Electrolytic wire cutting apparatus and method for generating elliptical vibrations

Abstract

The application belongs to the technical field of electrolytic processing, and relates to an electrolytic wire cutting device and method for generating elliptical vibration. The device comprises a base I, piezoelectric ceramics I, piezoelectric ceramics II, a flexible mechanism, a moving platform and a clamp arranged on the base I; the base I comprises a vertical connecting part and a horizontal connecting part; the piezoelectric ceramics I are arranged between the horizontal connecting part and a lever mechanism I; the piezoelectric ceramics II are arranged between the vertical connecting part and a lever mechanism II; a half-bridge mechanism I is arranged above the piezoelectric ceramics I and connected between the lever mechanism I and the horizontal connecting part; a half-bridge mechanism II is arranged on one side of the lever mechanism II and connected between the lever mechanism II and the vertical connecting part; the moving platform is connected between the two half-bridge mechanisms in parallel with a plate spring mechanism; the clamp is connected with the moving platform and used for connecting an electrode wire to generate cutting tracks with the same size and uniform distribution; and the electrolytic processing efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of electrolytic machining technology, specifically, it relates to an electrolytic wire cutting apparatus and method that generates elliptical vibration. Background Technology

[0002] In the field of metal micro / nano fabrication, flexible amplification mechanisms have always been the primary cutting tools. Different flexible mechanisms, due to variations in thickness, type, and structural dimensions, result in different final forms. However, many flexible amplification mechanisms do not achieve ideal cutting results. Currently, the main structural types in China include: SR structures, single-leaf spring hinges, semi-circular flexible hinges, and lever-driven AC mechanisms. While these existing structures can achieve amplification to a certain extent and are widely used, they share a common drawback: the amplification mechanism achieves limited elliptical amplification across the entire system, and the major and minor axes of the ellipse are inconsistent, making qualitative control impossible. This leads to suboptimal cutting results. Therefore, this study researched and developed electrolytic wire cutting technology.

[0003] Electrolytic wire cutting is a novel metal cutting technology that utilizes a wire electrode as the cathode. Conductive metal materials undergo an electrochemical reaction in a salt / acid / alkali solution and are dissolved. It offers advantages such as being unaffected by the workpiece's mechanical properties, zero wire electrode wear, and no processing stress or recast layer on the machined surface, making it ideal for high-precision machining of difficult-to-machine materials. However, the machining gap in electrolytic wire cutting is generally small. When the workpiece is thick, the large amount of electrolytic products generated is difficult to remove, easily causing uneven conductivity distribution within the machining area, thus affecting machining accuracy and stability.

[0004] In view of this, the present invention is proposed. Summary of the Invention

[0005] This invention proposes an electrolytic wire cutting apparatus and method for generating elliptical vibration.

[0006] The basic concept of the technical solution adopted in this invention is:

[0007] An electrolytic wire cutting processing device that generates elliptical vibration includes a base I, on which piezoelectric ceramic I, piezoelectric ceramic II, a flexible mechanism, a moving platform, and a clamp are disposed; the flexible mechanism includes a horizontal flexible mechanism and a vertical flexible mechanism, the horizontal flexible mechanism including a lever mechanism I, a half-bridge mechanism I, and a parallel leaf spring mechanism I; the vertical flexible mechanism includes a lever mechanism II, a half-bridge mechanism II, and a parallel leaf spring mechanism II;

[0008] The base I includes a vertical connecting part and a horizontal connecting part; one end of the piezoelectric ceramic I is connected to the horizontal connecting part, and the other end is spherical and forms a point-to-surface contact with the planar input end of the lever mechanism I; the upper end of the piezoelectric ceramic II is spherical and forms a point-to-surface contact with the planar input end of the lever mechanism II, and the lower end of the piezoelectric ceramic II is connected to the vertical connecting part.

[0009] Both the half-bridge mechanism I and the half-bridge mechanism II are composed of three small half-bridge blocks connected in sequence. The half-bridge mechanism I is located above the piezoelectric ceramic I, and one end of the small half-bridge block of the half-bridge mechanism I is connected to the lever mechanism I, and the other end of the small half-bridge block is connected to the horizontal connecting part. The half-bridge mechanism II is located on one side of the lever mechanism II, and the top small half-bridge block of the half-bridge mechanism II is connected to the lever mechanism II, and the bottom small half-bridge block is connected to the vertical connecting part.

