A microwave package design method for eliminating cavity resonance
By constructing metal islands and thin-film resistor arrays in microwave packaging design to form PMC boundaries, the problem of self-excited oscillation caused by cavity resonance is solved, and mass production of highly stable microwave circuits is realized.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAN INSTITUE OF SPACE RADIO TECH
- Filing Date
- 2023-05-25
- Publication Date
- 2026-07-07
AI Technical Summary
In existing microwave packaging designs, cavity resonance leads to poor input-output isolation, causing self-excited oscillation problems. Traditional methods, such as reducing cavity size or bonding absorbing materials, have limitations and reliability issues in mass production.
Metal islands and thin-film resistor arrays are constructed inside the cavity to form PMC boundaries and eliminate cavity resonance.
It improves cavity isolation, eliminates cavity resonance, enhances microwave circuit stability, is suitable for conventional production processes, and does not introduce additional bonding processes.
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Figure CN116759773B_ABST