Wafer micro-motion device and automated processing production line
By setting a combination structure of cross-force application surface and eccentric shaft on the sliding component, the space compression of the wafer micro-motion device is realized, which solves the problem of large space occupation of the micro-motion device in the automated processing production line and improves its adaptability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
- Filing Date
- 2023-06-20
- Publication Date
- 2026-07-24
Smart Images
Figure CN116721947B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing equipment technology, and in particular to a wafer micro-motion device and an automated processing production line. Background Technology
[0002] In semiconductor processing, micro-motion devices are often required to fine-tune the position of the wafer. Micro-motion devices typically include a support mechanism for supporting the wafer and at least two drive mechanisms. Both drive mechanisms are connected to the support mechanism, and each of the at least two drive mechanisms extends in a different direction to drive the support mechanism to move in different directions. This makes the micro-motion devices occupy a large space, making them difficult to adapt to compact and space-constrained automated processing lines. Summary of the Invention
[0003] The purpose of this application is to provide a wafer micro-motion device and an automated processing production line, so as to solve to some extent the technical problem that the existing micro-motion devices occupy a large space and are difficult to adapt to the compact and space-constrained automated processing production lines.
[0004] According to a first aspect of this application, a wafer micro-motion device is provided, including a support portion, a sliding assembly, a first eccentric shaft, a second eccentric shaft, a first driving portion, and a second driving portion. The support portion for supporting the wafer is connected to the sliding assembly, and both the first eccentric shaft and the second eccentric shaft extend along a first direction.
[0005] The sliding assembly includes a first force-applying surface and a second force-applying surface. One end of the first eccentric shaft is connected to the first driving part, and the side of the other end of the first eccentric shaft abuts against the first force-applying surface, so that the first driving part can drive the sliding assembly to move along a second direction perpendicular to the first force-applying surface. The second driving part is connected to one end of the second eccentric shaft, and the side of the other end of the second eccentric shaft abuts against the second force-applying surface, so that the second driving part can drive the sliding assembly to move along a third direction perpendicular to the second force-applying surface. The first force-applying surface and the second force-applying surface intersect.
[0006] Preferably, the sliding assembly includes a first slider and a second slider connected to each other, the supporting part and the first force-applying surface are both disposed on the first slider, and the second force-applying surface is disposed on the second slider.
[0007] Preferably, the sliding assembly further includes a connecting guide portion disposed between the first slider and the second slider;
[0008] The connecting guide portion is provided with a limiting groove extending in the second direction on the side facing the second slider, and at least a portion of the second slider is disposed inside the limiting groove, so that the connecting guide portion can slide relative to the second slider in the second direction.
[0009] The side of the connecting guide that faces away from the second slider is connected to the first slider.
[0010] Preferably, the inner walls of the limiting groove on both sides in the third direction can limit the position of the second slider in the third direction, and when the second slider moves along the third direction, the first slider can move with the second slider.
[0011] Preferably, the first slider includes a connecting portion and an adjusting portion that are detachably connected to each other, so that the length of the first slider in the second direction is adjustable;
[0012] The supporting part is fixedly disposed at the first end of the connecting part in the third direction. The adjusting part includes an abutting protrusion. The abutting protrusion protrudes from the end face of the second end of the connecting part in the third direction, so that the abutting protrusion and the connecting part form an abutting notch. The first force-applying surface is the surface of the abutting protrusion in the second direction.
[0013] Preferably, it further includes a first hook, a second hook, and a first elastic part. The first hook is disposed on the side of the abutting protrusion facing the second slider, the second hook is disposed on the side of the second slider facing the first slider, and the two ends of the first elastic part are respectively hooked on the first hook and the second hook, and the first elastic part is stretched along the second direction.
[0014] Preferably, it further includes a fixing part and a second elastic part, the fixing part being disposed on the side of the second slider opposite to the second force-applying surface, and the second elastic part being compressedly disposed between the fixing part and the second slider.
[0015] Preferably, it further includes a limiting part, the limiting part and the connecting guide part are disposed opposite to each other along the first direction, and the second slider is disposed between the limiting part and the connecting guide part.