[0010] One end of the moving platform is connected to the small half-bridge block in the middle part of the half-bridge mechanism I via a parallel leaf spring mechanism I, and the other end is connected to the small half-bridge block in the middle part of the half-bridge mechanism II via a parallel leaf spring mechanism II; the parallel leaf spring mechanism I and the parallel leaf spring mechanism II are arranged at 90°.

[0011] The fixture includes a base II, a flexible hinge, and clamping arms. The base II is connected to the moving platform. The base II is connected to a pair of clamping arms via a pair of flexible hinges. There are notches at the opposite ends of the clamping arms. Electrode wires are placed in the notches and clamped in the notches by clamping bolts.

[0012] Furthermore, the overall appearance of the small semi-bridge blocks connecting lever mechanism I, lever mechanism II, and base I is zig-shaped; the connection method of the small semi-bridge blocks in the middle part is straight.

[0013] Furthermore, one end of the lever mechanism I is connected to the base I via a flexible hinge A1, and the other end is connected to the flexible hinge B1 of the half-bridge mechanism I, forming a first-stage displacement amplification mechanism.

[0014] Furthermore, the center points of flexible hinge B1 and flexible hinge E1 of the half-bridge mechanism I are located on the same horizontal line, and the center points of flexible hinge C1 and flexible hinge D1 of the half-bridge mechanism I are located on the same horizontal line. The two straight lines are parallel to each other and not on the same line. Flexible hinges B1, C1, D1 and E1 of the half-bridge mechanism I are rigidly connected to form a second-stage displacement amplification mechanism.

[0015] Furthermore, both the vertical and horizontal connecting parts on the base I are L-shaped, and they are arranged symmetrically with respect to the Y-axis, which is inclined at 45° to the upper right. The X-axis is perpendicular to the Y-axis and inclined at 45° to the lower right.

[0016] Furthermore, the displacement of the moving platform is output along the Y-axis, and the angle between the displacement output directions of the parallel leaf spring mechanism I and the parallel leaf spring mechanism II and the displacement output direction of the moving platform is 45°.

[0017] Furthermore, based on the horizontal output displacement M generated by piezoelectric ceramic I on the moving platform, and the vertical displacement N generated by piezoelectric ceramic II on the moving platform, the displacements generated by the moving platform on the X and Y axes can be calculated as follows:

[0018]

[0019]

[0020] A processing method for an electrolytic wire cutting device that generates elliptical vibration includes the following steps:

[0021] S1. Apply voltage to piezoelectric ceramic I and piezoelectric ceramic II respectively. Piezoelectric ceramic I deforms along its axial direction and outputs displacement to the input end of lever mechanism I. Piezoelectric ceramic II also deforms along its axial direction and outputs displacement to the input end of lever mechanism II, thus realizing the first stage of displacement amplification.

[0022] The lever mechanism I transmits displacement to the half-bridge mechanism I through the flexible hinge B1, and the lever mechanism II transmits displacement to the half-bridge mechanism II through the flexible hinge B2. The half-bridge mechanism I and the half-bridge mechanism II achieve a second-level amplification of displacement.

[0023] The two amplified displacements act together on the moving platform, generating displacements along the X and Y directions on the moving platform and the fixture.

[0024] S2. To achieve electrolytic wire cutting, an electrolyte flows between the electrode wire and the workpiece. The electrode wire is connected to the negative terminal of the power supply, and the workpiece is connected to the positive terminal of the power supply. The electrode wire has elliptical vibration, and the workpiece moves toward the electrode wire, together achieving elliptical vibration-assisted electrolytic wire cutting.

[0025] Furthermore, in S1, the control signals for piezoelectric ceramic I and piezoelectric ceramic II are:

[0026]

[0027] In the formula, and These represent the two phases of the voltage; , These are the control signal amplitudes for piezoelectric ceramic I and piezoelectric ceramic II, respectively. It controls the signal frequency. Electrolysis time; It is the phase difference between the control signals of piezoelectric ceramic I and piezoelectric ceramic II;

[0028] By adding two control signals, we can obtain an elliptical trajectory that changes over time.

