A device and method for trimming a single crystal silicon rod

Abstract

A kind of single crystal silicon rod's re-cutting device and re-cutting method, including correction subassembly, sliding table subassembly, cutting subassembly;Sliding table subassembly includes slide rail, sliding table and support rail, sliding table is slidably arranged in the upper of slide rail, support rail is parallel with slide rail;Support rail is arranged in the both sides of sliding table;Sliding table is equipped with first telescopic part, and first telescopic part is used to control the movement of sliding table in vertical direction;Cutting subassembly includes cutting wire saw, and cutting wire saw is arranged in the upper of support rail;Correction subassembly includes the correction cylinder and positioning plate that cooperate with each other, and correction cylinder and positioning plate are respectively arranged in the both sides of support rail at the lower end of the position of cutting subassembly.This application improves the stability and precision of single crystal silicon rod by the support of support rail and the positioning of correction subassembly;By the jacking of sliding table subassembly, the transmission of single crystal silicon rod is realized, and the cutting material and excess material of single crystal silicon rod are separated and transported by cooperating with cutting subassembly, so as to realize re-cutting effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of hard and brittle material cutting, in particular to a single crystal silicon rod re-cutting device and method. BACKGROUND

[0002] At present, with the development of new energy field, green renewable energy is paid more and more attention, among which, the photovoltaic solar power generation field is paid more and more attention and development. In the photovoltaic power generation field, the common crystalline silicon solar cell is made on a high-quality single crystal silicon wafer, which is cut from a pulled or cast silicon rod by a wire saw, that is, a wire cutting technology.

[0003] In the prior art, before cutting the single crystal silicon, the single crystal silicon rod needs to be corrected, and the defective section is cut off in advance or the single crystal silicon rod is cut into a section of corresponding size in advance according to the cutting requirement. At present, the correction of the single crystal silicon rod needs too much manual calibration and collection, which is easy to cause damage to the single crystal silicon rod and result in waste. SUMMARY

[0004] The technical problem to be solved by the present application is to provide a single crystal silicon rod re-cutting device and method to realize the re-cutting operation of the single crystal silicon rod.

[0005] In order to solve the above technical problems, the technical scheme adopted by the present application is as follows:

[0006] A single crystal silicon rod re-cutting device, comprising a correction assembly, a sliding table assembly and a cutting assembly.

[0007] The sliding table assembly comprises a sliding rail, a sliding table and a support rail, the sliding table is slidably arranged above the sliding rail, and the support rail is parallel to the sliding rail; the support rail is arranged on both sides of the sliding table; the sliding table is provided with a first telescopic part for controlling the movement of the sliding table in the vertical direction.

[0008] The cutting assembly comprises a cutting wire saw, and the cutting wire saw is arranged above the support rail.

[0009] The correction assembly comprises a correction cylinder and a positioning plate matched with each other, and the correction cylinder and the positioning plate are arranged on both sides of the support rail at the lower end or the front end of the position of the cutting assembly.

[0010] In order to solve the above technical problems, another technical scheme adopted by the present application is as follows:

[0011] A single crystal silicon rod re-cutting method applied to a single crystal silicon rod re-cutting device, comprising the following steps:

[0012] S1, using the correction assembly to position and correct the single crystal silicon rod horizontally;

[0013] S2. Cut the monocrystalline silicon rod using the cutting lines of the cutting component;

[0014] S3. Use a sliding table assembly to separate the cutting material and residue generated after cutting the monocrystalline silicon rod;

[0015] S4. Control the cutting component to return to its original position.

[0016] The beneficial effects of the present invention are as follows: a re-cutting device and method for monocrystalline silicon rods are provided, which improves the stability and accuracy of monocrystalline silicon rods by supporting the monocrystalline silicon rods with support rails and positioning the correction components; the monocrystalline silicon rods are transported by lifting the slide assembly, and the cutting components are used to separate and transport the cutting material and residue of the monocrystalline silicon rods, thereby achieving the re-cutting effect. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a single-crystal silicon rod recutting device according to a certain embodiment of the present invention. Figure 1 ;

[0018] Figure 2 for Figure 1 A magnified view of a portion of the image;

[0019] Figure 3 for Figure 2 Enlarged view of part B;

[0020] Figure 4 This is a schematic diagram of the structure of a single-crystal silicon rod recutting device according to a certain embodiment of the present invention. Figure 2 ;

[0021] Figure 5 This is a schematic diagram of the suction cup assembly of a single-crystal silicon rod back-cutting device according to a certain embodiment of the present invention;

[0022] Figure 6 This is a side view of a single-crystal silicon rod back-cutting device according to a certain embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of the slide table and slide rail of a single-crystal silicon rod back-cutting device according to a certain embodiment of the present invention;

[0024] Label Explanation:

[0025] 2. Slide assembly; 3. Cutting assembly; 4. Sensor assembly;

[0026] 5. Suction cup assembly;

[0027] 11. Correction cylinder; 12. Positioning plate;

[0028] 111. First straightening cylinder; 112. Second straightening cylinder;

[0029] 121. First positioning plate; 122. Second positioning plate;

[0030] 21. Slide rail; 22. Slide table; 23. Support rail; 24. First telescopic part;

[0031] 231. Ball bearing support rail; 232. Flexible support rail; 233. Ball bearing fixing plate;

[0032] 234. Ball bearing; 235. Ball bearing retaining groove;

[0033] 31. Wire saw;

[0034] 41. Feeding sensor; 42. Discharge sensor; 43. Distance sensing sensor;

[0035] 51. Negative pressure suction cup; 52. Second telescopic part. Detailed Implementation

[0036] To explain in detail the technical content, objectives, and effects of the present invention, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0037] Please refer to Figures 1 to 7 A reverse cutting device for a single crystal silicon rod includes a straightening component, a sliding table component 2, and a cutting component 3;

[0038] The slide assembly 2 includes a slide rail 21, a slide 22, and a support rail 23. The slide 22 is slidably disposed above the slide rail 21, and the support rail 23 is parallel to the slide rail 21. The support rail 23 is disposed on both sides of the slide 22. The slide 22 is provided with a first telescopic part 24, which is used to control the movement of the slide 22 in the vertical direction.

[0039] The cutting assembly 3 includes a wire saw 31, which is disposed above the support rail 23;

[0040] The correction assembly includes a correction cylinder 11 and a positioning plate 12 that cooperate with each other. The correction cylinder 11 and the positioning plate 12 are respectively disposed on both sides of the support rail 23 at the lower end or the front end of the cutting assembly 3.

[0041] As can be seen from the above description, the beneficial effects of the present invention are as follows: a re-cutting device and method for monocrystalline silicon rods are provided, which improves the stability and accuracy of monocrystalline silicon rods by supporting the monocrystalline silicon rods with support rails and positioning the correction components; the monocrystalline silicon rods are transported by lifting the slide assembly, and the cutting material and residue generated after cutting the monocrystalline silicon rods are transported in conjunction with the cutting assembly, thereby achieving the re-cutting effect.

[0042] Furthermore, the support rail 23 includes a ball bearing support rail 231 and a flexible support rail 232 assembled and connected along the axial direction of the slide rail 21;

[0043] The correcting cylinder includes a first correcting cylinder 111 and a second correcting cylinder 112, and the positioning plate includes a first positioning plate 121 and a second positioning plate 122; the ball bearing support rail 231 is disposed between the first correcting cylinder 111 and the first positioning plate 121, and the flexible support rail 232 is disposed between the second correcting cylinder 112 and the second positioning plate 122.

[0044] As described above, in one embodiment of the present invention, to facilitate the smooth operation of the correction component, the support rail 23 is divided into an axially connected ball bearing support rail 231 and a flexible support rail 232. The ball bearing support rail 231 is disposed between the first correction cylinder 111 and the first positioning plate 121, and the flexible support rail 232 is disposed between the second correction cylinder 112 and the second positioning plate 122. The purpose is that the first correction cylinder 111 pushes the monocrystalline silicon rod to the first positioning plate 121 for initial positioning. During the initial positioning process, the monocrystalline silicon rod moves significantly, and to prevent… To prevent wear on the monocrystalline silicon rod by the support rail, a ball bearing support rail 231 is specially provided to reduce the friction force on the monocrystalline silicon rod during movement. The second correction cylinder 112 and the second positioning plate 122 perform the final positioning of the monocrystalline silicon rod. After the initial positioning, the movement range of the monocrystalline silicon rod during the second positioning and correction is small. In order to prevent the inertial force from causing adverse effects on the monocrystalline silicon rod during movement, a flexible support rail 232 is selected to cooperate with the second correction cylinder 112 and the second positioning plate 122, which satisfies the slow movement of the monocrystalline silicon rod while preventing the inertial force from causing excessive movement of the monocrystalline silicon rod.

[0045] Specifically, in order to facilitate the initial positioning of the single crystal silicon rod by the first straightening cylinder and the first positioning plate 121, in one embodiment of the present invention, the starting point of the ball bearing support rail 231 is set as the zero position, and a scale is set from the zero position.

[0046] Furthermore, the ball bearing support rail 231 includes a ball bearing fixing plate 233 and a ball bearing 234. The upper surface of the ball bearing fixing plate 233 is provided with ball bearing fixing grooves 235 at fixed intervals along the axial direction. The ball bearing 234 is placed in the ball bearing fixing grooves 235 and protrudes from the upper surface of the ball bearing fixing plate 233.

