A CTP and TFT laminated liquid crystal module and a manufacturing process thereof

Abstract

This invention provides a CTP and TFT bonded liquid crystal module and its manufacturing process, comprising: S10: forming a first ITO pattern layer on the working surface of a glass substrate; S20: forming an insulating layer on the working surface of the glass substrate, wherein a screen printing space is reserved between the insulating layer and the first ITO pattern layer; S30: forming a second ITO pattern layer on the insulating layer; S40: screen printing silver lines and insulating oil on the first ITO pattern layer and the second ITO pattern layer on the working surface of the glass substrate; S50: bonding the working surface of the glass substrate to a glass cover plate with optical adhesive to obtain a CTP and TFT bonded liquid crystal module. This application innovatively forms two ITO pattern layers on the same surface, which, after bonding with the glass cover plate, can protect all silver lines, effectively improving the yield rate. The silver line screen printing and insulating oil screen printing processes only require uniform operation on the working surface, eliminating the need for flipping, effectively simplifying the process flow.

Description

Technical Field

[0001] This invention relates to the technical field of CTP and TFT bonded liquid crystal module manufacturing, and particularly to a CTP and TFT bonded liquid crystal module and its manufacturing process. Background Technology

[0002] In the fabrication of CTP and TFT bonded liquid crystal modules, double-sided ITO needs to be fabricated on a transparent glass substrate. Conventional fabrication methods include... Figure 1 As shown, the main process involves creating the photosensitive material for one side, developing the pattern through exposure, protecting the back side with PET, photosensitive emulsion, or other thin film, and then etching to remove the film, resulting in the ITO pattern required for the first side. Similarly, for the second side, after creating the photosensitive material through exposure and development, the front side is protected with PET, photosensitive emulsion, or other thin film, and then etched to remove the film, resulting in the ITO pattern required for the second side. After these steps, a screen printing process is performed. This process involves screen printing the ITO pattern, specifically screen printing one silver line and one insulating oil layer on each of the first and second sides.

[0003] However, the aforementioned product structure results in the silver wire bonding sites being distributed on opposite sides of the glass, requiring at least two bonding cycles. Furthermore, after the glass cover plate is bonded to one side, the silver wire on the other side remains exposed and unprotected, making it susceptible to damage. In addition, the aforementioned manufacturing process is complex and cumbersome, requiring operation on both sides of the glass substrate. This process is prone to scratches and other cosmetic defects, making it difficult to control product yield and leading to high production costs. Summary of the Invention

[0004] The purpose of this invention is to provide a CTP and TFT bonded liquid crystal module and its manufacturing process, aiming to solve the problems of complex process flow and difficulty in controlling product yield.

[0005] To achieve the above objectives, the technical solutions of the present invention are as follows:

[0006] This invention provides a manufacturing process for a CTP and TFT bonded liquid crystal module, comprising:

[0007] S10: Fabricate the first ITO pattern layer on the working surface of the glass substrate;

[0008] S20: An insulating layer is formed on the working surface of the glass substrate, wherein the insulating layer covers the first ITO pattern layer, and the insulating layer has a reserved screen printing space communicating with the first ITO pattern layer.

[0009] S30: A second ITO patterned layer is formed on the insulating layer;

[0010] S40: On the working surface of the glass substrate, silver lines and insulating oil are screen printed on the screen printing space and the second ITO pattern layer;

[0011] S50: The working surface of the glass substrate is bonded to the glass cover plate with optical adhesive to obtain a CTP and TFT bonded liquid crystal module.

[0012] Compared with the prior art, this application innovatively fabricates two ITO pattern layers on the working surface of the glass substrate (i.e., on the same surface). After being bonded to the glass cover, it can protect all silver lines and effectively improve the yield. In addition, the silver line screen printing and insulating oil screen printing processes only need to be performed on the working surface of the glass substrate, without the need for flipping, which effectively simplifies the process flow. Moreover, operating on the same surface can reduce the need for adhesive protection on the other side before etching, further simplifying the process flow.

[0013] In one embodiment, S10 includes:

[0014] S110: After depositing an ITO film on the working surface of the glass substrate, a photoresist is applied.

[0015] S120: The working surface of the glass substrate is pre-baked, exposed, developed, etched, and stripped to form a first ITO pattern layer on the ITO film.

[0016] In one embodiment, the step S20 of forming an insulating layer on the working surface of the glass substrate specifically involves:

[0017] An insulating layer is obtained by scraping, OC coating, exposure, development and curing on the working surface of the glass substrate. During the OC coating process, a screen printing space is reserved for the silver line screen printing of S40.

