Foreign matter detection device and foreign matter detection method

Abstract

An foreign matter detection device includes an acquisition unit, a determination unit, and a setting unit. The acquisition unit repeatedly photographs an inspection region of at least a portion of a substrate during a prescribed allowable time, and acquires a plurality of image data obtained by photographing the same inspection region. The determination unit determines whether or not a foreign matter is attached to the inspection region based on a difference in a feature quantity of the inspection region obtained by image processing of the plurality of image data acquired by the acquisition unit. The setting unit sets the allowable time in advance so as to avoid a false determination of a joining member that joins the substrate and a component as a foreign matter in the determination unit due to a variation in the feature quantity of the inspection region caused by a change in the elapsed time of the joining member applied to the inspection region.

Description

Technical Field

[0001] This specification discloses technologies related to foreign object detection devices and methods. Background Technology

[0002] Patent Document 1 describes an assembly line comprising a first camera unit, a second camera unit, and an image processing unit. The first camera unit is capable of capturing at least a portion of the printed circuit board in its field of view and is configured to photograph the printed circuit board before the mounting of electronic components in any assembly machine. The second camera unit is capable of capturing the same area as the first camera unit in its field of view and is configured to photograph the printed circuit board after the mounting of electronic components in any assembly machine or a subsequent assembly machine.

[0003] The image processing unit compares the image data captured by the second camera unit with the image data captured by the first camera unit and performs image processing. Therefore, the mounting line described in Patent Document 1 aims to detect solder printing abnormalities when solder is printed on a printed circuit board, or electronic component mounting abnormalities when electronic components are mounted on a printed circuit board.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent document 1: Japanese Patent Application Publication No. 2007-335524. Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] If foreign matter adheres to the component's assembly location, there is a possibility that the component assembly will become defective, necessitating the determination of whether foreign matter is attached to the substrate. When comparing multiple image data obtained from photographing at least a portion of the same inspection area of ​​the substrate, and determining the presence of foreign matter based on differences in the feature quantities of the image data, there is a possibility of misidentifying components other than foreign matter as foreign matter. Specifically, the feature quantities of the inspection area obtained by image processing of the image data may change over time due to variations in the bonding components between the substrate and the component on the inspection area of ​​the substrate, potentially leading to misidentification of bonding components as foreign matter.

[0009] In view of this situation, this specification discloses a foreign object detection device and a foreign object detection method, which can suppress the misjudgment of foreign objects caused by the historical changes of the bonding substrate and the bonding parts of the component coated on the inspection area of ​​the substrate.

[0010] Technical solutions for solving the problem

[0011] This specification discloses a foreign object detection device comprising an acquisition unit, a judgment unit, and a setting unit. The acquisition unit repeatedly captures images of at least a portion of an inspection area of ​​a substrate within a predetermined allowable time period, acquiring multiple image data points of the same inspection area. The judgment unit determines whether a foreign object is attached to the inspection area based on differences in characteristic quantities of the inspection area obtained by image processing of the multiple image data points acquired by the acquisition unit. The setting unit presets the allowable time to avoid misidentifying the bonding member as a foreign object in the judgment unit due to changes in the characteristic quantities of the inspection area over time caused by variations in the bonding member applied to the inspection area to bond the substrate to the component.

[0012] Furthermore, this specification discloses a foreign object detection method comprising an acquisition step, a judgment step, and a setting step. In the acquisition step, at least a portion of an inspection area of ​​a substrate is photographed multiple times within a predetermined allowable time period, acquiring multiple image data of the same inspection area. In the judgment step, based on the differences in characteristic quantities of the inspection area obtained by image processing of the multiple image data acquired in the acquisition step, it is determined whether a foreign object is attached to the inspection area. In the setting step, the allowable time is preset to avoid misidentifying the bonding component as a foreign object in the judgment step due to changes in the characteristic quantities of the inspection area over time caused by variations in the bonding components that bond the substrate to the component and are coated on the inspection area.

[0013] Invention Effects

[0014] According to the foreign object detection device described above, it is possible to suppress false detections of foreign objects caused by changes in the bonding components between the bonding substrate and the component in the inspection area of ​​the substrate over time. The same applies to the foreign object detection method as described above regarding the foreign object detection device. Attached Figure Description

[0015] Figure 1 This is a structural diagram illustrating an example of a substrate processing line.

[0016] Figure 2 This is a top view showing an example of the structure of a component assembly machine.

[0017] Figure 3 This is a block diagram representing an example of a control block for a foreign object detection device.

[0018] Figure 4 This is a flowchart illustrating an example of the control steps of a foreign object detection device.

[0019] Figure 5 This is a schematic diagram representing an example of reference data.

[0020] Figure 6 This is a diagram illustrating an example of comparing data.

[0021] Figure 7 This is a schematic diagram illustrating an example of the relationship between the allowed time, the first required time, and the second required time.

