Sensor unit, mobile body positioning device, and mobile body

Abstract

This application provides a sensor unit, a moving body positioning device, and a moving body, which reduces residual foreign matter between the surface-mounted accelerometer and the substrate, thereby stabilizing the signal output from the accelerometer. The sensor unit includes a circuit board (15), which has multiple electrode pads on a first surface. Multiple mounting terminals of an inertial sensor are respectively mounted on the multiple electrode pads via connecting members. The first surface of the circuit board includes: an insulating layer, which, when viewed from above, is located on the outer side of the multiple electrode pads; a first region, in which, when viewed from above, the portion overlapping with the central region of the inertial sensor that is further inward than the mounting terminals, is not provided with an insulating layer; and a second region, from the first region to the outer side of the inertial sensor, is not provided with an insulating layer.

Description

[0001] This application is a divisional application of patent application No. 201910226999.4, filed on March 25, 2019, entitled "Sensor Unit, Mobile Positioning Device and Mobile Body", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to sensor units, mobile positioning devices, portable electronic devices, electronic devices, mobile bodies, and display devices. Background Technology

[0003] Previously, sensor units were known to have inertial sensors such as accelerometers and angular velocity sensors mounted on a substrate that detects inertia based on a specified detection axis, and the substrate was housed in a housing. For example, Patent Document 1 describes an inertial measurement unit (IMU) in which connectors, angular velocity sensors, accelerometers, etc., are mounted on a substrate whose surface is protected by a resist.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2017-20829

[0005] However, the inertial measurement device (sensor unit) in Patent Document 1 has the following problem: foreign matter may sometimes remain between the surface-mount inertial sensor (accelerometer, etc.) and the substrate, and due to the foreign matter, the bias signal (detection output signal) may be subject to temperature hysteresis. Summary of the Invention

[0006] The sensor unit of this application is characterized by comprising: an inertial sensor; a circuit board, wherein a plurality of electrode pads are included on a first surface of the circuit board, and a plurality of mounting terminals of the inertial sensor are respectively mounted on the plurality of electrode pads via connecting components; and a housing, wherein the circuit board is housed inside the housing, and the first surface of the circuit board includes: an insulating layer, which, when viewed from above, is disposed on the outer side of the plurality of electrode pads; a first region, wherein, when viewed from above, the first region does not have the insulating layer disposed in the portion overlapping with the central region of the inertial sensor that is further inward than the mounting terminals; and a second region, wherein, when viewed from above, the second region does not have the insulating layer disposed from the first region to the outer side of the inertial sensor.

[0007] In the above-described sensor unit, it is preferable that recesses are provided in the first region and the second region of the first surface of the circuit board.

[0008] In the aforementioned sensor unit, preferably, a through hole penetrating the circuit board is provided in the first region of the circuit board substrate.

[0009] In the aforementioned sensor unit, it is preferable that the second region is located between adjacent electrode pads.

[0010] In the aforementioned sensor unit, preferably, when viewed from above, a circumferential protrusion or an unconnected protrusion is provided between the center of the inertial sensor and the electrode pad.

[0011] In the aforementioned sensor unit, preferably, the circumferential protrusion or the unconnected protrusion is closer to the electrode pad than to the center side of the inertial sensor.

[0012] In the aforementioned sensor unit, preferably, the circumferential protrusion or the unconnected protrusion is an insulating layer.

[0013] In the aforementioned sensor unit, preferably, when viewed from above, the inertial sensor is quadrilateral, and the plurality of mounting terminals are disposed on a pair of opposite sides of the quadrilateral.

[0014] In the above sensor unit, preferably, the inertial sensor is an acceleration sensor.

[0015] The mobile body positioning device of this application is characterized by comprising: the aforementioned sensor unit; a receiving unit for receiving satellite signals superimposed with position information from a positioning satellite; an acquisition unit for acquiring position information of the receiving unit based on the received satellite signals; a calculation unit for calculating the posture of the mobile body based on inertial data output from the sensor unit; and a calculation unit for calculating the position of the mobile body by correcting the position information based on the calculated posture.

[0016] The portable electronic device of this application is characterized by comprising: the aforementioned sensor unit; a housing housing the sensor unit; a processing unit housing the housing for processing output data from the sensor unit; a display unit housing the housing; and a light-transmitting cover blocking the opening of the housing.

[0017] In the aforementioned portable electronic devices, it is preferable to include a satellite positioning system to measure the user's moving distance and movement trajectory.

[0018] The electronic device of this application is characterized by comprising: the aforementioned sensor unit; and a control unit that performs control based on a detection signal output from the sensor unit.

[0019] The mobile body of this application is characterized by comprising: the aforementioned sensor unit; and a control unit that performs control based on the detection signal output from the sensor unit.

[0020] In the aforementioned mobile body, preferably, it includes at least one of an engine system, a braking system, and a keyless entry system, and the control unit controls the system based on the detection signal.

[0021] The mobile body of this application is characterized by comprising: the aforementioned sensor unit; and a control unit, wherein the control unit controls at least one of acceleration, braking, and steering based on a detection signal detected by the sensor unit, and the implementation or non-implementation of autonomous driving is switched according to changes in the detection signal from the sensor unit.

[0022] The display device of this application is characterized by comprising: a display unit worn on a user's head, which illuminates image light to the user's eyes; and the aforementioned sensor unit, which is located on one side of the center of the head when worn. Attached Figure Description

[0023] Figure 1 It is a three-dimensional view showing the sensor unit fixed to the mounting surface.

[0024] Figure 2 It means from Figure 1 A perspective view of the sensor unit from the mounting side.

[0025] Figure 3 From and Figure 2 Exploded stereoscopic view of the sensor unit observed from the same direction.

[0026] Figure 4 It is a three-dimensional view showing the approximate structure of a circuit unit.

[0027] Figure 5 This is a plan view illustrating the structure of the X-axis and Y-axis accelerometers.

[0028] Figure 6 This is a plan view illustrating the structure of the Z-axis accelerometer.

[0029] Figure 7A It is a plan view showing the configuration pattern of the insulating layer of a circuit board.

[0030] Figure 7B It is along Figure 7A A cross-sectional view of line AA in the diagram.

[0031] Figure 7C This is a cross-sectional view showing the mounting state of the accelerometer on the circuit board.

[0032] Figure 8 This is a graph showing the temperature characteristics of the acceleration output of a sensor unit using a circuit board with this structure.

[0033] Figure 9A This is a plan view showing the configuration pattern of the insulating layer of the circuit board of the comparative example.

[0034] Figure 9B It is along Figure 9A A cross-sectional view of the BB line in the diagram.