[0018] In one embodiment, the screen printing space is configured to correspond to the exit end of one end of the first ITO pattern layer.

[0019] In one embodiment, S30 includes:

[0020] S310: After depositing an ITO film on the insulating layer, photoresist is applied;

[0021] S320: The working surface of the glass substrate is pre-baked, exposed, developed, etched, and stripped to form a second ITO pattern layer on the ITO film.

[0022] In one embodiment, S40 includes:

[0023] S410: On the working surface of the glass substrate, a silver paste with conductive properties is screen-printed onto the screen printing space and the wire outlet end of one end of the second pattern layer and then cured to obtain the first silver wire and the second silver wire respectively.

[0024] S420: A layer of insulating oil is screen-printed onto the already cured first and second silver wires and then cured to obtain an insulating oil layer.

[0025] This invention provides a CTP and TFT bonded liquid crystal module, comprising:

[0026] A glass substrate having a working surface;

[0027] A first ITO pattern layer is disposed on the working surface, and the first ITO pattern layer is provided with a first silver line;

[0028] An insulating layer is disposed on the upper side of the first ITO patterned layer;

[0029] A second ITO pattern layer is disposed on the upper side of the insulating layer, and a second silver line is provided on the second ITO pattern layer;

[0030] A glass cover plate, which is bonded to the second ITO pattern layer via an optical adhesive layer;

[0031] The first silver wire and the second silver wire are arranged on opposite sides, and both the first silver wire and the second silver wire are provided with an insulating oil layer.

[0032] In one embodiment, the insulating layer has a reserved screen printing space, which is connected to the first ITO pattern layer to facilitate the placement of the first silver wire.

[0033] In one embodiment, the screen printing space is configured to correspond to the exit end of one end of the first ITO pattern layer.

[0034] In one embodiment, the first silver line and the silver paste dots of the first ITO pattern layer are located on the left side of the first ITO pattern layer.

[0035] The second silver line and the silver paste dots of the second ITO pattern layer are located on the front side of the second ITO pattern layer. Attached Figure Description

[0036] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings:

[0037] Figure 1 This is a schematic diagram of the process flow of existing technology;

[0038] Figure 2 This is a schematic diagram of the process flow of this application;

[0039] Figure 3 This is a cross-sectional view of the CTP and TFT bonded liquid crystal module of this application;

[0040] Figure 4 This is one of the front views of the CTP and TFT bonded liquid crystal module of this application;

[0041] Figure 5 This is the second front view of the CTP and TFT bonded liquid crystal module of this application;

[0042] Figure 6 This is the third front view of the CTP and TFT bonded liquid crystal module of this application. Detailed Implementation

[0043] To better illustrate the present invention, the invention will now be described in further detail with reference to the accompanying drawings.

[0044] It should be understood that the described embodiments are merely some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of the embodiments of this application.

[0045] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0046] In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims. In the description of this application, it should be understood that the terms "first," "second," "third," etc., are used only to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0048] To facilitate understanding of the differences between this invention and existing technologies, and to better appreciate the advantages of this invention in terms of simplified process flow, the following description will focus on the existing technology for fabricating double-sided ITO on a transparent glass substrate. Conventional fabrication methods, combined with... Figure 1 As shown,

[0049] Step 1: Perform double-sided ITO coating on the first and second sides of the glass substrate, and clean and dry the glass.

[0050] Step 2: Coat the first side of the glass substrate with photoresist, and perform pre-baking, exposure, and development processes;

[0051] Step 3: Apply PET or photosensitive emulsion to the second side of the glass substrate to prevent subsequent etching processes from damaging the ITO film on the second side;

[0052] Step 4: Etch the glass substrate and then remove the film from the glass substrate after etching to obtain a glass substrate with a first ITO pattern layer on the first side.

[0053] Step 5: The glass substrate from Step 4 is re-filled and cleaned, and photoresist is applied to the second side, followed by pre-baking, exposure, and development.

[0054] Step 6: Apply PET or photosensitive emulsion to the second side of the glass substrate to avoid etching damage to the first ITO pattern layer on the first side in subsequent processes;

[0055] Step 7: Etch the glass substrate and then remove the film from the glass substrate after etching to obtain a glass substrate with ITO patterned layers on both sides.

[0056] Step 8: After curing the silver wire screen printing on the first side of the glass substrate, then cure the silver wire screen printing with insulating oil.

[0057] Step 9: Flip the glass substrate over, and after screen printing and curing the silver wires on the second side, screen print and cure the silver wires with insulating oil.

