A metal product surface electroplating processing device

Abstract

The utility model provides a kind of metal product surface electroplating processing device, including tank, mobile mechanism is arranged on the front side surface of tank upper, anode is installed in the tank inner wall both sides, the top of tank is fixed with cathode hanger, the front side of the bottom of tank inner wall is equipped with scrap collecting groove, the bottom of tank inner wall is inclined with the angle of rear high front low, filter box is fixed with intercommunication in the right side of scrap collecting groove of tank, conveying pump is intercommunicated in the right side of filter box, the conveying end intercommunication of conveying pump has shunt pipe, shunt pipe surface intercommunication has shunt shell, the rear side intercommunication of shunt shell and tank inner wall bottom, C type scraper is slidably connected on the surface of scrap collecting groove, tank front side surface intercommunication has drainage valve.The utility model passes through the linkage of tank bottom inclination design, scrap collecting groove and mobile scraper, significantly improves impurity collection efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of electroplating technology, specifically relating to an electroplating device for metal products. Background Technology

[0002] Metal products are susceptible to corrosion, wear, and oxidation during long-term use, leading to performance degradation or appearance deterioration. Electroplating technology, by depositing a metal coating on the surface, can significantly improve the corrosion resistance, wear resistance, and aesthetics of products, and is widely used in automotive parts, electronic components, hardware tools, and other fields.

[0003] Traditional electroplating equipment mostly adopts an open or semi-closed structure. The electroplating solution in the electroplating tank needs to come into contact with the external environment during the processing. After long-term use, suspended particles, metal ion precipitates, or workpiece debris are easily deposited in the tank. These impurities will cause the plating layer to be rough, pitted, or have reduced adhesion. Currently, the cleaning method requires manual retrieval of the entire bottom of the inner wall of the electrolytic tank after the machine is stopped. The operation is time-consuming and cannot meet the usage requirements. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a metal product surface electroplating processing device to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] A metal product surface electroplating processing device includes a tank. A moving mechanism is provided above the front surface of the tank. Anodes are installed on both the front and rear sides of the inner wall of the tank. A cathode hanger is fixed on the top of the tank. A chip collection groove is opened on the front side of the bottom of the inner wall of the tank. The bottom of the inner wall of the tank is designed with an inclined structure with the back higher than the front. A filter box is connected and fixed to the right side of the chip collection groove. A conveying pump is connected to the right side of the filter box. A diversion pipe is connected to the conveying end of the conveying pump. A diversion shell is connected to the surface of the diversion pipe. The diversion shell is connected to the rear side of the bottom of the inner wall of the tank.

[0007] As a preferred embodiment, a C-shaped scraper is slidably connected to the surface of the chip collection groove, and a drain valve is connected to the front surface of the groove.

[0008] As a preferred embodiment, the moving mechanism includes two extension blocks. The extension blocks are fixed above the front surface of the tank. A motor is fixed to the surface of the left extension block. The output shaft of the motor passes through the extension block and is fixed with a lead screw. One end of the lead screw is rotatably connected to the surface of the extension block.

[0009] As a preferred embodiment, the lead screw surface is threaded with a sliding block, and the top of the sliding block is fixedly connected to the surface of the C-shaped scraper.

[0010] As a preferred embodiment, an intercepting filter is fixed to the inner wall of the diversion shell.

[0011] As a preferred embodiment, the inner wall of the filter box is fixed with two U-shaped shells, the surface of the U-shaped shells is provided with mounting grooves, the inner wall of the mounting grooves is slidably connected with a filter screen, and the opening of the U-shaped shells faces upward.

[0012] As a preferred embodiment, the top of the filter box is provided with an opening, and a door is slidably connected to the surface of the opening of the filter box. Both the door and the surface of the filter box are provided with multiple threaded holes.

[0013] As a preferred embodiment, the inner wall of the tank is fixed with a plurality of guide rods, and the C-shaped scraper is slidably connected to the surface of the guide rods.

[0014] As a preferred embodiment, the top of the filter box is provided with a sealing groove, and a sealing gasket is provided in the sealing groove.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] (1) This utility model significantly improves the efficiency of impurity collection by using the inclined design of the bottom of the tank and the linkage between the chip collection tank and the moving scraper. The double-layer filter screen and the interception filter screen in the filter box form a multi-stage filtration system, which effectively separates impurities of different particle sizes and ensures the purity of the electroplating solution. The closed-loop circulation system composed of the delivery pump and the diversion pipe maintains the uniformity of liquid flow. The auxiliary structures such as the guide rod and the sealing gasket enhance the stability of equipment operation and reduce maintenance costs.

[0017] (2) This utility model adopts a moving mechanism to drive the scraper, replacing the traditional manual large-area retrieval, which greatly shortens the downtime and improves production efficiency; the U-shaped shell and detachable filter screen design simplify the maintenance process, and the operator can quickly replace the filter screen; the airtight design of the box door and sealing gasket reduces the evaporation and pollution of the electroplating solution and extends the service life of the liquid; the overall structure is compact, adaptable to the transformation needs of existing electroplating production lines, takes into account both economy and functionality, and is suitable for large-scale industrial applications. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a three-dimensional structural schematic diagram of the present invention from another perspective;

[0020] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0021] Figure 4 This is a cross-sectional structural diagram of the present invention;

[0022] Figure 5 This is a schematic diagram of the moving mechanism in this utility model;

[0023] Figure 6 This is a partial cross-sectional structural diagram of the present invention.

