Method and device for repairing display panel LED and display panel

Abstract

The application discloses a display panel LED repairing method and device and a display panel. The method comprises the following steps: determining an LED dead point on a display panel; forming a channel surrounding the LED dead point on a connecting layer around the LED dead point, the connecting layer being used for connecting the LED and a back plate of the display panel; coating an LED connecting layer dissolving solution at the LED dead point, and dissolving the connecting layer corresponding to the LED dead point; and supplementing a normal LED at the LED dead point. The application can avoid damaging the back plate in the process of forming the channel. Then, the LED connecting layer dissolving solution is coated at the LED dead point, the LED connecting layer dissolving solution dissolves the connecting layer corresponding to the LED dead point, and the connecting layer at the LED dead point is removed in a directional manner. Then, the normal LED is supplemented at the LED dead point, so that the LED can be repaired in situ without damaging the back plate, that is, the LED can be repaired in a directional manner, and the yield of the display panel is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly to a method, apparatus and display panel for repairing LEDs of a display panel. Background Technology

[0002] Micro-LED (Micro Light Emitting Diode) display panels have advantages such as high brightness, fast response speed, low power consumption, long lifespan, and splicing capability, making them a research hotspot for people pursuing the next generation of display technologies.

[0003] Currently, common Micro-LED display panels are composed of millions of micron-sized LEDs, making them prone to Micro-LED dead pixels. In such cases, in-situ repair of these dead pixels can improve the overall yield of the Micro-LED display panel. However, this in-situ repair process can easily damage other structures within the Micro-LED display panel, leading to a decrease in overall yield. Summary of the Invention

[0004] This invention provides a method, apparatus, and display panel for repairing LEDs in a display panel, thereby improving the yield of LED display panels.

[0005] In a first aspect, embodiments of the present invention provide a method for repairing LEDs in a display panel, comprising:

[0006] Identify dead LEDs on the display panel;

[0007] A channel is formed around the LED defect on the connection layer, the connection layer being used to connect the LED and the back plate of the display panel;

[0008] An LED connection layer dissolving solution is applied to the defective LED area to dissolve the connection layer corresponding to the defective LED.

[0009] Replace the defective LED with a normal LED.

[0010] Optionally, a channel is formed around the LED defect on the connection layer surrounding the LED defect, including:

[0011] The connection layer is laser-etched around the LED defect to form the channel surrounding the LED defect.

[0012] Optionally, the depth of the channel is less than or equal to the thickness of the connecting layer.

[0013] Optionally, the channel extends to the edge of the display panel.

[0014] Optionally, the LEDs are arranged in an array, and the channel extends around the defective LEDs along a first direction and / or a second direction; wherein the first direction is the row direction of the LED array and the second direction is the column direction of the LED array.

[0015] Optionally, before applying the LED interconnect layer solvent to the LED defective area, the method further includes:

[0016] Remove the LED at the defective point of the LED.

[0017] Optionally, removing the LED at the defective LED location includes:

[0018] The defective LED is removed by targeting the defective LED with a laser.

[0019] Optionally, an LED interconnect layer solvent is applied to the defective LED area, comprising:

[0020] The LED interconnect layer solution is coated onto the defective LED area using an inkjet printing process.

[0021] Secondly, embodiments of the present invention also provide a repair device for LEDs on a display panel, comprising:

[0022] The dead pixel detection module is used to identify dead LEDs on the display panel;

[0023] A channel forming module is used to form a channel around the LED defect on a connecting layer around the LED defect, the connecting layer being used to connect the LED and the backplate of the display panel;

[0024] The solvent coating module is used to coat the LED connection layer solvent at the LED defect point to dissolve the connection layer corresponding to the LED defect point.

[0025] An LED replacement module is used to replace a normal LED at the location of the defective LED.

[0026] Thirdly, embodiments of the present invention also provide a display panel, including a back plate and an array of LEDs; the LEDs are connected to the back plate via a connecting layer; at least one of the LEDs is repaired using the repair method for display panel LEDs provided in the first aspect.

