An electroplating equipment specifically designed for internal holes and deep holes.

Abstract

This invention relates to the field of deep hole electroplating and discloses an electroplating device specifically for internal holes and deep holes. The device includes a lower mold, an upper mold, a movable anode, a plating solution circulation assembly, and a frame. A vertical guide rail is provided on the frame above the lower mold. The movable anode and the upper mold are movably connected to the guide rail. The plating solution circulation assembly includes an injection end and a return end. The lower mold is connected to the injection end for clamping the bottom end of the tubular workpiece and simultaneously injecting plating solution into it. The upper mold is connected to the return end for clamping the top end of the tubular workpiece and simultaneously guiding the plating solution. Guided by the guide rail, the movable anode passes through the upper mold and moves vertically reciprocally within the inner hole of the tubular workpiece. This invention solves the problem that existing deep hole chromium plating methods are mainly suitable for workpieces with shallow inner holes and workpieces with shallow inner holes that require external surface electroplating. However, for deep hole workpieces that only require plating of the inner wall, it is impossible to form a plating layer with uniform thickness and excellent mechanical properties only on the inner wall of the deep hole.

Description

Technical Field

[0001] This invention relates to the field of deep hole electroplating, and more specifically to an electroplating device suitable for internal holes and deep holes. Background Technology

[0002] In the electroplating process, current, solution flow rate, flow rate, temperature, solution composition, and anode are all key factors affecting electroplating quality. For internal plating of workpieces, especially deep holes, the impact of these key factors on quality is particularly significant. Current deep hole chromium plating technologies mainly employ full immersion internal hole chromium plating and flow internal hole chromium plating. The characteristics of these methods for internal hole chromium plating are as follows.

[0003] 1. Full Immersion Internal Hole Chromium Plating: In this method, the anode is installed at the center of the workpiece, and then the workpiece is fully immersed in the tank. The rectifier is connected to the anode and cathode, and electroplating begins. During the electroplating process, the anode remains stationary, and the solution does not flow (or the flow rate is uncontrollable).

[0004] The main problems with this approach include:

[0005] ① Because the workpiece is a long, narrow, deep hole, the anode power supply is introduced at one end, and the current will be lost. Therefore, the current will be larger at one end and smaller at the other end, resulting in a thicker plating layer at one end and a thinner plating layer at the other end of the electroplated product.

[0006] ②During the electroplating process, a large amount of hydrogen gas is generated at the cathode. Because the deep hole workpiece is thin and long, the gas does not easily escape and bubbles are generated in the solution inside the hole. Since the gas resistance and liquid resistance are inconsistent, the thickness of the plating layer inside the deep hole will be inconsistent. As the current increases, the amount of gas generated by the reaction increases, and the difference in thickness will also increase.

[0007] ③Since the workpiece is completely immersed in the electroplating solution, a plating layer will also form on the outer surface of the workpiece, resulting in unnecessary waste.

[0008] ④ Because the solution tank is open and the chromic anhydride solution is volatile, it poses a hazard to the health of workers and the environment.

[0009] ⑤ Since the anode is fixed during the electroplating process, when the thickness reaches a certain level, the coating is prone to peeling off due to internal stress concentration when subjected to high-speed impact during use.

[0010] 2. Flow plating of internal holes: In this method, the anode is installed at the center of the workpiece's internal hole, and the solution is allowed to flow from bottom to top through the workpiece's internal hole. The rectifier is connected to the anode and cathode, and electroplating begins. During the electroplating process, the anode remains stationary while the solution flows (the flow rate can be controlled).

[0011] The main problems with this approach include:

[0012] ① Due to the characteristics of the workpiece being a long and narrow deep hole, the anode power supply is introduced at both ends, and the current will be lost along the length of the inner hole. For workpieces with long inner holes and high precision, the current will be larger at both ends and smaller in the middle, resulting in a thicker plating layer at both ends and a thinner layer in the middle of the electroplated product.

[0013] ② Since the anode is fixed during the electroplating process, when the thickness reaches a certain level, the chromium layer is prone to peeling off due to internal stress concentration when subjected to high-speed impact.

