A control circuit, a temperature control function board, and a control system

Abstract

This application discloses a control circuit, a temperature control function board, and a control system. The control circuit includes a front-end module, a microcontroller module, and a conversion module. The front-end module receives a current detection signal from an external detection circuit and generates a voltage signal based on the current detection signal. The microcontroller module is connected to both the front-end module and the conversion module, and receives the voltage signal from the front-end module to generate serial peripheral interface data based on the voltage signal, and sends the serial peripheral interface data to the conversion module. The conversion module converts the serial peripheral interface data into controller local area network (CLAN) bus data and sends the CLAN bus data to the host computer, enabling the host computer to manage current based on the CLAN bus data.

Description

Technical Field

[0001] This application relates to the field of electronics, and more particularly to a control circuit, a temperature control function board, and a control system. Background Technology

[0002] With the continuous development of technology, various electrical and electronic devices have been widely used. Among them, reflow soldering heating equipment plays an important role in production and daily life. In existing reflow soldering heating equipment, the control of each heating temperature zone is generally accomplished through a separate integrated temperature controller. One temperature controller corresponds to one temperature zone. The temperature of the temperature zone is controlled by receiving the set temperature command sent from the main control PLC communication port.

[0003] However, existing solutions can only control the temperature of the heating zone, without designing for the current of the heating wire. They cannot manage the current of the heating wire in each zone, thus failing to achieve overall management of the total operating current during the heating process, causing some inconvenience to users. Summary of the Invention

[0004] This application provides a control circuit, a temperature control function board, and a control system.

[0005] A control circuit includes: a preamplifier module, a microcontroller module, and a conversion module;

[0006] The front-end module is used to receive the current detection signal sent by the external detection circuit and generate a voltage signal based on the current detection signal.

[0007] The microcontroller module is connected to the front-end module and the conversion module respectively, and is used to receive the voltage signal sent by the front-end module, generate serial peripheral interface data according to the voltage signal, and send the serial peripheral interface data to the conversion module.

[0008] The conversion module is used to convert the serial peripheral interface data into controller local area network (CLAN) bus data, and send the CLAN bus data to the host via the CLAN bus, so that the host can perform current management based on the CLAN bus data.

[0009] Optionally, the front-end module includes: a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, a first capacitor, a second capacitor, a third capacitor, a first diode, a second diode, and a first chip;

[0010] One end of the first resistor is connected to the microcontroller module, and the other end is connected to the first terminal of the first chip and one end of the second resistor. The other end of the second resistor is connected to the cathode of the second diode, one end of the seventh resistor, and the I3+ terminal. The anode of the second diode, one end of the sixth resistor, and the other end of the seventh resistor are grounded. The third terminal of the first chip is connected to the other end of the sixth resistor and one end of the fifth resistor. The other end of the fifth resistor and one end of the fourth resistor are connected to the fourth terminal of the first chip. The anode of the first diode is connected to the other end of the fourth resistor. The cathode of the first diode, one end of the third capacitor, and one end of the third resistor are connected to the microcontroller module. The other end of the third resistor, the other end of the third capacitor, one end of the first capacitor, and one end of the second capacitor are grounded. The other end of the first capacitor, the other end of the second capacitor, and the fifth terminal of the first chip are connected to the VCC terminal. The second terminal of the first chip is grounded.

[0011] Optionally, the first chip is an LM321 chip.

[0012] Optionally, the microcontroller module includes a second chip, which is an STC8H8K64U microcontroller.

[0013] Optionally, the conversion module includes: an eighth resistor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, a first crystal oscillator, and a third chip;

[0014] One end of the fourth capacitor is grounded, and the other end is connected to the VCC terminal, the eighteenth terminal of the third chip, and one end of the eighth resistor. The other end of the eighth resistor is connected to the seventeenth terminal of the third chip and one end of the seventh capacitor. The other end of the seventh capacitor and the ninth terminal of the third chip are both grounded. The first terminal of the first crystal oscillator is connected to the seventh terminal of the third chip. The second and fourth terminals of the first crystal oscillator are grounded. The third terminal of the first crystal oscillator is connected to the eighth terminal of the third chip. The fifth capacitor is connected in parallel between the first and second terminals of the first crystal oscillator. The sixth capacitor is connected in parallel between the second and third terminals of the first crystal oscillator. The first and second terminals of the third chip are connected to the controller local area network bus. The twelfth, thirteenth, fourteenth, fifteenth, and sixteenth terminals of the third chip are all connected to the microcontroller module.