[0027] The technical solution of this invention forms a channel on the connecting layer around the LED defect, thus avoiding damage to the backplane during the channel formation process. Then, an LED connecting layer dissolving solution is applied to the LED defect area. This solution dissolves the connecting layer corresponding to the LED defect, achieving targeted removal of the connecting layer at the defective LED location, causing the LED to detach. A normal LED is then added to the defective LED location, enabling in-situ LED repair without damaging the backplane. This targeted LED repair improves the yield rate of the display panel. Attached Figure Description

[0028] Figure 1 A schematic diagram illustrating the repair of defective pixels in Micro-LEDs, based on existing technology;

[0029] Figure 2 A flowchart illustrating a method for repairing LEDs on a display panel, as provided in an embodiment of the present invention;

[0030] Figure 3 A top view of the display panel corresponding to step S110 is provided in an embodiment of the present invention.

[0031] Figure 4 A cross-sectional structural diagram of a display panel corresponding to step S110 provided in an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of the structure of a display panel corresponding to step S120 provided in an embodiment of the present invention;

[0033] Figure 6 This is a schematic diagram of the structure of a display panel corresponding to step S130 provided in an embodiment of the present invention;

[0034] Figure 7 This is a schematic diagram of the structure of a display panel corresponding to step S140 provided in an embodiment of the present invention;

[0035] Figure 8 This is a schematic diagram of the channel cross-sectional structure of a display panel provided in an embodiment of the present invention;

[0036] Figure 9 This is a schematic diagram of the channel structure of a display panel provided in an embodiment of the present invention;

[0037] Figure 10 A flowchart illustrating another method for repairing LEDs on a display panel, as provided in an embodiment of the present invention.

[0038] Figure 11 A schematic diagram of a repair device for a display panel LED provided in an embodiment of the present invention;

[0039] Figure 12 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention. Detailed Implementation

[0040] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0041] Micro-LED display panels contain millions of micro-LEDs. After the micro-LEDs are bonded to the back panel of the display panel, the light emission of the micro-LED display panel can be detected. When there are micro-LEDs with abnormal light emission on the micro-LED display panel, the abnormal micro-LEDs can be identified as defective micro-LEDs and repaired, thereby ensuring the overall yield of the micro-LED display panel. Figure 1 This diagram illustrates a method for repairing defective pixels in Micro-LEDs, based on existing technology. Figure 1 As shown, when a defective pixel 01 exists in the Micro-LED display panel, it needs to be repaired. Repairing Micro-LED defective pixel 01 can be done through in-situ repair, directly replacing the Micro-LED at defective pixel 01, thereby improving the yield of the Micro-LED display panel. However, in-situ repair of Micro-LED defective pixel 01 can easily damage other film layers within the backplane of the Micro-LED display panel, such as the metal layer, leading to a decrease in the yield of the Micro-LED display panel.

[0042] To address the aforementioned technical problems, embodiments of the present invention provide a method for repairing LEDs on a display panel, used to repair LEDs on a display panel. Figure 2 This is a flowchart illustrating a method for repairing LEDs in a display panel, as provided in an embodiment of the present invention. Figure 2 As shown, the method includes:

[0043] S110. Identify dead LEDs on the display panel;

[0044] Specifically, Figure 3 This is a top view of the display panel corresponding to step S110 provided in an embodiment of the present invention. Figure 4 This is a cross-sectional structural diagram of a display panel corresponding to step S110, provided as an embodiment of the present invention. Figure 3 and Figure 4 As shown, the display panel includes a backplate 10 and LEDs 20, as well as a connecting layer 30 for connecting the backplate 10 and LEDs 20. The backplate 10 has a driving circuit for driving the LEDs 20. The connecting layer 30 enables electrical connection between the driving circuit within the backplate 10 and the LEDs 20, thereby allowing the LEDs 20 to emit light through the driving circuit on the backplate 10. For example, the connecting layer 30 can be an anisotropic conductive film (ACF). By placing ACF between the backplate 10 and the LEDs 20, electrical connection can be achieved between the driving circuit on the backplate 10 and the corresponding LEDs 20, while ensuring normal operation of the driving circuit. During the manufacturing process of the display panel, the LEDs 20 can be bonded to the backplate 10 via the connecting layer 30. After the LEDs 20 are bonded to the backplate 10, an abnormal light emission detection device can be used to identify defective LEDs in the display panel and determine their locations. For example, as... Figure 3 As shown, the display panel exemplarily shows LEDs 20 arranged in a 2*6 array. After detecting the LEDs 20, it can be determined that the LED 20 in the second row and second column is a dead LED 201.

[0045] S120. A channel is formed around the LED defect on the connection layer around the LED defect. The connection layer is used to connect the LED and the back plate of the display panel.

