Resin molding apparatus and method for manufacturing resin molded articles

Abstract

This invention provides a resin molding apparatus and a method for manufacturing high-precision resin molded articles. The resin molding apparatus includes: a lower mold for holding a substrate; an upper mold forming a cavity from side blocks and a cavity block, the cavity block being vertically movable relative to the side blocks; a clamping mechanism for clamping the lower mold and the upper mold; a transfer mechanism for supplying resin material to the cavity via a plunger; and a control unit for performing filling rate control based on the relationship between the resin filling rate of the cavity calculated from the volume of a chip disposed on the substrate and the volume of the resin material and the position of the plunger. This filling rate control is triggered when the plunger reaches a position corresponding to a predetermined resin filling rate to control actions related to resin molding.

Description

Technical Field

[0001] This invention relates to a resin molding apparatus and a method for manufacturing resin molded articles. Background Technology

[0002] Patent Document 1 discloses a resin molding apparatus comprising: a lower mold for holding a substrate; an upper mold forming a cavity by an upper mold cavity frame member and a cavity block; a clamping mechanism for clamping the lower mold and the upper mold; and a plunger for supplying resin material to the cavity. The resin molding apparatus can adjust the depth of the cavity to an appropriate depth by adjusting the position of the cavity block relative to the upper mold cavity frame member.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-179604 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In recent years, with the expansion of the technical fields applicable to resin molded articles, the precision requirements for resin molded articles have become higher. Therefore, technologies that can manufacture resin molded articles with higher precision are being sought.

[0008] The present invention was made in view of the situation described above, and the problem it aims to solve is to provide a resin molding apparatus and a method for manufacturing resin molded articles with high precision.

[0009] Technical means to solve the problem

[0010] The problem to be solved by the present invention is as described above. To solve the aforementioned problem, the resin molding apparatus of the present invention includes: a lower mold for holding a substrate; an upper mold for forming a mold cavity by side blocks and a cavity block, wherein the cavity block is provided in a manner that allows it to be raised and lowered relative to the side blocks; a clamping mechanism for clamping the lower mold and the upper mold; a transfer mechanism for supplying resin material to the mold cavity via a plunger; and a control unit for performing filling rate corresponding control using a relationship between the resin filling rate of the mold cavity calculated based on the volume of the chip disposed on the substrate and the volume of the resin material and the position of the plunger, wherein the filling rate corresponding control is triggered by the plunger reaching a position corresponding to a predetermined resin filling rate to control actions related to resin molding.

[0011] Furthermore, the method for manufacturing resin molded articles of the present invention uses the resin molding apparatus to manufacture resin molded articles.

[0012] Furthermore, the method for manufacturing a resin molded article according to the present invention includes: a chip volume measurement step, wherein the volume of a chip disposed on a substrate is measured; a resin volume measurement step, wherein the volume of a resin material is measured; a plunger position calculation step, wherein the relationship between the resin filling rate of the mold cavity and the position of the plunger is calculated based on the measured volume of the chip and the volume of the resin material; and a filling rate corresponding control step, wherein actions related to resin molding are controlled when the plunger reaches a position corresponding to a predetermined resin filling rate.

[0013] The effects of the invention

[0014] According to the present invention, high-precision resin molded articles can be manufactured. Attached Figure Description

[0015] Figure 1 This is a plan view showing the overall structure of a resin molding apparatus according to one embodiment.

[0016] Figure 2 This is a front cross-sectional view showing the structure of a resin molding module according to one embodiment.

[0017] Figure 3 (a) is a plan view showing the structure of the lower mold in one embodiment as viewed from the mold side (above). Figure 3 (b) is a bottom view showing the structure of the upper mold in one embodiment as viewed from the mold side (below).

[0018] Figure 4 (a) is a plan view showing the connecting groove that connects the residual material parts to each other. Figure 4 (b) is a plan view showing an example of residual material sections connected to each other via the mold cavity.

[0019] Figure 5 (a) is a front cross-sectional view showing the case where the depth of the mold cavity becomes shallow when clamped by the mold clamping mechanism. Figure 5 (b) is a front cross-sectional view showing the case where the depth of the mold cavity increases when resin is supplied by a plunger.

[0020] Figure 6 This is a flowchart illustrating an example of a method for manufacturing resin molded articles.

[0021] Figure 7 It is a graph showing the time variation of clamping load, plunger position, and plunger load in the first control mode.

[0022] Figure 8 This is a flowchart representing a specific example of fill rate control.

[0023] Figure 9 (a) is a front cross-sectional view of the lower and upper molds in the mold-locked state. Figure 9 (b) is a front cross-sectional view of the lower and upper molds, showing the state where the clamping load has decreased.

[0024] Figure 10 It is a graph showing the time variation of clamping load, plunger position, and plunger load in the second control mode.

[0025] [Explanation of Symbols]

[0026] 1: Resin molding device

[0027] 12: Frame Measurement Department

[0028] 15: Resin Testing Section

[0029] 18: Control Department

[0030] 110: Lower mold

[0031] 130: Upper mold setting section

[0032] 140: Upper mold

[0033] 142: Upper mold side block

[0034] 143: Upper mold cavity block

[0035] 150: Disc Spring

[0036] 160: Upper mold cavity adjustment mechanism

[0037] 170: Vent opening and closing mechanism

[0038] 180: Transfer Institution

[0039] 181: Transfer Drive Unit

[0040] 182: Plunger

[0041] 190: Mold clamping mechanism Detailed Implementation

[0042] The directions indicated by arrows U, D, L, R, F, and B in the diagram are defined as up, down, left, right, forward, and backward, respectively.

[0043] <Overall Structure of Resin Molding Device 1>

[0044] First, use Figure 1The structure of the resin molding apparatus 1 according to the first embodiment will be described below. The resin molding apparatus 1 is an apparatus for sealing electronic components such as semiconductor chips (hereinafter referred to as "chip 2a") with resin to manufacture resin molded articles. In particular, in this embodiment, a resin molding apparatus 1 that uses the transfer molding method to perform resin molding is illustrated.

[0045] The resin molding apparatus 1 includes a supply module 10, a resin molding module 20, and a delivery module 30 as constituent components. Each constituent component is detachable and replaceable relative to the other constituent components.

[0046] <Supply Module 10>

[0047] The supply module 10 supplies a lead frame (hereinafter referred to as "substrate 2"), which serves as a substrate on which the chip 2a is mounted, and a resin sheet T to the resin molding module 20. Furthermore, in this embodiment, a lead frame is exemplified as substrate 2, but various other substrates (epoxy glass substrates, ceramic substrates, resin substrates, metal substrates, etc.) can also be used besides the lead frame. The supply module 10 mainly includes a frame delivery unit 11, a frame measuring unit 12, a frame supply unit 13, a resin delivery unit 14, a resin measuring unit 15, a resin supply unit 16, a loader 17, and a control unit 18.

[0048] The frame delivery unit 11 delivers the unsealed substrate 2, housed in the inner box unit (not shown), to the frame measuring unit 12. The frame measuring unit 12 measures the volume of the chip 2a mounted on the substrate 2. Furthermore, the frame measuring unit 12 is one embodiment of the chip volume measuring unit of this application. Details regarding the frame measuring unit 12 will be described later. The substrate 2, after measurement in the frame measuring unit 12, is delivered to the frame supply unit 13. The frame supply unit 13 receives the substrate 2 from the frame measuring unit 12, arranges the received substrate 2 appropriately, and transfers it to the loader 17.

[0049] The resin delivery unit 14 receives resin sheet T from the stocker (not shown) and delivers it to the resin measuring unit 15. The resin measuring unit 15 measures the weight (volume) of the resin sheet T. Furthermore, the resin measuring unit 15 is one embodiment of the resin volume measuring unit of this application. Details regarding the resin measuring unit 15 will be described later. The resin sheet T, after measurement in the resin measuring unit 15, is delivered to the resin supply unit 16. The resin supply unit 16 receives the resin sheet T from the resin measuring unit 15, arranges the received resin sheet T appropriately, and hands it over to the loader 17.

[0050] The loader 17 transports the substrate 2 and resin sheet T received from the frame supply section 13 and the resin supply section 16 to the resin molding module 20.

[0051] The control unit 18 controls the operation of each module of the resin molding apparatus 1. Furthermore, the control unit 18 is one embodiment of the computing unit of this application. The operation of the supply module 10, the resin molding module 20, and the delivery module 30 is controlled by the control unit 18. Moreover, the operation of each module can be arbitrarily changed (adjusted) using the control unit 18.