[0016] Preferably, it further includes a counting disk and a photoelectric sensor. The counting disk is provided with a counting notch that penetrates the counting disk along the first direction. The counting disk is sleeved on the outer side of at least one of the first eccentric shaft and the second eccentric shaft. The photoelectric sensor is disposed on one side of the counting disk to record the number of times the counting notch passes through the photoelectric sensor.
[0017] According to the second aspect of this application, an automated processing production line is provided, including the wafer micro-motion device described in any of the above technical solutions, and thus has all the beneficial technical effects of the wafer micro-motion device, which will not be repeated here.
[0018] Compared with the prior art, the beneficial effects of this application are as follows:
[0019] The wafer micro-motion device provided in this application, by setting a first force-applying surface and a second force-applying surface that intersect each other on the sliding component, and by applying a first eccentric shaft and a second eccentric shaft that both extend along a first direction to the first force-applying surface and the second force-applying surface respectively, enables the first driving unit to drive the sliding component to move along a second direction perpendicular to the first force-applying surface, and the second driving unit to drive the sliding component to move along a third direction perpendicular to the second force-applying surface. In this way, the first eccentric shaft and the second eccentric shaft that extend in the same direction can drive the support part set on the sliding component to move along the second direction and the third direction, effectively compressing the space occupied by the wafer micro-motion device, thereby enabling the wafer micro-motion device to adapt to the compact and space-constrained automated processing production line, and improving the flexibility and adaptability of the wafer micro-motion device.
[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0022] Figure 1 This is an isometric structural diagram of the wafer micro-motion device provided in the embodiments of this application;
[0023] Figure 2 This is an exploded structural diagram of the wafer micro-motion device provided in the embodiments of this application;
[0024] Figure 3 This is another isometric structural schematic diagram of the wafer micro-motion device provided in the embodiments of this application;
[0025] Figure 4 This is another isometric structural schematic diagram of the wafer micro-motion device provided in the embodiments of this application.
[0026] Figure label:
[0027] 11-First slider; 111-Connecting part; 112-Adjusting part; 113-First force-applying surface; 114-Protrusion; 12-Second slider; 121-Second force-applying surface; 13-Connecting guide part; 14-Limiting part; 151-First hanging claw; 152-Second hanging claw; 2-First driving part; 21-First eccentric shaft; 3-Second driving part; 31-Second eccentric shaft; 4-Supporting part; 5-Counting disk; 51-Counting notch; 6-Photoelectric sensing part; 7-Outer shell; 71-Fixing part; 72-Compression spring top bolt;
[0028] F1 - First direction; F2 - Second direction; F3 - Third direction. Detailed Implementation
[0029] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.
[0030] The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of this application provided in the drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application.
[0031] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0032] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0034] The following reference Figures 1 to 4This application describes wafer micro-motion devices and automated processing lines according to some embodiments.
[0035] See Figures 1 to 4 As shown, an embodiment of the first aspect of this application provides a wafer micro-motion device, including a support portion 4, a sliding assembly, a first eccentric shaft 21, a second eccentric shaft 31, a first driving portion 2, and a second driving portion 3. The support portion 4, used to support the wafer, is connected to the sliding assembly. Both the first eccentric shaft 21 and the second eccentric shaft 31 extend along a first direction F1. The sliding assembly includes a first force-applying surface 113 and a second force-applying surface 121. One end of the first eccentric shaft 21 is connected to the first driving portion 2, and the side of the other end of the first eccentric shaft 21 abuts against the first force-applying surface 113, so that the first driving portion 2 can drive the sliding assembly to move along a second direction F2 perpendicular to the first force-applying surface 113. The second driving portion 3 is connected to one end of the second eccentric shaft 31, and the side of the other end of the second eccentric shaft 31 abuts against the second force-applying surface 121, so that the second driving portion 3 can drive the sliding assembly to move along a third direction F3 perpendicular to the second force-applying surface 121. The first force-applying surface 113 and the second force-applying surface 121 intersect.
