The main sheet material for the evaporation chamber, the evaporation chamber itself, and electronic equipment.

Abstract

The main body sheet for the evaporation chamber of the present invention includes a first main body surface, a second main body surface disposed on the opposite side of the first main body surface, and a through space extending from the first main body surface to the second main body surface. The through space extends along a first direction when viewed from above. When viewed in a cross section perpendicular to the first direction, the through space has a first opening on the first main body surface and a second opening on the second main body surface. The second opening extends from the area overlapping with the first opening when viewed from above to a position overlapping with the first groove when viewed from above.

Description

Technical Field

[0001] This invention relates to a main sheet for an evaporation chamber, an evaporation chamber, and electronic equipment. Background Technology

[0002] Electronic devices such as portable terminals or tablets use electronic components that generate heat. Examples of such components include central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors. These components are cooled by heat dissipation devices such as heat pipes (see, for example, Patent Documents 1 and 2). In recent years, there has been a demand for thinner heat dissipation devices in order to make electronic devices thinner. As a heat dissipation device, evaporation chambers that can be thinner than heat pipes are being developed. In evaporation chambers, the encapsulated working fluid absorbs heat from the electronic components and diffuses it inside, thereby efficiently cooling the electronic components.

[0003] More specifically, the working fluid in the evaporation chamber is heated by the electronic device at the part closest to it (evaporation section). The heated working fluid evaporates into working vapor. This working vapor diffuses away from the evaporation section within a vapor flow path formed in the evaporation chamber. The diffused working vapor is cooled and condensed, becoming the working fluid again. A liquid flow path, which functions as a capillary structure (core), is provided in the evaporation chamber. The working fluid flows through the liquid flow path and is transported towards the evaporation section. Then, the working fluid transported to the evaporation section is heated and evaporates again. In this way, the working fluid repeatedly undergoes phase change (i.e., evaporation and condensation) while flowing back within the evaporation chamber, thereby diffusing heat from the electronic device. As a result, the heat dissipation efficiency of the evaporation chamber is improved.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2008-82698

[0007] Patent Document 2: Japanese Patent Application Publication No. 2016-017702 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] The purpose of this invention is to provide a main sheet for an evaporator chamber, an evaporator chamber, and an electronic device that can improve cooling efficiency.

[0010] Methods for solving problems

[0011] As a first solution, the present invention provides a main sheet for an evaporation chamber, wherein the evaporation chamber is sealed with a working fluid, wherein...

[0012] The main sheet material for the evaporation chamber includes:

[0013] First main surface;

[0014] The second main surface is located on the side opposite to the first main surface;

[0015] A through space extending from the first main surface to the second main surface; and

[0016] A plurality of first grooves extending in the first direction are disposed on the first main body surface and communicate with the through space.

[0017] When viewed from above, the through space extends in the first direction.

[0018] When viewed in a cross section perpendicular to the first direction, the through space has: a first opening on the first main surface; and a second opening on the second main surface, the second opening extending from the area overlapping the first opening when viewed from above to the position overlapping the first groove when viewed from above.

[0019] Alternatively, in the main sheet used for the evaporation chamber in the first solution described above, it could also be,

[0020] When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess defining the first opening, disposed on the first main body surface; and a second spatial recess defining the second opening, disposed on the second main body surface and communicating with the first spatial recess.

[0021] The first spatial recess includes a pair of first wall surfaces that are curved into a concave shape.

[0022] The second spatial recess includes a pair of second wall surfaces that are curved into a concave shape.

[0023] The corresponding first wall surface and the second wall surface are connected by wall protrusions that project inward toward the through space.

[0024] When viewed in a cross section perpendicular to the first direction, the second spatial recess includes a flat surface that connects the corresponding second wall surface and the wall surface protrusion.

[0025] Alternatively, in the main sheet used for the evaporation chamber in the first solution described above, it could also be,

[0026] When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess defining the first opening, disposed on the first main body surface; and a second spatial recess defining the second opening, disposed on the second main body surface and communicating with the first spatial recess.

[0027] The first spatial recess includes a pair of first wall surfaces that are curved into a concave shape.

[0028] The second spatial recess includes a pair of second wall surfaces that are curved into a concave shape.

[0029] The corresponding first wall surface and the second wall surface are connected by wall protrusions that project inward toward the through space.

[0030] When viewed in a cross section perpendicular to the first direction, the second spatial recess includes a convex surface connecting the corresponding second wall surfaces and the wall surface protrusions.

[0031] The convex surface includes a spatial convex portion that extends in the first direction and protrudes toward the second body surface.

[0032] Furthermore, in the main sheet used for the evaporation chamber in the first solution described above, it is also possible that...

[0033] The convex surface includes a plurality of spatial convexities that are separated from each other.

[0034] Alternatively, in the main sheet used for the evaporation chamber in the first solution described above, it could also be,

[0035] When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess defining the first opening, disposed on the first main body surface; and a second spatial recess defining the second opening, disposed on the second main body surface and communicating with the first spatial recess.

[0036] The first spatial recess includes a pair of first wall surfaces that are curved into a convex shape.

[0037] The second spatial recess includes a pair of second walls that are curved into a concave shape.

[0038] Alternatively, in the main sheet used for the evaporation chamber in the first solution described above, it could also be,

[0039] When viewed in a cross section perpendicular to the first direction, the second opening extends on both sides relative to the first opening from the area that overlaps with the first opening when viewed from above to the position that overlaps with the first groove when viewed from above.

[0040] Alternatively, in the main sheet used for the evaporation chamber in the first solution described above, it could also be,

[0041] The main sheet material for the evaporation chamber includes:

[0042] A frame portion defining the through space, which forms a frame shape when viewed from above, extends from the first main body surface to the second main body surface; and

[0043] An island portion is disposed inside the frame portion, extends in the first direction, and extends from the first main body surface to the second main body surface.

[0044] The first opening and the second opening are located between the frame portion and the island portion.

[0045] The first groove is located on the first main body surface of the island portion.

[0046] When viewed in a cross section perpendicular to the first direction, the second opening extends from the area overlapping with the first opening when viewed from above to the position overlapping with the first groove located on the island when viewed from above, and extends further outward from the frame portion than the first opening.

[0047] Furthermore, as a second solution, the present invention provides a main sheet for an evaporation chamber, wherein the evaporation chamber is sealed with a working fluid, wherein...

[0048] The main sheet material for the evaporation chamber includes:

[0049] First main surface;

[0050] The second main body surface is disposed on the side opposite to the first main body surface; and

[0051] A through space extends from the first main surface to the second main surface.

[0052] When viewed from above, the through space extends in the first direction.

[0053] When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess disposed on the first main body surface; and a second spatial recess disposed on the second main body surface and communicating with the first spatial recess.

[0054] The first spatial recess includes a pair of first wall surfaces.

[0055] The second spatial recess includes a pair of second wall surfaces.

[0056] The first wall surface of one of the first spatial recesses is connected to the corresponding second wall surface of the second spatial recess through a protrusion of the first wall surface.

[0057] The first wall protrusion protrudes towards the inside of the through space.

[0058] The first wall protrusion is offset relative to the midpoint between the first main body surface and the second main body surface in the normal direction of the first main body surface.

[0059] The first wall surface of the first space recess, located on the opposite side of the first wall protrusion, and the corresponding second wall surface of the second space recess, are continuously concave from the first wall surface to the second wall surface.

[0060] Alternatively, in the main sheet used for the evaporation chamber in the second solution described above, it could also be,

[0061] The through space has: a first opening defined by the first spatial recess, located on the first main body surface; and a second opening defined by the second spatial recess, located on the second main body surface.

[0062] When viewed in a cross section perpendicular to the first direction, the center of the first opening is offset relative to the center of the second opening.

[0063] Furthermore, as a third solution, the present invention provides a main sheet for an evaporation chamber, wherein the evaporation chamber is sealed with a working fluid, wherein...

[0064] The main sheet material for the evaporation chamber includes:

[0065] First main surface;

[0066] The second main body surface is disposed on the side opposite to the first main body surface; and

[0067] A through space extends from the first main surface to the second main surface.

[0068] When viewed from above, the through space extends in the first direction.

[0069] When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess disposed on the first main body surface; and a second spatial recess disposed on the second main body surface, which communicates with the first spatial recess.

[0070] The first spatial recess includes a pair of first wall surfaces.

[0071] The second spatial recess includes a pair of second wall surfaces.

[0072] The first wall surface of one of the first spatial recesses is connected to the corresponding second wall surface of the second spatial recess through a protrusion of the first wall surface.

[0073] The first wall protrusion protrudes towards the inside of the through space.

[0074] The first wall protrusion is offset relative to the midpoint between the first main body surface and the second main body surface in the normal direction of the first main body surface.

[0075] The through space has: a first opening defined by the first spatial recess, located on the first main body surface; and a second opening defined by the second spatial recess, located on the second main body surface.

[0076] When viewed in a cross section perpendicular to the first direction, the center of the first opening is offset relative to the center of the second opening.

[0077] Alternatively, in the main sheet used for the evaporation chamber in the third solution described above, it could also be,

[0078] The main sheet used in the evaporation chamber also includes:

[0079] The frame section, which appears as a frame when viewed from above; and

[0080] An island portion, disposed inside the frame portion and extending in the first direction, defines the through space between the island portion and the frame portion.

[0081] When the width of the island is set to w1, the offset between the center of the first opening and the center of the second opening is 0.05mm to (0.8×w1)mm.

[0082] Furthermore, in the main sheet used for the evaporation chamber in the third solution described above, it is also possible that...

[0083] The main sheet for the evaporation chamber also includes a plurality of first grooves disposed on the first main surface and communicating with the through space.

[0084] The first wall protrusion is positioned closer to the first main body surface than the intermediate position.

[0085] Alternatively, in the main sheet used for the evaporation chamber in the third solution described above, it could also be,

[0086] The first wall surface of the first spatial recess, located on the opposite side to the first wall surface protrusion, and the corresponding second wall surface of the second spatial recess are connected by the second wall surface protrusion.

[0087] The second wall protrusion protrudes towards the inside of the through space.

[0088] The second wall protrusion is offset in the normal direction relative to the midpoint between the first main surface and the second main surface.

[0089] Furthermore, in the main sheet used for the evaporation chamber in the third solution described above, it is also possible that...

[0090] The second wall protrusion is positioned closer to the first main body surface than the intermediate position.

[0091] Furthermore, as a fourth solution, the present invention provides a main sheet for an evaporation chamber, wherein the evaporation chamber is sealed with a working fluid, wherein...

[0092] The main sheet material for the evaporation chamber includes:

[0093] First main surface;

[0094] The second main body surface is disposed on the side opposite to the first main body surface; and

[0095] A through space extends from the first main surface to the second main surface.

[0096] When viewed from above, the through space extends in the first direction.

[0097] When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess disposed on the first main body surface; a second spatial recess disposed on the second main body surface, which communicates with the first spatial recess; and a third spatial recess disposed on the second main body surface, which is located on both sides of the second spatial recess and communicates with the second spatial recess.

[0098] The second spatial recess includes a pair of second wall surfaces.

[0099] The third spatial recess includes a third wall surface.

[0100] Each of the second wall surfaces of the second spatial recess is connected to the third wall surface of the corresponding third spatial recess through a third wall surface protrusion.

[0101] The third wall protrusion protrudes toward the second main body surface.

[0102] Alternatively, in the main sheet used for the evaporation chamber in the fourth solution described above, it could also be,

[0103] The first spatial recess includes a pair of first wall surfaces.

[0104] The first wall surface of one of the first spatial recesses is connected to the corresponding second wall surface of the second spatial recess through a protrusion of the first wall surface.

[0105] The first wall protrusion protrudes towards the inside of the through space.

[0106] The first wall protrusion is offset relative to the midpoint between the first main surface and the second main surface in the normal direction of the first main surface.

[0107] Furthermore, in the main sheet used for the evaporation chamber in the fourth solution described above, it is also possible that...

[0108] The main sheet material for the evaporation chamber also has a plurality of first grooves, which are disposed on the first main surface and communicate with the through space.

[0109] The first wall protrusion is positioned closer to the first main body surface than the intermediate position.

[0110] Furthermore, in the main sheet used for the evaporation chamber in the fourth solution described above, it is also possible that...

[0111] The first wall surface of the first spatial recess, located on the opposite side to the first wall surface protrusion, and the corresponding second wall surface of the second spatial recess are connected by the second wall surface protrusion.

[0112] The second wall protrusion protrudes towards the inside of the through space.

[0113] The second wall protrusion is offset in the normal direction relative to the midpoint between the first main surface and the second main surface.

[0114] Furthermore, in the main sheet used for the evaporation chamber in the fourth solution described above, it is also possible that...

[0115] The second wall protrusion is positioned closer to the first main body surface than the intermediate position.

[0116] Furthermore, in the main sheet used for the evaporation chamber in the fourth solution described above, it is also possible that...

[0117] The first wall surface of the first space recess, located on the opposite side of the first wall protrusion, and the corresponding second wall surface of the second space recess, extend from the first wall to the second wall surface in a continuous concave shape.

[0118] Furthermore, in the main sheet used for the evaporation chamber in the fourth solution described above, it is also possible that...

[0119] The through space has: a first opening located on the first main surface and defined by the first spatial recess; and a second opening located on the second main surface and defined by the second spatial recess.

[0120] When viewed in a cross section perpendicular to the first direction, the center of the first opening is offset relative to the center of the second opening.

[0121] Alternatively, in the main sheet used for the evaporation chamber in the fourth solution described above, it could also be,

[0122] The main sheet used in the evaporation chamber also includes:

[0123] The frame section, which appears as a frame when viewed from above; and

[0124] An island portion, located inside the frame portion and extending in the first direction, defines the through space between the island portion and the frame portion.

[0125] When the width of the island is set to w1, the offset between the center of the first opening and the center of the second opening is 0.05mm to (0.8×w1)mm.

[0126] Furthermore, as a fifth solution, the present invention provides a main body sheet for an evaporation chamber, wherein...

[0127] The main sheet material for the evaporation chamber includes:

[0128] First main surface;

[0129] The second main surface is located on the side opposite to the first main surface;

[0130] A through space, which penetrates the first main surface and the second main surface; and

[0131] Multiple first slots are disposed on the second main body surface and communicate with the through space.

[0132] The through space has: a curved first wall surface located on the side of the first main body surface; and a curved second wall surface located on the side of the second main body surface.

[0133] The first wall surface and the second wall surface meet at a protrusion formed in a manner that extends inward toward the through space.

[0134] The protrusion is located closer to the second main surface than the midpoint between the first main surface and the second main surface.

[0135] The first wall surface has a first wall surface end on the side of the first main body surface.

[0136] When viewed from above, the end of the first wall surface is located inside the through space, closer to the protrusion.

[0137] Alternatively, in the main sheet used for the evaporation chamber in the fifth solution described above, it could also be,

[0138] The second wall surface has a second wall surface end on the side of the second main body surface.

[0139] When the distance between the end of the second wall surface and the protrusion in the width direction of the through space is set as Lp, and the distance between the end of the second wall surface and the end of the first wall surface in the width direction of the through space is set as Ls, the distance Ls is more than 1.05 times and less than 2 times the distance Lp.

[0140] Alternatively, in the main sheet used for the evaporation chamber in the fifth solution described above, it could also be,

[0141] Multiple first slots are arranged side by side.

[0142] A row of protrusions is provided between adjacent first grooves.

[0143] Each of the columns of protrusions has multiple protrusions.

[0144] The second wall surface has a second wall surface end on the side of the second main body surface.

[0145] When the distance between the end of the second wall and the end of the first wall is set to Ls, the distance Ls is more than 1.1 times and less than 10 times the width of the protrusion.

[0146] Furthermore, as a sixth solution, the present invention provides an evaporation chamber comprising:

[0147] First sheet material;

[0148] Second sheet; and

[0149] The main sheet for the evaporation chamber of each of the first to sixth solutions, located between the first sheet and the second sheet.

[0150] Furthermore, as a seventh solution, the present invention provides an evaporation chamber, wherein the evaporation chamber is sealed with a working fluid, wherein...

[0151] The evaporation chamber includes:

[0152] First sheet material;

[0153] Second sheet; and

[0154] The main sheet for the evaporation chamber is located between the first sheet and the second sheet.

[0155] The main sheet material has the following characteristics:

[0156] First main surface;

[0157] The second main surface is located on the side opposite to the first main surface;

[0158] A through space, which penetrates the first main surface and the second main surface; and

[0159] Multiple first slots are disposed on the second main body surface and communicate with the through space.

[0160] The through space has: a curved first wall surface located on the side of the first main body surface; and a curved second wall surface located on the side of the second main body surface.

[0161] The first wall surface and the second wall surface meet at a protrusion formed in a manner that extends inward toward the through space.

[0162] The protrusion is located closer to the second main surface than the midpoint between the first main surface and the second main surface.

[0163] The first wall surface has a first wall surface end on the side of the first main body surface.

[0164] When viewed from above, the end of the first wall surface is located inside the through space, closer to the protrusion.

[0165] Furthermore, in the evaporation chamber of the seventh solution described above, it is also possible to have...

[0166] The second wall surface has a second wall surface end on the side of the second main body surface.

[0167] When the distance between the end of the second wall surface and the protrusion in the width direction of the through space is set as Lp, and the distance between the end of the second wall surface and the end of the first wall surface is set as Ls, the distance Ls is more than 1.05 times and less than 2 times the distance Lp.

[0168] Furthermore, in the evaporation chamber of the seventh solution described above, it is also possible to have...

[0169] Multiple first slots are arranged side by side.

[0170] A row of protrusions is provided between adjacent first grooves.

[0171] Each of the columns of protrusions has multiple protrusions.

[0172] The second wall surface has a second wall surface end on the side of the second main body surface.

[0173] When the distance between the end of the second wall and the end of the first wall is set to Ls, the distance Ls is more than 1.1 times and less than 10 times the width of the protrusion.

[0174] Furthermore, as an eighth solution, the present invention provides an electronic device, wherein,

[0175] The electronic device includes:

[0176] case;

[0177] Electronic devices, housed within the housing; and

[0178] The evaporation chamber of the sixth or seventh solution is in thermal contact with the electronic device.

[0179] The effects of the invention

[0180] According to the present invention, cooling efficiency can be improved. Attached Figure Description

[0181] Figure 1 This is a schematic perspective view illustrating the electronic device according to the first embodiment of the present invention.

[0182] Figure 2 This is a top view showing the evaporation chamber according to the first embodiment of the present invention.

[0183] Figure 3 It is shown Figure 2 A sectional view of the evaporation chamber along line AA.

[0184] Figure 4 yes Figure 3 Top view of the lower sheet.

[0185] Figure 5 yes Figure 3 A bottom view of the upper sheet.

[0186] Figure 6 yes Figure 3 A top view of the core sheet.

[0187] Figure 7 yes Figure 3 A bottom view of the core sheet.

[0188] Figure 8A This shows the second vapor passage. Figure 3 A partially enlarged sectional view.

[0189] Figure 8B This is a partially enlarged cross-sectional view showing an example of the upper opening.

[0190] Figure 8C This is a partially enlarged cross-sectional view showing an example of the upper opening.

[0191] Figure 8D This is a partially enlarged cross-sectional view showing an example of the upper opening.

[0192] Figure 8E This is a partially enlarged cross-sectional view showing an example of the upper opening.

[0193] Figure 8F This is a schematic diagram used to illustrate a flat surface.

[0194] Figure 9 yes Figure 7 A partially enlarged top view of the liquid flow path shown.

[0195] Figure 10 This shows the first vapor passage. Figure 3 A partially enlarged sectional view.

[0196] Figure 11 It is shown Figure 8A A partially enlarged cross-sectional view of a modified example of the evaporation chamber shown.

[0197] Figure 12 It is shown Figure 8A A partially enlarged cross-sectional view of a modified example of the evaporation chamber shown.

[0198] Figure 13 It is shown Figure 8A A partially enlarged cross-sectional view of a modified example of the evaporation chamber shown.

[0199] Figure 14 It is shown Figure 8A A partially enlarged cross-sectional view of a modified example of the evaporation chamber shown.

[0200] Figure 15A yes Figure 6 The example shown is a modified core sheet, and is... Figure 6 A magnified top view of a portion of the view.

[0201] Figure 15B It is shown Figure 15A A partially enlarged cross-sectional view of the second vapor passage in the second region shown.

[0202] Figure 16 This is a cross-sectional view showing the evaporation chamber according to the second embodiment of the present invention, and is related to... Figure 2 The AA line section is equivalent to a cross-sectional view.

[0203] Figure 17 yes Figure 16 A partially enlarged sectional view.

[0204] Figure 18 This is a diagram illustrating the preparation process of the core sheet in the manufacturing method of the evaporation chamber according to the second embodiment.

[0205] Figure 19 This is a diagram illustrating the resist formation process in the manufacturing method of the evaporation chamber according to the second embodiment.

[0206] Figure 20 This is a diagram illustrating the process of constructing the resist in the manufacturing method of the evaporation chamber according to the second embodiment.

[0207] Figure 21 This is a diagram illustrating the etching process in the manufacturing method of the evaporation chamber according to the second embodiment.

[0208] Figure 22 This is a diagram illustrating the resist removal process in the manufacturing method of the evaporation chamber according to the second embodiment.

[0209] Figure 23 This is a diagram illustrating the joining process of the manufacturing method of the evaporation chamber in the second embodiment.

[0210] Figure 24 It is shown Figure 17 A partially enlarged cross-sectional view of a modified example of the evaporation chamber shown.

[0211] Figure 25 It is shown Figure 17 A partially enlarged cross-sectional view of another variation of the evaporation chamber shown.

[0212] Figure 26 This is a partially enlarged cross-sectional view showing the evaporation chamber according to the third embodiment of the present invention.

[0213] Figure 27 This is a diagram illustrating the first resist formation step in the manufacturing method of the evaporation chamber according to the third embodiment.

[0214] Figure 28 This is a diagram illustrating the first patterning step of the first resist in the manufacturing method of the evaporation chamber of the third embodiment.

[0215] Figure 29 This is a diagram illustrating the first etching step in the manufacturing method of the evaporation chamber according to the third embodiment.

[0216] Figure 30 This is a diagram illustrating the first resist removal step in the manufacturing method of the evaporation chamber according to the third embodiment.

[0217] Figure 31 This is a diagram illustrating the second resist formation step in the manufacturing method of the evaporation chamber according to the third embodiment.

[0218] Figure 32 This is a diagram illustrating the second patterning step of the second resist in the manufacturing method of the evaporation chamber of the third embodiment.

[0219] Figure 33This is a diagram illustrating the second etching step in the manufacturing method of the evaporation chamber according to the third embodiment.

[0220] Figure 34 This is a diagram illustrating the second resist removal step in the manufacturing method of the evaporation chamber according to the third embodiment.