[0052] Furthermore, this embodiment shows an example where the control unit 18 is located in the supply module 10, but the control unit 18 can also be located in other modules. Moreover, multiple control units 18 can be provided. For example, a control unit 18 can be provided for each module or each device, so that the operation of each module, etc., is linked together and controlled individually.

[0053] <Resin Molding Module 20>

[0054] The resin molding module 20 seals the chip 2a mounted on the substrate 2 with resin. In this embodiment, two resin molding modules 20 are arranged in a row. By performing resin sealing of the substrate 2 in parallel using two resin molding modules 20, the manufacturing efficiency of the resin molded product can be improved. The resin molding module 20 mainly includes molding dies (lower die 110 and upper die 140) and a mold clamping mechanism 190 (see reference). Figure 2 ).

[0055] The molding die (lower die 110 and upper die 140) uses molten resin material to seal the chip 2a mounted on the substrate 2. The molding die includes a pair of molds, namely the lower die 110 and the upper die 140 (see reference). Figure 2 (etc.). The forming mold is equipped with a heating section (not shown) such as a heater.

[0056] Mold clamping mechanism 190 (reference) Figure 2 By moving the lower mold 110 up and down, the forming mold (lower mold 110 and upper mold 140) can be locked or opened.

[0057] <Moveout Module 30>

[0058] The removal module 30 receives and removes the resin-sealed substrate 2 from the resin molding module 20. The removal module 30 mainly includes an unloading machine 31 and a substrate receiving section 32.

[0059] The unloading machine 31 carries the resin-sealed substrate 2 out to the substrate receiving section 32. The substrate receiving section 32 receives the resin-sealed substrate 2.

[0060] <Summary of the operation of resin molding apparatus 1>

[0061] Next, use Figure 1 and Figure 2Here is an outline of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing resin molded articles using the resin molding apparatus 1).

[0062] In the supply module 10, the frame delivery unit 11 delivers the substrate 2 housed in the inner box unit (not shown) to the frame measuring unit 12. After measuring the volume of the chip 2a of the received substrate 2, the frame measuring unit 12 delivers the substrate 2 to the frame supply unit 13. The frame supply unit 13 arranges the received substrate 2 appropriately and hands it over to the loader 17.

[0063] Furthermore, the resin delivery unit 14 delivers the resin sheet T received from the storage container (not shown) to the resin measuring unit 15. After measuring the weight (volume) of the received resin sheet T, the resin measuring unit 15 delivers the resin sheet T to the resin supply unit 16. The resin supply unit 16 delivers the necessary number of received resin sheets T to the loader 17. The loader 17 transports the received substrate 2 and resin sheets T to the molding die of the resin molding module 20.

[0064] In the resin molding module 20, the mold clamping mechanism 190 clamps the molding die. Furthermore, the resin sheet T is heated and melted by the heating part (not shown) of the molding die, and the resulting molten resin is used to seal the substrate 2.

[0065] After resin sealing is completed, the mold-locking mechanism 190 opens the molding die, thereby demolding the resin-sealed substrate 2. Then, the unloading machine 31 removes the substrate 2 from the molding die and stores it in the substrate receiving section 32 of the unloading module 30. At this time, non-essential parts of the resin-molded substrate 2 (excess resin such as cull and runner) are appropriately removed. Thus, a resin-sealed substrate 2 (resin-molded article) is manufactured.

[0066] <Detailed Structure of Resin Molding Module 20>

[0067] Next, the structure of the resin molding module 20 will be described in further detail. For example... Figure 2 As shown, the resin molding module 20 mainly includes a lower mold setting part 100, a lower mold 110, a lower mold cavity adjustment mechanism 120, an upper mold setting part 130, an upper mold 140, a coil spring 150, an upper mold cavity adjustment mechanism 160, an air vent opening and closing mechanism 170, a transfer mechanism 180, and a mold locking mechanism 190.

[0068] <Lower mold setting part 100>

[0069] Figure 2The lower mold setting part 100 shown is the part where the lower mold 110 is set. The lower mold setting part 100 mainly includes a lower mold movable base 101 and a lower mold mounting part 102.

[0070] The movable base 101 of the lower mold forms the lower part of the lower mold setting part 100. The lower mold mounting part 102 is the part for mounting the lower mold 110. The lower mold mounting part 102 is provided on the upper part of the movable base 101 of the lower mold.

[0071] <Lower Mold 110>

[0072] Figure 2 , Figure 3 (a) and Figure 9 The lower mold 110 shown forms the lower part of the forming mold. The lower mold 110 mainly includes a lower mold side block 111, a pot block 112, a lower mold cavity block 113, a lower mold pillar 114, and a lower mold elastic member 115. In the lower mold 110 of this embodiment, as... Figure 3 As shown in (a), there is a flow hole block 112 in the center, and lower mold cavity blocks 113 are arranged on the left and right sides thereto. Lower mold side blocks 111 are arranged further out of the lower mold cavity blocks 113.

[0073] The lower mold side block 111 forms the outer peripheral portion of the lower mold 110. The lower mold side block 111 is provided on the upper surface of the lower mold mounting portion 102.

[0074] The flow hole block 112 is a portion that receives the resin sheet T supplied from the supply module 10. Multiple through holes (flow holes) for receiving the resin sheet T are formed in the flow hole block 112. The flow hole block 112 is configured such that it is sandwiched between the left and right sides by the lower mold cavity block 113. The flow hole block 112 is provided on the upper surface of the lower mold mounting portion 102.

[0075] The lower mold cavity block 113 is a portion for mounting the substrate 2. The lower mold cavity block 113 is disposed between the lower mold side block 111 and the flow hole block 112. The lower mold cavity block 113 is configured to be movable relative to the lower mold side block 111 and the flow hole block 112 in the vertical direction.

[0076] The lower mold column 114 is a component that extends downward from the lower mold cavity block 113. The upper end of the lower mold column 114 is fixed to the lower part of the lower mold cavity block 113.

[0077] The lower mold elastic member 115 applies an upward force to the lower mold cavity block 113. The lower mold elastic member 115 is formed, for example, by a compression coil spring. The lower mold elastic member 115 is disposed between the lower mold cavity block 113 and the lower mold mounting portion 102. Through the force applied by the lower mold elastic member 115, an upward force is always applied to the lower mold cavity block 113.

[0078] <Lower mold cavity adjustment mechanism 120>

[0079] Figure 2 The lower mold cavity adjustment mechanism 120 shown adjusts the position of the lower mold cavity block 113. The lower mold cavity adjustment mechanism 120 mainly includes a lower mold first wedge member 121, a lower mold second wedge member 122, and a lower mold wedge member drive part 123.

[0080] The lower die first wedge member 121 and the lower die second wedge member 122 are a pair of members with tapered portions formed on their opposing surfaces. The lower die second wedge member 122 is disposed above the lower die first wedge member 121. The lower die second wedge member 122 is disposed below the lower die post 114. The lower end of the lower die post 114 abuts against the lower die second wedge member 122, thereby restricting the downward movement of the lower die cavity block 113. This defines the position of the lower die cavity block 113.

[0081] The lower die wedge member drive unit 123 moves the lower die first wedge member 121 in the horizontal direction (left-right direction). The lower die wedge member drive unit 123 is formed, for example, by a servo motor or cylinder. The lower die wedge member drive unit 123 is connected to the lower die first wedge member 121 via a suitable power transmission member. By driving the lower die wedge member drive unit 123, the lower die first wedge member 121 can be moved arbitrarily in the left-right direction.

[0082] The position of the lower mold cavity block 113 can be adjusted by the lower mold cavity adjustment mechanism 120 configured in various ways. Specifically, when the lower mold wedge member drive unit 123 is driven to move the lower mold first wedge member 121 in the left and right direction, the lower mold second wedge member 122, which is in contact with the lower mold first wedge member 121, will move up and down along the tapered portion. By moving the lower mold second wedge member 122 up and down, the position that restricts the lower mold column 114 from moving downward will be shifted, thereby adjusting the position of the lower mold cavity block 113.

[0083] <Upper mold setting section 130>

[0084] Figure 2 and Figure 9 The upper mold setting part 130 shown is the part where the upper mold 140 is set. Furthermore, the upper mold setting part 130 is one embodiment of the upper mold support part of this application. The upper mold setting part 130 mainly includes an upper mold fixing base 131, an upper mold mounting part 132, and a heating plate 133.