[0029] Compared with the prior art, the present invention has the following advantages:

[0030] 1. This invention utilizes lever mechanisms and half-bridge mechanisms to achieve two-stage displacement amplification, increasing the output displacement of the piezoelectric ceramic. By employing different connection methods of lever mechanisms and half-bridge mechanisms, the output Y-axis is arranged at 45° with the displacement output directions of parallel leaf spring mechanism I and parallel leaf spring mechanism II, which helps to achieve a wide range of elliptical vibration of the electrode wire. Furthermore, the output displacements in the two directions can be superimposed to achieve composite motion, making the trajectory more varied and meeting actual processing requirements. By changing different elliptical trajectories according to different cutting needs, cutting trajectories of the same size and uniform distribution can be generated.

[0031] 2. In the electrolytic processing described in this invention, the vibration trajectory of the electrode wire is adjusted by a piezoelectric ceramic control signal, and the frequency, shape, and amplitude of the elliptical vibration trajectory are easily adjusted by computer output parameters. The elliptical vibration of the electrode wire can generate turbulence in the electrolyte, which is beneficial to the renewal of the electrolyte in the electrolytic gap, thereby improving the efficiency of electrolytic processing.

[0032] The specific embodiments of the present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the assembly structure of the present invention;

[0034] Figure 2 This is a schematic diagram of the flexible mechanism structure of the present invention;

[0035] Figure 3 This is a schematic diagram of the clamp structure of the present invention;

[0036] Figure 4 This is a schematic diagram of the electrolytic wire cutting process of the present invention;

[0037] Figure 5 This is a schematic diagram of the target ellipse cutting trajectory under the condition that phi remains unchanged according to the present invention;

[0038] Figure 6 For the present invention in and This is a schematic diagram of an elliptical trajectory under constant conditions.

[0039] Among them: 1. Piezoelectric ceramic I; 2. Preload bolt I; 3. Preload bolt II;

[0040] 4. Flexible mechanism; 41. Flexible hinge A1; 42. Lever mechanism I; 43. Flexible hinge B1; 44. Flexible hinge C1; 45. Half-bridge mechanism I; 46. Flexible hinge D1; 47. Flexible hinge E1; 48. Preloaded threaded hole I; 49. Base I; 410. Preloaded threaded hole II; 411. Flexible hinge E2; 412. Flexible hinge D2; 413. Half-bridge mechanism II; 414. Flexible hinge C2; ​​415. Lever mechanism II; 416. Flexible hinge A2; 417. Flexible hinge B2; 418. Parallel leaf spring mechanism II; 419. Moving platform; 420. Fixed clamp threaded hole; 421. Parallel leaf spring mechanism I;

[0041] 5. Piezoelectric ceramic II; 6. Fixture; 61. Base II; 62. Fixture flexible hinge; 63. Clamping arm; 64. Clamping bolt; 65. Electrode wire; 66. Notch; 67. Nut; 7. Workpiece; 8. Electrolyte; 9. Power supply. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate the present invention.

[0043] like Figures 1-6 As shown, this application discloses an electrolytic wire cutting processing device that generates elliptical vibration, including a base I 49. The base I 49 is provided with piezoelectric ceramic I, piezoelectric ceramic II, a flexible mechanism, a moving platform, and a clamp. The flexible mechanism includes a horizontal flexible mechanism and a vertical flexible mechanism. The horizontal flexible mechanism includes a lever mechanism I 42, a half-bridge mechanism I 45, and a parallel leaf spring mechanism I 421. The vertical flexible mechanism includes a lever mechanism II 415, a half-bridge mechanism II 413, and a parallel leaf spring mechanism II 418.

[0044] The base I49 includes an integrally formed vertical connecting part and a horizontal connecting part; one end of the piezoelectric ceramic I1 is connected to the horizontal connecting part via a pre-tightening bolt I2, and the other end is spherical and forms a point-to-surface contact with the planar input end of the lever mechanism I42; the upper end of the piezoelectric ceramic II5 is spherical and forms a point-to-surface contact with the planar input end of the lever mechanism II415, and the lower end of the piezoelectric ceramic II5 is connected to the vertical connecting part via a pre-tightening bolt II3. Preferably, the horizontal connecting part is provided with a pre-tightening threaded hole I48 for placing the pre-tightening bolt I2, and a portion of the pre-tightening bolt I2 extends to the outside of the horizontal connecting part and connects with the piezoelectric ceramic I1; the vertical connecting part is provided with a pre-tightening threaded hole II410 for placing the pre-tightening bolt II3, and a portion of the pre-tightening bolt II3 extends to the outside of the vertical connecting part and connects with the piezoelectric ceramic II3.

