Detection method and detection system

Abstract

A detection method and system are disclosed. The method includes: acquiring a test area of ​​a target object, the test area including the center position of the target object; performing a first detection on the target object using a first detection module to acquire the height of the target object along a direction perpendicular to the surface of the target object; the first detection module including an image acquisition unit including a target surface for acquiring images; the first detection including: imaging the target object using the first detection module to acquire the position of the imaging spot of the test area of ​​the target object on the target surface of the image acquisition unit; and acquiring the height of the target object along a direction perpendicular to the surface of the target object based on the position of the imaging spot. This invention is advantageous for obtaining high-precision detection results.

Description

Technical Field

[0001] The present invention relates to the field of optical detection, and more particularly to a detection method and a detection system. Background Technology

[0002] With the rapid development of integrated circuit manufacturing technology, advanced packaging forms such as 2.5D / 3D integration and wafer-level packaging have become the main direction of packaging technology development.

[0003] With the high-density development of integrated circuit manufacturing, package sizes are getting smaller and smaller, and interconnection density is increasing. In integrated circuits, the size and spacing of the bumps connecting chips are getting smaller and smaller. At the same time, the problem of interconnection short circuits caused by solder deformation is becoming increasingly prominent. Therefore, the demand for three-dimensional defect detection of chip bump coplanarity is becoming more urgent.

[0004] Currently, optical inspection methods are commonly used for three-dimensional defect detection. Summary of the Invention

[0005] The problem solved by the embodiments of the present invention is to provide a detection method and detection system to obtain high-precision detection results.

[0006] To address the aforementioned problems, this invention provides a detection method, comprising: acquiring a test area of ​​a target to be tested, the test area including the center position of the target to be tested; performing a first detection on the target to be tested using a first detection module to acquire the height of the target to be tested along a direction perpendicular to the surface of the target to be tested, the first detection module including an image acquisition device; the first detection comprising: imaging the target to be tested using the first detection module to acquire the position of the imaging spot of the test area of ​​the target to be tested on the target surface of the image acquisition device; and acquiring the height of the target to be tested along a direction perpendicular to the surface of the target to be tested based on the position of the imaging spot.

[0007] This invention also provides a detection system, comprising: a first detection module, the first detection module including an illumination module, an imaging module, and a processing module, wherein the illumination module is used to generate incident light illuminating a test object, the incident light illuminating the test object to generate an illumination spot, and the incident light being reflected by the test object to form a probe light; the imaging module includes an image acquisition component, the image acquisition component being used to receive the probe light and obtain imaging information of the test target based on the probe light, the imaging information including the imaging spot formed by the test target in the image acquisition component; the processing module being used to process the imaging information to obtain the position of the imaging point of the test target, and obtain the height of the test target along a direction perpendicular to the surface of the test object based on the position of the imaging point of the test target.

[0008] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages:

[0009] In the detection method provided by the embodiments of the present invention, a first detection is performed on the target to be tested, and the three-dimensional information of the target to be tested is obtained according to the imaging spot, which provides great convenience for obtaining the three-dimensional information of the target to be tested. Furthermore, the embodiments of the present invention obtain the test area of ​​the target to be tested, which includes the object center position of the target to be tested, which is beneficial to obtain the three-dimensional information of the object center position of the target to be tested in a targeted manner, thereby facilitating the acquisition of highly stable and high-precision detection results.

[0010] The detection system provided in this embodiment of the invention detects the target and obtains the three-dimensional information of the target based on the imaging spot, which greatly facilitates the acquisition of the three-dimensional information of the target and is conducive to obtaining highly stable and high-precision detection results. Attached Figure Description

[0011] Figure 1 A flowchart of an embodiment of the detection method of the present invention;

[0012] Figure 2 This is a structural schematic diagram and optical path diagram of an embodiment of the detection system of the present invention;

[0013] Figure 3 yes Figure 2 A magnified view of any one of the convex points to be tested;

[0014] Figure 4 This is a top view of an embodiment of the detection system of the present invention. Detailed Implementation

[0015] As the background technology shows, optical inspection is a commonly used technique for detecting targets on an object. However, the accuracy of existing optical inspection methods needs improvement.

[0016] To address the aforementioned technical problem, embodiments of the present invention provide a detection method, comprising: acquiring a test area of ​​a target to be tested, the test area including the center position of the target to be tested; performing a first detection on the target to be tested using a first detection module to acquire the height of the target to be tested along a direction perpendicular to the surface of the target to be tested, the first detection module including an image acquisition device; the first detection comprising: imaging the target to be tested using the first detection module to acquire the position of the imaging spot of the test area of ​​the target to be tested on the target surface of the image acquisition device; and acquiring the height of the target to be tested along a direction perpendicular to the surface of the target to be tested based on the position of the imaging spot.

[0017] In the detection method provided by the embodiments of the present invention, a first detection is performed on the target to be tested, and the three-dimensional information of the target to be tested is obtained according to the imaging spot, which provides great convenience for obtaining the three-dimensional information of the target to be tested. Furthermore, the embodiments of the present invention obtain the test area of ​​the target to be tested, which includes the object center position of the target to be tested, which is beneficial to obtain the three-dimensional information of the object center position of the target to be tested in a targeted manner, thereby facilitating the acquisition of highly stable and high-precision detection results.

[0018] To make the above-mentioned objects, features and advantages of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0019] refer to Figure 1 , Figure 1 This is a flowchart of an embodiment of the detection method of the present invention.

[0020] In this embodiment, the detection method includes the following steps:

[0021] Step S1: Obtain the test area of ​​the target to be tested, wherein the test area includes the center position of the target to be tested;

[0022] Step S2: Perform a first detection on the target under test using a first detection module to obtain the height of the target under test along a direction perpendicular to the surface of the object under test. The first detection module includes an image acquisition unit.

[0023] Step S21: The first detection includes: imaging the target under test through the first detection module to obtain the position of the imaging spot of the test area of ​​the target under test on the target surface of the image acquisition device;

[0024] Step S22: Obtain the height of the object under test along the direction perpendicular to the surface of the object under test based on the position of the light spot.

[0025] In the detection method provided by the embodiments of the present invention, a first detection is performed on the target to be tested, and the three-dimensional information of the target to be tested is obtained according to the imaging spot, which provides great convenience for obtaining the three-dimensional information of the target to be tested. Furthermore, the embodiments of the present invention obtain the test area of ​​the target to be tested, which includes the object center position of the target to be tested, which is beneficial to obtain the three-dimensional information of the object center position of the target to be tested in a targeted manner, thereby facilitating the acquisition of highly stable and high-precision detection results.

