Chip position adjusting device and chip testing apparatus
By combining pneumatic and control components, the chip's position in the mounting slot is automatically adjusted, solving the problem of chip misalignment with the detection position in the chip detection device, thus improving detection efficiency and reducing production costs.
CN116793265BActive Publication Date: 2026-07-17KUNSHAN SMARTSENS TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KUNSHAN SMARTSENS TECH CO LTD
- Filing Date
- 2022-03-15
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing chip testing devices cannot quickly and automatically adjust the contact surfaces between the chip and the testing position during the testing process, which affects testing efficiency.
Method used
A pneumatic component is used to blow or suck air into the chip through holes in the bottom wall of the mounting slot. Combined with a control component and flow detection, the chip's position in the mounting slot is automatically adjusted so that the chip surface is in close contact with the bottom surface of the mounting slot.
Benefits of technology
It enables automated chip adjustment, reduces manual intervention, improves testing efficiency, lowers production costs, and avoids electrostatic pollution.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116793265B_ABST
Abstract
The present application belongs to the technical field of chip testing, and particularly relates to a chip position adjusting device and a chip testing equipment. The chip position adjusting device comprises a chip mounting seat, a pneumatic assembly and a control assembly. The mounting seat has a mounting groove for accommodating a chip. The bottom wall of the mounting groove is provided with a plurality of first hole groups distributed at intervals. Each first hole group comprises at least one first hole. The pneumatic assembly comprises a gas pipe joint. The first hole and the gas pipe joint are in communication with each other. The control assembly is electrically connected with the pneumatic assembly. The pneumatic assembly blows air to the chip through the first hole, so as to adjust the position of the chip in the mounting groove, so that the chip and the bottom wall of the mounting groove are in close contact with each other, thereby facilitating the flatness test of the chip by the subsequent chip testing equipment. When the chip is not placed flat relative to the bottom wall of the mounting groove, manual adjustment of the position of the chip is reduced, the misjudgment rate of the flatness test of the chip is reduced, and the test efficiency is improved.
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