Busbar assembly for immersion cooling

Abstract

Embodiments of busbar assemblies for immersion cooling are described herein. In one embodiment, a busbar assembly (100) can include an insulator block (10) and a busbar (20). The insulator block can include a first barrier extending from a first end of the insulator block to a second end of the insulator block. The insulator block (10) can include a second barrier extending from the first end to the second end. The first barrier can include a first support surface. The second barrier can include a second support surface. The insulator block (10) can include a channel between the first barrier and the second barrier. The channel can extend from the first end to the second end. The busbar (20) can be positioned in the channel. The busbar can have a top surface that is recessed below the first support surface and the second support surface. Other examples can be described and claimed. At the time of publication, FIG. 3A in the accompanying drawings is attached.

Description

Technical Field

[0001] This disclosure relates to immersion cooling devices, and more specifically to bus assemblies for immersion cooling devices. Background Technology

[0002] A data center houses information technology (IT) equipment used for the purpose of storing, processing, and distributing data and applications. IT equipment may include electronic devices such as servers, storage systems, power distribution units, routers, switches, and firewalls.

[0003] IT equipment consumes electricity and generates waste heat as a byproduct. Data centers with thousands of operational servers require dedicated IT cooling systems to manage this waste heat. Waste heat must be captured and removed from the data center. If waste heat is not removed, the ambient temperature within the data center can rise above acceptable thresholds, potentially leading to undesirable temperature-induced performance throttling of electronic devices such as microprocessors.

[0004] Direct liquid cooling systems can be used to cool IT equipment. One form of direct liquid cooling is immersion cooling. In an immersion cooling system, electronic components are immersed in a dielectric fluid. Waste heat from the electronic components is transferred to the dielectric fluid and then captured by suitable heat dissipation devices and exhausted outside the data center.

[0005] Figures 14A to 14C This illustrates a prior art example of a substantially two-phase immersion cooling device 1400. Device 1400 includes an immersion tank 201 partially filled with a dielectric fluid 620 (such as hydrofluoroether) in a liquid phase. Device 1400 includes a condenser 235 mounted in the top space of the immersion tank 201. Electronic device 800 is immersed in the dielectric fluid 620. Electronic device 800 may be a server including one or more microprocessors 801. Immersion tank 201 is enclosed by a cover 225.

[0006] During operation, the electronic device 800 generates waste heat. This waste heat is transferred to the dielectric fluid 620, causing a portion of the dielectric fluid 620 to boil and form dielectric vapor 615. The dielectric vapor 615 rises through the dielectric fluid 620 bath and enters the top space 206 of the immersion tank 201. When the dielectric vapor 615 contacts the condenser 235, it condenses back into the dielectric fluid 620 and is passively recirculated back into the liquid bath, thus completing the cycle 1401 of evaporation, condensation, falling, and collection.

[0007] In two-phase immersion cooling systems, cables or busbars are commonly used to transfer power from an external power source to electronic components within the immersion cooling tank. However, using cables to transfer power has several drawbacks. First, cables complicate routine maintenance. For example, electronic components are typically inserted vertically into the immersion tank. Cables are attached to the top side of the electronic components. When removing electronic components from the immersion tank, the cables must be removed and reeled in before the removable components. Typically, maintenance personnel must dip their hands into the thermal dielectric fluid to disconnect the cables. The thermal dielectric fluid is significantly hotter than body temperature and can be uncomfortable even when wearing heat-resistant gloves. Second, some cables may be incompatible with the dielectric fluids in the system. Cables contain insulation that can be made of plastic materials. Depending on the material type, there may be chemical compatibility issues that can lead to cable degradation and fluid contamination.

[0008] Therefore, instead of using cables, the electronic device 800 can be designed to mate with a bus located at the bottom of the immersion tank. As an example, the electronic device 800 can be equipped with a bus clamp designed to engage and electrically connect to the bus at the bottom of the immersion tank 201. Since the bus typically does not have insulation, there are no chemical compatibility issues with dielectric fluids.

[0009] Figure 14A The prior art immersion tank 201 shown includes a busbar 1405 penetrating the sidewall of the immersion tank 201. The busbar 1405 delivers power to electronic devices 800 within the immersion tank 201. This configuration is suitable for certain stationary tanks that experience minimal vibration or movement during use. However, this configuration is unacceptable for immersion cooling tanks used in mobile data centers 1500 (Figure 15). Mobile data centers 1500, such as the mobile data center shown in Figure 15, may include immersion cooling tanks arranged in shipping containers 1005. The mobile data center 1500 may be transported by road, for example, on a flatbed trailer. Due to vibrations caused by transportation and installation, fluid leakage may occur where the busbar 1405 penetrates the sidewall of the immersion tank 201.

[0010] If fluid leaks from immersion tank 201, the liquid level in the tank will drop, potentially exposing electronic device 800 to ambient air. In this case, the system may be unable to effectively cool electronic device 800. Electronic device 800 may overheat and subsequently shut down or experience performance throttling.