[0046] Specifically, Figure 5 This is a schematic diagram of the structure of a display panel corresponding to step S120, provided in an embodiment of the present invention. Figure 5 As shown, the display panel includes multiple LEDs 20, which can be arranged in an array. A connecting layer 30 is provided between adjacent LEDs 20. When a defective LED 201 exists, the connecting layer 30 around the defective LED 201 can be etched to form a channel A around the defective LED 201, creating a channel A between the connecting layer 30 corresponding to the defective LED 201 and the connecting layers 30 corresponding to other LEDs 20. Because the channel A is located on the connecting layer 30, etching and other processes can be avoided from damaging the backplate 10 on the side of the connecting layer 30 away from the LED 20 during the formation of the channel A, thus ensuring the yield rate of the display panel.

[0047] It should be noted that, Figures 3-5An exemplary illustration shows a display panel including one LED defective pixel 201. In other embodiments, when the display panel includes multiple LED defective pixels 201, the interconnecting layers 30 surrounding the multiple LED defective pixels 201 can be etched to form channels A, such that the interconnecting layer 30 corresponding to each LED defective pixel 201 has a channel A between it and the interconnecting layers 30 corresponding to other LEDs 20. Furthermore, the width of the channel A is not limited, as long as the width of the channel A does not affect other LEDs.

[0048] S130. Apply LED bonding layer dissolving solution to the LED defective area to dissolve the bonding layer corresponding to the LED defective area;

[0049] Specifically, Figure 6 This is a schematic diagram of the structure of a display panel corresponding to step S130, provided in an embodiment of the present invention. Figure 6 As shown, after forming a channel A around the LED defect 201, an LED bonding layer dissolving solution can be applied to the LED defect 201. This solution dissolves the bonding layer 30 corresponding to the LED defect 201, causing the LED defect 201 to detach without damaging the backplate 10 beneath the bonding layer 30. Simultaneously, after the LED bonding layer dissolving solution dissolves the bonding layer 30 corresponding to the LED defect 201, the channel A around the LED defect 201 can accommodate the substances formed by the reaction between the LED bonding layer dissolving solution and the bonding layer 30, and discharge these substances from the display panel. This prevents the LED bonding layer dissolving solution from reacting with the bonding layers 30 corresponding to other LEDs 20, ensuring the reliability of the display panel. Furthermore, the vertical distance from any position of channel A to the edge of the LED defect 201 can be equal, allowing channels A at different positions to uniformly accommodate the substances formed by the reaction between the LED bonding layer dissolving solution and the bonding layer 30 corresponding to the LED defect 201, further enhancing the reliability of the display panel. For example, the shape formed by the channel A around the LED defect 201 is the same as the shape of the LED defect 201. In addition, when the connecting layer 30 is ACF, the LED connecting layer dissolving solution can be an ACF soluble adhesive solution, thereby achieving the dissolution of the connecting layer 30.

[0050] For example, such as Figure 5 As shown, when channel A only surrounds the LED defect 201, when the material formed by the reaction in channel A is discharged from the display panel, the material formed by the reaction can be volatilized by means of light or heat, which can ensure that the material formed by the reaction is completely volatilized and discharged, thereby ensuring reliability when LEDs are subsequently replenished.

[0051] S140. Replace the defective LED with a normal LED.

[0052] Specifically, Figure 7This is a schematic diagram of the structure of a display panel corresponding to step S140, provided in an embodiment of the present invention. Figure 7 As shown, after the connecting layer 30 at the defective LED 201 is dissolved by the LED connecting layer solvent, the surface of the defective LED 201 becomes the backplate 10. At this point, a normal LED can be added by applying solder, i.e., the connecting layer 30 at the defective LED 201 is replenished. Then, a normal LED is fixed on the connecting layer 30, where a normal LED refers to an LED that can emit light normally in the driving state. This allows for in-situ repair of the defective LED 201. For example, the connecting layer 30 can be ACF (Acoustic Coating Forming).

[0053] The technical solution of this embodiment forms a channel on the connecting layer around the LED defect, which avoids damage to the backplane during the channel formation process. Then, an LED connecting layer dissolving solution is applied to the LED defect area. This solution dissolves the connecting layer corresponding to the LED defect, achieving targeted removal of the connecting layer at the defective LED location, causing the LED to detach. A normal LED is then added to the defective LED location, thus enabling in-situ LED repair without damaging the backplane. This targeted LED repair improves the yield rate of the display panel.