[0035] Figure 10 This is a graph showing the temperature characteristics of the acceleration output of the sensor unit using the circuit board of the comparative example.

[0036] Figure 11A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 1.

[0037] Figure 11B It is along Figure 11A A cross-sectional view of the CC line in the diagram.

[0038] Figure 12A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 2.

[0039] Figure 12B It is along Figure 12A A cross-sectional view of the DD line in the diagram.

[0040] Figure 13A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 3.

[0041] Figure 13B yes Figure 13A Enlarged view of part P in the image.

[0042] Figure 14A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 4.

[0043] Figure 14B It is along Figure 14A A cross-sectional view of the EE line in the diagram.

[0044] Figure 15 It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 5.

[0045] Figure 16A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 6.

[0046] Figure 16B It is along Figure 16A A cross-sectional view of the FF line in the diagram.

[0047] Figure 17 This is a block diagram representing the overall system of the mobile positioning device.

[0048] Figure 18 This is a diagram schematically illustrating the function of a positioning device for a moving object.

[0049] Figure 19 This is a three-dimensional diagram schematically illustrating the structure of a mobile personal computer as an example of an electronic device.

[0050] Figure 20 This is a three-dimensional diagram schematically representing the structure of a smartphone (portable phone) as an example of an electronic device.

[0051] Figure 21 This is a three-dimensional diagram showing the structure of a digital camera, an example of an electronic device.

[0052] Figure 22 It is a schematic plan view representing the structure of a portable electronic device.

[0053] Figure 23 It is a functional block diagram that represents the general structure of a portable electronic device.

[0054] Figure 24 This is a three-dimensional diagram showing the structure of a car as an example of a moving body.

[0055] Figure 25 It is a diagram showing the general structure of a driving assistance system.

[0056] Figure 26 This is a functional block diagram representing the general structure of a driving assistance system.

[0057] Figure 27 This is an explanatory diagram showing the schematic structure of a head-mounted display device.

[0058] Explanation of reference numerals in the attached figures

[0059] 1. Housing; 2. Threaded hole; 3. Interior; 4. Side wall; 5. Bottom wall; 6. First mating surface; 7. Top surface; 8. Cover; 10. Mating component; 11. First region; 12. Second region; 13. Connecting component; 14. Insulating layer; 15. Circuit board; 15f. First surface; 15r. Second surface; 16. Connector; 17x angular velocity sensor; 17y angular velocity sensor; 17z angular velocity sensor; 18. Accelerometer; 18d. Mounting terminal; 19. Control IC; 20. Inner shell as housing; 21. Opening; 22. Second mating surface; 25. Sensor module; 27. Lower surface ; 28 Recess; 31, 32, 33 Electrode pads; 34 Through hole; 70 Screw; 71 Mounting surface; 100 Sensor unit (inertial measurement device); 1100 Personal computer as electronic device; 1200 Smart phone (portable phone) as electronic device; 1300 Digital camera as electronic device; 1400 Wrist device as portable electronic device; 1500 Automobile as mobile body; 3000 Motion positioning device; 4000 Driving assistance system; 5000 Head-worn display device as display unit; S, Sn gap. Detailed Implementation

[0060] The following describes this embodiment. It should be noted that the embodiment described below is not intended to unduly limit the scope of the invention as defined in the claims. Furthermore, the structures described in this embodiment are not necessarily essential components of the invention.

[0061] <Sensor Unit>

[0062] (Overview of the sensor unit)

[0063] First, refer to Figure 1 and Figure 2 A summary of the sensor unit is provided. Figure 1 This is a perspective view showing the state in which the sensor unit involved in the embodiment is fixed to the mounting surface. Figure 2 It means from Figure 1 A perspective view of the sensor unit from the mounting side.

[0064] like Figure 1 As shown, sensor unit 100 is an inertial measurement unit (hereinafter referred to as IMU) that detects the posture and movement (inertial motion) of moving bodies (installed devices) such as automobiles, agricultural machinery, construction machinery, robots, and drones. Sensor unit 100 functions as a so-called 6-axis motion sensor, which includes a 3-axis accelerometer and a 3-axis angular velocity sensor as inertial sensors.

[0065] The sensor unit 100 is a cuboid with a roughly square planar shape, with dimensions of approximately 3 cm on one side and approximately 1 cm in thickness. Threaded holes 2 are formed near two vertices along the diagonal of the square, serving as mounting points. The sensor unit 100 is used by inserting two screws 70 into these threaded holes 2 to fix it to the mounting surface 71 of a vehicle or similar device. It should be noted that the above dimensions are an example; by selecting components and modifying the design, it can be miniaturized to a size suitable for mounting in HMDs (head-mounted displays, smart glasses), smartphones, and digital cameras. It should also be noted that the opening on the side of the sensor unit 100 opposite to the mounting surface 71 is covered by a cover 8.

[0066] The sensor unit 100 employs a packaging structure with features designed to reduce noise vibrations, such as those from the vehicle's engine, transmitted from the mounting surface 71. This structure achieves higher reliability and more stable detection accuracy compared to conventional sensor units.

[0067] The packaging structure with this feature will be described in detail below. It should be noted that this structure is not limited to IMUs with 6-axis motion sensors; it can be applied to any unit or device with an inertial sensor.

[0068] like Figure 2 As shown, an opening 21 is formed on the surface of the sensor unit 100 as viewed from the mounting surface side. A plug-type (male) connector 16 is disposed inside (inner side) of the opening 21. The connector 16 has multiple pins, which are directly opposite to... Figure 2 The device is configured to extend laterally. A socket-type (female) connector (not shown) connects to the connector 16 from the mounted device, through which electrical signals such as the drive voltage and detection data of the sensor unit 100 are transmitted and received.

[0069] It should be noted that in the following description, the extension direction of these multiple pins is defined as the X-axis direction. In other words, within the square shape of the sensor unit 100, the pins directly facing... Figure 2 The direction of extension of the horizontal side is defined as the X-axis. Furthermore, the direction of extension of the side orthogonal to the X-axis in the square shape is defined as the Y-axis. Additionally, the thickness direction of the sensor unit 100 is defined as the Z-axis. A socket-type (female) connector (not shown) connects to the connector 16 from the mounted device, and the transmission and reception of electrical signals such as the drive voltage and detection data of the sensor unit 100 are performed between the two.

[0070] (Structure of the sensor unit)

[0071] Below, except Figure 1 and Figure 2 In addition, refer to Figure 3 This will explain the structure of the sensor unit. Figure 3 From and Figure 2 Exploded stereoscopic view of the sensor unit observed from the same direction.

