Heating device, thermal management module and thermal management system

Abstract

This application provides a heating device, including a heating assembly. The heating assembly includes a first heating tube, a second heating tube, and a manifold, wherein both the first and second heating tubes are connected to the manifold. The manifold has a first manifold cavity and a second manifold cavity spaced apart, wherein the cavity of the first heating tube communicates with the first manifold cavity, and the cavity of the second heating tube communicates with the second manifold cavity. This application relates to a thermal management module, and further relates to a thermal management system. This application reduces production costs while heating different types of heat exchange media.

Description

Technical Field

[0001] This application relates to the field of thermal management, and in particular to a heating device, a thermal management module, and a thermal management system. Background Technology

[0002] In the thermal management system of new energy vehicles, providing suitable temperatures for the passenger compartment and battery system with low power consumption has always been an industry challenge. Currently, two main methods are used: coolant heating and air conditioning heat pumps. Using only coolant heating to provide the necessary heat for the passenger compartment and battery results in high energy consumption and significantly impacts the vehicle's driving range. On the other hand, using a heat pump air conditioning system presents the problem of insufficient heat absorption at low temperatures, preventing the heat pump from operating. Therefore, additional heating is needed to increase the enthalpy before the compressor and improve its operating range.

[0003] To meet the aforementioned application requirements, practical applications often require both a coolant heating device to heat the coolant circuit and a heating device to provide the heat energy needed for enthalpy increase in the refrigerant circuit. This heating device is often also a coolant heating device. The coolant is first heated by the heating device, and then the coolant heats the refrigerant through a device similar to a chiiller (plate heat exchanger), ultimately achieving the purpose of enthalpy increase. Such a thermal management system requires at least two high-power heating devices, which has disadvantages such as large installation space requirements and high product costs.

[0004] Therefore, it is necessary to provide a new heating device, thermal management module, and thermal management system to solve the above problems. Summary of the Invention

[0005] The purpose of this application is to provide a heating device, a thermal management module, and a thermal management system that reduces the production cost of heat exchanger products in the thermal management system.

[0006] To achieve the above objectives, this application adopts the following technical solution: a heating device, comprising a heating assembly; the heating assembly includes a first heating tube, a second heating tube, and a current collector, wherein the first heating tube and the second heating tube are both connected to the current collector; the current collector has a first current collector cavity and a second current collector cavity spaced apart, wherein the cavity of the first heating tube is connected to the first current collector cavity, and the cavity of the second heating tube is connected to the second current collector cavity.

[0007] To achieve the above objectives, this application adopts the following technical solution two: an integrated module, including the heating device as described above, and further including a plate heat exchanger installed in conjunction with the heating device.

[0008] To achieve the above objectives, this application adopts the following technical solution three: a thermal management system, including the thermal management module as described above.

[0009] Compared to existing technologies, the heating tubes in the heating device, thermal management module, and thermal management system of this application include a first heating tube and a second heating tube. The manifold is provided with a first manifold cavity and a second manifold cavity arranged at intervals. The cavity of the first heating tube is connected to the first manifold cavity, and the cavity of the second heating tube is connected to the second manifold cavity. Therefore, this application realizes the simultaneous heating function of at least two different heat exchange media (coolant and refrigerant), which significantly reduces the production cost of heat exchanger products compared to the two independent heaters in the prior art. Attached Figure Description

[0010] Figure 1 This is a three-dimensional assembly diagram of the heating device and plate heat exchanger of this application.

[0011] Figure 2 This is an exploded perspective view of the heating device of this application;

[0012] Figure 3 This is a further exploded perspective view of the heating device of this application;

[0013] Figure 4 yes Figure 3 Another view;

[0014] Figure 5 yes Figure 2 Another view;

[0015] Figure 6 yes Figure 1 Top view;

[0016] Figure 7 It is along Figure 6 Sectional view of line AA in the middle;

[0017] Figure 8 yes Figure 1 Another view;

[0018] Figure 9 This is an exploded perspective view showing the heating device and plate heat exchanger separated in this application.

