Resin composition and molded body

Abstract

The present invention provides a resin composition and a molded body made of the resin composition, the resin composition containing a heat-accumulating compound as a phase change material, the heat-accumulating compound having process heat resistance that can be adapted even when melt-kneaded with a resin at a higher temperature, and having a characteristic of not leaking from the resin when made into a molded body, and the resin composition being able to obtain a molded body that is warm-sensitively controllable, and excellent in brittleness resistance and lightness. A resin composition containing 100 parts by mass of a thermoplastic resin (A) having a density, MFR, and Shore A hardness in a specific range, 10 to 100 parts by mass of a heat-accumulating compound (B) having a flash point of 200°C or higher, and 1.5 to 20 parts by mass of a porous inorganic compound (C) having an oil absorption of 4.0 g / g or more, the content of the porous inorganic compound (C) being 100 parts by mass, and the content of the heat-accumulating compound (B) being less than 700 parts by mass.

Description

TECHNICAL FIELD

[0001] The present application relates to a resin composition and a molded body, and more particularly to a thermoplastic resin composition capable of warm-sensation control and a molded body thereof. BACKGROUND

[0002] In the past, there has been a concept that by adding a phase change material having a large heat capacity to a resin, temperature change does not easily occur even at high temperatures in midsummer or low temperatures in midwinter, and it is difficult to feel hot or cold when touched. This is based on a mechanism that energy is consumed in phase change (solid → liquid, liquid → solid), and by keeping at a certain temperature for a certain time, the rise and fall of temperature can be delayed. As an example based on such a concept, a bed sheet that feels cold, a material that suppresses the rise in temperature of a steering wheel and an instrument panel portion in a car in summer, and the like can be cited.

[0003] In Patent Literature 1, as a resin composition containing a phase change material as described above, a heat-accumulating resin composition is disclosed, which contains a thermoplastic resin having a crystal melting heat (ΔHm) of 100 J / g or less and a heat-accumulating microcapsule, and the crystal melting heat (ΔHm) is 50 J / g or more.

[0004] In addition, in Patent Literature 2, a resin particle containing heat-accumulating material particles is disclosed, which is composed of a thermoplastic resin and heat-accumulating material particles containing a heat-accumulating substance dispersed in the thermoplastic resin, and the particle diameter or the like of the heat-accumulating material particles satisfies a specific condition.

[0005] PRIOR ART DOCUMENTS

[0006] PATENT LITERATURE

[0007] Patent Literature 1: Japanese Patent Application Laid-Open No. 2019-116570

[0008] Patent Literature 2: Japanese Patent Application Laid-Open No. 2019-218518 SUMMARY

[0009] PROBLEMS TO BE SOLVED BY THE INVENTION

[0010] For a resin composition containing a phase change material such as a heat-accumulating compound, high heat resistance is sometimes required depending on the use, but in the inventions of Patent Documents 1 and 2, there is a problem that the heat resistance is insufficient because the melting point of the thermoplastic resin is not high. In addition, in the case of using a thermoplastic resin having high heat resistance, there is sometimes a necessity to melt-mix the phase change material and the thermoplastic resin at a higher temperature (for example, a temperature of 200°C or higher), and therefore, the phase change material is required to have heat resistance that can withstand the process temperature at the time of melt-mixing with the resin. In addition, for the obtained molded body, properties such as non-leakage (non-bleeding) of the phase change material from the resin, and brittleness resistance and lightness are required. However, in the conventional technology, such studies have not been sufficiently conducted.

[0011] The present application has an object to provide a resin composition containing a heat-accumulating compound as a phase change material, which has process heat resistance that can withstand melt-mixing with a resin even at a higher temperature, and has properties of not leaking (bleeding) from the resin when molded into a molded body, and which can obtain a molded body that is warm-feel-controllable and excellent in brittleness resistance and lightness, and a molded body composed of the resin composition.

[0012] Means for solving the problem

[0013] The present inventors and others have conducted intensive studies in order to solve the above problem. As a result, it has been found that the above problem can be solved by a resin composition containing a specific thermoplastic resin, a heat-accumulating compound, and a porous inorganic compound in specific amounts, and the present application has been completed. The following shows examples of modes of the present application.

