Laser processing control method, system and apparatus

Abstract

This application provides a laser processing control method, system, and apparatus, relating to the field of laser processing technology. The method includes: acquiring the pixel coordinate values ​​of at least two marked points on the material to be processed; determining the center coordinate values ​​of multiple processing areas and the deflection angle of the material to be processed based on the coordinate relationship between the processing platform and the vision positioning device and the pixel coordinate values; determining and correcting the image rotation angle of the galvanometer based on the deflection angle of the material to be processed and the installation angle of the galvanometer; controlling the laser galvanometer processing device to move to each processing area based on the center coordinate value of each processing area; determining and correcting the image scaling ratio based on the average thickness of each processing area and a preset scaling factor; and controlling the laser emitted by the laser emitter to pass through the galvanometer with the image rotation angle and image scaling ratio to perform laser processing on the processing area. This application can solve the problems of incoming material position deviation and inconsistent incoming material thickness, improving material processing accuracy.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and more specifically, to a laser processing control method, system, and apparatus. Background Technology

[0002] The laser galvanometer processing system consists of two parts: a laser and a galvanometer. The laser emits a laser beam, which is expanded and then enters the galvanometer. The laser is reflected by the mirrors in the X and Y orthogonal directions of the galvanometer and focused onto the workpiece by the focusing lens to perform laser processing.

[0003] Due to the influence of the processing area of ​​the galvanometer, when processing large-format parts, it is necessary to divide the graphic to be processed according to the processing area. By changing the relative position between the laser galvanometer and the material to be processed, the graphic processing of each processing area on the material to be processed is completed one by one, and then spliced ​​into the whole processing graphic.

[0004] However, during the splicing process, due to deviations in the position of the incoming materials and inconsistencies in the thickness of the incoming materials, the graphics processed in each processing area may be inconsistent in size and precision, making it impossible to successfully splice the graphics processed in each processing area. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of the prior art by providing a laser processing control method, system, and apparatus to solve the problems of material position deviation and inconsistent material thickness, thereby improving material processing accuracy.

[0006] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0007] In a first aspect, embodiments of this application provide a laser processing control method, the method comprising:

[0008] The pixel coordinates of at least two marker points on the material to be processed are obtained by a visual positioning device, and the material to be processed is mounted on a processing platform.

[0009] Based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinate values ​​of the at least two marker points, the center coordinate values ​​of multiple processing areas on the material to be processed and the deflection angle of the material to be processed are determined.

[0010] Based on the deflection angle of the material to be processed and the installation angle of the galvanometer in the laser galvanometer processing device, the image rotation angle of the galvanometer is determined and corrected.

[0011] Based on the center coordinates of each processing area, the laser galvanometer processing device is controlled to move to each processing area;

[0012] Based on the average thickness of each processing area and a preset scaling factor, the image scaling ratio of the galvanometer for each processing area is determined and corrected;

[0013] The laser emitted by the laser emitter in the laser galvanometer processing device is controlled to pass through a galvanometer having the image rotation angle and the image scaling ratio, and laser processing is performed on each of the processing areas.

[0014] Optionally, before determining the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinates of the at least two marker points, the method further includes:

[0015] Based on the position of the marking points on the calibration plate on the processing platform, the laser galvanometer processing device is controlled to process a matrix of marking points on the calibration plate with the marking points as the center.

[0016] The coordinate relationship between the processing platform and the visual positioning device is determined based on the platform coordinates of each point in the marked dot matrix on the processing platform and the pixel coordinates of each point.

[0017] Optionally, determining the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinates of the at least two marker points, includes:

[0018] Based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinate values ​​of the at least two marker points, the platform coordinate values ​​of the at least two marker points are calculated.

[0019] Calculate the deflection angle of the material to be processed based on the platform coordinate values ​​of the at least two marked points;

[0020] Based on the platform coordinates of the at least two marker points, the positional relationship between the at least two marker points and each processing area, and the deflection angle of the material to be processed, the center coordinates of multiple processing areas on the material to be processed are calculated.

[0021] Optionally, calculating the center coordinates of multiple processing areas on the material to be processed based on the platform coordinates of the at least two marker points, the positional relationship between the at least two marker points and each processing area, and the deflection angle of the material to be processed includes:

[0022] The center coordinates of the first processing area are calculated based on the platform coordinates of the at least two marker points, the positional relationship between the at least two marker points and the first processing area, and the deflection angle of the material to be processed.

[0023] The center coordinates of other processing areas are calculated based on the center coordinates of the first processing area, the relative positions of the processing areas, and the deflection angle of the material to be processed.

[0024] Optionally, after determining the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinates of the at least two marker points, the method further includes:

[0025] The center coordinate values ​​of the multiple processing areas are calibrated based on the verticality deviation between the mounting platform of the laser galvanometer processing device and the processing platform.

[0026] Optionally, before determining the image scaling ratio of the galvanometer based on the average thickness of the plurality of processing areas and a preset scaling factor, the method further includes:

[0027] A grid of the first size is generated on a preset correction plane by means of the laser galvanometer processing device;

[0028] Multiple second-size grids are generated by the laser galvanometer processing device on processing planes at different distances;

[0029] The preset scaling factor is calculated based on the size difference between the first-size grid and the plurality of second-size grids.

[0030] Optionally, the method further includes:

[0031] According to a preset cycle, the laser emitted by the laser emitter in the laser galvanometer processing device is controlled to pass through a galvanometer having the image rotation angle and the image scaling ratio to process auxiliary graphics in the first processing area;

[0032] The processing position and processing angle of the galvanometer are compensated based on the offset between the center of the auxiliary graphic and the center of the first processing area.

[0033] Optionally, before determining the image scaling ratio of the galvanometer for each processing area based on the average thickness of each processing area and a preset scaling factor, the method further includes:

[0034] A material thickness detection device is used to obtain multiple thicknesses for each of the processing areas;

[0035] The average thickness of each of the processing areas is calculated based on the multiple thicknesses of each processing area.

[0036] Secondly, embodiments of this application also provide a laser processing control system, the system comprising: a processing platform, an installation platform, a vision positioning device, a laser galvanometer processing device, and a control device; the control device is communicatively connected to the processing platform, the installation platform, the vision positioning device, and the laser galvanometer processing device;

[0037] The processing platform is used to mount the material to be processed and to move the material to be processed along the X-axis.

[0038] The mounting platform is perpendicular to the processing platform. The visual positioning device and the laser galvanometer processing device are both mounted on the mounting platform. The mounting platform drives the visual positioning device and the laser galvanometer processing device to move in the Y-axis direction.

[0039] The control device is used to perform the steps of the laser processing control method described in any of the first aspects above.

[0040] Optionally, the system further includes: an incoming material thickness detection device;

[0041] The incoming material thickness detection device is mounted on the installation platform. The installation platform drives the incoming material thickness detection device to move in the Y-axis direction. The incoming material thickness detection device is communicatively connected to the control device and sends multiple thicknesses of each processing area on the material to be processed to the control device.

