A device and method for measuring the deformation of structural components

Abstract

This application provides a device and method for measuring the deformation of a test structural component, relating to the field of semiconductor technology. The device includes at least one structural component, an actuator, and at least one laser displacement sensor. The structural component is configured to cooperate with a probe card, placing the probe card in a test state, and is located between the laser displacement sensor and the actuator. The actuator applies the pressure required for the test state, and the laser displacement sensor measures the deformation displacement data of the structural component. This effectively improves upon the current probe card test structure design, mitigating the adverse effects of structural component deformation, enabling more stable probe card testing, and improving testing efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to a device and method for measuring the deformation of structural components. Background Technology

[0002] In the field of semiconductor testing, with the reduction of pitch, the increasing complexity of processes, and the diversification of chip designs, the number of pins on probe cards and their density are increasing, which increases the pressure on the unit area and causes deformation of the probe card's structural components. This deformation directly affects the operational stability of the probe card during testing. However, in practice, the focus is often on the probe card itself or the testing process itself, and the deformation of the structural components is often overlooked. This results in loopholes in the improvement of probe card testing processes and affects the improvement of work efficiency. Summary of the Invention

[0003] In view of this, the embodiments of this specification provide a device and method for measuring the deformation of test structural components, which effectively improves the adverse factors caused by structural component deformation in the current probe card test structure design, enabling probe card testing to be carried out with higher stability and improving testing efficiency.

[0004] The embodiments in this specification provide the following technical solutions:

[0005] On one hand, a device for measuring the deformation of a structural component is provided, comprising at least one structural component, an actuator, and at least one laser displacement sensor. The structural component is configured to cooperate with a probe card such that the probe card is in a test state and is located between the laser displacement sensor and the actuator. The actuator is used to apply the pressure required for the test state, and the laser displacement sensor is used to measure the deformation displacement data of the structural component.

[0006] In some embodiments, the structural member is used to fix the probe card, and the structural member has at least one structural member through hole for the test spot of the at least one laser displacement sensor to pass through.

[0007] In some embodiments, a PCB board is further provided between the laser displacement sensor and the structural component. The PCB board has at least one PCB board through hole for the test spot of the at least one laser displacement sensor to pass through. The central axis of the at least one PCB board through hole coincides with the central axis of the at least one structural component through hole.

[0008] In some embodiments, the structural component through-hole includes a left structural component through-hole and a right structural component through-hole symmetrically arranged with respect to the center of the probe card, and the PCB board through-hole includes a left PCB board through-hole and a right PCB board through-hole symmetrically arranged with respect to the center of the probe card, wherein the central axis of the left structural component through-hole coincides with the central axis of the left PCB board through-hole, and the central axis of the right structural component through-hole coincides with the central axis of the right PCB board through-hole.

[0009] In some embodiments, the three structural members are provided, and the central axes of the through holes of the left structural members of the three structural members coincide, and the central axes of the through holes of the right structural members of the three structural members coincide.

[0010] In some embodiments, the test status includes the test status under different probe card test conditions.

[0011] In some embodiments, the laser displacement sensor is fixed by a universal bracket, such that the laser emitting end of the laser displacement sensor faces the photosensitive paper disposed on the structural component.

[0012] On the other hand, a method for measuring the deformation of a test structure component using the test structure component deformation measuring device described in any of the above embodiments is provided, including:

[0013] At least one of the structural components and at least one of the laser displacement sensors are sequentially installed above the actuator. The structural component is configured in conjunction with the probe card so that the probe card is in a test state and is located between the laser displacement sensor and the actuator.

[0014] Adjust the laser displacement sensor spot to focus on the structural component under test;

[0015] The actuator applies the pressure required for the test state and then reads the deformation displacement data of the structural component.

[0016] In some embodiments, under different probe card test conditions, the following operations are repeated until deformation displacement data of all the structural components are obtained:

[0017] Adjust the laser displacement sensor spot to focus on the structural component under test;

[0018] The actuator applies the pressure required for the test state and then reads the deformation displacement data of the structural component.