[0015] Optionally, the third chip is an MCP2515 chip.

[0016] A temperature control board includes the control circuit described above.

[0017] A control system includes a temperature control function board as described above, and also includes a detection circuit, a heating wire, a controller local area network bus, and a host.

[0018] The detection circuit is connected to the heating wire and the temperature control board respectively, so as to detect the current of the heating wire and input a current detection signal to the temperature control board.

[0019] The function control board is used to generate controller local area network bus data based on the current detection signal, and then transmit the controller local area network bus data to the host through the controller local area network bus.

[0020] As can be seen from the above technical solutions, the embodiments of this application have the following advantages:

[0021] An external detection circuit detects the current in the heating wire and sends it to the front-end module. The front-end module generates a voltage signal based on the current detection signal. The microcontroller module then generates serial peripheral interface data based on the voltage signal and sends this data to the conversion module. The conversion module converts the serial peripheral interface data into CAN bus data and sends it to the host computer via the CAN bus. This allows the host computer to manage the current based on the CAN bus data. By detecting the current in the heating wire and converting the current detection signal into CAN bus data (i.e., CAN bus data), which is then sent to the host computer for unified management, this system provides convenience for the user. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of one embodiment of the control circuit of this application;

[0023] Figure 2 This is a system framework diagram of this application;

[0024] Figure 3 This is a structural diagram of the front-end module of this application;

[0025] Figure 4 This is a structural diagram of the microcontroller module of this application;

[0026] Figure 5 This is a structural diagram of the conversion module in this application;

[0027] Figure 6 This is a schematic diagram of the internal workings of the third chip in this application. Detailed Implementation

[0028] This application provides a control circuit, a temperature control function board, and a control system.

[0029] Existing solutions lack design considerations for the current flowing through the heating element, hindering comprehensive current management. To address this issue, this application provides a control circuit, a temperature control board, and a control system to achieve comprehensive current management.

[0030] The control circuit, temperature control board, and control system of this application are described below. Please refer to [link / reference needed]. Figure 1 One embodiment of the control circuit of this application includes: a pre-amplifier module, a microcontroller module, and a conversion module;

[0031] The front-end module is used to receive the current detection signal sent by the external detection circuit and generate a voltage signal based on the current detection signal;

[0032] The microcontroller module is connected to the preamplifier module and the conversion module respectively. It is used to receive the voltage signal sent by the preamplifier module, generate serial peripheral interface data according to the voltage signal, and send the serial peripheral interface data to the conversion module.

[0033] The conversion module is used to convert serial peripheral interface data into controller LAN bus data, and send the controller LAN bus data to the host through the controller LAN bus, so that the host can perform current management based on the controller LAN bus data.

[0034] In this embodiment, the external detection circuit detects the current of the heating wire and sends it to the front-end module. The front-end module generates a voltage signal based on the current detection signal. The microcontroller module generates serial peripheral interface data based on the voltage signal and sends the serial peripheral interface data to the conversion module. The conversion module then converts the serial peripheral interface data into CAN bus data and sends the CAN bus data to the host, enabling the host to manage the current based on the CAN bus data. By detecting the current of the heating wire and converting the current detection signal into CAN bus data (i.e., CAN bus data), and sending it to the host via the CAN bus for unified management, this provides convenience for the user.

[0035] Please see Figure 2 The control system of this application includes a temperature control function board, a detection circuit, a heating wire, a controller area network CAN bus, and a host.

[0036] The detection circuit is connected to the heating wire and the temperature control board respectively, so as to detect the current of the heating wire and then input the current detection signal to the temperature control board.

[0037] The function control board is used to generate controller area network bus data based on the current detection signal, and then transmit the controller area network bus data to the host via the CAN bus so that the host can perform overall current management.

[0038] The temperature control function board includes the aforementioned control circuit, which includes a pre-amplifier module, a microcontroller module, and a conversion module.

[0039] Please see Figure 3 The front-end module includes: a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, a first capacitor C1, a second capacitor C2, a third capacitor C3, a first diode D1, a second diode D2, and a first chip U1.