[0042] Thirdly, embodiments of this application also provide a laser processing control device, the device comprising:

[0043] A pixel coordinate acquisition module is used to acquire the pixel coordinate values ​​of at least two marker points on the material to be processed through a visual positioning device, wherein the material to be processed is mounted on a processing platform.

[0044] The coordinate and angle determination module is used to determine the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the vision positioning device, and the pixel coordinate values ​​of the at least two marker points.

[0045] The rotation angle determination module is used to determine and correct the image rotation angle of the galvanometer based on the deflection angle of the material to be processed and the installation angle of the galvanometer in the laser galvanometer processing device.

[0046] A movement control module is used to control the laser galvanometer processing device to move to each of the processing areas based on the center coordinates of each processing area;

[0047] The scaling ratio determination module is used to determine and correct the image scaling ratio of the galvanometer for each processing area based on the average thickness of each processing area and a preset scaling factor.

[0048] The processing control module is used to control the laser emitted by the laser emitter in the laser galvanometer processing device to pass through the galvanometer having the image rotation angle and the image scaling ratio, so as to perform laser processing on each processing area.

[0049] Optionally, before the coordinate and angle determination module determines the center coordinates of the multiple processing areas and the deflection angle of the material to be processed, the device further includes:

[0050] The marker matrix processing module is used to control the laser galvanometer processing device to process the marker matrix on the calibration plate with the markers as the center, based on the position of the markers on the calibration plate on the processing platform.

[0051] The coordinate relationship determination module is used to determine the coordinate relationship between the processing platform and the vision positioning device based on the platform coordinate values ​​of each point in the marked dot matrix on the processing platform and the pixel coordinate values ​​of each point.

[0052] Optionally, the coordinate and angle determination module includes:

[0053] The marker point coordinate value determination unit is used to calculate the platform coordinate value of the at least two marker points based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinate values ​​of the at least two marker points.

[0054] The deflection angle determination unit is used to calculate the deflection angle of the material to be processed based on the platform coordinate values ​​of the at least two marker points.

[0055] The center coordinate value calculation unit is used to calculate the center coordinate values ​​of multiple processing areas on the material to be processed based on the platform coordinate values ​​of the at least two marker points, the positional relationship between the at least two marker points and each processing area, and the deflection angle of the material to be processed.

[0056] Optionally, the center coordinate value calculation unit includes:

[0057] The first center coordinate value calculation subunit is used to calculate the center coordinate value of the first processing area based on the platform coordinate values ​​of the at least two marker points, the positional relationship between the at least two marker points and the first processing area, and the deflection angle of the material to be processed.

[0058] The second center coordinate value calculation subunit is used to calculate the center coordinate values ​​of other processing areas based on the center coordinate values ​​of the first processing area, the relative positional relationship between the processing areas, and the deflection angle of the material to be processed.

[0059] Optionally, the device further includes:

[0060] The coordinate calibration module is used to calibrate the center coordinate values ​​of the multiple processing areas based on the verticality deviation between the mounting platform of the laser galvanometer processing device and the processing platform.

[0061] Optionally, before the scaling ratio determination module determines the image scaling ratio of the galvanometer, the device further includes:

[0062] The first mesh generation module is used to generate a mesh of a first size on a preset correction plane by means of the laser galvanometer processing device;

[0063] The second mesh generation module is used to generate multiple meshes of the second size on processing planes at different distances using the laser galvanometer processing device;

[0064] The scaling factor calculation module is used to calculate the preset scaling factor based on the size difference between the first-size grid and the plurality of second-size grids.

[0065] Optionally, the device further includes:

[0066] An auxiliary graphic processing module is used to control the laser emitted by the laser emitter in the laser galvanometer processing device to pass through a galvanometer having the image rotation angle and the image scaling ratio, and process auxiliary graphics in a first processing area according to a preset cycle.

[0067] The galvanometer compensation module is used to compensate the processing position and processing angle of the galvanometer based on the offset between the center of the auxiliary graphic and the center of the first processing area.

[0068] Optionally, before the scaling ratio determination module determines the image scaling ratio of the galvanometer, the device further includes:

[0069] A thickness acquisition module is used to acquire multiple thicknesses for each of the processing areas using an incoming material thickness detection device.

[0070] An average thickness calculation module is used to calculate the average thickness of each of the processing areas based on multiple thicknesses of each processing area.

[0071] Fourthly, embodiments of this application also provide a control device, including: a processor, a storage medium, and a bus, wherein the storage medium stores program instructions executable by the processor, and when the control device is running, the processor communicates with the storage medium via the bus, and the processor executes the program instructions to perform the steps of the data processing method as described in any of the first aspects.

[0072] Fifthly, embodiments of this application also provide a computer-readable storage medium storing a computer program, which, when executed by a processor, performs the steps of the data processing method as described in any of the first aspects.

[0073] The beneficial effects of this application are:

[0074] This application provides a laser processing control method, system, and apparatus. By determining the center coordinates and deflection angle of each processing area of ​​the material to be processed based on the pixel coordinates of the marked points on the material to be processed, the processing angle of the galvanometer is exchanged using the deflection angle, and the image scaling ratio of the galvanometer is determined based on the average thickness of each processing area. This achieves calibration of the material's incoming position deviation and the thickness difference of the incoming material in different processing areas, ensuring that the size and accuracy of the processed graphics in each processing area of ​​the material to be processed remain consistent even when there are deviations in the incoming position and differences in the thickness of the incoming material, thereby improving the material processing accuracy. Attached Figure Description

[0075] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0076] Figure 1 This application provides a schematic diagram of the structure of a laser processing control system.

[0077] Figure 2 A schematic flowchart of a laser processing control method provided in an embodiment of this application;

[0078] Figure 3 A schematic diagram illustrating an image scaling ratio provided in an embodiment of this application;

[0079] Figure 4A schematic flowchart illustrating another laser processing control method provided in an embodiment of this application;

[0080] Figure 5 A schematic flowchart illustrating another laser processing control method provided in this application embodiment;

[0081] Figure 6 A schematic flowchart illustrating another laser processing control method provided in an embodiment of this application;

[0082] Figure 7 A schematic diagram illustrating a deflection angle provided in an embodiment of this application;

[0083] Figure 8 A schematic flowchart illustrating yet another laser processing control method provided in this application embodiment;

[0084] Figure 9 A schematic flowchart illustrating yet another laser processing control method provided in this application embodiment;

[0085] Figure 10 A schematic diagram of an auxiliary graphic provided for an embodiment of this application;

[0086] Figure 11 This is a schematic flowchart of a laser processing control device provided in an embodiment of this application;

[0087] Figure 12 This is a schematic diagram of a control device provided in an embodiment of this application. Detailed Implementation

[0088] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments.