[0045] Preferably, the thickness of lever mechanism I 42 and lever mechanism II 415 is 10 mm; the semi-circular diameter of the ends of lever mechanism I 42 and lever mechanism II 415 is 0.5 mm; as mentioned above, the width of the planar input end of lever mechanism I 42 and lever mechanism II 415 that contacts the piezoelectric ceramic is 0.5 mm.

[0046] Both the half-bridge mechanism I 45 and the half-bridge mechanism II 413 consist of three small half-bridge blocks connected in sequence. The half-bridge mechanism I 45 is located above the piezoelectric ceramic I 1, and one end of the small half-bridge block of the half-bridge mechanism I 45 is connected to the lever mechanism I 42, while the other end of the small half-bridge block is connected to the horizontal connecting part. Similarly, the half-bridge mechanism II 413 is located on one side of the lever mechanism II 415, with the top small half-bridge block of the half-bridge mechanism II 413 connected to the lever mechanism II 415 and the bottom small half-bridge block connected to the vertical connecting part. The overall appearance of the small half-bridge blocks connecting the lever mechanism I, the lever mechanism II, and the base I is a zigzag shape. The zigzag shape has a certain rotational amplification effect on amplifying the displacement transmitted from the half-bridge mechanism I 45 and the half-bridge mechanism II 413. The connection method of the small half-bridge blocks in the middle part is a straight line, which has a more stable effect on the subsequent rigid body transmission. Preferably, the thickness of the half-bridge mechanism I 45 and the half-bridge mechanism II 413 is 10 mm; the semi-circular diameter of the ends of the half-bridge mechanism I 45 and the half-bridge mechanism II 413 is 0.4 mm.

[0047] The lever mechanism I 42 and lever mechanism II 45 can amplify the motion for the first time through fixed-axis rotation. The half-bridge mechanism I 45 and half-bridge mechanism II 413 can transmit the amplified displacement of the previous stage, and can achieve the second-stage amplification of the output motion through fixed-axis rotation and rigid body translation.

[0048] The above principle is illustrated using the mechanism on the horizontal connection as an example. One end of lever mechanism I42 is connected to base I49 via flexible hinge A141, and the other end is connected to flexible hinge B143 of half-bridge mechanism I45, forming the first-stage displacement amplification mechanism. The center points of flexible hinges B143 and E147 of half-bridge mechanism I45 are on the same horizontal line, and the center points of flexible hinges C144 and D146 of half-bridge mechanism I45 are on the same horizontal line. The two lines are parallel to each other but not parallel. Flexible hinges B143, C144, D146, and E147 of half-bridge mechanism I45 are rigidly connected to form the second-stage displacement amplification mechanism.

[0049] One end of the moving platform is connected to the small half-bridge block in the middle part of the half-bridge mechanism I45 via a parallel leaf spring mechanism I421, and the other end is connected to the small half-bridge block in the middle part of the half-bridge mechanism II413 via a parallel leaf spring mechanism II418; the parallel leaf spring mechanism I and the parallel leaf spring mechanism II are composed of double parallel leaf spring hinges, and the two are arranged at 90°.

[0050] Preferably, the vertical connecting part and the horizontal connecting part on the base I 49 are both L-shaped, and they are symmetrically arranged with respect to the Y-axis which is inclined to the upper right at 45°. The X-axis is perpendicular to the Y-axis and inclined to the lower right at 45°. The displacement of the moving platform 419 is output along the Y-axis, and the angle between the displacement output direction of the parallel leaf spring mechanism I 421 and the parallel leaf spring mechanism II 418 and the displacement output direction of the moving platform 419 is 45°.

[0051] Based on the horizontal output displacement M generated by piezoelectric ceramic I on the moving platform 419, and the vertical displacement N generated by piezoelectric ceramic II on the moving platform 419, the displacements generated by the moving platform 419 on the X and Y axes can be calculated as follows:

[0052]

[0053]

[0054] The clamp includes a base II 61, a clamping flexible hinge 62, and clamping arms 63. The base II 61 of the clamp 6 is connected to the threaded hole 420 on the moving platform by bolts. The base II 61 is connected to the clamping arms 63 symmetrically arranged along the Y-axis by a pair of clamping flexible hinges 62. The two symmetrical clamping arms 63 are connected by clamping bolts 64 parallel to the X-axis. There are notches 66 at opposite ends of the clamping arms. Electrode wires 65 are placed in the notches and clamped by the clamping bolts 64.