[0221] Figure 35 It is shown Figure 26 A partially enlarged cross-sectional view of a modified example of the evaporation chamber shown.

[0222] Figure 36 This is a top view showing the evaporation chamber according to the fourth embodiment of the present invention.

[0223] Figure 37 It is shown Figure 36 A BB-line sectional view of the evaporation chamber.

[0224] Figure 38 yes Figure 37 Top view of the lower sheet.

[0225] Figure 39 yes Figure 37 A bottom view of the upper sheet.

[0226] Figure 40 yes Figure 37 A top view of the core sheet.

[0227] Figure 41 yes Figure 37 A bottom view of the core sheet.

[0228] Figure 42 yes Figure 37 A partially enlarged sectional view.

[0229] Figure 43 yes Figure 40 A partially enlarged top view of the liquid flow path shown.

[0230] Figure 44 This is a diagram illustrating the manufacturing method of the evaporation chamber according to the fourth embodiment.

[0231] Figure 45 This is a diagram illustrating the manufacturing method of the evaporation chamber according to the fourth embodiment.

[0232] Figure 46 This is a diagram illustrating the manufacturing method of the evaporation chamber according to the fourth embodiment.

[0233] Figure 47 This is a partially enlarged cross-sectional view showing the flow of the working fluid in the steam flow path section of the fourth embodiment. Detailed Implementation

[0234] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, in the accompanying drawings, for ease of illustration and understanding, the scale and aspect ratios have been appropriately altered and exaggerated relative to the actual object.

[0235] The geometric conditions, physical properties, terms used to define the degree of geometric conditions or physical properties, and numerical values ​​representing geometric conditions or physical properties used in this specification can be interpreted without being strictly bound by any particular meaning. Furthermore, these geometric conditions, physical properties, terms, and numerical values ​​can be interpreted to include a range of degrees to which the same function can be expected. Examples of terms used to define geometric conditions include "length," "angle," "shape," and "configuration." Examples of terms used to define geometric conditions include "parallel," "orthogonal," and "identical." Furthermore, to make the drawings clear, the shapes of multiple parts that can be expected to perform the same function are regularly depicted. However, they are not limited to a strict meaning; within the range to which the function can be expected, the shapes of these parts can differ from one another. In the drawings, for convenience, the boundary lines representing the mating surfaces of components are shown only as straight lines, but they are not limited to strictly straight lines; the shape of these boundary lines is arbitrary within the range to which the desired mating performance can be expected.

[0236] (First Embodiment)

[0237] use Figures 1 to 15B The main sheet for the evaporation chamber, the evaporation chamber, and the electronic device according to the first embodiment of the present invention will be described. In this embodiment, the evaporation chamber 1, together with the heat-generating electronic device D, is housed in the housing H of the electronic device E, and serves as a device for cooling the electronic device D. Examples of the electronic device E include mobile terminals such as portable terminals and tablet terminals. Examples of the electronic device D include central processing units (CPUs), light-emitting diodes (LEDs), and power semiconductors. The electronic device D is sometimes also referred to as the cooling device.

[0238] Here, we will first describe the electronic device E equipped with the evaporation chamber 1 of this embodiment, taking a tablet terminal as an example. Figure 1 As shown, the electronic device E includes a housing H, electronic components D housed within the housing H, and an evaporation chamber 1. Figure 1In the illustrated electronic device E, a touch panel display TD is provided on the front surface of the housing H. An evaporation chamber 1 is housed within the housing H and is arranged in thermal contact with the electronic device D. The evaporation chamber 1 receives heat generated by the electronic device D when the electronic device E is in use. The heat received by the evaporation chamber 1 is released to the outside of the evaporation chamber 1 via working fluids 2a and 2b, described later. In this way, the electronic device D is effectively cooled. If the electronic device E is a tablet terminal, the electronic device D may also be a central processing unit, etc.

[0239] Next, the evaporation chamber 1 of this embodiment will be described. For example... Figure 2 and Figure 3 As shown, the evaporation chamber 1 has a sealed space 3 containing working fluids 2a and 2b. The working fluids 2a and 2b within the sealed space 3 undergo repeated phase changes, thereby effectively cooling the electronic device D of the aforementioned electronic device E. Examples of working fluids 2a and 2b include pure water, ethanol, methanol, and acetone, as well as mixtures thereof. Furthermore, working fluids 2a and 2b may also exhibit freeze-expansion properties. That is, working fluids 2a and 2b may be fluids that expand upon freezing. Examples of working fluids 2a and 2b exhibiting freeze-expansion properties include pure water and aqueous solutions of pure water with additives such as alcohol.

[0240] like Figure 2 and Figure 3 As shown, the evaporation chamber 1 includes a lower sheet 10, an upper sheet 20, a core sheet 30 for the evaporation chamber, a vapor flow path 50, and a liquid flow path 60. The core sheet 30 is located between the lower sheet 10 and the upper sheet 20. Hereinafter, the core sheet 30 for the evaporation chamber will be simply referred to as the core sheet 30. In the evaporation chamber 1 of this embodiment, the lower sheet 10, the core sheet 30, and the upper sheet 20 are stacked sequentially.

[0241] Evaporation chamber 1 is formed as a generally thin flat plate. The planar shape of evaporation chamber 1 is arbitrary and can also be... Figure 2 The evaporation chamber 1 is a rectangle as shown. For example, its planar shape can be a rectangle with one side measuring 1 cm and the other 3 cm, or a square with one side measuring 15 cm. The planar dimensions of the evaporation chamber 1 are arbitrary. In this embodiment, as an example, an example will be described where the planar shape of the evaporation chamber 1 is a rectangle with the X direction as its longer side (described later). In this case, as shown... Figures 4-7 As shown, the lower sheet 10, the upper sheet 20, and the core sheet 30 can also have the same planar shape as the evaporation chamber 1. Furthermore, the planar shape of the evaporation chamber 1 is not limited to a rectangular shape, but can also be any shape such as a circle, an ellipse, an L-shape, or a T-shape.

[0242] like Figure 2As shown, the evaporation chamber 1 has an evaporation zone SR for evaporating working fluids 2a and 2b, and a condensation zone CR for condensing working fluids 2a and 2b. Working vapor 2a is a working fluid in a gaseous state, and working liquid 2b is a working fluid in a liquid state.

[0243] The evaporation region SR is the area that overlaps with the electronic device D when viewed from above, and it is the area where the electronic device D is mounted. The evaporation region SR can also be positioned anywhere within the evaporation chamber 1. In this embodiment, it is located on one side of the evaporation chamber 1 in the X direction ( Figure 2 An evaporation zone SR is formed on the left side of the evaporation chamber 1. Heat from the electronic device D is transferred to the evaporation zone SR, and through this heat, the working fluid 2b evaporates in the evaporation zone SR. The heat from the electronic device D can be transferred not only to the area overlapping with the electronic device D when viewed from above, but also to the periphery of that area. Therefore, the evaporation zone SR includes the area overlapping with the electronic device D when viewed from above and the area surrounding it. Here, "viewed from above" can also refer to the state viewed from a direction orthogonal to the surface of the evaporation chamber 1 that receives heat from the electronic device D and the surface that releases the received heat. The surface that receives heat corresponds to the first lower sheet surface 10a of the lower sheet 10, which will be described later. The surface that releases heat corresponds to the second upper sheet surface 20b of the upper sheet 20, which will be described later. For example, as Figure 2 As shown, viewing the state of evaporation chamber 1 from above or from below is equivalent to looking down.

[0244] The condensation region CR is the area that does not overlap with the electronic device D when viewed from above, and is mainly the area where the working vapor 2a of the working fluid releases heat and condenses. The condensation region CR can be the area surrounding the evaporation region SR. In the condensation region CR, heat from the working vapor 2a is released to the upper sheet 20, and the working vapor 2a is cooled and condensed in the condensation region CR.

[0245] Furthermore, when the evaporation chamber 1 is located inside a mobile terminal, the vertical relationship may not be valid depending on the orientation of the mobile terminal. However, in this embodiment, for convenience, the sheet that receives heat from the electronic device D will be referred to as the lower sheet 10, and the sheet that releases the received heat will be referred to as the upper sheet 20. Therefore, the following description will be based on the state where the lower sheet 10 is positioned on the lower side and the upper sheet 20 is positioned on the upper side.

[0246] like Figure 3 As shown, the lower sheet 10 is an example of a first sheet. The lower sheet 10 has a first lower sheet surface 10a disposed on the side opposite to the core sheet 30 and a second lower sheet surface 10b disposed on the side opposite to the first lower sheet surface 10a. The second lower sheet surface 10b is located on the core sheet 30 side. In this embodiment, the second lower sheet surface 10b is in contact with the first main body surface 30a of the core sheet 30, which will be described later. Figure 4 As shown, alignment holes 12 can also be provided at the four corners of the lower sheet 10. The aforementioned electronic device D can also be mounted on the first lower sheet surface 10a.

[0247] like Figure 3 As shown, the upper sheet 20 is an example of a second sheet. The upper sheet 20 has a first upper sheet surface 20a disposed on the side of the core sheet 30 and a second upper sheet surface 20b disposed on the side opposite to the first upper sheet surface 20a. In this embodiment, the first upper sheet surface 20a is in contact with the second body surface 30b of the core sheet 30, which will be described later. Figure 5 As shown, alignment holes 22 can also be provided at the four corners of the upper sheet 20. A housing component Ha, which forms part of the aforementioned housing H, can also be mounted on the second upper sheet surface 20b. The entire second upper sheet surface 20b can also be covered by the housing component Ha.

[0248] like Figure 3 As shown, the core sheet 30 is an example of a main sheet. The core sheet 30 has a first main surface 30a and a second main surface 30b disposed on the side opposite to the first main surface 30a. The first main surface 30a is disposed on the side of the lower sheet 10, and the lower sheet 10 is disposed on the first main surface 30a. The second main surface 30b is disposed on the side of the upper sheet 20, and the upper sheet 20 is disposed on the second main surface 30b.

[0249] The second lower sheet surface 10b of the lower sheet 10 and the first main body surface 30a of the core sheet 30 can be permanently bonded to each other through diffusion bonding. Similarly, the first upper sheet surface 20a of the upper sheet 20 and the second main body surface 30b of the core sheet 30 can also be permanently bonded to each other through diffusion bonding. Alternatively, the lower sheet 10, upper sheet 20, and core sheet 30 can be permanently bonded, but not through diffusion bonding, by means of brazing or other methods. Furthermore, the term "permanently bonded" is not strictly defined and can also be used to mean that the bond between the lower sheet 10 and the core sheet 30 can be maintained to a degree that maintains the airtightness of the sealed space 3 when the evaporation chamber 1 is operating. Additionally, the term "permanently bonded" can also be used to mean that the bond is maintained to a degree that maintains the bond between the upper sheet 20 and the core sheet 30.

[0250] like Figure 3 , Figure 6 and Figure 7As shown, the core sheet 30 of this embodiment has: a frame portion 32 that is rectangular in shape when viewed from above; and a plurality of island portions 33 disposed within the frame portion 32. The frame portion 32 and each island portion 33 extend from the first main body surface 30a to the second main body surface 30b. The frame portion 32 and the island portions 33 are portions of the core sheet 30 that are not etched in the etching process described later, resulting in material residue on the core sheet 30. In this embodiment, the frame portion 32 is rectangular in shape when viewed from above. A vapor flow path portion 50 is defined on the inner side of the frame portion 32. The vapor flow path portion 50 is disposed on the inner side of the frame portion 32 and around each island portion 33. Working steam 2a flows around each island portion 33. The vapor flow path portion 50 is defined between the frame portion 32 and the island portions 33, and is defined between a pair of adjacent island portions 33.

[0251] In this embodiment, the island portion 33 may also extend elongatedly in the X direction when viewed from above. The planar shape of the island portion 33 may also be an elongated rectangular shape. The island portions 33 may also be equally spaced apart in the Y direction, thus being arranged parallel to each other. The working steam 2a flows around each island portion 33 and is transported towards the condensation region CR. This suppresses any obstruction to the flow of the working steam 2a. In this embodiment, the X direction is an example of the first direction, equivalent to... Figure 6 The left and right directions in the diagram. The Y direction is an example of the second direction, equivalent to... Figure 6 The vertical direction within the island. The X direction is taken as the long side of island 33, and the Y direction is taken as the direction orthogonal to the X direction when viewed from above. The directions orthogonal to both the X and Y directions are taken as the Z direction.

[0252] The width w1 of island 33 (refer to) Figure 8A For example, it can be 100μm to 3000μm. Here, the width w1 of the island 33 is the dimension of the island 33 in the Y direction. If described in more detail using the wall protrusions 57 and 58 described later, the width w1 of the island 33 refers to the distance in the Y direction between the end of the first wall protrusion 57 and the end of the second wall protrusion 58 that defines the island 33.

[0253] The frame portion 32 and each island portion 33 are diffusely bonded to the lower sheet 10 and to the upper sheet 20. This improves the mechanical strength of the evaporation chamber 1. The lower sidewalls 53a and 53b of the lower vapor flow path recess 53 and the upper sidewalls 54a and 54b of the upper vapor flow path recess 54 (described later) form the sidewalls of the island portion 33. The first main body surface 30a and the second main body surface 30b of the core sheet 30 can also be flattened throughout the frame portion 32 and each island portion 33.

[0254] The vapor flow path 50 is an example of a through-space. The vapor flow path 50 can be provided on the first main body surface 30a of the core sheet 30. The vapor flow path 50 can be a flow path primarily for the passage of working vapor 2a. Working fluid 2b can also pass through the vapor flow path 50. In this embodiment, the vapor flow path 50 extends from the first main body surface 30a to the second main body surface 30b, penetrating the core sheet 30. The vapor flow path 50 can be covered by the lower sheet 10 on the first main body surface 30a, and can be covered by the upper sheet 20 on the second main body surface 30b.

[0255] like Figure 6 and Figure 7 As shown, the vapor flow path 50 in this embodiment has a first vapor passage 51 and a plurality of second vapor passages 52. The first vapor passage 51 includes a portion extending in the X direction and a portion extending in the Y direction when viewed from above, and the first vapor passage 51 is formed between the frame portion 32 and the island portion 33. The first vapor passage 51 is continuously formed inside the frame portion 32 and outside the island portion 33. The planar shape of the first vapor passage 51 is rectangular. The second vapor passages 52 extend in the X direction when viewed from above and are formed between adjacent island portions 33. The planar shape of the second vapor passages 52 is an elongated rectangular shape. The vapor flow path 50 is divided into the first vapor passage 51 and the plurality of second vapor passages 52 by the plurality of island portions 33.

[0256] like Figure 8A As shown, the first vapor passage 51 and the second vapor passage 52 extend from the first main body surface 30a of the core sheet 30 to the second main body surface 30b. The first vapor passage 51 and the second vapor passage 52 each have a lower vapor flow path recess 53, an upper vapor flow path recess 54, a lower opening 55, and an upper opening 56. The lower vapor flow path recess 53 is an example of a first spatial recess and is located on the first main body surface 30a. The upper vapor flow path recess 54 is an example of a second spatial recess and is located on the second main body surface 30b. The lower vapor flow path recess 53 communicates with the upper vapor flow path recess 54, thereby forming the first vapor passage 51 and the second vapor passage 52 of the vapor flow path portion 50 to extend from the first main body surface 30a to the second main body surface 30b. The lower opening 55 is an example of a first opening and is located on the first main body surface 30a. The lower opening 55 is defined in the first main body surface 30a by the lower vapor flow path recess 53. The upper opening 56 is an example of the second opening and is located in the second main body surface 30b. The upper opening 56 is defined in the second main body surface 30b by the upper vapor flow path recess 54.

[0257] Regarding the lower vapor flow path recess 53, it is formed in a concave shape on the first main body surface 30a of the core sheet 30 by etching from the first main body surface 30a during the etching process described later. Thus, as... Figure 8A As shown, the lower vapor flow path recess 53 has a pair of lower sidewalls 53a and 53b formed in a curved shape. Lower sidewalls 53a and 53b are examples of the first wall. Lower sidewall 53a is... Figure 8A The left side wall, the lower side wall 53b is Figure 8A The right-side wall surface. Lower wall surfaces 53a and 53b are formed to extend from the lower opening 55 toward the second main body surface 30b. Lower wall surfaces 53a and 53b may also be concave and curved. Each lower wall surface 53a and 53b may also define a lower vapor flow path recess 53, and... Figure 8A The cross-section shown is curved in such a way that it approaches the opposing lower sidewalls 53a and 53b as it approaches the second main body surface 30b. Such a lower vapor flow path recess 53 constitutes a part of the first vapor passage 51 and a part of the second vapor passage 52. The lower vapor flow path recess 53 may also constitute the lower half of the first vapor passage 51 and the lower half of the second vapor passage 52.

[0258] The width w2 of the lower opening 55 can be, for example, 100 μm to 3000 μm. The width w2 of the lower opening 55 refers to the width dimension of the lower vapor flow path recess 53 in the first main body surface 30a. The width w2 corresponds to the Y-direction dimension of the portion extending in the X direction in the first vapor passage 51, and also corresponds to the Y-direction dimension of the second vapor passage 52. In this embodiment, the Y-direction dimension between the lower sidewalls 53a and 53b of the lower vapor flow path recess 53 gradually increases from the second main body surface 30b toward the first main body surface 30a, reaching its maximum on the first main body surface 30a. Therefore, the width w2 becomes the maximum value of the Y-direction dimension between the lower sidewalls 53a and 53b. However, the Y-direction dimension between the lower sidewalls 53a and 53b may not be maximum on the first main body surface 30a. For example, the position where the Y-direction dimension between the lower sidewall 53a and the lower sidewall 53b is the largest can also be located closer to the second main body surface 30b than the first main body surface 30a. The width w2 is also equivalent to the X-direction dimension of the portion extending along the Y-direction in the first vapor passage 51.

[0259] Regarding the upper vapor flow path recess 54, it is formed in a concave shape in the second main body surface 30b of the core sheet 30 by etching in the etching process described later. Figure 8A As shown, the upper vapor flow path recess 54 has a pair of upper sidewalls 54a and 54b formed in a curved shape. Upper sidewalls 54a and 54b are an example of the second wall. Upper sidewall 54a is... Figure 8A The left side wall, the upper side wall 54b is Figure 8AThe right-side wall surface. Upper wall surfaces 54a and 54b are formed such that they extend from the upper opening 56 toward the first main body surface 30a. Upper wall surfaces 54a and 54b may also be concave and curved. Each upper wall surface 54a and 54b may also define an upper vapor flow path recess 54, and... Figure 8A The cross-section shown is curved in such a way that it approaches the opposing upper sidewalls 54a and 54b as it approaches the first main body surface 30a. Such an upper vapor flow path recess 54 constitutes part of the first vapor passage 51 and part of the second vapor passage 52. The upper vapor flow path recess 54 may also constitute the upper half of the first vapor passage 51 and the upper half of the second vapor passage 52.

[0260] The width w3 of the upper opening 56 can also be larger than the width w2 of the lower opening 55 described above. For example, the width w3 can be 160 μm to 5800 μm. The width w3 of the upper opening 56 refers to the width dimension of the upper vapor flow path recess 54 in the second main body surface 30b. The width w3 corresponds to the Y-direction dimension of the portion extending in the X direction in the first vapor passage 51 and the Y-direction dimension of the second vapor passage 52. In this embodiment, the Y-direction dimension between the upper wall surface 54a and the upper wall surface 54b gradually increases from the first main body surface 30a toward the second main body surface 30b, reaching its maximum in the second main body surface 30b. Therefore, the width w3 becomes the maximum value of the Y-direction dimension between the upper wall surface 54a and the upper wall surface 54b. However, the Y-direction dimension between the upper wall surface 54a and the upper wall surface 54b may not be the maximum in the second main body surface 30b. For example, the position where the Y-direction dimension between the upper sidewall 54a and the upper sidewall 54b is the largest can also be located closer to the first main body surface 30a than the second main body surface 30b. The width w3 also corresponds to the X-direction dimension of the portion extending along the Y-direction in the first vapor passage 51.

[0261] like Figure 8A As shown, when viewed from above, the center 55a of the lower opening 55 may overlap with the center 56a of the upper opening 56. Alternatively, the center 55a of the lower opening 55 may be offset relative to the center 56a of the upper opening 56.

[0262] The lower opening 55 can also be defined by a pair of lower opening side edges 55b extending along the X direction. The lower opening side edges 55b are an example of the first opening side edge. The center 55a of the aforementioned lower opening 55 can also be the midpoint of the pair of lower opening side edges 55b when viewed from a section perpendicular to the X direction. Figure 8A In the middle, the lower opening side edge 55b is represented as the intersection of the first main body surface 30a and the lower side wall surfaces 53a and 53b, and the midpoint of these intersections can be the center 55a of the lower opening 55.

[0263] The upper opening 56 can also be defined by a pair of upper opening side edges 56b extending along the X direction. The upper opening side edges 56b are an example of the second opening side edge. The center 56a of the aforementioned upper opening 56 can also be the midpoint of the pair of upper opening side edges 56b when viewed from a section perpendicular to the X direction. Figure 8A In the middle, the upper opening side edge 56b is represented as the intersection of the second main body surface 30b and the upper side wall surfaces 54a and 54b, and the midpoint of these intersections can be the center 56a of the upper opening 56.

[0264] As described above, the width w3 of the upper opening 56 can also be greater than the width w2 of the lower opening 55. The upper opening 56 can also extend from the region 56c that overlaps with the lower opening 55 in a top view to the position that overlaps with the main flow channel 61 described later in a top view. Therefore, the flow path cross-sectional area of ​​the upper vapor flow path recess 54 can be increased compared to the lower vapor flow path recess 53. Here, as... Figure 8A As shown, the intersection point of the straight line extending in the Z direction through the second wall protrusion 58 and intersecting with the second lower sheet surface 10b is designated as P1. The area divided by intersection point P1, lower opening side edge 55b, lower wall surface 53b, and second wall protrusion 58 is designated as the lower vapor flow path region. The intersection point of the straight line extending in the Z direction through the second wall protrusion 58 and intersecting with the first upper sheet surface 20a is designated as P2. The area divided by intersection point P2, upper opening side edge 56b, upper wall surface 54b, and second wall protrusion 58 is designated as the upper vapor flow path region. The upper vapor flow path region has a larger flow path cross-sectional area than the lower vapor flow path region; therefore, the capillary effect of the upper vapor flow path region is smaller than that of the lower vapor flow path region. Therefore, the upper vapor flow path region can reduce the flow resistance of the working vapor 2a in the upper vapor flow path region, allowing the working vapor 2a to diffuse easily and improving heat dissipation efficiency. The same applies to the region defined by the lower wall surface 53a and the upper wall surface 54a. On the other hand, island portions 33 that join with the upper sheet 20 are formed between adjacent upper openings 56 along the Y direction. This ensures the mechanical strength of the evaporation chamber 1. Thus, in the evaporation chamber 1 of this embodiment, limited space is effectively utilized while ensuring mechanical strength and improving heat dissipation efficiency.