[0014] In summary, existing deep-hole chromium plating methods are mainly suitable for workpieces with shallow inner holes, and for workpieces with shallow inner holes that require external surface plating. However, for deep-hole workpieces that only require plating of the inner wall, it is impossible to form a coating with uniform thickness and excellent mechanical properties solely on the inner wall of the deep hole. Especially for military products, such as gun barrels and cannon barrels, the inner hole depth is long, and the operating conditions are harsh, requiring extremely high stability and uniformity of the internal plating. Even slight unevenness or instability in the plating can pose a risk of affecting the successful firing of shells, or even the risk of shells exploding during use. How to solve the problem of high-quality deep-hole electroplating for such workpieces is a problem that relevant manufacturers urgently need to overcome. Summary of the Invention

[0015] The present invention aims to provide an electroplating equipment specifically for internal holes and deep holes, in order to solve the problem that existing deep hole chromium plating methods are mainly applicable to workpieces with shallow internal holes and workpieces with shallow internal holes that require external surface electroplating, but cannot form a coating with uniform thickness and excellent mechanical properties only on the inner wall of deep hole workpieces that only require internal wall electroplating.

[0016] To achieve the above objectives, the present invention adopts the following technical solution: an electroplating equipment suitable for internal holes and deep holes, comprising a lower mold assembly, an upper mold assembly, a movable anode assembly, a plating solution circulation assembly, and a frame; the lower mold assembly is fixed to the lower part of the frame, and a vertical moving guide assembly is provided on the frame above the lower mold assembly; the movable anode assembly and the upper mold assembly are movably connected to the vertical moving guide assembly from top to bottom; the plating solution circulation assembly includes an injection end and a return end; the lower mold assembly is connected to the injection end, and the lower mold assembly is used to clamp the bottom end of the tubular workpiece while injecting plating solution into its internal hole; the upper mold assembly is connected to the return end, and the upper mold assembly is used to clamp the top end of the tubular workpiece while guiding the plating solution discharged from the internal hole; the movable anode assembly, guided by the vertical moving guide assembly, passes through the upper mold assembly and moves vertically reciprocally within the internal hole of the tubular workpiece.

[0017] Preferably, as an improvement, the movable anode assembly includes a movable base, on which a pull rod seat is fixed, an anode pull rod is detachably connected to the bottom end of the pull rod seat, and an anode rod is detachably connected to the bottom end of the anode pull rod.

[0018] Preferably, as an improvement, the upper end of the pull rod seat is fitted with an upper insulating sleeve, which is connected to the slide block. The inner hole of the upper insulating sleeve is a tapered hole with a smaller upper diameter and a larger lower diameter. The upper end of the pull rod seat is provided with a tapered rod section, which is inserted into the tapered hole of the upper insulating sleeve. The top of the pull rod seat passes through the upper insulating sleeve and is supported above the upper insulating sleeve by a limiting member.

[0019] Preferably, as an improvement, both the upper and lower ends of the anode rod are connected to a centralizing sleeve. The centralizing sleeve is spindle-shaped with frustum-shaped upper and lower ends and columnar middle. The length of the frustum-shaped sections at both ends of the centralizing sleeve is greater than the length of the columnar middle section. The diameter of the columnar middle section of the two centralizing sleeves is the same. Both centralizing sleeves are provided with a plating solution transition structure.

[0020] Preferably, as an improvement, the upper frustum taper of the centralizing sleeve is smaller than the lower frustum taper, and the frustum tapers at both ends of the centralizing sleeve located at the upper end of the anode rod are smaller than the frustum tapers at both ends of the centralizing sleeve located at the lower end of the anode rod.

[0021] Preferably, as an improvement, the upper mold assembly includes a movable base and an upper mold. The upper mold has a plating solution cavity with openings at both the upper and lower ends in the middle. The upper mold has a return port communicating with the plating solution cavity at the side end. The return port is connected to the return liquid end. The upper mold is covered with a lower insulating sleeve. Both the upper mold and the lower insulating sleeve are connected to the movable base.