[0019] Figure 10 yes Figure 9 Another view;

[0020] Figure 11 This is a three-dimensional assembly view of the heating component portion of the heating device in this application;

[0021] Figure 12 It is along Figure 11 Sectional view of the DD line;

[0022] Figure 13 yes Figure 1 A top view of the interior after removing the base;

[0023] Figure 14 yes Figure 1 A top view of the interior after removing the base and circuit board assembly;

[0024] Figure 15 yes Figure 1 A top view of the interior excluding the base, circuit board assembly, and adapter board;

[0025] Figure 16 This is a three-dimensional assembly diagram of the positive electrode structure and negative electrode structure of this application after being assembled with the metal base tube;

[0026] Figure 17 This is a three-dimensional exploded view of the positive electrode structure and negative electrode structure after separation from the metal substrate in this application;

[0027] Figure 18 This is a three-dimensional combined diagram of the positive (negative) electrode structure in the first embodiment of this application;

[0028] Figure 19 This is an exploded perspective view of the positive (negative) electrode structure in the first embodiment of this application;

[0029] Figure 20 This is a perspective view of the positive (negative) electrode structure in the second embodiment of this application. Detailed Implementation

[0030] The exemplary embodiments of this application will now be described in detail with reference to the accompanying drawings. If several embodiments exist, features in these embodiments may be combined with each other without conflict. When the description refers to the drawings, unless otherwise stated, the same numbers in different drawings represent the same or similar elements. The descriptions in the following exemplary embodiments do not represent all embodiments consistent with this application; rather, they are merely examples of apparatuses, products, and / or methods consistent with some aspects of this application as set forth in the claims.

[0031] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to limit the scope of protection of this application. The singular forms “a,” “the,” or “the” used in the description and claims of this application are also intended to include the plural forms unless the context clearly indicates otherwise.

[0032] It should be understood that the terms "first," "second," and similar words used in the specification and claims of this application do not indicate any order, quantity, or importance, but are merely used to distinguish features. Similarly, the terms "an" or "a" and similar words do not indicate a quantity limitation, but rather indicate the presence of at least one. Unless otherwise stated, the terms "before," "after," "above," "below," and similar words appearing in this application are for ease of explanation only and are not limited to a specific location or spatial orientation. The terms "comprising" or "including" and similar words are an open-ended expression, meaning that the element preceding "comprising" or "including" covers the element following "comprising" or "including" and its equivalents, which does not exclude that the element preceding "comprising" or "including" may also include other elements. If "several" appears in this application, it means two or more.

[0033] Please refer to Figures 1 to 20 The heating device 100 involved in this application is disposed on one side of a plate heat exchanger 200. The heating device 100 includes a first housing 1 and a heating assembly 2 housed within the first housing 1, used to heat at least two different heat exchange media (e.g., refrigerant and coolant) flowing through the plate heat exchanger 200. In the heating device 100 of this application, the heating assembly 2 includes a plurality of heating tubes 21 and at least one manifold 22. The heating tubes 21 have ends, and the manifold 22 is laterally connected to the ends of the heating tubes 21. In a specific embodiment, the heating tubes 21 are in a straight line shape, having two oppositely arranged ends; the specific implementation of the connection between the heating tubes 21 and the manifold 22 is that the two ends of the heating tubes 21 are respectively inserted into the interiors of the left and right manifolds 22. The heating tubes 21 include at least a first heating tube 211 and a second heating tube 212 for flowing different heat exchange media, and the manifold 22 is provided with a partition structure 220 separating the different heat exchange media. For example: Figure 11 and Figure 14 Coolant flows through the two first heating tubes 211 shown. Figure 11 and Figure 14 The four second heating tubes 212 shown are circulated with refrigerant. Therefore, this application achieves the function of simultaneous heating of coolant and refrigerant.

[0034] That is, the design focus of this application is: a heating device including the heating component 2. The heating component 2 includes a first heating tube 211, a second heating tube 212, and a collector block 22, wherein both the first heating tube 211 and the second heating tube 212 are connected to the collector block 22. The collector block 22 has a first collector cavity 22001 and a second collector cavity 22002 arranged at intervals. The cavity of the first heating tube 211 communicates with the first collector cavity 22001, and the cavity of the second heating tube 212 communicates with the second collector cavity 22002. The heating component 2 in the heating device, thermal management module, and thermal management system of this application includes at least two sets of heating units for circulating different heat exchange media (in the embodiment, three first heating tubes 211 and two second heating tubes 212). Therefore, this application realizes the simultaneous heating function of at least two heat exchange media (coolant and refrigerant), which significantly reduces product costs compared to the two independent heaters in the prior art.

[0035] The heating device includes a partition 220, and the collector block 22 has an inner cavity 2200. The partition 220 is at least partially located in the inner cavity 2200. In the thickness direction of the partition 220, the first collector cavity 22001 and the second collector cavity 22002 are respectively located on both sides of the partition 220. This application separates the different heat exchange media by incorporating a partition 220 within the collector block 22. Inserting the partition is simpler and easier to implement than integrally forming two collector cavities.

