A temperature controllable probe card

Abstract

The application relates to a temperature-controllable probe card, which comprises, from top to bottom, a probe head, a fixing support, a temperature control layer, a heat conduction layer and an adapter circuit board, the probe head comprises a plurality of probes, the probes pass through the hollow part in the middle of the fixing support, the temperature control layer and the heat conduction layer and are in contact with the adapter circuit board; the temperature control layer has temperature difference on the upper and lower sides, and the temperature control layer can actively adjust the temperature difference based on the ambient temperature. The temperature control layer and the heat conduction layer are arranged between the fixing support and the adapter circuit board, a multi-layer combined temperature control structure is formed, the heat of the whole card is concentrated on one side of the temperature control layer, the temperature of the whole card is controlled, the high and low temperature deformation of the whole card is reduced, and the flatness of the whole card is improved; in addition, the application can be applied to probe cards made of various materials, has wide application range and low production cost.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, and more particularly to a temperature-controllable probe card. Background Technology

[0002] Wafer testing, a crucial step before chip packaging, significantly improves the yield rate of packaged chips. Probe cards act as a bridge between the wafer and the testing machine, transmitting test signals from the testing machine to the wafer and transmitting response signals from the wafer back to the testing machine, thereby determining the wafer's performance.

[0003] Different chips have different operating temperatures. To ensure accurate and valid test results, the test environment needs to match the actual operating environment of the chip. However, some chips have a wide operating temperature range, ranging from -60°C to 125°C. Under these conditions, due to the thermal expansion and contraction of materials, the harsh high and low temperature environments will severely affect the deformation of the probe card. Therefore, it is desirable for the probe card to remain at room temperature under high and low temperature environments to maintain its ideal state. To improve the flatness of the probe card and reduce the impact of temperature on its deformation, the current method is to use materials with low thermal sensitivity. However, this method does not actually change the temperature of the probe card, does not improve the deformation of other materials with higher thermal sensitivity, and increases production costs to some extent. Summary of the Invention

[0004] This invention provides a temperature-controllable probe card to solve the above-mentioned technical problems.

[0005] To address the aforementioned technical problems, this invention provides a temperature-controllable probe card, comprising, from top to bottom, a probe head, a mounting bracket, a temperature control layer, a heat-conducting layer, and an adapter circuit board.

[0006] The probe head includes a plurality of probes, which pass through the hollow portion in the middle of the fixed bracket, the temperature control layer and the heat conduction layer and contact the adapter circuit board.

[0007] The temperature control layer has a temperature difference between its upper and lower sides, and the temperature control layer can actively adjust the temperature difference based on the ambient temperature.

[0008] Preferably, the temperature control layer includes a first temperature control layer and a second temperature control layer. The first temperature control layer is disposed directly below the fixed bracket, with its upper side in contact with the fixed bracket and its lower side in contact with the heat-conducting layer. The second temperature control layer surrounds the first temperature control layer, with its upper side in contact with air and its lower side in contact with the heat-conducting layer.

[0009] Preferably, when the ambient temperature is greater than a first threshold, the upper side of the first temperature control layer is the cold end and the lower side is the hot end, and the upper side of the second temperature control layer is the hot end and the lower side is the cold end; when the ambient temperature is less than a second threshold, the upper side of the first temperature control layer is the hot end and the lower side is the cold end, and the upper side of the second temperature control layer is the cold end and the lower side is the hot end.

[0010] Preferably, the first threshold is greater than or equal to the second threshold.

[0011] Preferably, both the first and second temperature control layers employ semiconductor coolers, and the hot and cold ends are interchanged by changing the direction of the internal current.

[0012] Preferably, a heat insulation layer is provided between the first temperature control layer and the second temperature control layer.

[0013] Preferably, the insulation layer is an air layer.

[0014] Preferably, the thermally conductive layer is made of graphene material.

[0015] Preferably, the probe head further includes an upper cover plate, a metal support plate, and a lower cover plate, with the metal support plate sandwiched between the upper and lower cover plates. One end of the probe is connected to the metal support plate, and the other end passes through the lower cover plate and contacts the adapter circuit board.

[0016] Preferably, the adapter circuit board is fixed on a mounting base, and the probe head, fixing bracket, temperature control layer, heat conduction layer, adapter circuit board and mounting base are connected as a whole.