[0055] Furthermore, the processing method of the electrolytic wire cutting device that generates elliptical vibration, as described above, includes the following steps:

[0056] S1. Apply voltage to the piezoelectric ceramic I1 and piezoelectric ceramic II5 respectively. Piezoelectric ceramic I1 deforms along the axial direction and outputs displacement to the input end of the lever mechanism I42. Piezoelectric ceramic II5 also deforms along the axial direction and outputs displacement to the input end of the lever mechanism II415, thus realizing the first stage of displacement amplification.

[0057] The lever mechanism I 42 transmits displacement to the half-bridge mechanism I 45 through the flexible hinge B1 43, and the lever mechanism II 415 transmits displacement to the half-bridge mechanism II 413 through the flexible hinge B2 417. The half-bridge mechanism I 45 and the half-bridge mechanism II 413 achieve the second-level amplification of displacement.

[0058] The two amplified displacements act together on the moving platform 419, generating displacements along the X and Y directions on the moving platform 419 and the fixture 6.

[0059] S2. To achieve electrolytic wire cutting, electrolyte 8 is circulated between electrode wire 65 and workpiece 7. Electrode wire 65 is connected to the negative terminal of power supply 9, and workpiece 7 is connected to the positive terminal of power supply 9. Electrode wire 65 has elliptical vibration, and workpiece 7 moves toward electrode wire 65, together achieving elliptical vibration-assisted electrolytic wire cutting.

[0060] Furthermore, in S1, by controlling the frequency, amplitude, and phase difference of the control signals of the piezoelectric ceramic I1 and piezoelectric ceramic II5, the electrode wire 65 can generate elliptical vibration trajectories with different frequencies, amplitudes, and shapes.

[0061] Furthermore, in order to achieve the elliptical vibration of electrode wire 65, the control signals for piezoelectric ceramic I1 and piezoelectric ceramic II5 are as follows:

[0062]

[0063] In the formula, and These represent the two phases of the voltage; , These are the control signal amplitudes for piezoelectric ceramic I1 and piezoelectric ceramic II5, respectively. It controls the signal frequency. Electrolysis time; It is the phase difference between the control signals of piezoelectric ceramic I1 and piezoelectric ceramic II5.

[0064] By adding two control signals, we can obtain an elliptical trajectory that changes over time.

[0065] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. An electrolytic wire cutting processing device for generating elliptical vibration, comprising a base I, wherein piezoelectric ceramic I, piezoelectric ceramic II, a flexible mechanism, a moving platform, and a clamp are disposed on the base I; characterized in that: The flexible mechanism includes a horizontal flexible mechanism and a vertical flexible mechanism. The horizontal flexible mechanism includes a lever mechanism I, a half-bridge mechanism I, and a parallel leaf spring mechanism I. The vertical flexible mechanism includes a lever mechanism II, a half-bridge mechanism II, and a parallel leaf spring mechanism II. The base I includes a vertical connecting part and a horizontal connecting part; one end of the piezoelectric ceramic I is connected to the horizontal connecting part, and the other end is spherical and forms a point-to-surface contact with the planar input end of the lever mechanism I; the upper end of the piezoelectric ceramic II is spherical and forms a point-to-surface contact with the planar input end of the lever mechanism II, and the lower end of the piezoelectric ceramic II is connected to the vertical connecting part. Both the half-bridge mechanism I and the half-bridge mechanism II are composed of three small half-bridge blocks connected in sequence. The half-bridge mechanism I is located above the piezoelectric ceramic I, and one end of the small half-bridge block of the half-bridge mechanism I is connected to the lever mechanism I, and the other end of the small half-bridge block is connected to the horizontal connecting part. The half-bridge mechanism II is located on one side of the lever mechanism II, and the top small half-bridge block of the half-bridge mechanism II is connected to the lever mechanism II, and the bottom small half-bridge block is connected to the vertical connecting part. One end of the moving platform is connected to the small half-bridge block in the middle part of the half-bridge mechanism I via a parallel leaf spring mechanism I, and the other end is connected to the small half-bridge block in the middle part of the half-bridge mechanism II via a parallel leaf spring mechanism II; the parallel leaf spring mechanism I and the parallel leaf spring mechanism II are arranged at 90°. The fixture includes a base II, a flexible hinge, and clamping arms. The base II is connected to the moving platform. The base II is connected to a pair of clamping arms via a pair of flexible hinges. There are notches at the opposite ends of the clamping arms. Electrode wires are placed in the notches and clamped in the notches by clamping bolts.