[0022] Figure 8 This is a flowchart illustrating an example of the control steps of a foreign object detection device. Detailed Implementation

[0023] 1. Implementation Method

[0024] 1-1. Structural example of substrate processing line WL0

[0025] In the substrate processing line WL0, a prescribed substrate processing operation is performed on substrate 90. There is no limitation on the type or number of substrate processing machines WM0 that constitute the substrate processing line WL0. For example... Figure 1 As shown, the substrate processing line WL0 of this embodiment includes multiple substrate processing machines WM0, such as a printer WM1, a printing inspection machine WM2, a component assembly machine WM3, a reflow oven WM4, and a visual inspection machine WM5. The substrate 90 is transported sequentially by a substrate transport device.

[0026] Printer WM1 prints solder at the assembly locations of multiple components 91 on substrate 90. Printing inspection machine WM2 inspects the printing status of the solder printed by printer WM1. For example... Figure 2 As shown, component assembly machine WM3 assembles multiple components 91 onto a substrate 90 on which solder has been printed by printer WM1. There can be one or more component assembly machines WM3. When multiple component assembly machines WM3 are provided, they can assemble the multiple components 91 in a distributed manner.

[0027] The reflow oven WM4 heats the substrate 90, on which multiple components 91 are assembled by the component assembly machine WM3, melting the solder to perform soldering. The appearance inspection machine WM5 inspects the assembly status of the multiple components 91 assembled by the component assembly machine WM3. Thus, the substrate processing line WL0 can use multiple substrate processing machines WM0 to sequentially transport the substrate 90 and perform production processes, including inspection, to produce substrate product 900. Furthermore, the substrate processing line WL0 can also be equipped with substrate processing machines WM0 such as functional inspection machines, buffer devices, substrate feeding devices, substrate flipping devices, shielding assembly devices, adhesive application devices, and ultraviolet irradiation devices, as needed.

[0028] The multiple substrate plating machines WM0 constituting the substrate plating line WL0 and the production line management device LC0 are connected and can communicate via a communication unit. Additionally, the production line management device LC0 and the management device HC0 are connected and can communicate via the communication unit. The communication unit can connect them via wired or wireless means, and various communication methods can be employed.

[0029] In this embodiment, a local area network (LAN) is formed by multiple substrate plating machines WM0, a production line management device LC0, and a management device HC0. Thus, the multiple substrate plating machines WM0 can communicate with each other via a communication unit. Furthermore, the multiple substrate plating machines WM0 can communicate with the production line management device LC0 via the communication unit. Moreover, the production line management device LC0 and the management device HC0 can communicate with each other via the communication unit.

[0030] The production line management unit LC0 controls the multiple substrate processing machines WM0 that constitute the substrate processing line WL0, and monitors the operation status of the substrate processing line WL0. The production line management unit LC0 stores various control data for controlling the multiple substrate processing machines WM0. The production line management unit LC0 sends control data to each of the multiple substrate processing machines WM0. In addition, each of the multiple substrate processing machines WM0 sends its operation status and production status to the production line management unit LC0.

[0031] The management device HC0 manages at least one production line management device LC0. For example, the operational status and production status of the substrate handling machine WM0, obtained by the production line management device LC0, are sent to the management device HC0 as needed. The management device HC0 is equipped with a storage device. The storage device is capable of storing various acquired data obtained from the substrate handling machine WM0. For example, various image data captured by the substrate handling machine WM0 are included in the acquired data. Records of the operating status of the substrate handling machine WM0 (log data) are also included in the acquired data. Furthermore, the storage device is capable of storing various production information related to the production of the substrate product 900.

[0032] The substrate processing line WL0 includes an input / output device 80. The input / output device 80 can be a known type of input / output device. The input / output device 80 includes a display unit that displays various data in a visually readable manner. Furthermore, the display unit, which is composed of a touch panel, also functions as an input device for receiving various operations from the operator.

[0033] 1-2. Structural Example of Component Assembly Machine WM3

[0034] The component assembly machine WM3 assembles multiple components 91 onto the substrate 90. For example... Figure 2As shown, the component assembly machine WM3 includes a substrate handling device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15, and a control device 16.

[0035] The substrate transport device 11, for example, is a belt conveyor, which transports the substrate 90 along the transport direction (X-axis direction). The substrate 90 is a circuit board for forming electronic circuits, electrical circuits, magnetic circuits, etc. The substrate transport device 11 moves the substrate 90 into the component assembly machine WM3 and positions the substrate 90 at a predetermined position within the machine. After the component assembly machine WM3 has finished assembling multiple components 91, the substrate transport device 11 moves the substrate 90 out of the component assembly machine WM3.

[0036] The component supply device 12 supplies a plurality of components 91 to be assembled onto the substrate 90. The component supply device 12 has a plurality of feeders 12a arranged along the transport direction (X-axis direction) of the substrate 90. Each feeder 12a is equipped with a reel. A carrier tape containing the plurality of components 91 is wound on the reel. The feeders 12a perform pitch feeding on the carrier tape and supply the components 91 in a pick-up manner at a supply position located at the top side of the feeder 12a. Alternatively, the component supply device 12 can also supply larger electronic components (e.g., leaded components) that are arranged on a tray.