[0036] For detailed implementation methods, please refer to Figure 11 and Figure 12 The current collector 22 includes a first current collector 221 and a second current collector 222, and the heating tube 21 is in Figure 11 Extending in the first direction (X direction) and having two ends arranged opposite to each other in the first direction, the first current collector 221 is located at one end of the heating tube 21 and the second current collector 222 is located at the other end of the heating tube 21. The first current collector 221 and the second current collector 222 are located at... Figure 11The first direction extends in the second direction (Y direction) and is perpendicular to the second direction. The first collector 221 has a first baffle structure 2201, and the second collector 222 has a second baffle structure 2202. The first collector 221 has a first flow port 2001 and a second flow port 2002 located on opposite sides of the first baffle structure 2201, and the second collector 222 has a third flow port 2003 and a fourth flow port 2004 located on opposite sides of the second baffle structure 2202. That is, the heating device includes two collectors 22. One end of both the first heating tube 211 and the second heating tube 212 is connected to one of the collectors 22, and the other ends of both are connected to the other collector 22. The preferred embodiment of having two collectors 22 ensures that the inlet and outlet of each heat exchange medium are on different collectors 22, facilitating easier connection of external pipelines.

[0037] In other embodiments not illustrated, the heating tube 21 may also be U-shaped, and the manifold 22 is a single manifold located on the same side of the heating tube 21. However, the internal design of this single manifold 22 requires a more complex configuration to achieve the inflow, outflow, and separation of different heat exchange media. Other embodiments are not preferred embodiments of this application and will not be described in detail.

[0038] Please refer to Figure 16 Each heating tube 21 includes a metal base tube 210, the outer surface of which is covered with a heating film (not labeled). The heating film is specifically implemented by first sintering an insulating layer onto the metal base tube 210, and then sintering or spraying a resistive heating layer onto the insulating layer. The metal base tube 210 has a positive electrode structure 231 and a negative electrode structure 232 at opposite ends, i.e., the positive electrode structure 231 and the negative electrode structure 232 are spaced apart from each other at opposite ends of the metal base tube 210 and are both electrically connected to the heating film. When energized, the positive electrode structure 231 and the negative electrode structure 232 can heat the wall of the metal base tube 210 through the heating film, thereby heating the refrigerant and coolant flowing in the metal base tube 210.

[0039] Furthermore, the end of the metal base tube 210 is also provided with an NTC thermocouple (not shown) for monitoring the real-time operating temperature of the heating tube 21.

[0040] Furthermore, the metal base tube 210 also has an internal turbulence-inducing structure. The turbulence-inducing structures on the coolant side and the refrigerant side are designed and optimized differently according to specific operating conditions. For example, the turbulence-inducing structures on the coolant side and / or the refrigerant side can be helical rods; in other optional embodiments, the turbulence-inducing structures on the coolant side and / or the refrigerant side can be springs.

[0041] Please refer to Figure 3 , Figure 7 as well as Figures 13 to 15 The heating device 100 of this application further includes a circuit board assembly 3 (PCBA) housed within the first housing 1, which supplies power to the positive electrode structure 231 and the negative electrode structure 232. The circuit board assembly 3 includes a circuit board 31 and multiple electronic components 30. The heating device 100 of this application can achieve power control using a single PCBA, which significantly reduces product costs compared to the two independent coolant heaters in the prior art.

[0042] Please refer to Figure 3 as well as Figures 16 to 20 Each of the positive electrode structure 231 and the negative electrode structure 232 has an electrode plate 230 electrically connected to the circuit board assembly 3 and a clamping member 23 sleeved on the metal base tube 210. The circuit board assembly 3 supplies power to the positive electrode structure 231 and the negative electrode structure 232, and the positive electrode structure 231 and the negative electrode structure 232 are energized together. That is, after the current flows from the positive electrode structure 231 through the heating film to the negative electrode structure 232, the heat generated by the current in the heating film can heat the heat exchange medium flowing in the metal base tube 210.