[0026] The following section explains each step of the detection method in conjunction with the detection system.

[0027] Reference Figures 2 to 4 , Figure 2 This is a structural schematic diagram and optical path diagram of an embodiment of the detection system of the present invention. Figure 3 yes Figure 2A magnified view of a local part of any convex point to be tested. Figure 4 This is a top view of an embodiment of the detection system of the present invention, and the detection method described in this embodiment will be explained in detail.

[0028] Perform step S1 to obtain the test area 810c of the target to be tested, which includes the center position of the target to be tested.

[0029] In this embodiment, the target to be tested is the protrusion 101 to be tested.

[0030] Specifically, as an example, the object to be tested is wafer 100, and the target to be tested is the bump 101 on the surface of wafer 100. The detection device in this embodiment is used to detect three-dimensional defects in the coplanarity of the bumps on the surface of wafer 100.

[0031] The test area 810c is the area of ​​the target to be tested that needs to be tested. The test area 810c can be the entire surface area of ​​the target or a part of the surface area of ​​the target.

[0032] In this embodiment, the test area 810c is a circular area with the center of the object as the center and a preset radius as the radius; the preset radius is smaller than the minimum size of the target on the parallel surface of the object to be tested.

[0033] The minimum size of the target on the parallel surface of the object being measured is: the minimum radius of the target on the parallel surface of the object being measured.

[0034] The test area 810c is a circular area with a preset radius centered on the center of the object. This helps to make the light spot corresponding to the test area 810c more uniform. The preset radius of the test area 810c is smaller than the minimum size of the target on the parallel surface of the object to be tested, so that the test area 810c can be included for each target to be tested.

[0035] In this embodiment, the projection of the target under test onto the surface of the object under test is circular; the radius of the test area 810c is less than or equal to 1 / 10 of the radius of the target under test.

[0036] It should be noted that the radius of the test area 810c should not be too large a proportion of the radius of the target. If the radius of the test area 810c is too large a proportion of the target's radius, the area of ​​the imaging spot that needs to be processed in the subsequent processing of the test area 810c will still be large, making it difficult to reduce the amount of processing required, thus hindering the saving of computing power and the improvement of the detection output of the detection system. Therefore, in this embodiment, the radius of the test area 810c is less than or equal to 1 / 10 of the radius of the target.

[0037] In this embodiment, the target to be tested is the convex point 101. The test area 810c of the target to be tested is the region where the maximum height of the convex point 101 is located, and the test area 810c of the convex point 101 is the region used to obtain the height of the convex point 101. In this embodiment, the imaging spot of the test area 810c of the convex point 101 is subsequently processed, reducing the range of the imaging spot that needs processing. This helps to reduce the amount of processing required for the imaging spot, thereby saving computing power and increasing the detection output of the detection system.

[0038] Specifically, in this embodiment, the second detection module pre-scans the object to be tested to obtain the center position of the target; the test area 810c is obtained based on the center position, and the test area 810c includes the center position of the target.

[0039] In this embodiment, the test area 810c is obtained according to the center position of the object, so that the test area 810c can be distributed relatively evenly around the center position of the object. Specifically, the radius of the test area 810c is set, and the radius range with the center position of the object as the center is used as the test area 810c.

[0040] As an example, the second detection module is an imaging device, and the pre-scanning of the object to be tested includes: imaging the object to be tested to obtain an image of the object to be tested, and obtaining the center position of the target object based on the image of the object to be tested.

[0041] After obtaining the test area 810c of the target to be tested, before the first detection module performs the first detection on the target to be tested, the following steps are also included: focusing the center of the target to be tested according to the object center position of the target to be tested.

[0042] Since the target to be tested is the convex point 101, the surface of the target to be tested is an arc-shaped convex shape. The reflection angle of the subsequent incident light is different at different heights of the target to be tested, so the clarity of the image at different heights of the target to be tested is different. In this embodiment, it is necessary to obtain the height of the center position of the target to be tested, so the image at the center position of the target to be tested needs to be as clear as possible. Therefore, before the first detection module performs the first detection on the target to be tested, the center of the target to be tested is focused according to the center position of the target to be tested.

[0043] Specifically, in this embodiment, during the detection process, the first detection module moves relative to the object to be tested. When the center of the object to be tested is determined to be within the first detection module based on the center position of the object to be tested, the distance between the first detection module and the object to be tested along the optical axis of the first detection module is adjusted. When the first detection module clearly images the object to be tested, the object to be tested is detected.

[0044] Step S2 is executed, in which the first detection module performs a first detection on the target to be tested and obtains the height of the target to be tested along the direction perpendicular to the surface of the object to be tested. The first detection module includes an image acquisition unit 810.

[0045] In this embodiment of the invention, a first detection is performed on the target to be tested, and the three-dimensional information of the target to be tested is obtained based on the imaging spot, which greatly facilitates the acquisition of the three-dimensional information of the target to be tested. Furthermore, this embodiment obtains the test area 810c of the target to be tested, which includes the object center position of the target to be tested. This is beneficial for obtaining the three-dimensional information of the object center position of the target to be tested in a targeted manner, thereby facilitating the acquisition of highly stable and high-precision detection results.

[0046] In this embodiment, imaging the target under test by the first detection module includes: performing step S21: imaging the target under test by the first detection module to obtain the position of the imaging spot of the test area 810c of the target under test on the target surface 80 of the image acquisition device 810.

[0047] Specifically, in the first detection, the first detection module generates incident light focused onto the object under test, the incident light illuminates the object under test to generate an illumination spot 800s, and the incident light is reflected by the object under test to form a probe light; at least a portion of the probe light is collected by the image acquisition unit 810, and the imaging information of the target under test is obtained based on the collected probe light, the imaging information including the spot position of the imaging spot of the test area 810c of the target under test.

[0048] In this embodiment, the incident light irradiates the object under test to generate an illumination spot 800s, and the illumination spot 800s is linear.

[0049] A linear light spot is generated on the object under test for 800 seconds, thereby enabling the detection device to perform a linear scan of the object under test.