[0011] Some existing technology buses, such as Figure 12The example shown has exposed, non-insulated metal strips 20', which pose a safety risk to data center workers. Personnel could accidentally come into contact with the exposed busbars 20' and receive an electric shock. In another example, a person could accidentally drop a metal tool (such as a wrench) into the slot, causing a short circuit in the busbar assembly 100', resulting in system downtime and damage to electronic hardware 800.

[0012] "Some existing technology bus assemblies 100", such as Figure 13 The example shown has a molding resin coating to insulate the bus 20” and prevent accidental electric shock. The molding resin can create thermal resistance that prevents the dielectric fluid 620 from effectively cooling the bus 20”. Excessive heat buildup can increase resistance and reduce transmission efficiency. Moreover, the molding resin may not be chemically compatible with the dielectric fluid 620 and can degrade and contaminate the dielectric fluid 620 over time, thus requiring fluid filtration or replacement.

[0013] "Some existing technology bus assemblies 100", such as Figure 13 The example shown may have closely spaced horizontal busbars 20”. During use, busbars 20” can become hot and require cooling. In a two-phase cooling system, vapor bubbles can form on the surface of busbars 20” and float in the liquid bath. As electricity usage increases, busbars 20” will generate more waste heat and consequently more intense boiling. At some point, due to the narrow gaps between the horizontally oriented busbars 20”, vapor bubbles will form faster than they can escape from the gaps. Vapor buildup may occur, and the vapor bubbles can act as an insulating layer, leading to a condition known as “evaporation.” Evaporation occurs when vapor cannot escape from the surface and prevents supercooled fluid from reaching and thus cooling the surface of the electronic device 800. Evaporation can lead to increased thermal resistivity and overheating. In extreme cases, evaporation can lead to thermal runaway and device failure. Summary of the Invention

[0014] In a first aspect, the present invention relates to a bus assembly for an immersion cooling device. In some embodiments, the bus assembly includes an insulator block having a first end and a second end opposite to the first end, a slot, and a bus. In some embodiments, the insulator block is made of one or more dielectric materials (e.g., phenolic materials, Mylar materials, polyimide materials, and epoxy resin materials) and includes: a first barrier extending from the first end to the second end, the first barrier including a first support surface and a first barrier width; a second barrier extending from the first end to the second end, the second barrier including a second support surface and a second barrier width; and a channel located between the first barrier and the second barrier, the channel extending from the first end to the second end and having a channel width. In some variations, the slot may be formed in the bottom surface of the channel, and the bus may be disposed in the slot. Advantageously, the bus has a top surface recessed below the first support surface and / or the second support surface.

[0015] In some implementations, the busbar may be substantially centered in the channel. For example, a first gap may be formed in the channel between the busbar and the first barrier, and a second gap may be formed in the channel between the busbar and the second barrier, such that the first gap is greater than the width of the busbar and the second gap is greater than the width of the busbar, and / or the top surface of the busbar is recessed below at least one of the first support surface and the second support surface by a distance greater than at least one of the first gap or the second gap.

[0016] In some embodiments, the channel is one of a plurality of channels formed in the insulating block and the bus is one of a plurality of buses, such that the plurality of channels are arranged in a parallel configuration and each channel accommodates one of the buses. In some variations, these buses are adapted to transmit single-phase or three-phase power. For example, these buses may include a first set of buses configured to transmit three-phase power and a second set of buses configured to transmit three-phase power, such that the first set of buses and the second set of buses are arranged in a symmetrical configuration to allow electronic devices to be electrically connected to these buses in at least one of a first orientation or a second orientation.

[0017] In a second aspect, the present invention relates to an immersion cooling device. In some embodiments, the immersion cooling device includes: an immersion tank having an upper portion and a lower portion and defining a target liquid level between the upper portion and the lower portion, and the immersion tank including an internal volume defined by a bottom and a plurality of sidewalls; and a manifold assembly positioned within the internal volume of the immersion tank. In some applications, the bus assembly may include: an insulator block having a base portion and an upright portion, such that the base portion is adjacent to an inner surface of the bottom and the upright portion is adjacent to an inner surface of one of the plurality of sidewalls; a base channel extending from a first end of the base portion to a second end of the base portion; an upright channel extending from the first end of the upright portion to the second end of the upright portion; a first barrier extending along the base channel and having a first support surface and a first barrier width; a second barrier extending along the base channel and having a second support surface and a second barrier width; and a bus having a base segment electrically connected to the upright segment, such that the base segment is disposed in the base channel and the upright segment is disposed in the upright channel. In some variations, the top surface of the base segment may be positioned below at least one of the first support surface or the second support surface.

[0018] In some applications, the immersion cooling device further includes a condenser positioned within the internal volume of the immersion tank and above the target liquid level, and / or a through-connection assembly. In some embodiments, the through-connection assembly may include: a connecting block mountable to the outer surface of the immersion tank above the target liquid level; an electrical connector extending through the connecting block; and a seal configured to provide a liquid-tight seal between the bottom surface of the connecting block and the outer surface of the immersion tank. In some embodiments, the upright section of the manifold is adapted to penetrate an opening in the immersion tank and be electrically connected to the electrical connector.

