A microwave package design method for eliminating cavity resonance

By constructing metal islands and thin-film resistor arrays in microwave packaging design to form PMC boundaries, the problem of self-excited oscillation caused by cavity resonance is solved, and mass production of highly stable microwave circuits is realized.

CN116759773BActive Publication Date: 2026-07-07XIAN INSTITUE OF SPACE RADIO TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
XIAN INSTITUE OF SPACE RADIO TECH
Filing Date
2023-05-25
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

In existing microwave packaging designs, cavity resonance leads to poor input-output isolation, causing self-excited oscillation problems. Traditional methods, such as reducing cavity size or bonding absorbing materials, have limitations and reliability issues in mass production.

Method used

Metal islands and thin-film resistor arrays are constructed inside the cavity to form PMC boundaries and eliminate cavity resonance.

Benefits of technology

It improves cavity isolation, eliminates cavity resonance, enhances microwave circuit stability, is suitable for conventional production processes, and does not introduce additional bonding processes.

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Abstract

The present application relates to a kind of microwave package design method for eliminating cavity resonance, and high stability microwave package design is realized based on microstrip island and film resistance.The microwave package design for eliminating cavity resonance is divided into two parts, first, design appropriate metal island and film resistance array on the bottom of the package microwave circuit substrate, then design the dielectric cover plate of microwave package using microwave dielectric substrate, the side facing the outside of the package is used as shielding using full metal ground, and the side facing the inside of the package is loaded with the same metal island and film resistance array.
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