[0043] Regarding the positive electrode structure 231 and the negative electrode structure 232 of the clamp shape, please refer to... Figures 17 to 19 In the first embodiment shown, the electrode plate 230 and the clamping member 23 are two-piece units. First, the electrode plate 230 is embedded into the clamping member 23, with the end of the electrode plate 230 protruding from the cut 2300 of the clamping member 23. Then, the entire assembly of the electrode plate 230 and the clamping member 23 is fitted onto the metal base tube 210. In this first embodiment, the electrode plate 230 is used for conducting electricity, and the clamping member 23 is used to fix the electrode plate 230 onto the metal base tube 210. Please refer to... Figure 20 In the second embodiment shown, the electrode sheet 230 and the clamp 23 can also be integral. The electrode sheet 230 is stamped from the plate surface of the clamp 23. The electrode sheet 230 is integrally bent outward. In the second embodiment, the clamp 23 is used for conducting electricity and also for fixing on the metal base tube 210.

[0044] Please refer to Figure 3 , Figure 7 and Figure 14 The heating device 100 of this application includes a transition plate 4 disposed between the circuit board assembly 3 and the heating assembly 2. The transition plate 4 is provided with electrode insertion holes 41, and the electrode plate 230 is inserted into the electrode insertion holes 41 and electrically connected to the circuit board 31. The transition plate 4 has the function of connecting the positive and negative electrode lines of the heating assembly 2 to the corresponding parts of the PCBA, and also has the function of connecting the temperature measuring lines of the NTC thermocouple to the corresponding parts of the PCBA; the transition plate 4 also has the function of heat insulation, that is, the transition plate 4 avoids the problem of the PCBA temperature being too high or even unable to work due to the heat of the heating assembly 4 directly radiating to the PCBA.

[0045] Please refer to Figures 1 to 5 The first housing 1 includes a top cover 11 and a base 12. The base 12 includes a bottom wall 121 and a side wall 122 extending upward from the periphery of the bottom wall 121. The top cover 11, the bottom wall 121, and the side wall 122 enclose a receiving space 10. At least a portion of the electronic components 30 are mounted on the circuit board 31 facing the bottom wall 121. The heating assembly 2 is mounted closer to the top cover 11 than the circuit board assembly 3, which facilitates the flow of heat exchange medium between the heating device 100 on one side of the top cover 11 and the plate heat exchanger 200 on the other side of the top cover 11, shortening the path.

[0046] It should also be emphasized that the heating device 100 of this application is used to simultaneously heat at least two heat exchange media (refrigerant and coolant) flowing in the plate heat exchanger 200. Please refer to... Figure 2 and Figure 5 The upper cover 11 includes a first side 111 facing the receiving space 10 and a second side 112 facing away from the receiving space 10, that is, the upper cover 11 includes a first side 111 and a second side 112 in the thickness direction. The plate heat exchanger 200 has at least a second housing 7 and the second housing 7 is mounted on the second side 112 of the upper cover 11. It can be understood that the heating assembly 2 and the plate heat exchanger 200 are installed on opposite sides of the upper cover 11. The heating device of this application can be directly integrated with the existing plate heat exchanger 200 (commonly referred to in the industry as a Chiller), which greatly reduces the possible connection pipes and fittings, reduces the installation space, reduces the possible unnecessary heat leakage of the system, and improves the system efficiency.

[0047] Please refer to Figures 1 to 5Furthermore, it should be noted that a high-voltage connector 5 and a low-voltage connector 6 are installed on the second side 112 of the upper cover 11. The high-voltage connector 5 and the low-voltage connector 6 are respectively connected to the circuit board 31, which facilitates the access of external power supply.

[0048] To facilitate understanding of the flow direction of coolant and refrigerant in this application, please refer to... Figure 7 , Figures 9 to 11 The first manifold 221 has a first flow port 2001 and a second flow port 2002 located on opposite sides of the first partition structure 2201. The second manifold 222 has a third flow port 2003 and a fourth flow port 2004 located on opposite sides of the second partition structure 2202. The first flow port 2001, the second flow port 2002, the third flow port 2003, and the fourth flow port 2004 are respectively connected to four pipe ports 2005 for two different heat exchange media. Two of the pipe ports 2005 are located on the upper cover 11, and the other two pipe ports 2005 are located on the second shell 7 of the plate heat exchanger 200. For a further understanding of the flow direction of the coolant and refrigerant in this application, please refer to... Figure 10 The upper cover 11 is provided with a first through hole 1101 and a second through hole 1102; please refer to Figure 9 The second housing 7 is provided with a third through hole 701 and a fourth through hole 702. The first through hole 1101 is connected to the third through hole 701, and the second through hole 1102 is connected to the fourth through hole 702. The first collecting cavity 22001 and the second collecting cavity 22002 are connected to the pipe opening 2005 and the heating tube 21, respectively, forming two flow channels for the two heat exchange media. The first collecting cavity 22001 and the second collecting cavity 22002 constitute part of the flow channel cavity of the heating device 100, specifically the flow channel cavity at the two collecting blocks 22. The cavity of the heating tube 21 is another part of the flow channel cavity of the heating tube 21.