[0072] like Figure 3 As shown, the sensor unit 100 includes a housing 1, a connecting member (buffer member) 10, a circuit board 15, and an inner housing 20. In other words, it is configured such that the circuit board 15 and the inner housing 20 are sequentially fitted (inserted) into the interior 3 of the housing 1, separated by the connecting member (buffer member) 10. Here, the portion consisting of the circuit board 15 and the inner housing 20, which serves as the housing containing the circuit board 15, is referred to as the sensor module 25. It should be noted that, for ease of explanation, the parts are referred to as the housing and the inner housing, but they can also be referred to as the first housing and the second housing.

[0073] The outer casing 1 is a box-shaped base made of aluminum. The material is not limited to aluminum; other metals such as zinc and stainless steel, resin, or composite materials of metal and resin can also be used. The outer casing 1 has the same overall shape as the aforementioned sensor unit 100, being a roughly square cuboid with threaded holes 2 formed near two diagonal vertices. It should be noted that the design is not limited to threaded holes 2; for example, it could be a structure where a notch is formed for threaded fastening (a notch is formed at the corner of the outer casing 1 with threaded holes 2), or a structure where a flange (ear) is formed on the side of the outer casing 1 and threaded fastening is performed on the flange portion. However, when using the former notch hole as a fixing part for threaded fastening, if the notch hole is wider than the screw diameter, the screw may misalign with the notch during threading, potentially causing the threaded fastening to come loose, or the notch portion of the outer casing may deform or be thinned due to the misaligned screw. Therefore, when a notch is provided as a fixing part, it is preferable to design the notch of the notch to be smaller than the diameter of the screw head that forms the seat surface.

[0074] The outer casing 1 is a rectangular, open-top box, with its interior 3 (inner side) forming an internal space (container) surrounded by a bottom wall 5 and side walls 4. In other words, the outer casing 1 is box-shaped with the side opposite the bottom wall 5 being an open surface, housing the sensor module 25 in a manner that covers most of the opening (by blocking the opening), and the sensor module 25 is exposed from the opening (see reference). Figure 2Here, the opening surface opposite to the bottom wall 5 refers to the same surface as the upper surface 7 of the outer shell 1. Furthermore, the planar shape of the interior 3 of the outer shell 1 is a hexagon formed by chamfering the corners of the two vertices of a square, with the chamfered vertices corresponding to the positions of the threaded holes 2. Additionally, in the cross-sectional shape (thickness direction) of the interior 3, a first mating surface 6, which is one step higher than the central portion, is formed on the bottom wall 5 at the periphery of the interior 3, i.e., the interior space. That is, the first mating surface 6 is a part of the bottom wall 5, a stepped section that surrounds the central portion of the bottom wall 5 when viewed from above and is formed in a ring shape; it is a surface whose distance from the opening surface (the same surface as the upper surface 7) is smaller than its distance from the bottom wall 5.

[0075] It should be noted that the example given is an open-top box-shaped outer shell 1, where the box shape is a cuboid with a roughly square planar shape. However, this is not a limitation; the planar shape of the outer shell 1 can be a polygon such as a hexagon or octagon, or a polygon with chamfered corners or curved sides. Furthermore, the planar shape of the interior 3 (inner side) of the outer shell 1 is not limited to a hexagon; it can also be a square or other polygonal shape such as a square (quadrilateral), octagon, etc. Additionally, the planar shapes of the outer shell 1 and the interior 3 can be similar or dissimilar.

[0076] The inner shell 20 is a component that supports the circuit board 15 and is shaped to be housed within the interior 3 of the outer shell 1. Specifically, in plan view, it is a hexagon formed by chamfering the corners of the two vertices of a square. In plan view, a rectangular opening 21 serving as a through hole and a recess 28 provided on the surface supporting the circuit board 15 are formed on the lower surface 27 of the hexagon. The two chamfered vertices correspond to the positions of the threaded holes 2 in the outer shell 1. The height in the thickness direction (Z-axis direction) is lower than the height from the upper surface 7 of the outer shell 1 to the first mating surface 6. In a preferred embodiment, the inner shell 20 is also formed by machining aluminum, but other materials can also be used, similar to the outer shell 1.

[0077] On the back side of the inner shell 20 (the side facing the outer shell 1), guide pins and support surfaces (neither shown) are formed for positioning the circuit board 15. The circuit board 15 is disposed on (positioned on) the guide pins and support surfaces and bonded to the back side of the inner shell 20. Details of the circuit board 15 will be described later. The peripheral portion of the back side of the inner shell 20 forms a second mating surface 22 composed of annular planes. The second mating surface 22, when viewed from above, has a shape substantially the same as the first mating surface 6 of the outer shell 1. When the inner shell 20 is disposed on the outer shell 1, the two surfaces face each other while the mating member 10 is held in place. It should be noted that the structure of the outer shell 1 and the inner shell 20 is one embodiment and is not limited to this structure.

[0078] (Structure of a circuit unit)

[0079] The following describes the structure of the circuit unit on which the inertial sensor is mounted on the circuit board 15, referring to... Figure 4 Please provide an explanation. Figure 4 It is a three-dimensional view showing the approximate structure of a circuit unit.

[0080] A connector 16, an angular velocity sensor 17z, an acceleration sensor 18, etc., are mounted on the first surface 15f (the surface on the inner shell 20 side) of the circuit board 15 constituting the circuit unit. The connector 16 is a plug-in type (male) connector, having two rows of connecting terminals arranged at equal intervals along the X-axis direction. Preferably, it is formed as a connecting terminal with 20 pins in total, with 10 pins in one row, but the number of terminals can also be appropriately changed according to the design specifications.

[0081] The angular velocity sensor 17z is a gyroscope sensor that detects the angular velocity of one axis in the Z-axis direction. As a preferred example, a vibrating gyroscope sensor is used, employing a crystal as an oscillator and detecting the angular velocity based on the Coriolis force applied to the vibrating object. It should be noted that the sensor is not limited to a vibrating gyroscope sensor; any sensor capable of detecting angular velocity is acceptable. For example, sensors using ceramic or silicon as oscillators can also be used.

[0082] Furthermore, on the side of the circuit board 15 in the X-axis direction, an angular velocity sensor 17x for detecting the angular velocity of one axis in the X-axis direction is mounted orthogonally to the X-axis via a mounting surface (mounting surface). Similarly, on the side of the circuit board 15 in the Y-axis direction, an angular velocity sensor 17y for detecting the angular velocity of one axis in the Y-axis direction is mounted orthogonally to the Y-axis via a mounting surface (mounting surface). It should be noted that the structure is not limited to using three angular velocity sensors for each axis; any sensor capable of detecting the angular velocity of three axes is acceptable. For example, a sensor device capable of detecting the angular velocity of three axes in a single device (package), such as the accelerometer sensor 18 described later, can also be used.