[0040] One end of the first resistor R1 is connected to the microcontroller module, and the other end is connected to the first terminal of the first chip U1 and one end of the second resistor R2. The other end of the second resistor R2 is connected to the cathode of the second diode D2, one end of the seventh resistor R7, and the I3+ terminal. The anode of the second diode D2, one end of the sixth resistor R6, and the other end of the seventh resistor R7 are grounded. The third terminal of the first chip U1 is connected to the other end of the sixth resistor R6 and one end of the fifth resistor R5. The other end of the fifth resistor R5 and one end of the fourth resistor R4 are connected to the fourth terminal of the first chip U1. The anode of the first diode D1 is connected to the other end of the fourth resistor R4. The cathode of the first diode D1, one end of the third capacitor C3, and one end of the third resistor R3 are connected to the microcontroller module. The other end of the third resistor R3, the other end of the third capacitor C3, one end of the first capacitor C1, and one end of the second capacitor C2 are grounded. The other end of the first capacitor C1, the other end of the second capacitor C2, and the fifth terminal of the first chip U1 are connected to the VCC terminal. The second terminal of the first chip U1 is grounded. The first chip U1 is an LM321 chip, but it can also be other types of chips; no specific limitation is made here.

[0041] Please see Figure 4 The microcontroller module includes a second chip U2, which is an STC8H8K64U microcontroller, but can also be other types of microcontrollers, depending on actual needs; no specific limitation is made here. Specifically, the tenth terminal of the second chip U2 is connected to one end of the first resistor R1, the sixteenth terminal of the second chip U2 is connected to the cathode of the first diode D1, the fifteenth terminal of the second chip U2 is connected to the VCC terminal, and the seventeenth terminal of the second chip U2 is grounded.

[0042] Please see Figure 5 The conversion module includes: eighth resistor R8, fourth capacitor C4, fifth capacitor C5, sixth capacitor C6, seventh capacitor C7, first crystal oscillator Y1, and third chip U3;

[0043] One end of the fourth capacitor C4 is grounded, and the other end is connected to the VCC terminal, the eighteenth terminal of the third chip U3, and one end of the eighth resistor R8. The other end of the eighth resistor R8 is connected to the seventeenth terminal of the third chip U3 and one end of the seventh capacitor C7. The other end of the seventh capacitor C7 and the ninth terminal of the third chip U3 are both grounded. The first terminal of the first crystal oscillator Y1 is connected to the seventh terminal of the third chip U3. The second and fourth terminals of the first crystal oscillator Y1 are grounded. The third terminal of the first crystal oscillator Y1 is connected to the eighth terminal of the third chip U3. The fifth capacitor C5 is connected in parallel between the first and second terminals of the first crystal oscillator Y1. The sixth capacitor C6 is connected in parallel with the first crystal oscillator Y1. Between the second and third terminals, the first and second terminals of the third chip U3 are connected to the controller LAN bus. Terminals 12, 13, 14, 15, and 16 of the third chip U3 are all connected to the microcontroller module. Specifically, terminal 12 of the third chip U3 is connected to terminal 22 of the second chip U2, terminal 13 of the third chip U3 is connected to terminal 9 of the second chip U2, terminal 14 of the third chip U3 is connected to terminal 12 of the second chip U2, terminal 15 of the third chip U3 is connected to terminal 8 of the second chip U2, and terminal 16 of the third chip U3 is connected to terminal 11 of the second chip U2. The third chip U3 is an MCP2515 chip, but other types of chips can also be used; specific limitations are not specified here.

[0044] The working principle of this embodiment is described below. The detection circuit detects the heating wire to obtain a current detection signal. This detection circuit can be a current transformer or other types; specific details are not limited here. The current detection signal is sent to the front-end module of the control circuit in the temperature control function board. The I3+ terminal of the front-end module receives the current detection signal, and after passing through the output of the first chip U1, it obtains the voltage signal of the MCU_RL_DET port. This voltage signal is transmitted to the tenth terminal of the second chip U2. After processing, the second chip U2 transmits serial peripheral interface data to the third chip U3 through its eighth, ninth, eleventh, twelfth, and twenty-second terminals. After processing, the third chip U3 sends the converted CAN bus data to the CAN bus through its first and second terminals to the host. For details on the internal workings of the third chip U3, please refer to [link to relevant documentation]. Figure 6 The SPI bus data is the data transmitted from the second chip U2 to the third chip U3. The logic controller controls the SPI conversion logic to convert the SPI data into CAN bus data, buffers and filters the CAN bus data, and then sends the CAN bus data to the host through the CAN bus protocol engine. The timing generator is used to control the timing.