[0050] A linear light spot 800s is used to scan the object under test. Along the scanning direction, the edges of adjacent linear light spots 800s can be precisely aligned or partially overlapped. Using linear light spots 800s to complete the linear scan facilitates complete coverage of the object under test by all linear light spots 800s. At the same time, it can make full use of each linear light spot 800s, and a smaller number of linear light spots 800s are needed to complete the scanning of the object under test, thereby improving scanning efficiency. Specifically, the detection device in this embodiment is used to measure the microscopic three-dimensional morphology of the height of the protrusion 101 under test.

[0051] In this embodiment, the incident angle α of the incident light is less than 45 degrees or greater than 45 degrees.

[0052] In this embodiment, the incident angle of the incident light is less than 45 degrees, which is beneficial to reduce the probability of the target being blocked on the test object by flexibly adjusting the incident angle of the incident light, so that the target can be fully illuminated, thereby making the imaging of the target in the imaging module more accurate. The incident angle of the incident light is greater than 45 degrees, which is beneficial to increase the space above the test object by flexibly adjusting the incident angle of the incident light, so as to facilitate the installation of other detection devices.

[0053] In this embodiment, the incident angle of the incident light is 25 degrees to 35 degrees.

[0054] The incident light undergoes specular reflection after passing through the surface of the object under test. The incident angle of the incident light is equal to the reflection angle of the probe light. The incident angle of the incident light is 25 degrees to 35 degrees. This ensures that the target under test can receive more sufficient illumination, facilitates the setting of the relative positions of the illumination module and the imaging module, and also facilitates the complete reception of the probe light by the imaging module, thereby enabling more accurate imaging in the imaging module.

[0055] Reference Figure 3 In this embodiment, the incident angle α of the incident light is less than 45 degrees as an example. Figure 3 A magnified view of a portion of any of the convex points to be measured is shown for ease of explanation. Figure 3 The diagram illustrates the overlapping of two test bumps 101 of different heights. The first test bump 101a is represented by a solid black bump, and the second test bump 101b is represented by a dashed outline. For the first test bump 101a, when incident light illuminates it, it is reflected at point P to form a probe light (the optical path of the probe light reflected at point P is represented by a dashed line). The image spot on the target surface 80 is located at point P'. For the second test bump 101b, when incident light illuminates it, it is reflected at point Q to form a probe light (the optical path of the probe light reflected at point P is represented by a solid line). The image spot on the target surface 80 is located at point Q'.

[0056] In this embodiment, the target surface 80 is perpendicular to the incident direction of the corresponding received probe light. Therefore, the conjugate image of the target surface 80 is located on the base surface 80e passing through point P. The base surface 80e is perpendicular to the main optical path 10b of the probe light. However, the incident angle α of the incident light is less than 45 degrees, and the incident light is specularly reflected. Therefore, the incident light and the probe light are not perpendicular. Thus, the base surface 80e and the optical axis 10a of the incident light do not coincide. That is to say, point Q on the second convex point 101b to be tested is not on the base surface 80e. As a result, the imaging spot of the incident light passing through point Q is a blurry spot. In other words, point Q cannot be clearly imaged at point Q', but forms a blurry spot at point Q'. Therefore, in order to obtain the clear position of point Q', it is necessary to process the blurry spot.

[0057] In this embodiment, the target surface 80 is perpendicular to the incident direction of the corresponding received detection light, thus simplifying the setup of the target surface 80 and reducing modifications to the original detection system.

[0058] In this embodiment, the test area 810c of the target to be tested is obtained in the position of the imaging spot of the target surface 80 of the image acquisition device 810, and one test area 810c corresponds to multiple imaging spots.

[0059] During the first inspection process, when multiple adjacent linear light spots 800s cover a test area 810c, a test area 810c will correspondingly form multiple imaging light spots.

[0060] In this embodiment, collecting at least a portion of the probe light by the image acquisition device 810 includes: along the surface direction of the object to be measured, making the linear light spot 800s along the scanning direction (e.g., along the surface direction of the object to be measured). Figure 4 (As shown in the X direction) The object to be measured is translated relative to the object by a preset step size to scan the object. The scanning direction is perpendicular to the length direction of the linear spot 800s. During the scanning process, the preset step size is less than or equal to the width of the linear spot 800s.

[0061] In this embodiment, the linear spot 800s is moved relative to the object under test along the scanning direction by a preset step size to scan the object under test, so that the entire surface of the object under test can be imaged in the imaging module. Furthermore, the scanning direction is perpendicular to the length direction of the linear spot 800s. The linear spot 800s has a large length and a small width. This embodiment can scan the area spanned by the length of the linear spot 800s on the surface of the object under test after scanning along the scanning direction, and then perform the next round of scanning of the area spanned by the length of the linear spot 800s. This helps to ensure the regularity of each scanning translation and reduce the jumpiness of the scanning, which helps to make the scanning of the surface of the object under test simple and smooth.

[0062] It should be noted that the preset step size should not be too large. If the preset step size is too large, gaps may easily occur between two adjacent linear light spots 800s, resulting in incomplete scanning of the surface of the object under test, making it difficult to perform complete detection of the object and affecting the detection results. Therefore, in this embodiment, the preset step size is less than or equal to the width of the linear light spot 800s, thereby ensuring that two adjacent linear light spots 800s are precisely stitched together or have overlapping portions.

[0063] In this embodiment, there are multiple image acquisition units 810. The first detection module also includes a beam splitter 700, which is used to transmit the received detection light along multiple different optical path directions and project the detection light transmitted along multiple different optical path directions into the image acquisition unit 810 respectively. Each image acquisition unit 810 sequentially acquires each detection light to form images of different areas of the object under test.

[0064] refer to Figure 3 In this embodiment, the imaging spot of the incident light passing through point Q is a diffuse spot. That is to say, point Q cannot be clearly imaged at point Q', but a diffuse spot is formed at point Q'. Therefore, the diffuse spot is processed by the processing module 900 to obtain the clear position of point Q', and the heights of the convex points 101a and 101b to be measured are obtained based on the clear positions of points P' and Q'.

[0065] Specifically, in this embodiment, obtaining the position of the imaging spot of the test area 810c of the target under test on the target surface 80 of the image acquisition device 810 includes: extracting the center of the imaging spot to obtain the center of the imaging spot, and using the center of the imaging spot as the image center position.

[0066] In this embodiment, the center of the diffuse spot is extracted to obtain the clear location of the center of the diffuse spot, which is the Q' point.

[0067] In this embodiment, the methods for extracting the center of the imaging spot include the gray-scale centroid method, the quadratic curve fitting vertex method, the Gaussian curve fitting vertex method, the centroid method, or the maximum value position method.