[0022] Preferably, as an improvement, the bottom end of the upper mold is provided with a trumpet-shaped guide hole, the top end of the guide hole is provided with an insertion hole, the top end of the insertion hole is connected to the plating liquid chamber by a through hole, a sealing ring is embedded between the insertion hole and the through hole, an upper extension tube is inserted into the insertion hole, and the bottom end of the upper extension tube is a tapered tube-shaped connector.

[0023] Preferably, as an improvement, the lower mold assembly includes a lower mold base and a lower mold core. A recycling tank is mounted above the lower mold base. The lower mold core is columnar and vertically passes through the middle of the recycling tank. A connecting hole is provided in the middle of the lower mold core. A lower extension tube is detachably connected to the connecting hole. The top end of the lower extension tube is provided with a slot for inserting a pipe fitting. A liquid inlet hole that penetrates the lower mold core is connected to the bottom of the connecting hole. The liquid inlet hole communicates with the injection end.

[0024] Preferably, as an improvement, the plating solution circulation assembly includes a plating solution tank, which is connected to a circulation pipeline consisting of an inlet pipe and a return pipe. A circulation pump and a flow control mechanism are connected to the circulation pipeline. The end of the inlet pipe away from the plating solution tank serves as the injection end, and the end of the return pipe away from the plating solution tank serves as the return end.

[0025] Preferably, as an improvement, multiple electroplating devices suitable for internal holes and deep holes are arranged side by side in a straight line, arc, or circle.

[0026] The principle of this invention is as follows: In practical application, the frame provides structural support for each component, enabling vertical electroplating of the inner hole of the pipe fitting. The pipe fitting is placed vertically, with its bottom end positioned by the lower extension tube in the lower mold assembly and its top end positioned by the upper extension tube in the upper mold assembly. The lower mold assembly is fixed in position, while the upper mold assembly moves vertically with the assistance of the vertical movement guide assembly to adjust and press the pipe fitting downwards. The plating solution in the plating tank enters the inlet pipe under the action of the circulating pump, and then flows upwards from the bottom of the lower mold core of the lower mold assembly, sequentially through the lower extension tube, the pipe fitting, the upper extension tube, and the upper mold plating chamber, before returning to the plating tank through the return pipe. The flow control mechanism is used to control the flow rate of the plating solution for pipe fittings of different sizes. After rectification, the cathode of the electroplating power supply is connected to the pipe fitting, and the anode is connected to the moving anode assembly. The moving anode assembly moves vertically up and down with the assistance of the vertical moving guide assembly. During the descent, the moving base and the pull rod seat keep the anode pressure rod and anode rod stable. The anode rod passes through the upper mold and the upper extension tube and enters the inner hole of the pipe fitting. During the reciprocating up and down process, the anode rod repeatedly rises and falls between the upper extension tube and the lower extension tube. The straightening sleeve ensures the stability of the anode rod moving in the inner hole. In the inner hole of the pipe fitting, the moving anode and the flowing plating solution perform comprehensive and uniform electroplating on the inner hole surface. The upper extension tube and the lower extension tube ensure that the plating thickness is uniform in all areas along the length of the inner hole of the pipe fitting, avoiding stress concentration in the plating layer.

[0027] The advantages of this invention include:

[0028] 1) Compared to full-immersion internal chromium plating, the mobile flow chromium plating of this invention solves the problem of inconsistent thickness caused by uneven current distribution through the movement of the anode. By controlling the flow rate of the solution, the problems of poor gas discharge from the cathode and uneven temperature are solved. Since the solution flows inside the internal hole, which is essentially a closed space, the evaporation of the solution is greatly reduced, and it will not cause harm to workers or the environment.

[0029] 2) Compared with the flow-through chromium plating, the technical solution provided by the present invention solves the problem of inconsistent thickness caused by uneven current distribution by moving the anode in the flow-through chromium plating.

[0030] 3) Since the anode moves back and forth and the plating is applied layer by layer, the stress of the chromium plating layer will not be concentrated in one place, so the adhesion will be better than that of the existing technology.

[0031] 4) Compared with the prior art, the technical solution provided by the present invention for mobile flow chromium plating has the advantages of wider applicability, higher internal hole precision, higher pass rate, better bonding force, and smaller footprint. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention.

[0033] Figure 2 This is a schematic diagram of the lower mold assembly in an embodiment of the present invention.