[0047] As can be seen from the above description, the ball support rail 231 accommodates the ball 234 through the ball fixing groove 235 on the ball fixing plate 233. The ball fixing groove 235 is evenly distributed along the axial direction on the ball fixing plate 233. The ball 234 protrudes from the upper surface of the ball fixing plate 233 and directly contacts the monocrystalline silicon rod, thereby improving the smoothness of sliding between the monocrystalline silicon rod and the ball support rail 231.

[0048] Furthermore, it also includes a sensor assembly 4, which includes a feeding sensor 41, a discharging sensor 42, and a distance sensing sensor 43;

[0049] The feeding sensor 41 is positioned opposite to the first correction cylinder 111;

[0050] The feeding sensor 42 is located behind the cutting assembly 3;

[0051] The distance sensing sensor 43 is located between the first correction cylinder 111 and the second correction cylinder 112.

[0052] As can be seen from the above description, in one embodiment of the present invention, the re-cutting device is further provided with a sensor assembly 4 to realize the automation of the re-cutting device, including a loading sensor 41, a unloading sensor 42 and a distance sensing sensor 43. The loading and unloading sensors are used to detect whether there is a single crystal silicon rod at the corresponding position, thereby starting or transferring the single crystal silicon rod. The loading sensor 41 is positioned opposite to the first straightening cylinder 111, and only performs preliminary positioning when the single crystal silicon rod is detected at the position of the first straightening cylinder 111. The unloading sensor 42 is located behind the cutting assembly 3 along the axial direction of the track, and is used to detect whether the cutting material generated after cutting is transported to the unloading area, thereby performing subsequent unloading operations. The distance sensing sensor 43 is used to sense the transport distance of the single crystal silicon rod in the axial direction of the slide rail 21, thereby facilitating the control of the single crystal silicon rod to stop at the preset cutting position, and the second straightening cylinder 112 performs final positioning in subsequent operations.

[0053] Furthermore, it also includes a suction cup assembly 5, which is slidably disposed at the rear end of the slide rail 21. The suction cup assembly 5 has a negative pressure suction cup 51 on its end face perpendicular to the axis of the slide rail 21, and a second telescopic part 52 is provided on the negative pressure suction cup 51 along the axial direction of the slide rail 21.

[0054] As can be seen from the above description, in order to prevent the cut material from being too small and tipping over after cutting, which would cause the monocrystalline silicon rod to break, the recutting device is also equipped with a suction cup assembly 5. The suction cup assembly 5 is located at the end of the slide rail 21 and moves toward the cut material during operation. The negative pressure suction cup 51 is used to adsorb the end face of the cut material. The adsorption principle is that when the negative pressure suction cup 51 reaches a preset distance from the end face of the cut material, the second telescopic part 52 slowly pushes the suction cup to the end face of the cut material, thereby completing the adsorption.

[0055] A method for back-cutting a single-crystal silicon rod, applied to a single-crystal silicon rod back-cutting device, includes the following steps:

[0056] S1. Use the straightening component to perform horizontal positioning and straightening of the monocrystalline silicon rod;

[0057] S2. Cut the monocrystalline silicon rod using the cutting line of the cutting component 3;

[0058] S3. Use the slide assembly 2 to separate the cutting material and residue generated after cutting the monocrystalline silicon rod;

[0059] S4. Control the cutting component 3 to return to its original position.

[0060] As can be seen from the above description, the present invention uses a correction component to perform horizontal positioning and correction on the monocrystalline silicon rod, thereby determining the cutting position of the monocrystalline silicon rod, and then controlling the cutting component 3 to cut the monocrystalline silicon rod. After cutting, the slide assembly 2 is used to separate the cut material and the remaining material. Finally, the cutting component 3 is controlled to return to its original position, thereby achieving the recutting effect of the monocrystalline silicon rod.

[0061] Further, step S1 specifically involves:

[0062] S11. Use the first straightening cylinder 111 to press the single crystal silicon rod against the first positioning plate 121;

[0063] S12, Control the first corrective cylinder 111 to retract;

[0064] S13. Simultaneously start the slide assembly 2 and the sensor assembly 4. When the movement of the single crystal silicon rod is detected to be a preset positioning distance, stop the slide assembly 2.

[0065] S14. Use the second correction cylinder 112 to press the single crystal silicon rod against the second positioning plate 122.