[0068] Gray-scale centroid method, quadratic curve fitting vertex method, Gaussian curve fitting vertex method, centroid method or maximum value position method are all commonly used methods for center extraction in the field of optics. The calculation methods are relatively mature and simple, which is conducive to more accurate center extraction and obtaining a more accurate clear position of Q' point.

[0069] In this embodiment, the processing of the imaging spot includes: processing the imaging spot of the test area 810c of the target under test to obtain the position of the imaging point of the test area 810c of the target under test.

[0070] In this embodiment, the imaging spot of the test area 810c of the target under test is processed, which reduces the range of the imaging spot that needs to be processed. This helps to reduce the amount of processing required for the imaging spot, thereby saving computing power and increasing the detection output of the detection system.

[0071] It should be noted that in this embodiment, when the accuracy of the pre-scan of the object to be tested is high, and the test area 810c is the center point of the target, the imaging spot of the center point of the target is an imaging point. Therefore, the center extraction algorithm is not required, and the position of the imaging point can be directly obtained as the image center position. The height of the target along the direction perpendicular to the surface of the object to be tested can be obtained based on the image center position.

[0072] Execute step S22 to obtain the height of the target under test along the direction perpendicular to the surface of the object under test based on the position of the light spot.

[0073] Accordingly, in this embodiment, the position of the imaging point corresponds to the height of the protrusion 101 to be measured.

[0074] In this embodiment, obtaining the height of the target under test along the direction perpendicular to the surface of the object under test based on the position of the light spot includes: obtaining the height of the target under test based on the position of the image center.

[0075] Specifically, in this embodiment, based on the triangulation method, each position on the target surface 80 of the image acquisition component 810 is fixed in height. That is, each position on the target surface 80 corresponds to the height of the target to be measured. Accordingly, in this embodiment, the target to be measured is imaged on the target surface 80 by the probe light. Based on the position of the imaging point of the target to be measured, the height of the corresponding point of the target to be measured can be obtained.

[0076] In this embodiment, as Figure 4 As shown, each linear light spot 800s spans the surface around the bottom of the convex point 101 to be tested. Therefore, in this embodiment, there is no need to set a reference surface. Instead, the height difference between the points on the convex point 101 and the points on the surface around the bottom of the convex point 101 can be obtained by the position difference of the imaging points. This helps to reduce the detection error caused by the unevenness of the reference surface itself, and thus helps to obtain the height of the convex point 101 more accurately.

[0077] In this embodiment, the position of the light spot is obtained based on the imaging light spot of the target to be tested, and the height of the target to be tested along the direction perpendicular to the surface of the target to be tested is obtained based on the light spot position. The average value of the heights obtained from multiple imaging light spots is used as the height of the test area 810c.

[0078] During the first inspection process, when multiple adjacent linear light spots 800s cover a test area 810c, a test area 810c will form multiple imaging light spots. Therefore, using the average height of the multiple imaging light spots as the height of the test area 810c is beneficial to obtain a more accurate height.

[0079] It should be noted that after obtaining the height of the target along the direction perpendicular to the surface of the object, the height change of the target can be obtained by stitching together the images obtained from the target surface 80, and the height of the target can be calibrated.

[0080] Accordingly, this embodiment also provides a detection system.

[0081] refer to Figures 2 to 4 , Figure 2 This is a structural schematic diagram and optical path diagram of an embodiment of the detection system of the present invention. Figure 3 yes Figure 2 A magnified view of a local part of any convex point to be tested. Figure 4 This is a top view of an embodiment of the detection system of the present invention.

[0082] The system is used to detect targets on a test object. The detection system includes: a first detection module, which includes an illumination module, an imaging module, and a processing module 900. The illumination module generates incident light that illuminates the test object, producing an illumination spot 800s on the test object. The incident light is reflected by the test object to form a probe light. The imaging module includes an image acquisition component 810, which receives the probe light and obtains imaging information of the target based on the probe light. The imaging information includes the imaging spot formed by the target in the image acquisition component 810. The processing module 900 processes the imaging information to obtain the position of the imaging point of the target and obtains the height of the target along a direction perpendicular to the surface of the test object based on the position of the imaging point of the target.

[0083] In this embodiment, the target to be tested is the protrusion 101 to be tested.

[0084] Specifically, as an example, the object to be tested is wafer 100, and the target to be tested is the bump 101 formed on the surface of wafer 100. The detection device of this embodiment is used to detect three-dimensional defects in the coplanarity of the bumps on the surface of wafer 100. Specifically, the detection device of this embodiment is used to measure the microscopic three-dimensional morphology of the height of the bump 101 to be tested.

[0085] In the actual testing process, the target to be tested also has a test area 810c, which is the area of ​​the target to be tested that needs to be tested. The test area 810c can be the entire surface area of ​​the target to be tested, or a part of the surface area of ​​the target to be tested.

[0086] In this embodiment, the test area 810c is a circular area with the center of the target being tested as the center and a preset radius; the preset radius is smaller than the minimum size of the target being tested on the surface parallel to the test object.

[0087] The minimum size of the target on the parallel surface of the object being measured is: the minimum radius of the target on the parallel surface of the object being measured.

[0088] The test area 810c is a circular area with the center of the target to be tested as the center and a preset radius. This is beneficial to make the light spot corresponding to the test area 810c more uniform. The preset radius of the test area 810c is smaller than the minimum size of the target to be tested on the parallel surface of the object to be tested, so that the test area 810c can be included for each target to be tested.

[0089] In this embodiment, the projection of the target under test onto the surface of the object under test is circular; the radius of the test area 810c is less than or equal to 1 / 10 of the radius of the target under test.

[0090] It should be noted that the radius of the test area 810c should not be too large a proportion of the radius of the target. If the radius of the test area 810c is too large a proportion of the target's radius, the area of ​​the imaging spot that needs to be processed in the subsequent processing of the test area 810c will still be large, making it difficult to reduce the amount of processing required, thus hindering the saving of computing power and the improvement of the detection output of the detection system. Therefore, in this embodiment, the radius of the test area 810c is less than or equal to 1 / 10 of the radius of the target.

[0091] In this embodiment, the target to be tested is the convex point 101. The test area 810c of the target to be tested is the region where the maximum height of the convex point 101 is located, and the test area 810c of the convex point 101 is the region used to obtain the height of the convex point 101. During actual detection, the imaging spot of the test area 810c of the convex point 101 is processed, reducing the range of the imaging spot that needs processing. This helps reduce the amount of processing required for the imaging spot, thereby saving computing power and increasing the detection output of the detection system.