[0014] [1] A resin composition comprising:

[0015] 100 parts by mass of a thermoplastic resin (A) that satisfies the following requirements (a-1) to (a-3),

[0016] 10 to 100 parts by mass of a heat-accumulating compound (B) having a flash point of 200°C or higher (different from the above component (A)), and

[0017] 1.5 to 20 parts by mass of a porous inorganic compound (C) having an oil absorption amount of 4.0 g / g or more,

[0018] In the case where the content of the above porous inorganic compound (C) is set to 100 parts by mass, the content of the above heat-accumulating compound (B) is less than 700 parts by mass;

[0019] (a-1) a density of 0.80 to 1.0 g / cm 3 as measured according to the method described in ASTM D 1505;

[0020] (a-2) a melt flow rate (MFR) measured according to the method described in ISO 1133 at 230°C under a load of 10 kg is in the range of 0.1 to 100 g / 10 min;

[0021] (a-3) a Shore A hardness (instantaneous value) measured according to the method described in ISO 7619 is in the range of 30 to 100.

[0022] [2] The resin composition according to item [1], wherein the heat-accumulating compound (B) is a fatty acid ester.

[0023] [3] The resin composition according to item [1] or [2], wherein the porous inorganic compound (C) is at least one compound selected from the group consisting of silicon dioxide, aluminum oxide, and carbon.

[0024] [4] The resin composition according to any one of items [1] to [3], wherein the oil absorption amount of the porous inorganic compound (C) is 4.5 g / g or more and 10.0 g / g or less.

[0025] [5] The resin composition according to any one of items [1] to [4], wherein the porous inorganic compound (C) is a hydrophobic silicon dioxide.

[0026] [6] The resin composition according to any one of items [1] to [5], wherein the heat of fusion of the crystal of the heat-accumulating compound (B) ΔHm is 150 J / g or more.

[0027] [7] The resin composition according to any one of items [1] to [6], wherein the content of the porous inorganic compound (C) is 1.5 parts by mass or more and less than 14 parts by mass.

[0028] [8] A molded body composed of the resin composition according to any one of items [1] to [7].

[0029] [9] A method for producing a resin composition, which is a method for producing the resin composition according to any one of items [1] to [7], having a step of kneading a thermoplastic resin (A), a heat-accumulating compound (B), and a porous inorganic compound (C) at a temperature of 200°C or higher.

[0030] Effects of the Invention

[0031] The resin composition of the present application can be produced by melt-kneading at a high temperature (e.g., a temperature of 200°C or higher). In addition, if the resin composition of the present application is used, a molded body having the property that a heat-accumulating compound (phase change material) does not leak out (does not bleed out) from the resin, and which is warm-sensitively controllable and excellent in brittleness resistance and lightness, can be produced. DETAILED DESCRIPTION

[0032] Hereinafter, the present application will be described in detail.

[0033] [Resin composition]

[0034] The resin composition according to the present application is characterized by comprising:

[0035] 100 parts by mass of a thermoplastic resin (A) satisfying the following requirements (a-1) to (a-3) below,

[0036] 10 to 100 parts by mass of a heat-accumulating compound (B) having a flash point of 200°C or higher (different from the above component (A)), and

[0037] 1.5 to 20 parts by mass of a porous inorganic compound (C) having an oil absorption of 4.0 g / g or more,

[0038] In a case where the content of the above porous inorganic compound (C) is set to 100 parts by mass, the content of the above heat-accumulating compound (B) is less than 700 parts by mass.

[0039] <Thermoplastic resin (A)>

[0040] The thermoplastic resin (A) used in the present application satisfies the following requirements (a-1) to (a-3).

[0041] (a-1) The density measured according to the method described in ASTM D 1505 is in the range of 0.80 to 1.0 g / cm 3 .

[0042] (a-2) The melt flow rate (MFR) measured according to the method described in ISO 1133 at 230°C under a load of 10 kg is in the range of 0.1 to 100 g / 10 min.

[0043] (a-3) The Shore A hardness (instantaneous value) measured according to the method described in ISO 7619 is in the range of 30 to 100.

[0044] The density in the requirement (a-1) is preferably in the range of 0.81 to 0.97 g / cm 3 , more preferably in the range of 0.82 to 0.94 g / cm 3 . By making the density of the thermoplastic resin (A) in the above range, a molded body excellent in lightness can be obtained.

[0045] The MFR in the requirement (a-2) is preferably in the range of 0.5 to 80 g / 10 min, more preferably in the range of 1 to 50 g / 10 min. By making the MFR of the thermoplastic resin (A) in the above range, the resin composition obtained is excellent in molding processability.