2. The electrolytic wire cutting apparatus for generating elliptical vibration as described in claim 1, characterized in that: The small semi-bridge blocks connecting lever mechanism I, lever mechanism II, and base I have a zigzag shape; the connection method of the small semi-bridge blocks in the middle part is straight.

3. The electrolytic wire cutting apparatus for generating elliptical vibration as described in claim 1, characterized in that: One end of the lever mechanism I is connected to the base I via a flexible hinge A1, and the other end is connected to the flexible hinge B1 of the half-bridge mechanism I, forming a first-stage displacement amplification mechanism.

4. The electrolytic wire cutting apparatus for generating elliptical vibration as described in claim 1, characterized in that: The center points of flexible hinges B1 and E1 of the half-bridge mechanism I are located on the same horizontal line, and the center points of flexible hinges C1 and D1 of the half-bridge mechanism I are located on the same horizontal line. The two straight lines are parallel to each other and not on the same line. Flexible hinges B1, C1, D1 and E1 of the half-bridge mechanism I are rigidly connected to form a second-stage displacement amplification mechanism.

5. The electrolytic wire cutting apparatus for generating elliptical vibration as described in claim 1, characterized in that: Both the vertical and horizontal connecting parts on the base I are L-shaped, and they are symmetrically arranged with respect to the Y-axis, which is inclined at 45° to the upper right. The X-axis is perpendicular to the Y-axis and inclined at 45° to the lower right.

6. The electrolytic wire cutting apparatus for generating elliptical vibration as described in claim 5, characterized in that: The displacement of the moving platform is output along the Y-axis, and the angle between the displacement output direction of the parallel leaf spring mechanism I and the displacement output direction of the moving platform is 45°.

7. The electrolytic wire cutting apparatus for generating elliptical vibration as described in claim 5, characterized in that: Based on the horizontal output displacement M generated by piezoelectric ceramic I on the moving platform, and the vertical displacement N generated by piezoelectric ceramic II on the moving platform, the displacements generated by the moving platform on the X and Y axes can be calculated as follows:

8. The processing method of the electrolytic wire cutting apparatus for generating elliptical vibration as described in claim 5, characterized in that, Includes the following steps: S1. Apply voltage to piezoelectric ceramic I and piezoelectric ceramic II respectively. Piezoelectric ceramic I deforms along its axial direction and outputs displacement to the input end of lever mechanism I. Piezoelectric ceramic II also deforms along its axial direction and outputs displacement to the input end of lever mechanism II, thus realizing the first stage of displacement amplification. The lever mechanism I transmits displacement to the half-bridge mechanism I through the flexible hinge B1, and the lever mechanism II transmits displacement to the half-bridge mechanism II through the flexible hinge B2. The half-bridge mechanism I and the half-bridge mechanism II achieve a second-level amplification of displacement. The two amplified displacements act together on the moving platform, generating displacements along the X and Y directions on the moving platform and the fixture; S2. To achieve electrolytic wire cutting, an electrolyte flows between the electrode wire and the workpiece. The electrode wire is connected to the negative terminal of the power supply, and the workpiece is connected to the positive terminal of the power supply. The electrode wire has elliptical vibration, and the workpiece moves toward the electrode wire, together achieving elliptical vibration-assisted electrolytic wire cutting.

9. The processing method of the electrolytic wire cutting processing apparatus for generating elliptical vibration as described in claim 8, characterized in that, In S1, the control signals for piezoelectric ceramic I and piezoelectric ceramic II are: In the formula, and These represent the two phases of the voltage; , These are the control signal amplitudes for piezoelectric ceramic I and piezoelectric ceramic II, respectively. It controls the signal frequency. Electrolysis time; It is the phase difference between the control signals of piezoelectric ceramic I and piezoelectric ceramic II; By adding two control signals, we can obtain an elliptical trajectory that changes over time.

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