[0037] The component transfer device 13 includes a head drive device 13a and a moving stage 13b. The head drive device 13a is configured to move the moving stage 13b in the X-axis and Y-axis directions via a linear motion mechanism. An assembly head 20 is provided on the moving stage 13b in a detachable (replaceable) manner via a clamping member. The assembly head 20 uses at least one holding member 30 to pick up and hold the component 91 supplied by the component supply device 12 and assemble the component 91 onto the substrate 90 positioned by the substrate transport device 11. The holding member 30 can be, for example, a nozzle, a chuck, or the like.

[0038] The component camera 14 and the substrate camera 15 can use known imaging devices. The component camera 14 is fixed to the base of the component assembly machine WM3 with its optical axis pointing upwards in the vertical direction (Z-axis direction). The component camera 14 can capture images of the component 91 held in the holding member 30 from below. The substrate camera 15 is provided on the moving stage 13b of the component transfer device 13 with its optical axis pointing downwards in the vertical direction (Z-axis direction). The substrate camera 15 can capture images of the substrate 90 from above. The component camera 14 and the substrate camera 15 capture images based on control signals sent from the control device 16. The image data of the captured images by the component camera 14 and the substrate camera 15 are sent to the control device 16.

[0039] The control device 16 is equipped with a known arithmetic unit and a storage unit, and constitutes a control circuit. Information, image data, etc., output from various sensors installed in the component assembly machine WM3 are input to the control device 16. Based on the control program and pre-set assembly conditions, the control device 16 sends control signals to each device.

[0040] For example, the control device 16 causes the substrate camera 15 to capture an image of the substrate 90 after it has been positioned by the substrate transport device 11. The control device 16 performs image processing on the image captured by the substrate camera 15 to identify the positioning state of the substrate 90. Additionally, the control device 16 causes the holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to capture an image of the component 91 held in the holding member 30. The control device 16 performs image processing on the image captured by the component camera 14 to identify the holding posture of the component 91.

[0041] The control device 16 moves the holding member 30 upward toward a predetermined assembly position set by a control program. Furthermore, the control device 16 corrects the predetermined assembly position based on the positioning state of the substrate 90 and the holding posture of the component 91, and sets the actual assembly position of the assembled component 91. The predetermined assembly position and the actual assembly position include not only position (X-axis and Y-axis coordinates) but also rotation angle.

[0042] The control device 16 corrects the target position (X-axis and Y-axis coordinates) and rotation angle of the holding member 30 according to the assembly position. At the corrected target position, the control device 16 lowers the holding member 30 by the corrected rotation angle, assembling the component 91 onto the substrate 90. The control device 16 performs the assembly process of assembling multiple components 91 onto the substrate 90 by repeatedly performing the above pick-and-place cycle.

[0043] 1-3. Structural Example of Foreign Object Detection Device 70

[0044] like Figure 2 As shown, if a foreign object 92 (e.g., another component 91, debris, etc.) is attached to the assembly location of component 91, there is a possibility of poor assembly of component 91 (e.g., component 91 not assembled, floating, tilting, etc.), and it is necessary to determine whether the foreign object 92 is attached to the substrate 90. When comparing multiple image data PD0 obtained by photographing the same inspection area CA0 of at least a portion of the substrate 90, and determining the presence or absence of foreign object 92 based on the differences in characteristic quantities of image data PD0 (e.g., pixel brightness, etc.), there is a possibility of misidentifying a component other than foreign object 92 as foreign object 92.

[0045] Specifically, the feature quantity of the inspection area CA0 obtained by image processing of image data PD0 varies over time due to the changes in the bonding components 93 (e.g., solder, adhesive, etc.) between the bonding substrate 90 and the component 91 coated on the inspection area CA0 of the substrate 90. Therefore, there is a possibility that the bonding component 93 may be mistakenly identified as a foreign object 92. To address this, the substrate processing line WL0 in this embodiment is provided with a foreign object detection device 70 capable of suppressing the misidentification of foreign objects 92 caused by the changes in the bonding component 93 over time.

[0046] When the foreign object detection device 70 is understood as a control block, it includes an acquisition unit 71, a judgment unit 72, and a setting unit 73. The foreign object detection device 70 may also include a transport control unit 74. The foreign object detection device 70 may also include an assembly control unit 75. For example... Figure 3 As shown, the foreign object detection device 70 of this embodiment includes an acquisition unit 71, a judgment unit 72, a setting unit 73, a transport control unit 74, and an assembly control unit 75.

[0047] The foreign object detection device 70 can be installed in various control devices. For example, the foreign object detection device 70 can be installed in the control device 16 of the component assembly machine WM3, the production line management device LC0, the management device HC0, etc. The foreign object detection device 70 can also be installed in the cloud. Figure 3 As shown, in the foreign object detection device 70 of this embodiment, the acquisition unit 71, the judgment unit 72, the transport control unit 74, and the assembly control unit 75 are provided in multiple (in) Figure 1 In the example shown, the control devices 16 of each of the three component assembly machines WM3 are located in the management device HC0.