[0019] In another embodiment, the base channel and the upright channel can form an L-shaped channel and the base section and the upright section can form an L-shaped busbar, so that the L-shaped busbar can be placed in the L-shaped channel.

[0020] In another embodiment, the immersion cooling device may also include one or more of the following: a base slot formed in the base channel, wherein the base section of the busbar can be positioned in the base slot; and an upright slot formed in the upright channel, such that the upright section of the busbar can be positioned in the upright slot.

[0021] In a third aspect, the present invention relates to a busbar assembly for an immersion cooling tank. In some embodiments, the busbar assembly includes an insulator block and an L-shaped busbar. In some variations, the L-shaped busbar may include a base section and an upright section, and the insulator block may include a base portion and an upright portion adapted to form an L-shaped insulator block; a base channel extending from a first end of the base portion to a second end of the base portion; an upright channel extending from the first end of the upright portion to the second end of the upright portion, such that the upright channel and the base channel together form an L-shaped channel; a first barrier having a first support surface and extending along the base channel; and a second barrier having a second support surface and extending along the base channel. Advantageously, the base channel may be configured to receive the base section and the upright channel may be configured to receive the upright section, and when the base section is disposed in the base channel, the base section may be recessed below the first support surface and / or the second support surface.

[0022] In some applications, the bus assembly may also include a through-connection assembly. In some embodiments, the through-connection assembly may include: a connector block; an electrical connector extending through the connector block and configured to connect to the upright section of the L-shaped bus; and a seal configured to provide a liquid-tight seal between the bottom surface of the connector block and the outer surface of the immersion tank. In some variations, a groove may be formed in the bottom surface of the connector block, and the seal may be disposed in the groove.

[0023] In another application, the bus assembly may include one or more of the following: a base slot in the base channel, such that the base slot is configured to receive the base section of the L-shaped bus; an upright slot in the upright channel, such that the upright slot is configured to receive the upright section of the L-shaped bus; and / or a board connector, which is structured and arranged to connect the base section of the L-shaped bus to the upright section of the L-shaped bus.

[0024] In another application, the insulator block may also include: a third barrier extending along the upright channel and having a third support surface; and a fourth barrier extending along the upright channel and having a fourth support surface, such that when the upright section is installed in the upright channel, the upright section is recessed below the third support surface and the fourth support surface. Attached Figure Description

[0025] In the accompanying drawings, the same reference numerals generally refer to the same parts in different figures. Furthermore, the drawings are not necessarily drawn to scale, but generally focus on illustrating the principles of the invention. In the following description, various embodiments of the invention are described with reference to the following drawings, wherein:

[0026] Figure 1 A perspective view of an immersion cooling tank according to some embodiments of the present invention is shown.

[0027] Figure 2 Multiple immersion cooling tanks configured in a data center according to some embodiments of the present invention are shown.

[0028] Figure 3A An exemplary busbar assembly disposed in an immersion cooling tank assembly according to some embodiments of the present invention is shown in partial cross-sectional view.

[0029] Figure 3B The invention illustrates some embodiments of the invention. Figure 3A Details of an exemplary connection between the base portion and the upright portion of the bus assembly are shown in the figure.

[0030] Figure 4A An exploded view of the penetration connection assembly and mounting surface of an immersion tank according to some embodiments of the present invention is shown.

[0031] Figure 4B Showing the invention Some embodiments Figure 4A A bottom view of the electrical connection block of the connection assembly.

[0032] Figure 5 A side perspective view of the base portion of an exemplary bus assembly according to some embodiments of the present invention is shown.

[0033] Figure 6 A side cross-sectional view of the base portion of an immersion cooling tank assembly and an exemplary bus assembly immersed in a dielectric fluid, according to some embodiments of the present invention, is shown.

[0034] Figure 7 A front view of an exemplary three-phase bus assembly according to some embodiments of the present invention is shown.

[0035] Figure 8 A front view of an exemplary single-phase bus assembly having a single protective ground bus is shown according to some embodiments of the present invention.

[0036] Figure 9 A front view of an exemplary single-phase bus assembly having a pair of protective grounding buses is shown according to some embodiments of the present invention.

[0037] Figure 10 A front view of an exemplary three-phase bus assembly without a neutral bus is shown according to some embodiments of the present invention.

[0038] Figure 11 A front view of an exemplary three-phase bus assembly having a pair of neutral buses is shown according to some embodiments of the present invention.

[0039] Figure 12 An exemplary bus assembly according to the prior art is shown.

[0040] Figure 13 An exemplary horizontally oriented bus assembly according to the prior art is shown.

[0041] Figures 14A to 14C An exemplary immersion cooling system with a condenser according to the prior art is shown.

[0042] Figure 15 shows a partial cross-sectional view of a modular data center with multiple immersion cooling tank assemblies inside an exposed shipping container according to the prior art. Detailed Implementation

[0043] Two-phase immersion cooling systems employ phase change heat transfer, which enables them to cool electronic devices that generate high heat flux densities, such as high-performance computing servers containing one or more central processing units (CPUs) and graphics processing units (GPUs).