[0058] The aforementioned manufacturing process requires operation on both sides of the glass substrate. While operating on one side, the other side must be protected to prevent damage to the ITO film during etching. Furthermore, a flipping process is necessary, making the process complex and cumbersome. The process also involves dealing with surface defects such as scratches, making it difficult to control product yield and resulting in high production costs. In addition, the product structure results in silver wire bonding sites distributed on opposite sides of the glass, requiring at least two bonding operations. Moreover, after the glass cover is attached to one side, the silver wires on the other side are exposed and unprotected, making them susceptible to damage.

[0059] To solve the above-mentioned technical problems, combined with Figures 2 to 6 As shown, this application provides a CTP and TFT bonded liquid crystal module and its manufacturing process. This application innovatively fabricates two ITO pattern layers on the working surface (i.e., the same surface) of the glass substrate. After bonding with the glass cover, it can protect all silver lines and effectively improve the yield. In addition, the silver line screen printing and insulating oil screen printing processes only need to be performed on the working surface, without the need for flipping, which effectively simplifies the process flow. Moreover, operating on the same surface can reduce the need for adhesive protection on the other side before etching, further simplifying the process flow.

[0060] Combination Figures 2 to 6 As shown, the present invention provides a manufacturing process for a CTP and TFT bonded liquid crystal module, which includes:

[0061] S10: A first ITO pattern layer is formed on the working surface of the glass substrate 10, such as... Figure 4 As shown; S10 includes:

[0062] S110: After depositing an ITO film on the working surface of the glass substrate 10, a photoresist is applied.

[0063] S120: The working surface of the glass substrate 10 is pre-baked, exposed, developed, etched, and stripped to form a first ITO pattern layer on the ITO film.

[0064] S20: An insulating layer 30 is formed on the working surface of the glass substrate 10, wherein the insulating layer 30 covers the first ITO pattern layer 20, and the insulating layer 30 has a reserved screen printing space 310 communicating with the first ITO pattern layer 20, such as... Figure 5 As shown; specifically, the operator applies an OC coating, exposes, develops, and cures the working surface of the glass substrate 10 to obtain an insulating layer 30. During the OC coating process, a screen printing space 310 is reserved for the silver line screen printing of S40. Moreover, during the OC coating process, the OC covers the first ITO pattern layer to prepare for the subsequent low-temperature deposition of an ITO film on the insulating layer 30.

[0065] It should be noted that OC is short for overcoater, an insulating material widely used in LCD manufacturing and familiar to those skilled in the art; therefore, it will not be described in detail here. This application utilizes OC as the insulating layer 30 to prevent contact between the first ITO pattern layer and the second ITO pattern layer (mentioned later), thus preventing short circuits.

[0066] Preferably, the screen printing space 310 is configured corresponding to the lead-out end of one end of the first ITO pattern layer. In this application, by setting the screen printing space 310 at the lead-out end of one end of the first ITO pattern layer, the silver paste with conductive properties can fully contact and conduct with the lead-out end of one end of the first ITO pattern layer in the subsequent S40 screen printing silver wire process, thereby achieving electrical connection.

[0067] S30: A second ITO pattern layer is formed on the insulating layer 30; after completing the operation in S20, the operator continues to form a second ITO pattern layer on the working surface of the glass substrate 10. Specifically, S30 includes:

[0068] S310: After depositing an ITO film on the insulating layer 30, photoresist is applied; preferably, this application uses a low-temperature deposition method to deposit an ITO film on the insulating layer 30 so that the ITO film can form a second ITO pattern layer 40 in subsequent operations; preferably, the temperature of the low-temperature deposition is 160℃~180℃. By using the low-temperature deposition method, the working surface of the glass substrate can be effectively avoided from being peeled off due to high-temperature embrittlement of the insulating layer.

[0069] S320: The working surface of the glass substrate 10 is pre-baked, exposed, developed, etched, and stripped to form a second ITO pattern layer 40 on the ITO film.

[0070] S40: On the working surface of the glass substrate 10, silver lines and insulating oil are screen-printed onto the screen printing space 310 and the second ITO pattern layer, such as... Figure 6 As shown; S40 includes:

[0071] S410: The operator screen-prints conductive silver paste onto the working surface of the glass substrate 10 and the wire outlet end of one end of the screen printing space 310 and cures it to obtain the first silver line 610 and the second silver line 620 respectively. In the process of screen printing silver lines, this application only needs to perform a uniform operation on the working surface of the glass substrate. Compared with the double-sided screen printing of silver lines in the prior art, this application only needs to perform the operation on the same surface, which is simple and fast. Moreover, there is no need to flip the glass substrate, which effectively reduces the operation time and the production risks caused by the flipping action.