[0265] A portion of the upper opening 56 may also overlap with a portion of the main channel 61 adjacent to the steam passages 51 and 52 when viewed from above. A portion of the upper opening 56 may overlap with multiple main channels 61 when viewed from above. The number of main channels 61 overlapping with the upper opening 56 is arbitrary.

[0266] Reference Figures 8B to 8EAn example of the positional relationship between the upper opening 56 and the main flow channel 61 will be described. Here, the main flow channel 61 adjacent to the second vapor passage 52 formed by one upper opening 56 will be referred to as main flow channel 61P, and the other main flow channel 61 adjacent to main flow channel 61P will be referred to as main flow channel 61Q. Main flow channel 61Q is located further away from the center 55a of the lower opening 55 than main flow channel 61P. In other words, main flow channel 61Q is located further away from the center 56a of the upper opening 56 than main flow channel 61P. In this embodiment, when viewed from above, the center 55a of the lower opening 55 overlaps with the center 56a of the upper opening 56. Hereinafter, the positional relationship between the upper opening 56 and the main flow channel 61 will be described using the center 55a of the lower opening 55.

[0267] The main channel grooves 61P and 61Q include a first main channel groove side edge 61a and a second main channel groove side edge 61b extending along the X direction. Figures 8B to 8E In this diagram, the first main channel side edge 61a and the second main channel side edge 61B are represented as the intersection of the first main body surface 30a and the wall surface 62 described later. The first main channel side edge 61a is located closer to the center 55a of the lower opening 55 than the second main channel side edge 61b, and the second main channel side edge 61b is located further away from the center 55a of the lower opening 55 than the first main channel side edge 61a.

[0268] For example, such as Figure 8B As shown, the upper opening 56 can extend in the Y direction to a position that overlaps with a portion of the main channel 61P. In this case, in the top view, the side edge 56b of the upper opening can be closer to the center 55a of the lower opening 55 than the second main channel side edge 61b of the main channel 61P.

[0269] Or, such as Figure 8C As shown, the upper opening 56 may also extend in the Y direction to a position that overlaps entirely with the main channel 61P adjacent to the second vapor passage 52. In this case, in the top view, the upper opening side edge 56b may be located at a position overlapping with the second main channel side edge 61b of the main channel 61P, or it may be located further away from the center 55a of the lower opening 55 than the second main channel side edge 61b of the main channel 61P. Alternatively, in the top view, the upper opening side edge 56b may be located at a position overlapping with the first main channel side edge 61a of the main channel 61Q.

[0270] Or, such as Figure 8DAs shown, the upper opening 56 can extend in the Y direction to a position that overlaps with a portion of the main channel 61Q. In this case, in the top view, the upper opening side edge 56b can be located further away from the center 55a of the lower opening 55 than the first main channel side edge 61a of the main channel 61Q, or it can be located closer to the center 55a of the lower opening 55 than the second main channel side edge 61b of the main channel 61Q.

[0271] Or, such as Figure 8E As shown, the upper opening 56 can extend in the Y direction to a position that overlaps with the entire main channel 61Q. In this case, in the top view, the upper opening side edge 56b can be located at a position that overlaps with the second main channel side edge 61b of the main channel 61Q, or it can be located further away from the center 55a of the lower opening 55 than the second main channel side edge 61b of the main channel 61Q.

[0272] The above describes an example of the positional relationship between the upper opening 56 and the main flow channel 61 adjacent to the second steam passage 52 formed by the upper opening 56. The positional relationship between the upper opening 56 and the main flow channel 61 adjacent to the first steam passage 51 formed by the upper opening 56 is similar.

[0273] like Figure 10 As shown, when viewed in a cross-section perpendicular to the X direction, the upper opening 56 in the first steam passage 51 can also extend from the region 56c overlapping with the lower opening 55 in a top view towards a position further outward than the lower opening 55 from the frame portion 32. The lower opening 55 and the upper opening 56 in the first steam passage 51 are located between the frame portion 32 and the island portion 33 adjacent to the frame portion 32. Here, the upper opening 56 in the portion of the first steam passage 51 extending in the X direction will be described. Similarly, in the portion of the first steam passage 51 extending in the Y direction, the width of the upper opening 56 can be larger than the width of the lower opening 55.

[0274] More specifically, the aforementioned pair of lower opening side edges 55b are composed of a first lower opening side edge 55ba and a second lower opening side edge 55bb. The first lower opening side edge 55ba defines the boundary between the frame portion 32 and the lower opening portion 55, and the second lower opening side edge 55bb defines the boundary between the island portion 33 and the lower opening portion 55. Similarly, the aforementioned pair of upper opening side edges 56b are composed of a first upper opening side edge 56ba and a second upper opening side edge 56bb. The first upper opening side edge 56ba defines the boundary between the frame portion 32 and the upper opening portion 56, and the second upper opening side edge 56bb defines the boundary between the island portion 33 and the upper opening portion 56.

[0275] The first upper opening side edge 56ba is located on the outer side of the frame portion 32, which is closer to the frame portion 32 than the first lower opening side edge 55ba. Figure 10 In the example shown, the first upper opening side edge 56ba is located to the left of the first lower opening side edge 55ba.

[0276] When viewed in a cross-section perpendicular to the X direction, the upper opening 56 in the first vapor passage 51 extends from the region 56c, which overlaps with the lower opening 55 when viewed from above, to the position where it overlaps with the main flow channel 61 located in the island 33 when viewed from above. The side edge 56bb of the second upper opening is located at the position where it overlaps with the liquid flow path 60 located in the island 33. Figure 10 In the example shown, the second upper opening edge 56bb is located to the right of the second lower opening edge 55bb.

[0277] like Figure 8A As shown, when viewed in a cross section perpendicular to the X direction, the upper opening 56 in the second steam passage 52 can also extend from the region 56c that overlaps with the lower opening 55 when viewed from above to the position that overlaps with the main flow channel 61 located on the island 33 when viewed from above. The upper opening 56 in the second steam passage 52 can also extend on both sides relative to the lower opening 55 from the region 56c that overlaps with the lower opening 55 when viewed from above to the position that overlaps with the main flow channel 61 when viewed from above.

[0278] To explain more specifically, the second steam passage 52 is located between the adjacent first island portion 33P and the second island portion 33Q. The lower opening 55 and the upper opening 56 are located between the first island portion 33P and the second island portion 33Q.

[0279] When viewed in a section perpendicular to the X direction, the upper opening 56 in the second vapor passage 52 can extend from a position overlapping with the main flow channel 61 located in the first island 33P when viewed from above, to a position overlapping with the main flow channel 61 located in the second island 33Q when viewed from above. The side edges 56b of each upper opening are located at positions overlapping with the liquid flow path portions 60 of the corresponding islands 33P and 33Q. Figure 8A In the example shown, the upper opening edge 56b on the left is positioned to the left of the lower opening edge 55b on the left. The upper opening edge 56b on the right is positioned to the right of the lower opening edge 55b on the right.

[0280] like Figure 8AAs shown, w12 represents the distance from each wall protrusion 57, 58 to the corresponding upper opening edge 56b. w12 can be, for example, 30 μm to 1400 μm. Distance w12 is the planar distance from the first wall protrusion 57 to the left upper opening edge 56b when viewed from a section perpendicular to the X direction, and refers to the planar distance from the second wall protrusion 58 to the right upper opening edge 56b. Distance w12 corresponds to the dimension in the Y direction.

[0281] like Figure 8A As shown, the width of the island portion 33 in the second main body surface 30b is represented by w13. w13 can be, for example, 30 μm to 2900 μm. The width w13 refers to the distance from the upper opening edge 56b of one upper opening portion 56 to the upper opening edge 56b of the other upper opening portion 56 when viewed from a cross section perpendicular to the X direction. The width w13 corresponds to the dimension in the Y direction.

[0282] like Figure 8A As shown, the lower wall surfaces 53a and 53b of the lower vapor flow path recess 53 are connected to the corresponding upper wall surfaces 54a and 54b of the upper vapor flow path recess 54 via wall protrusions 57 and 58. More specifically, the lower wall surface 53a of the lower vapor flow path recess 53 is connected to the corresponding upper wall surface 54a of the upper vapor flow path recess 54 via a first wall protrusion 57. The lower wall surface 53b of the lower vapor flow path recess 53 is connected to the corresponding upper wall surface 54b of the upper vapor flow path recess 54 via a second wall protrusion 58. The first wall protrusion 57 is... Figure 8A The left wall protrusion, the second wall protrusion 58 is Figure 8A The protrusion on the right side of the wall.

[0283] like Figure 8A As shown, the first wall protrusion 57 may also protrude toward the inside of the steam passages 51 and 52. The second wall protrusion 58 may also protrude toward the inside of the steam passages 51 and 52. In this embodiment, a pair of wall protrusions 57 and 58 protrude in a direction along the first main body surface 30a and the second main body surface 30b, facing each other.

[0284] In this embodiment, the first wall protrusion 57 is disposed in the Z direction at a midpoint MP between the first main body surface 30a and the second main body surface 30b. However, it is not limited to this; the first wall protrusion 57 may also be disposed offset relative to the midpoint MP. Figure 8A In the example shown, the first wall protrusion 57 is positioned in the Z direction at the same location as the second wall protrusion 58. However, this is not a limitation; the first wall protrusion 57 may also be positioned offset relative to the second wall protrusion 58 in the Z direction.

[0285] Similarly, in this embodiment, the second wall protrusion 58 is disposed in the Z direction at an intermediate position MP between the first main body surface 30a and the second main body surface 30b. However, it is not limited to this; the second wall protrusion 58 may also be disposed offset relative to the intermediate position MP. Figure 8A In the example shown, the second wall protrusion 58 is positioned in the Z direction at the same location as the first wall protrusion 57. However, this is not a limitation; the second wall protrusion 58 may also be positioned offset relative to the first wall protrusion 57 in the Z direction.

[0286] A through section 34 is defined by a pair of wall protrusions 57 and 58, in which the lower vapor flow path recess 53 and the upper vapor flow path recess 54 communicate with each other. In this embodiment, the planar shape of the through section 34 in the first vapor passage 51 is a rectangular frame shape, similar to the first vapor passage 51. The planar shape of the through section 34 in the second vapor passage 52 is an elongated rectangular shape, similar to the second vapor passage 52. The width w4 of such a through section 34 (refer to...) Figure 8A For example, it can be 200μm to 500μm. Here, the width w4 of the through portion 34 corresponds to the gap between adjacent island portions 33 in the Y direction. More specifically, the width w4 refers to the distance in the Y direction between the end of the first wall protrusion 57 and the end of the second wall protrusion 58 that define the through portion 34.

[0287] When viewed in a section perpendicular to the X direction, the upper vapor flow path recess 54 may also include two flat surfaces 59a and 59b. Each flat surface 59a and 59b connects the corresponding upper wall surfaces 54a and 54b to the wall protrusions 57 and 58. Flat surface 59a is... Figure 8A The left side of the face, flat surface 59b is Figure 8AThe right side of the surface. More specifically, the upper sidewall 54a is connected to the first wall protrusion 57 via a flat surface 59a, which is formed between the upper sidewall 54a and the first wall protrusion 57. The upper sidewall 54b is connected to the second wall protrusion 58 via a flat surface 59b, which is formed between the upper sidewall 54b and the second wall protrusion 58. When viewed in a section perpendicular to the X direction, the flat surfaces 59a and 59b may also be along the second main body surface 30b. In this case, the flat surfaces 59a and 59b may be parallel to either the second main body surface 30b or the first main body surface 30a. However, the flat surfaces 59a and 59b may also be inclined relative to the second main body surface 30b. Both flat surfaces 59a and 59b may be along the second main body surface 30b or inclined relative to the second main body surface 30b. Alternatively, one of the two flat surfaces 59a and 59b may be along the second main surface 30b, and the other may be inclined relative to the second main surface 30b.

[0288] The flat surfaces 59a and 59b can be formed to be flat. For example, the flat surfaces 59a and 59b can also be formed such that, when viewed from a cross section perpendicular to the X direction, they are contained within a range of less than 3 μm in the direction perpendicular to the flat surfaces 59a and 59b. For example, they can also be formed such that, when viewed from a cross section perpendicular to the X direction, they are contained within a range of less than 3 μm in the direction perpendicular to the reference line of the endpoints of the connecting wall protrusions 57 and 58 and the upper side wall surfaces 54a and 54b.

[0289] Reference Figure 8F The planar surfaces 59a and 59b will be described in more detail. For clarity, planar surface 59b will be described representatively here. Planar surface 59a is identical to planar surface 59b, therefore detailed descriptions are omitted.

[0290] like Figure 8F As shown, the reference line corresponding to the flat surface 59b is represented by the line labeled 59c. The reference line 59c can also be a straight line connecting the second wall protrusion 58 and the endpoint 54c of the upper wall 54b. The endpoint 54c can also be the point in the upper wall 54b closest to the second wall protrusion 58. The flat surface 59b can also be formed within the range 59f between the first boundary line 59d and the second boundary line 59e. The first boundary line 59d can also be a line offset from the reference line 59c towards the first main body surface 30a, and is parallel to the reference line 59c. The second boundary line 59e can also be a line offset from the reference line 59c towards the second main body surface 30b, and is parallel to the reference line 59c. Alternatively, the flat surface 59b can be formed within the range 59f between the first boundary line 59d and the second boundary line 59e as defined in this way.

[0291] like Figure 8F As shown, the baseline 59c can extend along the second main body surface 30b. In this case, the first boundary line 59d and the second boundary line 59e can also extend along the second main body surface 30b. However, it is not limited to this; the baseline 59c can also be inclined relative to the second main body surface 30b. In this case, the first boundary line 59d and the second boundary line 59e can also be inclined relative to the second main body surface 30b.

[0292] like Figure 8F As shown, the distance between the first boundary line 59d and the reference line 59c and the distance between the second boundary line 59e and the reference line 59c can also be equal. In this case, for example, the distance between the first boundary line 59d and the reference line 59c can be less than 1.5 μm. For example, the distance between the second boundary line 59e and the reference line 59c can also be less than 1.5 μm. However, the distance between the first boundary line 59d and the reference line 59c and the distance between the second boundary line 59e and the reference line 59c are not limited to being equal. If the distance between the first boundary line 59d and the second boundary line 59e is less than 3.0 μm, then the distance between the first boundary line 59d and the reference line 59c and the distance between the second boundary line 59e and the reference line 59c can also be different. The first boundary line 59d can also overlap with the reference line 59c, or the second boundary line 59e can also overlap with the reference line 59c.

[0293] like Figure 8A As shown, the depth of the upper vapor flow path recess 54 is represented by h2. h2 can be, for example, 20 μm to 250 μm. Depth h2 refers to the distance from the second main body surface 30b to the flat surfaces 59a and 59b when viewed from a section perpendicular to the X direction. Depth h2 is equivalent to the dimension in the Z direction.

[0294] The width w3 of the upper opening 56 can cover the entire area of ​​the island 33 in the X direction, which is larger than the width w2 of the lower opening 55. As a result, the cross-sectional area of ​​the steam passages 51 and 52 can be increased by covering the entire area of ​​the island 33 in the X direction.

[0295] The vapor flow path 50, including the first vapor passage 51 and the second vapor passage 52 configured in this way, constitutes a part of the aforementioned sealed space 3. For example... Figure 3 As shown, the steam flow path 50 of this embodiment is mainly defined by the lower sheet 10, the upper sheet 20, the frame portion 32 of the core sheet 30, and the island portion 33. Each steam passage 51, 52 has a relatively large flow path cross-sectional area to allow the working steam 2a to pass through.

[0296] To make the accompanying drawings clear, Figure 3The first steam passage 51 and the second steam passage 52 are shown in magnified form, illustrating the number, arrangement, and other characteristics of these steam passages 51, 52, etc. Figure 2 , Figure 6 and Figure 7 different.

[0297] Additionally, although not shown, multiple support portions supporting the island portions 33 to the frame portion 32 can be provided within the steam flow path portion 50. Furthermore, support portions supporting adjacent island portions 33 can also be provided. These support portions can be provided on both sides of the island portion 33 in the X direction or on both sides of the island portion 33 in the Y direction. The support portions can also be configured not to obstruct the flow of the working steam 2a diffusing in the steam flow path portion 50. For example, they can be disposed on one side of the first main body surface 30a and the second main body surface 30b of the core sheet 30, and the space constituting the steam flow path can be formed on the other side. This allows the thickness of the support portion to be thinner than the thickness of the core sheet 30, preventing the first steam passage 51 and the second steam passage 52 from being divided in the X and Y directions.

[0298] like Figure 6 and Figure 7 As shown, alignment holes 35 can also be provided at the four corners of the core sheet 30, similar to those provided for the lower sheet 10 and the upper sheet 20.

[0299] like Figure 2 As shown, the evaporation chamber 1 may also have an injection section 4 on one end edge in the X direction for injecting working fluid 2b into the sealed space 3. Figure 2 In the configuration shown, the injection section 4 is positioned on the evaporation zone SR side and protrudes outward from the end edge of the evaporation zone SR side toward the outside of the evaporation chamber 1. Furthermore, as described later... Figure 36 As shown, the injection section 4 may not protrude outward from the evaporation chamber 1.

[0300] More specifically, the injection section 4 may have a lower injection protrusion 11 (see reference). Figure 4 ), Upper injection protrusion 21 (refer to) Figure 5 ) and core sheet injection protrusion 36 (refer to) Figure 6 and Figure 7The lower injection protrusion 11 constitutes the lower sheet 10. The upper injection protrusion 21 constitutes the upper sheet 20. The core sheet injection protrusion 36 constitutes the core sheet 30. An injection flow path 37 is formed in the core sheet injection protrusion 36. This injection flow path 37 can extend from the first main body surface 30a of the core sheet 30 to the second main body surface 30b, and can also penetrate the core sheet injection protrusion 36 of the core sheet 30 in the Z direction. Furthermore, the injection flow path 37 communicates with the vapor flow path 50, and the working fluid 2b is injected into the sealing space 3 through the injection flow path 37. Additionally, depending on the configuration of the liquid flow path 60, the injection flow path 37 can also communicate with the liquid flow path 60. The upper and lower surfaces of the core sheet injection protrusion 36 can be substantially flat, and the upper surface of the lower injection protrusion 11 and the lower surface of the upper injection protrusion 21 can also be substantially flat. The planar shapes of each injection protrusion 11, 21, and 36 can also be the same.

[0301] Furthermore, in this embodiment, an example is shown where the injection section 4 is provided on one of the two end edges in the X direction of the evaporation chamber 1, but it is not limited to this and can be provided at any position. Additionally, regarding the injection path 37 provided in the core sheet injection protrusion 36, it may not penetrate the core sheet injection protrusion 36 as long as the working fluid 2b can be injected. In this case, the injection path 37 communicating with the vapor flow path section 50 can be formed by a recess formed on one of the first main body surface 30a and the second main body surface 30b of the core sheet 30.

[0302] like Figure 3 , Figure 8A and Figure 10 As shown, the liquid flow path 60 can also be provided between the lower sheet 10 and the core sheet 30. In this embodiment, the liquid flow path 60 is provided on the first main body surface 30a of the core sheet 30. The liquid flow path 60 can also be a flow path mainly for the working liquid 2b to pass through. The working vapor 2a mentioned above can pass through the liquid flow path 60. The liquid flow path 60 forms part of the sealed space 3 mentioned above and communicates with the vapor flow path 50. The liquid flow path 60 is configured as a capillary structure (core) for conveying the working liquid 2b to the evaporation zone SR. In this embodiment, the liquid flow path 60 is provided on the first main body surface 30a of each island portion 33 of the core sheet 30. The liquid flow path 60 can also be formed throughout the entire first main body surface 30a of each island portion 33. Although in Figure 3 Although not shown in the figure, a liquid flow path 60 may be provided on the second main body surface 30b of each island 33.

[0303] like Figure 9As shown, the liquid flow path 60 is an example of a tank assembly comprising multiple tanks. More specifically, the liquid flow path 60 has multiple main flow channels 61 through which the working fluid 2b passes, and multiple connecting channels 65 communicating with the main flow channels 61. The main flow channels 61 of the liquid flow path 60 are an example of a first tank. The connecting channels 65 of the liquid flow path 60 are an example of a second tank. The main flow channels 61 and the connecting channels 65 are tanks through which the working fluid 2b passes. The connecting channels 65 communicate with the main flow channels 61.

[0304] like Figure 9 As shown, each main channel 61 is formed to extend along the X direction. The main channel 61 has a flow path cross-sectional area smaller than that of the first vapor passage 51 or the second vapor passage 52 of the vapor flow path section 50, so that the working liquid 2b flows by capillary action. Thus, the main channel 61 is configured to transport the working liquid 2b condensed from the working vapor 2a to the evaporation zone SR. Each main channel 61 can also be arranged at equal intervals along the Y direction, which is orthogonal to the X direction.

[0305] The main groove 61 is formed by etching from the first main body surface 30a of the core sheet 30 in an etching process described later. Thus, as... Figure 8A As shown, the main channel 61 has a curved wall 62. This wall 62 defines the main channel 61, which is curved in a shape bulging toward the second main body surface 30b.

[0306] like Figure 8A and Figure 9 As shown, the width w5 (dimension in the Y direction) of the main channel 61 can be, for example, from 5 μm to 400 μm. Furthermore, the width w5 of the main channel 61 refers to the dimension on the first body surface 30a. Additionally, as... Figure 8A As shown, the depth h1 (dimension in the Z direction) of the main channel 61 can be, for example, from 5 μm to 100 μm.

[0307] like Figure 9 As shown, each connecting groove 65 extends in a direction different from the X direction. In this embodiment, each connecting groove 65 is formed to extend in the Y direction and is formed perpendicular to the main flow groove 61. Some connecting grooves 65 are configured to connect adjacent main flow grooves 61 to each other. Other connecting grooves 65 are configured to connect the vapor flow path 50 (first vapor passage 51 or second vapor passage 52) to the main flow groove 61. That is, the connecting groove 65 extends from the side edge 33a of the island 33 in the Y direction to the main flow groove 61 adjacent to the side edge 33a. In this way, the first vapor passage 51 or the second vapor passage 52 of the vapor flow path 50 is connected to the main flow groove 61.

[0308] The connecting channel 65 has a smaller cross-sectional area than the first vapor passage 51 or the second vapor passage 52 of the vapor flow path section 50, so that the working fluid 2b flows by capillary action. Each connecting channel 65 can also be arranged at equal intervals along the X direction.

[0309] Similar to the main channel 61, the connecting channel 65 is also formed by etching and has a wall surface (not shown) formed with the same curved shape as the main channel 61. Figure 9 As shown, the width w6 (dimension in the X direction) of the connecting groove 65 can be equal to the width w5 of the main groove 61, but it can also be greater than or less than the width w5. The depth of the connecting groove 65 can be equal to the depth h1 of the main groove 61, but it can also be deeper or shallower than the depth h1.

