A dual-phase liquid cooling plate and heat sink

Abstract

This utility model discloses a dual-phase liquid cooling plate and radiator. The dual-phase liquid cooling plate includes an evaporation end, a condensation end, and multiple fins. The evaporation end includes a lower cover plate, a middle frame body, and multiple capillary structures. The lower cover plate and the middle frame body are connected to form an evaporation chamber. The condensation end includes an upper cover plate and a middle frame body. The middle frame body includes a frame formed by a side frame and a flat plate in the middle of the frame. The flat plate has multiple grooves. The lower ends of the fins pass through the grooves and are located between adjacent capillary structures. The dual-phase liquid cooling plate and radiator provided by this utility model, by adding a middle frame body and fins, and through the isolation of the middle frame body, allows the solder to preferentially fill the gaps between the grooves in the middle frame body in the molten state, reducing the amount of solder overflowing to the bottom of the grooves, thereby contaminating the sintering layer and damaging the capillary structures, improving the heat dissipation efficiency and finished product qualification rate of the liquid cooling plate.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a dual-phase liquid cooling plate and radiator. Background Technology

[0002] As we all know, high temperature is the enemy of integrated circuits. High temperature can not only cause the system to run unstably and shorten its lifespan, but may even burn out some components. The role of the heat sink is to absorb the heat on the chip and quickly dissipate it, thereby reducing the temperature of the chip.

[0003] Currently, single-phase liquid cooling plates use pure water or single-phase coolant as the working fluid, and the internal pressure resistance requirement is above 1 MPa. Two-phase liquid cooling plates use low-boiling-point liquids such as fluorinated liquids or refrigerants as the working fluid, and the pressure resistance needs to reach above 3 MPa. When the liquid cooling plate is close to the heat source, the heat from the heat source causes the liquid working fluid to vaporize into a gaseous state. The gaseous working fluid flows upward, thereby transferring the heat from the heat source. In order to achieve the two-phase change, existing liquid cooling plates require strict vacuum sealing of the internal cavity. Traditional welding of the tooth tops results in low welding yield under the 3 MPa requirement. After the solder melts, it contaminates the capillary structure of the sintered layer, affecting performance. Therefore, how to reduce the internal cavity pressure requirement of the liquid cooling plate and improve the production yield of liquid cooling plates has become an urgent technical problem to be solved in this field. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this utility model is to provide a dual-phase liquid cooling plate and radiator. By adding a middle frame body and fins, and through the isolation provided by the middle frame body, the solder, in its molten state, preferentially fills the gaps in the groove of the middle frame body, preventing the solder from overflowing to the bottom of the groove, thereby contaminating the sintering layer and damaging the capillary structure. This significantly improves the heat dissipation efficiency and finished product qualification rate of the liquid cooling plate.

[0005] To achieve the above objectives, this utility model provides a two-phase liquid cooling plate, including an evaporation end, a condensation end, and multiple fins;

[0006] The evaporation end includes a lower cover plate, a middle frame body, and multiple capillary structures. The multiple capillary structures are parallel to each other and vertically fixed on the lower cover plate. The lower cover plate and the middle frame body are connected to form an evaporation chamber.

[0007] The condensation end includes an upper cover plate and a middle frame body;

[0008] The middle frame body includes a frame surrounded by a border and a flat plate disposed in the middle of the frame. The flat plate has multiple grooves. The lower ends of the fins pass through the grooves and are located between adjacent capillary structures. The upper ends of the fins are located within the condensation end.

[0009] The middle frame body is provided with at least one liquid inlet and one liquid outlet, and the liquid inlet, evaporation chamber and liquid outlet are connected.

[0010] Preferably, the capillary structure is U-shaped, with its bottom connected to the lower cover plate and its top connected to the bottom of the flat plate.

[0011] Preferably, the fin includes a first fin plate and a second fin plate arranged in an L-shape. The first fin plate passes through the groove and is located between two adjacent U-shaped capillary structures. The second fin plate is connected between the upper cover plate and the flat plate. The plurality of grooves are distributed in parallel to each other.