[0036] Based on the above technical features, by setting a first force-applying surface 113 and a second force-applying surface 121 that intersect each other on the sliding component, and by applying a first eccentric shaft 21 and a second eccentric shaft 31 that both extend along the first direction F1 to the first force-applying surface 113 and the second force-applying surface 121 respectively, the first driving part 2 can drive the sliding component to move along the second direction F2 perpendicular to the first force-applying surface 113, and the second driving part 3 can drive the sliding component to move along the third direction F3 perpendicular to the second force-applying surface 121. In this way, through the above structure, the first eccentric shaft 21 and the second eccentric shaft 31 that extend in the same direction can drive the support part 4 set on the sliding component to move along the second direction F2 and the third direction F3, effectively compressing the space occupied by the wafer micro-motion device, thereby enabling the wafer micro-motion device to adapt to the compact and space-constrained automated processing production line, and improving the flexibility and adaptability of the wafer micro-motion device.
[0037] See Figures 1 to 4 In the figure, direction F1 can be an example of a first direction F1, direction F2 can be an example of a second direction F2, and direction F3 can be an example of a third direction F3. Preferably, any two of the first direction F1, the second direction F2, and the third direction F3 are perpendicular. Preferably, the second direction F2 is the direction of gravity.
[0038] Preferably, such as Figure 3 and Figure 4As shown, the sliding assembly may include a first slider 11 and a second slider 12 connected to each other. The support part 4 and the first force-applying surface 113 are both disposed on the first slider 11, and the second force-applying surface 121 is disposed on the second slider 12. In this way, interference between the first eccentric shaft 21 and the second eccentric shaft 31 is avoided.
[0039] Preferably, such as Figure 1 and Figure 2 As shown, the sliding assembly may further include a connecting guide portion 13 disposed between the first slider 11 and the second slider 12. A limiting groove extending along the second direction F2 is provided on the side of the connecting guide portion 13 facing the second slider 12. At least a portion of the second slider 12 is disposed inside the limiting groove, allowing the connecting guide portion 13 to slide relative to the second slider 12 along the second direction F2. The side of the connecting guide portion 13 facing away from the second slider 12 is connected to the first slider 11. Thus, when the first slider 11 slides along the second direction F2, the connecting guide portion 13 can slide relative to the second slider 12 along with the first slider 11, keeping the position of the second slider 12 unchanged in the second direction F2, thereby ensuring the accuracy and stability of the docking between the second slider 12 and the second eccentric shaft 31.
[0040] Preferably, such as Figures 1 to 4 As shown, the inner walls on both sides of the limiting groove in the third direction F3 can limit the position of the second slider 12 in the third direction F3. When the second slider 12 moves along the third direction F3, the first slider 11 can move with the second slider 12. Thus, when the second slider 12 moves in the third direction F3, it can drive the first slider 11 provided on the support part 4 to move together with the second slider 12.
[0041] Preferably, such as Figure 1 and Figure 2 As shown, the first slider 11 may include a connecting part 111 and an adjusting part 112 that are detachably connected to each other, so that the length of the first slider 11 in the second direction F2 is adjustable. The first force-applying surface 113 may be disposed on the adjusting part 112. The connecting part 111 and the adjusting part 112 are detachably connected, so that the distance between the connecting part 111 and the adjusting part 112 in the second direction F2 is adjustable, which facilitates the adjustment of the position of the first force-applying surface 113 in the second direction F2, so as to avoid insufficient fit between the first force-applying surface 113 and the first eccentric shaft 21 under the action of gravity.
[0042] Preferably, such as Figure 1 and Figure 2As shown, the support portion 4 is fixedly disposed at the first end of the connecting portion 111 in the third direction F3. The adjusting portion 112 may include an abutting protrusion 114, which protrudes from the end face of the second end of the connecting portion 111 in the third direction F3, so that the abutting protrusion 114 and the connecting portion 111 form an abutting notch. The first force-applying surface 113 is the upper surface of the abutting protrusion 114 in the second direction F2. In this way, the first eccentric shaft 21 can be disposed in the abutting notch, further saving the space of the wafer micro-motion device.
[0043] Preferably, such as Figure 1 and Figure 2 As shown, the wafer micro-motion device may further include a first claw 151, a second claw 152, and a first elastic part. The first claw 151 is disposed on the side of the abutting protrusion 114 facing the second slider 12, and the second claw 152 is disposed on the side of the second slider 12 facing the first slider 11. The two ends of the first elastic part are respectively attached to the first claw 151 and the second claw 152, and the first elastic part is stretched along the second direction F2. Thus, when the first elastic part moves downward under the driving action of the first eccentric shaft 21, the first sliding part can always be in contact with the first eccentric shaft 21 under the stretching action of the first elastic part, so that the first slider 11 can perform periodic reciprocating motion in the second direction F2 as the first eccentric shaft 21 rotates.