[0089] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0090] In the description of this application, it should be noted that if the terms "upper", "lower", etc. appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in, it is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0091] Furthermore, the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0092] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0093] Please refer to Figure 1 This is a schematic diagram of the structure of a laser processing control system provided in an embodiment of this application, as shown below. Figure 1 As shown, the system includes: a processing platform 10, a mounting platform 20, a vision positioning device 30, a laser galvanometer processing device 40, and a control device 50 (not shown in the figure); the control device 50 is communicatively connected to the processing platform 10, the mounting platform 20, the vision positioning device 30, and the laser galvanometer processing device 40; the processing platform 10 is used to mount the material to be processed and to move the material to be processed along the X-axis; the mounting platform 20 is perpendicular to the processing platform 10, and the vision positioning device 30 and the laser galvanometer processing device 40 are both mounted on the mounting platform 20, which moves the vision positioning device 30 and the laser galvanometer processing device 40 along the Y-axis.

[0094] The control device 50 moves the processing platform 10 in the X direction to position the Mark on the material to be processed within the field of view of the vision positioning device 30, thereby obtaining the working coordinate values ​​and deflection angles of each processing area of ​​the material to be processed on the processing platform 10. The control device 50 determines and corrects the image rotation angle of the galvanometer based on the deflection angle and the installation angle of the galvanometer, and determines and corrects the image scaling ratio of the galvanometer based on the average thickness of each processing area. The control device 50 controls the laser galvanometer processing device 40 to move to the processing position based on the working coordinate values ​​on the processing platform 10, and controls the laser emitted by the laser emitter in the laser galvanometer processing device 40 to pass through the galvanometer with the image rotation angle and image scaling ratio to perform laser processing on each processing area.

[0095] In this embodiment, the processing platform 10 and the mounting platform 20 together constitute a gantry structure. The processing platform 10 is the carrier in the gantry structure. After the material to be processed moves from the material receiving position to the processing platform 10, the material to be processed is suspended on the processing platform 10 by the air flotation device on the processing platform 10, and the material to be processed is fixed by the gripper. The gripper is set on the drive mechanism, and the control device 50 drives the gripper to move along the X-axis direction through the drive mechanism.

[0096] It should be noted that the air flotation device and gripper used in this embodiment are mainly for materials with a large area and heavy weight, so that the material to be processed is suspended by the air flotation device and moved along the X-axis by the gripper. For materials with a small area and light weight, other support and motion components can be used, such as conveyor belts. This embodiment does not limit the type of support and motion components used.

[0097] The mounting platform 20 is the gantry frame in the gantry structure, which is set above the processing platform 10 and perpendicular to the processing platform 10. A linear module is set on the mounting platform 20. The vision positioning device 30 and the laser galvanometer processing device 40 are both set on the drive mechanism. The control device 50 drives the laser galvanometer processing device 40 to move along the Y-axis direction through the drive mechanism.

[0098] For example, the driving mechanism in this embodiment can be a linear module. The linear module is communicatively connected to the control device 50 so that the control device 50 controls the gripper to move along the X-axis direction with the material through the linear module, and controls the visual positioning device 30 and the laser galvanometer processing device 40 to move along the Y-axis direction.

[0099] The visual positioning device 30 is used to visually calibrate the position of the material to be processed on the processing platform 10, so that the control device 50 can determine the position of each processing area of ​​the material to be processed and the deflection angle of the material to be processed on the processing platform 10 based on the visual calibration results. The control device 50 can calculate the image rotation angle of the galvanometer based on the deflection angle and the installation angle of the galvanometer, and control the laser galvanometer processing device 40 to move to the corresponding position for laser processing. For example, the visual positioning device 30 can be a camera.

[0100] It should be noted that at least two marker points are required for visual calibration of the material to be processed. When the area of ​​the material is small, if a single camera can cover all the marker points, then a single camera can be used for visual calibration. When the area of ​​the material is large, and the distance between the at least two marker points is far, multiple cameras are needed to ensure that the camera's field of view can cover at least two marker points. In this embodiment, visual calibration of the material to be processed can be completed using only two marker points, Mark1 and Mark2, requiring only two cameras.

[0101] Furthermore, such as Figure 1 As shown, the laser processing control system further includes: an incoming material thickness detection device 60, which is mounted on a mounting platform 20. The mounting platform 20 drives the incoming material thickness detection device 60 to move in the Y-axis direction. The incoming material thickness detection device 60 is communicatively connected to a control device 50. The control device 50 controls the incoming material thickness detection device 60 to move to each processing area of ​​the material to be processed, to obtain multiple thicknesses of the material to be processed in each processing area, and sends the multiple thicknesses of each processing area on the material to be processed to the control device 50. This allows the control device 50 to calculate the average thickness of the material to be processed in each processing area based on the multiple thicknesses of each processing area, and to calculate the image scaling ratio of the galvanometer in each processing area based on the average thickness. This allows the laser emitted by the laser emitter to perform laser processing in each processing area through the galvanometer, which has an image rotation angle and an image scaling ratio. For example, the incoming material thickness detection device 60 can be a height measuring instrument. The height of multiple points on each processing area measured by the height measuring instrument represents the thickness corresponding to multiple points in each processing area.

[0102] Based on the aforementioned laser processing control system, this application provides a laser processing control method applied to the control device within the aforementioned laser processing control system. Please refer to... Figure 2 This is a schematic flowchart of a laser processing control method provided in an embodiment of this application, as shown below. Figure 2 As shown, the method includes:

[0103] S10: Obtain the pixel coordinates of at least two marker points on the material to be processed through a visual positioning device. The material to be processed is installed on the processing platform.

[0104] In this embodiment, the material to be processed has a calibration area, which includes at least two marker points. By adjusting the position of the material to be processed on the processing platform, the at least two marker points are within the field of view of the visual positioning device. The visual positioning device takes pictures of the at least two marker points and sends the images to the control device. The control device determines the pixel coordinate values ​​of the at least two marker points through the images.

[0105] The marker can be a pre-set (processed, marked) MARK point on the material to be processed, or it can be an easily identifiable feature mark that already exists on the material to be processed, such as corner points, etc. This embodiment does not limit this.

[0106] S20: Based on the pre-established coordinate relationship between the processing platform and the vision positioning device, and the pixel coordinate values ​​of at least two marker points, determine the center coordinate values ​​of multiple processing areas on the material to be processed and the deflection angle of the material to be processed.

[0107] In this embodiment, the coordinate relationship between the processing platform and the visual positioning device is as follows: the coordinate relationship between the spatial coordinate system of the processing platform and the pixel coordinate system of the visual positioning device. The control device calculates the platform coordinate values ​​of at least two marker points based on the pixel coordinate values ​​of at least two marker points and the coordinate relationship between the processing platform and the visual positioning device, and determines the center coordinate values ​​of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the platform coordinate values ​​of at least two marker points.

[0108] S30: Determine and correct the image rotation angle of the galvanometer based on the deflection angle of the material to be processed and the installation angle of the galvanometer in the laser galvanometer processing device.