[0012] Preferably, the evaporation chamber contains a liquid, which is a fluorinated liquid. The fluorinated liquid is one or more of sodium fluoride, hydrofluorocarbon, hydrofluoroether, hydrofluoroolefin, and unsaturated hydrofluoroether. The boiling point of the liquid is 47°C to 56°C under one standard atmosphere. The volume ratio of the liquid to the volume of the evaporation chamber is 95% to 100%.

[0013] Preferably, the evaporation end further includes a connector connected to the liquid inlet and the liquid outlet.

[0014] Preferably, the liquid cooling plate is further provided with a first welding sheet and a second welding sheet, wherein the first welding sheet is located between the upper cover plate and the upper part of the flat plate, and the second welding sheet is located between the upper part of the U-shaped capillary structure and the lower part of the flat plate.

[0015] This utility model also provides a two-phase liquid-cooled heat sink, characterized in that it includes a liquid cooling plate.

[0016] The beneficial effects of this utility model are as follows: The dual-phase liquid cooling plate and its manufacturing method provided by this utility model, by adding a middle frame body and fins, and setting a flat plate inside the middle frame body, and setting multiple grooves on the flat plate, through the isolation of the middle frame body, the solder in the molten state preferentially fills the gaps between the grooves in the middle frame body, reducing the solder overflow to the bottom of the grooves, thereby contaminating the sintering layer and destroying the capillary structure, greatly improving the yield of the liquid cooling plate; by setting the capillary structure as U-shaped, and the bottom of the U-shape is connected to the lower cover plate, the strength of the capillary structure and the liquid storage volume at the bottom of the capillary structure can be increased, thereby improving the heat dissipation efficiency of the liquid cooling plate, and the evaporation chamber does not need to be vacuumed, the internal pressure requirements are not high, and only liquids with low boiling points are needed, which greatly improves the yield of existing liquid cooling plates. Attached Figure Description

[0017] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0018] Figure 1 This is a schematic diagram of the structure of the dual-phase liquid cooling plate in Example 1;

[0019] Figure 2 This is a schematic diagram of the internal structure of the dual-phase liquid cooling plate in Example 1;

[0020] Figure 3 for Figure 2 A magnified view of a portion of point A in the middle;

[0021] Figure 4 This is a schematic diagram of the manufacturing process of the dual-phase liquid cooling plate in Example 1. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present invention are shown in the accompanying drawings.

[0023] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] Example 1: Please refer to Figures 1 to 4 This embodiment 1 includes:

[0025] A two-phase liquid cooling plate includes an evaporation end, a condensation end, and multiple fins 4;

[0026] The evaporation end includes a lower cover plate 1, a middle frame body 2 and multiple capillary structures 5. The multiple capillary structures 5 are parallel to each other and vertically fixed on the lower cover plate 1. The lower cover plate 1 and the middle frame body 2 are connected to form an evaporation chamber 11.

[0027] The condenser end includes an upper cover plate 3 and a middle frame body 2;

[0028] The middle frame body 2 includes a frame surrounded by a side frame and a flat plate 21 in the middle of the frame. The flat plate 21 has multiple grooves 22. The lower end of the fin 4 passes through the groove 22 and is located between adjacent capillary structures 5. The upper end of the fin 4 is located inside the condensation end.

[0029] The middle frame body 2 is provided with at least one liquid inlet 61 and one liquid outlet 62, and the liquid inlet 61, the evaporation chamber 11 and the liquid outlet 62 are connected.

[0030] In this embodiment, the liquid cooling plate is connected to the external heat dissipation mechanism through the liquid inlet 61 and the liquid outlet 62 to form a heat sink when in operation. In this embodiment, the evaporation chamber 11 does not need to be evacuated and the pressure requirement is not high. Only liquids with low boiling points are needed. Since it is connected to the external heat dissipation mechanism, the liquid inside can be injected into the evaporation chamber 11 before use. Furthermore, since the evaporation chamber 11 does not need to be evacuated and the pressure requirement is not high, the yield rate of existing liquid cooling plates is greatly improved.