[0085] The upper mold fixing base 131 forms the upper part of the upper mold mounting portion 130. The upper mold mounting portion 132 is the part for mounting the upper mold 140. The upper mold mounting portion 132 is formed by assembling multiple components. The upper mold mounting portion 132 is provided at the lower part of the upper mold fixing base 131. On the outer periphery of the upper mold mounting portion 132, a support portion 132a is provided to support the upper mold 140 (upper mold base 141) described later from below. A heating plate 133 is used to heat the upper mold 140. The heating plate 133 is provided on the bottom surface of the upper mold mounting portion 132.

[0086] <Upper mold 140>

[0087] Figure 2 , Figure 3 (b) and Figure 9 The upper mold 140 shown forms the upper part of the forming mold. The upper mold 140 mainly includes an upper mold base 141, an upper mold side block 142, an upper mold cavity block 143, an upper mold support 145, and an upper mold pillar 146. In this embodiment, as... Figure 3 As shown in (b), there is a residual material block 144 in the center, and upper mold cavity blocks 143 are arranged on the left and right sides thereto. Upper mold side blocks 142 are arranged on the outer periphery of the upper mold cavity blocks 143 (except for the residual material block side).

[0088] The upper mold base 141 is a component that supports the upper mold side block 142, which will be described later. The upper mold base 141 is formed as a plate with a predetermined thickness at the top and bottom. The outer periphery of the upper mold base 141 is supported from below by the support portion 132a of the upper mold mounting portion 132. Thus, the upper mold base 141 is supported in a manner that allows it to move vertically relative to the upper mold mounting portion 130.

[0089] The upper mold side block 142 forms the side surface of the mold cavity C formed by the upper mold 140. Furthermore, the upper mold side block 142 is one embodiment of the side block in this application. The upper mold side block 142 is formed as a frame with an opening at a position corresponding to the resin molded article (mold cavity C). The upper mold side block 142 is provided on the lower surface of the upper mold base bottom 141. An air vent groove 142a is formed in the upper mold side block 142.

[0090] Figure 2 The vent groove 142a shown is used to expel air from the mold cavity C to the outside. The vent groove 142a is formed at an appropriate position on the lower surface of the upper mold side block 142.

[0091] The upper mold cavity block 143 forms the upper surface of the mold cavity C formed by the upper mold 140. Furthermore, the upper mold cavity block 143 is one embodiment of the mold cavity block of this application. The upper mold cavity block 143 is disposed inside the upper mold side block 142 (more specifically, inside the opening of the upper mold side block 142). The upper mold cavity block 143 is configured to be movable relative to the upper mold side block 142 in the vertical direction.

[0092] The residual material block 144 is positioned opposite to the flow hole block 112 of the lower mold 110, forming the side surface of the mold cavity C formed by the upper mold 140. On the lower surface of the residual material block 144, a groove-shaped residual material portion 144a and a flow channel portion 144b for guiding resin material to the mold cavity C are formed (see reference). Figure 3 (b)). Furthermore, Figure 2 The diagram schematically shows the situation where the through hole (flow hole) of the flow hole block 112 is connected to the mold cavity C described later via the residual material part 144a and the flow channel part 144b, so as to facilitate the understanding of the resin flow.

[0093] The upper mold support 145 restricts the upward movement of the upper mold 140 by contacting the upper mold setting part 130, thus defining the position of the upper mold 140. The upper mold support 145 is fixed to the upper surface of the upper mold base 141. Multiple upper mold supports 145 are provided at appropriate positions on the upper surface of the upper mold base 141.

[0094] The upper mold column 146 is a component that extends upward from the upper mold cavity block 143. The lower end of the upper mold column 146 is fixed to the upper part of the upper mold cavity block 143. The upper mold column 146 is configured to penetrate through the bottom 141 of the upper mold base.

[0095] also, Figure 2 The image shows the state in which the release film F is adsorbed onto the lower surface of the upper mold 140 (the surface that forms the mold cavity C).

[0096] <150 Coil Spring>

[0097] The coil spring 150 applies a downward force to the upper mold 140. Furthermore, the coil spring 150 is one embodiment of the applying force in this application. The coil spring 150 is disposed between the lower surface of the upper mold mounting portion 130 (heating plate 133) and the upper surface of the upper mold 140 (upper mold base 141). Through the applied force of the coil spring 150, a force is always applied to the upper mold 140 in a direction away from the upper mold mounting portion 130 (downward).

[0098] <Upper mold cavity adjustment mechanism 160>

[0099] The upper mold cavity adjustment mechanism 160 adjusts the position of the upper mold cavity block 143. Furthermore, the upper mold cavity adjustment mechanism 160 is one embodiment of the position adjustment mechanism of this application. The upper mold cavity adjustment mechanism 160 includes an upper mold cavity block holding member 161, an upper mold cavity block driving part 162, a limiting member 163, an upper mold elastic member 164, an upper mold first wedge member 165, an upper mold second wedge member 166, and an upper mold wedge member driving part 167.

[0100] The upper mold cavity block holding member 161 holds the upper mold cavity block 143. The upper mold cavity block holding member 161 is formed as a hollow frame when viewed from the front. The upper mold cavity block holding member 161 is formed by combining multiple components (upper and lower plate-shaped components and multiple cylindrical components connecting the upper and lower plate-shaped components, etc.). The upper mold cavity block holding member 161 is arranged to penetrate vertically through the bottom 131 of the upper mold fixing base. The upper mold cavity block holding member 161 is designed to move vertically relative to the bottom 131 of the upper mold fixing base. The upper end of the upper mold column 146 is fixed to the lower surface of the upper mold cavity block holding member 161. Thus, the upper mold cavity block holding member 161 can hold the upper mold cavity block 143 via the upper mold column 146.

[0101] The upper mold cavity block drive unit 162 moves the upper mold cavity block holding member 161 in the vertical direction (up and down direction). The upper mold cavity block drive unit 162 is formed, for example, by a servo motor or a cylinder. The upper mold cavity block drive unit 162 is provided on the upper part of the upper mold cavity block holding member 161. By driving the upper mold cavity block drive unit 162, the upper mold cavity block holding member 161 (and thus the upper mold cavity block 143) can be moved arbitrarily in the up and down direction relative to the upper mold setting part 130.

[0102] The limiting member 163 restricts the movement of the upper mold cavity block holding member 161 by contacting it. The limiting member 163 is formed by combining multiple members (plate-like members, etc.). The limiting member 163 includes an upper portion that spans left and right across the upper mold cavity block holding member 161, and a central portion disposed inside the upper mold cavity block holding member 161. The central portion of the limiting member 163 is configured to contact the lower portion (bottom) of the upper mold cavity block holding member 161 from above. By contacting the lower portion of the upper mold cavity block holding member 161 from above, the limiting member 163 restricts the upward movement of the upper mold cavity block holding member 161. This allows the depth of the mold cavity C to be defined.

[0103] The upper mold elastic member 164 applies an upward force to the restricting member 163. The upper mold elastic member 164 is formed, for example, by a compression coil spring. The upper mold elastic member 164 is disposed between the restricting member 163 and the upper mold mounting portion 132. Through the force applied by the upper mold elastic member 164, an upward force is always applied to the restricting member 163.

[0104] The upper mold first wedge member 165 and the upper mold second wedge member 166 are a pair of members with tapered portions formed on their opposing surfaces. The upper mold second wedge member 166 is disposed below the upper mold first wedge member 165. The upper mold first wedge member 165 and the upper mold second wedge member 166 are disposed inside the upper mold cavity block holding member 161. More specifically, the upper mold first wedge member 165 and the upper mold second wedge member 166 are disposed between the upper mold fixing base bottom 131 and the limiting member 163. The upper mold second wedge member 166 is fixed to the upper surface of the limiting member 163.

[0105] The upper die wedge member drive unit 167 moves the upper die first wedge member 165 in the horizontal direction (left-right direction). The upper die wedge member drive unit 167 is formed, for example, by a servo motor or cylinder. The upper die wedge member drive unit 167 is connected to the upper die first wedge member 165 via a suitable power transmission member. By driving the upper die wedge member drive unit 167, the upper die wedge member drive unit 167 can be moved arbitrarily in the left-right direction.

[0106] The position of the upper mold cavity block 143 can be adjusted by the upper mold cavity adjustment mechanism 160 configured in various ways. Specifically, when the upper mold cavity block drive unit 162 is driven to move the upper mold cavity block holding member 161 downward, a gap is formed between the limiting member 163 and the lower part of the upper mold cavity block holding member 161. That is, the limiting member 163 can be moved up and down using the gap. In this state, when the upper mold wedge member drive unit 167 is driven to move the upper mold first wedge member 165 in the left and right direction, the upper mold second wedge member 166, which is in contact with the upper mold first wedge member 165, will move up and down along the tapered portion. Moreover, the limiting member 163 also moves up and down together with the upper mold second wedge member 166. After the limiting member 163 is adjusted to the predetermined position, the upper mold cavity block drive unit 162 is driven again to move the upper mold cavity block holding member 161 upward until it contacts the limiting member 163. By moving the limiting member 163 up and down in this way, the position of the upper mold cavity block holding member 161 moving upward is restricted, and thus the position of the upper mold cavity block 143 can be adjusted.

