Hybrid thermal management system and method

Abstract

The application discloses a hybrid heat management system and method, and relates to the heat management field, and the system comprises a thermoelectric cooler, a magnetocaloric unit and a heat management power supply; the magnetocaloric unit is arranged on the surface of a temperature-controlled device, the thermoelectric cooler is arranged outside the magnetocaloric unit, the first side of the thermoelectric cooler is in contact with the surface of the magnetocaloric unit, the second side of the thermoelectric cooler is in contact with air, and the heat management power supply is electrically connected with the thermoelectric cooler and the magnetocaloric unit respectively; when dissipating heat, the magnetocaloric unit generates a diamagnetic heat effect to absorb the heat of the surface of the temperature-controlled device and generate electricity, the heat management power supply outputs a positive forced direct current to the thermoelectric cooler, and the thermoelectric cooler is controlled to dissipate heat; when heating, the magnetocaloric unit generates a paramagnetic heat effect to heat the surface of the temperature-controlled device, the heat management power supply outputs a reverse forced direct current to the thermoelectric cooler, and the thermoelectric cooler is controlled to heat; through the cooperation of the magnetocaloric unit and the thermoelectric cooler, the temperature control efficiency of the system can be improved, and the energy consumption can be reduced.

Description

Technical Field

[0001] This invention relates to the field of thermal management, and in particular to a hybrid thermal management system and method. Background Technology

[0002] Currently, in the application of thermal management materials, materials such as copper foil and graphene with high thermal conductivity can be added inside equipment or on the surface of heat sinks to improve the thermal conductivity of the equipment and thus achieve better heat dissipation. However, the thermal conductivity of thermal management materials is generally lower than that of metals, so their thermal conductivity is limited. Increased material thickness and area are needed to achieve a certain heat dissipation effect, resulting in relatively low thermal conductivity efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide a hybrid thermal management system and method that improves the system's temperature control efficiency and reduces energy consumption.

[0004] To achieve the above objectives, the present invention provides the following solution:

[0005] A hybrid thermal management system, the system comprising: a thermoelectric cooler, a magnetocaloric unit, and a thermal management power supply;

[0006] The magnetocaloric unit is disposed on the surface of the device to be temperature controlled, and the thermoelectric cooler is disposed on the outside of the magnetocaloric unit. The first side of the thermoelectric cooler is in contact with the surface of the magnetocaloric unit, and the second side of the thermoelectric cooler is in contact with the air. The thermal management power supply is electrically connected to the thermoelectric cooler and the magnetocaloric unit respectively.

[0007] When the temperature of the device to be controlled exceeds the first threshold, the magnetocaloric unit is used to generate a reverse magnetocaloric effect to absorb heat from the surface of the device to be controlled and generate electricity, which is then transmitted to the thermal management power supply.

[0008] The thermal management power supply is used to output a positive forced DC current to the thermoelectric cooler;

[0009] The thermoelectric cooler is used to transfer heat from the first side to the second side to dissipate heat from the temperature-controlled device under the action of the positive forced direct current.

[0010] When the temperature of the device to be controlled is less than the second threshold, the magnetocaloric unit is used to generate a positive magnetocaloric effect to heat the surface of the device to be controlled.

[0011] The thermal management power supply is used to output reverse forced DC current to the thermoelectric cooler;

[0012] The thermoelectric cooler is used to transfer heat from the second side to the first side to heat the temperature-controlled device under the action of the reverse forced direct current.

[0013] The first threshold is greater than the second threshold.

[0014] Optionally, the system further includes: a temperature sensor and a thermal management controller;

[0015] The temperature sensor is installed on the device to be temperature controlled and is connected to the thermal management controller. The temperature sensor is used to detect the temperature of the device to be temperature controlled and send the temperature of the device to be temperature controlled to the thermal management controller.

[0016] The thermal management controller is connected to the thermal management power supply. The thermal management controller is used to compare the temperature value of the device to be controlled with the first threshold and the second threshold. When the temperature value of the device to be controlled is greater than the first threshold, the thermal management power supply is controlled to output a positive forced DC current to control the magnetic thermal unit to generate a reverse magnetic thermal effect. When the temperature value of the device to be controlled is less than the second threshold, the thermal management power supply is controlled to output a reverse forced DC current to control the magnetic thermal unit to generate a positive magnetic thermal effect.

[0017] Optionally, the system further includes a heat sink disposed on the second side.