[0024] The figure shows: 1. Tank; 2. Moving mechanism; 201. Extension block; 202. Motor; 203. Lead screw; 204. Sliding block; 3. Anode; 4. Cathode bracket; 5. Chip collection tank; 6. Filter box; 7. Transfer pump; 8. Diverter pipe; 9. Diverter shell; 10. C-shaped scraper; 11. Guide rod; 12. Interception filter screen; 13. U-shaped shell; 14. Filter screen; 15. Box door; 16. Sealing gasket; 17. Threaded hole; 18. Drain valve. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figures 1 to 6 As shown, this utility model embodiment provides a metal product surface electroplating processing device, specifically including a tank 1, a moving mechanism 2 is provided above the front surface of the tank 1, anodes 3 are installed on both the front and rear sides of the inner wall of the tank 1, a cathode hanger 4 is fixed on the top of the tank 1, a chip collection groove 5 is opened on the front side of the bottom of the inner wall of the tank 1, the bottom of the inner wall of the tank 1 is designed with an inclined structure with the back higher than the front, a filter box 6 is connected and fixed to the right side of the chip collection groove 5, a conveying pump 7 is connected to the right side of the filter box 6, a diversion pipe 8 is connected to the conveying end of the conveying pump 7, a diversion shell 9 is connected to the surface of the diversion pipe 8, the diversion shell 9 is connected to the rear side of the bottom of the inner wall of the tank 1, a C-shaped scraper 10 is slidably connected to the surface of the chip collection groove 5, and a drain valve 18 is connected to the front surface of the tank 1.

[0027] In this embodiment, the tank 1 features an inclined design with a higher back and lower front at the bottom of its inner wall, allowing impurities in the electroplating solution to naturally slide towards the chip collection tank 5 due to gravity. The chip collection tank 5, located at the front of the bottom of the inner wall of the tank 1, is used to collect the deposited impurities, which are then cleaned by the sliding of the C-shaped scraper 10. The impurities are pushed into the filter box 6, and simultaneously, with the extraction of the transfer pump 7, the electroplating solution further carries the impurities into the filter box 6. The electroplating solution is then pumped by the transfer pump 7 to the diversion pipe 8 and the diversion shell 9, and finally flows back to the bottom of the rear side of the tank 1, forming a circulating purification process. This further flushes the impurities located at the rear of the bottom of the tank 1 into the chip collection tank 5. Through this design, impurities are uniformly discharged into the filter box 6, thus saving the time of manually cleaning the entire tank 1 and making impurity cleaning more convenient.

[0028] Please see Figure 5 As shown, the moving mechanism 2 specifically includes two extension blocks 201. The extension blocks 201 are fixed above the front surface of the tank 1. A motor 202 is fixed to the surface of the left extension block 201. The output shaft of the motor 202 passes through the extension block 201 and is fixed with a lead screw 203. One end of the lead screw 203 is rotatably connected to the surface of the extension block 201. A sliding block 204 is threadedly connected to the surface of the lead screw 203. The top of the sliding block 204 is fixedly connected to the surface of the C-shaped scraper 10. In this embodiment, the moving mechanism 2 is driven by the motor 202 to rotate the lead screw 203, which drives the sliding block 204 to move horizontally along the lead screw 203. The sliding block 204 is fixedly connected to the C-shaped scraper 10, so that the C-shaped scraper 10 slides along the surface of the chip collection groove 5, pushing the deposited impurities to the inlet of the filter box 6.

[0029] Please see Figures 1 to 6 As shown, an intercepting filter 12 is fixed to the inner wall of the diversion shell 9. The intercepting filter 12 is fixed inside the diversion shell 9 to prevent impurities from entering the diversion shell 9 and the diversion pipe 8, thus preventing blockage of the diversion pipe 8. Two U-shaped shells 13 are fixed to the inner wall of the filter box 6. The surface of the U-shaped shell 13 has an installation groove, and a filter 14 is slidably connected to the inner wall of the installation groove. The opening of the U-shaped shell 13 faces upward. The filter 14 is slidably installed in the installation groove of the U-shaped shell 13. The filter 14 can be removed from the U-shaped shell 13 by sliding upward. After the electroplating liquid flows into the filter box 6 from the chip collection tank 5, it passes through the two layers of filter 14 in sequence to intercept impurities of different particle sizes. The purified liquid is pumped back to the tank 1 by the transfer pump 7.