[0034] Figure 3 for Figure 2 A magnified view of point A in the middle.

[0035] Figure 4 This is a schematic diagram of the upper mold assembly in an embodiment of the present invention.

[0036] Figure 5 This is a schematic diagram of the structure of the movable anode assembly in an embodiment of the present invention.

[0037] Figure 6 This is a schematic diagram showing the connection between the upper and lower stabilizing sleeves and the anode rod in an embodiment of the present invention. Detailed Implementation

[0038] The following detailed description illustrates the specific implementation method:

[0039] The reference numerals in the accompanying drawings include: frame 1, lower mold assembly 2, lower mold base 201, recovery tank 202, lower extension tube 203, slot 204, lower mold core 205, lower insulating sleeve 206, sealing gasket 207, liquid supply flange 209, pressure plate 210, clamping platform 221, recovery port 222, threaded section 231, clamping groove 251, upper mold assembly 3, clamping sleeve 301, guide hole 302, valve hole 303, long bolt 304, upper insulating sleeve 305, plating solution chamber 306, upper mold 307, guide hole 309, upper... Extension tube 310, connector 311, return port 314, movable anode assembly 4, anode insulating sleeve 401, pull rod seat 402, concentric clamp 403, limit sleeve 404, anode pull rod 405, upper straightening sleeve 406, lower straightening sleeve 407, anode rod 408, fittings 5, movable base 6, partition 601, side plate 602, base plate 603, motor 604, drive gear 605, plating bath 701, return pipe 702, inlet pipe 703, circulation pump 704, flow controller 705, power supply 8, guide rail 9.

[0040] Example 1, basically as shown in the attached document. Figure 1 As shown: An electroplating device suitable for internal holes and deep holes includes a lower mold assembly 2, an upper mold assembly 3, a moving anode assembly 4, a plating solution circulation assembly, and a frame 1. The frame 1 includes a support platform and a support frame welded to the support platform. Vertical guide rails 9 are bolted to the support frame as vertical movement guide components.

[0041] The lower mold assembly 2 is fixed on the support platform and is used to clamp the bottom end of the tubular workpiece while simultaneously injecting plating solution into its inner hole. For example... Figure 2 , Figure 3As shown, the lower mold assembly 2 includes a lower mold base 201 and a lower mold core 205. The lower mold base 201 is bolted to the support platform. A recycling groove 202 is mounted above the lower mold base 201. An upwardly protruding annular retaining plate 221 is integrally formed in the middle of the recycling groove 202. The inner hole of the retaining plate 221 penetrates the recycling groove 202. The lower mold base 201 is provided with a through hole coaxial with the inner hole of the retaining plate 221. A recycling port 222 is opened in the recycling groove 202 on the outer side of the retaining plate 221. The lower mold core 205 is columnar, with its top edge folded outward to form an annular groove 251 that can be fastened onto the clamping platform 221. The lower mold core 205 is vertically inserted into the inner hole and through hole of the clamping platform 221. The lower part of the lower mold core 205 has external threads, and an annular pressure plate 210 is threaded onto the upper part of the lower mold core 205. The groove 251 and the pressure plate 210 fix the lower mold core 205 onto the recovery tank 202 and the lower mold base 201 from the upper and lower ends. Lower insulating sleeves 206 are provided between the pressure plate 210 and the lower mold base 201, and between the lower mold core 205 and the inner hole and through hole of the clamping platform 221, all fitted onto the lower mold core 205. A connecting hole is opened in the middle of the lower mold core 205, and the bottom of the connecting hole is connected to a liquid inlet hole that penetrates the lower mold core 205. The upper section of the connecting hole is a stepped hole, and the lower section is a threaded hole. A lower extension tube 203 is detachably connected inside the connecting hole. The top end of the lower extension tube 203 is provided with a slot 204 for inserting the fitting 5. The lower section of the lower extension tube 203 is provided with a step. The lower extension tube 203 below the step is provided with a threaded section 231. The threaded section 231 can be connected to the threaded hole. A sealing ring is provided at the bottom of the stepped hole and in the middle of the threaded hole. The sealing ring provides a seal from both ends of the threaded section 231.