[0046] The Shore A hardness (instantaneous value) in the requirement (a-3) is preferably 40 to 90, more preferably 40 to 85, and further preferably 40 to 80. By making the Shore A hardness (instantaneous value) of the thermoplastic resin (A) within the above range, the brittle failure is less likely to occur even when the porous inorganic compound (C) is added within the prescribed range.

[0047] As the thermoplastic resin (A) as described above, there is no particular limitation as long as it satisfies the above requirements (a-1) to (a-3), and for example, olefin-based resins, styrene-based resins, acrylic-based resins, polyester-based resins, polyvinyl chloride-based resins, polyamide-based resins, polycarbonate-based resins, polylactic acid-based resins, polyimide-based resins, polysulfone-based resins, aromatic polyketone-based resins, and the like can be exemplified. These resins can be used alone or in combination of two or more, and commercially available products can also be used. Among the above, olefin-based resins are preferred, and olefin-based thermoplastic elastomers are more preferred.

[0048] As a preferred example of the olefin-based thermoplastic elastomer, a dynamic crosslinked body of an ethylene-α-olefin-non-conjugated polyene copolymer [I] (hereinafter also referred to as "ethylene-α-olefin-non-conjugated polyene copolymer [I]") and a polyolefin resin [II] can be exemplified.

[0049] The above dynamic crosslinked body can be a dynamic crosslinked body obtained by dynamically crosslinking one kind of ethylene-α-olefin-non-conjugated polyene copolymer [I] and one kind of polyolefin resin [II], or can be a dynamic crosslinked body obtained by dynamically crosslinking a plurality of kinds of ethylene-α-olefin-non-conjugated polyene copolymers [I] and a plurality of kinds of polyolefin resins [II].

[0050] In the present specification, the dynamic crosslinking refers to a process of crosslinking at least a part of carbon-carbon double bonds possessed by the ethylene-α-olefin-non-conjugated polyene copolymer [I] by kneading the ethylene-α-olefin-non-conjugated polyene copolymer [I] and the polyolefin resin [II] in a molten state.

[0051] • Ethylene-α-olefin-non-conjugated polyene copolymer [I]

[0052] The ethylene-α-olefin-non-conjugated polyene copolymer [I] contains a structural unit (a) derived from ethylene, a structural unit (b) derived from an α-olefin having 3 to 20 carbon atoms, and a structural unit (c) derived from a non-conjugated polyene.

[0053] The molar ratio (a) / (b) of the structural unit (a) to the structural unit (b) in the ethylene-α-olefin-non-conjugated polyene copolymer [I] is preferably 50 / 50 to 95 / 5, more preferably 60 / 40 to 80 / 20, and further preferably 65 / 35 to 75 / 25.

[0054] On the other hand, the specific amount of the structural unit (c) derived from the non-conjugated polyene in the ethylene-α-olefin-non-conjugated polyene copolymer [I] is preferably 2 to 20% by mass relative to the total amount of the ethylene-α-olefin-non-conjugated polyene copolymer [I].

[0055] Specific examples of the α-olefin having 3 to 20 carbon atoms constituting the ethylene-α-olefin-non-conjugated polyene copolymer [I] include propylene, 1-butene, 4-methyl-1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-undecene, 1-dodecene, 1-tridecene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-nonadecene, 1-eicosene, 9-methyl-1-decene, 11-methyl-1-dodecene, 12-ethyl-1-tetradecene, and the like.

[0056] Among them, propylene, 1-butene, 4-methyl-1-pentene, 1-hexene, and 1-octene are preferable. The ethylene-α-olefin-non-conjugated polyene copolymer [I] can contain only one kind of the structural unit (b) derived from the α-olefin, or can contain two or more kinds of the structural unit (b) derived from the α-olefin.