[0048] Furthermore, the foreign object detection device 70 of this embodiment is in accordance with Figure 4 The flowchart shown illustrates the execution control. The acquisition unit 71 performs the process shown in step S12. The judgment unit 72 performs the process shown in step S13. The setting unit 73 performs the process shown in step S11. Furthermore, the processes of the transport control unit 74 and the assembly control unit 75 will be described later.

[0049] 1-3-1. Obtaining Part 71

[0050] The acquisition unit 71 takes multiple images of at least a portion of the inspection area CA0 of the substrate 90 within a specified allowable time T0, and acquires multiple image data PD0 obtained from taking images of the same inspection area CA0. Figure 4 Step S12 (as shown).

[0051] As the inspection area CA0, the acquisition unit 71 can photograph the entire assembly area of ​​the substrate 90, or it can photograph a portion of the assembly area of ​​the substrate 90. When photographing a portion of the assembly area of ​​the substrate 90, the acquisition unit 71 can, for example, photograph the assembly area of ​​components 91 (e.g., BGA (Ball Grid Array) components 91) where the number of electrodes is greater than the number of chip components and which are easily affected by foreign matter 92. In addition, based on past assembly performance, the acquisition unit 71 can also identify assembly areas where component 91 assembly defects have occurred due to foreign matter 92, assembly areas where foreign matter 92 is easily attached, etc., and photograph these assembly areas as the inspection area CA0.

[0052] The acquisition unit 71 can also designate an area specified by the user of the component assembly machine WM3, which assembles components 91 onto the substrate 90, as the inspection area CA0. The substrate assembly line WL0 of this embodiment includes an input / output device 80. For example, the user can use the input / output device 80 to designate any area (the entire assembly area of ​​the substrate 90 or a portion of the assembly area of ​​the substrate 90) as the inspection area CA0. In this case, the acquisition unit 71 causes the display unit of the input / output device 80 to schematically display the assembly area of ​​the components 91 on the substrate 90, allowing the user to select any assembly area.

[0053] The acquisition unit 71 can acquire image data PD0 using an imaging device capable of capturing the inspection area CA0. The imaging device is not limited to any device capable of capturing the inspection area CA0. For example, a substrate camera 15 capable of capturing a portion of the assembly area of ​​the substrate 90 from above, or a ceiling camera capable of capturing the entire assembly area of ​​the substrate 90 from above, can be included in the imaging device. In this embodiment, using the substrate camera 15, the acquisition unit 71 designates the area specified by the user of the component assembly machine WM3 as the inspection area CA0. Furthermore, the acquisition unit 71 allows the same shooting conditions (e.g., exposure time, aperture, illumination time, etc.) set by the imaging device to be used repeatedly to capture the same inspection area CA0. Additionally, the allowable time T0 is set by the setting unit 73.

[0054] 1-3-2. Judgment Section 72

[0055] The determination unit 72 determines whether there is a foreign object 92 attached to the inspection area CA0 based on the difference in feature quantities obtained by image processing of each of the multiple image data PD0 acquired by the acquisition unit 71. Figure 4 Step S13 (as shown).

[0056] The first image data PD0 obtained from a plurality of image data PD0 (two in this embodiment) is used as reference data SD0. The other image data PD0 from the plurality of image data PD0 is used as comparison data CD0. At this time, when the difference between the feature value of the inspection area CA0 obtained from the reference data SD0 and the feature value of the inspection area CA0 obtained from the comparison data CD0 exceeds a predetermined threshold, the determination unit 72 determines that a foreign object 92 is attached to the inspection area CA0. When the difference between the feature value of the inspection area CA0 obtained from the reference data SD0 and the feature value of the inspection area CA0 obtained from the comparison data CD0 is less than or equal to the predetermined threshold, the determination unit 72 determines that no foreign object 92 is attached to the inspection area CA0.

[0057] The feature quantities are not limited to any values ​​obtained by image processing of the image data PD0. For example, the brightness, chroma, and luminance of each pixel in the reference data SD0 and the comparison data CD0 are included in the feature quantities. Additionally, the area and perimeter length of the closed regions obtained by performing image processing (e.g., binarization) on the reference data SD0 and the comparison data CD0 are included in the feature quantities. In this embodiment, the feature quantity is the brightness of each pixel in the reference data SD0 and the comparison data CD0.

[0058] Furthermore, the aforementioned threshold is set to be greater than the feature quantity (e.g., pixel brightness) when no foreign object 92 is attached to the inspection area CA0, and less than the feature quantity when foreign object 92 is attached to the inspection area CA0. The threshold is predetermined, for example, through simulation or real-machine-based verification.

[0059] Figure 5 as well as Figure 6 An example of multiple (two) image data PD0 acquired by the acquisition unit 71 is shown schematically. Figure 5 Indicates the baseline data SD0, Figure 6 This indicates that the comparison data is CD0. Furthermore, in... Figure 5 as well as Figure 6 The image also illustrates multiple pixels arranged in a grid pattern. Additionally, Figure 5 as well as Figure 6 The region AR0 shown represents the same region (a set of multiple pixels) within the inspection region CA0.