[0030] Please see Figures 1 to 6As shown, the top of the filter box 6 has an opening, and a door 15 is slidably connected to the surface of the opening. Both the door 15 and the surface of the filter box 6 have multiple threaded holes 17. The door 15 opens or closes by sliding; when open, it facilitates manual removal of impurities intercepted by the filter screen 14. The door 15 is bolted to the surface of the filter box 6 through the threaded holes 17 to ensure a tight seal. Multiple guide rods 11 are fixed to the inner wall of the tank 1. A C-shaped scraper 10 is slidably connected to the surface of the guide rods 11, sliding along the surface of the guide rods 11. This restricts the C-shaped scraper 10 to move only horizontally, preventing deviation or tilting. A sealing groove is formed at the top of the filter box 6, and a sealing gasket 16 is placed inside the sealing groove. The sealing gasket 16 is embedded in the sealing groove at the top of the filter box 6. When the door 15 is closed, the sealing gasket 16 is deformed under pressure to fill the gap, blocking the leakage path of liquid or gas, reducing liquid evaporation inside the filter box 6, and maintaining the stability of the electroplating solution composition.

[0031] During use, the electroplating solution undergoes an electroplating reaction in the tank 1. Metal ions are deposited on the workpiece surface between the anode 3 and the cathode hanger 4. The inclined design of the bottom of the tank 1, which is higher at the back and lower at the front, allows impurities to naturally converge to the chip collection tank 5 on the front side as the liquid flows. When it is necessary to collect impurities uniformly, the motor 202 of the moving mechanism 2 is started, driving the lead screw 203 to rotate, which drives the sliding block 204 and the C-shaped scraper 10 to move horizontally along the guide rod 11, scraping the impurities in the chip collection tank 5 towards the inlet of the filter box 6 on the right. After the electroplating solution carries the impurities into the filter box 6, it passes through the filter screen 14 in the two U-shaped shells 13 in sequence. After the impurities are intercepted, the liquid is pumped to the diversion pipe 8 by the delivery pump 7. The diversion pipe 8 distributes the liquid to the diversion shell 9. Finally, the cleaned electroplating solution flows back from the bottom of the rear side of the tank 1 to form a cycle. When cleaning impurities, the drain valve 18 is opened to drain the electroplating solution, and then the bolts of the filter box 6 and the box door 15 are loosened. After that, the impurities collected uniformly inside the filter box 6 can be taken out.

[0032] Although specific embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these specific embodiments without departing from the principles and spirit, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A metal product surface electroplating processing apparatus, comprising a tank (1), characterized in that: A moving mechanism (2) is provided above the front surface of the tank (1). Anodes (3) are installed on both the front and rear sides of the inner wall of the tank (1). A cathode hanger (4) is fixed on the top of the tank (1). A chip collection groove (5) is opened on the front side of the bottom of the inner wall of the tank (1). The bottom of the inner wall of the tank (1) is designed with an angled structure that is higher at the back and lower at the front. A filter box (6) is fixedly connected to the right side of the chip collection groove (5) of the tank (1). A conveying pump (7) is connected to the right side of the filter box (6). A diversion pipe (8) is connected to the conveying end of the conveying pump (7). A diversion shell (9) is connected to the surface of the diversion pipe (8). The diversion shell (9) is connected to the rear side of the bottom of the inner wall of the tank (1).

2. The metal product surface electroplating processing apparatus according to claim 1, characterized in that: The chip collection groove (5) is slidably connected to a C-shaped scraper (10), and the front surface of the groove (1) is connected to a drain valve (18).

3. The metal product surface electroplating processing apparatus according to claim 1, characterized in that: The moving mechanism (2) includes two extension blocks (201). The extension blocks (201) are fixed above the front surface of the groove (1). A motor (202) is fixed on the surface of the left extension block (201). The output shaft of the motor (202) passes through the extension block (201) and is fixed with a lead screw (203). One end of the lead screw (203) is rotatably connected to the surface of the extension block (201).

4. The metal product surface electroplating processing apparatus according to claim 3, characterized in that: The lead screw (203) is threadedly connected to a sliding block (204), and the top of the sliding block (204) is fixedly connected to the surface of the C-shaped scraper (10).

5. The metal product surface electroplating processing apparatus according to claim 1, characterized in that: An intercepting filter (12) is fixed to the inner wall of the diversion shell (9).

6. The metal product surface electroplating processing apparatus according to claim 1, characterized in that: The filter box (6) has two U-shaped shells (13) fixed on its inner wall. The surface of the U-shaped shell (13) is provided with an installation groove, and a filter screen (14) is slidably connected to the inner wall of the installation groove. The opening of the U-shaped shell (13) is upward.

7. The metal product surface electroplating processing apparatus according to claim 1, characterized in that: The filter box (6) has an opening at the top, and a door (15) is slidably connected to the surface of the opening of the filter box (6). Both the door (15) and the surface of the filter box (6) have multiple threaded holes (17).

8. The metal product surface electroplating processing apparatus according to claim 2, characterized in that: Multiple guide rods (11) are fixed on the inner wall of the trough (1), and the C-shaped scraper (10) is slidably connected to the surface of the guide rods (11).

9. The metal product surface electroplating processing apparatus according to claim 1, characterized in that: The top of the filter box (6) is provided with a sealing groove, and a sealing gasket (16) is provided in the sealing groove.

Images