[0057] In addition, the non-conjugated polyene constituting the ethylene-α-olefin-non-conjugated polyene copolymer [I] is only required to be a compound having two or more carbon-carbon double bonds without having a conjugated structure. Specific examples thereof include chain-like non-conjugated dienes such as 1,4-hexadiene, 3-methyl-1,4-hexadiene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, 4,5-dimethyl-1,4-hexadiene, 7-methyl-1,6-octadiene, 8-methyl-4-ethylidene-1,7-nonadiene, 4-ethylidene-1,7-undecadiene, and the like; cyclic non-conjugated dienes such as methyltetrahydroindene, 5-ethylidene-2-norbornene, 5-methylene-2-norbornene, 5-isopropylidene-2-norbornene, 5-vinyl-2-norbornene, 6-chloromethyl-5-isopropenyl-2-norbornene, 5-isopropenyl-2-norbornene, 5-isobutenyl-2-norbornene, cyclopentadiene, norbornadiene, and the like; and trienes such as 2,3-diisopropylidene-5-norbornene, 2-ethylidene-3-isopropylidene-5-norbornene, 2-propenyl-2,2-norbornadiene, 4-ethylidene-8-methyl-1,7-nonadiene, and the like.

[0058] Among these non-conjugated polyenes, 5-ethylidene-2-norbornene (ENB) and 5-vinyl-2-norbornene (VNB) are particularly preferable. The ethylene-α-olefin-non-conjugated polyene copolymer [I] can contain only one kind of the structural unit (c) derived from the non-conjugated polyene, or can contain two or more kinds of the structural unit (c) derived from the non-conjugated polyene.

[0059] Note that the ethylene-α-olefin-non-conjugated polyene copolymer [I] can also be a so-called oil-extended rubber in which a softening agent, preferably a mineral oil-based softening agent, is incorporated at the time of its production. The mineral oil-based softening agent can be provided as a hitherto known mineral oil-based softening agent, examples of which include paraffin-based process oil and the like.

[0060] The ethylene-α-olefin-non-conjugated polyene copolymer [I] described above can be produced by a hitherto known method.

[0061] • Polyolefin resin [II]

[0062] The polyolefin resin [II] is a resin of a polyolefin system that substantially has no unsaturated bond in the main chain. Specific examples thereof include homopolymers of α-olefins such as ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-octene, 1-decene, and the like; and copolymers thereof. Note that in the case where the polyolefin resin [II] is a copolymer, the content of any one of the α-olefins is preferably 90 mol% or more.

[0063] In addition, the polyolefin resin [II] is particularly preferably a propylene-based polymer (II-1) having propylene as a main component, or an ethylene-based polymer (II-2) having ethylene as a main component.

[0064] Examples of the propylene-based polymer (II-1) include homopolymers of propylene; random copolymers of propylene and α-olefins having 2 to 10 carbon atoms (for example, ethylene, 1-butene, 1-pentene, 4-methyl-1-pentene, and the like); block copolymers of a homopolymer of propylene and an amorphous or low-crystalline propylene-ethylene random copolymer; and the like. However, the amount of structural units other than propylene is preferably 10 mol% or less relative to the total amount of structural units.

[0065] Note that the propylene-based polymer (II-1) can be a propylene-based polymer polymerized by a known polymerization method, or can be a propylene-based polymer produced and sold as a polypropylene resin.

[0066] Further, the propylene-based polymer (II-1) preferably has an isotactic structure, but can have a syndiotactic structure, a mixed structure of these structures, or can have a structure including a part of a random structure.

[0067] On the other hand, examples of the ethylene-based polymer (II-2) include homopolymers of ethylene; random copolymers of ethylene and α-olefins having 3 to 10 carbon atoms (for example, propylene, 1-butene, 1-pentene, 4-methyl-1-pentene, and the like). In the ethylene-based polymer (II-2), the amount of structural units other than ethylene is preferably 10 mol% or less relative to the total amount of structural units.

[0068] The ethylene-based polymer (II-2) can be an ethylene-based polymer polymerized by a publicly known polymerization method, or can be an ethylene-based polymer manufactured and sold as a high-pressure process low-density polyethylene, a linear low-density polyethylene, a high-density polyethylene, or the like.

[0069] • Method for producing dynamic crosslinker

[0070] The above dynamic crosslinker can be produced by adding the above ethylene-α-olefin-non-conjugated polyene copolymer [I] and the polyolefin resin [II], and, as necessary, a publicly known crosslinking agent, a crosslinking aid, and a softening agent, and performing kneading (dynamic crosslinking). Alternatively, a commercially available product can be used. In performing the dynamic crosslinking, either a non-open type device or an open type device can be used, but a non-open type device is preferred.