[0060] In the case where foreign object 92 is attached to region AR0. Figure 5 The brightness of the pixels contained in region AR0 shown is... Figure 6 The difference in brightness among the pixels in region AR0 exceeds a specified threshold. Conversely, in the absence of foreign object 92 in region AR0, Figure 5The brightness of the pixels contained in region AR0 shown is... Figure 6 The difference in brightness of the pixels contained in the area AR0 shown is below a specified threshold.

[0061] Therefore, the judgment part 72 is in Figure 5 The brightness of the pixels contained in region AR0 shown is... Figure 6 When the difference in brightness between pixels within the area AR0 exceeds a predetermined threshold, it is determined that a foreign object 92 is attached to the inspection area CA0. The determination unit 72 then... Figure 5 The brightness of the pixels contained in region AR0 shown is... Figure 6 If the difference in brightness among the pixels in the area AR0 shown is below a specified threshold, it is determined that no foreign object 92 is attached to the inspection area CA0. The brightness comparison is performed on a per-pixel basis.

[0062] The determination unit 72 can also make the determination when the number of image data PD0 acquired by the acquisition unit 71 is three or more. Specifically, the determination unit 72 can calculate the difference between the feature quantity of the inspection region CA0 obtained from the reference data SD0 and the feature quantity of the inspection region CA0 obtained from each of the multiple comparison data CD0, and determine whether the difference of the calculated feature quantity exceeds a predetermined threshold.

[0063] 1-3-3. Setting Department 73

[0064] If the feature quantity of the inspection area CA0 obtained by image processing of the image data PD0 changes over time due to the change in the bonding component 93 of the bonding substrate 90 and the element 91 of the inspection area CA0 coated on the substrate 90, there is a possibility that the determination unit 72 may misidentify the bonding component 93 as a foreign object 92. Therefore, the foreign object detection device 70 of this embodiment includes a setting unit 73.

[0065] The setting unit 73 presets an allowable time T0 to prevent the bonding component 93 of the bonding substrate 90 and the component 91 from being mistakenly identified as a foreign object 92 in the judgment unit 72 due to the change in the characteristic quantity of the inspection area CA0 over time due to the change in the bonding component 93 of the component 91 and the bonding substrate 90 applied to the inspection area CA0. Figure 4 Step S11 is shown.

[0066] The bonding component 93 is not limited to any component that bonds the substrate 90 to the component 91. For example, solder, adhesive, etc., are included in the bonding component 93. In this embodiment, the bonding component 93 is solder. The solder changes color from silver to gray as the flux it contains dries. Therefore, there is a possibility that the characteristic quantity of the inspection area CA0 may change due to the time change of the solder, and there is a possibility that the determination unit 72 may mistakenly identify the solder as foreign matter 92.

[0067] The allowable time T0 can be obtained in advance, for example, through simulation or on-machine verification. Furthermore, there may be cases where the allowable time T0 varies depending on the type of bonding component 93, and the setting unit 73 can also set the allowable time T0 corresponding to the type of bonding component 93. For example, the setting unit 73 can set the allowable time T0 corresponding to the type of solder. Additionally, the setting unit 73 can set the allowable time T0 corresponding to the type of adhesive.

[0068] The higher the temperature inside the component assembly machine WM3, the faster the flux in the solder dries. Conversely, the lower the humidity inside the component assembly machine WM3, the faster the flux in the solder dries. Therefore, the setting unit 73 can also set an allowable time T0 corresponding to at least one of the temperature and humidity inside the component assembly machine WM3 for assembling components 91 onto the substrate 90.

[0069] 1-3-4. Application example of WL0 substrate processing line

[0070] exist Figure 1 In the substrate assembly line WL0 shown, substrate 90 is sequentially transported to multiple (three in this figure) component assembly machines WM3 that assemble components 91 onto substrate 90, and multiple components 91 are sequentially assembled thereon. Figure 7 As shown, the first required time T1 is set as the time expected from the time the substrate 90 is moved into one of the multiple (three) component assembly machines WM3 until the substrate 90 is moved out of the component assembly machine WM3 after the component assembly machine WM3 has assembled the predetermined component 91 in the component assembly machine WM3 while the component assembly machine WM3 is working normally and has not stopped due to error.

[0071] When the allowable time T0 is greater than or equal to the first required time T1, the acquisition unit 71 can acquire multiple image data PD0 for each component assembly machine WM3. In this case, the determination unit 72 can determine whether there is a foreign object 92 attached to the inspection area CA0 inside the component assembly machine WM3. Furthermore, when the allowable time T0 is more than twice the first required time T1, the acquisition unit 71 can also acquire multiple image data PD0 for each of the multiple component assembly machines WM3. In this case, the determination unit 72 can determine whether there is a foreign object 92 for each of the multiple component assembly machines WM3. In addition, when a substrate transport conveyor is provided between multiple consecutively arranged component assembly machines WM3, if the sum of the first required time T1 for each of the multiple component assembly machines WM3 and the second required time T2 (described later) which is equivalent to the transport time of the substrate transport conveyor between the multiple component assembly machines WM3 is within the allowable time, the acquisition unit can also acquire multiple image data PD0 for each of the multiple component assembly machines WM3. In this case, the judgment unit 72 can also judge whether there is a foreign object 92 in each of the multiple component assembly machines WM3.