[0042] The movable anode assembly 4 and the upper mold assembly 3 are movably connected to the guide rail 9 from top to bottom. The upper mold assembly 3 is used to clamp the top of the tubular workpiece while guiding the plating solution discharged from the inner hole. Figure 4 As shown, the upper mold assembly 3 includes a movable base 6 and an integrally formed cylindrical upper mold 307. A flange is integrally formed at the top of the upper mold 307 as a connecting structure. A plating solution cavity 306 is located in the middle of the upper mold 307, and an opening communicating with the plating solution cavity 306 is located at the middle of the top of the upper mold 307. A return port 314 communicating with the plating solution cavity 306 is located on the side of the upper mold 307. A trumpet-shaped guide hole 309 is located at the bottom of the upper mold 307. A vertical cylindrical insertion hole is located at the top of the guide hole 309. A through hole connects the top of the insertion hole to the plating solution cavity 306. The through hole is funnel-shaped at the top, cylindrical in the middle, and trumpet-shaped at the bottom. A sealing ring is embedded between the insertion hole and the through hole, and the inner diameter of the sealing ring is smaller than the inner diameter of the insertion hole. An upper extension tube 310 is inserted into the insertion hole, and the lower end of the upper extension tube 310 is a tapered connector 311.

[0043] Combination Figure 4As shown, the movable base 6 includes a base plate 603 and two side plates 602 vertically welded and fixed to the upper end of the base plate 603. The two side plates 602 are arranged in parallel, and a vertical partition 601 is vertically welded and fixed between the two side plates 602. A guide rail 9 is located between the two side plates 602. Roller frames are bolted to each side plate 602, and rollers are connected to the roller frames by pins. The rollers are in friction contact with the guide rail 9. A horizontal motor 604 is bolted to the partition 601. The output shaft of the motor 604 passes through the partition 601 and faces the guide rail 9. A drive gear 605 is bolted to the output shaft. A driven gear is integrally formed on the roller on one side of the guide rail 9, and the driven gear meshes with the drive gear 605. Mounting holes are provided on the base plate 603.

[0044] The upper mold 307 is fitted with a flange-shaped upper insulating sleeve 305. Above the upper mold 307, a clamping sleeve 301 coaxial with the upper insulating sleeve 305 is provided. A flange is formed on the clamping sleeve 301. The upper insulating sleeve 305 is placed on the base plate 603 through the flange bracket. The base plate 603 has threaded holes corresponding to the flange. The clamping sleeve 301, the upper mold 307, and the upper insulating sleeve 305 are connected to the base plate 603 by a long bolt 304 passing through the flange. The upper mold 307 passes through the mounting hole on the base plate 603. A guide hole 302 is provided in the middle of the clamping sleeve 301. Both ends of the guide hole 302 are chamfered. A valve hole 303 is provided in the middle of the clamping sleeve 301, which is laterally connected to the guide hole 302. A valve plate is connected to the valve hole 303 by internal threads.