[0109] In this embodiment, during the installation of the laser galvanometer processing device, there is an installation angle t1 between the galvanometer and the processing platform. This installation angle is an unavoidable installation error during the galvanometer installation process, which will cause misalignment of the processed graphics in adjacent processing areas. Calibration errors may also exist during visual calibration. To avoid affecting processing accuracy, the visual calibration compensation value BaseT needs to be calculated. Simultaneously, since the material to be processed has a deflection angle t' at its fixed position on the processing platform, the galvanometer also needs to deflect the laser emitted by the laser emitter according to the deflection angle t' of the material to be processed during processing, ensuring that the laser emitted by the laser galvanometer processing device matches the position of the material to be processed.

[0110] For example, the formula for calibrating the rotation angle t of the image processed by the galvanometer can be:

[0111] t = t1 + t' + BaseT

[0112] S40: Based on the center coordinates of each processing area, control the laser galvanometer processing device to move to each processing area.

[0113] In this embodiment, after determining the center coordinates of each processing area, the control device moves the processing platform in the X-axis direction and the laser galvanometer processing device in the Y-axis direction, so that the laser galvanometer processing device moves to any processing area of ​​the material to be processed, and the processing center of the galvanometer in the laser galvanometer processing device coincides with the center of each processing area, thus completing the position matching between the laser galvanometer processing device and the material to be processed.

[0114] It should be noted that the correction of the image rotation angle of the galvanometer in S30 can be performed before the control device controls the laser processing device to move to the processing area, during the process of the control device controlling the laser processing device to move to the processing area, or after the control device controls the laser processing device to move to the processing area. This embodiment does not limit the order between S30 and S40.

[0115] Preferably, the correction of the image rotation angle of the galvanometer in S30 can be performed during the process of the control device controlling the laser processing device to move to the processing area. This allows the movement time of the galvanometer relative to the material and the image rotation angle of the galvanometer to be parallel, thereby improving processing efficiency.

[0116] S50: Determine and correct the image scaling ratio of the galvanometer for each processing area based on the average thickness of each processing area and the preset scaling factor.

[0117] In this embodiment, the closer the plane of the material to be processed is to the galvanometer, the larger the area of ​​the pattern processed by the galvanometer. Since the thickness of different areas of the material to be processed varies, the distance between different areas and the galvanometer is also different. In order to avoid the inconsistency in the size of the pattern processed in different processing areas of the material to be processed due to the difference in material thickness, it is necessary to determine the image scaling ratio of the galvanometer in each processing area according to the thickness of the material in each processing area.

[0118] For example, please refer to Figure 3 This is a schematic diagram illustrating an image scaling ratio provided in an embodiment of this application, such as... Figure 3As shown, based on the average thickness of each processing area, the height between each processing area and the galvanometer is determined. The height of each processing area is compared with the height of the galvanometer's standard calibration plane. The image scaling ratio of each processing area is determined by the change in height Δh. For every increase in height Δh1, the scaling of the galvanometer increases by a factor of f, where f is the preset scaling factor of the galvanometer. The formula for calculating the image scaling ratio K of each processing area is:

[0119] K = 1 + Δh * f / Δh1

[0120] For example, taking an increase of 50 μm in height as an example, K = 1 + Δh*f / 50.

[0121] Furthermore, different scaling factors can be used in the length and width directions of the graphic to be processed, and the image scaling ratio of each processing area in the length and width directions can be calculated separately.

[0122] In one optional embodiment, the method for obtaining the average thickness of each processing area may be: using an incoming material thickness detection device to obtain multiple thicknesses of each processing area; and calculating the average thickness of each processing area based on the multiple thicknesses of each processing area.

[0123] In this embodiment, the incoming material thickness detection device measures the thickness at multiple points in each processing area to obtain multiple thicknesses for each processing area. The average thickness of each processing area is then calculated by averaging these multiple thicknesses. For example, the average thickness H = (H1 + H2 + ... + H...). n ) / n.

[0124] In one possible implementation, the thickness measurement of the processing area can be performed at multiple points after the material thickness detection device is moved to the processing area and before laser processing begins, in order to obtain the average thickness.

[0125] In another possible implementation, the thickness of the processing area can be measured by the incoming material thickness detection device while the current processing area is being laser-processed. This implementation can improve processing efficiency, but it is necessary to ensure that the installation positions of the laser galvanometer processing device and the incoming material thickness detection device on the mounting platform meet the processing requirements, that is, the installation positions of the laser galvanometer processing device and the incoming material thickness detection device are exactly above the two adjacent processing areas respectively.

[0126] It should be noted that the correction of the image scaling ratio in S50 can be performed before the control device controls the laser processing device to move to the processing area, during the process of the control device controlling the laser processing device to move to the processing area, or after the control device controls the laser processing device to move to the processing area. This embodiment does not limit the order between S40 and S50.

[0127] In one possible implementation, please refer to Figure 4 This is a schematic flowchart of another laser processing control method provided in an embodiment of this application, as shown below. Figure 4 As shown, before the step in S50 above, which determines the image scaling ratio of the galvanometer for each processing area based on the average thickness of each processing area and a preset scaling factor, the method may further include:

[0128] S71: A mesh of the first size is generated on a preset calibration plane by a laser galvanometer processing device.

[0129] S72: Multiple second-size meshes are generated by processing on processing planes at different distances using a laser galvanometer processing device.

[0130] S73: Calculate the preset scaling factor based on the size difference between the first-size grid and multiple second-size grids.

[0131] In this embodiment, with the galvanometer in its initial state, a first-size grid is generated on the material located on a preset calibration plane using a laser galvanometer processing device. This first-size grid serves as the galvanometer calibration document. By adjusting the distance between the laser galvanometer processing device and the processing plane, second-size grids are generated on the material located at different processing planes. The changes in length and width, ΔL and ΔW, of the first-size grid and multiple second-size grids are determined. The changes in length and width, ΔL and ΔW, remain essentially consistent at different heights. To eliminate measurement errors, the average values ​​of the changes ΔL and ΔW at different distances are taken to obtain the scaling factor f of the galvanometer in the length direction. x and the scaling factor f in the width direction y .

[0132] In one alternative embodiment, the distance between the laser galvanometer processing device and the processing plane can be adjusted by adjusting the height of the calibration plane, or the distance between the laser galvanometer processing device and the processing plane can be adjusted by adjusting the thickness of the material on the plane. This embodiment does not limit this.

[0133] S60: The laser emitted by the laser emitter in the laser galvanometer processing device is controlled to pass through a galvanometer with an image rotation angle and an image scaling ratio, so that laser processing is performed on each processing area.

[0134] In this embodiment, after determining and correcting the image rotation angle of the galvanometer and the image scaling ratio of the galvanometer in each processing area, the control device controls the laser emitted by the laser emitter to pass through the galvanometer with the above-mentioned image rotation angle and image scaling ratio to perform laser processing in each processing area.

[0135] Those skilled in the art will know that by adjusting the image rotation angle and image scaling ratio, controlling the laser galvanometer to scan along a preset path and speed can complete laser processing.