[0107] <Air vent opening and closing mechanism 170>

[0108] Figure 2 The vent opening and closing mechanism 170 shown opens and closes the vent groove 142a connecting the mold cavity C with the outside. The vent opening and closing mechanism 170 mainly includes a vent pin 171 and a vent drive part 172.

[0109] The vent pin 171 is used to seal the vent groove 142a. The vent pin 171 is installed in a through hole in the upper mold side block 142 that communicates with the vent groove 142a, and can be moved up and down.

[0110] The vent drive unit 172 moves the vent pin 171 vertically. The vent drive unit 172 is formed, for example, by a servo motor or a cylinder. The vent drive unit 172 is connected to the vent pin 171 via a suitable power transmission member. By driving the vent drive unit 172, the vent pin 171 can be moved arbitrarily in the vertical direction. For example, by moving the vent pin 171 downward, the vent groove 142a can be closed.

[0111] <Transfer Institution 180>

[0112] The transfer mechanism 180 supplies resin material to the mold cavity C. The transfer mechanism 180 mainly includes a transfer drive unit 181, a plunger 182, and a plunger load measuring unit 183.

[0113] The transfer drive unit 181 is a drive source that moves the plunger 182 (described later) in the vertical direction (up and down direction). Furthermore, the transfer drive unit 181 is one embodiment of the drive source of this application. The transfer drive unit 181 is formed, for example, by a servo motor or a cylinder. The transfer drive unit 181 is located below the flow hole block 112 and is situated at the movable base 101 of the lower mold.

[0114] The plunger 182 injects the resin sheet T (resin material) contained in the flow block 112 into the mold cavity C. The plunger 182 is configured to move up and down (lift and lower) within the flow block 112.

[0115] The plunger load measuring unit 183 measures the force (plunger load) applied to the plunger 182. Specifically, the force applied to the plunger 182 refers to the force exerted by the transfer drive unit 181 pressing against the plunger 182. The plunger load measuring unit 183 is formed, for example, by a load cell. The plunger load measuring unit 183 is located between the transfer drive unit 181 and the plunger 182.

[0116] Furthermore, in this embodiment, no elastic member or similar pressure equalization mechanism is provided between the transfer drive unit 181 and the plunger 182 to achieve uniformity of the force (and thus the resin pressure within the mold cavity C) imparted to the resin material by each plunger 182. Therefore, the plunger 182 will move with a movement proportional to the output of the transfer drive unit 181. For example, if a cylinder with a retractable rod is used as the transfer drive unit 181, and the plunger 182 is pushed upwards from below, the plunger 182 will also move with the same amount of movement as the rod of the transfer drive unit 181. Moreover, for example, if the transfer drive unit 181 moves the plunger 182 via a suitable reduction mechanism, the plunger 182 will move with a movement amount obtained by multiplying the output of the transfer drive unit 181 by the reduction ratio of the reduction mechanism.

[0117] <Shape of residual material section 144a>

[0118] Thus, the plunger 182 moves with a movement proportional to the output of the transfer drive unit 181. Therefore, when multiple plungers 182 are used to supply resin material to the mold cavity C, it is ideal to have a structure in which the resin pressure within the mold cavity C becomes uniform. In this embodiment, a structure is formed in which resin material is supplied from multiple plungers 182 (flow holes) to a common mold cavity C, and the resin pressure becomes uniform via the mold cavity C. Other methods for uniformizing the resin pressure within the mold cavity C include, for example: Figure 4 As shown in (a), a method for forming a connecting groove 144c that connects the residual material portions 144a to each other; or as shown in (a). Figure 4 As shown in (b), in the case of multiple mold cavities C, a connecting groove 144d is further formed to connect the mold cavities C to each other (supplying resin material from multiple residual material portions 144a to a common mold cavity C). In this way, by connecting the residual material portions 144a to each other, the phenomenon of uneven pressure applied to the resin material due to the deviation of the plunger load of each plunger 182 can be suppressed.

[0119] <Mold clamping mechanism 190>

[0120] Figure 2 The clamping mechanism 190 shown raises the lower mold 110 and clamps (locks) the lower mold 110 and the upper mold 140. Furthermore, the clamping mechanism 190 is one embodiment of the clamping mechanism of this application. The clamping mechanism 190 mainly includes a fixed plate 191, a support column 192, a drive mechanism 193, and a clamping load measuring unit 194.

[0121] The fixed plate 191 is a part that is set on the ground and supports other components. On the upper part of the fixed plate 191, a lower mold 110 (lower mold setting part 100) is provided via the drive mechanism 193 described later.

[0122] The support column 192 supports the upper mold 140 (upper mold mounting part 130). The support column 192 is provided to extend upward from the fixing plate 191. At the upper part of the support column 192, the upper mold fixing base 131 of the upper mold mounting part 130 is fixed. Thus, the upper mold 140 (upper mold mounting part 130) is positioned above the lower mold 110 (lower mold mounting part 100).

[0123] The drive mechanism 193 moves the lower mold 110 (lower mold setting part 100) in the vertical direction (up and down direction). The drive mechanism 193 is formed, for example, by a drive source such as a servo motor and a suitable power transmission mechanism. The drive mechanism 193 is disposed between the fixed platen 191 and the lower mold setting part 100. By driving the drive mechanism 193, the lower mold setting part 100 can be moved arbitrarily in the vertical direction (lifting and lowering). For example, the drive mechanism 193 can be used to raise the lower mold 110 toward the upper mold 140, thereby performing mold locking. Moreover, the drive mechanism 193 can be used to lower the lower mold 110 away from the upper mold 140, thereby performing mold opening.

[0124] The clamping load measuring unit 194 measures the force (clamping load) when the lower mold 110 and the upper mold 140 are clamped by the clamping mechanism 190. The clamping load measuring unit 194 is formed, for example, by a force gauge or strain gauge. The clamping load measuring unit 194 is provided on the support column 192. The clamping load measuring unit 194 can measure the clamping load based on the load applied to the support column 192.

[0125] also, Figure 2 The image shows the state after the substrate 2 and resin sheet T are transported to the molding die, with the lower mold 110 and upper mold 140 locked (clamped).

[0126] <An overview of the manufacturing method of resin molded articles>

[0127] Hereinafter, a method for manufacturing a resin molded article using the resin molding apparatus 1 configured as described above will be described.

[0128] In this embodiment, during resin molding in the resin molding module 20, control is performed to improve the dimensional accuracy of the product (specifically, the dimensional accuracy of the thickness of the molded resin). To help understand this control, firstly, using... Figure 5 This will explain the main reasons for the uneven size of the products in the resin molding apparatus 1.

[0129] like Figure 5 As shown in (a), when the lower mold 110 is raised by the clamping mechanism 190 to clamp the lower mold 110 and the upper mold 140, the upper mold side block 142 in the upper mold 140 will contact the lower mold 110. Therefore, the clamping load generated by the clamping mechanism 190 will be mainly applied to the upper mold side block 142. When the clamping load is applied to the upper mold side block 142, the upper mold side block 142 is subjected to vertical compression and produces slight deformation, so the depth (thickness in the vertical direction) of the mold cavity C may become shallower.

[0130] Moreover, such as Figure 5As shown in (b), when resin is supplied to the mold cavity C via the plunger 182 of the transfer mechanism 180, the pressure of the resin material from the mold cavity C acts upward on the upper mold cavity block 143. Therefore, the upper mold cavity block 143 is pushed upward and produces a slight movement or deformation, so the depth of the mold cavity C may increase.

[0131] Therefore, when performing resin molding using the resin molding apparatus 1, the depth of the mold cavity C may change depending on the movement of each part. By suppressing such changes, the dimensional accuracy of the resin molded article can be improved. Hereinafter, a method for manufacturing resin molded articles that can achieve this improvement in dimensional accuracy (control mode of clamping load and plunger load) will be described.

[0132] Figure 6 In process S10, the volume of the resin sheet T and the chip 2a on the substrate 2 is measured. This will be explained in detail below.