[0017] Compared with the prior art, the temperature-controllable probe card provided by the present invention has the following advantages:

[0018] 1. This invention forms a multi-layer combined temperature control structure by setting a temperature control layer and a heat conduction layer between the fixed bracket and the adapter circuit board, thereby concentrating the heat of the whole card to one side of the temperature control layer, thereby controlling the temperature of the whole card itself, reducing the high and low temperature deformation of the whole card, and improving the flatness of the whole card.

[0019] 2. This invention can be applied to probe cards made of various materials, and its scope of application is basically unlimited, with low production costs. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the disassembled structure of a temperature-controllable probe card according to a specific embodiment of the present invention;

[0021] Figure 2 This is a top view of a temperature-controllable probe card according to a specific embodiment of the present invention;

[0022] Figure 3This is a longitudinal cross-sectional view of a temperature-controllable probe card according to a specific embodiment of the present invention.

[0023] Figure 4 for Figure 3 A magnified view of a portion of the image.

[0024] In the diagram: 10-Probe head, 20-Fixing bracket, 21-Screw, 30-Temperature control layer, 31-First temperature control layer, 32-Second temperature control layer, 33-Insulation layer, 40-Heat conduction layer, 41-Kuttery section, 50-Adapter circuit board, 51-Mounting base. Detailed Implementation

[0025] To describe the technical solution of the invention in more detail, specific embodiments are listed below to make the technical solution of the invention easier to understand and master, and to demonstrate the technical effect of the invention.

[0026] In the following detailed description, specific details are illustrated by example to provide a thorough understanding of this application. However, those skilled in the art will understand that this application can be implemented without these details.

[0027] In addition, it should be understood that the terms "middle", "upper", "lower", etc., used in this document to indicate orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings and are only for the purpose of describing and understanding the present invention, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed or operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0028] The temperature-controllable probe card provided by this invention, such as... Figures 1 to 4 As shown, the wafer testing process includes a probe head 10, a fixing bracket 20, a temperature control layer 30, a thermal conductive layer 40, and an adapter circuit board 50 arranged sequentially from top to bottom. The probe head 10 includes a plurality of probes (not shown). The bottom of the probes passes through the cutout 41 in the middle of the fixing bracket 20, the temperature control layer 30, and the thermal conductive layer 40 and contacts the adapter circuit board 50. The probes transmit signals and complete the wafer testing process.

[0029] The temperature control layer 30 has a temperature difference between its upper and lower sides, which can be either high temperature on the upper side and low temperature on the lower side, or low temperature on the upper side and high temperature on the lower side. The temperature control layer 30 can actively adjust the temperature difference based on the ambient temperature. For example, it can adjust the mode from high temperature on the upper side and low temperature on the lower side to low temperature on the upper side and high temperature on the lower side, thereby concentrating the heat of the entire card to one side of the temperature control layer 30, thereby controlling the temperature of the entire card itself, reducing high and low temperature deformation of the entire card, and improving the flatness of the entire card. In addition, the present invention can be applied to probe cards made of various materials, with a wide range of applications and low production costs.

[0030] In some embodiments, please refer to the following: Figure 1 , Figure 3 and Figure 4 The temperature control layer 30 includes a first temperature control layer 31 and a second temperature control layer 32. The first temperature control layer 31 is disposed directly below the fixed bracket 20, with its upper side in contact with the fixed bracket 20 and its lower side in contact with the heat-conducting layer 40. This allows for rapid temperature changes in the fixed bracket 20 and rapid, even distribution of heat on the heat-conducting layer 40. In some embodiments, the external shape of the first temperature control layer 31 can be consistent with that of the fixed bracket 20, i.e., they overlap vertically to maximize the contact area between the fixed bracket 20 and the first temperature control layer 31, further improving the temperature control effect.

[0031] The second temperature control layer 32 surrounds the first temperature control layer 31, with its upper side in contact with the air and its lower side in contact with the heat-conducting layer 40. In some embodiments, a hole matching the shape of the first temperature control layer 31 can be cut out in the middle of the second temperature control layer 32 to ensure that the first temperature control layer 31 can be placed inside the second temperature control layer 32. In this way, the lower sides of both the first and second temperature control layers 31 and 32 are in direct contact with the heat-conducting layer 40, realizing rapid heat transfer, while the upper side of the second temperature control layer 32 is in direct contact with the air, that is, the upper side of the second temperature control layer 32 is directly exposed to the air for heat dissipation or heat absorption, thereby achieving the purpose of rapidly adjusting the temperature of the entire card.