[0092] The illumination module generates incident light that illuminates the object under test. In this embodiment, the incident angle of the incident light is less than 45 degrees or greater than 45 degrees. An incident angle of less than 45 degrees allows for flexible adjustment of the incident angle, reducing the probability of the target on the object being obstructed, thus ensuring more sufficient illumination of the target. This, in turn, contributes to more accurate imaging of the target in the imaging module. An incident angle of greater than 45 degrees allows for flexible adjustment of the incident angle, increasing the space above the object under test to facilitate the installation of other detection devices.

[0093] In this embodiment, the incident angle of the incident light is 25 degrees to 35 degrees.

[0094] The incident light undergoes specular reflection after passing through the surface of the object under test. The incident angle of the incident light is equal to the reflection angle of the probe light. The incident angle of the incident light is 25 degrees to 35 degrees. This ensures that the target under test can receive more sufficient illumination, facilitates the setting of the relative positions of the illumination module and the imaging module, and also facilitates the complete reception of the probe light by the imaging module, thereby enabling more accurate imaging in the imaging module.

[0095] The illumination module is used to generate a linear light spot 800s on the object under test, the extension direction of which is perpendicular to the incident surface of the incident light.

[0096] It should be noted that the incident plane is the plane containing the incident light and the normal to the surface of the object under test.

[0097] The illumination module generates a linear light spot 800s on the object under test, which enables the detection device to perform a linear scan of the object under test.

[0098] The object under test is scanned using a linear spot 800s. Along the scanning direction, the edges of adjacent linear spots 800s can be aligned or partially overlapped. Using linear spots 800s to complete linear scanning is beneficial for achieving complete coverage of the object under test by all linear spots 800s. At the same time, each linear spot 800s can be fully utilized, and a smaller number of linear spots 800s can be used to complete the scanning of the object under test, thereby improving scanning efficiency.

[0099] The lighting module includes components along the optical path transmission direction (e.g.) Figure 2 (As indicated by the arrow on the dashed line) A light source assembly 200, a first slit element 400, and a first mirror group 500 are arranged in sequence. The light source assembly 200 is used to generate a light beam, the first slit element 400 is used to allow the light beam to pass through and generate linear incident light, and the first mirror group 500 is used to focus the linear incident light onto the object under test to generate a linear light spot 800s.

[0100] In this embodiment, the light source assembly 200 is used to generate a linear light beam.

[0101] In this embodiment, along the optical path transmission direction, the light beam generated by the light source component 200 passes through the first slit element 400, thereby generating a linear light spot 800s on the object under test. Therefore, compared with a circular light beam, the light source component 200 generates a linear light beam. When the light beam generated by the light source component 200 is coupled with the first slit element 400, it is beneficial to reduce the waste of light beam energy and improve the coupling efficiency.

[0102] In this embodiment, the light source assembly 200 includes a light source, and the light source is an incoherent light source.

[0103] The light source assembly 200 generates a beam of light using the light emitted by the light source.

[0104] In this embodiment, the light source is an incoherent light source. Compared with coherent light sources (e.g., laser light sources), incoherent light sources have less noise. Therefore, the light beam generated by the incoherent light source has a higher signal-to-noise ratio in the imaging module, thus enabling the imaging module to obtain more accurate imaging information of the target under test.

[0105] Specifically, in this embodiment, the type of light source includes LED light source, halogen lamp or xenon lamp.

[0106] LED light sources, halogen lamps, or xenon lamps are incoherent light sources, and they also have the characteristics of small size, long lifespan, high luminous efficiency, and low power consumption.

[0107] In this embodiment, the light source assembly 200 includes a light source and a shaping element 220. The shaping element 220 is used to shape the light emitted by the light source to produce a linear beam.

[0108] In practical applications, incoherent light sources typically emit circular beams. Therefore, shaping element 220 is used to shape the light emitted by the light source to ensure that the light source assembly 200 produces a linear beam.

[0109] In this embodiment, the shaping element 220 includes an optical fiber bundle, the shape of the entrance port of the optical fiber bundle matching the shape of the light spot emitted by the light source, and the optical fibers at the exit port of the optical fiber bundle arranged in a straight line.

[0110] Using fiber optic bundles to shape the light emitted from a light source is simple and easy to operate. Furthermore, the port shape of the fiber optic bundle is easily adjustable, allowing the input port of the fiber optic bundle to be adjusted according to the light spot formation emitted by the light source, and the output port of the fiber optic bundle to be adjusted according to the required shape of the incident light.

[0111] In this embodiment, the shape of the incident port of the fiber bundle matches the shape of the light spot emitted by the light source, thereby improving the coupling efficiency between the light emitted by the light source and the fiber bundle. The shape of the exit port of the fiber bundle is straight, thereby enabling the light source assembly 200 to generate a linear beam.

[0112] In other embodiments, the light source assembly may further include an imaging element for directly generating a linear beam of light.

[0113] In this embodiment, the light source assembly 200 includes a light source and a filter color wheel, which is used to control the spectrum emitted by the light source assembly 200.

[0114] As an example, the light source assembly 200 includes a light box 210, in which a light source and a filter color wheel are disposed, the filter color wheel being used to control the spectrum emitted by the light box 210.

[0115] The light box 210 is used as a device for housing a light source and a color wheel of filters.

[0116] In this embodiment, the light emitted by the light source passes through the color wheel of the filter before being emitted from the light box 210, thereby enabling the spectrum emitted by the light box 210 to be controlled by the color wheel of the filter.

[0117] As an example, the light source emits white light, which, after passing through a color wheel with a filter, can cause the light box 210 to emit blue, green, yellow, or cyan light.

[0118] In this embodiment, the spectrum of the filter color wheel is adjusted according to the spectrum of the surface coating of the target under test, for example, according to the spectrum of the coating on the wafer surface. Specifically, the spectrum of the filter color wheel is consistent with the spectrum of the surface coating of the target under test, which helps to improve the signal-to-noise ratio of the probe light generated by the incident light on the surface of the target under test.

[0119] The first slit element 400 is used to obtain linear incident light.

[0120] The first slit element 400 includes a fixed slit, a unilaterally adjustable asymmetrical slit, or a bilaterally adjustable symmetrical slit.