[0136] As is understandable, using a galvanometer with image rotation angle and image scaling ratio means writing the image rotation angle and image scaling ratio into the galvanometer calibration file. By calling the calibration file, the calibrated processing can be performed.

[0137] For example, such as Figure 1 As shown, one possible processing sequence for the material to be processed is as follows: After the laser galvanometer processing device completes processing of the first processing area C1, the control device controls the laser galvanometer processing device to move in the Y direction to the fourth processing area C4 for processing. After processing, the control device controls the processing platform to move in the X-axis direction, so that the laser galvanometer processing device processes the fifth processing area C5. Then, the laser galvanometer processing device moves in the Y-axis direction to the second processing area C2 for processing. Then, the processing platform continues to move in the X-axis direction, so that the laser galvanometer processing device processes the third processing area C3. Finally, the laser galvanometer processing device moves in the Y-axis direction to the sixth processing area C6 for processing. After processing, all working areas of the entire material to be processed are completed. The control device controls the processing platform to move in the X-axis direction, moving the processed material in the X direction to the downstream equipment.

[0138] The laser processing control method provided in the above embodiments determines the center coordinates and deflection angles of each processing area of ​​the material to be processed based on the pixel coordinates of the marked points on the material to be processed. The processing angle of the galvanometer is exchanged using the deflection angle. The image scaling ratio of the galvanometer is determined based on the average thickness of each processing area. This achieves calibration of the material's incoming position deviation and the thickness difference of the incoming material in different processing areas. It ensures that the image size and accuracy of each processing area of ​​the material to be processed remain consistent even when there are deviations in the incoming position and differences in the thickness of the incoming material, thereby improving the material processing accuracy.

[0139] Meanwhile, the laser processing control method provided in the above embodiments, for large-format materials to be processed, moves the material in the X direction and the galvanometer processing system in the Y direction, so that the galvanometer processing system is placed in different processing areas for processing. Simultaneously, the horizontal offset of the material and the difference in thickness are corrected by adjusting the galvanometer correction setting. On the one hand, this reduces the mechanical design of the entire laser processing control system in terms of angle and height, making the structure simpler and avoiding more mechanical errors. On the other hand, the correction by adjusting the galvanometer correction setting also ensures processing accuracy. Furthermore, the visual positioning device, the incoming material thickness detection device, and the laser galvanometer processing device are all mounted on the installation platform, allowing for the early detection and acquisition of the angle and thickness information of the material to be processed. Adjusting the galvanometer correction setting can be completed when the galvanometer moves from one area to the next, improving processing efficiency.

[0140] Based on the above embodiments, this application also provides another laser processing control method for determining the coordinate relationship between the processing platform and the vision positioning device before processing the material to be processed. Please refer to... Figure 5 This is a schematic flowchart of another laser processing control method provided in an embodiment of this application, as shown below. Figure 5 As shown, before step S20, which determines the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the vision positioning device, and the pixel coordinates of at least two marker points, the method may further include:

[0141] S81: Based on the position of the marking points on the calibration plate on the processing platform, control the laser galvanometer processing device to process the marking point array on the calibration plate with the marking points as the center.

[0142] In this embodiment, at least one marker point is set on the calibration plate. The calibration plate is moved to the center position of the first area of ​​the processing platform. Based on the relationship between the marker point on the calibration plate and the center position of the first area, the laser galvanometer processing device is controlled to process a marker dot matrix of a preset size on the calibration plate with the marker point as the center. For example, the marker dot matrix can be a 3*3 dot matrix.

[0143] S82: Determine the coordinate relationship between the processing platform and the vision positioning device based on the platform coordinates of each point in the marked dot matrix and the pixel coordinates of each point.

[0144] In this embodiment, the platform coordinates of each point in the marker array on the processing platform are determined based on the relationship between the marker points on the calibration board and the center position of the first region. An image containing the marker array is obtained through a vision positioning device. The control device determines the coordinate relationship between the processing platform and the vision positioning device based on the pixel coordinates of each point in the marker array and the platform coordinates.

[0145] It should be noted that when using two marker points for visual calibration of the material to be processed, and using two cameras, two marker points need to be set on the calibration board, and two marker point arrays are generated with each marker point as the center. The field of view of each camera covers one marker point array. Based on the pixel coordinate values ​​of each point in each marker point array and the platform coordinate values, the coordinate relationship between each camera and the processing platform is determined. Each camera determines the platform coordinates of the marker point based on the pixel coordinate values ​​of the marker point captured on the material to be processed and the coordinate relationship between the camera and the processing platform.

[0146] The laser processing control method provided in the above embodiments determines the coordinate relationship between the processing platform and the vision positioning device by processing a mark matrix on a calibration plate and determining the platform coordinate value and pixel coordinate value of each point in the mark matrix. This unifies the coordinate system between the vision positioning device and the processing platform, allowing the vision positioning device to determine the accurate platform coordinate value of the material to be processed, thereby controlling the laser galvanometer processing device to process accurately and improving the material processing accuracy.

[0147] Based on the above embodiments, this application also provides another laser processing control method. Please refer to... Figure 6 This is a schematic flowchart of another laser processing control method provided in an embodiment of this application, as shown below. Figure 6 As shown, the step S20 above, which determines the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the vision positioning device, and the pixel coordinates of at least two marker points, may include:

[0148] S21: Calculate the platform coordinate values ​​of at least two marker points based on the pre-established coordinate relationship between the processing platform and the vision positioning device, and the pixel coordinate values ​​of at least two marker points.

[0149] In this embodiment, the control device calculates the platform coordinate values ​​of at least two marker points based on the pixel coordinate values ​​of at least two marker points and the coordinate relationship between the processing platform and the vision positioning device.

[0150] S22: Calculate the deflection angle of the material to be processed based on the platform coordinate values ​​of at least two marked points.

[0151] In this embodiment, at least two marker points set on the material to be processed are parallel to each other in the X-axis or Y-axis direction. When the material to be processed is offset on the processing platform, the at least two marker points are offset from the X-axis and Y-axis directions. The deflection angle of the line connecting the at least two marker points relative to the X-axis or Y-axis can be determined according to the trigonometric relationship between the horizontal and vertical coordinates of the at least two marker points. This deflection angle is the deflection angle of the material to be processed.

[0152] For example, please refer to Figure 7 This is a schematic diagram of a deflection angle provided in an embodiment of this application, as shown below. Figure 7 As shown, based on the platform coordinates of markers Mark1 and Mark2, the deflection angle of the line connecting markers Mark1 and Mark2 relative to the Y-axis is determined, which is the deflection angle t' of the material to be processed.

[0153] S23: Calculate the center coordinates of multiple processing areas on the material to be processed based on the platform coordinates of at least two marker points, the positional relationship between at least two marker points and each processing area, and the deflection angle of the material to be processed.