[0083] Accelerometer 18, used as an inertial sensor, is a capacitive accelerometer obtained by processing a silicon substrate using MEMS technology. It can detect acceleration in three directions (3 axes): the X, Y, and Z axes, using a single device. It should be noted that this type of sensor is not limited to any particular sensor; any sensor capable of detecting acceleration is acceptable. For example, it could be a piezoelectric accelerometer, a thermal accelerometer, or even a structure like the aforementioned angular velocity sensor, where one accelerometer is provided for each axis.

[0084] A control IC 19 is mounted on the back side of the circuit board 15 (the side facing the housing 1). The control IC 19 is a microcontroller unit (MCU), which integrates a storage unit including non-volatile memory, an A / D converter, etc., and controls various parts of the sensor unit 100. The storage unit stores programs specifying the order and content for detecting acceleration and angular velocity, programs for digitizing the detection data and embedding it into packet data, and accompanying data. It should be noted that several other electronic components are also mounted on the circuit board 15.

[0085] (Structure of X-axis and Y-axis accelerometers)

[0086] Here, regarding the structure of the X-axis acceleration sensor and the Y-axis acceleration sensor mounted on the acceleration sensor 18, which is an inertial sensor, please refer to... Figure 5 Please provide an explanation. Figure 5 This is a plan view illustrating the structure of the X-axis accelerometer.

[0087] Figure 5The X-axis accelerometer 101 shown detects acceleration Ax in the X-axis direction. This X-axis accelerometer 101 has a base 102 and an element 103. The element 103 is disposed on the base 102 and detects acceleration Ax (a physical quantity) in the X-axis direction. Furthermore, the element 103 includes: a fixed electrode 104 mounted on the base 102; a movable part 152 movable relative to the base 102 in the X-axis direction (a first direction, which is the detection axis of the physical quantity), via a spring 153; and a movable electrode 106 disposed on the movable part 152. Additionally, the fixed electrode 104 has a first fixed electrode 141 and a second fixed electrode 142 arranged along the Y-axis direction (a second direction, intersecting (or orthogonal to) the detection axis). Furthermore, the first fixed electrode section 141 has a first main body 411 and a plurality of first fixed electrode fingers 412, the first fixed electrode fingers 412 being disposed on both sides of the first main body 411 in the Y-axis direction (second direction), with their long sides along the second direction. Furthermore, the second fixed electrode section 142 has a second main body 421 and a plurality of second fixed electrode fingers 422, the second fixed electrode fingers 422 being disposed on both sides of the second main body 421 in the Y-axis direction (second direction), with their long sides along the second direction. Furthermore, the movable electrode section 106 has a first movable electrode section 161 and a second movable electrode section 162 arranged along the Y-axis direction (second direction). Furthermore, at least a portion of the first movable electrode section 161 has a plurality of first movable electrode fingers 611, the first movable electrode fingers 611 being located on both sides of the first main body 411 in the Y-axis direction (second direction), with their long sides along the second direction, and opposite the first fixed electrode fingers 412 in the X-axis direction (first direction). Furthermore, at least a portion of the second movable electrode section 162 has a plurality of second movable electrode fingers 621, which are located on both sides of the second main body 421 in the Y-axis direction (second direction), with their long sides along the second direction, and opposite to the second fixed electrode fingers 422 in the X-axis direction (first direction). By forming this structure, it is possible to maintain sufficiently large electrostatic capacitance between the first movable electrode fingers 611 and the first fixed electrode fingers 412, and between the second movable electrode fingers 621 and the second fixed electrode fingers 422, while shortening the first fixed electrode fingers 412 and 422, and the first movable electrode fingers 611 and 621, respectively. Therefore, an X-axis acceleration sensor 101 is formed that is difficult to break and has excellent impact resistance, including the first fixed electrode fingers 412, the second fixed electrode fingers 422, the first movable electrode fingers 611, and the second movable electrode fingers 621.

[0088] It should be noted that, although not illustrated, by arranging the base 102 and the element portion 103 provided on the base 102 in a direction aligned along the Y-axis, it is possible to achieve the following: Figure 5The X-axis accelerometer 101 shown is used as a Y-axis accelerometer to detect acceleration in the Y-axis direction.

[0089] (An acceleration sensor element that detects acceleration in the Z-axis direction)

[0090] Figure 6 This is a plan view illustrating the structure of the Z-axis accelerometer. For the structure of the Z-axis accelerometer mounted on the accelerometer 18, which functions as an inertial sensor, please refer to [reference needed]. Figure 6 Please provide an explanation.

[0091] The Z-axis accelerometer 201 includes a movable body 220. Furthermore, the movable body 220 has a first movable portion 220a and a second movable portion 220b. When viewed from above, the movable body 220 has the first movable portion 220a on one side orthogonal to the support axis Q, and the second movable portion 220b on the other side orthogonal to the support axis Q, with the support axis Q as the boundary. The movable body 220 also includes a third beam portion 243 and a fourth beam portion 244 connecting the first movable portion 220a and the second movable portion 220b; a first beam portion 241 connecting the first fixed portion 232 and the second fixed portion 234 to the third beam portion 243; a second beam portion 242 connecting the first fixed portion 232 and the second fixed portion 234 to the fourth beam portion 244; and an opening 226 disposed between the third beam portion 243 and the fourth beam portion 244 when viewed from above. The first movable part 220a is located on one side of the support shaft Q when viewed from above (viewed from the Z-axis direction) (in the example shown, it is on the -X-axis direction side). The second movable part 220b is located on the other side of the support shaft Q when viewed from above (in the example shown, it is on the +X-axis direction side).

[0092] When a vertical acceleration (e.g., gravitational acceleration) is applied to the movable body 220, rotational torques (force torques) are generated in the first movable part 220a and the second movable part 220b, respectively. Here, when the rotational torques of the first movable part 220a (e.g., counterclockwise rotational torque) and the second movable part 220b (e.g., clockwise rotational torque) are balanced, the tilt of the movable body 220 does not change, and acceleration cannot be detected. Therefore, the movable body 220 is designed such that when a vertical acceleration is applied, the rotational torques of the first movable part 220a and the second movable part 220b are not balanced, thereby producing a predetermined tilt in the movable body 220.