[0031] In this embodiment, a liquid with a low boiling point is used in the evaporation chamber 11. The liquid used in this embodiment is a fluorinated liquid or a cooling medium. The fluorinated liquid is one or more of sodium fluoride, hydrofluorocarbon, hydrofluoroether, hydrofluoroolefin, and unsaturated hydrofluoroether. The boiling point of the liquid is 47°C to 56°C under one standard atmosphere. The volume ratio of the liquid to the evaporation chamber is 95%-100%. Unlike traditional liquid cooling plates, the volume ratio of the liquid to the evaporation chamber 11 in this embodiment is 95%, which is significantly higher than that of traditional liquid cooling plates. The heat source 7 is located below the lower cover plate 1. The heat from the heat source 7 is transferred to the lower cover plate 1. The low-boiling-point liquid boils and partially vaporizes in the evaporation chamber 11. The vaporized gas flows upward, thereby transferring heat to the condenser end. Since the temperature of the condenser plate is low, the vaporized gas encounters the lower-temperature plate 21 and liquefies back into liquid. Under the influence of gravity and the capillary action of the capillary structure 5, the liquid flows downward to the lower cover plate 1. This cycle repeats continuously, transferring the heat from the heat source 7, thereby achieving the purpose of dissipating heat from the heat source 7. By having the lower end of the fin 4 pass through the groove 22 and be located between adjacent capillary structures 5, and the upper end of the fin 4 be located inside the condensing end, the fin 4 can transfer the heat from the heat source 7 to the condensing end more quickly, thereby improving the heat dissipation efficiency of the liquid cooling plate.

[0032] In addition, in this embodiment, by passing the fins 4 through the groove 22 of the middle frame body 2, this design can increase the welding area of ​​the fins 4, the middle frame body 2, and the upper cover plate 3, and improve the overall structural strength of the condensation end. More importantly, the middle frame body 2 provides isolation. When the solder is in a molten state, it preferentially fills the gap in the middle frame body 2 that matches the groove 22, reducing the amount of solder that overflows into the groove 22 and thus contaminates the sintering layer and damages the capillary structure 5, which greatly improves the finished product qualification rate of the liquid cooling plate.

[0033] The capillary structure 5 is U-shaped, with its bottom connected to the lower cover plate 1 and its top connected to the bottom of the plate 21. The connection between the bottom of the U-shape and the lower cover plate 1 increases the strength of the capillary structure 5 and the liquid storage volume at the bottom of the capillary structure 5, thereby improving the heat dissipation efficiency of the liquid cooling plate per unit area. The liquid will boil and vaporize in the internal space of the U-shape. Multiple U-shapes separate and connect the liquid boiling and vaporization, thereby improving the heat dissipation efficiency of the liquid cooling plate. The connection between its top and the bottom of the plate 21 facilitates the liquefied liquid to flow downward along the capillary structure 5 to the lower cover plate 1, thereby facilitating the liquid cooling plate to transfer heat more quickly.

[0034] The fin 4 includes a first fin plate 41 and a second fin plate 42 arranged in an L-shape. The first fin plate 41 passes through the groove 22 and is located between two adjacent U-shaped capillary structures 5. The second fin plate 42 is connected between the upper cover plate 3 and the flat plate 21. Multiple grooves 22 are distributed parallel to each other. In this embodiment, the upper cover plate 3, the middle frame body 2 and the second fin plate 42 form a solid. When heat is transferred to the condensing end, since the upper cover plate 3, the middle frame body 2 and the second fin plate 42 form a solid, in addition, in this embodiment, by passing the fin 4 through the groove 22 of the middle frame body 2 and bending the part above the middle frame body 2 into the second fin plate 42, this design can increase the welding area of ​​the second fin plate 42, the middle frame body 2 and the upper cover plate 3, and improve the overall structural strength of the condensing end. In addition, through the isolation of the middle frame body 2, the solder in the molten state preferentially fills the gap in the middle frame body 2 that matches the groove 22, reducing the solder overflow to the bottom of the groove 22, thereby contaminating the sintering layer and destroying the capillary structure 5, which greatly improves the finished product qualification rate of the liquid cooling plate.

[0035] The evaporation chamber 11 contains liquid. Unlike traditional liquid cooling plates, the evaporation chamber 11 in this embodiment does not require vacuuming and does not have high internal pressure requirements. Only liquids with low boiling points are needed, which greatly improves the yield of existing liquid cooling plates.