[0154] In this embodiment, when at least two marker points are generated on the material to be processed, the positional relationship between the two marker points and the center point of each processing area is determined. This positional relationship includes the difference between the abscissa and ordinate of the marker points and the center point of each processing area. Based on the platform coordinates of the at least two marker points, the difference between the abscissa and ordinate of the marker points and the center point of each processing area, and the deflection angle of the material to be processed, the center coordinate values ​​of multiple processing areas on the material to be processed are calculated based on the trigonometric function relationship between the marker points and the center point of each processing area.

[0155] In one possible implementation, please refer to Figure 8 This is a schematic flowchart of another laser processing control method provided in the embodiments of this application, as shown below. Figure 8 As shown, the step in S23 above, which calculates the center coordinates of multiple processing areas on the material to be processed based on the platform coordinates of at least two marker points, the positional relationship between the at least two marker points and each processing area, and the deflection angle of the material to be processed, may include:

[0156] S231: Calculate the center coordinates of the first processing area based on the platform coordinates of at least two marker points, the positional relationship between the at least two marker points and the first processing area, and the deflection angle of the material to be processed.

[0157] In this embodiment, the material to be processed is divided into multiple processing areas according to the processing area of ​​the galvanometer. When a marker point is generated on the material to be processed, the positional relationship between the marker point and the first processing area is recorded. This positional relationship includes the difference between the horizontal and vertical coordinates between the marker point and the center point of the first processing area. Based on the platform coordinates of a marker point, the difference between the horizontal and vertical coordinates between the marker point and the center point of the first processing area, and the deflection angle of the material to be processed, the center coordinate value of the first processing area on the material to be processed is calculated based on the trigonometric function relationship between the marker point and the center point of the first processing area.

[0158] S232: Calculate the center coordinates of other processing areas based on the center coordinates of the first processing area, the relative positional relationship between each processing area, and the deflection angle of the material to be processed.

[0159] In this embodiment, the center points of multiple processing areas are distributed at equal intervals along the horizontal and vertical directions on the material to be processed. The relative positional relationship between each processing area includes the difference between the horizontal and vertical coordinates of the center points of other processing areas and the first processing area. The center coordinates of other processing areas can be calculated based on the trigonometric function relationship between the center points of other processing areas and the first processing area, the center coordinates of the first processing area, the difference between the horizontal and vertical coordinates of the center points of other processing areas and the first processing area, and the deflection angle of the material to be processed.

[0160] For example, the center coordinates of the first processing area are C1(X1,Y1), and the center coordinates of the other processing areas are Cn(X1,Y1). n’ ,Y n’ ), D n (DefaultX n DefaultY n ) represents the coordinates of the center point of each processing area on the material to be processed, which can be determined based on D. n (DefaultX n DefaultY n Determine the relative positional relationship between the center points of other processing areas and the first processing area, and the center coordinates C of the other processing areas. n (X n’ ,Y n’ Specifically, it can be expressed as:

[0161] X' n =X1+(DefaultX) n -DefaultX1)*cos(t'+BaseT)-(DefaultY n -DefaultY1)*sin(t'+BaseT)

[0162] Y' n =Y1+(DefaultY) n -DefaultY1)*sin(t'+BaseT)+(DefaultY n -DefaultY1)*cos(t'+BaseT)

[0163] The laser processing control method provided in the above embodiments determines the deflection angle of the material to be processed by calculating the platform coordinate values ​​based on the pixel coordinate values ​​of at least two marker points on the material to be processed, thereby calculating the center coordinate values ​​of multiple processing areas on the material to be processed, so as to realize the position calibration of each processing area on the material to be processed, ensuring that the laser galvanometer processing device performs laser processing at an accurate position, and improving the material processing accuracy.

[0164] In one possible implementation, after step S20, which determines the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the vision positioning device, and the pixel coordinates of at least two marker points, the method may further include:

[0165] Based on the verticality deviation between the mounting platform and the processing platform of the laser galvanometer processing device, the center coordinate values ​​of multiple processing areas are calibrated.

[0166] In this embodiment, since the laser galvanometer processing device is mounted on the mounting platform and the material to be processed is mounted on the processing platform, theoretically the mounting platform and the processing platform are perpendicular to each other. However, due to machining and installation errors, there will be deviations in the perpendicularity between the mounting platform and the processing platform. To ensure the accuracy of the processing position, it is necessary to calibrate the center coordinate values ​​of each processing area of ​​the material to be processed according to the perpendicularity deviation, and obtain the compensated center coordinate values ​​C of each processing area. n (X n ,Y n ).

[0167] For example, the calibration formula can be specifically expressed as:

[0168] X n =X' n +Y' n *tan(t2)

[0169] X n =Y' n / cos(t2)

[0170] The laser processing control method provided in the above embodiments calibrates the center coordinate values ​​of multiple processing areas based on the verticality deviation between the mounting platform and the processing platform of the laser galvanometer processing device, ensuring that the laser galvanometer processing device performs laser processing on the material to be processed at the accurate position, thereby improving the material processing accuracy.

[0171] Based on the above embodiments, this application also provides another laser processing control method. Please refer to... Figure 9 This is a schematic flowchart of yet another laser processing control method provided in an embodiment of this application, as shown below. Figure 9 As shown, the method also includes:

[0172] S91: According to a preset cycle, the laser emitted by the laser emitter in the laser galvanometer processing device is controlled to pass through the galvanometer with image rotation angle and image scaling ratio to process auxiliary graphics in the first processing area.

[0173] S92: Compensate the machining position and machining angle of the galvanometer based on the offset between the center of the auxiliary graphic and the center of the first machining area.

[0174] In this embodiment, by determining the position of the material to be processed and correcting the image rotation angle and image scaling ratio of the galvanometer through the steps of S10-S50 described above, the accuracy of material processing can be guaranteed in a short time. However, as the temperature and humidity of the processing environment change during the processing, the mechanical structure of the laser galvanometer processing device will undergo slight changes, causing the position of the laser galvanometer processing device to shift and affecting the processing accuracy. Therefore, this embodiment needs to calibrate the processing position of the laser generated by the laser galvanometer processing device.

[0175] Specifically, the preset cycle is the self-calibration cycle of the laser galvanometer processing device. After executing the steps S10-S50 above, the laser galvanometer processing device is controlled to move to the first processing area of ​​the material to be processed. The laser emitted by the laser emitter in the laser galvanometer processing device is controlled to pass through the galvanometer with the above-mentioned image rotation angle and image scaling ratio to process auxiliary graphics in the first processing area. The auxiliary graphics can be rectangles, lines, or graphics that actually need to be processed on the material.

[0176] For example, please refer to Figure 10 This is a schematic diagram of an auxiliary graphic provided in an embodiment of this application, such as... Figure 10As shown, the offset between the center of the auxiliary graphic and the center of the first processing area is calculated. The offset includes: the offset Δx of the center of the auxiliary graphic relative to the center of the first processing area in the X-axis direction, the offset Δy of the center of the auxiliary graphic relative to the center of the first processing area in the Y-axis direction, and the offset angle Δt of the auxiliary graphic in the vertical direction. Based on the offsets Δx and Δy, the processing position of the laser passing through the galvanometer is compensated, and the processing angle of the laser passing through the galvanometer is compensated based on the offset angle Δt. This ensures that even if the mechanical structure of the laser galvanometer processing device undergoes slight changes, it can still accurately process the material to be processed.