[0044] To avoid the risk of fluid leakage from the immersion tank 201, in some embodiments, the manifold assembly 100 may penetrate the immersion tank 201 above the liquid level, such as... Figure 6 As shown. The liquid level can be defined as the interface between the liquid dielectric fluid 620 in the lower part 210 of the immersion tank 201 and the gas (e.g., air, water vapor, and / or dielectric vapor) in the upper space 206 of the immersion tank 201. The bus assembly 100 may include features that make it safe and convenient for use in the immersion cooling system 200.

[0045] Unlike Figure 12 and Figure 13 The prior art bus assembly shown in the figure, Figure 3A The bus assembly 100 shown is safe and effective for a variety of immersion cooling applications, including data center and transportation applications. Data center applications may include, for example, traditional data centers, mobile data centers 1500 (Figure 15), or edge data centers. Transportation applications may include, for example, autonomous vehicles requiring high computing power.

[0046] Bus assembly 100 can safely conceal one or more current-carrying busbars 20 to prevent accidental short circuits or electric shocks. Bus assembly 100 can be suitable for single-phase immersion cooling or two-phase immersion cooling.

[0047] To achieve two-phase immersion cooling without the risk of drying out, in some embodiments, the bus assembly 100 may include channels 13 with sufficient clearances 30, 31 on each side of the bus 20, such as... Figure 6As shown in the diagram, the busbars 20 can be arranged vertically and spaced apart. Each busbar 20 can have appropriately sized gaps 30, 31 on each side to facilitate vapor escape. The gaps 30, 31 can have generally vertical sidewalls without cuts or other vapor trapping features. The gaps 30, 31 allow vapor bubbles 616 to escape freely from the busbar surface and rise unimpeded in the fluid bath. As the vapor bubbles 616 leave the channel 13, subcooled fluid can rush into the gaps 30, 31 and occupy the space vacated by the departing vapor bubbles 616, thereby creating a continuous supply of subcooled fluid to the busbar surface. This configuration avoids trapped vapor, which could act as an insulating layer and create critical heat flux conditions. Thus, the busbar assembly 100 alleviates the cooling limitations of certain prior art busbar assemblies by delaying the onset of evaporation on the busbar surface.

[0048] The two-phase immersion cooling device 200 may include an immersion tank 201, such as Figure 3A As shown in the diagram. Immersion tank 201 may have an upper part 205 and a lower part 210 ( Figure 6 The upper part 205 may be a portion of the immersion tank 201 positioned above the liquid level. The lower part 210 may be a portion of the immersion tank 201 positioned below the liquid level.

[0049] The immersion tank 201 may have an opening 220. The opening 220 may be positioned in the top of the immersion tank 201, such as... Figure 3A As shown in the diagram, opening 220 provides access to the internal volume of immersion tank 201 to facilitate the insertion and removal of electronic devices 800 (e.g., servers, switches, or power electronic devices). The internal volume of immersion tank 201 is defined by a bottom surface and multiple side surfaces. To seal opening 220 and prevent dielectric vapor 615 from escaping into the surrounding environment, immersion tank 201 may have a cover 225, such as... Figure 1 As shown in the diagram. When open, cover 225 provides an inlet to the internal volume of the immersion tank 201. When closed, cover 225 seals off opening 220 and prevents vapor loss. Although Figure 1 The embodiment shown illustrates an immersion tank 201 with a generally rectangular shape, but this is for illustrative purposes only. The immersion tank 201 can have any desired shape that is economically manufactured and efficiently used.

[0050] Immersion tank 201 can be partially filled with liquid dielectric fluid 620, such as Figure 6 As shown in the diagram, the liquid dielectric fluid 620 may have a boiling point lower than the operating temperature of the electronic device 800 being cooled. When the electronic device 800 is operating, the liquid dielectric fluid 620 in contact with the device 800 may partially boil and generate dielectric vapor 615. The dielectric vapor 615 may form vapor bubbles 616, which rise in the fluid bath and reach the top space 206 of the immersion tank 201.

[0051] The two-phase immersion cooling device 200 may include a condenser (e.g., a cooling coil) 235, such as Figure 3A As shown in the diagram. In some embodiments, the condenser 235 may be positioned in the top space 206 of the immersion tank 201. The condenser 235 is structured and arranged to condense the dielectric vapor 615 present in the top space 206. In some applications, the condenser 235 may include a cooling coil that receives coolant from a heat dissipation system, such as an evaporative cooling tower, a dry cooler, or a chilled water circuit, and the coolant may be, for example, chilled water, a water-glycol mixture, or a refrigerant. Coolant may be supplied to the condenser 235 at or below the dew point of the vapor 615 occupying the top space 206.