[0018] Optionally, the radiator may be a fan-type radiator, a water-cooled radiator, or a heat pipe radiator.

[0019] Optionally, the thermoelectric cooler specifically includes a thermoelectric chip, electrodes, and a thermally conductive silicone grease layer;

[0020] The thermoelectric chip is connected to the electrode, and the thermally conductive silicone grease layer is disposed on the first side.

[0021] Optionally, the magnetocaloric unit specifically includes: a magnetic field source, a magnetocaloric material layer, and two thermally conductive silicone layers;

[0022] Two thermally conductive silicone layers are respectively disposed on two sides of the magnetocaloric material layer, which is disposed within the magnetic field source.

[0023] A hybrid thermal management method, applied to the hybrid thermal management system described above, the method comprising:

[0024] When the temperature of the device to be controlled exceeds the first threshold, the magnetocaloric unit generates a reverse magnetocaloric effect to absorb the heat on the surface of the device and generate electricity.

[0025] The thermal management power supply outputs a positive forced DC current to the thermoelectric cooler;

[0026] The thermoelectric cooler, under the action of the positive forced direct current, transfers heat from the first side to the second side to dissipate heat from the temperature-controlled device.

[0027] When the temperature of the device to be controlled is lower than the second threshold, the surface of the device to be controlled is heated by the positive magnetocaloric effect generated by the magnetocaloric unit.

[0028] The thermal management power supply outputs a reverse forced DC current to the thermoelectric cooler;

[0029] The thermoelectric cooler, under the action of the reverse forced direct current, transfers heat from the second side to the first side to heat the temperature-controlled equipment.

[0030] According to specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0031] This invention places a magnetocaloric unit on the surface of the device to be temperature-controlled, and a thermoelectric cooler on the outside of the magnetocaloric unit. The first side of the thermoelectric cooler contacts the surface of the magnetocaloric unit, and the second side contacts the air. A thermal management power supply is electrically connected to both the thermoelectric cooler and the magnetocaloric unit. During heat dissipation, the magnetocaloric unit generates a reverse magnetocaloric effect to absorb heat from the surface of the device and generates electricity. The thermal management power supply outputs a positive forced DC current to the thermoelectric cooler to control its heat dissipation. During heating, the magnetocaloric unit generates a positive magnetocaloric effect to heat the surface of the device. The thermal management power supply outputs a reverse forced DC current to the thermoelectric cooler to control its heating. Through the combined action of the magnetocaloric unit and the thermoelectric cooler, the system's temperature control efficiency is improved, and energy consumption is reduced. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A flowchart of a hybrid thermal management system provided in an embodiment of the present invention;

[0034] Figure 2 This is a diagram showing the equipment connection relationship of a hybrid thermal management system provided in an embodiment of the present invention.

[0035] Symbol explanation:

[0036] Thermoelectric cooler-1, magnetocaloric unit-2, thermal management power supply-3, temperature sensor-4, thermal management controller-5, radiator-6. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] The purpose of this invention is to provide a hybrid thermal management system and method that improves the temperature control efficiency and reduces energy consumption through the combined action of a magnetocaloric unit and a thermoelectric cooler.

[0039] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] Example 1

[0041] like Figures 1-2 As shown, this embodiment is a hybrid thermal management system, including: a thermoelectric cooler 1, a magnetocaloric unit 2, and a thermal management power supply 3.

[0042] The magnetic heating unit 2 is disposed on the surface of the device to be temperature controlled, and the thermoelectric cooler 1 is disposed on the outside of the magnetic heating unit 2. The first side of the thermoelectric cooler 1 is in contact with the surface of the magnetic heating unit 2, and the second side of the thermoelectric cooler 1 is in contact with the air. The thermal management power supply is electrically connected to the thermoelectric cooler 1 and the magnetic heating unit 2 respectively. The basic principle of the thermoelectric cooler 1 is to use a thermocouple formed at the contact point of two different materials to transfer heat from one side of the thermoelectric cooler 1 to the other side through the action of forced direct current. When the device to be temperature controlled needs to dissipate heat, the first side will cool down, while the heat will move to the second side, and the second side will heat up and dissipate heat. When the current is reversed, the first side heats up, while the second side cools down and absorbs heat, thus achieving the effect of cooling or heating the device to be controlled. The thermoelectric cooler 1 specifically includes a thermoelectric chip, electrodes, and a thermally conductive silicone grease layer. The thermoelectric chip is connected to the electrodes, and the thermally conductive silicone grease layer is located on the first side. The magnetocaloric unit 2 further adjusts the temperature of the device to be controlled through positive and negative magnetocaloric effects. At the same time, by adjusting the magnetic field strength and direction of the magnetocaloric unit 2, the temperature and heat output of the magnetocaloric unit 2 can be controlled, thereby achieving more precise temperature regulation. The magnetocaloric unit 2 specifically includes a magnetic field source, a magnetocaloric material layer, and two thermally conductive silicone layers. The two thermally conductive silicone layers are respectively located on the two sides of the magnetocaloric material layer, and the magnetocaloric material layer is located inside the magnetic field source.

