where A is greater than or equal to 0.5 mm. For example, A can be 0.5 mm, 0.51 mm, 0.522 mm, 0.53 mm, 0.55 mm, 0.58 mm, 0.61 mm, 0.667 mm, 0.71 mm, 0.74 mm, 0.8 mm, 0.89 mm, 0.92 mm, or 1.05 mm, etc., and this application embodiment does not limit this.

[0163] It is understandable that when the first circuit board 200 is electrically connected to the touch panel 100 via the pad 21, it means that there will be some wires, such as copper wires, connected to the pad 21 on the surface of the first circuit board 200. The stress generated when the first circuit board 200 deforms will be greater and more concentrated at the part where the wires are connected to the pad 21, making the part where the wires are connected to the pad 21 more prone to wrinkling, falling off, and breaking when the first circuit board 200 deforms. Therefore, in this embodiment, by using A greater than or equal to 0.5, the deformation of the first circuit board 200 at the pad 21 can be reduced, thereby providing a good protection effect for the part where the wires are connected to the pad 21, and of course, it can also make the connection of the pad 21 itself more stable and reliable.

[0164] Please continue to refer to this. Figure 16 , Figure 16 for Figure 13 The diagram shows a schematic of the touch control device of the electronic device. In some embodiments, along the thickness direction of the touchpad 100, the distance from the side of the elastic support plate 400 away from the first circuit board 200 to the side of the solder paste 22 away from the first circuit board 200 is B, or in other words, the distance from the side of the elastic support plate 400 away from the first circuit board 200 to the side of the touchpad 100 facing the first circuit board 200 is B. B is greater than or equal to 0.5 mm, and B is less than A. This causes the deformation of the elastic support plate 400 and the first circuit board 200 to be more concentrated in the part abutting against the connector 3000 when the connector 3000 presses the elastic support plate 400, thereby allowing the pressure sensor 300 to detect the user's operation of pressing the touchpad 100 more sensitively.

[0165] For example, B can be 0.5 mm, 0.51 mm, 0.522 mm, 0.53 mm, 0.55 mm, 0.58 mm, 0.61 mm, 0.667 mm, 0.71 mm, 0.74 mm, 0.8 mm, 0.89 mm, 0.92 mm, or 1.05 mm, etc., and the embodiments of this application do not limit this.

[0166] Please continue to refer to this. Figures 17 to 18 , Figure 17 for Figure 13 The diagram shows the state of the touch device in the electronic device before it is pressed. Figure 18 for Figure 13 The diagram shows the state of the touch device in the electronic device after being pressed. Based on the above structure, when the touchpad 100 receives a pressing force of 0.5N, the maximum displacement distance of the pressure sensor 300 driven by the deformed first circuit board 200 is 0.0007221mm. When the touchpad 100 receives a pressing force of 5N, the maximum displacement distance of the pressure sensor 300 driven by the deformed first circuit board 200 is 0.007194mm.

[0167] Therefore, when the pressure received by the touchpad 100 is less than or equal to 5N, the maximum displacement distance of the pressure sensor 300 driven by the deformed first circuit board 200 is much less than the thickness of the solder paste 22. This can avoid the inaccurate pressure detected by the thinner pressure sensor 300 after it collides with the touchpad 100 or be damaged after the collision.

[0168] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Although this application has disclosed preferred embodiments as above, it is not intended to limit this application. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this application. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A touch device, comprising: The touch panel receives a touch signal. The first circuit board has a side facing the touch panel, and the side has at least one pad, and the pad is welded to the touch panel. The pressure sensor is disposed on the side of the first circuit board facing the touch panel, and the pressure sensor is at least partially located at the middle of the first circuit board along the first direction. The elastic support plate is fixedly disposed on the side of the first circuit board away from the touch panel. The distance between the first circuit board and the touch panel is greater than or equal to 0.05 mm and less than or equal to 0.3 mm. The distance between the pressure sensor and the touch panel is greater than or equal to 0.05 mm and less than or equal to 0.3 mm. 2.The touch device of claim 1, wherein, The first circuit board and the touch panel are electrically connected through at least one pad. 3.The touch device of claim 2, wherein, The pad includes: 4.The touch device of claim 1, wherein, The first pad, and the first circuit board and the touch panel are electrically connected through the first pad; and 5.The touch device of claim 4, wherein, The second pad, and the first circuit board and the touch panel are fixedly connected through the second pad. When the plurality of pads are respectively located at different ends of the first circuit board along the first direction, the first circuit board is a flexible circuit board. When all the pads are welded to the same end of the first circuit board along the first direction, the first circuit board is a rigid-flexible combined board, and the pressure sensor is at least partially disposed on the flexible part of the rigid-flexible combined board. 6.The touch device of claim 5, wherein, On the same end of the first circuit board along the first direction, the first circuit board has the second pad on each side along the second direction, and the first pad is disposed on the middle part of the first circuit board along the second direction, and the second direction, the first direction and the thickness direction of the first circuit board are perpendicular to each other. 7.The touch device of claim 5, wherein, The first circuit board includes two first side edges disposed opposite along the first direction, and the distance between the first pad and the adjacent first side edge is greater than the distance between the second pad and the adjacent first side edge. 8.The touch device according to claim 6 or 7, characterized in that, Along the first direction, the distance from the first pad to the middle of the first circuit board is greater than the distance from the second pad to the middle of the touch panel. 9.The touch device according to claim 6 or 7, characterized in that, The pressure sensor includes four pressure sensing resistors, and the four pressure sensing resistors are electrically connected in a Wheatstone bridge type, and all the pressure sensing resistors are located at the middle of the first circuit board along the first direction. 10.The touch device of claim 9, wherein, The elastic support plate includes a first part and a second part connected to each other, the rigidity of the first part is less than that of the second part, and the projection of the pressure sensor on the elastic support plate is at least partially located in the first part.

11. The touch control device according to claim 6 or 7, characterized in that, The first part is provided with at least one of a groove, a notch and an opening structure.

12. The touch control device according to any one of claims 1 to 6, wherein, The electronic device further includes:

13. The touch control device according to claim 12, wherein, A shell; and 14. An electronic device, comprising: A connecting piece connected and fixed to the shell.

15. The electronic device of claim 14, wherein, ​ ​ ​ The side of the elastic support plate away from the first circuit board abuts against the connecting piece, and a normal projection of the connecting piece on the plane where the elastic support plate is located at least partially overlaps a normal projection of the pressure sensor on the plane where the elastic support plate is located.

16. The electronic device of claim 15, wherein, The connecting piece comprises a silica gel piece fixedly connected with the connecting piece.

17. The electronic device of claim 16, wherein, A minimum distance between a normal projection of the connecting piece on the plane where the elastic support plate is located and a normal projection of the solder pad on the plane where the elastic support plate is located is A, A is greater than or equal to 0.5 mm.

18. The electronic device of claim 17, wherein, In the thickness direction of the touch pad, a distance from the side surface of the elastic support plate away from the first circuit board to the side surface of the touch pad facing the first circuit board is B, B is greater than or equal to 0.5 mm, and B is less than A.

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