[0177] It should be noted that when the laser galvanometer processing device performs self-calibration, the first processing area serves as an auxiliary area. After processing the auxiliary graphic, the first processing area does not participate in the subsequent processing of the preset graphic.

[0178] The laser processing control method provided in the above embodiments processes an auxiliary pattern in the first processing area to determine the offset between the auxiliary pattern and the first processing area, and compensates for the processing position and processing angle of the galvanometer. This ensures that even if the mechanical structure of the laser galvanometer processing device undergoes slight changes, it can still accurately process the material to be processed, thereby improving the processing accuracy of the material.

[0179] Based on the above embodiments, this application also provides a laser processing control device. Please refer to... Figure 11 This is a schematic flowchart of a laser processing control device provided in an embodiment of this application, as shown below. Figure 11 As shown, the device includes:

[0180] The pixel coordinate acquisition module 11 is used to acquire the pixel coordinate values ​​of at least two marker points on the material to be processed through a visual positioning device. The material to be processed is installed on the processing platform.

[0181] The coordinate and angle determination module 12 is used to determine the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the vision positioning device, as well as the pixel coordinate values ​​of at least two marker points.

[0182] The rotation angle determination module 13 is used to determine and correct the image rotation angle of the galvanometer based on the deflection angle of the material to be processed and the installation angle of the galvanometer in the laser galvanometer processing device.

[0183] The movement control module 14 is used to control the laser galvanometer processing device to move to each processing area according to the center coordinate value of each processing area;

[0184] The scaling ratio determination module 15 is used to determine and correct the image scaling ratio of the galvanometer for each processing area based on the average thickness of each processing area and the preset scaling factor.

[0185] The processing control module 16 is used to control the laser emitted by the laser emitter in the laser galvanometer processing device to pass through the galvanometer with image rotation angle and image scaling ratio, so as to perform laser processing on each processing area.

[0186] Optionally, before the coordinate and angle determination module 12 determines the center coordinates of multiple processing areas and the deflection angle of the material to be processed, the device further includes:

[0187] The marker matrix processing module is used to control the laser galvanometer processing device to process the marker matrix on the calibration plate with the markers as the center, based on the position of the markers on the calibration plate on the processing platform.

[0188] The coordinate relationship determination module is used to determine the coordinate relationship between the processing platform and the vision positioning device based on the platform coordinates of each point in the marked dot matrix on the processing platform and the pixel coordinates of each point.

[0189] Optional, the coordinate and angle determination module 12 includes:

[0190] The marker point coordinate value determination unit is used to calculate the platform coordinate values ​​of at least two marker points based on the pre-established coordinate relationship between the processing platform and the vision positioning device, and the pixel coordinate values ​​of at least two marker points.

[0191] The deflection angle determination unit is used to calculate the deflection angle of the material to be processed based on the platform coordinate values ​​of at least two marker points.

[0192] The center coordinate value calculation unit is used to calculate the center coordinate values ​​of multiple processing areas on the material to be processed based on the platform coordinate values ​​of at least two marker points, the positional relationship between at least two marker points and each processing area, and the deflection angle of the material to be processed.

[0193] Optional, the center coordinate value calculation unit includes:

[0194] The first center coordinate value calculation subunit is used to calculate the center coordinate value of the first processing area based on the platform coordinate values ​​of at least two marker points, the positional relationship between at least two marker points and the first processing area, and the deflection angle of the material to be processed.

[0195] The second center coordinate value calculation subunit is used to calculate the center coordinate values ​​of other processing areas based on the center coordinate values ​​of the first processing area, the relative positional relationship between each processing area, and the deflection angle of the material to be processed.

[0196] Optionally, the device may also include:

[0197] The coordinate calibration module is used to calibrate the center coordinate values ​​of multiple processing areas based on the verticality deviation between the mounting platform and the processing platform of the laser galvanometer processing device.

[0198] Optionally, before the scaling determination module 15 determines the image scaling ratio of the galvanometer, the device further includes:

[0199] The first mesh generation module is used to generate a mesh of the first size on a preset correction plane by means of a laser galvanometer processing device;

[0200] The second mesh generation module is used to generate multiple meshes of the second size on processing planes at different distances using a laser galvanometer processing device.

[0201] The scaling factor calculation module is used to calculate a preset scaling factor based on the size difference between a first-size grid and multiple second-size grids.

[0202] Optionally, the device may also include:

[0203] An auxiliary image processing module is used to control the laser emitted by the laser emitter in the laser galvanometer processing device to pass through a galvanometer with an image rotation angle and an image scaling ratio to process an auxiliary image in a first processing area according to a preset cycle.

[0204] The galvanometer compensation module is used to compensate for the processing position and processing angle of the galvanometer based on the offset between the center of the auxiliary image and the center of the first processing area.

[0205] Optionally, before the scaling determination module 15 determines the image scaling ratio of the galvanometer, the device further includes:

[0206] The thickness acquisition module is used to acquire multiple thicknesses for each processing area using an incoming material thickness detection device.

[0207] The average thickness calculation module is used to calculate the average thickness of each processing area based on multiple thicknesses of each processing area.

[0208] The above-described device is used to execute the method provided in the foregoing embodiments, and its implementation principle and technical effect are similar, so they will not be described again here.

[0209] These modules can be one or more integrated circuits configured to implement the above methods, such as one or more Application Specific Integrated Circuits (ASICs), one or more microprocessors, or one or more Field Programmable Gate Arrays (FPGAs). Alternatively, when a module is implemented using processing element scheduler code, the processing element can be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. Furthermore, these modules can be integrated together as a system-on-a-chip (SOC).

[0210] Please refer to Figure 12 This is a schematic diagram of a control device provided in an embodiment of this application, such as... Figure 12 As shown, the control device 50 includes a processor 501, a storage medium 502, and a bus. The storage medium 502 stores program instructions executable by the processor 501. When the control device 50 is running, the processor 501 communicates with the storage medium 502 via the bus, and the processor 501 executes the program instructions to perform the above-described method embodiment. The specific implementation and technical effects are similar and will not be described in detail here.

[0211] Optionally, the present invention also provides a program product, such as a computer-readable storage medium, including a program that, when executed by a processor, is used to perform the above-described method embodiments.

[0212] In the several embodiments provided by this invention, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0213] The unit described as a separating component may or may not be separated from the material. The component shown as a unit may or may not be a material unit; that is, it may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0214] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist as a separate material, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in the form of hardware plus software functional units.