[0044] Optionally, the first driving unit 2 may be a rotary motor, such that the displacement of the first slider 11 in the second direction F2 is Z = rr × cosθ, where r is the eccentricity of the first eccentric shaft 21 and θ is the rotation angle of the first driving unit 2.
[0045] Preferably, such as Figure 3 and Figure 4 As shown, the wafer micro-motion device may further include a fixing part 71, which is disposed on the side of the second slider 12 opposite to the second force application surface 121.
[0046] Optionally, such as Figure 3 and Figure 4 As shown, the wafer micro-motion device may also include a housing 7, and the aforementioned fixing part 71 may be the side wall of the housing 7 in the second direction F2 near the slider assembly.
[0047] Preferably, the wafer micro-motion device may further include a second elastic part, which is compressedly disposed between the fixed part 71 and the second slider 12, so that the second slider 12 can always be in contact with the second eccentric shaft 31 under the abutment action of the second elastic part, so that the second slider 12 can perform periodic reciprocating motion in the third direction F3 as the second eccentric shaft 31 rotates.
[0048] Optionally, such as Figure 4 As shown, the outer casing 7 may also include a spring top bolt 72, through which the second elastic part is fixed to the fixing part 71.
[0049] Optionally, the first elastic part can be an elastic material such as a spring or rubber band. The second elastic part can be an elastic material such as a spring or elastic rod.
[0050] Similarly, the second drive unit 3 can also be a rotary motor, such that the displacement of the second slider 12 in the third direction F3 is X = RR × cosγ, where R is the eccentricity of the second eccentric shaft 31 and γ is the rotation angle of the second drive unit 3.
[0051] Preferably, such as Figures 1 to 4 As shown, the wafer micro-motion device may also include a limiting part 14, which is disposed opposite to the connecting guide part 13 along the first direction F1. The second slider 12 is disposed between the limiting part 14 and the connecting guide part 13, thereby effectively improving the accuracy of the second slider 12 moving along the third direction F3.
[0052] In an embodiment, preferably, such as Figures 1 to 4 As shown, the wafer micro-motion device may further include a counting disk 5 and a photoelectric sensor 6. The counting disk 5 is provided with a counting notch 51 that penetrates the counting disk 5 along a first direction F1. The counting disk 5 is sleeved on the outer side of the first eccentric shaft 21. The photoelectric sensor 6 may be disposed on one side of the counting disk 5 to record the number of times the counting notch 51 passes through the photoelectric sensor 6, thereby recording the number of times the first slider 11 reciprocates along the second direction F2. Optionally, the photoelectric sensor 6 may be a photoelectric switch, a photoelectric sensor, etc.
[0053] However, it is not limited to this. As not shown in the figure, the counting disk can also be fitted on the outside of the second eccentric shaft to record the number of times the second slider reciprocates along a third direction.
[0054] Preferably, the support portion 4 can be an air pump and a negative pressure suction cup that are connected to each other, so as to stably adsorb the wafer.
[0055] Based on the features described above, Figures 1 to 4 The following description uses the wafer micro-motion device as an example. The movement process of the wafer micro-motion device will be described in detail below.
[0056] Action 1: The first drive unit 2 rotates while the second drive unit 3 remains stationary, causing the first eccentric shaft 21 to rotate. Under the action of the first elastic part, one end of the first eccentric shaft 21 is always in contact with the first force application surface 113.
[0057] In the second action, when the support part 4 moves to its highest point under the drive of the first slider 11, the first drive part 2 stops, the second drive part 3 rotates, and the aforementioned air pump is activated, causing the support part 4 to adsorb the wafer. Under the action of the second elastic part, one end of the second eccentric shaft 31 is always in contact with the second force application surface 121; driven by the second eccentric shaft 31, the wafer is moved along the third direction F3.
[0058] Action 3: When the support part 4 moves to the maximum stroke in the third direction F3 under the drive of the second slider 12, the maximum stroke can be understood as the position farthest from the axis of the second drive part 3 in the third direction F3. Then the air pump is turned off, so that the wafer is separated from the support part 4.