[0054] Based on the above technical solution, a channel is formed around the LED defect on the connection layer surrounding the LED defect, including:

[0055] A laser-etched bonding layer is used to form a channel around the LED defect.

[0056] Specifically, the LED can be a micro-LED, which is very small, typically at the micrometer level. When forming channels around LED defects, a laser etching process can be used to ensure collimation during the etching process, thereby ensuring accuracy in etching the channels around the LED defects.

[0057] Figure 8 This is a schematic diagram of the channel cross-sectional structure of a display panel provided in an embodiment of the present invention. Figure 8 As shown, the depth of channel A is less than or equal to the thickness of the connecting layer 30.

[0058] Specifically, channel A is formed on the connecting layer 30. By setting the depth of channel A to be less than or equal to the thickness of the connecting layer 30, it can be ensured that the backplate 10 on the side of the connecting layer 30 away from the LED 20 is not damaged during the formation of channel A, thus ensuring the yield of the display panel. For example, Figure 8 The example shows that the depth of the channel A is equal to the thickness of the connector layer 30. When the connector layer 30 is laser-etched to form the channel A, laser damage to the backplate 10 on the side of the connector layer 30 away from the LED 20 can be avoided.

[0059] Figure 9 This is a schematic diagram of the channel structure of a display panel provided in an embodiment of the present invention. Figure 9 As shown, channel A extends to the edge of the display panel.

[0060] Specifically, in other embodiments, when forming channel A, it can be extended to the edge of the display panel, based on the fact that channel A surrounds the LED defect 201. When the LED connector layer solvent is applied to the LED defect, the substance formed by the reaction between the LED connector layer solvent and the connector layer 30 corresponding to the LED defect 201 can directly extend to the edge of the display panel through channel A and be discharged from the display panel. Thus, the substance formed by the reaction between the LED connector layer solvent and the connector layer 30 corresponding to the LED defect 201 can be directly discharged through channel A without additional heating or light exposure processes, thereby improving the manufacturing efficiency of the display panel.

[0061] Continue to refer to Figure 9 The LEDs 20 are arranged in an array, and the channel A extends around the LED defect 201 along the first direction X and / or the second direction Y; wherein, the first direction X is the row direction of the LED 20 array arrangement, and the second direction Y is the column direction of the LED 20 array arrangement.

[0062] Specifically, the LED defect 201 is at least one of a plurality of LEDs 20 arranged in an array. When a channel A is formed around the LED defect 201, the channel A may have a portion extending along a first direction X and a portion extending along a second direction Y, so that the LED defect 201 has a channel A with other LEDs 20. When the channel A extends to the edge of the display panel, it can extend directly to the edge of the display panel along the first direction X and / or along the second direction Y, based on the area surrounding the LED defect 201. This allows the channel A to extend between the LEDs 20, avoiding damage to the LEDs 20 during the formation of the channel A. Simultaneously, it allows the channel A to extend to the edge of the display panel with the shortest possible length, reducing the manufacturing process time and cost of forming the channel A. For example, as shown... Figure 9As shown, channel A surrounding the LED defect 201 has two portions extending along a first direction X and two portions extending along a second direction Y. Based on this, the portion extending along the first direction X can continue to the edge of the display panel, and simultaneously, the two portions extending along the second direction Y can also continue to the edge of the display panel. This allows the substance formed by the reaction of the LED bonding layer solvent with the bonding layer 30 corresponding to the LED defect 201 to be directly discharged from the display panel through the channel A extending in the first direction X and the channel A extending in the second direction Y. In other embodiments, both portions extending along the first direction X can also continue to the edge of the display panel, increasing the number of channels A through which the substance formed by the reaction of the LED bonding layer solvent with the bonding layer 30 corresponding to the LED defect 201 is discharged from the display panel. Furthermore, Figure 9 The example shows that channel A extends to the edge of the display panel along both the first direction X and the second direction Y. In other embodiments, channel A may also extend to the edge of the display panel along either the first direction X or the second direction Y, as long as channel A can extend to the edge of the display panel.

[0063] Figure 10 A flowchart illustrating another method for repairing LEDs in a display panel, provided by an embodiment of the present invention. Figure 10 As shown, the method includes:

[0064] S210. Identify dead LEDs on the display panel;

[0065] S220. A channel is formed around the LED defect on the connection layer around the LED defect. The connection layer is used to connect the LED and the back plate of the display panel.

[0066] S230, Remove LEDs from areas with dead LEDs.