[0066] As described above, the correction and positioning process of the correction component is divided into two steps. The first step is to perform preliminary positioning of the monocrystalline silicon rod by the first correction cylinder 111. Specifically, the first correction cylinder 111 pushes the monocrystalline silicon rod until the side of the monocrystalline silicon rod contacts the first positioning plate 121 to complete the positioning. After the preliminary positioning is completed, the first correction cylinder 111 retracts, and the slide assembly 2 lifts the monocrystalline silicon rod and transports it to the corresponding position of the second correction cylinder 112. The movement process is detected by the distance sensing sensor 43 in the sensor assembly 4. When the monocrystalline silicon rod is detected to have reached the preset cutting distance, the slide assembly 2 is controlled to stop moving, and the first telescopic part 24 of the slide assembly 2 is controlled to retract to its original position, placing the monocrystalline silicon rod on the flexible support rail 232. Then, the second correction cylinder 112 and the second positioning plate 122 perform the final positioning of the monocrystalline silicon rod. The cut surface of the silicon rod can also be kept perpendicular according to production requirements.

[0067] Further, step S3 specifically includes:

[0068] S31, Control the second correction cylinder 112 to retract;

[0069] S32. Use the slide table assembly 2 to lift the excess material and then lower it after retracting it along the slide rail 21 by a preset retraction distance.

[0070] S33. The cutting material is lifted by the slide table assembly 2 and moved along the slide rail 21 to the unloading area and then lowered.

[0071] As can be seen from the above description, during the cutting process, the second straightening cylinder 112 keeps the monocrystalline silicon rod clamped to prevent the monocrystalline silicon rod from shaking; after the cutting is completed, the slide assembly 2 lifts the residual material generated after cutting and retracts it along the slide rail 21 by a preset retraction distance before putting the residual material down, leaving retraction space for the wire saw in the cutting assembly 3; then the cutting material is lifted and transported to the unloading area for unloading, completing the separation process of the residual material and the cutting material.

[0072] Furthermore, step S30 is included between steps S2 and S3, and step S30 specifically includes:

[0073] S301. When the length of the monocrystalline silicon rod is detected to be less than the preset size, the suction cup assembly 5 is controlled to move from the unloading area along the slide rail 21 toward the monocrystalline silicon rod.

[0074] S302. When the sensor of the suction cup assembly detects the end face of the monocrystalline silicon rod, the suction cup assembly is controlled to reduce its moving speed and continue to move closer to the monocrystalline silicon rod.

[0075] S303. When the sensor of the suction cup assembly 5 detects that the distance to the end face of the monocrystalline silicon rod is less than or equal to the preset adsorption distance, the suction cup is controlled to perform negative pressure adsorption on the monocrystalline silicon rod.

[0076] As can be seen from the above description, in order to prevent the cutting material from being too short and causing tipping, when the cutting length of the monocrystalline silicon rod is detected to be less than the preset size, the suction cup assembly 5 is controlled to adsorb and fix the cutting material generated after the monocrystalline silicon rod is cut, so as to prevent tipping.

[0077] Furthermore, step S4 is followed by step S5:

[0078] S5. When it is detected that there is still a need for cutting, the slide assembly 2 will send the remaining material to the positioning position and return to step S2; otherwise, the remaining material will be unloaded.

[0079] As can be seen from the above description, in one embodiment of the present invention, when it is detected that there is still a need for cutting, the remaining material can be sent back to the positioning point under the detection of the sensor component 4. This positioning point is the positioning point of the first correction cylinder 111 or the positioning point of the second correction cylinder 112, and then return to step S2 to continue the subsequent steps; if there is no need for cutting again, the remaining material can be unloaded.

[0080] This invention provides a re-cutting device and method for monocrystalline silicon rods, mainly applied in the field of re-cutting monocrystalline silicon rods. The following is a detailed description with reference to embodiments:

[0081] Please refer to Figures 1 to 7 Embodiment 1 of the present invention is as follows:

[0082] A reverse cutting device for a single crystal silicon rod includes a straightening component, a sliding table component 2, and a cutting component 3;

[0083] The slide assembly 2 includes a slide rail 21, a slide 22 and a support rail. The slide 22 is slidably disposed above the slide rail 21, and the support rail 23 is parallel to the slide rail 21. The support rail 23 is disposed on both sides of the slide 22. The slide 22 is provided with a first telescopic part 24, which is used to control the movement of the slide 22 in the vertical direction.

[0084] The cutting assembly 3 includes a wire saw 31, which is disposed above the support rail 23;

[0085] The correction assembly includes a correction cylinder 11 and a positioning plate 12 that cooperate with each other. The correction cylinder 11 and the positioning plate 12 are respectively located on both sides of the support rail at the lower end or the front end of the cutting assembly 3.

[0086] In this embodiment, a re-cutting device and method for monocrystalline silicon rods are provided. The stability and accuracy of the monocrystalline silicon rods are improved by supporting the monocrystalline silicon rods with support rails and positioning the correction components. The monocrystalline silicon rods are transported by lifting the slide assembly 2. In conjunction with the cutting assembly 3, the cutting material and residual material of the monocrystalline silicon rods are separated and transported, thereby achieving the re-cutting effect.