[0072] Furthermore, when the allowable time T0 is less than the first required time T1, the acquisition unit 71 repeatedly acquires multiple image data PD0s and the judgment unit 72 judges the presence or absence of foreign objects 92 within a component assembly machine WM3. Based on simulations of the historical changes of the bonding member 93 used in the substrate product 900 and verification results based on actual machines, it was determined that the acquisition unit 71 preferably acquires multiple image data PD0s for each component assembly machine WM3. Therefore, in the following descriptions of the transport control unit 74 and the assembly control unit 75, the acquisition unit 71 acquires multiple image data PD0s for each component assembly machine WM3, and the judgment unit 72 judges whether there are foreign objects 92 attached to the inspection area CA0 inside the component assembly machine WM3. Alternatively, the acquisition unit 71, the judgment unit 72, and the setting unit 73 can be any of the aforementioned configurations.

[0073] 1-3-5. Material handling control unit 74 and assembly control unit 75

[0074] Foreign object detection device 70 applied to substrate processing line WL0, for example, can be according to Figure 8 The flowchart shown is used to perform control. Furthermore, the component assembly machine WM3 that assembles component 91 to inspection area CA0 is designated as the target component assembly machine MT0, and at least one component assembly machine WM3 located upstream of the target component assembly machine MT0 is designated as the upstream component assembly machine MU0. In this embodiment, the allowable time T0 is a length greater than or equal to a first required time T1 and a second required time T2.

[0075] Additionally, for ease of explanation, such as Figure 1 as well as Figure 7 As shown, multiple (three) component assembly machines WM3 are sequentially designated as component assembly machine M1, component assembly machine M2, and component assembly machine M3 from the upstream side. Furthermore, component assembly machine M3 is designated as the target component assembly machine MT0, and component assembly machines M1 and M2 are designated as upstream component assembly machines MU0.

[0076] Foreign object detection device 70 determines whether component assembly machine WM3 is the upstream component assembly machine MU0 (component assembly machine M1 or component assembly machine M2). Figure 8 (Step S21 shown). When the component assembly machine WM3 is an upstream component assembly machine MU0 (when "Yes" is set in step S21), the acquisition unit 71 acquires multiple image data PD0 (step S22). Specifically, in each upstream component assembly machine MU0, the acquisition unit 71 captures the inspection area CA0 to acquire image data PD0 before the assembly process of component 91 begins, and captures the inspection area CA0 to acquire image data PD0 after the assembly process of component 91 ends.

[0077] Next, the determination unit 72 determines whether foreign matter 92 is attached to the inspection area CA0 in the upstream component assembly machine MU0 (step S23). When the determination unit 72 determines that no foreign matter 92 is attached to the inspection area CA0 in the upstream component assembly machine MU0 (in the case of "No" in step S23), the transport control unit 74 moves the substrate 90 to the next component assembly machine WM3 located downstream of the upstream component assembly machine MU0 (step S24).

[0078] When the determination unit 72 determines that a foreign object 92 is attached to the inspection area CA0 in the upstream component assembly machine MU0 (if "yes" is true in step S23), the transport control unit 74 stops the removal of the substrate 90 (step S25). In this case, for example, the operator can remove the substrate 90 to check for the presence or absence of the foreign object 92. Alternatively, if the foreign object 92 can be removed, the operator can also remove it.

[0079] If component assembly machine WM3 is not the upstream component assembly machine MU0 (if "No" is true in step S21), the foreign object detection device 70 determines whether component assembly machine WM3 is the target component assembly machine MT0 (component assembly machine M3) (step S26). If component assembly machine WM3 is the target component assembly machine MT0 (if "Yes" is true in step S26), the acquisition unit 71 acquires multiple image data PD0 (step S27). Specifically, in the target component assembly machine MT0, the acquisition unit 71 captures the inspection area CA0 and acquires image data PD0 before starting the assembly process of component 91, and captures the inspection area CA0 and acquires image data PD0 before assembling the component 91 to be assembled into the inspection area CA0.

[0080] Next, the determination unit 72 determines whether a foreign object 92 is attached to the inspection area CA0 in the target component assembly machine MT0 (step S28). When the determination unit 72 determines that no foreign object 92 is attached to the inspection area CA0 in the target component assembly machine MT0 (if "No" is true in step S28), the assembly control unit 75 allows the component to be assembled into the inspection area CA0 for assembly 91 (step S29). Furthermore, the control of the foreign object detection device 70 is temporarily terminated.

[0081] When the determination unit 72 determines that a foreign object 92 is attached to the inspection area CA0 in the target component assembly machine MT0 (if "yes" is indicated in step S28), the assembly control unit 75 restricts the assembly of the component 91 to the inspection area CA0 (step S30). In this case, for example, the operator can remove the substrate 90 to check for the presence or absence of the foreign object 92. Alternatively, if the foreign object 92 can be removed, the operator can also remove it.