[0045] The movable anode assembly 4, guided by the vertical moving guide assembly, passes through the upper mold assembly 3 and reciprocates vertically within the inner hole of the tubular workpiece. Figure 5 As shown, the movable anode assembly 4 includes a movable base 6 with the same structure as the upper mold assembly 3. An anode insulating sleeve 401, which passes through a mounting hole, is bolted to the base plate 603 of the movable base 6. A pull rod seat 402 is connected inside the anode insulating sleeve 401. The inner hole of the anode insulating sleeve 401 is a tapered hole that is smaller at the top and larger at the bottom. The upper end of the pull rod seat 402 is provided with a tapered rod section, which is inserted into the tapered hole of the anode insulating sleeve 401. The top end of the pull rod seat 402 passes through the anode insulating sleeve 401 and is supported above the anode insulating sleeve 401 by nuts and washers as limiting elements, and is electrically connected to the anode of the power supply 8. A mounting hole is provided at the center of the bottom end of the pull rod seat 402. A concentric chuck 403 is inserted into the mounting hole. A limiting sleeve 404 is threadedly connected to the bottom end of the pull rod seat 402. The limiting sleeve 404 presses the concentric chuck 403 into the mounting hole. The concentric chuck 403 clamps and holds the anode pull rod 405. The anode pull rod 405 is a conductor with an insulating layer on its surface. The bottom end of the anode pull rod 405 is threadedly connected to the anode rod 408. The anode rod 408 is a steel wire with copper and lead or lead alloy plated sequentially on its surface. The copper plating is used to increase the charge carrying capacity, and the lead or lead alloy is used to protect the copper layer from corrosion. Figure 6As shown, the upper and lower ends of the anode rod 408 are threadedly connected to an upper regulating sleeve 406 and a lower regulating sleeve 407, respectively. Both the upper regulating sleeve 406 and the lower regulating sleeve 407 are spindle-shaped insulating parts with frustum shapes at both ends and a columnar shape in the middle. The length of the frustum sections at both ends of the upper regulating sleeve 406 and the lower regulating sleeve 407 is greater than the length of the columnar section in the middle. The diameters of the columnar sections in the middle of the upper regulating sleeve 406 and the lower regulating sleeve 407 are the same. The taper of the upper frustum at the top of the upper regulating sleeve 406 is smaller than that of the lower frustum at the bottom, and the taper of the upper frustum at the top of the lower regulating sleeve 407 is smaller than that of the lower frustum at the bottom. The taper of the upper frustum at the top of the upper regulating sleeve 406 is smaller than that of the upper frustum at the bottom of the lower regulating sleeve 407, and the taper of the lower frustum at the top of the upper regulating sleeve 406 is smaller than that of the upper frustum at the bottom of the lower regulating sleeve 407. Both the upper regulating sleeve 406 and the lower regulating sleeve 407 are provided with a plating solution transition structure, which consists of four grooves evenly spaced circumferentially on the upper regulating sleeve 406 and the lower regulating sleeve 407. The lower middle part of the upper regulating sleeve 406 and the upper middle part of the lower regulating sleeve 407 are provided with a conical hole and a threaded hole arranged coaxially in sequence as an anode positioning connection structure. The upper end of the upper regulating sleeve 406 has an insertion hole communicating with the threaded hole.

[0046] The plating solution circulation assembly includes a plating solution tank 701, which is connected to a circulation pipeline consisting of an inlet pipe 703 and a return pipe 702. One end of the inlet pipe 703 is connected to the plating solution tank 701, and the other end is connected to a supply flange 209 as an injection end. The supply flange 209 is bolted to the bottom of the lower mold core 205. A sealing gasket 207 is provided between the supply flange 209 and the lower mold core 205, thus connecting the inlet pipe 703 to the inlet hole of the lower mold core 205. A circulation pump 704 and a flow controller 705 are connected to the flange on the inlet pipe 703. The circulation pump 704 is used to draw plating solution and transport it to the lower mold assembly 2, and the flow controller 705 is used to control the flow rate of the plating solution. Both are commercially available products, and specific models can be selected and purchased according to needs. One end of the return pipe 702 is connected to the plating bath 701, and the other end is connected to the return flange as the return end. The return flange is bolted to the outside of the return port 314 on the side of the upper mold 307, so that the return pipe 702 is connected to the plating chamber 306 of the upper mold 307.

[0047] An electroplating method specifically for internal holes and deep holes, employing the aforementioned electroplating equipment specifically for internal holes and deep holes, specifically includes:

[0048] The bottom end of the pipe fitting 5 to be processed is inserted into the slot 204 at the top of the lower extension tube 203. The bottom end of the lower extension tube 203 is vertically inserted into the stepped hole on the upper section of the connecting hole of the lower mold core 205, so that the pipe fitting 5 is vertically supported on the lower mold assembly 2. The inner hole of the pipe fitting 5 is connected to the liquid inlet pipe 703 through the internal connecting hole of the lower mold core 205. The moving base 6 is driven by the motor 604 to move on the guide rail 9, so that the upper mold 307 moves downward, inserting the bottom end of the upper extension tube 310 into the top end of the pipe fitting 5, positioning the top end of the pipe fitting 5, and completing the vertical clamping of the pipe fitting 5.