[0043] When the temperature of the device to be controlled exceeds the first threshold, the magnetic thermal unit 2 is used to generate a reverse magnetic thermal effect to absorb the heat on the surface of the device to be controlled and generate electricity, which is then transmitted to the thermal management power supply 3.

[0044] Thermal management power supply 3 is used to output positive forced DC current to thermoelectric cooler 1.

[0045] The thermoelectric cooler 1 is used to transfer heat from the first side to the second side to dissipate heat from the temperature-controlled equipment under the action of a positive forced direct current.

[0046] When the temperature of the device to be controlled is less than the second threshold, the magnetic thermal unit 2 is used to generate a positive magnetic thermal effect to heat the surface of the device to be controlled.

[0047] Thermal management power supply 3 is used to output reverse forced DC current to thermoelectric cooler 1.

[0048] The thermoelectric cooler 1 is used to transfer heat from the second side to the first side to heat the temperature-controlled equipment under the action of reverse forced direct current.

[0049] The first threshold is greater than the second threshold.

[0050] As an optional implementation, the system also includes a temperature sensor 4 and a thermal management controller 5.

[0051] Temperature sensor 4 is installed on the device to be temperature controlled. Temperature sensor 4 is connected to thermal management controller 5. Temperature sensor 4 is used to detect the temperature of the device to be temperature controlled and send the temperature of the device to be temperature controlled to thermal management controller 5.

[0052] The thermal management controller 5 is connected to the thermal management power supply 3. The thermal management controller 5 compares the temperature value of the device to be controlled with a first threshold and a second threshold. When the temperature value is greater than the first threshold, it controls the thermal management power supply 3 to output a positive forced DC current, controlling the magnetic heating unit 2 to generate a reverse magnetic heating effect. When the temperature value is less than the second threshold, it controls the thermal management power supply 3 to output a reverse forced DC current, controlling the magnetic heating unit 2 to generate a positive magnetic heating effect. The thermal management controller 5 controls the output of the thermal management power supply 3 based on the monitored data, thereby adjusting the cooling and heating effects of the thermoelectric cooler 1 and the magnetic heating unit 2. The thermal management controller 5 includes devices such as an MCU, a power module, and a control module. The thermal management controller 5 can control the heating and heat dissipation power of the magnetic heating unit 2 and the thermoelectric cooler 1 according to the temperature. The thermal management controller 5 can control the thermoelectric cooler 1 by controlling the direction and magnitude of the current, generating a thermoelectric potential through the Poisson effect, thereby achieving heat transfer, and conducting the heat to the outside of the system through thermally conductive silicone. The thermal management controller 5 can control the direction and magnitude of the magnetic field by changing the direction and magnitude of the current flowing through the magnetic field source, so that the magnetocaloric material can generate a magnetocaloric effect or a reverse magnetocaloric effect under the action of the magnetic field, thereby controlling the magnetocaloric unit 2 to achieve cooling or heating, and conducting the heat to the outside of the system through thermally conductive silicone.

[0053] As an optional implementation, the system also includes a radiator 6, which is disposed on the second side. The radiator 6 can be a fan-type radiator, a water-cooled radiator, or a heat pipe radiator. The radiator 6 is used to transfer the heat absorbed by the magnetocaloric unit 2 and the thermoelectric cooler 1 to the external environment, ensuring the stable and reliable operation of the system.

[0054] The working process of the hybrid thermal management system is as follows:

[0055] First, check the temperature of the equipment.

[0056] The next step is to determine whether the temperature of the equipment to be controlled is too high or too low.