[0071] The dynamic crosslinking is preferably performed in an atmosphere of a non-reactive gas such as nitrogen or carbon dioxide. The temperature at the time of performing the dynamic crosslinking is generally in the range from the melting point of the polyolefin resin [II] to 300°C, and is preferably 150 to 270°C, and more preferably 170 to 250°C. The kneading time is preferably 1 to 20 minutes, and more preferably 1 to 10 minutes. In addition, the shear rate at this time is preferably 10 to 50,000 sec -1 , and more preferably 100 to 20,000 sec -1 .

[0072] Examples of the kneading device used for the dynamic crosslinking include a mixing roll, an intensive mixer (e.g., a Banbury mixer, a kneader), a single-screw or twin-screw extruder, and the like, but a non-open type device is preferred, and a twin-screw extruder is particularly preferred.

[0073] <Heat-accumulating Compound (B)>

[0074] The heat-accumulating compound (B) used in the present application is used as a phase change material, and is a compound having a flash point of 200°C or higher, preferably 210°C or higher and 300°C or lower, more preferably 220°C or higher and 290°C or lower, and further preferably 220°C or higher and 280°C or lower (but is a compound other than the above component (A)). By having a flash point in the above range, even when melt-kneaded together with the component (A) or the like at a high temperature of 200°C or higher, it can be contained in the resin composition without thermal decomposition, and can exert an excellent phase change effect.

[0075] The crystal melting heat amount ΔHm of the heat-accumulating compound (B) is preferably 150 J / g or more, more preferably 180 J / g or more and 300 J / g or less, further preferably 210 J / g or more and 290 J / g or less, particularly preferably 210 J / g or more and 280 J / g or less. By setting the crystal melting heat amount ΔHm of the heat-accumulating compound (B) within the above range, the above effects are enhanced.

[0076] As the heat-accumulating compound (B) as described above, for example, a compound having a chain structure not containing a ring, a multiple bond, and having a small volume, a structure having a hydrocarbon, a structure having a hydrogen bonding unit such as a carbonyl group, a hydroxyl group, or the like can be exemplified. More specifically, a fatty acid ester, an aliphatic alcohol, a fatty acid, or the like can be exemplified, of which a fatty acid ester is preferred, and a fatty acid ester in which the substituents at both ends of the ester are chain-like is more preferred.

[0077] As the fatty acid ester, for example, isocetyl myristate, octyldodecyl myristate, isocetyl isostearate, cetyl 2-ethylhexanoate, isocetyl stearate, 2-ethylhexyl palmitate, isotridecyl stearate, butyl stearate, dodecyl stearate, myristyl myristate, cetyl myristate, cetyl palmitate, stearyl stearate, behenyl behenrate, or the like can be exemplified. Of these, stearyl stearate, myristyl myristate, cetyl myristate, and behenyl behenrate are preferred.

[0078] As the aliphatic alcohol, an aliphatic alcohol having 20 or more carbon atoms is preferred, and, for example, behenyl alcohol or the like can be exemplified. As the fatty acid, a fatty acid having 20 or more carbon atoms is preferred, and, for example, behenic acid or the like can be exemplified.

[0079] The heat-accumulating compound (B) can be appropriately selected depending on the desired phase change temperature (heat retaining temperature), and one kind can be used alone or two or more kinds can be used in combination.

[0080] < Porous Inorganic Compound (C) >

[0081] The oil absorption amount of the porous inorganic compound (C) used in the present application is 4.0 g / g or more, preferably 4.5 g / g or more and 10.0 g / g or less, more preferably 5.0 g / g or more and 9.5 g / g or less, further preferably 5.0 g / g or more and 9.0 g / g or less. By setting the oil absorption amount of the porous inorganic compound (C) within the above range, the heat-accumulating compound (B) can be more retained, and thus leakage of the heat-accumulating compound (B) from the resin, i.e., bleeding, at the time of molding into a molded body can be suppressed.

[0082] The average particle diameter of the porous inorganic compound (C) is preferably 1 μm or more and 100 μm or less. By setting the average particle diameter of the porous inorganic compound (C) within the above range, the above effects are further improved. Note that the above average particle diameter is a value measured using a device and analysis method suitable for the particle diameter, such as a value measured by a laser diffraction / scattering method.

[0083] As the porous inorganic compound (C), there is no particular limitation as long as it is a porous inorganic compound having the above oil absorption amount, but from the viewpoint of having excellent heat resistance, for example, silica, alumina, and carbon, etc. can be given. They can be used alone or two or more kinds can be used. Among the above, silica is preferred, and from the viewpoint of being able to further improve the oil absorption effect, hydrophobic silica is more preferred.