[0121] In this embodiment, the length direction of the slit opening in the first slit element 400 is perpendicular to the incident surface of the incident light path, thereby obtaining linear incident light that matches the slit opening. Accordingly, in this embodiment, the length of the obtained linear incident light is controlled by setting the slit opening length of the first slit element 400.

[0122] The first lens group 500 is used to focus linear incident light onto the object under test to generate a linear light spot, and also to control the size of the generated linear light spot. As an example, the first lens group 500 is a first microscope objective.

[0123] In this embodiment, the size and spacing of the bumps 101 to be tested are usually small. Therefore, a finer linear light spot is required to detect the bumps 101 to be tested.

[0124] In this embodiment, the first lens group 500 is used to reduce the image of the first slit element 400 onto the object under test, thereby reducing the width of the linear incident light passing through the first slit element 400. This results in a narrower linear spot, which is beneficial for improving scanning accuracy when using the linear spot to perform linear scanning on the object under test, and thus improving the accuracy of the detection results.

[0125] In this embodiment, the first slit element 400 and the first mirror group 500 are used to shape and image the light beam generated by the light source assembly 200. The first mirror group 500 can be used to reduce the size of the first slit element 400 and image it onto the object under test, thereby obtaining a smaller linear spot 800s. The linear spot 800s forms a probe light through the object under test, which is beneficial to obtaining high-precision imaging information of the object under test and correspondingly obtaining high-stability and high-precision detection results.

[0126] In this embodiment, the lighting module further includes an optical fiber coupler 300, which is disposed between the light source assembly 200 and the first slit element 400. The optical fiber coupler 300 is used to couple the light beam to the slit opening of the first slit element 400.

[0127] In this embodiment, the light source component 200 generates a linear light beam through an optical fiber bundle. Since the light beam generated by the optical fiber bundle is a discontinuous light spot, the optical fiber coupler 300 can converge the light beam and couple it at the slit opening of the first slit element 400. This is beneficial to improve the illumination efficiency of the incident light, control the incident light, reduce the divergence of the incident light, and improve the uniformity of the imaging in the imaging module.

[0128] In this embodiment, the fiber optic coupler 300 includes a cylindrical mirror 310, which is disposed on the side of the fiber optic coupler 300 near the light-emitting end face, or disposed on the side of the optical fiber coupler near the light-incident end face.

[0129] Cylindrical mirror 310 is used to improve the illumination efficiency of incident light and the uniformity of incident light.

[0130] In this embodiment, the imaging module is used to collect the detection light and obtain the imaging information of the target under test based on the detection light.

[0131] In this embodiment, the imaging information includes the imaging spot formed by the target in the image acquisition component 810.

[0132] In this embodiment, the image acquisition component 810 includes a target surface 80 for receiving probe light, and the target surface 80 of the image acquisition component 810 is perpendicular to the incident direction of the received probe light.

[0133] Reference Figure 3 In this embodiment, the incident angle α of the incident light is less than 45 degrees as an example. Figure 3 A magnified view of a portion of any of the convex points to be measured is shown for ease of explanation. Figure 3The diagram illustrates the overlapping of two test bumps 101 of different heights. The first test bump 101a is represented by a solid black bump, and the second test bump 101b is represented by a dashed outline. For the first test bump 101a, when incident light illuminates it, it is reflected at point P to form a probe light (the optical path of the probe light reflected at point P is represented by a dashed line). The image spot on the target surface 80 is located at point P'. For the second test bump 101b, when incident light illuminates it, it is reflected at point Q to form a probe light (the optical path of the probe light reflected at point P is represented by a solid line). The image spot on the target surface 80 is located at point Q'.

[0134] In this embodiment, the target surface 80 of the image acquisition component 810 is perpendicular to the incident direction of the corresponding received probe light. Therefore, the conjugate image of the target surface 80 is located on the base surface 80e passing through point P. The base surface 80e is perpendicular to the main optical path 10b of the probe light. However, the incident angle α of the incident light is not 45 degrees, and the incident light is specularly reflected. Therefore, the incident light and the probe light are not perpendicular. Thus, the base surface 80e and the optical axis 10a of the incident light do not coincide. That is to say, point Q on the second convex point 101b to be tested is not on the base surface 80e. As a result, the imaging spot of the incident light passing through point Q is a blur spot. In other words, point Q cannot be clearly imaged at point Q', but a blur spot is formed at point Q'. Therefore, in order to obtain the clear position of point Q', the blur spot needs to be processed.

[0135] In this embodiment, the target surface 80 of the image acquisition component 810 is perpendicular to the incident direction of the corresponding received detection light, thus simplifying the setup of the image acquisition component 810 and reducing modifications to the original detection system.

[0136] In this embodiment, the imaging module further includes an imaging component 600, which is used to converge the probe light into the image acquisition component 810.

[0137] In this embodiment, the imaging component 600 includes a second mirror group 620, an aperture 630, and a tube mirror 640 arranged sequentially along the optical path transmission direction. The second mirror group 620 is used to collect the probe light and incident the probe light into the aperture 630. The tube mirror 640 is used to receive the probe light passing through the aperture 630 and converge the probe light.

[0138] In this embodiment, the second mirror group 620 is used to amplify the optical path of the probe light, making the image of the target under test clearer. As an example, the second mirror group 620 is a second microscope objective.

[0139] In this embodiment, the aperture 630 is used to control the amount of light passing through the probe light. The aperture 630 is also used to limit the telecentricity of the main ray of the probe light, so that the telecentricity of the probe light is infinitely close to 0. This is beneficial to make the imaging quality of each field of view in the imaging module uniform, thereby helping to obtain imaging information with higher accuracy.

[0140] In this embodiment, the aperture 630 images the target to be tested at infinity, and the tube lens 640 images the target to be tested at a finite distance. Correspondingly, it images the target to be tested onto the image acquisition component 810. The combination of the aperture 630 and the tube lens 640 is beneficial to ensure that the image quality of the probe light on the image acquisition component 810 after passing through the imaging component 600 is uniform, clear and accurate.

[0141] In this embodiment, the imaging assembly 600 further includes a second slit element 610, which is disposed on the side of the second mirror group 620 facing away from the aperture stop 630. The second slit element 610 is used to reduce stray light of the probe light.

[0142] In this embodiment, the second slit element 610 is used to limit the numerical aperture (NA) of the optical system of the probe light, thereby reducing the divergence of the probe light.