[0093] In the Z-axis accelerometer 201, by positioning the support shaft Q off-center from the center (center of gravity) of the movable body 220 (by making the distances from the support shaft Q to the front ends of the first movable part 220a and the second movable part 220b different), the first movable part 220a and the second movable part 220b have different masses. That is, the movable body 220 has different masses on one side (first movable part 220a) and the other side (second movable part 220b) with the support shaft Q as the boundary. In the illustrated example, the distance from the support shaft Q to the end face 223 of the first movable part 220a is greater than the distance from the support shaft Q to the end face 224 of the second movable part 220b. Furthermore, the thickness of the first movable part 220a and the thickness of the second movable part 220b are the same. Therefore, the mass of the first movable part 220a is greater than the mass of the second movable part 220b.

[0094] In this way, by making the first movable part 220a and the second movable part 220b have different masses, when a vertical acceleration is applied, the rotational torque of the first movable part 220a and the rotational torque of the second movable part 220b can be made unbalanced. Therefore, when a vertical acceleration is applied, the movable body 220 can be tilted in a predetermined manner.

[0095] It should be noted that, alternatively, the first movable part 220a and the second movable part 220b can have different masses by positioning the support shaft Q at the center of the movable body 220 and making the thicknesses of the first movable part 220a and the second movable part 220b different from each other, but this is not illustrated. In this case, the movable body 220 can also be tilted according to a specified angle when a vertical acceleration is applied.

[0096] The movable body 220 is disposed separately from the substrate 210. The movable body 220 is located above the recess 211. A gap is provided between the movable body 220 and the substrate 210. As a result, the movable body 220 can swing.

[0097] The movable body 220 has a first movable electrode 221 and a second movable electrode 222 disposed with the support shaft Q as the boundary. The first movable electrode 221 is disposed in the first movable part 220a. The second movable electrode 222 is disposed in the second movable part 220b.

[0098] The first movable electrode 221 is the portion of the movable body 220 that overlaps with the first fixed electrode 250 when viewed from above. The first movable electrode 221 forms an electrostatic capacitance C1 with the first fixed electrode 250. That is, the electrostatic capacitance C1 is formed by the first movable electrode 221 and the first fixed electrode 250.

[0099] The second movable electrode 222 is the portion of the movable body 220 that overlaps with the second fixed electrode 252 when viewed from above. The second movable electrode 222 forms an electrostatic capacitance C2 with the second fixed electrode 252. That is, the electrostatic capacitance C2 is formed by the second movable electrode 222 and the second fixed electrode 252. In the Z-axis accelerometer 201, the movable body 220 is made of a conductive material (silicon doped with impurities), thereby providing a first movable electrode 221 and a second movable electrode 222. That is, the first movable portion 220a functions as the first movable electrode 221, and the second movable portion 220b functions as the second movable electrode 222.

[0100] The electrostatic capacitances C1 and C2 are configured, for example, to be equal when the movable body 220 is horizontal. The positions of the first movable electrode 221 and the second movable electrode 222 change according to the movement of the movable body 220. The electrostatic capacitances C1 and C2 change according to the positions of the first movable electrode 221 and the second movable electrode 222. A predetermined potential is provided to the movable body 220 via the support portion 230.

[0101] A through-hole 225 is formed in the movable body 220. This reduces the influence of airflow (air resistance) when the movable body 220 swings. Multiple through-holes 225 are formed. In the illustrated example, the planar shape of the through-hole 225 is square.

[0102] An opening 226 is provided on the movable body 220, extending through the movable body 220. When viewed from above, the opening 226 is located on the support shaft Q. In the illustrated example, the opening 226 has a rectangular planar shape.

[0103] A support portion 230 is provided on the base plate 210. The support portion 230 is located in the opening 226. The support portion 230 supports the movable body 220. The support portion 230 has a first fixing portion 232, a second fixing portion 234, a first beam portion 241, a second beam portion 242, a third beam portion 243, and a fourth beam portion 244.

[0104] The first fixing part 232 and the second fixing part 234 are fixed to the substrate 210. The first fixing part 232 and the second fixing part 234 are provided to clamp the support shaft Q when viewed from above. In the example shown, the first fixing part 232 is provided on the +X axis direction side of the support shaft Q, and the second fixing part 234 is provided on the -X axis direction side of the support shaft Q.

[0105] (Structure of the circuit board)

[0106] The following describes the structure of the circuit board 15 that constitutes the circuit unit, referring to... Figure 7A , Figure 7B and Figure 7C Please provide an explanation. Figure 7AIt is a plan view showing the configuration pattern of the insulating layer of a circuit board.

[0107] Figure 7B It is along Figure 7A A cross-sectional view of line AA in the diagram. Figure 7C This is a cross-sectional view showing the state of the accelerometer sensor mounted on the circuit board.

[0108] The circuit board 15 is a multilayer substrate with multiple through holes, and uses a glass epoxy resin substrate. It should be noted that it is not limited to glass epoxy resin substrates; any rigid substrate capable of mounting multiple inertial sensors, electronic components, connectors, etc., is acceptable. For example, composite substrates and ceramic substrates can also be used.

[0109] On the first surface 15f of the circuit board 15, there are multiple mounting terminals for inertial sensors such as an accelerometer 18, a connector 16, and angular velocity sensors 17x, 17y, and 17z, which are mounted thereon via connecting members 13 such as solder or conductive adhesive, and multiple electrode pads 31, 32, and 33, as well as through holes 34. Furthermore, an insulating layer 14, for example made of photosensitive resin, is provided on the outer side of the multiple electrode pads 31, 32, and 33. In other words, each electrode pad 31, 32, and 33 is formed at an opening in the insulating layer 14. Additionally, the first surface 15f of the circuit board 15 includes a first region 11 and a second region 12 where the insulating layer 14 is not provided.

[0110] It should be noted that the accelerometer 18 in this embodiment is quadrilateral when viewed from above, facing the first surface 15f of the circuit board 15, and multiple mounting terminals are arranged on opposite sides of the quadrilateral. That is, multiple electrode pads 31 are arranged on the first surface 15f of the circuit board 15 corresponding to the mounting terminals. The accelerometer 18 is a surface mount device (SMD), and in this embodiment, it is surface mounted (SMT) on the multiple electrode pads 31 arranged on the first surface 15f of the circuit board 15 by soldering (connecting component 13).

[0111] The first region 11 is located in the central region, further inward than the electrode pad 31 used to mount the accelerometer 18, and is positioned overlapping the central portion of the accelerometer 18. The second region 12 extends from the first region 11 to the outer periphery of the accelerometer 18. That is, as... Figure 7CAs shown, a gap S, equivalent to the thickness of the insulating layer 14, is provided between the accelerometer 18 and the first surface 15f of the circuit board 15, where the mounting terminal 18d of the accelerometer 18 and the electrode pad 31 are connected by a connecting member 13 such as a solder joint. The gap S extends from a position overlapping the central portion of the accelerometer 18 to the outer periphery of the accelerometer 18.