[0087] Please refer to Figures 1 to 7 The second embodiment of the present invention is as follows: Based on the first embodiment, the support rail includes a ball support rail 231 and a flexible support rail 232 assembled and connected along the axial direction of the slide rail 21.

[0088] The straightening cylinder includes a first straightening cylinder 111 and a second straightening cylinder 112, and the positioning plate includes a first positioning plate 121 and a second positioning plate 122; the ball support rail 231 is disposed between the first straightening cylinder 111 and the first positioning plate 121, and the flexible support rail 232 is disposed between the second straightening cylinder 112 and the second positioning plate 122; the ball support rail 231 includes a ball fixing plate 233 and a ball 234, and the upper surface of the ball fixing plate 233 is provided with ball fixing grooves 235 at fixed intervals along the axial direction, and the ball is placed in the ball fixing groove 235 and protrudes from the upper surface of the ball fixing plate 233.

[0089] In this embodiment, to ensure smooth operation of the correction component, the support rail is divided into an axially connected ball bearing support rail 231 and a flexible support rail 232. The ball bearing support rail 231 is positioned between the first correction cylinder 111 and the first positioning plate 121, while the flexible support rail 232 is positioned between the second correction cylinder 112 and the second positioning plate 122. The purpose is that the first correction cylinder 111 pushes the monocrystalline silicon rod to the first positioning plate 121 for initial positioning. During this initial positioning process, the monocrystalline silicon rod moves significantly, and to prevent wear on the support rail... The monocrystalline silicon rod is specially equipped with a ball bearing support rail 231 to reduce the frictional force on the monocrystalline silicon rod during movement. The second straightening cylinder 112 and the second positioning plate 122 perform final positioning of the monocrystalline silicon rod. After the initial positioning, the movement range of the monocrystalline silicon rod during the second positioning and correction is small. In order to prevent the inertial force from adversely affecting the monocrystalline silicon rod during movement, a flexible support rail 232 is selected to cooperate with the second straightening cylinder 112 and the second positioning plate 122, which satisfies the slow movement of the monocrystalline silicon rod while preventing excessive movement of the monocrystalline silicon rod due to inertial force. In addition, the ball bearing support rail 231 accommodates the balls 234 through the ball bearing fixing grooves 235 on the ball bearing fixing plate 233. The ball bearing fixing grooves 235 are evenly distributed along the axial direction on the ball bearing fixing plate 233. The balls protrude from the upper surface of the ball bearing fixing plate 233 and directly contact the monocrystalline silicon rod, thereby improving the smoothness of sliding between the monocrystalline silicon rod and the ball bearing support rail 231.

[0090] Please refer to Figures 1 to 7 The third embodiment of the present invention is as follows: based on the second embodiment, it further includes a sensor assembly 4, which includes a feeding sensor 41, a discharging sensor 42 and a distance sensing sensor 43.

[0091] The feeding sensor 41 is positioned opposite to the first correction cylinder 111;

[0092] The feeding sensor 42 is located behind the cutting assembly 3;

[0093] The distance sensing sensor 43 is located between the first correction cylinder 111 and the second correction cylinder 112.

[0094] It also includes a suction cup assembly 5, which is slidably disposed at the rear end of the slide rail 21. The end face of the suction cup assembly 5 perpendicular to the axis of the slide rail 21 is provided with a negative pressure suction cup 51, and the negative pressure suction cup 51 is provided with a second telescopic part 52 along the axis of the slide rail 21.

[0095] In this embodiment, the recutting device is further equipped with a sensor assembly 4 to automate the recutting process. This assembly includes a loading sensor 41, a unloading sensor 42, and a distance sensing sensor 43. The loading and unloading sensors 42 are used to detect whether a single-crystal silicon rod is present at the corresponding position, thereby initiating or transferring the single-crystal silicon rod. The loading sensor 41 is positioned opposite the first straightening cylinder 111, and initial positioning is only performed when a single-crystal silicon rod is detected at the location of the first straightening cylinder 111. The unloading sensor 42 is located behind the cutting assembly 3 along the axial direction of the track and is used to detect whether the cutting material generated after cutting is transported to the unloading area, thereby performing subsequent unloading operations. The distance sensing sensor 43 is used to sense the transport distance of the single-crystal silicon rod along the slide rail 21, thereby facilitating the control of the single-crystal silicon rod to stop at the preset cutting position. The second straightening cylinder 112 then performs the final positioning. Specifically, when the feeding sensor detects the presence of material, it transmits the signal "feeding n" (where n is the number of cuts) and records the quantity of cut material generated. When there is no need for recutting and the remaining material is located in the feeding area, the feeding sensor transmits the signal "feeding n+1". During feeding, it distinguishes between cut material and remaining material, provides data to upstream and downstream processes, and realizes the automation of the entire process.