[0049] The plating solution in the plating tank 701 is transported by the circulating pump 704 through the inlet pipe 703 and the downward extension pipe 203, so that the plating solution flows sequentially through the plating tank 701, the inlet pipe 703, the lower mold core 205, the lower extension pipe 203, the pipe fitting 5, the upper extension pipe 310, the plating solution cavity 306, and the return pipe 702, and then returns to the plating tank 701.

[0050] Prepare power supply 8. After rectification, fix the cathode of power supply 8 to the middle of pipe fitting 5 with conductive clamp, and fix the anode of power supply 8 to pull rod seat 402 with conductive clamp.

[0051] The moving base 6 is driven by motor 604 to move on guide rail 9, causing the pull rod seat 402, anode pull rod 405, and anode rod 408 to move downwards as a whole. The anode rod 408 and anode pull rod 405 are vertically inserted through the clamping sleeve 301, upper mold 307, and upper extension tube 310 into the inner hole of the pipe fitting 5. The moving anode assembly 4 is driven by motor 604 to repeatedly rise and fall vertically along guide rail 9. The anode rod 408 moves vertically and repeatedly rises and falls vertically within the pipe fitting 5, forming a fully covered and uniformly thick coating on the inner wall of the pipe fitting 5. During the movement, the anode rod 408 is stabilized by the upper and lower stabilizing sleeves 406 and 407. The upper and lower stabilizing sleeves 406 and 407, through grooves, ensure smooth flow of the plating solution within the pipe fitting 5.

[0052] After the electroplating of pipe 5 is completed, the moving base 6 of the moving anode assembly 4 rises under the drive of the motor 604, retracting the anode rod 408 above the clamping sleeve 301. Then, the valve plate inside the clamping sleeve 301 closes the guide hole 302. The pressure and flow rate of the plating solution entering pipe 5 are increased by the circulation pump 704 and the flow controller 705 to flush the inner hole of the electroplated pipe 5. After flushing, the circulation pump 704 stops working. The moving base 6 of the upper mold assembly 3 rises under the drive of the motor 604, causing the upper extension tube 310 to detach from the top of pipe 5 and pipe 5 to be removed. During the process, the residual plating solution in the upper mold 307 and pipe 5 drips into the recovery tank 202 below. The plating solution collected in the recovery tank 202 is discharged from the recovery port 222. The recovery port 222 can be connected to the plating solution tank 701 with a hose to recycle the recovered plating solution.

[0053] The installation and connection parts of the anode tie rod 405, anode rod 408, upper straightening sleeve 406, lower straightening sleeve 407, upper extension tube 310, and lower extension tube 203 all adopt a detachable connection method, which allows for quick replacement of clamps for different sizes of pipe fittings 5.

[0054] Example 2: An electroplating production line suitable for internal holes and deep holes. Taking the electroplating equipment suitable for internal holes and deep holes in Example 1 as a production unit, multiple production units are arranged in a straight line and side by side, and the frames of multiple production units are connected laterally to form a whole, forming a production line that can simultaneously perform moving anodic flow plating on the internal holes of multiple pipes.

[0055] Example 3: An electroplating production line suitable for internal holes and deep holes. Taking the electroplating equipment suitable for internal holes and deep holes in Example 1 as a production unit, multiple production units are arranged side by side in an arc, and the frames of multiple production units are connected laterally to form a whole, forming a production line that can simultaneously perform moving anodic flow plating on the internal holes of multiple pipes.

[0056] Example 4: An electroplating production line suitable for internal holes and deep holes. Taking the electroplating equipment suitable for internal holes and deep holes in Example 1 as a production unit, multiple production units are arranged in a circular arrangement, and the frames of multiple production units are connected along the circumference to form a whole, forming a production line that can simultaneously perform moving anodic flow plating on the internal holes of multiple pipes.