[0052] The two-phase immersion cooling device 200 may include a bus assembly 100, such as Figure 3A As shown in the diagram. The bus assembly 100 allows for easy connection and disconnection of power without opening the immersion tank 201 and without loss of vapor 615. The bus assembly 100 can be installed within the internal volume of the immersion tank 201. For example, the bus assembly 100 can be adjacent to one or more inner walls of the immersion tank 201 and / or can be mounted to or rest against one or more inner surfaces of the immersion tank 201. The bus assembly 100 may include any number of buses 20, such as Figures 5 to 11 As shown in the diagram. Each busbar 20 may be made of a suitable conductive material, such as copper, brass, aluminum, or aluminum-coated steel.

[0053] Bus assembly 100 may include through-connection assembly 40, such as Figure 4A As shown in the diagram. The penetration connection assembly 40 may include a connection block 410. The connection block 410 may be mounted to the outer surface 222 of the upper portion 205 of the immersion tank 201, as shown in the diagram. Figure 1 As shown in Figure 3, the connecting block 41 can be installed above the opening 240 in the top of the immersion tank 201, as shown in Figure 3. Figure 4A As shown in the figure. Connector 41 can be installed above the liquid level. Connector 41 can be made of chemically resistant materials (such as phenol, Mylar, polyimide, epoxy resin, any other dielectric material compatible with dielectric fluid 620, and combinations of these materials).

[0054] The connection block 41 may include a plurality of electrical connectors 45, which are structured and arranged to extend through the connection block 41 and the opening 240 and electrically connect to corresponding busbars 20 in the immersion tank 201. The electrical connectors 45 may be, for example, busbar portions, electrical connection pins, or cables. Each electrical connector 45 may be configured to electrically connect an external power source to one of the plurality of busbars 20. As an example, the electrical connector 45 may include terminal lugs 48 to allow power from a power outlet or power source to be supplied to the busbar 20.

[0055] During operation, waste heat generated by the electronic device 800 is transferred from the electronic device 800 to the liquid dielectric fluid 620, and a portion of the liquid dielectric fluid 620 can be heated, boiled, and evaporated to form dielectric vapor 615. The dielectric vapor 615 can rise through the dielectric fluid 620 to reach the top space 206 of the immersion tank 201. To prevent loss of vapor 615 from the top space 206, a liquid-tight seal is provided by the through connection assembly 40 against the outer surface 222 and above the liquid level.

[0056] The penetration connection assembly 40 may include a seal (e.g., a sealing device, such as a gasket, O-ring, or the like) 42 between the bottom surface of the connection block 41 and the outer surface 222 of the immersion tank 201. Figure 4B As shown in the diagram. The seal 42 can be disposed in a groove 47 on the bottom surface of the connecting block 41. The through-connection assembly 40 may include a plurality of fasteners 43. The fasteners 43 can be tightened to compress the seal 42 and provide an airtight seal around the opening 240. Figure 4A In the example shown, a plurality of bolts 46 may protrude from the outer surface 222 near the opening 240, and fasteners 43 may be screwed into the bolts 46 to secure the connecting block 41 to the outer surface 222.

[0057] The bottom of the bus assembly 100 may include, for example, a chemically resistant insulator block 10, such as... Figure 5 As shown in the diagram, the insulating block 10 may extend horizontally from a first end 16 to a second end 17. The insulating block 10 may be made of a chemically stable material, such as hydrofluoroether, in the presence of a liquid dielectric fluid, and / or may be made of an electrically insulating material, such as a phenolic material. In some embodiments, the insulating block 10 may be made of one or more of phenolic materials, Mylar, polyimide, epoxy resin, or other dielectric materials compatible with the liquid dielectric fluid 620.

[0058] like Figure 3A As shown, the insulating block 10 may include a base portion 14 positioned against the bottom inner surface of the immersion tank 201. The insulating block 10 may also include an upright portion 15 positioned against the inner sidewall of the immersion tank 201. The base portion 14 and the upright portion 15 together form a structured and arranged L-shaped insulating block 10 to fit within the immersion tank 201. The upright portion 15 may extend from the base portion 14 to a through-connection assembly 40 positioned in the upper portion 205 of the tank assembly.

[0059] Insulator block 10 may include multiple barriers 12, such as Figure 3A , Figure 5 and Figure 6 As shown in the diagram. Barrier 12 may extend from a first end 16 (e.g., longitudinally) of the insulator block to a second end 17. As... Figure 3A , Figure 5 and Figure 6 As shown, corresponding channels 13 are formed between adjacent pairs of barriers 12a, 12b. Channels 13 may also extend from a first end 16 (e.g., longitudinally) of the insulator block 10 to a second end 17. Figure 3A As shown, barrier 12 and channel 13 may extend along the base portion 14 of insulator block 10. Barrier 12 and channel 13 may also extend along the upright portion 15 of insulator block 10. Base channel 33 in base portion 14 and corresponding upright channel 19 in upright portion 15 may be aligned together and provide a continuous L-shaped channel configured to accommodate L-shaped busbar 20.