[0096] In addition, to prevent the cut material from being too small and tipping over after cutting, which could cause the monocrystalline silicon rod to break, the recutting device is also equipped with a suction cup assembly 5. The suction cup assembly 5 is located at the end of the slide rail 21 and moves toward the cut material during operation. The negative pressure suction cup 51 is used to adsorb the end face of the cut material. The adsorption principle is that when the negative pressure suction cup 51 reaches a preset distance from the end face of the cut material, the second telescopic part 52 slowly pushes the suction cup to the end face of the cut material, thereby completing the adsorption.

[0097] Please refer to Figures 1 to 7 Embodiment four of the present invention is: a method for back-cutting a single-crystal silicon rod, using any one of the single-crystal silicon rod back-cutting devices of Embodiments one to three above, including the following steps:

[0098] S1. Use the straightening component to perform horizontal positioning and straightening of the monocrystalline silicon rod;

[0099] S2. Cut the monocrystalline silicon rod using the cutting line of the cutting component 3;

[0100] S3. Use the slide assembly 2 to separate the cutting material and residue generated after cutting the monocrystalline silicon rod;

[0101] S4. Control the cutting component 3 to return to its original position.

[0102] In this embodiment, the present invention uses a correction component to perform horizontal positioning correction on the monocrystalline silicon rod, thereby determining the cutting position of the monocrystalline silicon rod, and then controls the cutting component 3 to cut the monocrystalline silicon rod. After cutting, the slide assembly 2 is used to separate the cut material and the remaining material. Finally, the cutting component 3 is controlled to return to its original position, thereby achieving the recutting effect of the monocrystalline silicon rod.

[0103] Please refer to Figures 1 to 7 The fifth embodiment of the present invention is as follows: Based on the fourth embodiment, step S1 is specifically as follows;

[0104] S11. Use the first straightening cylinder 111 to press the single crystal silicon rod against the first positioning plate 121;

[0105] S12, Control the first corrective cylinder 111 to retract;

[0106] S13. Simultaneously start the slide assembly 2 and the sensor assembly 4. When the movement of the single crystal silicon rod is detected to be a preset positioning distance, stop the slide assembly 2.

[0107] Step S3 is as follows:

[0108] S31, Control the second correction cylinder 112 to retract;

[0109] S32. Use the slide table assembly 2 to lift the excess material and then lower it after retracting it along the slide rail 21 by a preset retraction distance.

[0110] S33. The cutting material is lifted by the slide table assembly 2 and moved along the slide rail 21 to the unloading area and then lowered.

[0111] In this embodiment, the correction and positioning process of the correction component is divided into two steps. The first step is to perform preliminary positioning of the monocrystalline silicon rod by the first correction cylinder 111. Specifically, the first correction cylinder 111 pushes the monocrystalline silicon rod until the side of the monocrystalline silicon rod contacts the first positioning plate 121 to complete the positioning. After the preliminary positioning is completed, the first correction cylinder 111 retracts, and the slide assembly 2 lifts and transports the monocrystalline silicon rod to the corresponding position of the second correction cylinder 112. The movement process is detected by the distance sensing sensor 43 in the sensor assembly 4. When the monocrystalline silicon rod is detected to have reached the preset cutting distance, the slide assembly 2 is controlled to stop moving, and the first telescopic part 24 of the slide assembly 2 is controlled to retract to its original position, placing the monocrystalline silicon rod on the flexible support rail 232. Then, the second correction cylinder 112 and the second positioning plate 122 perform the final positioning of the monocrystalline silicon rod.

[0112] Meanwhile, during the cutting process, the second straightening cylinder 112 keeps the monocrystalline silicon rod clamped to prevent the monocrystalline silicon rod from shaking. After the cutting is completed, the slide assembly 2 lifts the residual material generated after cutting and retracts it along the slide rail 21 by a preset retraction distance before putting the residual material down, leaving retraction space for the wire saw in the cutting assembly 3. Then the cutting material is lifted and transported to the unloading area for unloading, completing the separation process of the residual material and the cutting material.

[0113] Please refer to Figures 1 to 7 Embodiment six of the present invention is as follows: Based on embodiment five, step S30 is further included between step S2 and step S3, and step S30 specifically includes:

[0114] S301. When the length of the monocrystalline silicon rod is detected to be less than the preset size, the suction cup assembly 5 is controlled to move from the unloading area along the slide rail 21 toward the monocrystalline silicon rod.

[0115] S302. When the sensor of the suction cup assembly detects the end face of the monocrystalline silicon rod, the suction cup assembly is controlled to reduce its moving speed and continue to move closer to the monocrystalline silicon rod.

[0116] S303. When the sensor of the suction cup assembly 5 detects that the distance to the end face of the monocrystalline silicon rod is less than or equal to the preset adsorption distance, the suction cup is controlled to perform negative pressure adsorption on the monocrystalline silicon rod.