[0057] The above descriptions are merely embodiments of the present invention, and common knowledge such as specific technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solutions of the present invention, and these should also be considered within the scope of protection of the present invention. These modifications and improvements will not affect the effectiveness of the implementation of the present invention or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. An electroplating equipment specifically designed for internal holes and deep holes, characterized in that: Includes lower mold assembly, upper mold assembly, moving anode assembly, plating solution circulation assembly, and frame; The lower mold assembly is fixed to the lower part of the frame. A vertical moving guide assembly is provided on the frame above the lower mold assembly. The moving anode assembly and the upper mold assembly are movably connected to the vertical moving guide assembly from top to bottom. The plating solution circulation assembly includes an injection end and a return end. The lower mold assembly is connected to the liquid injection end. The lower mold assembly is used to clamp the bottom end of the tubular workpiece and inject plating solution into its inner hole at the same time. The upper mold assembly is connected to the return liquid end. The upper mold assembly is used to clamp the top of the tubular workpiece and guide the plating solution discharged from the inner hole. The lower mold assembly includes a lower mold base and a lower mold core. A recycling trough is mounted above the lower mold base. The lower mold core is columnar and vertically passes through the middle of the recycling trough. A connecting hole is provided in the middle of the lower mold core. A lower extension tube is detachably connected to the connecting hole. The top end of the lower extension tube is provided with a slot for inserting a pipe fitting. A liquid inlet hole that penetrates the lower mold core is connected to the bottom of the connecting hole. The liquid inlet hole communicates with the liquid injection end. The movable anode assembly, guided by the vertical moving guide assembly, passes through the upper mold assembly and reciprocates vertically within the inner hole of the tubular workpiece. The movable anode assembly includes a movable base, on which a pull rod seat is fixed. An anode pull rod is detachably connected to the bottom end of the pull rod seat, and an anode rod is detachably connected to the bottom end of the anode pull rod. An upper insulating sleeve is fitted on the upper end of the pull rod seat, and the upper insulating sleeve is connected to a slide block. The inner hole of the upper insulating sleeve is a tapered hole that is smaller at the top and larger at the bottom. A tapered rod section is provided at the upper end of the pull rod seat. The tapered rod section is inserted into the tapered hole of the upper insulating sleeve. The top end of the pull rod seat passes through the upper insulating sleeve and is supported above the upper insulating sleeve by a limiting member.

2. The electroplating equipment for internal holes and deep holes according to claim 1, characterized in that: Both ends of the anode rod are connected to a centralizing sleeve. The centralizing sleeve is spindle-shaped with frustum-shaped ends and columnar middle. The length of the frustum-shaped ends of the centralizing sleeve is greater than the length of the columnar middle section. The diameter of the columnar middle section of the two centralizing sleeves is the same. The centralizing sleeve is equipped with a plating solution transition structure.

3. The electroplating equipment for internal holes and deep holes according to claim 2, characterized in that: The upper frustum taper of the centralizing sleeve is smaller than that of the lower frustum taper. The centralizing sleeve located at the upper end of the anode rod has a smaller frustum taper at both ends than the centralizing sleeve located at the lower end of the anode rod.

4. The electroplating equipment for internal holes and deep holes according to claim 1, characterized in that: The upper mold assembly includes a movable base and an upper mold. The upper mold has a plating solution cavity with openings at both the upper and lower ends in the middle. The upper mold has a return port at the side end that communicates with the plating solution cavity. The return port communicates with the return liquid end. The upper mold is covered with a lower insulating sleeve. Both the upper mold and the lower insulating sleeve are connected to the movable base.

5. The electroplating equipment for internal holes and deep holes according to claim 4, characterized in that: The bottom of the upper mold is provided with a trumpet-shaped guide hole, the top of the guide hole is provided with an insertion hole, the top of the insertion hole is connected to the plating liquid chamber by a through hole, a sealing ring is embedded between the insertion hole and the through hole, and an upper extension tube is inserted into the insertion hole, the bottom end of the upper extension tube is a tapered tube-shaped connector.

6. The electroplating equipment for internal holes and deep holes according to claim 1, characterized in that: The plating solution circulation assembly includes a plating solution tank, which is connected to a circulation pipeline consisting of an inlet pipe and a return pipe. A circulation pump and a flow control mechanism are connected to the circulation pipeline. The end of the inlet pipe away from the plating solution tank serves as the injection end, and the end of the return pipe away from the plating solution tank serves as the return end.

7. The electroplating equipment for internal holes and deep holes according to claim 1, characterized in that: Multiple electroplating devices specifically designed for internal and deep holes are arranged side-by-side in a straight line, arc, or circle.

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