[0036] The evaporation end also includes a connector 63 connected to the liquid inlet 61 and the liquid outlet 62. In non-working states such as transportation, the connector 63 can protect the liquid inlet 61 and the liquid outlet 62, prevent dust or bacteria from entering the evaporation chamber 11, prevent the liquid cooling plate from being corroded or contaminated, and extend the service life of the liquid cooling plate.

[0037] The liquid cooling plate is also provided with a first welding sheet 81 and a second welding sheet 82. The first welding sheet 81 is located between the upper cover plate 3 and the upper plate 21, and the second welding sheet 82 is located between the upper U-shaped capillary structure 5 and the lower plate 21. Both the first welding sheet 81 and the second welding sheet 82 can be made of silver solder. Silver solder has good fluidity and can ensure sufficient welding.

[0038] The liquid cooling plate in this embodiment is specifically manufactured using the following steps:

[0039] S1, capillary structure 5 sintering: Copper mesh or copper powder is sintered on the lower cover plate 1 to form capillary structure 5.

[0040] S2, Fin 4 Installation: Multiple fins 4 are passed through the groove 22 of the middle frame body 2, so that the lower end of the fin 4 is located between adjacent capillary structures 5, and the upper end of the fin 4 is located above the flat plate 21 of the middle frame body 2. Through the isolation of the middle frame body 2, the solder, in its molten state, preferentially fills the gap in the groove 22 of the middle frame body 2, reducing the amount of solder overflowing below the groove 22, thereby contaminating the sintered layer and damaging the capillary structure 5, greatly improving the finished product qualification rate of the liquid cooling plate.

[0041] S3, Assembly and welding of the liquid cooling plate: The upper cover plate 3, the bent fins 4, the middle frame body 2 and the lower cover plate 1 are brazed together to obtain the liquid cooling plate.

[0042] The capillary structure 5 is sintered at 880-920℃, with the copper mesh or copper powder in a semi-molten state.

[0043] The brazing temperature is 820-870℃. The first brazing piece 81 is used to weld the upper cover plate 3 to the flat plate 21, and the second brazing piece 82 is used to weld the lower cover plate 1 to the flat plate 21. The first brazing piece 81 and the second brazing piece 82 are silver brazing pieces.

[0044] It also includes the following steps:

[0045] S11, Sintering of the U-shaped capillary structure 5: Copper mesh or copper powder is laid on a U-shaped fixture and sintered, so that the sintered capillary structure 5 has a U-shaped cross-section structure, and the U-shaped bottom of the U-shaped capillary structure 5 is sintered on the lower cover plate 1.

[0046] S21, the fins 4 are bent and flattened, and multiple fins 4 are passed through the groove 22 of the middle frame body 2 so that the lower end of the fins 4 is located between adjacent capillary structures 5 and the upper end of the fins 4 is located above the plate 21 of the middle frame body 2. The fins 4 located above the plate 21 are bent and flattened. The bent and flattened fins 4 are set into an L-shape formed by the first fin plate 41 and the second fin plate 42.

[0047] Example 2: A heat sink, including the dual-phase liquid cooling plate in Example 1, whose heat dissipation principle is the same as that in Example 1, and will not be repeated here.

[0048] The dual-phase liquid cooling plate provided by this utility model adds a middle frame body and fins. A flat plate is set inside the middle frame body, and multiple grooves are set on the flat plate. By passing the lower end of the fins through the grooves, the upper end of the fins is integrally welded to the middle frame body and the upper cover plate. This design increases the welding area of ​​the fins, middle frame body, and upper cover plate, improving the overall structural strength of the condensation end. Furthermore, through the isolation provided by the middle frame body, the molten solder preferentially fills the gaps between the mating grooves in the middle frame body, reducing solder overflow to the bottom of the grooves, thus preventing contamination of the sintering layer and damage to the capillary structure, greatly improving the finished product yield of the liquid cooling plate. By setting the capillary structure in a U-shape, the bottom of the U-shape is connected to... The connection of the lower cover plate increases the strength of the capillary structure and the liquid storage volume at the bottom of the capillary structure, thereby improving the heat dissipation efficiency of the liquid cooling plate per unit area. The liquid boils and vaporizes within the internal space of the U-shaped structure. Multiple U-shaped structures separate and connect the liquid boiling and vaporization, thus improving the heat dissipation efficiency of the liquid cooling plate. The connection between the top and the bottom of the plate facilitates the downward flow of the liquefied liquid along the capillary structure to the lower cover plate, which helps the liquid cooling plate to transfer heat more quickly, thereby improving the heat dissipation efficiency of the liquid cooling plate. The evaporation chamber does not require vacuuming and does not have high internal pressure requirements. Only liquids with low boiling points are needed, which greatly improves the yield of existing liquid cooling plates.