[0082] Furthermore, if the component assembly machine WM3 is not the target component assembly machine MT0 (in the case of "No" in step S26), the component assembly machine WM3 is located downstream of the target component assembly machine MT0, and component 91 has already been assembled in the inspection area CA0. Therefore, in this case, the control of the foreign object detection device 70 is temporarily terminated.

[0083] Thus, before and after the assembly process of component 91 begins in the upstream component assembly machine MU0, the acquisition unit 71 captures images of the inspection area CA0 to obtain image data PD0. Furthermore, when the determination unit 72 determines that no foreign matter 92 is attached to the inspection area CA0 in the upstream component assembly machine MU0, the transport control unit 74 moves the substrate 90 to the next component assembly machine WM3 located downstream of the upstream component assembly machine MU0. By sequentially performing the above processes in the upstream component assembly machine MU0, the substrate 90 in which no foreign matter 92 is attached to the inspection area CA0 is transported to the target component assembly machine MT0.

[0084] Furthermore, before the component assembly process of the target component 91 begins in the target component assembly machine MT0 and before the component 91 to be assembled into the inspection area CA0, the acquisition unit 71 captures image data PD0 of the inspection area CA0. And, when the determination unit 72 determines that no foreign matter 92 is attached to the inspection area CA0 in the target component assembly machine MT0, the assembly control unit 75 allows the assembly of the component 91 to the inspection area CA0. By performing the above process in the target component assembly machine MT0, the target component assembly machine MT0 can assemble the component 91 to be assembled in the inspection area CA0 where no foreign matter 92 is attached.

[0085] 1-3-6. Handling of substrate 90 between components in WM3 component assembly machine

[0086] In the event of foreign matter 92 adhering during the transport of substrate 90 between component assembly machines WM3, the foreign matter detection device 70 can perform the control shown below. In this manner, substrate 90 is also sequentially transported to multiple (in) assembly points for components 91 to be assembled on substrate 90. Figure 1 The example shown is a three-component assembly machine WM3, which assembles multiple components 91 sequentially. Furthermore, the acquisition unit 71, the judgment unit 72, and the setting unit 73 can be any of the methods described above. Moreover, as... Figure 7 As shown, the second required time T2 is defined as the time required from the moment the substrate 90 is moved out of one of the multiple (three) component assembly machines WM3, namely the first component assembly machine MF0, until the substrate 90 is moved into the next component assembly machine WM3, namely the second component assembly machine MS0, which is located downstream of the first component assembly machine MF0, while the component assembly machine WM3 is working normally and has not stopped due to an error.

[0087] When the allowed time T0 is greater than or equal to the second required time T2, the acquisition unit 71 captures image data PD0 of the inspection area CA0 after the assembly process of component 91 in the first component assembly machine MF0 is completed and before the substrate 90 is removed. Additionally, the acquisition unit 71 captures image data PD0 of the inspection area CA0 after the substrate 90 is moved into the second component assembly machine MS0 and before the assembly process of component 91 in the second component assembly machine MS0 begins. In this case, the determination unit 72 can determine whether there is any foreign object 92 attached to the inspection area CA0 during the transfer of the substrate 90 between the first component assembly machine MF0 and the second component assembly machine MS0.

[0088] 2. Foreign object detection methods

[0089] The same applies to the foreign object detection method as described for the foreign object detection device 70. Specifically, the foreign object detection method includes an acquisition step, a judgment step, and a setting step. The acquisition step corresponds to the control performed by the acquisition unit 71. The judgment step corresponds to the control performed by the judgment unit 72. The setting step corresponds to the control performed by the setting unit 73. In addition, the foreign object detection method may include a transport control step. The transport control step corresponds to the control performed by the transport control unit 74. The foreign object detection method may also include an assembly control step. The assembly control step corresponds to the control performed by the assembly control unit 75.

[0090] 3. An example of the effect of the implementation method

[0091] According to the foreign object detection device 70, it is possible to suppress the misjudgment of foreign objects 92 caused by the time-dependent changes in the bonding components 93 of the bonding substrate 90 and the component 91 coated on the inspection area CA0 of the substrate 90. The above description of the foreign object detection device 70 also applies to the foreign object detection method.

[0092] Explanation of reference numerals in the attached figures

[0093] 70. Foreign object detection device; 71. Acquisition unit; 72. Judgment unit; 73. Setting unit; 74. Transport control unit; 75. Assembly control unit; 90. Substrate; 91. Component; 92. Foreign object; 93. Joining component; CA0. Inspection area; PD0. Image data; SD0. Reference data; CD0. Comparison data; WM3. Component assembly machine; MT0. Target component assembly machine; MU0. Upstream component assembly machine; MF0. First component assembly machine; MS0. Second component assembly machine; T0. Allowable time; T1. First required time; T2. Second required time.

Claims

1. A foreign object detection device, comprising: The acquisition unit takes multiple photographs of at least a portion of the inspection area of ​​the substrate within a specified allowable time period, and acquires multiple image data obtained from photographing the same inspection area. The determination unit determines whether there is a foreign object attached to the inspection area based on the difference in feature quantities of the inspection area obtained by image processing of the plurality of image data obtained by the acquisition unit. as well as The setting unit presets the allowable time to avoid misjudging the bonding member as a foreign object in the judgment unit due to the change in the characteristic value of the inspection area caused by the time variation of the bonding member. The bonding member is applied to the inspection area and the substrate is bonded to the component.