[0060] Figure 3A An L-shaped busbar 20 is shown positioned within an L-shaped channel. Once installed, the top surface 29 of the conductive busbar 20 is recessed below the top surface 18 of the barrier 12, thereby preventing accidental electric shock. Recessing the busbar 20 below the top surface 18 of the barrier 12 also protects the busbar 20 from physical damage and reduces the risk of short circuits.

[0061] like Figure 3B As shown, the L-shaped bus 20 may include a base section 24 and a standing section 25. In some variations, the base section 24 may be connected to the standing section 25 via, for example, a board connector 22 and a fastener 23. In another example, the base section 24 and the standing section 25 may be a single unit. Once installed, the standing section 25 of the bus 20 extends from the through-connection assembly 40 to the base portion 14 of the insulator block 10. The bus 20 can conduct current from the through-connection assembly 40 to one or more electronic devices 800 disposed within the immersion tank 201.

[0062] refer to Figure 5 and Figure 6 The top surface 29 of the base section 24 of the L-shaped busbar 20 can be recessed to be lower than the top surface 18 of the barrier 12 by a distance (d). 凹入 The busbar 20 is recessed below the top surface 18 to protect it and prevent accidental electric shock. For example, the top surface 18 can prevent misaligned hand tools or electronic device housings from accidentally contacting the busbar 20 and short-circuiting it. The top surface 18 of the barrier 12 can also support the electronic device 800 and reduce the physical load from the busbar 20. For example, the electronic device 800, mounted in the immersion tank 201, is reliably placed on one or more top surfaces 18 and includes electrical connections extending downward into the channel 13 and electrically connected to the base section 24 of the busbar 20.

[0063] exist Figure 6In the example shown, bus 20 can be positioned within a slot 35 formed in the bottom of channel 13. The slot 35 supports and holds bus 20 in an upright orientation. The effective bus height (h) can be measured upwards from the bottom surface of channel 13. 汇流排 Effective busbar height (h) 汇流排 It can be less than the barrier height (h) 障壁 The dimensions of barrier I2, channel 13, and bus 20 can be selected to increase creepage and clearance. Creepage distance can be defined as the shortest path between two buses 20 measured along the outer surface of insulator block 10. Clearance distance can be defined as the shortest path between two buses 20 measured through air or liquid.

[0064] A first gap 30 may be disposed between the busbar 20 and the first adjacent barrier 12a. A second gap 31 may be disposed between the busbar 20 and the second adjacent barrier 12b. During two-phase cooling, gaps 30 and 31 allow vapor bubbles 616 to escape from the channel 13, such as... Figure 6 As shown, it allows subcooled liquid to flow back into channel 13. This continuous circulation of subcooled fluid into channel 13 ensures effective heat dissipation from manifold 20 and prevents evaporation from the surface of manifold 20.

[0065] The first gap 30 and the second gap 31 can be approximately equal in size, thus causing the busbar 20 to be roughly centered in the channel 13. The first gap 30 can be larger than the width of the busbar 20 (w). 汇流排 (For example, at least twice as large). Second gap 31 (w) 间隙 It can be larger than the bus width (e.g., at least twice as large).

[0066] The first barrier 12a may have a width greater than that of the channel 13 (w 通道 (e.g., at least twice as large) width (w) 障壁 The second barrier 12b may have a width greater than the channel width (w). 通道 (e.g., at least twice the width).

[0067] The top surface 29 of the busbar 20 may be recessed below the first top surface 18a and / or recessed below the second top surface 18b. In some embodiments, the top surface 29 of the busbar 20 may be recessed below one of the first top surface 18a and the second top surface 18b by a distance at least equal to the width of the busbar. For example, the top surface 29 of the busbar 20 may be recessed below both the first top surface 18a and the second top surface 18b by a distance at least equal to the width of the first gap 30 or the second gap 31.

[0068] Bus assembly 100 may include one or more buses 20. In one embodiment, bus assembly 100 may include any number of buses 20 (e.g., a first bus (L1), a second bus (L2), and a third bus (L3)) to support two-phase power transmission. Bus assembly 100 may also include a protective earth bus (PE) and / or a neutral bus (N).

[0069] In some embodiments, the bus 20 may be arranged in a symmetrical configuration, such as... Figures 7 to 11 As shown, the electronic device 800 can therefore be attached in either of the two orientations, while allowing the respective connectors of the electronic device 800 to be connected to the intended bus 20. Figure 7 A symmetrical configuration of a busbar for a three-phase application is shown, which allows electronic devices 800 to be attached in either orientation, while allowing the respective connectors of devices 800 to connect to the intended busbar 20. Although a symmetrical configuration of busbar 20 is shown and described, one or more asymmetrical arrangements of busbar 20 may also be used.