[0084] In addition, as the porous inorganic compound (C), it is preferred that it be a porous inorganic compound that, when the state of the heat accumulating compound (B) is maintained, is not easily volatilized and not easily ignited at or above the melting point (melting peak temperature) of the heat accumulating compound (B) compared to when the heat accumulating compound (B) is alone. As such a preferred porous inorganic compound (C), for example, "AEROS" manufactured by THILLIUM Co. can be given.

[0085] <Composition>

[0086] Regarding the content of each component in the resin composition of the present application, relative to 100 parts by mass of the thermoplastic resin (A),

[0087] The content of the heat accumulating compound (B) is 10 to 100 parts by mass, preferably 12 to 80 parts by mass, and more preferably 15 to 50 parts by mass,

[0088] The content of the porous inorganic compound (C) is 1.5 to 20 parts by mass, preferably 2.0 to 18 parts by mass, and more preferably 2.5 to 16 parts by mass. In addition, the content of the porous inorganic compound (C) can be set to 1.5 parts by mass or more and less than 14 parts by mass, 2.0 parts by mass or more and less than 14 parts by mass, or 2.5 parts by mass or more and less than 14 parts by mass.

[0089] In addition, in the case where the content of the porous inorganic compound (C) is set to 100 parts by mass, the content of the heat accumulating compound (B) is less than 700 parts by mass, preferably 100 parts by mass or more and less than 700 parts by mass, and more preferably 200 parts by mass or more and less than 700 parts by mass.

[0090] By setting the contents of each component to satisfy the above conditions, a molded body in which the heat accumulating compound (B) does not leak out (does not exude) from the resin when the molded body is produced, in which sufficient phase change effects are obtained, and which has excellent brittleness resistance and lightness can be obtained.

[0091] <Optional Component>

[0092] The resin composition of the present application can contain, as an optional component, a lubricant, a nucleating agent, a filler, an antioxidant, a weathering stabilizer, a colorant (including a thermochromic material), a foaming agent, a pigment, a dye, an antistatic agent, a flame retardant, and the like, in addition to the above components (A) to (C), without impairing the effects of the present application.

[0093] <Manufacturing Method of Resin Composition>

[0094] The manufacturing method of the resin composition of the present application has a step of mixing a thermoplastic resin (A), a heat-accumulating compound (B), a porous inorganic compound (C), and an optional component, if necessary, at a temperature of 200°C or higher, preferably 210°C or higher and 300°C or lower, more preferably 220°C or higher and 260°C or lower. The mixing time is usually 1 to 20 minutes, and preferably 1 to 10 minutes.

[0095] As the mixing device, a mixing roll, a powerful mixer (e.g., a Banbury mixer, a kneader), a single-screw or twin-screw extruder, or the like can be used, but a non-open type device is preferred.

[0096] [Shaped Body]

[0097] The shaped body of the present application is composed of the above resin composition of the present application. As the shaping method, various publicly known methods can be employed. Specifically, extrusion molding, press molding, injection molding, calender molding, hollow molding, and the like can be mentioned. In addition, a shaped body such as a sheet obtained by the above shaping method can be subjected to secondary processing such as thermoforming, or laminated with other materials to produce a shaped body.

[0098] The use of the shaped body of the present application is not particularly limited, and is suitable for various publicly known uses such as automobile parts, civil engineering / building material products, electrical / electronic parts, sanitary products, films / sheets, foamed bodies, and the like. In particular, it is also useful as a material for a steering wheel portion, an instrument panel portion, wearable materials, clothing materials, shoes, various cold-keeping materials, cold-keeping containers, heat-keeping materials, and heat-keeping containers, which become high in temperature in a car in summer.

[0099] Examples

[0100] Hereinafter, the present application will be more specifically described based on examples, but the present application is not limited by these examples in any way.

[0101] [Materials]

[0102] The components of the resin compositions produced in the examples and comparative examples are as described below.