[0032] In some embodiments, when the ambient temperature is greater than a first threshold, it is determined that the probe card is being tested in a high-temperature environment. The upper side of the first temperature control layer 31 is the cold end and the lower side is the hot end, that is, the hot end is in direct contact with the heat-conducting layer 40, ensuring that heat can be quickly transferred to areas outside the fixed bracket 20. At this time, the upper side of the second temperature control layer 32 is the hot end and the lower side is the cold end, and the hot end is in direct contact with the air for heat dissipation.

[0033] When the ambient temperature is below the second threshold, the probe card is determined to be under low-temperature testing. The upper side of the first temperature control layer 31 is the hot end, and the lower side is the cold end. The cold end is in direct contact with the heat-conducting layer 40, ensuring rapid heat absorption from areas outside the fixed bracket 20. Meanwhile, the upper side of the second temperature control layer 32 is the cold end, and the lower side is the hot end. The cold end is in direct contact with the air for heat absorption. This achieves the effect of cooling the entire card in a high-temperature environment and warming the entire card in a low-temperature environment.

[0034] In some embodiments, the first threshold may be greater than the second threshold. For example, when the ambient temperature is detected to be greater than 40°C, it is determined that the probe card is being tested in a high-temperature environment. In this case, the upper side of the first temperature control layer 31 is controlled as the cold end and the lower side as the hot end; the upper side of the second temperature control layer 32 is controlled as the hot end and the lower side as the cold end. When the ambient temperature is detected to be less than 20°C, it is determined that the probe card is being tested in a low-temperature environment. In this case, the hot and cold ends of the first temperature control layer 31 and the second temperature control layer 32 are interchanged. When the ambient temperature is detected to be between 20°C and 40°C, it is determined that the probe card is being tested in a normal temperature environment, and no control is applied to the first temperature control layer 31 and the second temperature control layer 32.

[0035] In other embodiments, the first threshold can be equal to the second threshold. For example, when the ambient temperature is detected to be greater than 30°C, it is determined that the probe card is being tested in a high-temperature environment. At this time, the upper side of the first temperature control layer 31 is controlled as the cold end and the lower side as the hot end; the upper side of the second temperature control layer 32 is controlled as the hot end and the lower side as the cold end. When the ambient temperature is detected to be less than 30°C, it is determined that the probe card is being tested in a low-temperature environment. At this time, the hot and cold ends of the first temperature control layer 31 and the second temperature control layer 32 are interchanged. This ensures that the entire probe card is always kept at a temperature of around 30°C, preventing deformation of the entire card.

[0036] Of course, the specific values ​​of the first and second thresholds can be set according to factors such as the material of the probe card and the ambient temperature.

[0037] In some embodiments, the first temperature control layer 31 and the second temperature control layer 32 can be thermoelectric coolers (TECs, or Thermo Electric Coolers for short), which utilize the Peltier effect of semiconductor materials to form a phenomenon where one side absorbs heat and the other side releases heat, thereby forming a cold end and a hot end; the first temperature control layer 31 and the second temperature control layer 32 can also switch between the cold and hot ends by changing the direction of the internal current, which is a simple and quick control method with low cost.

[0038] In some embodiments, please refer to the following: Figure 4 A heat insulation layer 33 is provided between the first temperature control layer 31 and the second temperature control layer 32 to prevent direct contact between the hot / cold end of the first temperature control layer 31 and the cold / hot end of the second temperature control layer 32, which would affect the temperature control effect and cause energy waste. In some embodiments, the heat insulation layer 33 can be an air layer, that is, the edges of the first temperature control layer 31 and the second temperature control layer 32 do not contact each other, forming a physical isolation, which is low in cost and has a good heat insulation effect; of course, the heat insulation layer 33 can also be made of other heat insulation materials such as asbestos and vacuum panels, which are not limited here.

[0039] In some embodiments, the thermally conductive layer 40 may be made of graphene material, which has good thermal conductivity and is abundant, low in cost, and lightweight.

[0040] In some embodiments, the probe head 10 further includes an upper cover plate, a metal support plate, and a lower cover plate. The metal support plate is sandwiched between the upper cover plate and the lower cover plate. One end of the probe is connected to the metal support plate, and the other end passes through the lower cover plate and contacts the adapter circuit board 50. In some embodiments, the components of the probe head 10 can be fixed as a whole using screws 21 first, and then the probe head 10 can be fixed to the fixing bracket 20 using screws 21 to complete the positioning and installation of the probe head 10.