[0070] More specifically, Figure 7 A symmetrical embodiment of a bus assembly 100 supporting a pair of three-phase voltage buses (L1, L2, L3) and having a pair of neutral buses (N) and a protective earth bus (PE) is shown. Figure 8 A symmetrical embodiment of a bus assembly 100 is shown, which supports a pair of single-phase voltage buses (L), has a pair of neutral buses (N) and a single protective earth bus (PE). Figure 9 A symmetrical embodiment of a bus assembly 100 supporting a pair of single-phase voltage buses (L), having a pair of neutral buses (N) and a pair of protective earth buses (PE) is shown. Figure 10 A symmetrical embodiment of a bus assembly 100 is shown, which supports a pair of three-phase voltage buses (L1, L2, L3) and has no neutral bus but has a pair of protective earth buses (PE). Figure 11 A symmetrical embodiment of a bus assembly 100 is shown, which supports a pair of three-phase voltage buses (L1, L2, L3), has a pair of neutral buses (N), and also has a pair of protective earth buses (PE).

[0071] In some embodiments, the bus assembly 100 may be a component kit that can be mounted on an existing immersion tank 201. The kit may include an insulator block 10, one or more busbars 20, and a through-connection assembly 40.

[0072] As used herein, the term "fluid" may refer to a substance in gaseous or liquid form, or a two-phase mixture of gas and liquid. Fluids may undergo a phase change from liquid to vapor, or vice versa. Liquids can form free surfaces not created by a container in which the liquid resides, whereas gases cannot.

[0073] As used herein, the term "vapor" can refer to a substance that is in the gaseous phase at temperatures below its critical temperature. Therefore, vapor can be condensed into a liquid by increasing the pressure without lowering the temperature.

[0074] As used herein, the term "two phases" can refer to the coexistence of a vapor phase and a liquid phase of a substance. When this occurs, the partial pressure of the gas can be equal to the vapor pressure of the liquid.

[0075] As used herein, "target level" refers to the desired level of liquid in the immersion tank. In one example, the target level may be marked on the inner wall of the immersion tank. Before use, the immersion tank may be filled with dielectric fluid up to the target level.

[0076] Liquid dielectric fluid 620, such as hydrofluorocarbons (HFCs) or hydrofluoroethers (HFEs), can be used as a fluid in immersion cooling device 200. Unlike water, the dielectric fluid can be used in direct contact with electronic devices 800 (such as microprocessors 801, memory modules, and power inverters) without the risk of short-circuiting electrical connections. Non-limiting examples of liquid dielectric fluids include 1,1,1,3,3-pentafluoropropane (referred to as R-245fa), hydrofluoroethers (HFEs), 1-methoxyheptafluoropropane (referred to as HFE-7000), and methoxynonafluorobutane (referred to as HFE-7100). Hydrofluoroethers including HFE-7000, HFE-7100, HFE-7200, HFE-7300, HFE-7500, and HFE-7600 are commercially available as NOVEC engineered fluids from 3M Corporation, headquartered in Mapleton, Minnesota. FC-40, FC-43, FC-72, FC-84, FC-770, FC-3283 and FC-3284 are also commercially available from 3M as FLUOROINERT electronic liquids.

[0077] The elements and method steps described herein can be used in any combination, whether explicitly described or not. All combinations of method steps described herein can be performed in any order, unless otherwise specified or explicitly implied in the context of performing the referenced combination.

[0078] As used herein, the singular forms “a,” “one,” and “the” include multiple referents unless the context clearly indicates otherwise.

[0079] The methods and compositions of the present invention may include, consist of, or substantially consist of the basic elements and limitations described herein and any additional or optional steps, components or limitations described herein or otherwise useful in the art.

[0080] It should be understood that the present invention is not limited to the specific constructions and arrangements shown and described herein, but encompasses modified forms of such specific constructions and arrangements as described in the claims.

[0081] The foregoing description has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the claims to the disclosed embodiments. Other modifications and variations may be possible in light of the foregoing teachings. The embodiments were chosen and described to illustrate the principles of the invention and its practical application so that others skilled in the art can best utilize the invention in various embodiments and various modifications as appropriate for the particular intended use. Except as limited by the prior art, the claims are intended to be construed as including other alternative embodiments of the invention.

Claims

1. A busbar assembly for an immersion cooling device, the busbar assembly comprising: An insulator block having a first end and a second end opposite to the first end, and the insulator block comprising: A first barrier extends from the first end to the second end, the first barrier including a first support surface and a first barrier width; A second barrier extending from the first end to the second end, the second barrier including a second supporting surface and a second barrier width; and A passage located between the first barrier and the second barrier, the passage extending from the first end to the second end and having a passage width; A slot formed in the bottom surface of the channel; and A busbar that can be disposed in the slot, the busbar having a top surface that is recessed below the first support surface and the second support surface.

2. The bus assembly according to claim 1, wherein, The busbar is centered in the channel.

3. The bus assembly according to claim 1, wherein, A first gap is formed between the busbar and the first barrier, a second gap is formed between the busbar and the second barrier, and the busbar has a busbar width, wherein the first gap is greater than the busbar width and / or the second gap is greater than the busbar width.

4. The bus assembly according to claim 1, wherein, A first gap is formed between the busbar and the first barrier, a second gap is formed between the busbar and the second barrier, and the top surface of the busbar is recessed to be a distance lower than the first support surface and the second support surface, the distance being greater than at least one of the first gap or the second gap.