[0133] As described above, the volume of resin sheet T is measured in the resin measuring unit 15 of the supply module 10. Any measuring machine can be used to measure the volume of resin sheet T in the resin measuring unit 15. As an example of the resin measuring unit 15, a weighing gauge that measures the weight of resin sheet T can be used. The volume of resin sheet T is calculated based on the weight of resin sheet T measured by the weighing gauge and the specific gravity of resin sheet T. Furthermore, there are no particular limitations on the method for measuring the volume of resin sheet T, and various other machines can be used. For example, various types of three-dimensional scanners, laser volume meters using laser light, etc., can be used.

[0134] Furthermore, as described above, the volume of the chip 2a on the substrate 2 is measured in the frame measuring unit 12 of the supply module 10. The frame measuring unit 12 can use any measuring machine to measure the volume of the chip 2a on the substrate 2. As an example of the frame measuring unit 12, a volumetric gauge for measuring the volume of the chip 2a on the substrate 2 can be cited. This volumetric gauge is a laser volumetric gauge that uses laser light to detect the distance to the chip 2a on the substrate 2, thereby measuring the shape (and thus the volume) of the chip 2a. Furthermore, the method for measuring the volume of the chip 2a is not particularly limited, and various other machines can be used. For example, various types of three-dimensional scanners can be used.

[0135] Next, in Figure 6 In process S20, the position of plunger 182 is calculated when the specified resin filling rate of mold cavity C is determined. This will be explained in detail below.

[0136] The control unit 18 calculates the capacity of the mold cavity C based on the pre-stored dimensions of each component (upper mold side block 142, upper mold cavity block 143, flow hole block 112, residual material block 144, etc.) and the vertical position of the upper mold cavity block 143. Furthermore, the vertical position of the upper mold cavity block 143 can be determined based on the driving amount of the upper mold wedge member drive unit 167, etc. Based on the calculated capacity of the mold cavity C and the volumes of the resin sheet T and chip 2a measured in process S10, the control unit 18 can calculate, at what position the plunger 182 rises, what percentage of the capacity of the mold cavity C has been filled with molten resin material (resin filling rate).

[0137] In this embodiment, such as Figure 5 As shown, the control unit 18 calculates the positions of the plunger 182 when the resin filling rate of the mold cavity C is 0%, 25%, 50%, 75%, and 100% (hereinafter referred to as position P0, position P25, position P50, position P75, and position P100, respectively).

[0138] Furthermore, strictly speaking, when the plunger 182 is in a position lower than position P0, the resin filling rate of the mold cavity C is 0% regardless of the position of the plunger 182. However, in this embodiment, the position where the plunger 182 rises and begins to supply resin material into the mold cavity C is defined as position P0 where the resin filling rate is 0%.

[0139] Next, in Figure 6 In process S30, the substrate 2 and the resin sheet T are respectively transported to the molding die of the resin molding module 20. Specifically, the substrate 2 is placed on the lower mold 110, and the resin sheet T is housed in the flow hole of the flow hole block 112.

[0140] Next, in Figure 6 In process S40, the lower mold 110 and the upper mold 140 are locked together by the mold-locking mechanism 190. Specifically, the lower mold 110 rises through the mold-locking mechanism 190, and the lower mold 110 contacts the upper mold 140 from below. Thus, the mold cavity C is closed. At this time, as... Figure 9 As shown in (a), the upper mold 140 rises until the upper mold support 145 contacts the upper mold setting part 130 (heating plate 133).

[0141] The following uses Figure 7 The chart shown also illustrates an example of the time-varying clamping load (units such as tonf, N, etc.), plunger position (the vertical position of plunger 182 with the initial position set to 0, units such as mm, etc.), and plunger load (units such as tonf, N, etc.) accompanying the operation of the resin molding device 1.

[0142] In process S40, by locking the lower mold 110 and the upper mold 140, thereby... Figure 7 During time t1, the clamping load rises to CL1.

[0143] Next, in Figure 6 In process S50, the plunger 182 begins to rise ( Figure 7 Time t2).

[0144] Next, in Figure 6 In process S60, filling rate control is performed. Filling rate control refers to controlling the operation of the resin molding device 1 based on the resin filling rate of the mold cavity C.

[0145] Figure 8 This represents an example of fill rate control. Figure 8 An example of controlling the clamping load and the moving speed of the plunger 182 based on the resin filling rate is shown.

[0146] Specifically, when the plunger 182 reaches position P50 (the position with 50% resin filling rate) (yes in step S61), the clamping load increases from CL1 to CL2 (step S62). Figure 7 At time t3, plunger 182 reaches position P50. From time t3 to time t4, the clamping load increases from CL1 to CL2.

[0147] Furthermore, when the plunger 182 reaches position P50 (the position where the resin filling rate is 50%) (yes in step S61), the moving speed of the plunger 182 is adjusted (step S62). Figure 7 In the middle, at time t3, the time change of plunger 182 (the tilt of the plunger position graph) becomes flat. That is, an adjustment is made to slow down the movement speed of plunger 182.

[0148] Next, when the plunger 182 reaches position P100 (the position where the resin filling rate is 100%) (yes in step S63), the plunger 182 is stopped (step S64). Figure 7 At time t5, plunger 182 reaches position P100, and the movement (ascent) of plunger 182 stops.

[0149] also, Figure 8 The example shown illustrates adjusting the clamping load and the movement speed of the plunger 182 only once, with the resin filling rate reaching 50%. However, the number of adjustments is not limited to this, and multiple adjustments can be made. For example, the clamping load can be adjusted whenever the resin filling rate reaches 25%, 50%, and 75% (when the plunger 182 reaches positions P25, P50, and P75). Furthermore, the resin filling rate used as the trigger for such adjustments is not limited to the example shown and can be arbitrarily set.

[0150] By gradually increasing the clamping load according to the resin filling rate, the depth variation of the mold cavity C can be suppressed. Specifically, with the increase of the resin filling rate, the force of the resin material pushing upwards onto the mold cavity block 143 increases, thus increasing the depth of the mold cavity C (see reference). Figure 5 (b)). Therefore, by increasing the clamping load according to the resin filling rate as described above, the depth of the mold cavity C is made shallower (see reference). Figure 5 (a) This can counteract the tendency of the cavity C to change depth (increase and decrease in depth) and suppress the change in the cavity C depth.

[0151] Furthermore, by adjusting the moving speed of the plunger 182 according to the resin filling rate, the occurrence of unfilled resin material can be suppressed. Specifically, the resin material flowing in the mold cavity C flows in parts where flow is relatively easy (e.g., the part of the substrate 2 without the chip 2a) and parts where flow is relatively difficult (e.g., the part of the substrate 2 with the chip 2a). Therefore, in order to ensure good resin flow, it is sometimes desirable to adjust the flow rate. Thus, by adjusting the moving speed of the plunger 182 according to the resin filling rate as described above, the resin flow can be improved.

[0152] Furthermore, in this embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the actual measurement of the volume of the resin sheet T and the chip 2a of the substrate 2. Therefore, regardless of the deviation in the volume of each resin sheet T, the resin filling rate of the mold cavity C can be controlled with high precision. As a result, the depth variation of the mold cavity C can be suppressed with even greater precision.

[0153] Furthermore, the appropriate clamping load value relative to the resin filling rate or the appropriate moving speed of the plunger 182 can be determined in advance using experiments or numerical analysis.

[0154] Next, in Figure 6 In process S70, cavity control is performed. Cavity control refers to adjusting the position of the upper mold cavity block 143 before the pressure adjustment control described later.

[0155] Specifically, in such Figure 9 As shown in (a), with the lower mold 110 and upper mold 140 clamped together, as Figure 9 As shown in (b), the clamping load decreases. At this time, the clamping load decreases while the upper mold cavity block holding member 161 is pressed downward using the upper mold cavity block drive unit 162. Figure 7At time t6, the clamping load decreases from CL2 to CLdown. At this time, the depth of the mold cavity C may increase due to the decrease in clamping load, but the increase in depth of the mold cavity C can be suppressed by using the upper mold cavity block drive part 162 to press the upper mold cavity block holding member 161 downward.

[0156] When the clamping load decreases, such as Figure 9 As shown in (b), the upper mold 140 moves relative to the upper mold setting portion 130 via the coil spring 150, thus forming a small gap between the limiting member 163 and the upper mold cavity block holding member 161 (see reference). Figure 9 (Part A of (b)).

[0157] By creating this gap, the movable area of ​​the second wedge member 166 of the upper mold is ensured. That is, the second wedge member 166 of the upper mold can move up and down. By driving the upper mold wedge member drive 167 in this state, the position of the upper mold cavity block 143 can be adjusted arbitrarily.