[0045] In this embodiment, the external detection circuit detects the current of the heating wire and sends it to the front-end module. The front-end module generates a voltage signal based on the current detection signal. The microcontroller module generates serial peripheral interface data based on the voltage signal and sends the serial peripheral interface data to the conversion module. The conversion module then converts the serial peripheral interface data into CAN bus data and sends the CAN bus data to the host, enabling the host to manage the current based on the CAN bus data. By detecting the current of the heating wire and converting the current detection signal into CAN bus data (i.e., CAN bus data), and sending it to the host via the CAN bus for unified management, this provides convenience for the user.

[0046] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, circuits, and modules described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0047] In the several embodiments provided in this application, it should be understood that the disclosed systems, circuits, and modules can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0048] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0049] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

Claims

1. A control circuit, characterized in that, include: The module consists of a pre-amplifier module, a microcontroller module, and a conversion module. The front-end module is used to receive the current detection signal sent by the external detection circuit and generate a voltage signal based on the current detection signal. The external detection circuit is used to detect the current of the heating wire. The microcontroller module is connected to the front-end module and the conversion module respectively, and is used to receive the voltage signal sent by the front-end module, generate serial peripheral interface data according to the voltage signal, and send the serial peripheral interface data to the conversion module. The conversion module is used to convert the serial peripheral interface data into controller local area network (CLAN) bus data, and send the CLAN bus data to the host via the CLAN bus, so that the host can perform current management based on the CLAN bus data. The front-end module includes: a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, a first capacitor, a second capacitor, a third capacitor, a first diode, a second diode, and a first chip; One end of the first resistor is connected to the microcontroller module, and the other end is connected to the first terminal of the first chip and one end of the second resistor. The other end of the second resistor is connected to the cathode of the second diode, one end of the seventh resistor, and the I3+ terminal. The I3+ terminal is used to receive current detection signals. The anode of the second diode, one end of the sixth resistor, and the other end of the seventh resistor are grounded. The third terminal of the first chip is connected to the other end of the sixth resistor and one end of the fifth resistor. The other end of the fifth resistor and one end of the fourth resistor are connected to the fourth terminal of the first chip. The anode of the first diode is connected to the other end of the fourth resistor. The cathode of the first diode, one end of the third capacitor, and one end of the third resistor are connected to the microcontroller module. The other end of the third resistor, the other end of the third capacitor, one end of the first capacitor, and one end of the second capacitor are grounded. The other end of the first capacitor, the other end of the second capacitor, and the fifth terminal of the first chip are connected to the VCC terminal. The second terminal of the first chip is grounded. The conversion module includes: an eighth resistor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, a first crystal oscillator, and a third chip; One end of the fourth capacitor is grounded, and the other end is connected to the VCC terminal, the eighteenth terminal of the third chip, and one end of the eighth resistor. The other end of the eighth resistor is connected to the seventeenth terminal of the third chip and one end of the seventh capacitor. The other end of the seventh capacitor and the ninth terminal of the third chip are both grounded. The first terminal of the first crystal oscillator is connected to the seventh terminal of the third chip. The second and fourth terminals of the first crystal oscillator are grounded. The third terminal of the first crystal oscillator is connected to the eighth terminal of the third chip. The fifth capacitor is connected in parallel between the first and second terminals of the first crystal oscillator. The sixth capacitor is connected in parallel between the second and third terminals of the first crystal oscillator. The first and second terminals of the third chip are connected to the controller local area network bus. The twelfth, thirteenth, fourteenth, fifteenth, and sixteenth terminals of the third chip are all connected to the microcontroller module.

2. The control circuit according to claim 1, characterized in that, The first chip is an LM321 chip.

3. The control circuit according to claim 1, characterized in that, The microcontroller module includes a second chip, which is an STC8H8K64U microcontroller.

4. The control circuit according to claim 1, characterized in that, The third chip is an MCP2515 chip.

5. A temperature control functional board, characterized in that, Includes the control circuit as described in any one of claims 1 to 4.

6. A control system, characterized in that, Including the temperature control function board as described in claim 5, it also includes a detection circuit, a heating wire, a controller local area network bus, and a host; The detection circuit is connected to the heating wire and the temperature control board respectively, so as to detect the current of the heating wire and input a current detection signal to the temperature control board. The temperature control function board is used to generate controller local area network bus data based on the current detection signal, and then transmit the controller local area network bus data to the host through the controller local area network bus.

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