[0049] On one hand, the refrigerant enters the receiving space 10 through one of the ports 2005 (position B1) of the heating device 100, and flows through the first manifold 221 on the first side, through the first heating pipe 211, to the second manifold 222 on the second side, and then flows out through the third port 2003 and the second through hole 1102 (position B2) opposite to the third port 2003. It then enters the second housing 7 of the plate heat exchanger 200 through the fourth through hole 702 (position B3) opposite to the second through hole 1102. Due to the special channel design within the plate heat exchanger 200, the refrigerant finally flows out through another port 2005 (position B4) diagonally opposite to the fourth through hole 702. Therefore, the first port 2001 is the first heat exchange medium inlet on the heating assembly 2, and the third port 2003 is the first heat exchange medium outlet on the heating assembly 2.

[0050] On the other hand, the coolant enters the second housing 7 from another port 2005 (position C1) of the plate heat exchanger 200. Due to the special channel design within the plate heat exchanger 200, it flows out from the third through hole 701 (position C2) diagonally opposite to the other port 2005, then flows downward through the first through hole 1101 (position C3) opposite to the third through hole 701 into the fourth flow port 2004 opposite to the first through hole 1101. It then flows from the second manifold 222 on the second side through the second heating pipe 212 to the first manifold 221 on the first side. Finally, the coolant flows out from the last port 2005 (position C4) opposite to the second flow port 2002. Therefore, the second flow port 2002 is the second heat exchange medium outlet on the heating assembly 2, and the fourth flow port 2004 is the second heat exchange medium inlet on the heating assembly 2.

[0051] In summary, the refrigerant and coolant flow in opposite directions from multiple different heating tubes 21, i.e., the two sets of heating units mentioned above. The heating device 100 of this application can simultaneously heat the refrigerant and coolant flowing in the plate heat exchanger 200.

[0052] The heating device 100 of this application also includes a plurality of power control units 8 positioned on the current collector 22. Two of the power control units 8 are used to control the operating power of the first heating tube 211, and the other power control unit 8 is used to control the operating power of the second heating tube 212. All of the power control units 8 are electrically connected to the circuit board 31. The power control units 8 are preferably insulated gate bipolar transistors (IGBTs). The IGBT is attached to the current collector 22 via its own insulating thermally conductive pad 80, which dissipates the heat generated during IGBT operation in a timely manner, avoiding the hazards of high-temperature operation. The heating device 100 of this application also includes a pressure block 9 that presses and fixes the power control units 8 against the current collector 22, thereby preventing the power control units 8 from moving.

[0053] This application also relates to a thermal management module, including a heating device as described above and a heat exchanger installed in conjunction with the heating device.

[0054] It is easy to understand that the third through hole 701 serves as the second medium outlet on the heat exchanger and communicates with the fourth flow port 2004, while the fourth through hole 702 serves as the first medium inlet on the heat exchanger and communicates with the third flow port 2003. Since the heat exchanger and the heating device are installed on opposite sides of the thickness direction of the upper cover 11, and the upper cover 11 is respectively provided with a first through hole 1101 and a second through hole 1102, the specific implementation of the communication between the third through hole 701 and the fourth flow port 2004 is: through the first through hole 1101 on the upper cover 11; the specific implementation of the communication between the fourth through hole 702 and the third flow port 2003 is: through the second through hole 1102 on the upper cover 11.

[0055] This application also relates to a thermal management system, including the thermal management module described above.

[0056] This application includes at least a first heating tube 211 and a second heating tube 212. The manifold 22 has a first manifold cavity 22001 and a second manifold cavity 22002 spaced apart. Specifically, the two manifold cavities 22001 and 22002 are implemented by a partition structure 220 inside the manifold 22, which separates the inner cavity 220 of the manifold 22 into two manifold cavities 22001 and 22002. The cavity of the first heating tube 211 communicates with the first manifold cavity 22001, and the cavity of the second heating tube 212 communicates with the second manifold cavity 22002. Therefore, this application achieves simultaneous heating of at least two heat exchange media (coolant and refrigerant) through a heating device that circulates two different heat exchange media. Compared to the two independent heaters in the prior art, this application significantly reduces costs. The heating device of this application can be directly integrated with the existing plate heat exchanger 200 (known in the industry as Chiller), which greatly reduces the possible connection pipes and fittings, reduces installation space, reduces heat leakage, and improves heat exchange efficiency.