[0143] In this embodiment, there are multiple image acquisition components 810.

[0144] By employing multiple image acquisition components 810 for image acquisition, it is beneficial to increase the maximum frame rate of the image acquisition components 810, thereby improving the image acquisition efficiency of the image acquisition components 810.

[0145] Specifically, the number of image acquisition components 810 is the multiple of the maximum frame rate of the image acquisition component 800 compared to a single image acquisition component.

[0146] refer to Figure 4 In this embodiment, there are two image acquisition components 810, which can improve the image acquisition efficiency of the image acquisition component 810 while making the optical path of the probe light less complicated. This ensures the image acquisition efficiency of the image acquisition component 810 while making the optical path of the probe light in the imaging module easier to set.

[0147] Specifically, the two image acquisition components 810 work alternately to acquire imaging information of linear light spots 810s and 820s respectively, until the object under test is linearly scanned.

[0148] In this embodiment, the imaging component 600 further includes a beam splitter 700, which is disposed on the side of the imaging component 600 closest to the light-emitting end. The beam splitter 700 is used to transmit the received probe light along multiple different optical path directions and project the probe light transmitted along multiple different optical path directions into the image acquisition component 810 respectively. Each image acquisition component 810 sequentially acquires each probe light to form images of different areas of the object under test.

[0149] The beam splitter 700 is used to set up multiple image acquisition components 810 to acquire images. In order to ensure the normal operation of each image acquisition component 810, the sub-probe beams split by the beam splitter 700 correspond one-to-one with the image acquisition component 810.

[0150] Specifically, in this embodiment, there are two image acquisition components 810. The beam splitter 700 is used to reflect the probe light and project the reflected probe light into one of the image acquisition components 810. It is also used to transmit the probe light and project the transmitted probe light into the other image acquisition component 810.

[0151] In this embodiment, the beam splitter 700 includes a beam splitting prism.

[0152] A beam splitter can split the probe light beam. In this embodiment, the beam splitter can separate the horizontal and vertical polarization of a probe light beam, correspondingly dividing it into sub-probe lights along the original optical path transmission direction and sub-probe lights perpendicular to the original optical path transmission direction. Moreover, the beam splitter has the characteristics of low stress, high extinction ratio, good imaging quality, and small beam deflection angle.

[0153] In this embodiment, the beam splitting ratio of the beam splitter is 1:1, which makes the two sub-probe beams more uniform, and the corresponding imaging quality on the two image acquisition components 810 is more uniform.

[0154] In this embodiment, the detection system further includes a processing module 900, which processes the imaging spot to obtain the position of the imaging point of the target to be tested, and the position of the imaging point corresponds to the height of the target to be tested.

[0155] Accordingly, in this embodiment, the position of the imaging point corresponds to the height of the protrusion 101 to be measured.

[0156] refer to Figure 3 In this embodiment, the imaging spot of the incident light passing through point Q is a diffuse spot. That is to say, point Q cannot be clearly imaged at point Q', but a diffuse spot is formed at point Q'. Therefore, the diffuse spot is processed by the processing module 900 to obtain the clear position of point Q', and the heights of the convex points 101a and 101b to be measured are obtained based on the clear positions of points P' and Q'.

[0157] Specifically, in this embodiment, the processing module 900 is used to extract the center of the imaging spot to obtain the center of the imaging spot, and the center of the imaging spot is the position of the imaging point.

[0158] In this embodiment, the center of the diffuse spot is extracted to obtain the clear location of the center of the diffuse spot, which is the Q' point.

[0159] Specifically, in this embodiment, based on the triangulation method, each position on the target surface 80 of the image acquisition component 810 is fixed in height. That is, on the target surface 80, each imaging position corresponds to the height of the target to be measured. Accordingly, in this embodiment, the target to be measured is imaged on the target surface 80 by the probe light. Based on the position of the imaging point of the target to be measured, the height of the corresponding point of the target to be measured can be obtained.

[0160] In this embodiment, as Figure 4 As shown, each linear light spot 800s spans the surface around the bottom of the convex point 101 to be tested. Therefore, in this embodiment, there is no need to set a reference surface. Instead, the height difference between the points on the convex point 101 and the points on the surface around the bottom of the convex point 101 can be obtained by the position difference of the imaging points. This helps to reduce the detection error caused by the unevenness of the reference surface itself, and thus helps to obtain the height information of the convex point 101 more accurately.

[0161] The probe light reflected from points P and Q forms different imaging points in the imaging module. Therefore, the position of the imaging point corresponds to the height information of the convex point 101 to be measured.

[0162] Specifically, in this embodiment, the illumination module, the object under test, and the imaging module form a triangle, so that the height of the convex point 101 under test can be obtained by triangulation based on the position of the imaging point.

[0163] In this embodiment, the detection system further includes a second detection module (not shown), used to pre-scan the object to be tested, obtain the center position of the target, and obtain the test area 810c based on the center position, wherein the test area 810c contains the center position.

[0164] In this embodiment, the target to be tested is the convex point 101 to be tested. The test area 810c of the target to be tested is the area where the maximum height of the convex point 101 to be tested is located. The test area 810c of the target to be tested is the area used to obtain the height of the convex point 101 to be tested.

[0165] In this embodiment, the processing module is used to process the imaging spot of the test area 810c of the target under test to obtain the position of the imaging point of the test area 810c.

[0166] In this embodiment, the imaging spot of the test area 810c of the target to be tested is processed, which reduces the range of the imaging spot that needs to be processed. This helps to reduce the amount of processing required by the processing module 900 to process the imaging spot, thereby saving computing power and increasing the detection output of the detection system.

[0167] Specifically, as an example, the second detection module is an imaging device used to obtain an image of the object to be tested and to obtain the center position of the target object based on the image of the object to be tested.

[0168] It should be noted that in this embodiment, when the pre-scanning accuracy of the object under test is high and the test area 810c is the center position, the imaging spot of the center position of the target under test in the imaging module is an imaging point. Then the processing module 900 is used to process the imaging spot of the center position of the target under test to directly obtain the position of the imaging point of the center position of the target under test. In other words, the position of the imaging point can be obtained directly without using an algorithm for center extraction, and the height of the target under test along the direction perpendicular to the surface of the object under test can be obtained based on the position of the imaging point of the target under test.