[0310] like Figure 9 As shown, the liquid flow path 60 has a row of protrusions 63 disposed on the first main body surface 30a of the core sheet 30. The row of protrusions 63 is disposed between adjacent main flow channels 61. Each row of protrusions 63 includes a plurality of protrusions 64 (an example of a liquid flow path protrusion) arranged in the X direction. The protrusions 64 are disposed within the liquid flow path 60 and abut against the upper sheet 20. Each protrusion 64 is rectangular in shape with the X direction as its long side when viewed from above. The main flow channels 61 are located between adjacent protrusions 64 in the Y direction, and a connecting channel 65 is located between adjacent protrusions 64 in the X direction. The connecting channel 65 is formed to extend in the Y direction and connects adjacent main flow channels 61 in the Y direction to each other. Thus, the working fluid 2b can flow between these main flow channels 61.

[0311] The protrusion 64 is the portion of the core sheet 30 that remains unetched during the etching process described later. In this embodiment, as... Figure 9 As shown, the planar shape of the protrusion 64 is the shape at the position of the first main surface 30a of the core sheet 30, and it becomes rectangular.

[0312] In this embodiment, the protrusions 64 are arranged in a staggered configuration. More specifically, the protrusions 64 of adjacent protrusion rows 63 in the Y direction are staggered in the X direction. This offset can also be half the spacing between the protrusions 64 in the X direction. The width w7 (dimension in the Y direction) of the protrusions 64 can be, for example, 5 μm to 500 μm. Furthermore, the width w7 of the protrusions 64 refers to the dimension on the first body surface 30a. Additionally, the arrangement of the protrusions 64 is not limited to a staggered configuration; they can also be arranged side-by-side. In this case, the protrusions 64 of adjacent protrusion rows 63 in the Y direction are also arranged in the Y direction.

[0313] The main channel 61 includes a cross portion 66 that communicates with the connecting channel 65. At the cross portion 66, the main channel 61 and the connecting channel 65 are connected in a T-shape. This avoids the situation where, in one main channel 61, there is a connection with one side (e.g., Figure 9 At the intersection 66 of the connecting groove 65 on the upper side), on the other side (e.g., Figure 9 The connecting groove 65 (on the lower side) is connected to the main groove 61.

[0314] That is, on both sides in the Y direction of a main channel 61 ( Figure 9 When the connecting grooves 65 (on both the upper and lower sides) are positioned at the same location in the X direction, the main channel 61 intersects the connecting groove 65 in a cross shape. In this case, the wall 62 of the main channel 61 (see...) Figure 8A At the same position in the X direction, the connecting groove 65 is on both sides ( Figure 9 The upper and lower sides of the channel are cut off. At the location of the cut, a continuous space in a cross shape is formed, which may reduce the capillary effect of the main channel 61.

[0315] On the other hand, according to this embodiment, there are two sides in the Y direction of a main channel 61 ( Figure 9 The connecting grooves 65 (on both the upper and lower sides) are arranged at different positions in the X direction. This allows the positions where the connecting grooves 65 cut off one side of the wall 62 in the Y direction and the other side in the Y direction are different in the X direction. In this case, since one side of the main channel 61 in the Y direction is connected to the connecting groove 65, the wall 62 of the main channel 61 can be preserved on the other side in the Y direction. Therefore, at the positions where the wall 62 of the main channel 61 is cut off by the connecting grooves 65, a continuous space is formed in a T-shape, thereby suppressing the reduction of the capillary effect of the main channel 61. Therefore, the reduction of the propulsion force of the working fluid 2b toward the evaporation region SR at the intersection 66 can be suppressed.

[0316] However, the materials constituting the lower sheet 10, upper sheet 20, and core sheet 30 are not specifically defined, as long as they have good thermal conductivity sufficient to ensure heat dissipation efficiency as the evaporation chamber 1. For example, copper or copper alloys with good thermal conductivity and corrosion resistance when using pure water as the working fluid can be cited as materials for each of the sheets 10, 20, and 30. Examples of copper include pure copper and oxygen-free copper (C1020). Examples of copper alloys include tin-containing copper alloys, titanium-containing copper alloys (C1990, etc.), and Coson series copper alloys (C7025, etc.) which contain nickel, silicon, and magnesium. Tin-containing copper alloys include, for example, phosphor bronze (C5210, etc.).

[0317] Figure 3 The thickness t1 of the evaporation chamber 1 shown can be, for example, 100 μm to 500 μm. By setting the thickness t1 of the evaporation chamber 1 to 100 μm or more, the vapor flow path 50 can be properly ensured, thereby enabling the evaporation chamber 1 to function properly. On the other hand, by setting the thickness t1 to 500 μm or less, the thickness t1 of the evaporation chamber 1 can be prevented from becoming too thick.

[0318] The core sheet 30 may also be thicker than the lower sheet 10. Similarly, the core sheet 30 may also be thicker than the upper sheet 20. In this embodiment, an example is shown where the thickness of the lower sheet 10 is equal to the thickness of the upper sheet 20, but this is not a limitation, and the thicknesses of the lower sheet 10 and the upper sheet 20 may also be different.

[0319] The thickness t2 of the lower sheet 10 can be, for example, 6 μm to 100 μm. By setting the thickness t2 of the lower sheet 10 to 6 μm or more, the mechanical strength and long-term reliability of the lower sheet 10 can be ensured. On the other hand, by setting the thickness t2 of the lower sheet 10 to 100 μm or less, the thickness t1 of the evaporation chamber 1 can be suppressed from becoming thicker. Similarly, the thickness t3 of the upper sheet 20 can also be set in the same way as the thickness t2 of the lower sheet 10.

[0320] The thickness t4 of the core sheet 30 can be, for example, 50 μm to 300 μm. By setting the thickness t4 of the core sheet 30 to 50 μm or more, the vapor flow path 50 can be properly ensured, thereby enabling it to function properly as the evaporation chamber 1. On the other hand, by setting it to 300 μm or less, the thickness t1 of the evaporation chamber 1 can be suppressed from becoming too thick. Furthermore, the thickness t4 of the core sheet 30 can also be the distance between the first main body surface 30a and the second main body surface 30b.

[0321] The evaporation chamber 1 of this embodiment, constructed with such a structure, can be used by referring to the following description. Figures 18-23 The manufacturing method described herein is used to manufacture the material. By adjusting etching conditions such as the shape of the resist, the flow pattern of the etchant, or the etching time, the flat surfaces 59a and 59b of the upper vapor flow path recess 54 can be easily formed.

[0322] Next, the working method of the evaporation chamber 1, namely the cooling method of the electronic device D, will be explained.

[0323] The evaporation chamber 1 obtained as described above is disposed within the housing H of a mobile terminal or the like, and the housing component Ha is mounted on the second upper sheet surface 20b of the upper sheet 20. Alternatively, the evaporation chamber 1 is mounted on the housing component Ha. Furthermore, an electronic device D, such as a CPU, serving as a cooling device, is mounted on the first lower sheet surface 10a of the lower sheet 10. Alternatively, the evaporation chamber 1 is mounted on the electronic device D. The working fluid 2b within the sealed space 3 adheres to the wall surface of the sealed space 3 due to its surface tension. More specifically, the working fluid 2b adheres to the lower wall surfaces 53a and 53b of the lower vapor flow path recess 53, the upper wall surfaces 54a and 54b of the upper vapor flow path recess 54, the flat surfaces 59a and 59b, the wall surface 62 of the main flow channel 61, and the wall surface of the connecting channel 65. The working fluid 2b can also adhere to the portion of the lower sheet surface 10b of the lower sheet 10 that is exposed in the lower vapor flow path recess 53. The working fluid 2b can also adhere to the exposed portions of the upper vapor flow path recess 54, the main flow channel 61, and the connecting channel 65 in the first upper sheet surface 20a of the upper sheet 20.

[0324] When electronic device D heats up in this state, there exists an evaporation region SR (refer to...). Figure 6 and Figure 7 The working fluid 2b receives heat from the electronic device D. The received heat is absorbed as latent heat, causing the working fluid 2b to evaporate (vaporize), generating working vapor 2a. Most of the generated working vapor 2a diffuses within the first vapor passage 51 and the second vapor passage 52 that constitute the sealed space 3 (see reference). Figure 7 (Solid arrow). More specifically, in the portion of the first steam passage 51 extending in the X direction and the second steam passage 52 of the steam flow path 50, the working steam 2a diffuses mainly in the X direction. On the other hand, in the portion of the first steam passage 51 extending in the Y direction, the working steam 2a diffuses mainly in the Y direction. In this embodiment, the upper opening 56 is larger than the lower opening 55, thereby increasing the flow path cross-sectional area of ​​the steam passages 51 and 52. Therefore, the flow path resistance of the working steam 2a is reduced, and the working steam 2a can diffuse smoothly.

[0325] Furthermore, the working vapor 2a in each vapor passage 51, 52 leaves the evaporation zone SR, and most of the working vapor 2a is transported to the lower-temperature condensation zone CR. Figure 6 and Figure 7 (The right side of the image). In the condensation zone CR, the working vapor 2a is mainly cooled by dissipating heat to the upper sheet 20. The heat received by the upper sheet 20 from the working vapor 2a is transmitted through the housing component Ha (see reference). Figure 3 It is transferred to the external gas.

[0326] Working vapor 2a dissipates heat to the upper sheet 20 in the condensation zone CR, thereby losing the latent heat absorbed in the evaporation zone SR and condensing to generate working liquid 2b. The generated working liquid 2b adheres to the wall surfaces 53a, 53b, 54a, 54b, flat surfaces 59a, 59b of each vapor flow path recess 53, 54, as well as the second lower sheet surface 10b of the lower sheet 10 and the first upper sheet surface 20a of the upper sheet 20. Here, in the evaporation zone SR, the working liquid 2b continues to evaporate. Therefore, the working liquid 2b in the liquid flow path section 60, excluding the evaporation zone SR (i.e., the condensation zone CR), is transported towards the evaporation zone SR through the capillary action of each main flow channel 61 (see reference). Figure 7 (The dashed arrows indicate this). Thus, the working fluid 2b, adhering to each of the wall surfaces 53a, 53b, 54a, 54b, the flat surfaces 59a, 59b, the second lower sheet surface 10b, and the first upper sheet surface 20a, moves within the liquid flow path 60 and enters the main flow channel 61 through the connecting channel 65. In this way, the working fluid 2b is filled into each main flow channel 61 and each connecting channel 65. Therefore, the filled working fluid 2b receives a propulsive force towards the evaporation zone SR through the capillary action of each main flow channel 61, thereby being smoothly transported towards the evaporation zone SR.

[0327] In the liquid flow path section 60, each main flow channel 61 is connected to other adjacent main flow channels 61 via a corresponding connecting channel 65. As a result, the working fluid 2b flows between adjacent main flow channels 61, suppressing dry burning within the main flow channels 61. Therefore, a capillary effect is applied to the working fluid 2b within each main flow channel 61, ensuring smooth transport of the working fluid 2b towards the evaporation zone SR.

[0328] On the other hand, the working liquid 2b adhering to the wall surfaces 53a, 53b, 54a, 54b and the flat surfaces 59a, 59b of each steam flow path recess 53, 54 can also be transported to the evaporation zone SR by means of the capillary action of the steam flow path recess 53, 54. The steam flow path recesses 53, 54 mainly function as flow paths for the working steam 2a, but can also impart a capillary action to the working liquid 2b adhering to the wall surfaces 53a, 53b, 54a, 54b and the flat surfaces 59a, 59b.

[0329] The working fluid 2b reaching the evaporation zone SR is heated and evaporates again from the electronic device D. The working vapor 2a evaporated from the working fluid 2b moves through the connecting groove 65 in the evaporation zone SR to the lower vapor flow path recess 53 and the upper vapor flow path recess 54, which have large cross-sectional areas, and diffuses within each vapor flow path recess 53 and 54. In this way, the working fluids 2a and 2b repeatedly undergo phase change, i.e., evaporation and condensation, while flowing back within the sealed space 3, diffusing and releasing the heat from the electronic device D. As a result, the electronic device D is cooled.

[0330] Thus, according to this embodiment, when viewed in a cross-section perpendicular to the X direction, the upper opening 56 on the second main body surface 30b extends from the region 56c, which overlaps with the lower opening 55 on the first main body surface 30a when viewed from above, to the position where it overlaps with the main flow channel 61 when viewed from above. This increases the flow path cross-sectional area of ​​the vapor passages 51 and 52. Consequently, the flow path resistance of the working vapor 2a can be reduced, allowing the working vapor 2a to diffuse more easily. As a result, the heat dissipation efficiency of the evaporation chamber 1 can be improved, thereby increasing the cooling efficiency of the electronic device D.

[0331] Furthermore, according to this embodiment, when viewed in a cross-section perpendicular to the X direction, the upper vapor flow path recess 54 includes flat surfaces 59a and 59b connecting the corresponding upper wall surfaces 54a and wall protrusions 57 and 58. The flat surfaces 59a and 59b are formed to be flat. This further reduces the flow path resistance of the working vapor 2a, making it easier to diffuse the working vapor 2a.

[0332] Furthermore, according to this embodiment, when viewed in a cross-section perpendicular to the X direction, the upper opening 56 extends from the region 56c that overlaps with the lower opening 55 when viewed from above to a position where it overlaps with the main flow channel 61 on both sides relative to the lower opening 55 when viewed from above. This further increases the flow path cross-sectional area of ​​the vapor passages 51 and 52. Consequently, the flow path resistance of the working vapor 2a can be reduced, allowing the working vapor 2a to diffuse more easily. As a result, the heat dissipation efficiency of the evaporation chamber 1 can be improved, thereby improving the cooling efficiency of the electronic device D.

[0333] Furthermore, in the above embodiment, the following example was described: when viewed in a cross-section perpendicular to the X direction, the upper opening 56 extends from the region 56c that overlaps with the lower opening 55 when viewed from above, to a position that overlaps with the main channel 61 on both sides relative to the lower opening 55 when viewed from above. However, it is not limited to this. For example, as... Figure 11 As shown, the upper opening 56 can extend from the region 56c that overlaps with the lower opening 55 in a top view to a position that overlaps with the main flow channel 61 on one side relative to the lower opening 55 in a top view. Alternatively, the upper opening 56 may not extend to the position on the other side relative to the lower opening 55 that overlaps with the main flow channel 61 in a top view. In this case, the flow path cross-sectional area of ​​the steam passages 51 and 52 can also be increased. Figure 11In the example shown, the upper opening 56 extends to the left relative to the lower opening 55. Viewed in a section perpendicular to the X direction, the upper vapor flow path recess 54 includes a flat surface 59a. The flat surface 59a is disposed on the side where the upper opening 56 extends. The flat surface 59a connects one upper wall surface 54a to the first wall surface protrusion 57. The other upper wall surface 54b and the second wall surface protrusion 58 do not pass through the flat surface 59b (see reference). Figure 8A And connected. The upper opening edge 56b, located on the side opposite to the flat surface 59a, can also be located at a position that overlaps with the corresponding lower opening edge 55b when viewed from above. In Figure 11 In the example shown, the center 55a of the lower opening 55 and the center 56a of the upper opening 56 can also be staggered.

[0334] Furthermore, in the above embodiment, the following example was described: when viewed in a cross-section perpendicular to the X direction, the upper vapor flow path recess 54 includes flat surfaces 59a and 59b. However, it is not limited to this. For example, as... Figure 12 As shown, the upper vapor flow path recess 54 may also include convex surfaces 75a and 75b. The convex surfaces 75a and 75b connect corresponding upper wall surfaces 54a and 54b to wall protrusions 57 and 58. The convex surface 75a is... Figure 12 The left side of the face, the convex face 75b is Figure 12 The right side of the wall. More specifically, the upper wall surface 54a is connected to the first wall protrusion 57 via one convex surface 75a, and the upper wall surface 54b is connected to the second wall protrusion 58 via the other convex surface 75b. The convex surfaces 75a and 75b each include a spatial protrusion 76. The spatial protrusion 76 extends in the X direction and protrudes toward the second main body surface 30b. Thus, the working vapor 2a can be rectified in a manner that flows along the spatial protrusion 76. Therefore, the flow resistance of the working vapor 2a can be reduced, thereby making it easier for the working vapor 2a to diffuse. The convex surfaces 75a and 75b may also each include a plurality of spatial protrusions 76 that are separated from each other. A concave curved surface 77 may also be formed between two adjacent spatial protrusions 76. A concave curved surface 77 may also be formed between the wall protrusions 57 and 58 and the adjacent spatial protrusions 76. Figure 12 In the example shown, the convex surfaces 75a and 75b include two spatial convexities 76. In this case, the working steam 2a can be further rectified.

[0335] like Figure 12As shown, the depth of the upper vapor flow path recess 54 is represented by h3. h3 can be, for example, 20 μm to 250 μm. Depth h3 refers to the maximum distance from the second main body surface 30b to the convex surfaces 75a and 75b when viewed from a cross section perpendicular to the X direction. Depth h3 corresponds to the dimension in the Z direction.

[0336] like Figure 12 As shown, h4 represents the depth from the second main body surface 30b to the spatial protrusion 76. h4 can be, for example, 17 μm to 245 μm. The depth h4 refers to the distance from the second main body surface 30b to the end of the spatial protrusion 76 when viewed from a section perpendicular to the X direction. The depth h4 corresponds to the dimension in the Z direction.

[0337] like Figure 12 As shown, the spacing of the spatial protrusions 76 is represented by w14. w14 can be, for example, 30 μm to 300 μm. The spacing w14 refers to the distance between adjacent spatial protrusions 76 when viewed in a section perpendicular to the X direction. The spacing w14 corresponds to the dimension in the Y direction.

[0338] Furthermore, in the above embodiment, the following example was described: when viewed in a cross-section perpendicular to the X direction, the upper vapor flow path recess 54 includes flat surfaces 59a and 59b. However, it is not limited to this. For example, as... Figure 13 As shown, the upper steam flow path recess 54 may not include flat surfaces 59a and 59b. More specifically, the upper wall surfaces 54a and 54b are not connected to the wall protrusions 57 and 58 via flat surfaces 59a and 59b. In this case, the upper opening 56 located on the second main body surface 30b only needs to extend from the area 56c that overlaps with the lower opening 55 located on the first main body surface 30a when viewed from above to the position that overlaps with the main flow channel 61 when viewed from above. This increases the flow path cross-sectional area of ​​the steam passages 51 and 52 and reduces the flow path resistance of the working steam 2a.

[0339] Furthermore, in the above embodiment, an example was described where the lower side walls 53a and 53b of the lower vapor flow path recess 53 are bent into a concave shape. However, it is not limited to this. For example... Figure 14As shown, the lower sidewalls 53a and 53b can also be bent into a convex shape. Each lower sidewall 53a and 53b can also be connected to the upper sidewalls 54a and 54b without passing through wall protrusions 57 and 58. Each lower sidewall 53a and 53b can also be connected to the upper sidewalls 54a and 54b without passing through flat surfaces 59a and 59b. Thus, by bending the lower sidewalls 53a and 53b into a convex shape, the formation of wall protrusions 57 and 58 can be avoided. Therefore, the flow path cross-sectional area of ​​the steam passages 51 and 52 can be increased, and the flow path resistance of the working steam 2a can be reduced. Furthermore, the lower sidewalls 53a and 53b can also be connected to the upper sidewalls 54a and 54b via flat surfaces 59a and 59b.

[0340] Furthermore, in the above embodiment, an example was described where the width w3 of the upper opening 56, covering the entire area of ​​the island 33 in the X direction, is larger than the width w2 of the lower opening 55. However, this is not the only limitation. For example, as... Figure 15A As shown, the area where the width w3 of the upper opening 56 is greater than the width w2 of the lower opening 55 can also be a part of the island 33 in the X direction.

[0341] 144 in Figure 15A In the example shown, the upper opening 56 includes a first region 56d and a second region 56e. The first region 56d is the region of the upper opening 56 that extends from the region 56c, which overlaps with the lower opening 55 in a top view, to the position where it overlaps with the main channel 61 in a top view. The second region 56e is the region of the upper opening 56 that does not extend from the region 56c, which overlaps with the lower opening 55 in a top view, to the position where it overlaps with the main channel 61 in a top view. In the first region 56d, the width w3 is greater than the width w2. For example, as... Figure 15B As shown, the width w3 in the second region 56e is smaller than the width w3 in the first region 56d. In the second region 56e, the width w3 can also be equal to the width w2, and the upper opening 56 can overlap with the lower opening 55 when viewed from above. More specifically, the upper opening side edge 56b is located at a position where it overlaps with the corresponding lower opening side edge 55b when viewed from above. This increases the bonding area between the island 33 and the upper sheet 20, thereby improving the mechanical strength of the evaporation chamber 1.

[0342] The positions of region 56d and region 56e in the X direction are arbitrary. For example, region 56d can be located in evaporation region SR, and region 56e can be located in condensation region CR. In this case, the cross-sectional area of ​​the steam passages 51 and 52 can be increased in evaporation region SR, where the pressure of working steam 2a tends to be higher.

[0343] For example, region 56d could be located in condensation region CR, and region 56e could be located in evaporation region SR. In this case, the flow rate of working vapor 2a can be reduced in condensation region CR, thereby promoting condensation.

[0344] For example, the first region 56d can also be located in the middle of the evaporation chamber 1 in the X direction. The first region 56d can also be located in the condensation region CR, near the evaporation region SR. In this case, the flow resistance of the working vapor diffusing from the evaporation region SR can be reduced, allowing the working vapor 2a to diffuse to a position away from the evaporation region SR. This improves the heat dissipation efficiency of the evaporation chamber 1.

[0345] (Second Implementation)

[0346] Next, use Figures 16-25 The main sheet for the evaporation chamber, the evaporation chamber, and the electronic equipment according to the second embodiment of the present invention will be described.

[0347] exist Figures 16-25 In the second embodiment shown, the main difference is that the first wall protrusion is offset relative to the midpoint between the first and second main body surfaces in the normal direction of the first main body surface. Other structures are the same as... Figure 1-Figure 2 The first embodiment shown in Figure 5 is largely the same. Furthermore, in Figures 16-25 In the middle, to and Figure 1-Figure 2 The same parts as those in the first embodiment shown in Figure 5 are labeled with the same reference numerals and detailed descriptions are omitted.

[0348] like Figure 16 and Figure 17 As shown, when viewed in a cross-section perpendicular to the X direction, the center 55a of the lower opening 55 is offset relative to the center 56a of the upper opening 56. More specifically, in the portion of the first steam passage 51 extending along the X direction, the center 55a of the lower opening 55 is offset relative to the center 56a of the upper opening 56 in the Y direction. Similarly, in the second steam passage 52, the center 55a of the lower opening 55 is also offset relative to the center 56a of the upper opening 56 in the Y direction. Thus, in this embodiment, the cross-sectional shapes of the first steam passage 51 and the second steam passage 52 can also be asymmetrical in the Y direction.