[0112] That is, by not providing an insulating layer 14 between the central region of the accelerometer 18 and the circuit board 15, the sensor unit 100 allows the gap (spacing S) between the accelerometer 18 and the circuit board 15 to be larger than when the insulating layer 14 is provided. As a result, cleaning fluid used to remove foreign matter present between the accelerometer 18 and the circuit board 15 can easily enter the gap, improving the cleaning effect. In other words, foreign matter is less likely to remain in the gap (spacing S) between the accelerometer 18 and the circuit board 15, thus reducing the stress on the accelerometer 18 caused by changes in the state of the foreign matter, such as thermal expansion or contraction due to temperature changes. Therefore, the reduction in the detection accuracy of the accelerometer 18 related to temperature changes, such as the temperature hysteresis of the bias signal, can be reduced.

[0113] Specifically, regarding the effect of reducing the decrease in detection accuracy of the accelerometer 18 of the sensor unit 100 of the circuit board 15 having this structure when temperature changes occur, such as... Figure 8 The following explanation is provided. It should be noted that... Figure 10 The text shows examples of comparisons. Figure 9A and Figure 9B The diagram shows the structure of a circuit board without the first region 11 and the second region 12, and the output characteristics of an accelerometer sensor using this circuit board when a temperature change occurs. It should be noted that... Figure 8 This is a graph showing the temperature characteristics of the acceleration output of a sensor unit using a circuit board with the structure involved in this invention. Figure 9A This is a plan view showing the configuration pattern of the insulating layer of the circuit board of the comparative example. Figure 9B It is along Figure 9A A cross-sectional view of the BB line in the diagram.

[0114] Figure 10 This is a graph showing the temperature characteristics of the acceleration output of the sensor unit using the circuit board of the comparative example.

[0115] First, the circuit board 15n used as a comparative example does not have the first region 11 and the second region 12 as described above. That is, when the accelerometer 18 is connected to the circuit board 15n via surface mounting, the gap Sn between the bottom surface of the accelerometer 18 on the circuit board 15n side and the insulating layer 14n is small, for example, by soldering. With such a small gap Sn, the cleaning fluid used to remove foreign matter present between the accelerometer 18 and the circuit board 15n has difficulty penetrating between them, resulting in reduced cleaning effectiveness and incomplete removal of foreign matter, leading to residue. This residual foreign matter is located at the bottom of the accelerometer 18, and its state changes when the temperature changes. Specifically, the residual foreign matter expands at high temperatures and contracts at low temperatures. Sometimes this causes the accelerometer 18 to detect stress changes caused by the volume change of the residual foreign matter. As a result, when the temperature changes from a high-temperature side to a low-temperature side, stress changes occur... Figure 10 The diagram illustrates a bias shift (temperature hysteresis of the bias signal (detection output signal)) in the low-temperature region of the sensor. It should be noted that removing foreign matter remaining in such a narrow gap (Sn) requires increasing the number of cleaning cycles or extending the cleaning time, which increases the manufacturing workload of the sensor unit.

[0116] In contrast, Figure 7A In the circuit board 15 of the above-described embodiment, even when the accelerometer 18 is connected to the circuit board 15 via surface mounting, by not providing an insulating layer 14 between the central region of the accelerometer 18 and the circuit board 15, the gap (spacing S) between the accelerometer 18 and the circuit board 15 can be made larger than when an insulating layer 14 is provided. This improves the cleaning effect of residual foreign matter, allowing for easy removal of residual foreign matter through a single cleaning or a short cleaning time. Therefore, in Figure 7A In the circuit board 15 of the present embodiment shown above, the following can be obtained: Figure 8 The output characteristics (bias) of the detection acceleration bias shift phenomenon observed in the low-temperature region in the comparative example where residual foreign matter is present are not observed.

[0117] (Variations of the first and second regions)

[0118] It should be noted that the first region and the second region without the insulating layer 14 can be designed in various ways in the circuit board 15. Variations of the first region and the second region will be described below.

[0119] (Variation 1) First, refer to Figure 11A and Figure 11B The modified example 1 of the first and second regions will be explained. Figure 11A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 1. Figure 11B It is along Figure 11A A cross-sectional view of the CC line in the diagram.

[0120] like Figure 11A and Figure 11B As shown, the circuit board 15a of Modified Example 1 has an insulating layer 14a with a configuration pattern including a first region 11a formed by through holes 38, which are located in a region larger than the area where the accelerometer 18 is mounted (see reference 1). Figure 4 The electrode pad 31 used is located in the inner central region, overlapping with the central portion of the accelerometer 18. That is, the first region 11a is the region where the insulating layer 14a is not provided due to the through-hole 38. It should be noted that the through-hole 38 extends from the first surface 15f to the second surface 15r, which is opposite to the first surface 15f. Furthermore, the through-hole 38 does not have to be circular; it can be formed in any shape.

[0121] By providing such a first region 11a (through hole 38), a large space can be provided on the bottom side of the accelerometer 18, thereby reducing the residue of foreign matter, and further reducing the occurrence of residual foreign matter due to the sufficient spread of cleaning fluid.

[0122] (Variation Example 2)

[0123] Below, refer to Figure 12A and Figure 12B The modified example 2 of the first and second regions will be explained. Figure 12A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 2. Figure 12B It is along Figure 12A A cross-sectional view of the DD line in the diagram.

[0124] like Figure 12A and Figure 12B As shown, in Modification 2, the insulating layer 14b of the circuit board 15b has a first region 11b, which is located at a point where the accelerometer 18 is mounted (see reference). Figure 4The electrode pad 31 used is located in the central region further inside, overlapping the central portion of the accelerometer 18. Furthermore, in Modification 2, the insulating layer 14b of the circuit board 15b has a second region 12b at each of the four corners of the outer periphery of the accelerometer 18. The second region 12b extends from the first region 11b to the outer edge of the outer periphery of the accelerometer 18. Here, the first region 11b and the second region 12b are areas where the insulating layer 14b is not disposed. Additionally, in Modification 2, a recess 39 is provided at the position overlapping the first region 11b and the second region 12b, recessed from the first surface 15f towards the second surface 15r.

[0125] Thus, by providing recesses 39 in the first region 11b and the second region 12b, a large space can be provided between the accelerometer 18 and the circuit board 15b. This reduces the amount of foreign matter remaining, and further reduces the occurrence of residual foreign matter due to the sufficient spread of the cleaning fluid.