[0057] The above embodiments are only used to illustrate this application and are not intended to limit the technical solutions described in this application. The understanding of this specification should be based on those skilled in the art. For example, the directional descriptions such as "front", "back", "left", "right", "up", and "down" are important. Although this specification has described this application in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to this application. All technical solutions and improvements that do not depart from the spirit and scope of this application should be covered within the scope of the claims of this application.

Claims

1. A heating device, characterized in that, include: Heating component (2); The heating assembly (2) includes a first heating tube (211), a second heating tube (212), and a collector block (22), wherein the first heating tube (211) and the second heating tube (212) are both connected to the collector block (22); The current collector (22) has a first current collector cavity (22001) and a second current collector cavity (22002) spaced apart. The cavity of the first heating tube (211) is connected to the first current collector cavity (22001), and the cavity of the second heating tube (212) is connected to the second current collector cavity (22002). It also includes a first housing (1) housing the heating assembly (2), a circuit board assembly (3) housing the first housing (1), and components disposed on the circuit board assembly (3) and the heating assembly (2). The adapter plate (4) between the two heating tubes (211 and 212) includes a circuit board (31) and an electrode socket (41). The first heating tube (211) and the second heating tube (212) include a positive electrode structure (231) and a negative electrode structure (232). The positive electrode structure (231) and the negative electrode structure (232) each have an electrode plate (230). The electrode plate (230) is inserted into the electrode socket (41) and electrically connected to the circuit board (31).

2. The heating device according to claim 1, characterized in that, The heating device includes a partition (220), the collector block (22) has an inner cavity (2200), the partition (220) is at least partially located in the inner cavity (2200), and in the thickness direction of the partition (220), the first collector cavity (22001) and the second collector cavity (22002) are respectively located on both sides of the partition (220).

3. The heating device according to claim 2, characterized in that, The current collector (22) includes a first current collector (221) and a second current collector (222). One end of the first heating tube (211) and the second heating tube (212) is connected to the first current collector (221), and the other end of the first heating tube (211) and the second heating tube (212) is connected to the second current collector (222).

4. The heating device according to claim 3, characterized in that, The first collector block (221) is provided with a first baffle structure (2201), and the second collector block (222) is provided with a second baffle structure (2202). The first collector block (221) has a first flow port (2001) and a second flow port (2002) located on opposite sides of the first baffle structure (2201). The second collector block (222) has a third flow port (2003) and a fourth flow port (2004) located on opposite sides of the second baffle structure (2202). The first flow port (2001) is the first heat exchange medium inlet on the heating component (2), the second flow port (2002) is the second heat exchange medium outlet on the heating component (2), the third flow port (2003) is the first heat exchange medium outlet on the heating component (2), and the fourth flow port (2004) is the second heat exchange medium inlet on the heating component (2).

5. The heating device according to claim 1, characterized in that, Each of the heating tubes (21) includes a metal base tube (210), the outer surface of which is covered with a heating film. The metal base tube (210) has a positive electrode structure (231) and a negative electrode structure (232) at opposite ends. The positive electrode structure (231) and the negative electrode structure (232) are spaced apart from each other and are both electrically connected to the heating film.

6. The heating device according to claim 5, characterized in that, The first housing (1) includes a top cover (11) and a base (12). The top cover (11) covers the base (12) to form a receiving space (10). The top cover (11) includes a first side (111) and a second side (112) in the thickness direction. A high-voltage connector (5) and a low-voltage connector (6) are installed on the second side (112) of the top cover (11). The high-voltage connector (5) and the low-voltage connector (6) are respectively connected to the circuit board (31) for connecting to an external power source.

7. A thermal management module, comprising the heating device as described in any one of claims 1 to 6, characterized in that: It also includes a heat exchanger that is matched and installed with the heating device.

8. The thermal management module according to claim 7, characterized in that, The heat exchanger includes a second housing (7) having a third through hole (701) and a fourth through hole (702); the third through hole (701) serves as a second medium outlet on the heat exchanger and is connected to the fourth flow port (2004) of the manifold (22); the fourth through hole (702) serves as a first medium inlet on the heat exchanger and is connected to the third flow port (2003) of the manifold (22).

9. A thermal management system comprising the thermal management module as described in claim 8.

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