[0349] exist Figure 16 and Figure 17 The image shows an example where the center 55a of the lower opening 55 is offset to the right relative to the center 56a of the upper opening 56, but it could also be offset to the left. Figure 17As shown, the offset s1 between the center 55a of the lower opening 55 and the center 56a of the upper opening 56 can be, for example, 0.05 mm to (0.8 × w1) mm. By setting it to 0.05 mm or more, the effects described later based on the offset between the centers 55a and 56a can be achieved. On the other hand, by setting the offset s1 to (0.8 × w1) mm or less, it can be set to less than 80% of the width w1 of the island 33. In this case, the mechanical strength of the island 33 can be ensured, and deformation of the core sheet 30 can be suppressed when a load is applied, such as during diffusion bonding. Furthermore, in Figure 2 , Figure 6 as well as Figure 7 In order to make the accompanying drawings clear, it is shown that the center 55a of the lower opening 55 is not separated from the center 56a of the upper opening 56.

[0350] The width w1 of the island portion 33 in this embodiment (refer to...) Figure 17 For example, it can be 100μm to 1500μm. The width w2 of the lower opening 55 in this embodiment can be, for example, 100μm to 5000μm. The width w3 of the upper opening 56 in this embodiment is the same as the width w2 of the lower opening 55 described above; for example, the width w3 can also be 100μm to 5000μm. However, the width w3 of the upper opening 56 can also be different from the width w2 of the lower opening 55.

[0351] When viewed in a section perpendicular to the X direction, each lower opening side edge 55b is offset relative to its corresponding upper opening side edge 56b. Each lower opening side edge 55b is offset to the right relative to its corresponding upper opening side edge 56b.

[0352] It should be noted that, similarly, in the portion extending along the Y direction in the first vapor passage 51, the center 55a of the lower opening 55 can be offset to one side in the X direction relative to the center 56a of the upper opening 56. In this case, each lower opening side edge 55b can also be offset to one side relative to the corresponding upper opening side edge 56b.

[0353] In this embodiment, a pair of wall protrusions 57 and 58 protrude obliquely toward each other. The first wall protrusion 57 protrudes toward the upper right. The second wall protrusion 58 protrudes toward the lower left.

[0354] In this embodiment, the first wall protrusion 57 is offset in the Z direction relative to the midpoint MP between the first main body surface 30a and the second main body surface 30b. The Z direction is the thickness direction of the core sheet 30, corresponding to the normal direction of the first main body surface 30a. Figure 17As shown, the first wall protrusion 57 can also be positioned closer to the first main body surface 30a than the aforementioned intermediate position MP. In this case, the first wall protrusion 57 is positioned closer to the first main body surface 30a than the second main body surface 30b. The distance s2 from the first main body surface 30a to the first wall protrusion 57 can be, for example, greater than h1 or less than t4 / 2. h1 is the depth of the main channel 61 as described above. t4 is the thickness of the core sheet 30 as described above.

[0355] Similarly, in this embodiment, the second wall protrusion 58 is disposed offset in the Z direction relative to the midpoint MP between the first main body surface 30a and the second main body surface 30b. For example... Figure 17 As shown, the second wall protrusion 58 can also be positioned closer to the second main body surface 30b than the aforementioned intermediate position MP. In this case, the second wall protrusion 58 is positioned closer to the second main body surface 30b than the first main body surface 30a. The distance s3 from the second main body surface 30b to the second wall protrusion 58 can be equal to or different from the distance s2 from the first main body surface 30a to the first wall protrusion 57. The distance s3 can be, for example, greater than h1 or less than t4 / 2.

[0356] Next, use Figures 18-23 The manufacturing method of the evaporation chamber 1 of this embodiment, which is constructed with such a structure, will be described.

[0357] Here, we will first explain the core sheet manufacturing process for making the core sheet 30.

[0358] First, such as Figure 18 As shown, as a material preparation step, a flat sheet of metal material M is prepared, which includes a lower surface Ma (an example of a first material surface) and an upper surface Mb (an example of a second material surface). The metal material sheet M can be formed from a rolled piece having a desired thickness.

[0359] After the material preparation process, such as Figure 19 As shown, as a resist forming process, a lower resist film 70 is formed on the lower surface Ma of the metal sheet M, and an upper resist film 71 is formed on the upper surface Mb. Before forming each resist film 70, 71, as a pretreatment, the lower surface Ma and upper surface Mb of the metal sheet M may be subjected to an acidic degreasing treatment. Alternatively, each resist film 70, 71 may also be formed by applying a liquid resist to the lower surface Ma and the upper surface Mb and allowing it to dry and harden. Alternatively, each resist film 70, 71 may also be formed by adhering a dry film resist to the lower surface Ma and the upper surface Mb.

[0360] Next, as Figure 20As shown, as a patterning process, the lower resist film 70 and the upper resist film 71 are patterned using photolithography. In this case, a first resist opening 72 corresponding to the lower opening 55 is formed on the lower resist film 70, and a second resist opening 73 corresponding to the main channel 61 and the connecting channel 65 of the liquid flow path 60 is formed. Additionally, a third resist opening 74 corresponding to the upper opening 56 is formed on the upper resist film 71. The center of the first resist opening 72 is offset to one side in the Y direction relative to the center of the corresponding third resist opening 74. The Y-direction dimension w2' of the first resist opening 72 can be equal to or different from the Y-direction dimension w3' of the third resist opening 74. w2' is a dimension corresponding to the width w2 of the lower opening 55, and is a dimension set for forming the width w2 of the lower opening 55 by etching. Similarly, w3' is a dimension corresponding to the width w3 of the lower opening 55, and is a dimension set for forming the width w3 of the upper opening 56 by etching.

[0361] Next, as Figure 21 As shown, as an etching process, the lower surface Ma and upper surface Mb of the metal sheet M are etched. As a result, the portions of the lower surface Ma of the metal sheet M corresponding to the first resist opening 72 and the second resist opening 73 are etched. Thus, a... Figure 21 The vapor flow path portion 50 shown includes a lower vapor flow path recess 53, and the liquid flow path portion 60 includes a main flow channel 61 and a connecting channel 65. Additionally, the portion of the upper surface Mb corresponding to the third resist opening 74 is etched to form... Figure 21 The vapor flow path portion 50 shown has an upper vapor flow path recess 54. Furthermore, for the etching solution, for example, a ferric chloride-based etching solution such as an aqueous solution of ferric chloride, or a copper chloride-based etching solution such as an aqueous solution of copper chloride can be used.

[0362] Regarding etching, both the lower surface Ma and the upper surface Mb of the metal sheet M can be etched simultaneously. However, this is not the only possibility; the etching of the lower surface Ma and the upper surface Mb can also be performed as separate processes. Furthermore, the vapor flow path 50 and the liquid flow path 60 can be formed simultaneously by etching, or they can be formed through separate processes.

[0363] In addition, during the etching process, the lower surface Ma and the upper surface Mb of the metal sheet M are etched to obtain... Figure 6 and Figure 7 The core sheet 30 shown has a specified external outline shape.

[0364] After the etching process, such as Figure 22 As shown, as a resist removal process, the lower resist film 70 and the upper resist film 71 are removed.

[0365] Thus, the core sheet 30 of this embodiment is obtained.

[0366] Following the manufacturing process of the core sheet 30, as a joining process, such as... Figure 23 As shown, the lower sheet 10, the upper sheet 20, and the core sheet 30 are joined together. Alternatively, the lower sheet 10 and the upper sheet 20 can also be formed from rolled parts with a desired thickness.

[0367] More specifically, firstly, the lower sheet 10, the core sheet 30, and the upper sheet 20 are stacked sequentially. In this case, the first main body surface 30a of the core sheet 30 coincides with the second lower sheet surface 10b of the lower sheet 10, and the first upper sheet surface 20a of the upper sheet 20 coincides with the second main body surface 30b of the core sheet 30. At this time, the alignment holes 12 of the lower sheet 10, 35 of the core sheet 30, and 22 of the upper sheet 20 are used to align each sheet 10, 20, and 30.

[0368] Next, the lower sheet 10, the core sheet 30, and the upper sheet 20 are temporarily fixed. For example, resistance welding can be performed in a dotted manner to temporarily fix these sheets 10, 20, and 30, or laser welding can be used to temporarily fix these sheets 10, 20, and 30.

[0369] Next, the lower sheet 10, the core sheet 30, and the upper sheet 20 are permanently bonded together by diffusion bonding. Diffusion bonding is a method of bonding the sheets 10, 20, and 30 together by tightly adhering the lower sheet 10 to be bonded to the core sheet 30 and by tightly adhering the core sheet 30 to the upper sheet 20. More specifically, in a controlled atmosphere such as a vacuum or inert gas, each sheet 10, 20, and 30 is pressurized and heated in the stacking direction. Thus, the diffusion of atoms generated at the bonding surface is used to bond the sheets 10, 20, and 30. In diffusion bonding, the material of each sheet 10, 20, and 30 is heated to a temperature close to its melting point, but below the melting point, thus preventing the sheets 10, 20, and 30 from melting and deforming. More specifically, the first main body surface 30a of the frame portion 32 and each island portion 33 of the core sheet 30 diffusely bonds with the second lower sheet surface 10b of the lower sheet 10. Furthermore, the second main body surface 30b of the frame portion 32 and each island portion 33 of the core sheet 30 diffusely bonds with the first upper sheet surface 20a of the upper sheet 20. Thus, the sheets 10, 20, and 30 are diffusely bonded together, forming a sealed space 3 with a vapor flow path 50 and a liquid flow path 60 between the lower sheet 10 and the upper sheet 20. In the aforementioned injection section 4, the lower injection protrusion 11 of the lower sheet 10 is diffusely bonded with the core sheet injection protrusion 36 of the core sheet 30. The core sheet injection protrusion 36 and the upper injection protrusion 21 of the upper sheet 20 are diffusely bonded together. Therefore, the injection flow path 37 becomes a closed space.

[0370] After the joining process, working fluid 2b is injected from injection section 4 into sealing space 3. During injection, working fluid 2b is supplied to sealing space 3 through injection flow path 37.

[0371] Subsequently, the aforementioned injection flow path 37 is sealed. For example, the injection section 4 can also be partially melted to seal the injection flow path 37. This cuts off the connection between the sealed space 3 and the outside, and the working fluid 2b is sealed within the sealed space 3, preventing leakage of the working fluid 2b from the sealed space 3 to the outside. Furthermore, after sealing, the injection section 4 can also be shut off.

[0372] As described above, the evaporation chamber 1 of this embodiment was obtained.

[0373] The operation of the evaporation chamber 1 in this embodiment will be described.

[0374] The working fluid 2b adhering to the wall surfaces 53a, 53b, 54a, and 54b of each vapor flow path recess 53 and 54 can also be transported to the evaporation zone SR through the capillary action of the vapor flow path recesses 53 and 54. The vapor flow path recesses 53 and 54 primarily function as flow paths for the working steam 2a, but they also impart a capillary effect to the working fluid 2b adhering to the wall surfaces 53a, 53b, 54a, and 54b. When viewed in a section perpendicular to the X direction, a shorter length of the wall surfaces 53a, 53b, 54a, and 54b enhances the capillary effect on the working fluid 2b adhering to them. The length of the wall surface refers to the length along the wall surface when viewed in a section perpendicular to the X direction.

[0375] like Figure 17 As shown, in this embodiment, the first wall protrusion 57 is positioned in the Z direction closer to the first main body surface 30a than the midpoint MP between the first main body surface 30a and the second main body surface 30b. In this case, the length of the lower wall surface 53a connected to the first wall protrusion 57 is shortened, thereby improving the capillary effect on the working fluid 2b adhering to the lower wall surface 53a.

[0376] On the other hand, when viewed in a section perpendicular to the X direction, the length of the upper wall surface 54a connected to the first wall surface protrusion 57 becomes longer. In this case, the effect of holding the working fluid 2b on the upper wall surface 54a is improved, and the amount of working fluid 2b held on the upper wall surface 54a can be increased. The working fluid 2b held on the upper wall surface 54a moves across the first wall surface protrusion 57 to the lower wall surface 53a, and is transported to the evaporation zone SR by means of the capillary action of the lower wall surface 53a. Therefore, by using the working fluid 2b held by the upper wall surface 54a, the amount of working fluid 2b transported toward the evaporation zone SR can be increased.

[0377] The lower side wall 53a is connected to the first main body surface 30a, and the first main body surface 30a is provided with a main flow channel 61 and a connecting channel 65 for the liquid flow path 60. In this case, the lower side wall 53a is close to the liquid flow path 60, and the working fluid 2b can flow between the lower side wall 53a and the liquid flow path 60.

[0378] Similarly, in this embodiment, the second wall protrusion 58 is positioned in the Z direction closer to the second main body surface 30b than the midpoint MP between the first main body surface 30a and the second main body surface 30b. In this case, the length of the upper wall surface 54b connected to the second wall protrusion 58 is shortened, thereby improving the capillary effect on the working fluid 2b adhering to the upper wall surface 54b.

[0379] On the other hand, when viewed in a section perpendicular to the X direction, the length of the lower wall surface 53b connected to the second wall surface protrusion 58 becomes longer. In this case, the effect of holding the working fluid 2b on the lower wall surface 53b is improved, and the amount of working fluid 2b held on the lower wall surface 53b can be increased. The working fluid 2b held on the lower wall surface 53b moves across the second wall surface protrusion 58 to the upper wall surface 54b and is transported to the evaporation zone SR by means of the capillary action of the upper wall surface 54b. Therefore, by using the working fluid 2b held by the lower wall surface 53b, the amount of working fluid 2b transported toward the evaporation zone SR can be increased.

[0380] The lower side wall 53b is connected to the first main body surface 30a, and the first main body surface 30a is provided with a main flow channel 61 and a connecting channel 65 for the liquid flow path section 60. In this case, the lower side wall 53b is close to the liquid flow path section 60, and the working liquid 2b held by the lower side wall 53b can move to the liquid flow path section 60. As a result, the amount of working liquid 2b conveyed toward the evaporation zone SR can also be increased.

[0381] In this way, the working fluid 2b can be transported to the evaporation zone SR not only through the liquid flow path section 60, but also through the vapor flow path section 50.

[0382] Thus, according to this embodiment, the lower wall surface 53a of the lower vapor flow path recess 53 and the upper wall surface 54a of the upper vapor flow path recess 54 are connected by a first wall surface protrusion 57. The first wall surface protrusion 57 protrudes toward the inside of the vapor flow path portion 50 and is offset in the Z direction relative to the midpoint MP between the first main body surface 30a and the second main body surface 30b. As a result, when viewed in a cross section perpendicular to the X direction, the length of the lower wall surface 53a is different from the length of the upper wall surface 54a. Therefore, the capillary action imparted to the working liquid 2b adhering to the shorter of the two wall surfaces 53a and 54a can be improved, and the retention of the working liquid 2b held on the longer of the two wall surfaces can be improved. For example, when the length of the lower wall surface 53a is shorter, the working liquid 2b held by the upper wall surface 54a can be transported to the evaporation zone SR by the capillary action of the lower wall surface 53a. Therefore, the amount of working fluid 2b transported toward the evaporation zone SR can be increased. As a result, the heat dissipation efficiency of the evaporation chamber 1 can be improved, thereby improving the cooling efficiency of the electronic device D.

[0383] Furthermore, according to this embodiment, a liquid flow path 60 comprising multiple main flow channels 61 and multiple connecting channels 65 is provided on the first main body surface 30a, and the first wall protrusion 57 is positioned closer to the first main body surface 30a than the intermediate position MP between the first main body surface 30a and the second main body surface 30b. This allows the first wall protrusion 57 to approach the liquid flow path 60. Therefore, the capillary action applied to the working fluid 2b adhering to the lower side wall 53a near the liquid flow path 60 can be improved, thereby allowing the working fluid 2b to flow between the lower side wall 53a and the liquid flow path 60. In this case, the working fluid 2b can be concentrated on the side with stronger capillary action in the lower side wall 53a and the liquid flow path 60, increasing the amount of working fluid 2b transported toward the evaporation region SR.

[0384] Furthermore, according to this embodiment, the lower wall surface 53b of the lower vapor flow path recess 53 and the upper wall surface 54b of the upper vapor flow path recess 54 are connected by a second wall surface protrusion 58. The second wall surface protrusion 58 protrudes towards the inside of the vapor flow path portion 50 and is offset in the Z direction relative to the midpoint MP between the first main body surface 30a and the second main body surface 30b. As a result, when viewed in a cross section perpendicular to the X direction, the length of the lower wall surface 53b is different from the length of the upper wall surface 54b. Therefore, the capillary effect on the working liquid 2b adhering to the shorter of the lower and upper wall surfaces 53b can be improved, and the retention effect on the working liquid 2b held on the longer of the wall surface can be improved. For example, when the upper wall surface 54b is shorter, the working liquid 2b held by the lower wall surface 53b can be transported to the evaporation zone SR by the capillary effect of the upper wall surface 54b. Therefore, the amount of working fluid 2b transported toward the evaporation zone SR can be increased. As a result, the heat dissipation efficiency of the evaporation chamber 1 can be improved, thereby improving the cooling efficiency of the electronic device D.

[0385] Furthermore, according to this embodiment, the center 55a of the lower opening 55 of the vapor flow path 50 located on the first main body surface 30a of the core sheet 30 is offset relative to the center 56a of the upper opening 56 located on the second main body surface 30b. This allows for easy offsetting of the first wall protrusion 57 and the second wall protrusion 58 relative to the midpoint MP between the first and second main body surfaces 30a and 30b. Consequently, the amount of working fluid 2b conveyed toward the evaporation region SR can be easily increased. Additionally, when the center 55a of the lower opening 55 is offset relative to the center 56a of the upper opening 56, the difference between the width w2 of the lower opening 55 and the width w3 of the upper opening 56 can be reduced. In this case, deviations in the holding effect of the lower wall surface 53b on the working fluid 2b and the holding effect of the upper wall surface 54a on the working fluid 2b can be suppressed. Therefore, the performance of evaporation chamber 1 can be suppressed from being affected by the orientation of evaporation chamber 1, thereby improving the reliability of evaporation chamber 1.

[0386] Furthermore, in this embodiment described above, the following example was illustrated: the first wall protrusion 57 is positioned closer to the first main body surface 30a than the intermediate position MP, and the second wall protrusion 58 is positioned closer to the second main body surface 30b than the intermediate position MP. However, this is not a limitation. For example, the first wall protrusion 57 may be positioned closer to the second main body surface 30b than the intermediate position MP, and the second wall protrusion 58 may be positioned closer to the first main body surface 30a than the intermediate position MP. In this case, the second wall protrusion 58 can be positioned close to the liquid flow path 60, allowing the working fluid 2b to flow between the lower side wall 53b and the liquid flow path 60. Alternatively, the second wall protrusion 58 may also be positioned at the intermediate position MP.

[0387] Or, such as Figure 24 As shown, the first wall protrusion 57 may be positioned closer to the first main body surface 30a than the middle position MP, and the second wall protrusion 58 may be positioned closer to the first main body surface 30a than the middle position MP.

[0388] For example, in Figure 21 In the etching process shown, by forming the first resist opening 72 in a way that reduces the etching rate of the lower vapor flow path recess 53, it is possible to form Figure 24 The first wall protrusion 57 and the second wall protrusion 58 are shown. Figure 24In this configuration, the distance s4 from the first main body surface 30a to the first wall protrusion 57 can, for example, be 20 μm or more. For example, the distance s4 can be less than t4 / 2 or less than h1. The distance s5 from the first main body surface 30a to the second wall protrusion 58 can be equal to or different from the distance s4. The distance s5 can, for example, be 20 μm or more. For example, the distance s5 can be less than t4 / 2 or less than h1.

[0389] according to Figure 24 In the modified example shown, the first wall protrusion 57 is positioned closer to the first main body surface 30a than the intermediate position MP, and the second wall protrusion 58 is positioned closer to the first main body surface 30a than the intermediate position MP. This allows the first wall protrusion 57 and the second wall protrusion 58 to approach the liquid flow path 60. Therefore, the capillary effect on the working fluid 2b adhering to the lower sidewalls 53a and 53b near the liquid flow path 60 can be improved. In this case, the working fluid 2b can flow between the lower sidewall 53a and the liquid flow path 60, and also between the lower sidewall 53b and the liquid flow path 60. Therefore, the working fluid 2b can be concentrated in the lower sidewalls 53a, 53b, and the liquid flow path 60 where the capillary effect is strong, increasing the amount of working fluid 2b transported towards the evaporation zone SR.

[0390] In addition, according to Figure 24 In the modified example shown, the first wall protrusion 57 is positioned closer to the first main body surface 30a than the intermediate position MP, and the second wall protrusion 58 is positioned closer to the first main body surface 30a than the intermediate position MP. This allows the flow path of the working vapor 2a diffusing within the upper vapor flow path recess 54 to approach a larger circular shape. Therefore, the flow path resistance of the working vapor 2a can be reduced, and the working vapor 2a can diffuse more easily. Thus, the heat dissipation efficiency of the evaporation chamber 1 can be improved, thereby improving the cooling efficiency of the electronic device D.

[0391] Furthermore, in the above embodiment, an example was described where the lower wall surface 53b of the lower vapor flow path recess 53 and the upper wall surface 54b of the upper vapor flow path recess 54 are connected by the second wall surface protrusion 58. However, it is not limited to this. For example, as... Figure 25 As shown, the lower sidewall 53b and the upper sidewall 54b can also be continuously formed into a concave shape from the lower sidewall 53b to the upper sidewall 54b. In this case, the lower sidewall 53b and the upper sidewall 54b can also be formed in a manner that bulges outward toward the outside of the steam flow path recesses 53 and 54. For example, the lower sidewall 53b and the upper sidewall 54b can also be formed as follows: Figure 25Compared to the straight line connecting the lower opening side edge 55b and the upper opening side edge 56b on the right side shown, the lower wall surface 53b and the upper wall surface 54b bulge outwards from the vapor flow path recesses 53 and 54. The lower wall surface 53b and the upper wall surface 54b can also be continuously and smoothly curved.

[0392] For example, in Figure 21 In the etching process shown, the etching rate of the portion of the lower sidewall 53b in the lower vapor flow path recess 53 can be relatively increased compared to the etching rate of the portion of the lower sidewall 53a. For example, the first resist opening 72 can be formed in a way that reduces the etching rate of the portion of the lower sidewall 53a in the lower vapor flow path recess 53. This allows the etching rate of the portion of the lower sidewall 53b in the lower vapor flow path recess 53 to be greater than the etching rate of the portion of the lower sidewall 53a. Similarly, the third resist opening 74 can be formed in a way that reduces the etching rate of the portion of the upper sidewall 54a in the upper vapor flow path recess 54. This allows the etching rate of the portion of the upper sidewall 54b in the upper vapor flow path recess 54 to be greater than the etching rate of the portion of the upper sidewall 54a. Thus, the lower sidewall 53b and the upper sidewall 54b are formed without forming the second wall protrusion 58. As a result, the lower sidewall 53b and the upper sidewall 54b are continuously concave from the lower sidewall 53b to the upper sidewall 54b.