[0019] In some embodiments, the method further includes: adjusting or replacing the structural component based on the deformation displacement data of the structural component.

[0020] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0021] By using at least one structural component, an actuator, and at least one laser displacement sensor, and acquiring deformation measurements of the test structural component under different actual test conditions of the probe card, the deformation index of the structural component can be quantified. This provides a favorable indicator basis for the probe card testing process. For example, based on the deformation displacement data of the structural component, the structural component can be adjusted or replaced. This effectively improves the adverse factors (test instability, open circuit and other errors) caused by structural component deformation in the current probe card test structure design, enabling probe card testing to be carried out with higher stability and improving testing efficiency. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the deformation measurement device for test structural components provided in the embodiments of this application;

[0024] Figure 2 This is a schematic diagram of the deformation measurement method for test structural components provided in the embodiments of this application. Detailed Implementation

[0025] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0026] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0028] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0029] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0030] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0031] The deformation measuring device for test structures provided in this application includes at least one structural component 3 (exemplarily, such as...). Figure 1 The diagram shows a three-layer structure 3, an actuator 4, and at least one laser displacement sensor 1. The structure 3 is configured to cooperate with a probe card 5, placing the probe card 5 in a testing state, and is located between the laser displacement sensor 1 and the actuator 4. The actuator 4 applies the pressure required for the testing state, and the laser displacement sensor 1 measures the deformation displacement data of the structure 3. Here, the structure 3 refers to various structural components used in product testing, such as probe card testing in semiconductor testing. There are no particular limitations on the specific structural configuration or quantity of the structure 3; it can be combined with other components as needed. Figure 1 The three-layer structural components shown are arranged in different structural styles or in other quantities.

[0032] In some embodiments, at least one structural through hole (e.g., ...) is provided on the structural member 3. Figure 1The structural components shown have through holes 31, 32, 33, 34, 35, 36, etc., for the passage of a test spot from at least one laser displacement sensor 1. In some embodiments, a PCB board 2 is further provided between the laser displacement sensor 1 and the structural component 3, and the PCB board 2 has at least one PCB board through hole (e.g., ...). Figure 1 The PCB board through holes 21 and 22 shown are used to pass through the test spot of at least one laser displacement sensor 1, and the central axis of at least one PCB board through hole coincides with the central axis of at least one structural component through hole.

[0033] In some embodiments, the structural through-hole includes a left structural through-hole symmetrically disposed relative to the probe card 5 located at the center (exemplary, such as...). Figure 1 The left structural component through holes 31, 32, and 33 (shown) and the right structural component through holes (exemplarily, such as...) Figure 1 The through holes 34, 35, and 36 of the right structural component shown are symmetrically arranged with respect to the probe card located at the center. The central axis of the through holes 31, 32, and 33 of the left structural component coincides with the central axis of the through hole 21 of the left PCB board, and the central axis of the through holes 34, 35, and 36 of the right structural component coincides with the central axis of the through hole 22 of the right PCB board.

[0034] In some embodiments, a three-layer structure 3 may be provided, wherein the central axes of the through holes 31, 32, and 33 of the left structure of the three-layer structure 3 coincide, and the central axes of the through holes 33, 34, and 35 of the right structure of the three-layer structure 3 coincide.

[0035] In some embodiments, a universal bracket (not shown in the figure) can be used to fix the laser displacement sensor 1. Through multi-angle operation of the universal bracket, the laser emitting end of the laser displacement sensor 1 can be oriented towards the photosensitive paper (not shown in the figure) disposed on the structural component 3, so that the focused light spot is on the structural component 3. In some embodiments, the test state of the probe card includes the test state under different probe card test conditions, that is, the deformation data of the structural component can be measured under different probe card test conditions.