[0057] Then, when the temperature of the device to be controlled is too high, the magnetic heating unit 2 is adjusted to generate a reverse magnetic heating effect and a positive DC current is applied to the thermoelectric cooler 1 for heat dissipation; when the temperature of the device to be controlled is too low, the magnetic heating unit 2 is adjusted to generate a positive magnetic heating effect and a reverse DC current is applied to the thermoelectric cooler 1 for heating.

[0058] Finally, adjust the power of the magnetic heating unit 2 and the thermoelectric cooler 1 according to the detected temperature to control the equipment temperature within its normal operating temperature range (the setting varies depending on the normal operating temperature range of the equipment).

[0059] Existing heat dissipation and temperature control technologies have various shortcomings. For example, temperature control systems rely on built-in temperature sensors to monitor the device temperature in real time and transmit this information to a controller. The controller then adjusts the device's power and cooling fan speed based on the temperature information to achieve optimal thermal management. However, the control precision of temperature control systems is limited, making precise temperature control impossible. In some applications, such as those operating in high or low temperature environments, higher control precision is required to ensure device safety and performance stability. For instance, thermal enclosure technology seals the heat sink and device together to form a thermal enclosure. A thermally conductive medium transfers heat generated inside the device to the heat sink surface, where it is then dissipated through natural or forced air convection for optimal heat dissipation. The effectiveness of thermal enclosures depends heavily on ambient temperature and airflow. High ambient temperatures or poor airflow can negatively impact heat dissipation, affecting device lifespan and performance. Furthermore, the heat dissipation effect of thermal enclosures may be uneven, leading to uneven internal temperature distribution and further impacting device lifespan and performance. For example, liquid cooling systems utilize a liquid cooling medium circulating through internal pipes to remove heat generated by the equipment, which is then transferred to the external environment via a heat exchanger. Liquid cooling systems require components such as water pumps, coolers, pipes, and coolant, involving numerous parts and presenting significant installation and maintenance challenges. They also require considerable space, impacting the overall size and weight of the equipment, making them unsuitable for applications with strict size and weight constraints. Meanwhile, magnetic control cooling, which regulates temperature by controlling the magnitude and direction of the magnetic field, generates additional electrical energy, resulting in energy waste. Therefore, combining magnetic control technology with thermal management cooling technology allows the generated electrical energy to be used by the thermal management material for further heat dissipation, thereby improving system cooling efficiency. This invention, through the combined action of a magnetic thermal unit and a thermoelectric cooler, improves system temperature control efficiency and reduces energy consumption.

[0060] Example 2

[0061] This embodiment also provides a hybrid thermal management method, which is applied to the above-mentioned hybrid thermal management system, and includes:

[0062] When the temperature of the device to be controlled exceeds the first threshold, the magnetothermal unit 2 generates a reverse magnetothermal effect to absorb the heat on the surface of the device and generate electricity.

[0063] The thermal management power supply 3 outputs a positive forced DC current to the thermoelectric cooler 1.

[0064] Thermoelectric cooler 1 transfers heat from the first side to the second side to dissipate heat from the temperature-controlled equipment under the action of a positive forced direct current.

[0065] When the temperature of the device to be controlled is lower than the second threshold, the surface of the device to be controlled is heated by the positive magnetocaloric effect generated by the magnetocaloric unit 2.

[0066] The thermal management power supply 3 outputs reverse forced DC current to the thermoelectric cooler 1.

[0067] Thermoelectric cooler 1 heats the equipment to be controlled by transferring heat from the second side to the first side under the action of reverse forced direct current.

[0068] This invention relates to the field of thermal management. Since the equipment to be temperature controlled generates a certain amount of heat during use, if it cannot dissipate heat in time, the temperature of the equipment will rise, affecting the life and safety performance of the equipment. This invention combines a thermoelectric cooler and a magnetocaloric material to achieve more efficient heat dissipation and temperature control.

[0069] The technical effects of this invention are as follows:

[0070] This invention improves the temperature control efficiency and reduces energy consumption by combining a magnetocaloric unit and a thermoelectric cooler. In this invention, the magnetocaloric material can convert heat into electrical energy using the antimagnetic-thermal effect, thereby improving the efficiency of the thermoelectric cooler. Simultaneously, the thermoelectric cooler can convert electrical energy into cooling energy using the thermoelectric effect, transferring heat from one side to the other, making heat dissipation more efficient. The magnetocaloric material can absorb or release heat under the influence of an external magnetic field; therefore, combining them effectively reduces the system's energy consumption, thereby improving the performance and stability of the temperature-controlled equipment.