[0393] Thus, according to Figure 25 In the modified example shown, the lower side wall 53b and the upper side wall 54b are continuously concave from the lower side wall 53b to the upper side wall 54b. This allows the flow path of the working vapor 2a diffusing within the concave portions 53 and 54 of the vapor flow path to approach a large circular shape. Therefore, the flow path resistance of the working vapor 2a can be reduced, and the working vapor 2a can diffuse more easily. Thus, the heat dissipation efficiency of the evaporation chamber 1 can be improved, thereby improving the cooling efficiency of the electronic device D.

[0394] (Third Implementation)

[0395] Next, use Figures 26-35 The main body sheet for the evaporation chamber, the evaporation chamber, and the electronic equipment according to the third embodiment of the present invention will be described.

[0396] exist Figures 26-35 In the third embodiment shown, third spatial recesses are provided on both sides of the second spatial recess on the second main body surface. A pair of third wall protrusions connecting each wall surface of the second spatial recess to the corresponding third wall surface of the third spatial recess protrude toward the second main body surface. The main differences lie in these aspects. Other structures are similar. Figures 16-25 The second embodiment shown is largely the same. Furthermore, in Figures 26-35 In the middle, to and Figures 16-25 The same parts as those in the second embodiment shown are labeled with the same reference numerals and detailed descriptions are omitted.

[0397] like Figure 26 As shown, in the evaporation chamber 1 of this embodiment, the first vapor passage 51 and the second vapor passage 52 of the vapor flow path section 50 respectively have a lower vapor flow path recess 53, a first upper vapor flow path recess 81, and a second upper vapor flow path recess 82. The lower vapor flow path recess 53 is an example of a first spatial recess and is provided on the first main body surface 30a. The first upper vapor flow path recess 81 is an example of a second spatial recess and is provided on the second main body surface 30b. The second upper vapor flow path recess 82 is an example of a third spatial recess and is provided on the second main body surface 30b. The first upper vapor flow path recess 81 has a pair of first upper sidewalls 81a and 81b. The first upper sidewalls 81a and 81b are examples of second walls. The first upper sidewall 81a is... Figure 26 The left side wall, the first upper side wall 81b is Figure 26 The right-side wall surface. In this embodiment, the first upper vapor flow path recess 81 and the first upper wall surfaces 81a and 81b are... Figure 16 The upper vapor flow path recess 54 and upper wall surfaces 54a and 54b shown are substantially the same. Therefore, detailed descriptions of the first upper vapor flow path recess 81 and the first upper wall surfaces 81a and 81b are omitted.

[0398] like Figure 26 As shown, when viewed in a cross section perpendicular to the X direction, the second upper vapor flow path recess 82 is located on both sides of the first upper vapor flow path recess 81. Each of the second upper vapor flow path recesses 82 is connected to the first upper vapor flow path recess 81, forming a continuous opening on the second main body surface 30b.

[0399] The second upper vapor flow path recess 82 is formed in a concave shape on the second main body surface 30b by etching from the second main body surface 30b of the core sheet 30 in the second etching process described later. Thus, as Figure 26 As shown, the second upper vapor flow path recess 82 has a second upper wall surface 82a formed in a curved shape. The second upper wall surface 82a is an example of the third wall surface. The second upper wall surface 82a defines the second upper vapor flow path recess 82 and constitutes a part of the first vapor passage 51 and a part of the second vapor passage 52.

[0400] In this embodiment, the upper opening 83 is located on the second main body surface 30b, and is the opening of the first upper vapor flow path recess 81 and the second upper vapor flow path recess 82 on the second main body surface 30b. Figure 6As shown, the planar shape of the upper opening 83 in the first vapor passage 51 is a rectangular frame. Figure 6 As shown, the upper opening 83 in the second vapor passage 52 has a slender rectangular shape. The upper opening 83 is an opening defined on the second main body surface 30b by the first upper vapor flow path recess 81 and the second upper vapor flow path recess 82.

[0401] The width w8 of the upper opening 83 can be, for example, 200 μm to 6000 μm. Here, the width w8 of the upper opening 83 is the dimension of the upper opening 83 in the Y direction. The width w8 of the upper opening 83 corresponds to the Y-direction dimension of the portion extending in the X direction in the first vapor passage 51, and also corresponds to the Y-direction dimension of the second vapor passage 52. In this embodiment, the Y-direction dimension between the second upper wall surfaces 82a of the pair of second upper vapor flow path recesses 82 that define the vapor passages 51 and 52 gradually increases from the first main body surface 30a toward the second main body surface 30b, and becomes the maximum on the second main body surface 30b. Therefore, the width w8 becomes the maximum value of the Y-direction dimension between the pair of second upper wall surfaces 82a. However, the Y-direction dimension between the pair of second upper wall surfaces 82a may not be the maximum on the second main body surface 30b. For example, the position where the Y-direction dimension between the pair of second upper sidewalls 82a becomes the largest can also be located closer to the first main body surface 30a than the second main body surface 30b. Furthermore, the width w8 also corresponds to the X-direction dimension of the portion extending along the Y-direction in the first vapor passage 51. Additionally, the width w8 of the upper opening 83 can also be greater than the width w2 of the lower opening 55. In this embodiment, the upper opening 83 can also extend from the region 56c that overlaps with the lower opening 55 when viewed from above to the position that overlaps with the main flow channel 61 when viewed from above.

[0402] In this embodiment, the cross-sectional shapes of the first vapor passage 51 and the second vapor passage 52 can also be symmetrical in the Y direction. That is, the center 55a of the lower opening 55 can also be positioned at the same location in the Y direction relative to the center 83a of the upper opening 83.

[0403] The upper opening 83 is defined by a pair of upper opening side edges 83b (an example of the second opening side edge) extending along the X direction. The center 83a of the upper opening 83 is the midpoint of the pair of upper opening side edges 83b when viewed from a section perpendicular to the X direction. Figure 26 In the middle, the upper opening side edge 83b is indicated as the intersection of the second main body surface 30b and the second upper side wall surface 82a of the second upper vapor flow path recess 82, and the midpoint of these intersections is the center 83a of the upper opening 83.

[0404] Each upper opening side edge 83b is offset to one side relative to the corresponding lower opening side edge 55b. Figure 26 In the upper opening 83, the upper opening edge 83b on the right side is offset to the right relative to the lower opening edge 55b on the right side of the lower opening 55, and the upper opening edge 83b on the left side is offset to the left relative to the lower opening edge 55b on the left side. Thus, the width w8 of the upper opening 83 is greater than the width w2 of the lower opening 55.

[0405] In this embodiment, the first upper side walls 81a and 81b of the first upper vapor flow path recess 81 do not extend to the second main body surface 30b. The width w9 of the opening can also be [not specified] when the first upper side walls 81a and 81b are extended to the second main body surface 30b along their curved shape. Figure 17 The width w3 of the upper opening 56 shown is equal. That is, in the first patterning process described later, the third resist opening 94 formed on the first upper resist film 91 formed on the second main body surface 30b can also be equal to the first resist opening 92 formed on the first lower resist film 90 formed on the first main body surface 30a.

[0406] like Figure 26 As shown, the first upper side wall surfaces 81a and 81b of the first upper vapor flow path recess 81 are connected to the second upper side wall surface 82a of the corresponding second upper vapor flow path recess 82 via the third wall surface protrusion 84. Therefore, the first upper side wall surfaces 81a and 81b do not extend to the second main body surface 30b, and the first upper vapor flow path recess 81 communicates with the second upper vapor flow path recess 82 on its side.

[0407] The third wall protrusion 84 may also protrude toward the second main body surface 30b. The third wall protrusion 84 may also be formed to extend toward the upper sheet 20. The third wall protrusion 84 is located closer to the first main body surface 30a than the second main body surface 30b, and is separated from the first upper sheet surface 20a of the upper sheet 20.

[0408] The lower side walls 53a and 53b of the lower vapor flow path recess 53 are connected to the corresponding first upper side walls 81a and 81b of the first upper vapor flow path recess 81 via wall protrusions 57 and 58. More specifically, the lower side wall 53a of the lower vapor flow path recess 53 is connected to the corresponding first upper side wall 81a of the first upper vapor flow path recess 81 via a first wall protrusion 57. The lower side wall 53b of the lower vapor flow path recess 53 is connected to the corresponding first upper side wall 81b of the first upper vapor flow path recess 81 via a second wall protrusion 58. The first wall protrusion 57 is... Figure 26 The left wall protrusion, the second wall protrusion 58 is Figure 26The protrusion on the right side of the wall.

[0409] like Figure 26 As shown, the first wall protrusion 57 can also be positioned at the intermediate position MP between the first main body surface 30a and the second main body surface 30b. The second wall protrusion 58 can also be positioned at the intermediate position MP between the first main body surface 30a and the second main body surface 30b.

[0410] The through portion 34 is defined by a pair of wall protrusions 57 and 58. In the through portion 34, the lower vapor flow path recess 53 communicates with the first upper vapor flow path recess 81. The width w10 of such a through portion 34 (see reference) Figure 26 For example, it can be 400μm to 1600μm. Here, the width w10 of the through portion 34 corresponds to the gap between adjacent island portions 33 in the Y direction. More specifically, the width w10 refers to the distance in the Y direction between the end of the first wall protrusion 57 and the end of the second wall protrusion 58 that define the through portion 34.

[0411] Additionally, the width w11 of the island portion 33 in this embodiment (refer to...) Figure 26 For example, it can be 100μm to 1500μm. Here, the width w11 of the island 33 is the maximum dimension of the island 33 in the Y direction. More specifically, the width w11 of the island 33 refers to the distance in the Y direction between the end of the first wall protrusion 57 and the end of the second wall protrusion 58 that define the island 33.

[0412] Next, use Figures 27-34 The manufacturing method of the evaporation chamber 1 of this embodiment, which has such a structure, will be described. Here, the differences from the second embodiment will be mainly explained.

[0413] exist Figure 18 After the material preparation process shown, as Figure 27 As shown, as the first resist forming step, a first lower resist film 90 is formed on the lower surface Ma of the metal material sheet M, and a first upper resist film 91 is formed on the upper surface Mb. The first resist forming step can be combined with... Figure 19 The resist formation process shown is performed in the same manner.

[0414] Next, as Figure 28As shown, as the first patterning process, the first lower resist film 90 and the first upper resist film 91 are patterned using photolithography. In this case, a first resist opening 92 corresponding to the lower opening 55 is formed on the first lower resist film 90, and a second resist opening 93 corresponding to the main flow channel 61 and the connecting channel 65 of the liquid flow path 60 is formed. Additionally, a third resist opening 94 corresponding to the upper opening 83 is formed on the first upper resist film 91. The Y-direction dimension w9' of the third resist opening 94 is... Figure 26 The shown width w9 corresponds to the dimension, and is the dimension set for forming the width w9 by etching. w9' can be equal to or different from the Y-direction dimension w3' of the first resist opening 92.

[0415] Next, as Figure 29 As shown, as the first etching process, and Figure 21 The etching process shown also etches the lower surface Ma and upper surface Mb of the metal sheet M. Thus, a layer is formed on the lower surface Ma of the metal sheet M. Figure 29 The vapor flow path 50 shown includes a lower vapor flow path recess 53, and the liquid flow path 60 includes a main flow channel 61 and a connecting channel 65. Additionally, a first upper vapor flow path recess 81 of the vapor flow path 50 is formed on the upper surface Mb.

[0416] After the first etching process, as Figure 30 As shown, as the first resist removal process, the first lower resist film 90 and the first upper resist film 91 are removed.

[0417] After the first resist removal process, such as Figure 31 As shown, as the second resist forming process, a second lower resist film 95 is formed on the lower surface Ma of the metal sheet M, and a second upper resist film 96 is formed on the upper surface Mb. Additionally, a wall resist film 97 is formed on the lower wall surfaces 53a and 53b of the lower vapor flow path recess 53 and the first upper wall surfaces 81a and 81b of the first upper vapor flow path recess 81. Liquid resist film 95, second upper resist film 96, and wall resist film 97 can also be formed using liquid resist. In this case, the wall resist film 97 can be easily formed on the lower wall surfaces 53a and 53b and the first upper wall surfaces 81a and 81b. Before forming each resist film 95-97, as a pretreatment, the lower surface Ma and upper surface Mb of the metal sheet M, as well as each wall surface 53a, 53b, 81a, 81b, can be subjected to acid degreasing treatment.

[0418] Next, as Figure 32As shown, as the second patterning process, the second upper resist film 96 and the wall resist film 97 are patterned using photolithography. In this case, a fourth resist opening 98 corresponding to the second upper vapor flow path recess 82 is formed on the second upper resist film 96 and the wall resist film 97. The fourth resist opening 98 is formed to extend from the second upper resist film 96 to the wall resist film 97. Figure 32 As shown, the fourth resist opening 98 can also be formed such that the opening edge on the opposite side of the first upper vapor flow path recess 81 satisfies the dimension w8' in the Y direction. w8' is a dimension corresponding to the width w8 of the upper opening 83, and is a dimension set for forming the width w8 of the upper opening 83 by etching.

[0419] Next, as Figure 33 As shown, as the second etching process, and Figure 21 The etching process shown also etches the upper surface Mb of the metal sheet M and the first upper wall surfaces 81a and 81b of the first upper vapor flow path recess 81. As a result, the second upper vapor flow path recess 82 of the vapor flow path portion 50 is formed on the upper surface Mb of the metal sheet M and the first upper wall surfaces 81a and 81b.

[0420] After the second etching process, as Figure 34 As shown, as the second resist removal process, the second lower resist film 95 and the second upper resist film 96 are removed.

[0421] Thus, the core sheet 30 of this embodiment is obtained.

[0422] Thus, according to this embodiment, the first upper wall surfaces 81a and 81b of the first upper vapor flow path recess 81 are connected to the second upper wall surface 82a of the second upper vapor flow path recess 82 located on both sides of the first upper vapor flow path recess 81 via a third wall surface protrusion 84. The third wall surface protrusion 84 protrudes toward the second main body surface 30b. This prevents the second upper sheet surface 20b of the upper sheet 20 from deforming into a concave shape. Specifically, it considers the situation where, by bearing atmospheric pressure on the second upper sheet surface 20b, the portion of the upper sheet 20 overlapping with the upper opening 83 enters the first upper vapor flow path recess 81 and the second upper vapor flow path recess 82 of the depressurized vapor flow path portion 50. In this case, it prevents this portion of the upper sheet 20 from entering deeper than the third wall surface protrusion 84. Therefore, it is possible to suppress the deformation of the second upper sheet surface 20b of the upper sheet 20 into a concave shape. In this case, the tightness of the fit between the electronic device D and the lower sheet 10 can be improved, and the thermal resistance between the electronic device D and the evaporation chamber 1 can be reduced.

[0423] Furthermore, in the above-described embodiment, an example was described where the first wall protrusion 57 and the second wall protrusion 58 are positioned at an intermediate position MP between the first main body surface 30a and the second main body surface 30b in the Z direction. However, this is not the only limitation.

[0424] For example, such as Figure 35 As shown, the first wall protrusion 57 can also be configured offset relative to the intermediate position MP in the Z direction. Figure 35 In the middle, the first wall protrusion 57 is positioned closer to the first main body surface 30a than the intermediate position MP. The distance s2 from the first main body surface 30a to the first wall protrusion 57 can also be... Figure 17 The distance s2 shown is the same.

[0425] like Figure 35 As shown, the second wall protrusion 58 can also be configured offset relative to the intermediate position MP in the Z direction. Figure 35 In the middle, the second wall protrusion 58 is positioned closer to the second main body surface 30b than the central position MP. The distance s3 from the second main body surface 30b to the second wall protrusion 58 can also be... Figure 17 The distance s3 shown is the same.

[0426] exist Figure 35 In the modified example shown, the first wall protrusion 57 and the second wall protrusion 58 are... Figure 17 The example shown is configured similarly. In this case, the cross-sectional shapes of the first vapor passage 51 and the second vapor passage 52 can also be asymmetrical in the Y direction.

[0427] exist Figure 35 In the middle, the center 55a of the lower opening 55 is offset to one side in the Y direction relative to the center 83a of the upper opening 83. Figure 35 The diagram shows an example where the lower opening 55 is offset to the right relative to the upper opening 83, but it could also be offset to the left. The offset between the center 55a of the lower opening 55 and the center 83a of the upper opening 83 can also be... Figure 17 The offset s1 shown is equal.

[0428] exist Figure 35In this configuration, the upper opening edge 83b on the right side of the upper opening 83 is offset to the right relative to the lower opening edge 55b on the right side of the lower opening 55, and the upper opening edge 83b on the left side is offset to the left relative to the lower opening edge 55b on the left side. Thus, the width w8 of the upper opening 83 is greater than the width w2 of the lower opening 55. However, as long as the width w8 of the upper opening 83 is greater than the width w2 of the lower opening 55, the upper opening edge 83b on the right side of the upper opening 83 can also be offset to the left relative to the lower opening edge 55b on the right side of the lower opening 55. Alternatively, in this case, the upper opening edge 83b on the right side of the upper opening 83 can also be positioned at the same location as the lower opening edge 55b on the right side.

[0429] (Fourth implementation)

[0430] Next, use Figures 36-47 The main sheet for the evaporation chamber, the evaporation chamber, and the electronic equipment according to the fourth embodiment of the present invention will be described.

[0431] exist Figures 36-47 In the fourth embodiment shown, the main difference is that the end of the first wall surface located on the first main body side is positioned inside the steam flow path portion of the protrusion when viewed from above. Other structures are the same as... Figures 1 to 17 The first embodiment shown is largely the same. Furthermore, in Figures 36-47 In the middle, to and Figures 1 to 17 The same parts as those in the first embodiment shown are labeled with the same reference numerals and detailed descriptions are omitted.

[0432] The evaporation chamber 100 of this embodiment will be described. For example... Figure 36 and Figure 37 As shown, the evaporation chamber 100 has a sealed space 103 containing the working fluids 2a and 2b. By repeatedly subjecting the working fluids 2a and 2b within the sealed space 103 to phase changes, the electronic device D of the aforementioned electronic device E is effectively cooled.

[0433] like Figure 36 and Figure 37 As shown, the evaporation chamber 100 includes a lower sheet 110, an upper sheet 120, and a core sheet 130 for the evaporation chamber. Hereinafter, the core sheet 130 for the evaporation chamber will be simply referred to as the core sheet 130. In the evaporation chamber 100 of this embodiment, the lower sheet 110, the core sheet 130, and the upper sheet 120 are stacked sequentially.

[0434] The evaporation chamber 100 is formed as a generally thin flat plate. The planar shape of the evaporation chamber 100 is arbitrary, but it can also be as follows: Figure 36The evaporation chamber 100 can be, for example, a rectangle with one side measuring 50mm or more and 200mm or less, and the other side measuring 150mm or more and 60mm, or a square with one side measuring 70mm or more and 300mm or less. The planar dimensions of the evaporation chamber 100 are arbitrary. In this embodiment, as an example, the following example will be described: the planar shape of the evaporation chamber 100 is a rectangle with the X direction as its longer side, as described later. In this case, as... Figures 38 to 41 As shown, the lower sheet 110, the upper sheet 120, and the core sheet 130 may also have the same planar shape as the evaporation chamber 100. Furthermore, the planar shape of the evaporation chamber 100 is not limited to a rectangular shape, but may also be any shape such as a circle, an ellipse, an L-shape, or a T-shape.

[0435] like Figure 36 As shown, the evaporation chamber 100 has an evaporation zone SR for evaporating working fluids 2a and 2b and a condensation zone CR for condensing working fluids 2a and 2b.

[0436] The evaporation region SR is the area that overlaps with the electronic device D when viewed from above, and it is the area where the electronic device D is mounted. The evaporation region SR can also be positioned anywhere within the evaporation chamber 100. In this embodiment, it is located on one side of the evaporation chamber 100 in the X direction ( Figure 36 An evaporation zone SR is formed on the left side of the evaporation chamber 100. Heat from the electronic device D is transferred to the evaporation zone SR, through which the working fluid 2b evaporates in the evaporation zone SR. The heat from the electronic device D can be transferred not only to the area overlapping with the electronic device D when viewed from above, but also to the periphery of that area. Therefore, the evaporation zone SR includes the area overlapping with the electronic device D when viewed from above and the area surrounding it. Here, the view from above can also be as follows: viewed from a direction perpendicular to the surface of the evaporation chamber 100 that receives heat from the electronic device D and the surface that releases the received heat. The surface that receives heat corresponds to the second upper sheet surface 120b of the upper sheet 120, which will be described later. The surface that releases heat corresponds to the first lower sheet surface 110a of the lower sheet 110, which will be described later. For example, as Figure 36 As shown, the state of the evaporation chamber 100 viewed from above or from below is equivalent to a top view.

[0437] The condensation region CR is the area that does not overlap with the electronic device D when viewed from above; it is mainly the area where the working vapor 2a releases heat and condenses. The condensation region CR can also be the area surrounding the evaporation region SR. In the condensation region CR, heat from the working vapor 2a is released to the lower sheet 110, and the working vapor 2a is cooled and condensed in the condensation region CR.

[0438] Furthermore, when the evaporation chamber 100 is installed inside a mobile terminal, the vertical relationship may not be valid depending on the orientation of the mobile terminal. However, in this embodiment, for convenience, the sheet that receives heat from the electronic device D will be referred to as the upper sheet 120, and the sheet that releases the received heat will be referred to as the lower sheet 110. Therefore, the following description will be based on the state where the lower sheet 110 is positioned on the lower side and the upper sheet 120 is positioned on the upper side.

[0439] like Figure 37 As shown, the lower sheet 110 is an example of a first sheet. The lower sheet 110 has a first lower sheet surface 110a located on the side opposite to the core sheet 130 and a second lower sheet surface 110b located on the side opposite to the first lower sheet surface 110a. The second lower sheet surface 110b is located on the side of the core sheet 130. The lower sheet 110 can be integrally formed as a flat surface, and the lower sheet 110 can also have an integral thickness. A housing component Ha, constituting part of the housing of a mobile terminal, etc., can also be mounted on the first lower sheet surface 110a. The entire first lower sheet surface 110a can also be covered by the housing component Ha. Figure 38 As shown, alignment holes 112 can also be provided at the four corners of the lower sheet 110.