[0169] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A detection method for detecting a target on an object to be tested, characterized in that, include: The object to be tested is pre-scanned using the second detection module to obtain the center position of the target object; The test area is obtained based on the center position of the object, and the test area includes the center position of the target object; the test area is a circular region with the center position of the object and a preset radius; the projection of the target object onto the surface of the object is circular; the radius of the test area is less than or equal to 1 / 10 of the radius of the target object; the object to be tested includes a wafer, and the target object includes a bump to be tested; The first detection module performs a first detection on the target to be tested to obtain the height of the target to be tested along a direction perpendicular to the surface of the object to be tested. The first detection module includes an image acquisition unit. The first detection includes: imaging the target under test using a first detection module to obtain the position of the imaging spot of the test area of ​​the target under test on the target surface of the image acquisition device; and obtaining the height of the target under test along the direction perpendicular to the surface of the test object based on the spot position. The method of obtaining the height of the target under test along the direction perpendicular to the surface of the object under test based on the position of the light spot includes: each imaging position on the target surface of the image acquisition device corresponds to the height of the target under test; the height difference between the imaging points on the convex point under test and the points on the surface around the bottom of the convex point under test is obtained by the position difference between the imaging points; and the height of the convex point under test is obtained accordingly.

2. The detection method as described in claim 1, characterized in that, Imaging the target under test using the first detection module includes: generating incident light focused onto the object under test by the first detection module, the incident light illuminating the object under test to generate an illumination spot, and the incident light being reflected by the object under test to form a probe light; The image acquisition device collects at least a portion of the detection light and obtains imaging information of the target under test based on the collected detection light. The imaging information includes the position of the imaging spot of the target under test area.

3. The detection method as described in claim 2, characterized in that, The incident angle of the incident light is less than 45 degrees or greater than 45 degrees.

4. The detection method as described in claim 1, characterized in that, Obtaining the position of the imaging spot of the test area of ​​the target under test on the target surface of the image acquisition device includes: extracting the center of the imaging spot to obtain the center of the imaging spot, and using the center of the imaging spot as the image center position; Obtaining the height of the target under test along a direction perpendicular to the surface of the object under test based on the position of the light spot includes: obtaining the height of the target under test based on the position of the image center.

5. The detection method as described in claim 4, characterized in that, Methods for extracting the center of the imaging spot include gray-scale centroid method, quadratic curve fitting vertex method, Gaussian curve fitting vertex method, centroid method, or maximum value position method.

6. The detection method as described in claim 1, characterized in that, The second detection module is an imaging device; Pre-scanning the object to be tested includes: imaging the object to be tested using the second detection module to obtain an image of the object to be tested, and obtaining the center position of the target object based on the image of the object to be tested.

7. The detection method as described in claim 1, characterized in that, After obtaining the test area of ​​the target to be tested, before performing the first detection on the target to be tested by the first detection module, the method further includes: focusing the center of the target to be tested according to the object center position of the target to be tested.

8. The detection method as described in claim 1, characterized in that, The test area of ​​the target to be tested is obtained in the position of the imaging spot on the target surface of the image acquisition device, and one test area corresponds to multiple imaging spots; The height of the target under test along the direction perpendicular to the surface of the object under test is obtained from the position of the light spot, and the average value of the heights of the target under test obtained from multiple imaging light spots is taken as the height of the test area of ​​the target under test.

9. The detection method as described in claim 2, characterized in that, The incident light shines on the object under test to generate an illumination spot, and the illumination spot is linear. Collecting at least a portion of the probe light by the image acquisition device includes: translating the linear light spot relative to the object under test along the scanning direction by a preset step size along the surface direction of the object under test, and scanning the object under test, wherein the scanning direction is perpendicular to the length direction of the linear light spot; During the scanning process of the object to be tested, the preset step size is less than or equal to the width of the linear light spot.

10. A detection system for performing the detection method according to any one of claims 1 to 9, characterized in that, The detection system is used to detect targets on an object to be tested, and includes: The first detection module includes an illumination module, an imaging module, and a processing module, wherein... The illumination module is used to generate incident light that illuminates the object under test. The incident light illuminates the object under test to generate an illumination spot. The incident light is reflected by the object under test to form a probe light. The imaging module includes an image acquisition component, which is used to receive probe light and obtain imaging information of the target under test based on the probe light. The imaging information includes the imaging spot formed by the target under test in the image acquisition component. The processing module is used to process the imaging information to obtain the position of the imaging point of the target under test, and to obtain the height of the target under test along the direction perpendicular to the surface of the object under test based on the position of the imaging point of the target under test.

11. The detection system as described in claim 10, characterized in that, The processing module is used to extract the center of the imaging spot to obtain the center of the imaging spot, and the center of the imaging spot is the position of the imaging point.

12. The detection system as described in claim 10, characterized in that, The incident angle of the incident light is less than 45 degrees or greater than 45 degrees; The image acquisition component includes a target surface for receiving the probe light, and the target surface of the image acquisition component is perpendicular to the incident direction of the received probe light.

13. The detection system as described in claim 10, characterized in that, The detection system further includes: a second detection module, used to pre-scan the object to be tested, obtain the center position of the target to be tested, and obtain the test area based on the center position, wherein the test area includes the center position; The processing module is used to process the imaging spot of the test area of ​​the target to obtain the position of the imaging point of the test area.

14. The detection system as described in claim 13, characterized in that, The second detection module is also used to obtain an image of the object to be tested, and to obtain the center position of the target object based on the image of the object to be tested; The processing module is used to process the imaging spot at the center of the target under test to obtain the position of the imaging point at the center of the target under test.

15. The detection system as described in claim 10, characterized in that, The number of image acquisition components is multiple; The imaging module includes a beam splitter, which is used to transmit the received probe light along multiple different optical path directions and project the probe light transmitted along multiple different optical path directions into the image acquisition component respectively.

16. The detection system as described in claim 10, characterized in that, The illumination module includes a light source assembly, a first slit element, and a first mirror group arranged sequentially along the optical path transmission direction. The light source assembly is used to generate a light beam, the first slit element is used to allow the light beam to pass through and generate linear incident light, and the first mirror group is used to focus the linear incident light onto the object under test to generate a linear light spot.

17. The detection system as described in claim 16, characterized in that, The light source assembly includes: a light source and a shaping element. The shaping element is used to shape the light emitted by the light source to produce a linear beam. The shaping element includes: an optical fiber bundle. The shape of the entrance port of the optical fiber bundle matches the shape of the light spot emitted by the light source, and the optical fibers at the exit port of the optical fiber bundle are arranged in a straight line.

Images