2. The foreign object detection device according to claim 1, wherein, The acquisition unit will use the area designated by the user of the component assembly machine that assembles the component onto the substrate as the inspection area.

3. The foreign object detection device according to claim 1 or 2, wherein, When the difference between the feature quantity of the inspection area obtained based on the first image data (i.e., the reference data) and the feature quantity of the inspection area obtained based on another image data (i.e., the comparison data) exceeds a predetermined threshold, the determination unit determines that a foreign object is attached to the inspection area; when the difference in the feature quantity is below the predetermined threshold, the determination unit determines that no foreign object is attached to the inspection area.

4. The foreign object detection device according to claim 3, wherein, The feature quantity is the brightness of each pixel in the reference data and the comparison data.

5. The foreign object detection device according to claim 1 or 2, wherein, The setting unit sets the allowable time corresponding to the type of the engagement component.

6. The foreign object detection device according to claim 1 or 2, wherein, The setting unit sets the allowable time corresponding to at least one of the temperature and humidity inside the component assembly machine that assembles the component onto the substrate.

7. The foreign object detection device according to claim 1 or 2, wherein, The joining component is solder.

8. The foreign object detection device according to claim 1 or 2, wherein, The substrate is sequentially transported to multiple component assembly machines that assemble the components onto the substrate, and multiple components are sequentially assembled onto the substrate. The allowed time is a first required time or more, which is the time expected from the moment the substrate is moved into one of the plurality of component assembly machines until the substrate is assembled with the predetermined components in the component assembly machine under normal operation without stopping due to errors, and then removed from the component assembly machine. The acquisition unit acquires the plurality of image data for each of the component assembly machines. The judgment unit determines whether the foreign object is attached to the inspection area inside the component assembly machine.

9. The foreign object detection device according to claim 8, wherein, In at least one upstream component assembly machine (i.e., an upstream component assembly machine) located upstream of the component assembly machine that assembles the component in the inspection area, the acquisition unit captures the inspection area and acquires the image data in each upstream component assembly machine before starting the component assembly process, and captures the inspection area and acquires the image data after the component assembly process is completed.

10. The foreign object detection device according to claim 9, wherein, The foreign object detection device includes a transport control unit. When the determination unit determines that no foreign object is attached to the inspection area in the upstream component assembly machine, the transport control unit moves the substrate to the next component assembly machine located downstream of the upstream component assembly machine. When the determination unit determines that the foreign object is attached to the inspection area in the upstream component assembly machine, the transport control unit stops moving the substrate.

11. The foreign object detection device according to claim 8, wherein, In the component assembly machine, i.e., the target component assembly machine, which assembles the component into the inspection area, the acquisition unit takes a picture of the inspection area and acquires the image data before starting the component assembly process, and takes a picture of the inspection area and acquires the image data before assembling the component to be assembled into the inspection area.

12. The foreign object detection device according to claim 11, wherein, The foreign object detection device includes an assembly control unit. When the determination unit determines that no foreign object is attached to the inspection area in the object component assembly machine, the assembly control unit allows the component to be assembled into the inspection area. When the determination unit determines that the foreign object is attached to the inspection area in the object component assembly machine, the assembly control unit restricts the assembly of the component to be assembled into the inspection area.

13. The foreign object detection device according to claim 1 or 2, wherein, The substrate is sequentially transported to multiple component assembly machines that assemble the components onto the substrate, and multiple components are sequentially assembled onto the substrate. The allowed time is a second required time or more. This second required time is the time expected to be required from the moment the substrate is removed from one of the plurality of component assembly machines, i.e., the first component assembly machine, until the substrate is moved into the next component assembly machine, i.e., the second component assembly machine, located downstream of the first component assembly machine, while the second component assembly machine is operating normally without stopping due to errors. The acquisition unit captures image data of the inspection area after the assembly process of the component in the first component assembly machine is completed and before the substrate is removed, and captures image data of the inspection area after the substrate is moved into the second component assembly machine and before the assembly process of the component in the second component assembly machine begins. The determination unit determines whether the foreign object is attached to the inspection area when the substrate is transported between the first component assembly machine and the second component assembly machine.

14. A method for detecting foreign objects, comprising: The process involves taking multiple photographs of at least a portion of the inspection area of ​​the substrate within a specified allowable time period, and obtaining multiple image data obtained from photographing the same inspection area. The judgment process, based on the differences in feature quantities of the inspection area obtained by image processing of the multiple image data obtained through the acquisition process, determines whether any foreign object is attached to the inspection area; and The process involves setting a predetermined allowable time to prevent the bonding component from being mistakenly identified as a foreign object in the judgment process due to changes in the characteristic quantity of the inspection area caused by the temporal variation of the bonding component. The bonding component is applied to the inspection area and the substrate is bonded to the component.

Images