[0103] <Thermoplastic Resin>

[0104] • A-1: "Milastomer 6010NST" manufactured by Mitsui Chemicals, Inc. (crosslinked thermoplastic elastomer in which olefin-based rubber (EPT) and olefin-based resin (PP) are main components, density: 0.88 g / cm 3 , MFR (230°C, 10 kg load): 12 g / 10 min, Shore A hardness (instantaneous value): 70)

[0105] • A'-2: polyvinyl chloride (density: 1.2 g / cm 3 , Shore A hardness (instantaneous value): 70)

[0106] <Thermal Storage Compound (Phase Change Material)>

[0107] • B-1: "EXCEPARL SS" manufactured by Showa Denko K.K. (stearyl stearate, flash point: 258°C, ΔHm: 234 J / g)

[0108] • B-2: "EXCEPARL MY-M" manufactured by Showa Denko K.K. (myristyl myristate, flash point: 239°C, ΔHm: 229 J / g)

[0109] • B-3: "SPERMACETI" manufactured by NOF Corporation (cetyl myristate, flash point: 228°C, ΔHm: 241 J / g)

[0110] • B-4: "Unistar M-2222SL" manufactured by NOF Corporation (behenyl behenate, flash point: 270°C, ΔHm: 224 J / g)

[0111] • B'-5: "Octadecane" manufactured by Fuji Photo Film Co., Ltd. and Otsuka Pharmaceutical Co., Ltd. (flash point: 154°C)

[0112] • B'-6: melamine capsule "PMCD-28SP" manufactured by Mikasa Riken Industrial Co., Ltd. (flash point: 160°C)

[0113] <Poriferous Inorganic Material>

[0114] • C-1: hydrophobic silica ("AEROS" manufactured by THILLIUM Co., Ltd., oil absorption: 7 g / g)

[0115] • C'-2: activated carbon ("SUMILAY" manufactured by Takahashi & Co., Ltd., oil absorption: 3.4 g / g)

[0116] 3.4 g / g)

[0117] [Examples 1 to 6 and Comparative Examples 1 to 14]

[0118] Using a Labo Plastomill (Toyo Seiki Co., Ltd. "80C100"), the amounts (parts by weight) of thermoplastic resin, heat-retaining compound (phase change material), and porous inorganic material shown in Table 1 were mixed for 5 minutes at a temperature of 240°C and a torque of 30 rpm. After mixing, the mixture was quickly recovered. The resulting mixture was then finely cut into pieces approximately 0.5 cm × 0.5 cm × 0.5 cm using scissors.

[0119] Place Teflon (registered trademark) sheets and a mold sequentially on a stainless steel plate (hereinafter referred to as "SUS plate"). Fill the opening of the mold with the prepared material obtained above. After filling with the prepared material, stack the Teflon (registered trademark) sheets and SUS plates in that order. It should be noted that the Teflon (registered trademark) sheets are used to prevent the mixture from adhering to the SUS plate due to heat pressing. The mold is 6.5cm long, 6.5cm wide, and available in three thicknesses (1mm, 2mm, and 5mm).

[0120] The obtained laminate was hot-pressed at 240°C and 10 MPa for 5 minutes using a compression molding machine (ASF-10 manufactured by Shinto Metal Industries, Ltd.). Then, while held in place by an SUS sheet, it was rapidly transferred to a compression molding machine (NSF-37 manufactured by Shinto Metal Industries, Ltd.) and cooled at 10 MPa for 5 minutes. After cooling, the SUS sheet and Teflon (registered trademark) sheet were removed from the mold to obtain hot-pressed sheet samples with the thicknesses listed in Table 1. The hot-pressed sheet samples were evaluated as follows.

[0121] <Exudation>

[0122] Clamp the hot-pressed sheet sample obtained above with its top and bottom edges parallel to the cleaning paper, using a 6.5cm x 6.5cm surface. Then, clamp it further with an SUS plate and hot-press it for 5 minutes using a compression molding machine (ASF-10 manufactured by Shinto Metal Industries, Ltd.) at 100°C and 10MPa. After hot pressing, quickly peel the hot-pressed sheet sample from the cleaning paper. Check the condition of the cleaning paper; for areas where the sheet was placed, a "zero" result (no trace) is evaluated as "zero: no leakage," and a "×" result (traces) is evaluated as "×: leakage."

[0123] <Brittle Resistance>

[0124] The hot press sheet sample obtained above was cut into a size of 1.0 cm in length and 6.5 cm in width to prepare a test piece for a tensile test, and a TENSILON universal testing machine (type: RTG-1225) was used to measure the tensile elongation of the test piece at a tensile speed of 300 mm / min and a distance between clamps of 50 mm. The value of the tensile elongation at the time of breakage of the test piece was set as the elongation (%) = the elongation value (mm) / the distance between clamps (mm), and based on the measured elongation, evaluation was performed according to the following criteria.