[0158] For example Figure 7 In the example shown, the upper mold cavity block 143 is lowered slightly. This makes the depth of the mold cavity C slightly shallower, thereby making it easier to apply high pressure to the resin material in the mold cavity C during the pressure adjustment control (step S80), the first final adjustment control (step S90), and the second final adjustment control (step S100) described later.

[0159] Next, in Figure 6 In process S80, pressure adjustment control is performed. Pressure adjustment control refers to adjusting the clamping load to increase the pressure applied to the resin material in the mold cavity C.

[0160] Specifically, such as Figure 7 As shown, the clamping load is increased from CLdown to CLM (the preset clamping load) (time t7). At this time, the plunger 182 stops. Therefore, the resin material filled into the mold cavity C supports the tendency of the mold cavity C to become shallower as the clamping load increases, thus suppressing the change in the depth of the mold cavity C. Moreover, the pressure applied to the resin material in the mold cavity C increases, suppressing the occurrence of unfilled resin, etc., and improving the accuracy of the resin molded product. Furthermore, in Figure 7 In this process, a situation arose where the piston load increased along with the pressure inside the mold cavity C.

[0161] Next, in Figure 6 In process S90, the first final adjustment control is performed. The first final adjustment control refers to adjusting the clamping load to a preset final clamping load.

[0162] Specifically, such as Figure 7As shown, the clamping load is increased from CLM to CLf (final clamping load) (time t8). At this point, the plunger 182 stops. Therefore, the resin material filled into the mold cavity C supports the tendency of the mold cavity C to become shallower as the clamping load increases, thus suppressing the change in the depth of the mold cavity C. Moreover, the pressure applied to the resin material in the mold cavity C increases as a result, suppressing the occurrence of unfilled resin, etc., and improving the accuracy of the resin molded product.

[0163] Next, in Figure 6 In process S100, a second final adjustment control is performed. The so-called second final adjustment control adjusts the plunger load to make it a preset final plunger load.

[0164] Specifically, such as Figure 7 As shown, the plunger 182 is moved so that the plunger load becomes TRF (time t9). Figure 7 In the example shown, the piston load at the time point (time t8) when the first final adjustment control is completed is not full Trf, so the piston 182 is raised to increase the piston load to Trf.

[0165] Furthermore, for example, if the plunger load is greater than Trf at the time point (time t8) when the first final adjustment control is completed, the plunger 182 is lowered in step S100 until the plunger load decreases to Trf. Moreover, if the plunger load is Trf at the time point (time t8) when the first final adjustment control is completed, the plunger 182 is not moved in step S100, and the plunger load is maintained at Trf. In this way, the final plunger load is adjusted to a preset value, thereby improving the precision of the resin molded article.

[0166] Furthermore, when the plunger 182 is moved as in the second final adjustment control, the pressure applied to the resin material within the mold cavity C can be adjusted efficiently. On the other hand, the depth of the mold cavity C is prone to change due to variations in the amount of resin material within it. Therefore, in this embodiment, the clamping force is increased to the final clamping force in the first final adjustment control, and simultaneously, the plunger load is increased to a value close to the final plunger load. This minimizes the amount of movement of the plunger 182 in the second final adjustment control, thereby suppressing changes in the depth of the mold cavity C.

[0167] Next, in Figure 6 In process S110, while maintaining the clamping load and the plunger load, the machine waits until the solidification time (curing time) has elapsed.

[0168] Next, in Figure 6In process S120, the plunger 182 is lowered to reduce the plunger load, and the lower mold 110 and upper mold 140 are opened by the mold locking mechanism 190.

[0169] Next, in Figure 6 In process S130, the resin-molded (resin-sealed) substrate 2 is removed from the molding die. The removed substrate 2 is then transported to the removal module 30.

[0170] As described above, by appropriately controlling the clamping load and the plunger load, the depth variation of the mold cavity C can be suppressed, thereby improving the dimensional accuracy of the resin molded product.

[0171] <Other examples of control patterns>

[0172] The following describes other examples of methods for manufacturing resin molded articles (controlling clamping load and plunger load).

[0173] Figure 10 The example shown is to represent Figure 7 Other examples of control configurations such as clamping loads are shown. Furthermore, for convenience, the following will be... Figure 7 The control mode shown is called the first control mode. Figure 10 The control configuration shown is called the second control configuration. Figure 10 The second control mode shown is the same as Figure 7 The main difference in the first control mode lies in the control content from time t6 to time t7. Figure 6 (Processes S70 and S80). The differences will be explained below.

[0174] In the first control mode, Figure 6 In the mold cavity control of process S70, the position of the upper mold cavity block 143 is adjusted to make the depth of the mold cavity C shallower. However, in the second control mode, the position of the upper mold cavity block 143 is adjusted to make the depth of the mold cavity C deeper.

[0175] That is, in the second control mode, in process S70, when the clamping load is reduced to CLdown, the upper die wedge member drive 167 is driven, causing the upper die cavity block 143 to rise slightly. As a result, the depth of the die cavity C increases slightly.

[0176] Next, in Figure 6 In step S80, pressure adjustment control is performed. Here, as described above, in the second control configuration, an adjustment is made in step S70 to increase the depth of the mold cavity C. When the depth of the mold cavity C increases, the capacity of the mold cavity C also changes (increases), thus reducing the resin filling rate from 100% to below 100%.

[0177] Therefore, the control unit 18 recalculates the relationship between the resin filling rate of the mold cavity C and the position of the plunger 182 at the stated time point. Furthermore, the calculation method is the same as in process S20.

[0178] Next, the clamping load is increased from CLdown to CLM2 (time t7). At this time, since the resin filling rate is less than 100%, the clamping load CL is increased in stages while the plunger 182 is raised to supply resin material into the mold cavity C. That is, similar to the filling rate control mentioned above (process S60), the clamping load is increased in stages when the plunger 182 reaches a position corresponding to the specified resin filling rate. Moreover, the moving speed of the plunger 182 can also be adjusted at this time. Figure 10 The example shown illustrates how the clamping load is increased in two stages, CLM1 and CLM2.

[0179] Thus, in the pressure adjustment control (process S80), the clamping load is increased in stages according to the resin filling rate, just as in the aforementioned filling rate corresponding control (process S60), thereby suppressing the depth change of the mold cavity C. However, in the pressure adjustment control, a structure that does not perform the aforementioned filling rate corresponding control can also be adopted.

[0180] Furthermore, in the aforementioned filling rate control (step S60), an example is shown of adjusting the clamping load or the moving speed of the plunger 182 according to the resin filling rate. However, as another example, the vent opening and closing mechanism 170 can also be controlled according to the resin filling rate (see reference). Figure 2 The operation of the venting pin 171 can be lowered to close the venting groove 142a when the resin filling rate reaches a specified value (when the plunger 182 reaches a position corresponding to the specified resin filling rate). Thus, the opening and closing of the venting groove 142a can be controlled with high precision based on the resin filling rate.

[0181] Furthermore, in the aforementioned filling rate corresponding control (step S60), an example is shown of using the position of the plunger 182 corresponding to each resin filling rate (0%, 25%, 50%, 75%, and 100%) as a trigger to control each part, but the control method is not limited to this. For example, control can also be performed using other positions based on these positions as triggers.

[0182] For example, when the plunger 182 is raised (when resin material is supplied to the mold cavity C), the following control can be performed: taking the position P0 of the plunger 182 with a resin filling rate of 0% as a reference, the plunger 182 reaches a position that is a predetermined distance (e.g., 5 mm) downward from position P0 as a trigger to adjust the moving speed of the plunger 182 and close the air vent groove 142a.

[0183] Thus, by using position P0 as a reference and controlling the plunger 182 to a position below it as a trigger, control based on the position of the plunger 182 before supplying resin material to the mold cavity C can be performed. Therefore, control of each part can be performed, for example, even at the moment just before or at the start of supplying resin material to the mold cavity C (the timing is independent of the resin filling rate).

[0184] As described above, the resin molding apparatus 1 of this embodiment includes: a lower mold 110 for holding a substrate 2; an upper mold 140 for forming a mold cavity C by an upper mold side block 142 (side block) and an upper mold cavity block 143 (mold cavity block), wherein the upper mold cavity block 143 (mold cavity block) is provided in a manner that allows it to be raised and lowered relative to the upper mold side block 142; a clamping mechanism 190 for clamping the lower mold 110 and the upper mold 140; a transfer mechanism 180 for supplying resin material to the mold cavity C via a plunger 182; and a control unit 18 for performing a first final adjustment control. The first final adjustment control (S90) is performed after the mold cavity C is filled by the resin material supplied from the injection mechanism 180, so that the clamping load generated by the clamping mechanism 190 becomes the final clamping load. The second final adjustment control (S100) is performed after the first final adjustment control is completed, so that the plunger load applied to the plunger 182 becomes the final plunger load by driving the plunger 182.