[0067] Specifically, after forming channel A around LED defect 201, the LED at defect 201 can be removed first, exposing the corresponding bonding layer 30 on the surface. When subsequently dissolving the bonding layer 30 corresponding to LED defect 201 using an LED bonding layer dissolving solution, the solution can be directly applied to the bonding layer 30. This not only simplifies the application process but also allows the solution to fully wet the bonding layer 30, better dissolving it and ensuring the reliability of subsequent compensation LEDs.

[0068] Optionally, removing the LED at the defective LED location includes:

[0069] A laser is used to target and remove the defective LED.

[0070] Specifically, when removing the LED at the defective LED 201, a laser can be used to target the defective LED and destroy it. Simultaneously, the heat generated by the laser damages the bonding layer 30 between the LED and the backplate 10. This allows the LED to detach without damaging the backplate 10 on the side of the bonding layer 30 furthest from the LED 20. Using a laser to target the defective LED ensures accurate alignment, and controlling the laser energy prevents damage to the backplate 10 on the side of the bonding layer 30 furthest from the LED 20, thus guaranteeing the yield rate of the display panel.

[0071] S240. Apply LED bonding layer dissolving solution to the LED defective area to dissolve the bonding layer corresponding to the LED defective area;

[0072] S250, Replace the defective LED with a normal LED.

[0073] Based on the above technical solutions, an LED interconnect layer solvent is applied to the LED defective area, including:

[0074] An inkjet printing process is used to coat the LED connection layer solution at the LED defective points.

[0075] Specifically, inkjet printing technology enables targeted spraying. When applying LED connector layer dissolving solution to LED defective pixels, inkjet printing can be used to apply the solution to the defective pixels, ensuring that the solution is precisely sprayed onto the defective pixels surrounding the channels. This allows the dissolving solution to dissolve the corresponding connector layer at the defective pixel without affecting other LEDs, causing the defective LED 201 to detach, while not damaging the backplate 10 beneath the connector layer 30. Furthermore, inkjet printing technology allows for controllable droplet size, improving the accuracy of the applied LED connector layer dissolving solution.

[0076] It should be noted that when using inkjet printing to coat the LED connector layer solution, the volume of the inkjet droplets is generally between 5 and 20 pL. When coating the LED connector layer solution at the LED defective area, the number of droplets of LED connector layer solution can be determined based on the size of the LED at the defective area and the size of the smallest repeating unit of the display panel, so that the LED connector layer solution can cover the LED at the defective area after spreading. For example, with the inkjet droplet volume remaining constant, the larger the size of the LED at the defective area and the size of the smallest repeating unit of the display panel, the more droplets of LED connector layer solution are required; conversely, the smaller the size of the LED at the defective area and the size of the smallest repeating unit of the display panel, the fewer droplets of LED connector layer solution are required.

[0077] This invention also provides a device for repairing LEDs on a display panel, used to repair LEDs on a display panel. Figure 11 This is a schematic diagram of a repair device for a display panel LED provided in an embodiment of the present invention. Figure 11 As shown, the repair device includes:

[0078] The defective pixel determination module 11 is used to determine LED defective pixels on the display panel;

[0079] Specifically, the defective pixel determination module 11 can be a display panel detection device, which determines abnormal light emission points on the display panel as LED defective pixels on the display panel.

[0080] The channel forming module 12 is used to form a channel around the LED defect on the connection layer around the LED defect, and the connection layer is used to connect the LED and the back plate of the display panel.

[0081] Specifically, the channel forming module 12 can be a laser etching device, which precisely etches the connecting layer around the LED defect to form a channel on the connecting layer around the LED defect. Preferably, the depth of the channel is less than or equal to the thickness of the connecting layer. Alternatively, in other embodiments, the channel may extend to the edge of the display panel. Preferably, the LEDs are arranged in an array, and the channel extends around the LED defect along a first direction and / or a second direction; wherein the first direction is the row direction of the LED array, and the second direction is the column direction of the LED array.

[0082] The solvent coating module 13 is used to coat the LED connection layer solvent at the LED defect point to dissolve the connection layer corresponding to the LED defect point;

[0083] Specifically, the dissolving agent coating module 13 can be an inkjet printer. In this case, inkjet printing technology can be used to coat the LED connector layer dissolving agent at the LED defective point. This allows the LED connector layer dissolving agent to be sprayed precisely onto the LED defective point surrounded by the channel. This dissolves the connector layer corresponding to the LED defective point without affecting other LEDs, causing the LED defective point 201 to fall off, while not damaging the backplate 10 under the connector layer 30. Moreover, the inkjet printing process allows for controllable droplet size, improving the accuracy of the positional application of the LED connector layer dissolving agent.