[0126] (Variation Example 3)

[0127] Below, refer to Figure 13A and Figure 13B The modified example 3 of the first and second regions will be explained. Figure 13A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 3. Figure 13B yes Figure 13A Enlarged view of part P in the image.

[0128] like Figure 13A and Figure 13B As shown, the circuit board 15c of Modified Example 3 has an insulating layer 14c with a first region 11c, which is located at a point where the accelerometer 18 is mounted (see reference). Figure 4 The electrode pad 31 used is located in the central region further inside, overlapping the central portion of the accelerometer sensor 18. Furthermore, in Modification 3, the insulating layer 14c of the circuit board 15c has a second region 12c, which extends from the first region 11c to the outer edge of the accelerometer sensor 18. Here, the first region 11c and the second region 12c are areas where the insulating layer 14c is not disposed. In Modification 3, the second region 12c is disposed between adjacent electrode pads 31, extending from the first region 11c to the outer edge of the accelerometer sensor 18.

[0129] In this way, by placing the second region 12c between adjacent electrode pads 31, the area of ​​the second region 12c connected to the first region 11c is increased, and the occurrence of residual foreign matter can be further reduced because the cleaning fluid also spreads sufficiently.

[0130] (Variation Example 4)

[0131] Below, refer to Figure 14A and Figure 14B The modified example 4 of the first and second regions will be explained. Figure 14A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 4. Figure 14B It is along Figure 14A A cross-sectional view of the EE line in the diagram.

[0132] like Figure 14A and Figure 14B As shown, in Modification 4, the insulating layer 14d of the circuit board 15d has a first region 11d, which is located at a point where the accelerometer 18 is mounted (see reference). Figure 4 The electrode pad 31 is located in the central region further inside, overlapping with the central part of the accelerometer 18. In the first region 11d, when viewed from above, there is a circumferential protrusion 14d2 between the center of the accelerometer 18 and the electrode pad 31, which is not connected at the four corners.

[0133] Here, the protrusion 14d2 is configured to be closer to the electrode pad 31 than to the center of the accelerometer 18. In this way, by configuring the protrusion 14d2 to be closer to the electrode pad 31 than to the center of the accelerometer 18, it is difficult for foreign objects to reach the center of the accelerometer 18 where foreign objects are prone to remain.

[0134] It should be noted that the protrusion 14d2 is preferably made of the insulating layer 14d. In this way, by making the protrusion 14d2 from the insulating layer 14d, the protrusion 14d2 can be easily formed in the same process as the insulating layer 14d.

[0135] Furthermore, in Modification 4, the insulating layer 14d of the circuit board 15d includes a second region 12d, which extends from the first region 11d to the outer edge of the outer periphery of the accelerometer 18 at the four corners of the outer periphery. Here, the first region 11d and the second region 12d are areas where the insulating layer 14d is not disposed.

[0136] According to the configuration pattern of the insulating layer 14d involved in Modification 4 as described above, a protrusion 14d2 is provided between the center of the accelerometer 18 and the electrode pad 31. As a result, the protrusion 14d2 can block foreign objects from entering the center of the accelerometer 18, which is prone to harboring foreign matter.

[0137] It should be noted that the convex part 14d2 can also be either circumferential or circumferential but not connected.

[0138] (Variation Example 5)

[0139] Below, refer to Figure 15 The modified example 5 of the first and second regions will be explained. Figure 15 It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 5.

[0140] like Figure 15 As shown, the circuit board 15e of Modified Example 5 has an insulating layer 14e with a first region 11e and a second region 12e. The first region 11e is located in the central region, which is further inward than the electrode pad 31 for mounting the accelerometer 18e, and is positioned to overlap with the central portion of the accelerometer 18e. The second region 12e extends from the first region 11e to the outer edge of the outer periphery of the accelerometer 18e. Here, the first region 11e and the second region 12e are areas where the insulating layer 14e is not disposed.

[0141] The accelerometer 18e used in this modification is quadrilateral when viewed from above, with multiple mounting terminals arranged on a pair of opposite sides of the quadrilateral. That is, multiple electrode pads 31 are arranged in parallel along a pair of opposite sides. Furthermore, the first region 11e and the second region 12e are configured to traverse a pair of sides of the accelerometer 18e in the direction where the electrode pads 31 are not arranged.

[0142] According to the configuration pattern of the insulating layer 14e as described in Modification 5 above, the second region 12e can be configured to extend towards the mounting terminal where the accelerometer 18e is not located. This allows for a wider second region 12e, enabling cleaning fluid containing foreign matter remaining in the gap between the accelerometer 18e and the circuit board 15e to flow in easily. Therefore, foreign matter remaining in the gap between the accelerometer 18e and the circuit board 15e can be easily removed through cleaning.

[0143] (Variation Example 6)

[0144] Below, refer to Figure 16A and Figure 16B The modified example 6 of the first and second regions will be explained. Figure 16A It is a plan view showing the configuration pattern of the insulating layer of the circuit board involved in Modification Example 6. Figure 16B It is along Figure 16A A cross-sectional view of the FF line in the diagram.

[0145] like Figure 16A and Figure 16BAs shown, the circuit board 15g of Modification 6 has an insulating layer 14 with a first region 11. The first region 11 is located in the central region, which is further inward than the electrode pad 31 for mounting the accelerometer 18, and is positioned to overlap with the central portion of the accelerometer 18. Furthermore, the circuit board 15g of Modification 6 has a second region 12 with an insulating layer 14. The second region 12 extends from the first region 11 to the outer edge of the accelerometer 18 at the four corners of the outer periphery. Here, the first region 11 and the second region 12 are regions where the insulating layer 14 is not disposed. In addition, in Modification 6, a through hole 37 is provided in the central portion of the first region 11, penetrating from the first surface 15f of the circuit board 15g to the second surface 15r.

[0146] According to the configuration pattern of the circuit board 15g and the insulating layer 14 described in Modification 6 above, a through hole 37 is provided in the center of the first region 11, where the insulating layer 14 is not provided. Thus, by providing the through hole 37, cleaning fluid containing residual foreign matter can flow into or out of the first region 11 between the accelerometer 18 and the circuit board 15g. Therefore, the cleaning effect of residual foreign matter can be improved, and residual foreign matter can be removed.

[0147] <Mobile Positioning Device>

[0148] Below, refer to Figure 17 and Figure 18 The moving body positioning device is described. Figure 17 This is a block diagram representing the overall system of the mobile positioning device. Figure 18 This is a diagram schematically illustrating the function of a positioning device for a moving object.