[0185] By configuring it in this way, high-precision resin molded articles can be manufactured. That is, by adjusting the clamping load in advance using the first adjustment control before the second final adjustment control (adjustment of the plunger load generated by the plunger 182), the amount of movement of the plunger 182 in the second final adjustment control can be suppressed. As a result, changes in the depth of the mold cavity C can be suppressed.

[0186] Furthermore, in the first final adjustment control, the control unit 18 increases the clamping load generated by the mold-locking mechanism 190.

[0187] By configuring it in this way, the movement of the plunger 182 in the second final adjustment control can be effectively suppressed. This, in turn, suppresses changes in the depth of the mold cavity C.

[0188] Furthermore, after the mold cavity C is filled with the resin material and before the first final adjustment control is performed, the control unit 18 performs a pressure adjustment control (step S80) to adjust the pressure of the resin in the mold cavity C by adjusting the clamping load generated by the clamping mechanism 190.

[0189] By constructing the resin in various ways, the occurrence of unfilled resin and other defects can be suppressed, thereby improving the precision of the resin molded product.

[0190] Furthermore, before performing the pressure adjustment control, the control unit 18 performs cavity control (process S70) to adjust the relative position of the upper mold cavity block 143 relative to the upper mold side block 142.

[0191] By constructing it in various ways, the depth of the mold cavity C in the pressure adjustment control can be arbitrarily adjusted in advance.

[0192] Furthermore, in the mold cavity control, the control unit 18 moves the upper mold cavity block 143 relative to the upper mold side block 142 while the clamping load generated by the mold locking mechanism 190 is reduced.

[0193] By configuring it in this way or that, the upper mold cavity block 143 can be easily moved by reducing the clamping load.

[0194] Furthermore, the resin molding apparatus 1 also includes: an upper mold setting part 130 (upper mold support part) that supports the upper mold 140 in a way that allows it to move freely up and down; an upper mold cavity adjustment mechanism 160 (position adjustment mechanism) provided in the upper mold setting part 130 that can adjust the position of the upper mold cavity block 143; and a coil spring 150 (applying part) that applies force to the upper mold 140 in a direction that ensures the movable area of ​​the upper mold cavity adjustment mechanism 160.

[0195] By configuring it in this way, the movable area of ​​the upper mold cavity adjustment mechanism 160 (upper mold second wedge member 166) can be ensured, thereby making it easy to adjust the position of the upper mold cavity block 143 by the upper mold cavity adjustment mechanism 160.

[0196] Furthermore, in the mold cavity control, the control unit 18 adjusts the position of the upper mold cavity block 143 by deepening the mold cavity C through the movable area secured by the disc spring 150. In the pressure adjustment control, the resin material is supplied to the mold cavity C through the injection mechanism 180 while the clamping load generated by the clamping mechanism 190 is increased.

[0197] By constructing the mold cavity C, which is temporarily filled with resin material, resin material is supplied again, thereby suppressing the occurrence of unfilled resin and improving the precision of the resin molded product.

[0198] Furthermore, the transfer mechanism 180 includes a transfer drive unit 181 (drive source) that drives the plunger 182 to move the plunger 182 by a movement proportional to the output of the transfer drive unit 181.

[0199] By configuring it in this way, the clamping load or plunger load can be adjusted with higher precision. That is, without the elastic member or the like being placed between the transfer drive unit 181 and the plunger 182, the plunger 182 can be moved in a manner that completely follows the output of the transfer drive unit 181. Therefore, the position of the plunger 182 (and thus the resin fill rate) can be controlled with high precision. Moreover, the plunger load generated by the plunger 182 can also be adjusted precisely.

[0200] Furthermore, the resin molding apparatus 1 is used to manufacture the resin molded article in the method of this embodiment.

[0201] By using various methods, high-precision resin molded products can be manufactured.

[0202] Furthermore, the method for manufacturing a resin molded article according to this embodiment includes: a clamping process (process S40), in which a lower mold 110 and an upper mold 140 are clamped by a mold locking mechanism 190, wherein the lower mold 110 holds a substrate 2, and the upper mold 140 forms a mold cavity C by an upper mold side block 142 and an upper mold cavity block 143, wherein the upper mold cavity block 143 is provided in a manner that allows it to be raised and lowered relative to the upper mold side block 142; and a resin material supply process (processes S50 and S60), in which resin material is supplied to the substrate 2 by a plunger 182. The mold cavity C is supplied with resin material; a first final adjustment step (step S90) is performed, after the mold cavity C is filled with the resin material, to adjust the clamping load generated by the clamping mechanism 190 to become the final clamping load; and a second final adjustment step (step S100) is performed, after the clamping load generated by the clamping mechanism 190 becomes the final clamping load, to drive the plunger 182 to become the final plunger load.

[0203] By configuring it in this way, high-precision resin molded articles can be manufactured. That is, by adjusting the clamping load in advance using the first adjustment control before the second final adjustment control (adjustment of the plunger load generated by the plunger 182), the amount of movement of the plunger 182 in the second final adjustment control can be suppressed. As a result, changes in the depth of the mold cavity C can be suppressed.

[0204] Furthermore, as described above, the resin molding apparatus 1 of this embodiment includes: a lower mold 110 for mounting a substrate 2; an upper mold 140 for forming a mold cavity C by an upper mold side block 142 (side block) and an upper mold cavity block 143 (mold cavity block), wherein the upper mold cavity block 143 (mold cavity block) is provided in a manner that allows it to be raised and lowered relative to the upper mold side block 142; a clamping mechanism 190 for clamping the lower mold 110 and the upper mold 140; a transfer mechanism 180 for supplying resin material to the mold cavity C via a plunger 182; and a control unit 18 for performing filling rate corresponding control (step S60, step S80 in the second control mode) based on the relationship between the resin filling rate of the mold cavity C calculated based on the volume of the chip 2a disposed on the substrate 2 and the volume of the resin material (resin sheet T) and the position of the plunger 182. The filling rate corresponding control is based on the plunger 182 reaching a position corresponding to a predetermined resin filling rate to control actions related to resin molding.

[0205] By employing various configurations, high-precision resin molded articles can be manufactured. Specifically, the resin filling rate can be precisely controlled based on the volume of the resin sheet T and the chip 2a of the substrate 2, thus enabling control of each part based on the resin filling rate. This, in turn, improves the precision of the resin molded articles.

[0206] Furthermore, the control unit 18 performs clamping force adjustment control (process S60) in the filling rate corresponding control. The clamping force adjustment control is based on the plunger 182 reaching the position corresponding to the specified resin filling rate to adjust the clamping load generated by the mold clamping mechanism 190.

[0207] By adjusting the clamping load through various configurations, the depth variation of the mold cavity C corresponding to the resin filling rate can be suppressed, thereby improving the precision of the resin molded product.

[0208] Furthermore, in the clamping force adjustment control, the control unit 18 causes the clamping load generated by the clamping mechanism 190 to increase in stages.

[0209] By constructing the mold in this way or that, the tendency for the depth of the mold cavity C to increase with the increase of the resin filling rate can be suppressed by increasing the clamping load.

[0210] Furthermore, in the filling rate corresponding control, the control unit 18 performs plunger speed adjustment control (step S60). The plunger speed adjustment control is based on the plunger 182 reaching the position corresponding to the specified resin filling rate to adjust the moving speed of the plunger 182.

[0211] By using various configurations, the flow rate of the resin material can be adjusted according to the resin filling rate, thereby improving the precision of the resin molded product.

[0212] Furthermore, the control unit 18 performs pore switching control (step S60) in the filling rate corresponding control. The pore switching control is to switch the opening and closing of the pore groove 142a connected to the mold cavity C when the plunger 182 reaches the position corresponding to the specified resin filling rate.

[0213] By configuring the pore groove 142a in various ways, the flow of the resin material can be adjusted with high precision according to the resin filling rate, thereby improving the precision of the resin molded product.

[0214] Furthermore, the resin molding apparatus 1 also includes: a frame measuring unit 12 (chip volume measuring unit) for measuring the volume of the chip 2a disposed on the substrate 2; a resin measuring unit 15 (resin volume measuring unit) for measuring the volume of the resin material (resin sheet T); and a calculation unit (control unit 18) for calculating the relationship between the resin filling rate and the position of the plunger 182 based on the measurement results of the frame measuring unit 12 and the resin measuring unit 15.