[0215] The integrated units implemented as software functional units described above can be stored in a computer-readable storage medium. These software functional units, stored in a storage medium, include several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute some steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0216] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A laser processing control method, characterized in that, The method includes: The pixel coordinates of at least two marker points on the material to be processed are obtained by a visual positioning device, and the material to be processed is mounted on a processing platform. Based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinate values ​​of the at least two marker points, the center coordinate values ​​of multiple processing areas on the material to be processed and the deflection angle of the material to be processed are determined. Based on the deflection angle of the material to be processed and the installation angle of the galvanometer in the laser galvanometer processing device, the image rotation angle of the galvanometer is determined and corrected. Based on the center coordinates of each processing area, the laser galvanometer processing device is controlled to move to each processing area; Based on the average thickness of each processing area and a preset scaling factor, the image scaling ratio of the galvanometer for each processing area is determined and corrected; The laser emitted by the laser emitter in the laser galvanometer processing device is controlled to pass through a galvanometer having the image rotation angle and the image scaling ratio, so as to perform laser processing on each of the processing areas; The step of determining and correcting the image scaling ratio of the galvanometer for each processing area based on the average thickness of each processing area and a preset scaling factor includes: The height between each processing area and the galvanometer is determined based on the average thickness of each processing area; Based on the height variation between each processing area and the galvanometer and the height of the galvanometer's standard correction plane, and the preset scaling factor corresponding to the standard height variation, the image scaling ratio of the galvanometer for each processing area is determined and corrected. Before determining and correcting the image scaling ratio of the galvanometer based on the average thickness of the plurality of processing areas and a preset scaling factor, the method further includes: A grid of the first size is generated on a preset correction plane by means of the laser galvanometer processing device; Multiple second-size grids are generated by the laser galvanometer processing device on processing planes at different distances; The preset scaling factor is calculated based on the size difference between the first-size grid and the plurality of second-size grids.

2. The method as described in claim 1, characterized in that, Before determining the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinates of the at least two marker points, the method further includes: Based on the position of the marking points on the calibration plate on the processing platform, the laser galvanometer processing device is controlled to process a matrix of marking points on the calibration plate with the marking points as the center. The coordinate relationship between the processing platform and the visual positioning device is determined based on the platform coordinates of each point in the marked dot matrix on the processing platform and the pixel coordinates of each point.

3. The method as described in claim 1, characterized in that, The step of determining the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed, based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinates of the at least two marker points, includes: Based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinate values ​​of the at least two marker points, the platform coordinate values ​​of the at least two marker points are calculated. Calculate the deflection angle of the material to be processed based on the platform coordinate values ​​of the at least two marked points; Based on the platform coordinates of the at least two marker points, the positional relationship between the at least two marker points and each processing area, and the deflection angle of the material to be processed, the center coordinates of multiple processing areas on the material to be processed are calculated.

4. The method as described in claim 3, characterized in that, The step of calculating the center coordinates of multiple processing areas on the material to be processed based on the platform coordinates of the at least two marker points, the positional relationship between the at least two marker points and each processing area, and the deflection angle of the material to be processed includes: The center coordinates of the first processing area are calculated based on the platform coordinates of the at least two marker points, the positional relationship between the at least two marker points and the first processing area, and the deflection angle of the material to be processed. The center coordinates of other processing areas are calculated based on the center coordinates of the first processing area, the relative positions of the processing areas, and the deflection angle of the material to be processed.

5. The method as described in claim 1, characterized in that, After determining the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the visual positioning device, and the pixel coordinates of the at least two marker points, the method further includes: The center coordinate values ​​of the multiple processing areas are calibrated based on the verticality deviation between the mounting platform of the laser galvanometer processing device and the processing platform.

6. The method as described in claim 1, characterized in that, The method further includes: According to a preset cycle, the laser emitted by the laser emitter in the laser galvanometer processing device is controlled to pass through a galvanometer having the image rotation angle and the image scaling ratio to process auxiliary graphics in the first processing area; The processing position and processing angle of the galvanometer are compensated based on the offset between the center of the auxiliary graphic and the center of the first processing area.

7. The method as described in claim 1, characterized in that, Before determining and correcting the image scaling ratio of the galvanometer for each processing area based on the average thickness of each processing area and a preset scaling factor, the method further includes: A material thickness detection device is used to obtain multiple thicknesses for each of the processing areas; The average thickness of each of the processing areas is calculated based on the multiple thicknesses of each processing area.

8. A laser processing control system, characterized in that, The system includes: a processing platform, an installation platform, a vision positioning device, a laser galvanometer processing device, and a control device; the control device is communicatively connected to the processing platform, the installation platform, the vision positioning device, and the laser galvanometer processing device. The processing platform is used to mount the material to be processed and to move the material to be processed along the X-axis. The mounting platform is perpendicular to the processing platform. The visual positioning device and the laser galvanometer processing device are both mounted on the mounting platform. The mounting platform drives the visual positioning device and the laser galvanometer processing device to move in the Y-axis direction. The control device is used to perform the steps of the laser processing control method according to any one of claims 1-6.

9. The system as described in claim 8, characterized in that, The system also includes: a material thickness detection device; The incoming material thickness detection device is mounted on the installation platform. The installation platform drives the incoming material thickness detection device to move in the Y-axis direction. The incoming material thickness detection device is communicatively connected to the control device and sends multiple thicknesses of each processing area on the material to be processed to the control device.

10. A laser processing control device, characterized in that, The device includes: A pixel coordinate acquisition module is used to acquire the pixel coordinate values ​​of at least two marker points on the material to be processed through a visual positioning device, wherein the material to be processed is mounted on a processing platform. The coordinate and angle determination module is used to determine the center coordinates of multiple processing areas on the material to be processed and the deflection angle of the material to be processed based on the pre-established coordinate relationship between the processing platform and the vision positioning device, and the pixel coordinate values ​​of the at least two marker points. The rotation angle determination module is used to determine and correct the image rotation angle of the galvanometer based on the deflection angle of the material to be processed and the installation angle of the galvanometer in the laser galvanometer processing device. A movement control module is used to control the laser galvanometer processing device to move to each of the processing areas based on the center coordinates of each processing area; The scaling ratio determination module is used to determine and correct the image scaling ratio of the galvanometer for each processing area based on the average thickness of each processing area and a preset scaling factor. The processing control module is used to control the laser emitted by the laser emitter in the laser galvanometer processing device to pass through the galvanometer having the image rotation angle and the image scaling ratio, so as to perform laser processing on each processing area; The scaling ratio determination module is specifically used to determine the height between each processing area and the galvanometer based on the average thickness of each processing area; and to determine and correct the image scaling ratio of the galvanometer for each processing area based on the height difference between each processing area and the galvanometer and the height of the galvanometer's standard correction plane, and the preset scaling factor corresponding to the standard height difference. The device further includes: The first mesh generation module is used to generate a mesh of a first size on a preset correction plane by means of the laser galvanometer processing device; The second mesh generation module is used to generate multiple meshes of the second size on processing planes at different distances using the laser galvanometer processing device; The scaling factor calculation module is used to calculate the preset scaling factor based on the size difference between the first-size grid and the plurality of second-size grids.

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