[0049] In summary, the dual-phase liquid cooling plate and radiator provided by this utility model, by adding a middle frame body and fins, and setting a flat plate inside the middle frame body with multiple grooves on the flat plate, allows the solder to preferentially fill the gaps between the grooves in the middle frame body in a molten state through the isolation of the middle frame body, reducing the amount of solder overflowing to the bottom of the grooves, thus preventing contamination of the sintering layer and damage to the capillary structure, and greatly improving the yield of the liquid cooling plate. By setting the capillary structure in a U-shape, with the bottom of the U-shape connected to the lower cover plate, the strength of the capillary structure and the liquid storage volume at the bottom of the capillary structure can be increased, thereby improving the heat dissipation efficiency of the liquid cooling plate. Furthermore, the evaporation chamber does not require vacuuming, the internal pressure requirements are not high, and only liquids with low boiling points are needed, significantly improving the yield of existing liquid cooling plates.

[0050] Those skilled in the art should understand that the above embodiments are merely for clearly illustrating the present invention and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications can be made based on the above-described invention, and these changes or modifications still fall within the scope of the present invention.

Claims

1. A dual-phase liquid-cooled plate, characterized in that: Includes an evaporator end, a condenser end, and multiple fins; The evaporation end includes a lower cover plate, a middle frame body, and multiple capillary structures. The multiple capillary structures are parallel to each other and vertically fixed on the lower cover plate. The lower cover plate and the middle frame body are connected to form an evaporation chamber. The condensation end includes an upper cover plate and a middle frame body; The middle frame body includes a frame surrounded by a border and a flat plate disposed in the middle of the frame. The flat plate has multiple grooves. The lower ends of the fins pass through the grooves and are located between adjacent capillary structures. The upper ends of the fins are located within the condensation end. The middle frame body is provided with at least one liquid inlet and one liquid outlet, and the liquid inlet, evaporation chamber and liquid outlet are connected.

2. The dual-phase liquid cooling plate according to claim 1, characterized in that: The capillary structure is U-shaped, with its bottom connected to the lower cover plate and its top connected to the bottom of the flat plate.

3. The dual-phase liquid cooling plate according to claim 2, characterized in that: The fin includes a first fin plate and a second fin plate arranged in an L-shape. The first fin plate passes through the groove and is located between two adjacent U-shaped capillary structures. The second fin plate is connected between the upper cover plate and the flat plate. The multiple grooves are distributed in parallel to each other.

4. The dual-phase liquid cooling plate according to claim 1, characterized in that: The evaporation chamber contains a liquid, which is a fluorinated liquid. The fluorinated liquid is one or more of sodium fluoride, hydrofluorocarbon, hydrofluoroether, hydrofluoroolefin, and unsaturated hydrofluoroether. The boiling point of the liquid is 47°C to 56°C under one standard atmosphere. The volume of the liquid accounts for 95% to 100% of the volume of the evaporation chamber.

5. The dual-phase liquid cooling plate according to claim 1, characterized in that: The evaporation end also includes a connector connected to the liquid inlet and the liquid outlet.

6. The dual-phase liquid cooling plate according to claim 3, characterized in that: The liquid cooling plate is also provided with a first welding sheet and a second welding sheet. The first welding sheet is located between the upper cover plate and the upper part of the flat plate, and the second welding sheet is located between the upper part of the U-shaped capillary structure and the lower part of the flat plate.

7. A two-phase liquid-cooled heat sink, characterized in that: Includes a liquid cooling plate, wherein the liquid cooling plate is a dual-phase liquid cooling plate as described in any one of claims 1-6.

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