[0215] By configuring it in this way, the position of the plunger 182 (resin filling rate) can be determined based on the actual measured volume of the chip 2a and the resin material. Therefore, even if there is a deviation in the volume of the resin material (resin sheet T) or the chip 2a, high-precision control can be achieved.

[0216] Furthermore, the resin molding apparatus 1 also includes: an upper mold setting part 130 (upper mold support part) that supports the upper mold 140 in a way that allows it to move freely up and down; an upper mold cavity adjustment mechanism 160 (position adjustment mechanism) provided in the upper mold setting part 130 that can adjust the position of the upper mold cavity block 143; and a coil spring 150 (applying part) that applies force to the upper mold 140 in a direction that ensures the movable area of ​​the upper mold cavity adjustment mechanism 160. The control part 18 performs mold cavity control and pressure adjustment control, and performs the filling rate corresponding control in the pressure adjustment control. The mold cavity control is performed by adjusting the relative position of the upper mold cavity block 143 relative to the upper mold side block 142 by deepening the mold cavity C by using the movable area ensured by the coil spring 150 after the mold cavity C is filled with the resin material. The pressure adjustment control is performed by adjusting the clamping load generated by the clamping mechanism 190 after the mold cavity control to increase the resin pressure in the mold cavity C.

[0217] By configuring it in this way, pressure adjustment control can be performed on each part based on the resin filling rate, thus improving the precision of resin molded products.

[0218] Furthermore, the resin molding apparatus 1 is used to manufacture the resin molded article in the method of this embodiment.

[0219] By using various methods, high-precision resin molded products can be manufactured.

[0220] Furthermore, the method for manufacturing a resin molded article according to this embodiment includes: a chip volume measurement step (step S10), which measures the volume of a chip 2a disposed on a substrate 2; a resin volume measurement step (step S10), which measures the volume of a resin material; a plunger position calculation step (step S20), which calculates the relationship between the resin filling rate of the mold cavity C and the position of the plunger 182 based on the measured volume of the chip 2a and the volume of the resin material; and a filling rate corresponding control step (step S60, step S80 in the second control mode), which controls the actions related to resin molding when the plunger 182 reaches the position corresponding to the specified resin filling rate.

[0221] By employing various configurations, high-precision resin molded articles can be manufactured. Specifically, the resin filling rate can be precisely controlled based on the volume of the resin sheet T and the chip 2a of the substrate 2, thus enabling control of each part based on the resin filling rate. This, in turn, improves the precision of the resin molded articles.

[0222] The embodiments of the present invention have been described above, but the present invention is not limited to the described embodiments, and appropriate modifications can be made within the scope of the technical concept of the invention as described in the claims.

[0223] For example, the constituent elements (supply module 10, etc.) used in the resin molding apparatus 1 of the above embodiment are examples that can be appropriately installed, removed, or replaced. For example, the number of resin molding modules 20 can be changed. Moreover, the structure or operation of the constituent elements (supply module 10, etc.) used in the resin molding apparatus 1 of this embodiment are examples that can be appropriately modified.

[0224] Furthermore, while the described embodiment shows an example using sheet-like resin material (resin sheet T), the present invention is not limited thereto. That is, not only sheet-like resin materials can be used, but also resin materials in any form, such as granular, powdered, or liquid forms.

[0225] Furthermore, in the described embodiment, an example is shown in which a residual material portion 144a and a flow channel portion 144b are formed in the residual material block 144, but for example, a portion of the residual material portion 144a and the flow channel portion 144b may also be formed in the flow hole block 112. Moreover, in the described embodiment, an example is shown in which the flow hole block 112 includes a plurality of through holes (flow holes), but there may also be only one through hole.

[0226] Furthermore, the control configuration illustrated in the above embodiment is an example, and the detailed control content (e.g., the target value of clamping load, plunger load, or control timing) can be arbitrarily changed. For example, in the above embodiment, an example is shown of executing the second final adjustment control (step S100) after the first final adjustment control (step S90) is completed, but the second final adjustment control may also begin before the first final adjustment control is completed.

[0227] Furthermore, in the described embodiment, a coil spring 150 is exemplified as the force-applying component to the upper mold 140, but the present invention is not limited to this, and various other structures may be employed. For example, various elastic members or actuators such as cylinders may also be used as the force-applying component.

[0228] Furthermore, the embodiment described herein illustrates an example of measuring the volume of the chip 2a, etc., of the substrate 2 in the frame measuring section 12 and resin measuring section 15 included in the resin molding apparatus 1, but the present invention is not limited thereto. For example, the resin molding apparatus 1 may also use a substrate 2 or resin sheet T whose volume has been measured externally to perform resin molding. In this case, the resin molding apparatus 1 does not need to include the frame measuring section 12 or the resin measuring section 15.

[0229] Furthermore, in the embodiments described, as an example of filling rate corresponding control, clamping force adjustment control for adjusting clamping load, plunger speed adjustment control for adjusting the moving speed of plunger 182, and pore switching control for switching the opening and closing of pore groove 142a are illustrated. However, the present invention is not limited to these, and any action related to resin molding can be controlled.

Claims

1. A resin molding apparatus, comprising: The chip volume measurement unit measures the volume of a chip disposed on a substrate that is to be resin molded. The resin volume measuring unit measures the volume of the resin material used in the resin molding of the substrate; and The lower mold holds the substrate. The upper mold is formed by side blocks and a cavity block, wherein the cavity block is designed to be able to move up and down relative to the side blocks; A clamping mechanism clamps the lower mold and the upper mold; The injection mechanism supplies resin material to the mold cavity via a plunger; The calculation unit calculates the relationship between the resin filling rate of the mold cavity and the position of the plunger based on the measurement results of the chip volume measurement unit and the resin volume measurement unit. as well as The control unit, when performing resin molding using the substrate and the resin material, uses the relationship between the resin filling rate of the mold cavity and the position of the plunger calculated by the calculation unit to perform filling rate corresponding control. The filling rate corresponding control is to control the actions related to resin molding when the plunger reaches the position corresponding to the specified resin filling rate.

2. The resin molding apparatus according to claim 1, wherein... The control unit performs clamping force adjustment control in the filling rate corresponding control. The clamping force adjustment control is based on the plunger reaching the position corresponding to the specified resin filling rate to adjust the clamping load generated by the clamping mechanism.

3. The resin molding apparatus according to claim 2, wherein... In the clamping force adjustment control, the control unit causes the clamping load generated by the clamping mechanism to increase in stages.

4. The resin molding apparatus according to any one of claims 1 to 3, wherein In the filling rate corresponding control, the control unit performs plunger speed adjustment control, which adjusts the plunger's moving speed based on the plunger reaching the position corresponding to the specified resin filling rate.

5. The resin molding apparatus according to any one of claims 1 to 3, wherein The control unit performs pore switching control in the filling rate corresponding control. The pore switching control is based on the plunger reaching the position corresponding to the specified resin filling rate to switch the opening and closing of the pore groove connected to the mold cavity.

6. The resin molding apparatus according to any one of claims 1 to 3, further comprising: The upper mold support section supports the upper mold in a way that allows it to move freely up and down; A position adjustment mechanism is provided on the upper mold support part, which can adjust the position of the mold cavity block; as well as The force is applied to the upper mold in a direction that ensures the movable area of ​​the position adjustment mechanism. The control unit performs: Cavity control involves adjusting the relative position of the cavity block with respect to the side block by deepening the cavity through the movable area ensured by the feeding portion after filling the cavity with the resin material; and Pressure adjustment control, after the mold cavity control, adjusts the clamping load generated by the clamping mechanism to increase the resin pressure within the mold cavity. In the pressure adjustment control, the filling rate is controlled accordingly.

7. A method for manufacturing a resin molded article, comprising manufacturing the resin molded article using a resin molding apparatus as described in any one of claims 1 to 6.

8. A method for manufacturing a resin molded article, comprising: The chip volume measurement process measures the volume of the chip disposed on the substrate. The resin volume measurement process measures the volume of the resin material. The plunger position calculation process calculates the relationship between the resin filling rate of the mold cavity and the plunger position based on the volume of the chip and the volume of the resin material measured in the chip volume measurement process and the resin volume measurement process. as well as The filling rate control process controls the actions related to resin molding when the substrate and the resin material are used for resin molding, taking the plunger reaching the position corresponding to the specified resin filling rate as the trigger.

Images