[0117] In this embodiment, to prevent the cutting material from being too short and tipping over, when the cutting length of the monocrystalline silicon rod is detected to be less than the preset size, the suction cup assembly 5 is controlled to adsorb and fix the cutting material generated after the monocrystalline silicon rod is cut, so as to prevent tipping over.

[0118] Please refer to Figures 1 to 7 The seventh embodiment of the present invention is as follows: Based on the sixth embodiment, in step S5, when it is detected that there is still a need for cutting, the slide assembly 2 sends the remaining material to the positioning position and returns to step S2; otherwise, the remaining material is unloaded.

[0119] In this embodiment, when it is detected that there is still a need for cutting, the remaining material can be sent back to the positioning point under the detection of the sensor component 4. This positioning point is the positioning point of the first correction cylinder 111 or the positioning point of the second correction cylinder 112, and then return to step S2 to continue the subsequent steps; if there is no need for cutting again, the remaining material can be unloaded.

[0120] Preferably, in this embodiment, a single-crystal silicon rod back-cutting device is combined with a back-cutting method, and the specific steps are as follows:

[0121] 1. Before the device is put into operation, a self-test and reset are performed, including the reset of the slide assembly 2, the suction cup assembly 5 and the corresponding telescopic part, the self-test of the cutting assembly 3, and the self-test of the sensor assembly 4. If any abnormality is found, a "ready signal" is issued.

[0122] 2. Place the monocrystalline silicon rod in the feeding area. After the feeding sensor 41 sends a signal, the first correction cylinder 111 starts and, together with the ball bearing support rail 231, holds the monocrystalline silicon rod at the first positioning plate 121. After the initial positioning is completed, control the first correction cylinder 111 to retract.

[0123] 3. Control the first telescopic part 24 of the slide table 22 to lift the monocrystalline silicon rod a certain distance to ensure that it is separated from the ball support rail 231. Then control the slide table assembly 2 to move the monocrystalline silicon rod to the working area of ​​the second correction cylinder 112. During the movement, the distance sensing sensor 43 monitors the movement distance of the monocrystalline silicon rod. After the monocrystalline silicon rod moves a preset distance (i.e., reaches the preset cutting position), control the first telescopic part 24 to retract, and the flexible support rail 232 provides support for the monocrystalline silicon rod. At this time, the slide table 22 returns to the zero position (to avoid affecting the cutting) and controls the second correction cylinder 112 to complete the secondary positioning of the monocrystalline silicon rod.

[0124] 4. After the secondary correction is completed, the second correction cylinder 112 remains in a clamped state, controlling the wire saw in the cutting assembly 3 to fall vertically to cut the monocrystalline silicon rod. Preferably, the cutting assembly 3 also includes a spray section and a blowing section. The spray section is located at the top of the wire saw to cool and clean the wire saw during cutting; the blowing section is located at the rear end of the wire saw to dry and clean the monocrystalline silicon rod that is about to be cut after cutting.

[0125] 5. After cutting is completed, the second straightening cylinder 112 retracts, the slide table 22 moves to below the remaining material, lifts it up and then retracts a preset distance to leave space for the wire saw to retract; after reaching the corresponding position, the remaining material is put down; after the material feeding sensor 42 detects that there is no material in the feeding area, it controls the slide table 22 to lift the cutting material and move it to the feeding area.

[0126] 6. Control the wire saw of cutting component 3 to retract the wire and return to the initial position.

[0127] 7. Check if there is a need to cut the remaining material. If there is a need to cut, send the remaining material to the cutting position and clamp it by the second straightening cylinder 112, then return to step 4. If no need to cut is detected, arrange for the remaining material to be unloaded.

[0128] In addition, when the cut monocrystalline silicon rod is less than the first preset length, the suction cup assembly 5 is controlled to work. The specific working process is as follows: based on the above steps, after the cutting is completed, the suction cup assembly 5 is controlled to gradually approach the cutting material along the slide. After the sensor of the suction cup assembly 5 detects that it has reached the predetermined position, the second telescopic part 52 controls the negative pressure suction cup 51 to extend until it contacts the end face of the cutting material to complete the adsorption. Subsequently, the suction cup assembly 5 works with the slide table 22 to complete the lifting and movement. Preferably, the first telescopic part 24 and the second telescopic part 52 are telescopic cylinders.

[0129] In summary, the present invention provides a re-cutting device and method for monocrystalline silicon rods. By supporting the monocrystalline silicon rods with support rails and positioning the straightening components, the stability and accuracy of the monocrystalline silicon rods are improved. The monocrystalline silicon rods are transported by lifting the slide assembly, and in conjunction with the cutting assembly, the cutting material and residual material of the monocrystalline silicon rods are separated and transported, thereby achieving the re-cutting effect.