[0125] O: greater than 10%

[0126] Δ: 5 to 10%

[0127] X: less than 5%

[0128] <Thermal retention>

[0129] About 5 mg was cut from the hot press sheet sample obtained above, and a differential scanning calorimeter (DSC) was used to perform measurement under the following conditions.

[0130] • Measuring device: X-DSC7000 (manufactured by SII)

[0131] • Temperature: from -40°C, increased to 100°C, and after maintaining at 100°C for 1 minute, decreased to -40°C

[0132] • Temperature increase and decrease rates: both 3°C / min

[0133] • Measurement atmosphere: nitrogen

[0134] • Pretreatment: none

[0135] • Pan: simple seal pan

[0136] From the melting peak obtained by measurement, information on the enthalpy of fusion ΔH (J / g) of the thermal storage compound (phase change material) was obtained. Based on the value of ΔH obtained, evaluation was performed according to the following criteria.

[0137] O: greater than 50 J / g

[0138] Δ: 25 to 50 J / g

[0139] X: less than 25 J / g

[0140] <Light weight>

[0141] The weight of the hot press sheet sample obtained above was measured using a precision balance, and the value obtained by dividing the volume of the hot press sheet was set as the density. Based on the value of the density obtained, evaluation was performed according to the following criteria.

[0142] O: less than 0.9 g / cm 3

[0143] Δ: 0.9 g / cm 3 above and less than 1 g / cm 3

[0144] X: 1 g / cm 3 above

[0145] <Overall Evaluation>

[0146] The overall evaluation of the case where at least one of the above evaluations has an X is X (not suitable).

[0147] [Table 1]

[0148]

[0149] The overall evaluation of Examples 1 to 6 was "O", but Comparative Examples were all "X". Note that in Comparative Examples 13 and 14, the heat storage compound (phase change material) volatilized when the hot-pressed tablet samples were produced, and hot-pressed tablet samples could not be produced, and evaluation was not possible, and therefore the overall evaluation was also set to "X".

Claims

1. A resin composition comprising: 100 parts by weight of thermoplastic resin (A) that meets the following requirements (a-1) to (a-3) 10 to 100 parts by weight of a heat-retaining compound (B) that has a flash point of 200°C or higher and is different from the thermoplastic resin (A), and 1.5–20 parts by mass of porous inorganic compound (C) with an oil absorption capacity of 4.0 g / g or more. When the content of the porous inorganic compound (C) is set to 100 parts by mass, the content of the heat-retaining compound (B) is less than 700 parts by mass. The thermoplastic resin (A) comprises a dynamic crosslink of ethylene-α-olefin-nonconjugated polyene copolymer [I] with 3 to 20 carbon atoms and polyolefin resin [II]. The porous inorganic compound (C) contains silicon dioxide. (a-1) The density, determined according to the method described in ASTM D 1505, is 0.80–1.0 g / cm³. 3 Scope; (a-2) The melt flow rate (MFR) measured at 230°C and 10 kg load according to the method described in ISO 1133 is in the range of 0.1 to 100 g / 10 min. (a-3) The instantaneous Shore A hardness, determined according to the method described in ISO 7619, is in the range of 30 to 100.

2. The resin composition according to claim 1, wherein the heat-retaining compound (B) is a fatty acid ester.

3. The resin composition according to claim 1 or 2, wherein the oil absorption of the porous inorganic compound (C) is 4.5 g / g or more and 10.0 g / g or less.

4. The resin composition according to claim 1 or 2, wherein the porous inorganic compound (C) is hydrophobic silica.

5. The resin composition according to claim 1 or 2, wherein the heat of fusion ΔHm of the heat storage compound (B) is 150 J / g or more.

6. The resin composition according to claim 1 or 2, wherein the content of the porous inorganic compound (C) is 1.5 parts by mass or more and less than 14 parts by mass.

7. A molded article comprising the resin composition according to any one of claims 1 to 6.

8. A method for manufacturing a resin composition, which is the method for manufacturing the resin composition according to any one of claims 1 to 6, comprising a step of mixing a thermoplastic resin (A), a heat-retaining compound (B), and a porous inorganic compound (C) at a temperature of 200°C or higher.

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