[0440] like Figure 37 As shown, the upper sheet 120 is an example of the second sheet. The upper sheet 120 has a first upper sheet surface 120a disposed on the side of the core sheet 130 and a second upper sheet surface 120b located on the side opposite to the first upper sheet surface 120a. The upper sheet 120 can be integrally formed into a flat shape, and the upper sheet 120 can also have an integral thickness. The aforementioned electronic device D can also be mounted on this second upper sheet surface 120b. Figure 39 As shown, alignment holes 122 can also be provided at the four corners of the upper sheet 120.

[0441] like Figure 37 As shown, the core sheet 130 is an example of the main sheet. The core sheet 130 includes a vapor flow path 150 and a liquid flow path 160 disposed adjacent to the vapor flow path 150. In addition, the core sheet 130 has a first main body surface 131a and a second main body surface 131b located on the side opposite to the first main body surface 131a. The first main body surface 131a is disposed on the lower sheet 110 side, and the second main body surface 131b is disposed on the upper sheet 120 side.

[0442] The second lower sheet surface 110b of the lower sheet 110 and the first main body surface 131a of the core sheet 130 can also be permanently bonded to each other by diffusion bonding. Similarly, the first upper sheet surface 120a of the upper sheet 120 and the second main body surface 131b of the core sheet 130 can also be permanently bonded to each other by diffusion bonding. Alternatively, if the lower sheet 110, upper sheet 120, and core sheet 130 can be permanently bonded instead of by diffusion bonding, they can also be bonded together by other methods such as brazing.

[0443] like Figure 37 , Figure 40 and Figure 41 As shown, the core sheet 130 of this embodiment has a frame portion 132 that is formed into a rectangular frame shape when viewed from above, and island portions 133 disposed within the frame portion 132. The frame portion 132 and each island portion 133 extend from the first main body surface 131a to the second main body surface 131b. The frame portion 132 and the island portions 133 are portions of the core sheet 130 that are not etched in the etching process described later, resulting in material residue on the core sheet 130. In this embodiment, the frame portion 132 is formed into a rectangular frame shape when viewed from above. A vapor flow path portion 150 is defined on the inner side of the frame portion 132. Working vapor 2a flows inside the frame portion 132 and around the island portions 133.

[0444] In this embodiment, the island 133 may also extend elongatedly in the X direction when viewed from above. The planar shape of the island 133 may also be an elongated rectangular shape. The islands 133 may also be equally spaced in the Y direction and arranged parallel to each other. The working steam 2a flows around each island 133 and is transported towards the condensation region CR. This suppresses any obstruction to the flow of the working steam 2a. The width w21 of the island 133 (refer to...) Figure 42 For example, it can be 36 μm or more and 4000 μm or less. Here, the width w21 of the island 133 refers to the dimension of the island 133 in the Y direction, and refers to the dimension at the thickest position of the island 133 (for example, the position where the first wall end 153b exists, described later).

[0445] The frame portion 132 and each island portion 133 are diffusely bonded to the lower sheet 110 and to the upper sheet 120. This improves the mechanical strength of the evaporation chamber 100. The first wall surface 153a, the second wall surface 154a, and the protrusion 155 of the vapor passage 151 (described later) constitute the sidewalls of the island portion 133. The first wall surface 153a, the second wall surface 154a, and the protrusion 155 are formed on both sides of each island portion 133 in the width direction (X direction). The cross-sectional shape of each island portion 133 along the width direction (X direction) is shown in the figure. Figure 42It can also be a linearly symmetrical shape. Furthermore, the width w26 of the island portion 133 at the location where the protrusion 155 exists can, for example, be 30 μm or more and 3000 μm or less. The first main body surface 131a and the second main body surface 131b of the core sheet 130 can also be flattened throughout the frame portion 132 and each island portion 133. Furthermore, in Figure 37 In this case, the sidewalls of the frame portion 132 have a shape that is substantially the same as the sidewalls of the island portion 133. However, it is not limited to this, and the sidewalls of the frame portion 132 may not have a shape that is substantially the same as the sidewalls of the island portion 133.

[0446] The steam flow path 50 is an example of a through space. The steam flow path 150 is the main flow path through which the working steam 2a passes. The steam flow path 150 extends from the first main body surface 131a to the second main body surface 131b, passing through the core sheet 130.

[0447] like Figure 40 and Figure 41 As shown, the vapor flow path 150 in this embodiment has a plurality of vapor passages 151. Each vapor passage 151 is formed inside the frame portion 132 and outside the island portion 133. That is, the vapor passages 151 are formed between the frame portion 132 and the island portion 133, and between adjacent island portions 133. Each vapor passage 151 has a long rectangular shape. The vapor flow path 150 is divided into a plurality of vapor passages 151 by the plurality of island portions 133.

[0448] like Figure 37 As shown, the vapor passage 151 is formed extending from the first body surface 131a of the core sheet 130 to the second body surface 131b. The vapor passage 151 can also be formed by etching from the first body surface 131a and the second body surface 131b of the core sheet 130 in an etching process described later.

[0449] like Figure 42 As shown, the steam passage 151 has a first wall surface 153a and a second wall surface 154a that are both curved. The first wall surface 153a is located on the side of the first main body surface 131a and is curved in a shape that is recessed inward in the width direction of the island portion 133. The second wall surface 154a is located on the side of the second main body surface 131b and is curved in a shape that is recessed inward in the width direction of the island portion 133. The first wall surface 153a and the second wall surface 154a meet at a protrusion 155 that extends inward into the steam passage 151. The protrusion 155 may also be formed as an acute angle or an obtuse angle in cross-section. The width w27 of a pair of protrusions 155 that are adjacent to each other across the steam passage 151 (see reference). Figure 42For example, it can be 30 μm or more and 3000 μm or less. Here, the width w27 of the pair of protrusions 155 refers to the distance obtained by measuring the vapor passage 151 along the width direction (Y direction) at the location where the protrusions 155 exist.

[0450] The first wall surface 153a has a first wall surface end 153b located on the side of the first main body surface 131a. The upper end of the first wall surface 153a is a protrusion 155, corresponding to the end of the first wall surface 153a on the side of the second main body surface 131b. The lower end of the first wall surface 153a is the first wall surface end 153b, corresponding to the end of the first wall surface 153a on the side of the first main body surface 131a. The first wall surface 153a is connected to the lower sheet 110 at the first wall surface end 153b. Furthermore, the first wall surface end 153b may also be formed as an acute angle in a sectional view. Additionally, in... Figure 42 In the sectional view, the point in the first wall 153a that is most concave in the width direction (Y direction) of the island 133 is indicated by the label 153c.

[0451] The second wall surface 154a has a second wall surface end 154b located on the side of the second main body surface 131b. The upper end of the second wall surface 154a is the second wall surface end 154b, corresponding to the end of the second wall surface 154a on the side of the second main body surface 131b. The lower end of the second wall surface 154a is a protrusion 155, corresponding to the end of the second wall surface 154a on the side of the first main body surface 131a. The second wall surface 154a is connected to the upper sheet 120 at the second wall surface end 154b. Alternatively, the second wall surface end 154b may also form the outer edge of the protrusion 164 described later. Furthermore, the second wall surface end 154b may also be formed as an obtuse angle in cross-section.

[0452] In this embodiment, the first wall end 153b, when viewed from above, is located inside the steam flow path 150, closer to the protrusion 155. That is, when viewed from above, the second wall end 154b, the dot 153c, the protrusion 155, and the first wall end 153b are sequentially located from the inside to the outside in the width direction (Y direction) of the island 133. The outside corresponds to the steam flow path 150 side. The planar area of ​​the steam passage 151 is largest at the location where the second wall end 154b exists and smallest at the location where the first wall end 153b exists. The width w22 of the steam passage 151 (refer to...) Figure 42 For example, it can be 100 μm or more and 5000 μm or less. Here, the width w22 of the vapor passage 151 refers to the width of the narrowest part of the vapor passage 151, which in this case is the distance measured in the width direction (Y direction) at the location where the first wall end 153b exists. In addition, the width w22 of the vapor passage 151 corresponds to the gap between adjacent islands 133 in the width direction (Y direction).

[0453] like Figure 42 As shown, the distance between the second wall end 154b and the protrusion 155 in the width direction (Y direction) of the vapor flow path 150 is set as Lp, and the distance between the second wall end 154b and the first wall end 153b is set as Ls. In this case, the distance Ls can be more than 1.05 times and less than 2 times the distance Lp, or more than 1.05 times and less than 1.8 times. By making the distance Ls more than 1.05 times the distance Lp, the bonding area between the island 133 and the lower sheet 110 increases, which improves the strength of the diffusion bonding near the first wall end 153b. By making the distance Ls less than 2 times the distance Lp, the width of the vapor passage 151 can be ensured, allowing the working vapor 2a to flow smoothly in the vapor passage 151. The aforementioned distance Ls can be more than 6 μm and less than 500 μm. The aforementioned distance Lp can be more than 3 μm and less than 400 μm.

[0454] Furthermore, the distance Ls between the second wall end 154b and the first wall end 153b can also be set to be at least 1.1 times and less than 10 times the width w25 of the protrusion 164 described later. By making the distance Ls at least 1.1 times the width w25, the joint area between the island 133 and the lower sheet 110 increases, thereby improving the strength of the joint near the first wall end 153b based on diffusion bonding or brazing. By making the distance Ls less than 10 times the width w25, the width of the vapor passage 151 can be ensured, allowing the working vapor 2a to flow smoothly in the vapor passage 151.

[0455] The protrusion 155 in the thickness direction (Z direction) of the core sheet 130 is located closer to the second main surface 131b than the midpoint Pz between the first main surface 131a and the second main surface 131b. When the distance between the protrusion 155 and the second main surface 131b is defined as t25, the distance t25 can be 5% or more, 10% or more, or 20% or more of the thickness t24 of the core sheet 130 (described later). Alternatively, the distance t25 can be less than 45%, 40% or less, or 30% or less of the thickness t24 of the core sheet 130.

[0456] The vapor flow path 150, which includes the vapor passage 151 configured in this way, constitutes a part of the aforementioned sealed space 103. For example... Figure 37 As shown, the steam flow path 150 of this embodiment is mainly defined by the lower sheet 110, the upper sheet 120, and the frame portion 132 and island portion 133 of the core sheet 130 mentioned above. Each steam passage 151 has a relatively large flow path cross-sectional area to allow the working steam 2a to pass through.

[0457] Here, in order to make the accompanying drawings clear, Figure 37In the image, the steam passages 151, etc., are shown in an enlarged format. The number and arrangement of these steam passages 151, etc., are shown in the image. Figure 36 , Figure 40 and Figure 41 different.

[0458] In addition, such as Figure 40 and Figure 41 As shown, a support portion 139 is provided within the steam flow path 150 to support the island portion 133 against the frame portion 132. The support portion 139 supports adjacent island portions 133. The support portion 139 is provided on both sides of the island portion 133 in the long side direction (X direction). The support portion 139 can also be formed so as not to obstruct the flow of working steam 2a diffusing in the steam flow path 150. In this case, the support portion 139 is disposed on the first main body surface 131a side of the core sheet 130, and a space communicating with the steam flow path 150 is formed on the second main body surface 131b side. As a result, the thickness of the support portion 139 can be thinner than the thickness of the core sheet 130, and the steam passage 151 can be prevented from being divided in the X and Y directions. However, it is not limited to this, the support portion 139 can also be disposed on the second main body surface 131b side. Alternatively, a space communicating with the vapor flow path 150 may be formed on both the surface of the support portion 139 on the first main body surface 131a side and the surface of the second main body surface 131b side.

[0459] like Figure 40 and Figure 41 As shown, alignment holes 135 can also be provided at the four corners of the core sheet 130.

[0460] In addition, such as Figure 36 As shown, the evaporation chamber 100 may also have an injection section 104 on one end edge in the X direction for injecting working fluid 2b into the sealed space 103. Figure 36 In the illustrated configuration, the injection section 104 is positioned on the evaporation zone SR side. The injection section 104 has an injection flow path 37 formed on the core sheet 130. This injection flow path 37 is formed on the second main body surface 131b side of the core sheet 130, and is concave from the second main body surface 131b side. After the evaporation chamber 100 is completed, the injection flow path 37 is sealed. Furthermore, the injection flow path 37 communicates with the vapor flow path 150, and the working liquid 2b is injected into the sealed space 103 through the injection flow path 37. Additionally, depending on the configuration of the liquid flow path 160, the injection flow path 37 can also communicate with the liquid flow path 160.

[0461] Furthermore, in this embodiment, an example is shown where the injection portion 104 is provided at one end edge of a pair of end edges in the X direction of the evaporation chamber 100, but it is not limited thereto and can be provided at any position. Additionally, the injection portion 104 may be pre-formed to protrude from one end edge in the X direction of the evaporation chamber 100.

[0462] like Figure 37 , Figure 40 and Figure 41 As shown, a liquid flow path 160 is provided on the second main body surface 131b of the core sheet 130. The liquid flow path 160 is configured to primarily allow the working fluid 2b to pass through. This liquid flow path 160 forms part of the aforementioned sealed space 103 and communicates with the vapor flow path 150. The liquid flow path 160 is configured as a capillary structure (core) for conveying the working fluid 2b to the evaporation zone SR. In this embodiment, the liquid flow path 160 is provided on the second main body surface 131b of each island portion 133 of the core sheet 130. The liquid flow path 160 may also be formed throughout the entire second main body surface 131b of each island portion 133.

[0463] like Figure 43 As shown, the liquid flow path 160 is an example of a tank assembly including multiple tanks. The liquid flow path 160 has multiple main flow channels 161 arranged side-by-side for the working fluid 2b to pass through, and multiple connecting channels 165 communicating with the main flow channels 161. The main flow channels 161 of the liquid flow path 160 are examples of the first tank. The connecting channels 165 of the liquid flow path 160 are examples of the second tank. Furthermore, in Figure 43 In the example shown, each island 133 contains 6 main channel channels 161, but is not limited to this. The number of main channel channels 161 contained in each island 133 is arbitrary, for example, it can be set to more than 3 and less than 20.

[0464] like Figure 43 As shown, each main channel 161 is formed to extend along the long side (X direction) of the island 133. The multiple main channels 161 are arranged parallel to each other. Furthermore, if the island 133 is curved when viewed from above, each main channel 161 may extend in a curved shape along the curvature direction of the island 133. That is, each main channel 161 does not necessarily have to be formed in a straight line, and it may also extend in a direction other than parallel to the X direction.

[0465] The main flow channel 161 has a smaller flow path cross-sectional area than the vapor passage 151 of the vapor flow path section 150, so as to allow the working liquid 2b to flow mainly through capillary action. The main flow channel 161 is configured to transport the working liquid 2b condensed from the working vapor 2a to the evaporation zone SR. The main flow channels 161 are arranged at intervals from each other in the width direction (Y direction).

[0466] The main channel 161 is formed by etching from the second main surface 131b of the core sheet 130 in an etching process described later. Figure 42As shown, the main channel 161 has a curved wall 162. This wall 162 defines the main channel 161, which is curved in a shape bulging towards the first main body surface 131a. Additionally, in Figure 42 In the cross section shown, the radius of curvature of each wall 162 can also be smaller than the radius of curvature of the second wall 154a of the steam passage 151.

[0467] exist Figure 43 In this design, the width w23 of the main channel 161 can be, for example, 2 μm or more and 500 μm or less. The width w23 of the main channel 161 refers to its length in the direction perpendicular to the long side of the island 133, which in this case is the dimension in the Y direction. Alternatively, the width w23 of the main channel 161 refers to the dimension on the second main body surface 131b.

[0468] In addition, such as Figure 42 As shown, the depth h21 of the main channel 161 can, for example, be set to be 3 μm or more and 300 μm or less. Furthermore, the depth h21 of the main channel 161 is the distance measured from the second main body surface 131b in a direction perpendicular to the second main body surface 131b, and in this case, it is the dimension in the Z direction. Additionally, depth h21 refers to the deepest point of the main channel 161.

[0469] like Figure 43 As shown, each connecting groove 165 extends in a direction different from the X direction. In this embodiment, each connecting groove 165 is formed extending in the Y direction and perpendicular to the main flow groove 161. Some connecting grooves 165 are arranged to connect adjacent main flow grooves 161 to each other. Other connecting grooves 165 are configured to connect the steam flow path 150 (steam passage 151) and the main flow groove 161 closest to the steam flow path 150. That is, the connecting groove 165 extends from the end of the island 133 in the Y direction to the main flow groove 161 adjacent to that end. In this way, the steam passage 151 of the steam flow path 150 is connected to the main flow groove 161.

[0470] The connecting channel 165 has a smaller flow path cross-sectional area than the steam passage 151 of the steam flow path 150, so that the working fluid 2b mainly flows through capillary action. Each connecting channel 165 can also be arranged at equal intervals in the long side direction (X direction) of the island 133.

[0471] The connecting groove 165 is also formed by etching, similar to the main groove 161, and has a wall surface (not shown) formed in the same curved shape as the main groove 161. Figure 43 As shown, the width w24 (dimension in the X direction) of the connecting groove 165 can also be set to be 5μm or more and 300μm or less. The depth of the connecting groove 165 can also be set to be 3μm or more and 300μm or less.

[0472] The main channel 161 includes a cross portion 166 communicating with the connecting channel 165. At the cross portion 166, the main channel 161 and the connecting channel 165 are connected in a T-shape. This avoids the situation where, in one main channel 161, there is a connection with one side (e.g., Figure 43 The cross portion 166, which is connected to the connecting groove 165 on the upper side of the middle, and the other side (e.g., Figure 43 The connecting groove 165 (on the lower side of the groove) is connected to the main flow groove 161. Therefore, at the intersection 166, the wall surface 162 of the main flow groove 161 is not cut off on both sides in the Y direction, allowing one side of the wall surface 162 to remain. Thus, at the intersection 166, a capillary effect can also be applied to the working fluid 2b within the main flow groove 161, suppressing the decrease in the propulsion force of the working fluid 2b towards the evaporation region SR at the intersection 166.

[0473] like Figure 43 As shown, a row of liquid protrusions 163 is provided between adjacent main flow channels 161 in the liquid flow path section 160. Additionally, in Figure 43 The example shown illustrates a case where each island 133 contains 7 columns of liquid protrusions 163, but this is not the only example. The number of liquid protrusions 163 contained in each island 133 is arbitrary; for example, it can be set to 3 or more columns and 20 or fewer columns.

[0474] like Figure 43 As shown, each liquid protrusion row 163 is formed to extend along the long side direction (X direction) of the island portion 133. The plurality of liquid protrusion rows 163 are arranged parallel to each other. Furthermore, if the island portion 133 is curved when viewed from above, each liquid protrusion row 163 may also extend in a curved shape along the curvature direction of the island portion 133. That is, each liquid protrusion row 163 does not necessarily have to be formed in a straight line, and it may also not extend parallel to the X direction. The liquid protrusion rows 163 are arranged at intervals in the width direction (Y direction).

[0475] Each liquid protrusion row 163 includes a plurality of protrusions 164 (liquid flow path protrusions) arranged along the X direction. The protrusions 164 are disposed within the liquid flow path portion 160, protruding from the main flow channel 161 and the connecting channel 165 and abutting against the upper sheet 120. Each protrusion 164 is rectangular in shape with the X direction as its long side when viewed from above. Main flow channels 161 are disposed between adjacent protrusions 164 along the Y direction. Connecting channels 165 are disposed between adjacent protrusions 164 along the X direction. The connecting channels 165 are formed extending along the Y direction, connecting adjacent main flow channels 161 in the Y direction. Thus, the working fluid 2b can flow between these main flow channels 161.

[0476] The protrusion 164 is the portion of the core sheet 130 that was not removed during the etching process described later, resulting in material residue. In this embodiment, as... Figure 43 As shown, the planar shape of the protrusion 164 is rectangular. The planar shape of the protrusion 164 corresponds to the shape at the position of the second main body surface 131b of the core sheet 130. The width w25 of the protrusion 164 can be, for example, more than 5 μm and less than 500 μm. In addition, the width w25 of the protrusion 164 refers to the value at the part where the width of the protrusion 164 becomes the largest.

[0477] The spacing between the protrusions 164 in the width direction (Y direction) can be, for example, 7 μm or more and 1000 μm or less. Here, the spacing between the protrusions 164 is the interval between the center of the protrusion 164 in the Y direction and the center of the adjacent protrusion 164 in the Y direction, which refers to the distance measured in the Y direction.

[0478] In this embodiment, the protrusions 164 are arranged in an alternating pattern. More specifically, the protrusions 164 of adjacent liquid protrusion rows 163 in the Y direction are offset from each other in the X direction. This offset may also be half the spacing between the protrusions 164 in the X direction. Furthermore, the arrangement of the protrusions 164 is not limited to an alternating pattern; they may also be arranged side-by-side. In this case, the protrusions 164 of adjacent liquid protrusion rows 163 in the Y direction are also aligned in the X direction.

[0479] The length L1 of the protrusion 164 can also be uniform among the protrusions 164. In addition, the length L1 of the protrusion 164 is longer than the width w24 of the connecting groove 165 (L1 > w24). Furthermore, the length L1 of the protrusion 164 is equivalent to the dimension of the protrusion 164 in the X direction, which refers to the maximum dimension in the X direction on the second main body surface 131b.

[0480] Furthermore, the materials constituting the lower sheet 110, upper sheet 120, and core sheet 130 are not specifically defined as long as they have good thermal conductivity. For example, the lower sheet 110, upper sheet 120, and core sheet 130 may contain copper or copper alloys. In this case, the thermal conductivity of each sheet 110, 120, and 130 can be improved, thereby increasing the heat dissipation efficiency of the evaporation chamber 100. Additionally, when using pure water as the working fluid 2a and 2b, corrosion can be prevented. Moreover, as long as the desired heat dissipation efficiency is achieved and corrosion is prevented, these sheets 110, 120, and 130 can also be made of other metal materials such as aluminum or titanium, or other metal alloy materials such as stainless steel.

[0481] also, Figure 37The thickness t21 of the evaporation chamber 100 shown can be, for example, 100 μm or more and 2000 μm or less. By setting the thickness t21 of the evaporation chamber 100 to 100 μm or more, the vapor flow path 150 can be properly ensured, thereby enabling the evaporation chamber 100 to function properly. On the other hand, by setting the thickness t21 to 2000 μm or less, the thickness t21 of the evaporation chamber 100 can be prevented from becoming too thick.

[0482] The thickness t22 of the lower sheet 110 can be, for example, 25 μm or more and 500 μm or less. By setting the thickness t22 of the lower sheet 110 to 25 μm or more, the mechanical strength of the lower sheet 110 can be ensured. On the other hand, by setting the thickness t22 of the lower sheet 110 to 500 μm or less, the thickness t21 of the evaporation chamber 100 can be prevented from becoming thicker. Similarly, the thickness t23 of the upper sheet 120 can also be set in the same way as the thickness t22 of the lower sheet 110. The thickness t23 of the upper sheet 120 and the thickness t22 of the lower sheet 110 can also be different.