[0130] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A reverse cutting device for a single-crystal silicon rod, characterized in that: Includes correction components, slide components, and cutting components; The slide assembly includes a slide rail, a slide table, and a support rail. The slide table is slidably disposed above the slide rail, and the support rail is parallel to the slide rail. The support rail is disposed on both sides of the slide table. The slide table is provided with a first telescopic part, which is used to control the movement of the slide table in the vertical direction. The cutting assembly includes a wire saw, which is disposed above the support rail; The correction component includes a correction cylinder and a positioning plate that cooperate with each other. The correction cylinder and the positioning plate are respectively disposed on both sides of the support rail at the lower end or the front end of the cutting component. The support rail includes a ball bearing support rail and a flexible support rail assembled and connected along the axial direction of the slide rail; The corrective cylinder includes a first corrective cylinder and a second corrective cylinder, and the positioning plate includes a first positioning plate and a second positioning plate; the ball bearing support rail is disposed between the first corrective cylinder and the first positioning plate, and the flexible support rail is disposed between the second corrective cylinder and the second positioning plate.

2. The single-crystal silicon rod recutting device according to claim 1, characterized in that: The ball bearing support rail includes a ball bearing fixing plate and balls. The upper surface of the ball bearing fixing plate is provided with ball bearing fixing grooves at fixed intervals along the axial direction. The balls are placed in the ball bearing fixing grooves and protrude from the upper surface of the ball bearing fixing plate.

3. The single-crystal silicon rod recutting device according to claim 1, characterized in that: It also includes a sensor assembly, which includes a loading sensor, a unloading sensor, and a distance sensing sensor; The feeding sensor is positioned relative to the first correction cylinder; The feeding sensor is located behind the cutting assembly; The distance sensing sensor is located between the first correction cylinder and the second correction cylinder.

4. The single-crystal silicon rod recutting device according to claim 1, characterized in that: It also includes a suction cup assembly, which is slidably disposed at the rear end of the slide rail. The suction cup assembly has a negative pressure suction cup on its end face perpendicular to the axis of the slide rail, and the negative pressure suction cup has a second telescopic part along the axis of the slide rail.

5. A method for back-cutting a single-crystal silicon rod, applied to the back-cutting apparatus for a single-crystal silicon rod as described in any one of claims 1-3, characterized in that: Includes the following steps: S1. Use the straightening component to perform horizontal positioning and straightening of the monocrystalline silicon rod; S2. Cut the monocrystalline silicon rod using the cutting lines of the cutting component; S3. Use a sliding table assembly to separate the cutting material and residue generated after cutting the monocrystalline silicon rod; S4. Control the cutting component to return to its original position.

6. The method for reverse cutting a single-crystal silicon rod according to claim 5, characterized in that: The specific steps of S1 are as follows: S11. Use the first correction cylinder to press the single crystal silicon rod against the first positioning plate; S12, Control the retraction of the first correction cylinder; S13. Simultaneously start the slide assembly and sensor assembly. When the movement of the monocrystalline silicon rod is detected to be a preset positioning distance, stop the slide assembly. S14. Use the second correction cylinder to press the single crystal silicon rod against the second positioning plate.

7. The method for reverse cutting a single-crystal silicon rod according to claim 6, characterized in that: Step S3 specifically involves: S31, Control the retraction of the second correction cylinder; S32. Use the slide table assembly to lift the excess material and then lower it after retracting it along the slide rail a preset retraction distance. S33. Use the slide table assembly to lift the cutting material and move it along the slide rail to the unloading area, then lower it.

8. The method for reverse cutting a single-crystal silicon rod according to claim 7, characterized in that: The single-crystal silicon rod recutting device also includes a suction cup assembly, which is slidably disposed at the rear end of the slide rail. The suction cup assembly has a negative pressure suction cup on its end face perpendicular to the axis of the slide rail, and a second telescopic part is provided on the negative pressure suction cup along the axial direction of the slide rail. Step S30 is included between steps S2 and S3, and step S30 specifically includes: S301. When the length of the monocrystalline silicon rod is detected to be less than the preset size, the suction cup assembly is controlled to move from the unloading area along the slide rail toward the monocrystalline silicon rod. S302. When the sensor of the suction cup assembly detects the end face of the monocrystalline silicon rod, the suction cup assembly is controlled to reduce its moving speed and continue to move closer to the monocrystalline silicon rod. S303. When the sensor of the suction cup assembly detects that the distance to the end face of the monocrystalline silicon rod is less than or equal to the preset adsorption distance, the suction cup is controlled to perform negative pressure adsorption on the monocrystalline silicon rod.

9. The method for reverse cutting a single-crystal silicon rod according to claim 5, characterized in that: Step S4 is followed by step S5: S5. When it is detected that there is still a need for cutting, the slide assembly will send the remaining material to the positioning position and return to step S2; otherwise, the remaining material will be unloaded.

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