[0036] In addition, embodiments of this application also provide a method for measuring the deformation of a test structure using the aforementioned test structure deformation measuring device, such as... Figure 2 As shown, it includes the following steps:

[0037] S1. At least one structural component 3 and at least one laser displacement sensor 1 are sequentially installed above the actuator 4. The structural component 3 and the probe card 5 are configured to be in a test state and located between the laser displacement sensor 1 and the actuator 4.

[0038] S2. Adjust the spot of the laser displacement sensor 1 to focus on the structural component 3 under test;

[0039] S3, the actuator 4 applies the pressure required for the test state, and then reads the deformation displacement data of the structural component 3.

[0040] In some embodiments, for different test conditions of probe card 5, the following operations are repeated until the deformation displacement data of all structural components 3 are obtained:

[0041] Adjust the spot of the laser displacement sensor 1 to focus on the structural component 3 under test;

[0042] The actuator 4 applies the pressure required for the test state (e.g., the actuator 4 makes a reciprocating motion of contact and separation through a touch-down action), and then reads the deformation displacement data of the structural component 3.

[0043] In some embodiments, after obtaining the deformation displacement data of structural component 3, structural component 3 can be adjusted or replaced based on the deformation displacement data. In some embodiments, structural component 3 can be adjusted by strengthening its structural strength, flatness, and surface finish, so as to reduce the adverse effects of structural component deformation on probe card testing, making probe card testing more stable and testing efficiency higher.

[0044] In summary, the deformation measurement device and method for testing structural components provided in this application have at least the following beneficial effects:

[0045] By using at least one structural component, an actuator, and at least one laser displacement sensor, and acquiring deformation measurements of the test structural component under different actual test conditions of the probe card, the deformation index of the structural component can be quantified. This provides a favorable indicator basis for the probe card testing process. For example, based on the deformation displacement data of the structural component, the structural component can be adjusted or replaced. This effectively improves the adverse factors (test instability, open circuit and other errors) caused by structural component deformation in the current probe card test structure design, enabling probe card testing to be carried out with higher stability and improving testing efficiency.

[0046] In this specification, similar or identical parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for the product embodiments described later, since they correspond to the methods, the descriptions are relatively simple, and relevant parts can be referred to the descriptions in the system embodiments. Furthermore, this specification uses specific terms to describe the embodiments. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different places in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this specification can be appropriately combined.

[0047] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this specification are not intended to limit the order of the processes and methods described herein. Although various examples have been discussed in the foregoing disclosure of some embodiments of the invention that are currently considered useful, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the spirit and scope of the embodiments described herein. For example, while the system components described above can be implemented by hardware devices, they can also be implemented solely by software solutions, such as installing the described system on existing processing devices or mobile devices.

[0048] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification and therefore remain within the spirit and scope of the exemplary embodiments described herein.

Claims

1. A test structure deformation measurement apparatus, characterized by, The structure is used for fixing the probe card, and at least one structure hole is formed in the structure for the test light spot of the at least one laser displacement sensor. The laser displacement sensor and the structure are further provided with a PCB board, and at least one PCB hole is formed in the PCB board for the test light spot of the at least one laser displacement sensor. The structure hole includes a left structure hole and a right structure hole which are symmetrically arranged with respect to the center of the probe card, and the PCB hole includes a left PCB hole and a right PCB hole which are symmetrically arranged with respect to the center of the probe card. Three layers of the structure are provided, and the center axes of the left structure holes of the three layers of the structure coincide, and the center axes of the right structure holes of the three layers of the structure coincide. The laser displacement sensor is fixed by using a universal support, so that the laser emission end of the laser displacement sensor faces the photosensitive paper arranged on the structure. The test state includes different probe card test working conditions.

2. The apparatus of claim 1, wherein, The test state includes different probe card test working conditions.

3. The test structure deformation measurement method of any one of claims 1 to 2, wherein The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions.

4. The test structure deformation measurement method according to claim 3, wherein The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions.

5. The test structure deformation measurement method according to claim 3 or 4, characterized by, The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. The test state includes different probe card test working conditions. 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