[0483] The thickness t24 of the core sheet 130 can be, for example, 50 μm or more and 1000 μm or less. By setting the thickness t24 of the core sheet 130 to 50 μm or more, the vapor flow path 150 can be properly ensured, thereby enabling it to function properly as the evaporation chamber 100. On the other hand, by setting it to 1000 μm or less, the thickness t21 of the evaporation chamber 100 can be prevented from becoming too thick.

[0484] Next, use Figures 44-46 The manufacturing method of the evaporation chamber 100 of this embodiment, which has such a structure, will be described. Furthermore, in Figures 44-46 In the middle, it is shown that... Figure 37 The same cross-section as the sectional view.

[0485] Here, we will first explain the manufacturing process of the core sheet 130.

[0486] First, such as Figure 44 As shown, as a preparation step, a flat sheet of metal material M containing a lower surface Ma and an upper surface Mb is prepared.

[0487] Following the preparation process, as part of the etching process, such as Figure 45 As shown, the metal sheet M is etched from the lower surface Ma and the upper surface Mb to form a vapor flow path 150 and a liquid flow path 160.

[0488] More specifically, a patterned resist film (not shown) is formed on the lower surface Ma and upper surface Mb of a metal sheet M using photolithography. Then, the lower surface Ma and upper surface Mb of the metal sheet M are etched through openings in the patterned resist film. Thus, the lower surface Ma and upper surface Mb of the metal sheet M are etched in a patterned manner, forming... Figure 45 The vapor flow path 150 and liquid flow path 160 are shown as described. Furthermore, for the etching solution, for example, a ferric chloride-based etching solution such as an aqueous solution of ferric chloride, or a copper chloride-based etching solution such as an aqueous solution of copper chloride, can be used.

[0489] Regarding etching, both the lower surface Ma and the upper surface Mb of the metal sheet M can be etched simultaneously. However, this is not the only possibility; the etching of the lower surface Ma and the upper surface Mb can also be performed as separate processes. Furthermore, the vapor flow path 150 and the liquid flow path 160 can be formed simultaneously by etching, or they can be formed through different processes.

[0490] Furthermore, in the etching process, by etching the lower surface Ma and the upper surface Mb of the metal sheet M, the following is obtained: Figure 40 and Figure 41 The specified external outline shape is shown. That is, the end edge forming the core sheet 130.

[0491] Thus, the core sheet 130 of this embodiment is obtained.

[0492] Following the manufacturing process of the core sheet 130, as a joining process, such as... Figure 46 As shown, the lower sheet 110, the upper sheet 120, and the core sheet 130 are joined together. Alternatively, the lower sheet 110 and the upper sheet 120 can also be formed from rolled parts with a desired thickness.

[0493] More specifically, firstly, the lower sheet 110, the core sheet 130, and the upper sheet 120 are stacked sequentially. In this case, the first main body surface 131a of the core sheet 130 coincides with the second lower sheet surface 110b of the lower sheet 110, and the first upper sheet surface 120a of the upper sheet 120 coincides with the second main body surface 131b of the core sheet 130. At this time, the sheets 110, 120, and 130 are aligned using the alignment holes 112 of the lower sheet 110, the alignment holes 135 of the core sheet 130, and the alignment holes 122 of the upper sheet 120.

[0494] Next, the lower sheet 110, the core sheet 130, and the upper sheet 120 are temporarily fixed. For example, these sheets 110, 120, and 130 can be temporarily fixed by spot resistance welding or by laser welding.

[0495] Next, the lower sheet 110, the core sheet 130, and the upper sheet 120 are permanently bonded together by diffusion bonding. More specifically, the first main body surface 131a of the frame portion 132 and each island portion 133 of the core sheet 130 is diffusely bonded to the second lower sheet surface 110b of the lower sheet 110. Furthermore, the second main body surface 131b of the frame portion 132 and each island portion 133 of the core sheet 130 is diffusely bonded to the first upper sheet surface 120a of the upper sheet 120. Thus, the sheets 110, 120, and 130 are diffusely bonded together, thereby forming a sealed space 103 with a vapor flow path 150 and a liquid flow path 160 between the lower sheet 110 and the upper sheet 120.

[0496] After the joining process, working fluid 2b is injected into the sealing space 103 from the injection section 104.

[0497] Subsequently, the aforementioned injection flow path 137 is sealed. For example, the injection section 104 can be partially melted to seal the injection flow path 137. As a result, the communication between the sealed space 103 and the outside is cut off, and the working fluid 2b is sealed into the sealed space 103, preventing the working fluid 2b in the sealed space 103 from leaking to the outside.

[0498] As described above, the evaporation chamber 100 of this embodiment was obtained.

[0499] Next, the working method of the evaporation chamber 100, namely the cooling method of the electronic device D, will be explained.

[0500] The evaporation chamber 100 obtained as described above is disposed within the housing H of an electronic device E such as a mobile terminal, and an electronic device D, such as a CPU, which is a cooled device, is mounted on the second upper sheet surface 120b of the upper sheet 120. Alternatively, the evaporation chamber 100 is mounted on the electronic device D. The working fluid 2b within the sealed space 103 adheres to the walls of the sealed space 103 due to its surface tension, namely the first wall surface 153a and the second wall surface 154a of the vapor passage 151, the wall surface 162 of the main flow channel 161 of the liquid flow path 160, and the wall surface of the connecting channel 165. In addition, the working fluid 2b can also adhere to the portion of the lower sheet 110b exposed to the vapor passage 151 in the second lower sheet surface 110b. Furthermore, the working fluid 2b can also adhere to the portion of the upper sheet 120a exposed to the vapor passage 151, the main flow channel 161, and the connecting channel 165 in the first upper sheet surface 120a of the upper sheet 120.

[0501] In this state, when electronic device D heats up, there exists SR in the evaporation region (refer to...). Figure 40 and Figure 41The working fluid 2b is heated from the electronic device D. The received heat is absorbed as latent heat, and the working fluid 2b evaporates (vaporizes), generating working vapor 2a. Most of the generated working vapor 2a diffuses within the vapor passage 151 that constitutes the sealed space 103 (see reference). Figure 40 (Solid arrows). The working vapor 2a in each vapor passage 151 leaves the evaporation zone SR, with most of the working vapor 2a flowing into the lower-temperature condensation zone CR. Figure 40 and Figure 41 (The right side of the image) is transported. In the condensation zone CR, the working vapor 2a is mainly cooled by dissipating heat to the lower sheet 110. The heat received by the lower sheet 110 from the working vapor 2a is transmitted through the housing component Ha (see reference). Figure 37 It is transferred to the external gas.

[0502] Working vapor 2a dissipates heat to the lower sheet 110 in the condensation zone CR, thereby losing the latent heat absorbed in the evaporation zone SR and condensing to generate working liquid 2b. The generated working liquid 2b adheres to the first wall surface 153a and the second wall surface 154a of each vapor passage 151, the second lower sheet surface 110b of the lower sheet 110, and the first upper sheet surface 120a of the upper sheet 120. Here, the working liquid 2b continues to evaporate in the evaporation zone SR. Therefore, the working liquid 2b in the liquid flow path 160, excluding the evaporation zone SR (i.e., the condensation zone CR), is transported towards the evaporation zone SR by the capillary action of each main flow channel 161 (see reference). Figure 40 (The dashed arrows indicate this). Thus, the working fluid 2b attached to each vapor passage 151, the second lower sheet surface 110b, and the first upper sheet surface 120a moves towards the liquid flow path 160 and enters the main flow channel 161 through the connecting channel 165. In this way, the working fluid 2b is filled into each main flow channel 161 and each connecting channel 165. Therefore, the filled working fluid 2b receives a propulsive force towards the evaporation zone SR by means of the capillary action of each main flow channel 161, thereby smoothly conveying it towards the evaporation zone SR.

[0503] In the liquid flow path section 160, each main flow channel 161 is connected to other adjacent main flow channels 161 via a corresponding connecting channel 165. As a result, the working fluid 2b flows between adjacent main flow channels 161, suppressing dry burning in the main flow channels 161. Therefore, a capillary effect is applied to the working fluid 2b within each main flow channel 161, allowing the working fluid 2b to be smoothly transported towards the evaporation zone SR.

[0504] The working fluid 2b reaching the evaporation zone SR is heated and evaporated again from the electronic device D. The working vapor 2a evaporated from the working fluid 2b moves through the connecting channel 165 in the evaporation zone SR to the vapor passage 151 with a large cross-sectional area, and diffuses within each vapor passage 151. In this way, the working fluids 2a and 2b repeatedly undergo phase change, i.e., evaporation and condensation, while flowing back within the sealed space 103, thereby transferring and releasing the heat from the electronic device D. As a result, the electronic device D is cooled.

[0505] However, in the evaporation zone SR, the working vapor 2a generated from the working liquid 2b moves from the liquid flow path 160 toward the vapor passage 151. At this time, the working vapor 2a flows out from the main flow channel 161 through the connecting channel 165 adjacent to the protrusion 164 on the outer side of each liquid flow path 160 in the width direction to the vapor passage 151.

[0506] Typically, in the portion of the steam passage 151 on the second main surface 131b side, the pressure gradient of the working steam 2a in the thickness direction (Z direction) is large, while in the portion of the steam passage 151 on the first main surface 131a side, the pressure gradient of the working steam 2a in the thickness direction (Z direction) is small. In this embodiment, as... Figure 47 As shown, the protrusion 155 is located closer to the second main body surface 131b than the midpoint Pz between the first main body surface 131a and the second main body surface 131b. Therefore, when the vaporized working vapor 2a expands from the liquid flow path 160 to the vapor passage 151, the pressure gradient in the vertical direction of the protrusion 155 increases near the protrusion 155. The pressure difference between the upper and lower portions relative to the protrusion 155 may increase. The upper portion of the protrusion 155 corresponds to the portion on the second wall surface 154a side, and the lower portion of the protrusion 155 corresponds to the portion on the first wall surface 153a side. Therefore, the pressure of the working vapor 2a at the upper portion of the protrusion 155 can be sufficiently greater than the pressure of the working vapor 2a at the lower portion of the protrusion 155, allowing the working vapor 2a to easily cross the protrusion 155. Therefore, the working steam 2a can be easily drawn from the upper part of the protrusion 155 to the lower part. As a result, the protrusion 155 is less likely to become an obstacle to the passage of the working steam 2a, and the working steam 2a can be smoothly diffused from the protrusion 155 toward the lower part of the protrusion 155.

[0507] Furthermore, in this embodiment, the first wall end 153b of the first wall surface 153a is located inside the steam flow path 150 compared to the protrusion 155 when viewed from above. Therefore, the first wall surface 153a is formed facing the inside of the steam passage 151. As a result, the working steam 2a, which flows from the upper part of the protrusion 155 to the lower part, is guided along the first wall surface 153a in the width direction (Y direction) inward of the steam passage 151. As a result, the diffusion of the working steam 2a proceeds smoothly inside the steam passage 151, which improves the cooling capacity of the evaporation chamber 100. The radius of curvature of the first wall surface 153a can also gradually increase towards the first wall end 153b. Therefore, as the radius of curvature increases, the obstacle to the flow of the working steam 2a toward the first main body surface 131a increases. As a result, the diffusion of the working steam 2a inside the steam passage 151 can proceed more smoothly.

[0508] On the other hand, in the condensation zone CR, the working liquid 2b generated by the working vapor 2a moves from the vapor passage 151 toward the liquid flow path 160. At this time, the working liquid 2b enters the main flow path 161 through the connecting groove 165 adjacent to the protrusion 164 on the outer side of the width direction of each liquid flow path 160.

[0509] In this embodiment, the first wall end 153b of the first wall surface 153a is located inside the vapor flow path 150 compared to the protrusion 155 when viewed from above. Therefore, the working fluid 2b flowing through the vapor passage 151 is guided along the first wall surface 153a to the liquid flow path 160. As a result, the working fluid 2b smoothly enters the liquid flow path 160. In addition, the working fluid 2b can easily cross the protrusion 155, so the protrusion 155 is less likely to become an obstacle to the passage of the working fluid 2b, and the inflow of the working fluid 2b from the protrusion 155 toward the liquid flow path 160 can proceed smoothly.

[0510] Furthermore, in this embodiment, the protrusion 155 is located closer to the second main body surface 131b than the intermediate position Pz. Therefore, the radius of curvature of the second wall surface 154a can be smaller than the radius of curvature of the first wall surface 153a. This improves the capillary effect of the second wall surface 154a, allowing the working fluid 2b to flow smoothly into the liquid flow path 160. Additionally, by improving the capillary effect, the retention effect of the second wall surface 154a on the working fluid 2b can also be improved. Therefore, the amount of working fluid 2b transported toward the evaporation region SR can be increased.

[0511] In addition, in this embodiment, the first wall end 153b of the first wall 153a is located inside the steam flow path 150 than the protrusion 155 when viewed from above, so it is easy to confirm the shape defects of the width direction end of the island 133 when viewed from above.

[0512] Furthermore, in this embodiment, the first wall surface 153a is curved toward the liquid flow path 160, thus increasing the volume of the vapor passage 151 and improving the cooling capacity of the evaporation chamber 100.

[0513] This invention is not directly limited to the above-described embodiments and modifications. During implementation, the constituent elements can be modified and embodied by variations without departing from its spirit. Furthermore, various inventions can be formed through appropriate combinations of the multiple constituent elements disclosed in the above-described embodiments and modifications. It is also possible to delete several constituent elements from all the constituent elements shown in the embodiments and modifications.

Claims

1. A main sheet for an evaporation chamber, wherein the evaporation chamber is filled with a working fluid, wherein, The main sheet material for the evaporation chamber includes: First main surface; The second main surface is located on the side opposite to the first main surface; A through space that extends from the first main surface to the second main surface; as well as A plurality of first grooves extending in the first direction are disposed on the first main body surface and communicate with the through space. When viewed from above, the through space extends in the first direction. When viewed in a cross section perpendicular to the first direction, the through space has: a first opening on the first main surface; and a second opening on the second main surface, the second opening extending from the area overlapping the first opening when viewed from above to the position overlapping the first groove when viewed from above.

2. The main sheet for the evaporation chamber according to claim 1, wherein, When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess defining the first opening, disposed on the first main body surface; and a second spatial recess defining the second opening, disposed on the second main body surface and communicating with the first spatial recess. The first spatial recess includes a pair of first wall surfaces that are curved into a concave shape. The second spatial recess includes a pair of second wall surfaces that are curved into a concave shape. The corresponding first wall surface and the second wall surface are connected by wall protrusions that project inward toward the through space. When viewed in a cross section perpendicular to the first direction, the second spatial recess includes a flat surface that connects the corresponding second wall surface and the wall surface protrusion.

3. The main sheet for the evaporation chamber according to claim 1, wherein, When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess defining the first opening, disposed on the first main body surface; and a second spatial recess defining the second opening, disposed on the second main body surface and communicating with the first spatial recess. The first spatial recess includes a pair of first wall surfaces that are curved into a concave shape. The second spatial recess includes a pair of second wall surfaces that are curved into a concave shape. The corresponding first wall surface and the second wall surface are connected by wall protrusions that project inward toward the through space. When viewed in a cross section perpendicular to the first direction, the second spatial recess includes a convex surface connecting the corresponding second wall surfaces and the wall surface protrusions. The convex surface includes a spatial convex portion that extends in the first direction and protrudes toward the second body surface.

4. The main sheet for the evaporation chamber according to claim 3, wherein, The convex surface includes a plurality of spatial convexities that are separated from each other.

5. The main sheet for the evaporation chamber according to claim 1, wherein, When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess defining the first opening, disposed on the first main body surface; and a second spatial recess defining the second opening, disposed on the second main body surface and communicating with the first spatial recess. The first spatial recess includes a pair of first wall surfaces that are curved into a convex shape. The second spatial recess includes a pair of second walls that are curved into a concave shape.

6. The main sheet for the evaporation chamber according to any one of claims 1 to 5, wherein, When viewed in a cross section perpendicular to the first direction, the second opening extends on both sides relative to the first opening from the area that overlaps with the first opening when viewed from above to the position that overlaps with the first groove when viewed from above.

7. The main sheet for the evaporation chamber according to any one of claims 1 to 6, wherein, The main sheet material for the evaporation chamber includes: A frame portion defining the through space, which forms a frame shape when viewed from above, extends from the first main body surface to the second main body surface; and An island portion is disposed inside the frame portion, extends in the first direction, and extends from the first main body surface to the second main body surface. The first opening and the second opening are located between the frame portion and the island portion. The first groove is located on the first main body surface of the island portion. When viewed in a cross section perpendicular to the first direction, the second opening extends from the area overlapping with the first opening when viewed from above to the position overlapping with the first groove located on the island when viewed from above, and extends further outward from the frame portion than the first opening.

8. A main sheet for an evaporation chamber, wherein the evaporation chamber is filled with a working fluid, wherein... The main sheet material for the evaporation chamber includes: First main surface; The second main body surface is disposed on the side opposite to the first main body surface; and A through space extends from the first main surface to the second main surface. When viewed from above, the through space extends in the first direction. When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess disposed on the first main body surface; and a second spatial recess disposed on the second main body surface and communicating with the first spatial recess. The first spatial recess includes a pair of first wall surfaces. The second spatial recess includes a pair of second wall surfaces. The first wall surface of one of the first spatial recesses is connected to the corresponding second wall surface of the second spatial recess through a protrusion of the first wall surface. The first wall protrusion protrudes towards the inside of the through space. The first wall protrusion is offset relative to the midpoint between the first main body surface and the second main body surface in the normal direction of the first main body surface. The first wall surface of the first space recess, located on the opposite side of the first wall protrusion, and the corresponding second wall surface of the second space recess, are continuously concave from the first wall surface to the second wall surface.

9. The main sheet for the evaporation chamber according to claim 8, wherein, The through space has: a first opening defined by the first spatial recess, located on the first main body surface; and a second opening defined by the second spatial recess, located on the second main body surface. When viewed in a cross section perpendicular to the first direction, the center of the first opening is offset relative to the center of the second opening.

10. A main sheet for an evaporation chamber, wherein the evaporation chamber is enclosed with a working fluid, wherein... The main sheet material for the evaporation chamber includes: First main surface; The second main body surface is disposed on the side opposite to the first main body surface; and A through space extends from the first main surface to the second main surface. When viewed from above, the through space extends in the first direction. When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess disposed on the first main body surface; and a second spatial recess disposed on the second main body surface, which communicates with the first spatial recess. The first spatial recess includes a pair of first wall surfaces. The second spatial recess includes a pair of second wall surfaces. The first wall surface of one of the first spatial recesses is connected to the corresponding second wall surface of the second spatial recess through a protrusion of the first wall surface. The first wall protrusion protrudes towards the inside of the through space. The first wall protrusion is offset relative to the midpoint between the first main body surface and the second main body surface in the normal direction of the first main body surface. The through space has: a first opening defined by the first spatial recess, located on the first main body surface; and a second opening defined by the second spatial recess, located on the second main body surface. When viewed in a cross section perpendicular to the first direction, the center of the first opening is offset relative to the center of the second opening.

11. The main sheet for the evaporation chamber according to claim 9 or 10, wherein, The main sheet used in the evaporation chamber also includes: The frame section, which appears as a frame when viewed from above; and An island portion, disposed inside the frame portion and extending in the first direction, defines the through space between the island portion and the frame portion. When the width of the island is set to w1, the offset between the center of the first opening and the center of the second opening is 0.05mm to (0.8×w1)mm.

12. The main sheet for the evaporation chamber according to any one of claims 8 to 11, wherein, The main sheet for the evaporation chamber also includes a plurality of first grooves disposed on the first main surface and communicating with the through space. The first wall protrusion is positioned closer to the first main body surface than the intermediate position.

13. The main sheet for the evaporation chamber according to claim 12, wherein, The first wall surface of the first spatial recess, located on the opposite side to the first wall surface protrusion, and the corresponding second wall surface of the second spatial recess are connected by the second wall surface protrusion. The second wall protrusion protrudes towards the inside of the through space. The second wall protrusion is offset in the normal direction relative to the midpoint between the first main surface and the second main surface.

14. The main sheet for the evaporation chamber according to claim 13, wherein, The second wall protrusion is positioned closer to the first main body surface than the intermediate position.

15. A main sheet for an evaporation chamber, wherein the evaporation chamber is sealed with a working fluid, wherein... The main sheet material for the evaporation chamber includes: First main surface; The second main body surface is disposed on the side opposite to the first main body surface; and A through space extends from the first main surface to the second main surface. When viewed from above, the through space extends in the first direction. When viewed in a cross-section perpendicular to the first direction, the through space comprises: a first spatial recess disposed on the first main body surface; a second spatial recess disposed on the second main body surface, which communicates with the first spatial recess; and a third spatial recess disposed on the second main body surface, which is located on both sides of the second spatial recess and communicates with the second spatial recess. The second spatial recess includes a pair of second wall surfaces. The third spatial recess includes a third wall surface. Each of the second wall surfaces of the second spatial recess is connected to the third wall surface of the corresponding third spatial recess through a third wall surface protrusion. The third wall protrusion protrudes toward the second main body surface.

16. A main sheet for an evaporation chamber, wherein, The main sheet material for the evaporation chamber includes: First main surface; The second main surface is located on the side opposite to the first main surface; A through space, which penetrates the first main surface and the second main surface; and Multiple first slots are disposed on the second main body surface and communicate with the through space. The through space has: a curved first wall surface located on the side of the first main body surface; and a curved second wall surface located on the side of the second main body surface. The first wall surface and the second wall surface meet at a protrusion formed in a manner that extends inward toward the through space. The protrusion is located closer to the second main surface than the midpoint between the first main surface and the second main surface. The first wall surface has a first wall surface end on the side of the first main body surface. When viewed from above, the end of the first wall surface is located inside the through space, closer to the protrusion.

17. The main sheet for the evaporation chamber according to claim 16, wherein, The second wall surface has a second wall surface end on the side of the second main body surface. When the distance between the end of the second wall surface and the protrusion in the width direction of the through space is set as Lp, and the distance between the end of the second wall surface and the end of the first wall surface in the width direction of the through space is set as Ls, the distance Ls is more than 1.05 times and less than 2 times the distance Lp.

18. The main sheet for the evaporation chamber according to claim 16, wherein, Multiple first slots are arranged side by side. A row of protrusions is provided between adjacent first grooves. Each of the columns of protrusions has multiple protrusions. The second wall surface has a second wall surface end on the side of the second main body surface. When the distance between the end of the second wall and the end of the first wall is set to Ls, the distance Ls is more than 1.1 times and less than 10 times the width of the protrusion.

19. An evaporation chamber, wherein, The evaporation chamber includes: First sheet material; Second sheet; and The main sheet for the evaporation chamber according to any one of claims 1 to 18, wherein it is located between the first sheet and the second sheet.

20. An electronic device, wherein, The electronic device includes: case; Electronic devices, housed within the housing; and The evaporation chamber of claim 19 is in thermal contact with the electronic device.

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