5. The bus assembly according to claim 1, wherein, The insulating block includes one or more dielectric materials selected from the group consisting of phenolic materials, Mylar materials, polyimide materials and epoxy resin materials.

6. The bus assembly according to any one of claims 1 to 5, wherein, The channel is one of a plurality of channels formed in the insulating block, the plurality of channels being arranged in a parallel configuration, wherein the bus is one of a plurality of buses, and each of the plurality of channels accommodates one of the plurality of buses.

7. The bus assembly according to claim 6, wherein, The multiple busbars are suitable for transmitting single-phase or three-phase power.

8. The bus assembly according to claim 6, wherein, The plurality of buses includes a first set of buses configured to transmit three-phase power and a second set of buses configured to transmit three-phase power, wherein the first set of buses and the second set of buses are arranged in a symmetrical configuration to allow electronic devices to be electrically connected to the plurality of buses in at least one of a first orientation or a second orientation.

9. An immersion cooling device, comprising: An immersion tank having an upper portion and a lower portion, defining a target liquid level between the upper portion and the lower portion, and the immersion tank including an internal volume defined by a bottom and a plurality of sidewalls; and A busbar assembly, positioned within the internal volume of the immersion tank, the busbar assembly comprising: An insulator block comprising a base portion and an upright portion, the base portion being adjacent to the inner surface of the bottom, and the upright portion being adjacent to the inner surface of one of the plurality of sidewalls; A base channel that extends from a first end of the base portion to a second end of the base portion; An upright channel that extends from a first end of the upright portion to a second end of the upright portion; A first barrier extends along the base channel, the first barrier having a first support surface and a first barrier width; A second barrier extending along the base channel, the second barrier having a second supporting surface and a second barrier width; and A busbar, comprising a base section electrically connected to an upright section, the base section being disposed within the base channel, and the upright section being disposed within the upright channel. The top surface of the base section can be positioned below at least one of the first support surface or the second support surface.

10. The immersion cooling device according to claim 9, further comprising a through-connection assembly, the through-connection assembly comprising: A connecting block that can be installed on the outer surface of the immersion tank above the target liquid level; An electrical connector that extends through the connecting block; and A seal configured to provide a liquid-tight seal between the bottom surface of the connecting block and the outer surface of the immersion tank. The upright section of the busbar is adapted to penetrate the opening in the immersion tank and be electrically connected to the electrical connector.

11. The immersion cooling device according to claim 9, wherein, The base channel and the upright channel form an L-shaped channel, and the base section and the upright section form an L-shaped busbar, which can be installed within the L-shaped channel.

12. The immersion cooling device according to claim 9, further comprising: A base slot located within the base channel, wherein the base segment of the busbar can be positioned within the base slot; and An upright slot is located in the upright channel, wherein the upright section of the busbar can be positioned in the upright slot.

13. The immersion cooling apparatus according to any one of claims 9 to 12, further comprising a condenser positioned within the internal volume of the immersion tank and above the target liquid level.

14. A busbar assembly for an immersion cooling tank, the busbar assembly comprising: An insulator block comprising: A base portion and an upright portion, the base portion and the upright portion being adapted to form an L-shaped insulator block; A base channel that extends from a first end of the base portion to a second end of the base portion; An upright channel extending from a first end of the upright portion to a second end of the upright portion, the upright channel and the base channel being structured and arranged together to form an L-shaped channel; A first barrier extending along the base channel, the first barrier having a first supporting surface; and A second barrier extending along the base channel, the second barrier having a second supporting surface; and The L-shaped busbar includes a base section and an upright section. Wherein, the base channel is configured to accommodate the base segment and the upright channel is configured to accommodate the upright segment, and Wherein, when the base segment is placed in the base channel, the base segment is recessed to be lower than at least one of the first support surface and the second support surface.

15. The busbar assembly according to claim 14, further comprising a through-connection assembly, the through-connection assembly comprising: Connector block; An electrical connector that extends through the connecting block and is configured to connect to the upright section of the L-shaped busbar; and A seal configured to provide a liquid-tight seal between the bottom surface of the connecting block and the outer surface of the immersion tank.

16. The busbar assembly according to claim 15, further comprising a groove formed in the bottom surface of the connecting block, wherein, The seal can be placed in the groove.

17. The bus assembly of claim 14, further comprising a base slot in the base channel, the base slot being configured to receive the base section of the L-shaped bus.

18. The busbar assembly of claim 14, further comprising an upright slot in the upright channel, the upright slot being configured to receive the upright section of the L-shaped busbar.

19. The bus assembly of claim 14, further comprising a board connector, the board connector being structured and arranged to connect the base section of the L-shaped bus to the upright section of the L-shaped bus.

20. The busbar assembly according to any one of claims 14 to 19, wherein the insulator block further comprises: A third barrier extends along the upright passage, and the third barrier has a third supporting surface; and A fourth barrier extends along the upright passage, the fourth barrier having a fourth supporting surface. When the upright section is installed in the upright channel, the upright section is recessed to be lower than the third support surface and the fourth support surface.

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