[0072] The first silver line 610 and the second silver line 620 are arranged on opposite sides (for example, the first silver line 610 is arranged on the left side of the CTP and TFT bonding liquid crystal module, and the second silver line 620 is arranged on the front side of the CTP and TFT bonding liquid crystal module), which can prevent the first silver line 610 and the second silver line 620 from short-circuiting due to contact, and effectively utilize the spatial position of the CTP and TFT bonding liquid crystal module.

[0073] S420: An insulating oil layer is screen-printed onto the already cured first silver wire 610 and second silver wire 620 and then cured to obtain an insulating oil layer 630. This application innovatively completes the screen printing of silver wires and insulating oil on the working surface (same surface) of the glass substrate 10, eliminating the need for separate processes as in the prior art, thus simplifying the process.

[0074] S50: The working surface of the glass substrate 10 is bonded to the glass cover plate 50 with optical adhesive to obtain a CTP and TFT bonded liquid crystal module.

[0075] Based on the above description of the process flow of this application, compared with the prior art, this application,

[0076] 1. The two steps of applying a PET or photosensitive adhesive film to the other side of the glass substrate 10 before etching one side are omitted (i.e., steps 3 and 6 in the prior art). In the prior art, since it is double-sided ITO plating, in order to protect the ITO film on the second side during the fabrication of the first ITO pattern layer, it is necessary to treat the second side with PET or photosensitive adhesive to prevent damage to the ITO film on the second side during the etching process. Similarly, in the fabrication of the second ITO pattern layer, it is also necessary to treat the first side with PET or photosensitive adhesive to prevent damage to the first ITO pattern layer on the first side during the etching process.

[0077] In this application, since the glass substrate is coated on one side before the first ITO pattern layer is fabricated, the second side does not need to be treated with PET or photosensitive adhesive; and before the second ITO pattern layer is fabricated, an insulating layer is used to protect the first ITO pattern layer, so no PET or photosensitive adhesive treatment is required.

[0078] 2. The secondary feeding step (i.e., step 5 in the prior art) has been omitted;

[0079] 3. The step of screen printing silver wires and insulating oil on the first and second sides separately is omitted. Only the same side needs to be screen printed, reducing the screen printing process to half of the original. The existing technology involves screen printing and curing silver wires on the first ITO pattern layer on the first side, followed by screen printing and curing insulating oil on the silver wires. Then, by flipping the glass substrate to the second side, silver wires are screen printed and cured on the second ITO pattern layer on the second side, followed by screen printing and curing insulating oil on the silver wires. That is, two screen printing processes for silver wires and insulating oil.

[0080] Since this application places both the first ITO pattern layer and the second ITO pattern layer on the working surface (the same surface), the silver wire screen printing of the first ITO pattern layer and the second ITO pattern layer can be carried out simultaneously. Similarly, the insulating oil can also be applied simultaneously, reducing the number of processes and the amount of insulating oil used.

[0081] 4. This application eliminates the need for flipping the glass substrate 10, reducing the possibility of scratches and improving the product yield.

[0082] This invention provides a CTP and TFT bonded liquid crystal module, comprising:

[0083] Glass substrate 10, which has a working surface;

[0084] A first ITO pattern layer 20 is disposed on the working surface, and the first ITO pattern layer is provided with a first silver line 610;

[0085] Insulating layer 30 is disposed on the upper side of the first ITO patterned layer;

[0086] The second ITO pattern layer 40 is disposed on the upper side of the insulating layer 30, and the second ITO pattern layer is provided with a second silver line 620.

[0087] A glass cover plate 50 is bonded to the second ITO pattern layer via an optical adhesive layer 70;

[0088] The first silver wire 610 and the second silver wire 620 are arranged on opposite sides, and an insulating oil layer 630 is provided on both the first silver wire 610 and the second silver wire 620.

[0089] In this application, the first ITO pattern layer and the second ITO pattern layer of the CTP and TFT bonded liquid crystal module are both set on the working surface of the glass substrate 10, which facilitates subsequent FPC bonding, simplifies the process flow, reduces the product bonding production cycle to half of the original, doubles the production capacity, and improves the bonding yield. Moreover, after the glass substrate 10 and the glass cover plate 50 are bonded, it ensures that the silver lines are not exposed, reducing the probability of the silver lines being damaged. Furthermore, it ensures that the performance of the functional chips removed after full bonding is not damaged.

[0090] In one embodiment, the insulating layer 30 has a reserved screen printing space 310, which is connected to the first ITO pattern layer 20 to facilitate the placement of the first silver line 610.