[0084] LED supplement module 14 is used to supplement normal LEDs at the location of LED defects.

[0085] Specifically, the LED replenishment module 14 can be a dispensing machine and an LED bonding device. The dispensing machine dispenses glue to the defective LED and the LED bonding device replenishes the defective LED with a normal LED, thereby enabling the replenishment of a normal LED at the defective LED location.

[0086] The technical solution of this embodiment involves forming a channel on the connecting layer around the LED defect using a channel forming module. This channel placement on the connecting layer avoids damage to the backplane during channel formation. Then, a dissolving agent coating module applies an LED connecting layer dissolving agent to the LED defect area. This dissolving agent dissolves the connecting layer corresponding to the LED defect, achieving targeted removal of the connecting layer at the defective LED location, causing the defective LED to detach. Finally, an LED replacement module replaces the defective LED with a normal LED, thus enabling in-situ LED repair without damaging the backplane. This targeted LED repair improves the yield rate of the display panel.

[0087] In other embodiments, the LED repair apparatus may further include an LED removal module for removing the LED at the defective point. Exemplarily, the LED removal module may be a laser etching device, in which case a laser can be used to target and remove the LED at the defective point.

[0088] This invention also provides a display panel. Figure 12 This is a schematic diagram of a display panel provided in an embodiment of the present invention. Figure 12 As shown, the display panel includes a backplate 10 and an array of LEDs 20; the LEDs 20 are connected to the backplate 10 via a connecting layer 30; at least one LED 20 is repaired using the LED repair method for display panels provided in any embodiment of the present invention. Since the LEDs 20 in the display panel are repaired using the LED repair method for display panels provided in any embodiment of the present invention, the yield of the display panel can be improved, which will not be elaborated further here.

[0089] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for repairing LEDs in a display panel, characterized in that, include: Identify dead LEDs on the display panel; A channel is formed around the LED defect on the connection layer, the connection layer being used to connect the LED and the back plate of the display panel; An LED connection layer dissolving solution is applied to the defective LED area to dissolve the connection layer corresponding to the defective LED. Replace the defective LED with a normal LED.

2. The method for repairing LEDs in a display panel according to claim 1, characterized in that, A channel is formed around the LED defect on the connection layer, including: The connection layer is laser-etched around the LED defect to form the channel surrounding the LED defect.

3. The method for repairing LEDs in a display panel according to claim 2, characterized in that, The depth of the channel is less than or equal to the thickness of the connecting layer.

4. The method for repairing LEDs in a display panel according to claim 1, characterized in that, The channel extends to the edge of the display panel.

5. The method for repairing LEDs in a display panel according to claim 4, characterized in that, The LEDs are arranged in an array, and the channel extends around the defective LEDs along a first direction and / or a second direction; wherein the first direction is the row direction of the LED array, and the second direction is the column direction of the LED array.

6. The method for repairing LEDs in a display panel according to claim 1, characterized in that, Before applying the LED interconnect layer solvent to the LED defective area, the process also includes: Remove the LED at the defective point of the LED.

7. The method for repairing LEDs in a display panel according to claim 6, characterized in that, Removing the LED at the defective point of the LED includes: The defective LED is removed by targeting the defective LED with a laser.

8. The method for repairing LEDs in a display panel according to claim 1, characterized in that, The LED interconnect layer solvent is applied to the defective LED area, comprising: The LED interconnect layer solution is coated onto the defective LED area using an inkjet printing process.

9. A repair device for LEDs on a display panel, characterized in that, include: The dead pixel detection module is used to identify dead LEDs on the display panel; A channel forming module is used to form a channel around the LED defect on a connecting layer around the LED defect, the connecting layer being used to connect the LED and the backplate of the display panel; The solvent coating module is used to coat the LED connection layer solvent at the LED defect point to dissolve the connection layer corresponding to the LED defect point. An LED replacement module is used to replace a normal LED at the location of the defective LED.

10. A display panel, characterized in that, It includes a backplate and an array of LEDs; the LEDs are connected to the backplate via a connecting layer; at least one of the LEDs is repaired using the repair method for display panel LEDs according to any one of claims 1-8.

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