[0071] The hybrid thermal management system provided by this invention improves cooling efficiency, reduces energy consumption, increases system stability, and expands the scope of application compared to similar products, thereby meeting the needs of more diverse fields. This invention combines a thermoelectric cooler and a magnetocaloric material to reduce power consumption and noise, extend equipment lifespan, and solves the problems of low efficiency and heat dissipation associated with thermoelectric coolers. Furthermore, it increases system stability by adjusting the magnetic field of the magnetocaloric material through a current control system within the thermoelectric cooler.

[0072] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple; relevant parts can be referred to the method section.

[0073] This document uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A hybrid thermal management system, characterized in that, The system includes: a thermoelectric cooler, a magnetocaloric unit, and a thermal management power supply; The magnetocaloric unit is disposed on the surface of the device to be temperature controlled, and the thermoelectric cooler is disposed on the outside of the magnetocaloric unit. The first side of the thermoelectric cooler is in contact with the surface of the magnetocaloric unit, and the second side of the thermoelectric cooler is in contact with the air. The thermal management power supply is electrically connected to the thermoelectric cooler and the magnetocaloric unit respectively. When the temperature of the device to be controlled exceeds the first threshold, the magnetocaloric unit is used to generate a reverse magnetocaloric effect to absorb heat from the surface of the device to be controlled and generate electricity, which is then transmitted to the thermal management power supply. The thermal management power supply is used to output a positive forced DC current to the thermoelectric cooler; The thermoelectric cooler is used to transfer heat from the first side to the second side to dissipate heat from the temperature-controlled device under the action of the positive forced direct current. When the temperature of the device to be controlled is less than the second threshold, the magnetocaloric unit is used to generate a positive magnetocaloric effect to heat the surface of the device to be controlled. The thermal management power supply is used to output reverse forced DC current to the thermoelectric cooler; The thermoelectric cooler is used to transfer heat from the second side to the first side to heat the temperature-controlled device under the action of the reverse forced direct current. The first threshold is greater than the second threshold; The system also includes: a temperature sensor and a thermal management controller; The temperature sensor is installed on the device to be temperature controlled and is connected to the thermal management controller. The temperature sensor is used to detect the temperature of the device to be temperature controlled and send the temperature of the device to be temperature controlled to the thermal management controller. The thermal management controller is connected to the thermal management power supply. The thermal management controller is used to compare the temperature value of the device to be controlled with the first threshold and the second threshold. When the temperature value of the device to be controlled is greater than the first threshold, the thermal management power supply is controlled to output a positive forced DC current to control the magnetic thermal unit to generate a reverse magnetic thermal effect. When the temperature value of the device to be controlled is less than the second threshold, the thermal management power supply is controlled to output a reverse forced DC current to control the magnetic thermal unit to generate a positive magnetic thermal effect. The thermoelectric cooler specifically includes a thermoelectric chip, electrodes, and a thermally conductive silicone grease layer; The thermoelectric chip is connected to the electrode, and the thermally conductive silicone grease layer is disposed on the first side. The magnetocaloric unit specifically includes: a magnetic field source, a magnetocaloric material layer, and two thermally conductive silicone layers; Two thermally conductive silicone layers are respectively disposed on two sides of the magnetocaloric material layer, which is disposed within the magnetic field source.

2. The hybrid thermal management system according to claim 1, characterized in that, The system also includes a heat sink disposed on the second side.

3. A hybrid thermal management system according to claim 2, characterized in that, The radiator is a fan-type radiator, a water-cooled radiator, or a heat pipe radiator.

4. A hybrid thermal management method, characterized in that, The method is applied to the hybrid thermal management system according to any one of claims 1-3, and the method includes: When the temperature of the device to be controlled exceeds the first threshold, the magnetocaloric unit generates a reverse magnetocaloric effect to absorb the heat on the surface of the device and generate electricity. The thermal management power supply outputs a positive forced DC current to the thermoelectric cooler; The thermoelectric cooler, under the action of the positive forced direct current, transfers heat from the first side to the second side to dissipate heat from the temperature-controlled device. When the temperature of the device to be controlled is lower than the second threshold, the surface of the device to be controlled is heated by the positive magnetocaloric effect generated by the magnetocaloric unit. The thermal management power supply outputs a reverse forced DC current to the thermoelectric cooler; The thermoelectric cooler, under the action of the reverse forced direct current, transfers heat from the second side to the first side to heat the temperature-controlled equipment.

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