[0091] In one embodiment, the screen printing space 310 is configured to correspond to the exit end of one end of the first ITO pattern layer.

[0092] In one embodiment, the first silver line and the silver paste dots of the first ITO pattern layer are located on the left side of the first ITO pattern layer; the second silver line and the silver paste dots of the second ITO pattern layer are located on the front side of the second ITO pattern layer, effectively utilizing the space between the CTP and the TFT-bonded liquid crystal module.

[0093] In the description of this invention, it should be understood that the terms "vertical", "horizontal", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used to facilitate the description of this invention and to simplify the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this invention.

[0094] If the terms "first" or "second" are used in this document to define components, those skilled in the art should know that the use of "first" or "second" is merely for the convenience of describing the invention and simplifying the description, and unless otherwise stated, the above terms have no special meaning.

[0095] This invention is not limited to the above-described embodiments. If any modifications or variations to this invention do not depart from the spirit and scope of this invention, and if such modifications and variations fall within the scope of the claims and equivalent technologies of this invention, then this invention also intends to include such modifications and variations.

Claims

1. A manufacturing process for a CTP and TFT bonded liquid crystal module, characterized in that, include: S10: Fabricate the first ITO pattern layer on the working surface of the glass substrate; S20: An insulating layer is formed on the working surface of the glass substrate, wherein the insulating layer covers the first ITO pattern layer, and the insulating layer has a screen printing space that communicates with the first ITO pattern layer; the insulating layer is obtained by scraping OC, exposing, developing and curing on the working surface of the glass substrate, wherein a screen printing space is reserved during the scraping OC process for the silver line screen printing in S40. S30: A second ITO patterned layer is formed on the insulating layer; S30 includes: S310: An ITO film is deposited on the insulating layer by a low-temperature deposition method, followed by the application of photoresist; the temperature of the low-temperature deposition is 160℃~180℃. S320: The working surface of the glass substrate is pre-baked, exposed, developed, etched, and stripped to form a second ITO pattern layer from the ITO film; S40: On the working surface of the glass substrate, silver lines and insulating oil are screen printed on the screen printing space and the second ITO pattern layer; S50: The working surface of the glass substrate is bonded to the glass cover plate with optical adhesive to obtain a CTP and TFT bonded liquid crystal module.

2. The manufacturing process of the CTP and TFT bonded liquid crystal module according to claim 1, characterized in that, S10 includes: S110: After depositing an ITO film on the working surface of the glass substrate, a photoresist is applied. S120: The working surface of the glass substrate is pre-baked, exposed, developed, etched, and stripped to form a first ITO pattern layer on the ITO film.

3. The manufacturing process of the CTP and TFT bonded liquid crystal module according to claim 1, characterized in that: The screen printing space is configured to correspond to the exit end of one end of the first ITO pattern layer.

4. The manufacturing process of the CTP and TFT bonded liquid crystal module according to claim 1, characterized in that, S40 includes: S410: On the working surface of the glass substrate, a silver paste with conductive properties is screen-printed onto the screen printing space and the wire outlet end of one end of the second ITO pattern layer and then cured to obtain the first silver wire and the second silver wire respectively. S420: A layer of insulating oil is screen-printed onto the already cured first and second silver wires and then cured to obtain an insulating oil layer.

5. A CTP and TFT bonded liquid crystal module, characterized in that, The manufacturing process of the CTP and TFT bonded liquid crystal module as described in any one of claims 1-4 includes: A glass substrate having a working surface; A first ITO pattern layer is disposed on the working surface, and the first ITO pattern layer is provided with a first silver line; An insulating layer is disposed on the upper side of the first ITO patterned layer; A second ITO pattern layer is disposed on the upper side of the insulating layer, and the second ITO pattern layer is provided with a second silver line; A glass cover plate, which is bonded to the second ITO pattern layer via an optical adhesive layer; The first silver wire and the second silver wire are arranged on opposite sides, and both the first silver wire and the second silver wire are provided with an insulating oil layer.

6. The CTP and TFT bonded liquid crystal module according to claim 5, characterized in that: The insulating layer has a reserved space for screen printing, which is connected to the first ITO pattern layer to facilitate the placement of the first silver wire.

7. The CTP and TFT bonded liquid crystal module according to claim 6, characterized in that: The screen printing space is configured to correspond to the exit end of one end of the first ITO pattern layer.

8. The CTP and TFT bonded liquid crystal module according to claim 5, characterized in that: The first silver line and the silver paste dot of the first ITO pattern layer are located on the left side of the first ITO pattern layer; The second silver line and the silver paste dots of the second ITO pattern layer are located on the front side of the second ITO pattern layer.

Images