[0059] Action 4: When the support part 4 returns to its initial position on the third direction F3 under the drive of the second slider 12, the second drive part 3 is turned off and the first drive part 2 is turned on, so that the support part 4 returns to the lowest point on the second direction F2 under the drive of the first slider 11, completing one action cycle of the wafer micro-motion device.
[0060] The second aspect of this application also provides an automated processing production line, including the wafer micro-motion device described in any of the above embodiments, and thus has all the beneficial technical effects of the wafer micro-motion device, which will not be repeated here.
[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A wafer micro-motion device, characterized in that, It includes a support portion, a sliding assembly, a first eccentric shaft, a second eccentric shaft, a first driving portion, and a second driving portion. The support portion for supporting the wafer is connected to the sliding assembly. Both the first eccentric shaft and the second eccentric shaft extend along a first direction. The sliding assembly includes a first force-applying surface and a second force-applying surface. One end of the first eccentric shaft is connected to the first driving part, and the side of the other end of the first eccentric shaft abuts against the first force-applying surface, so that the first driving part can drive the sliding assembly to move along a second direction perpendicular to the first force-applying surface. The second driving part is connected to one end of the second eccentric shaft, and the side of the other end of the second eccentric shaft abuts against the second force-applying surface, so that the second driving part can drive the sliding assembly to move along a third direction perpendicular to the second force-applying surface. The first force-applying surface and the second force-applying surface intersect.
2. The wafer micro-motion device according to claim 1, characterized in that, The sliding assembly includes a first slider and a second slider connected to each other. The supporting part and the first force-applying surface are both disposed on the first slider, and the second force-applying surface is disposed on the second slider.
3. The wafer micro-motion device according to claim 2, characterized in that, The sliding assembly further includes a connecting guide portion disposed between the first slider and the second slider; The connecting guide portion is provided with a limiting groove extending in the second direction on the side facing the second slider, and at least a portion of the second slider is disposed inside the limiting groove, so that the connecting guide portion can slide relative to the second slider in the second direction. The side of the connecting guide that faces away from the second slider is connected to the first slider.
4. The wafer micro-motion device according to claim 3, characterized in that, The inner walls of the limiting groove on both sides in the third direction can limit the position of the second slider in the third direction. When the second slider moves along the third direction, the first slider can move with the second slider.
5. The wafer micro-motion device according to claim 3, characterized in that, The first slider includes a connecting portion and an adjusting portion that are detachably connected to each other, so that the length of the first slider in the second direction is adjustable; The supporting part is fixedly disposed at the first end of the connecting part in the third direction. The adjusting part includes an abutting protrusion. The abutting protrusion protrudes from the end face of the second end of the connecting part in the third direction, so that the abutting protrusion and the connecting part form an abutting notch. The first force-applying surface is the surface of the abutting protrusion in the second direction.
6. The wafer micro-motion device according to claim 5, characterized in that, It also includes a first hook, a second hook, and a first elastic part. The first hook is disposed on the side of the abutting protrusion facing the second slider, the second hook is disposed on the side of the second slider facing the first slider, and the two ends of the first elastic part are respectively hooked on the first hook and the second hook, and the first elastic part is stretched along the second direction.
7. The wafer micro-motion device according to claim 2, characterized in that, It also includes a fixing part and a second elastic part. The fixing part is disposed on the side of the second slider that is opposite to the second force-applying surface, and the second elastic part is compressedly disposed between the fixing part and the second slider.
8. The wafer micro-motion device according to claim 3, characterized in that, It also includes a limiting part, which is disposed opposite to the connecting guide part along the first direction, and the second slider is disposed between the limiting part and the connecting guide part.
9. The wafer micro-motion device according to any one of claims 2 to 8, characterized in that, It also includes a counting disk and a photoelectric sensor. The counting disk is provided with a counting notch that penetrates the counting disk along the first direction. The counting disk is sleeved on the outside of at least one of the first eccentric shaft and the second eccentric shaft. The photoelectric sensor is disposed on one side of the counting disk to record the number of times the counting notch passes through the photoelectric sensor.
10. An automated processing production line, characterized in that, The wafer micro-motion device includes any one of claims 1 to 9.