[0041] In some embodiments, please refer to the following: Figure 1 The adapter circuit board 50 is fixed to a mounting base 51, and the probe head 10, fixing bracket 20, temperature control layer 30, heat conduction layer 40, adapter circuit board 50, and mounting base 51 are connected as a whole. For example, screws 21 are used to pass through the fixing bracket 20, temperature control layer 30, heat conduction layer 40, and adapter circuit board 50 in sequence and fix them to ensure that the contact point of the probe corresponds precisely with the contact point on the adapter circuit board 50.

[0042] In summary, the temperature-controllable probe card provided by this invention includes, from top to bottom, a probe head 10, a fixing bracket 20, a temperature control layer 30, a heat-conducting layer 40, and an adapter circuit board 50. The probe head 10 includes a plurality of probes, which pass through the hollow portion 41 in the middle of the fixing bracket 20, the temperature control layer 30, and the heat-conducting layer 40 and contact the adapter circuit board 50. The upper and lower sides of the temperature control layer 30 have a temperature difference, and the temperature control layer 30 can actively adjust the temperature difference based on the ambient temperature, thereby concentrating the heat of the entire card to one side of the temperature control layer 30, thereby controlling the temperature of the entire card, reducing high and low temperature deformation of the entire card, and improving the flatness of the entire card. In addition, this invention can be applied to probe cards made of various materials, has a wide range of applications, and has a low production cost.

[0043] Obviously, those skilled in the art can make various modifications and variations to the invention without departing from the spirit and scope of the invention. Therefore, if these modifications and variations fall within the scope of the claims of the invention and their equivalents, the invention is also intended to include these modifications and variations.

Claims

1. A temperature controllable probe card, characterized by, The device includes, from top to bottom, a probe head, a fixing bracket, a temperature control layer, a heat-conducting layer, and an adapter circuit board. The probe head includes a plurality of probes, which pass through the hollowed-out portion in the middle of the fixing bracket, the temperature control layer, and the heat-conducting layer and contact the adapter circuit board. The temperature control layer has a temperature difference between its upper and lower sides, and the temperature control layer can actively adjust the temperature difference based on the ambient temperature; the temperature control layer includes a first temperature control layer and a second temperature control layer, the first temperature control layer is disposed directly below the fixed bracket, and its upper side contacts the fixed bracket, and its lower side contacts the heat-conducting layer; the second temperature control layer surrounds the first temperature control layer, and its upper side contacts the air, and its lower side contacts the heat-conducting layer.

2. The temperature-controlled probe card of claim 1, wherein, When the ambient temperature is greater than the first threshold, the upper side of the first temperature control layer is the cold end and the lower side is the hot end, and the upper side of the second temperature control layer is the hot end and the lower side is the cold end; when the ambient temperature is less than the second threshold, the upper side of the first temperature control layer is the hot end and the lower side is the cold end, and the upper side of the second temperature control layer is the cold end and the lower side is the hot end.

3. The temperature-controllable probe card as described in claim 2, characterized in that, The first threshold is greater than or equal to the second threshold.

4. The temperature-controllable probe card as described in claim 2, characterized in that, Both the first and second temperature control layers use semiconductor coolers, and the hot and cold ends are interchanged by changing the direction of the internal current.

5. The temperature-controllable probe card as described in claim 1, characterized in that, A heat insulation layer is provided between the first temperature control layer and the second temperature control layer.

6. The temperature-controllable probe card as described in claim 5, characterized in that, The insulation layer is an air layer.

7. The temperature-controllable probe card as described in claim 1, characterized in that, The thermally conductive layer is made of graphene material.

8. The temperature-controllable probe card as described in claim 1, characterized in that, The probe head also includes an upper cover plate, a metal support plate, and a lower cover plate. The metal support plate is sandwiched between the upper cover plate and the lower cover plate. One end of the probe is connected to the metal support plate, and the other end passes through the lower cover plate and contacts the adapter circuit board.

9. The temperature-controllable probe card as described in claim 1, characterized in that, The adapter circuit board is fixed on a mounting base, and the probe head, fixing bracket, temperature control layer, heat conduction layer, adapter circuit board and mounting base are connected as a whole.

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