[0149] Figure 17 The mobile positioning device 3000 shown is a device installed on a mobile body for positioning that mobile body. The mobile body is not particularly limited and can be any type of vehicle such as a bicycle, automobile (including four-wheeled cars and motorcycles), tram, airplane, or ship; however, in this embodiment, it is described as a four-wheeled automobile. The mobile positioning device 3000 includes an inertial measurement unit 3100 (IMU), a processing unit 3200, a GPS receiver 3300, a receiving antenna 3400, a position information acquisition unit 3500, a position synthesis unit 3600, a processing unit 3700, a communication unit 3800, and a display unit 3900. It should be noted that the inertial measurement unit 3100 can be, for example, the sensor unit 100 described above.

[0150] In addition, the inertial measurement device 3100 has a 3-axis accelerometer 3110 and a 3-axis angular velocity sensor 3120. The arithmetic processing unit 3200 receives acceleration data from the accelerometer 3110 and angular velocity data from the angular velocity sensor 3120, performs inertial navigation arithmetic processing on these data, and outputs inertial navigation positioning data (including acceleration and attitude data of the moving body).

[0151] Furthermore, the GPS receiver 3300 receives signals (GPS carrier waves, satellite signals superimposed with location information) from GPS satellites via the receiving antenna 3400. Additionally, the location information acquisition unit 3500 outputs GPS positioning data (latitude, longitude, altitude), speed, and orientation of the mobile positioning device 3000 (the mobile body) based on the signals received by the GPS receiver 3300.

[0152] The GPS positioning data also includes status data such as reception status and reception time.

[0153] The position synthesis unit 3600 calculates the position of the moving body based on the inertial navigation positioning data output from the arithmetic processing unit 3200 and the GPS positioning data output from the position information acquisition unit 3500. Specifically, it calculates the location of the moving body on the ground. For example, even if the positions of the moving bodies contained in the GPS positioning data are the same, if... Figure 18 As shown, the moving body's posture varies due to factors such as ground tilt, resulting in it traveling at different positions on the ground. Therefore, the precise position of the moving body cannot be calculated solely based on GPS positioning data. Thus, the position synthesis unit 3600 uses inertial navigation positioning data (especially data related to the moving body's posture) to calculate the moving body's position on the ground. It should be noted that this calculation can be performed relatively easily using trigonometric functions (the slope θ relative to the vertical direction).

[0154] The position data output from the position synthesis unit 3600 is processed according to a prescribed procedure by the processing unit 3700 and displayed as a positioning result on the display unit 3900. Alternatively, the position data can also be transmitted to an external device via the communication unit 3800.

[0155] The mobile object positioning device 3000 has been described above. As described above, such a mobile object positioning device 3000 includes: an inertial measurement unit 3100 that applies the sensor unit 100 described above; a GPS receiver 3300 (receiving unit) that receives satellite signals superimposed with position information from positioning satellites; a position information acquisition unit 3500 (acquisition unit) that acquires position information from the GPS receiver 3300 based on the received satellite signals; a calculation processing unit 3200 (calculation unit) that calculates the attitude of the mobile object based on inertial navigation positioning data (inertial data) output from the inertial measurement unit 3100; and a position synthesis unit 3600 (calculation unit) that calculates the position of the mobile object by correcting the position information based on the calculated attitude. Therefore, the effects of the sensor unit 100 (inertial measurement unit: IMU) described above can be enjoyed, resulting in a highly reliable mobile object positioning device 3000.

[0156] <Electronic Devices>

[0157] Below, regarding electronic devices using sensor unit 100, based on... Figures 19-21 Please provide a detailed explanation.

[0158] First, refer to Figure 19 This section describes a mobile personal computer as an example of an electronic device. Figure 19 This is a three-dimensional diagram schematically illustrating the structure of a mobile personal computer as an example of an electronic device.

[0159] In this figure, the personal computer 1100 consists of a main body 1104 with a keyboard 1102 and a display unit 1106 with a display unit 1108. The display unit 1106 is rotatably supported on the main body 1104 by means of a hinge structure. This personal computer 1100 incorporates a sensor unit 100 that functions as an inertial measurement device, and the control unit 1110 can perform control, such as attitude control, based on the detection data from the sensor unit 100.

[0160] Below, refer to Figure 20 This section describes a smartphone (portable phone) as an example of an electronic device. Figure 20 This is a three-dimensional diagram schematically representing the structure of a smartphone (portable phone) as an example of an electronic device.

[0161] In this figure, the smartphone 1200 is equipped with the aforementioned sensor unit 100. The detection data (acceleration data, angular velocity data) detected by the sensor unit 100 is sent to the control unit 1201 of the smartphone 1200. The control unit 1201 is configured to include a CPU (Central Processing Unit), capable of recognizing the smartphone 1200's posture and movements based on the received detection data, causing changes to the displayed image on the display unit 1208, sounding alarms or sound effects, or driving a vibration motor to cause the main body to vibrate. In other words, it can sense the smartphone 1200's motion and change the displayed content, or generate sounds or vibrations, based on the detected posture and movements. Especially when running game applications, it provides a near-realistic sense of presence.

[0162] Below, refer to Figure 21 This section describes a digital camera as an example of an electronic device. Figure 21 This is a perspective view showing the structure of a digital camera as an example of an electronic device. It should be noted that the connection to external devices is also simplified in this diagram.

[0163] A display unit 1310 is provided on the back of the camera body (main body) 1302 of the digital camera 1300. It is configured to display the shooting signal from the CCD and also functions as a viewfinder to display the subject as an electronic image. In addition, a light-receiving unit 1304 including an optical lens (shooting optical system), a CCD, etc. is provided on the front side (rear side in the figure) of the camera body 1302.

[0164] When the photographer confirms the image of the subject displayed on the display unit 1310 and presses the shutter button 1306, the CCD's shooting signal at that moment is transmitted and stored in the memory 1308. Furthermore, in this digital camera 1300, a video signal output terminal 1312 and a data communication input / output terminal 1314 are provided on the side of the housing 1302. As shown in the figure, the video signal output terminal 1312 is connected to a television monitor 1430, and the data communication input / output terminal 1314 is connected to a personal computer 1440 as needed. This configuration allows the shooting signal stored in the memory 1308 to be output to the television monitor 1430 and the personal computer 1440 through predetermined operations. This digital camera 1300 incorporates a sensor unit 100 that functions as an inertial measurement device, and the control unit 1316 can perform controls such as shake correction based on the detection data from the sensor unit 100.

[0165] Such electronic devices have sensor units 100 and control units 1110, 1201, and 1316, and therefore have excellent reliability.

[0166] It should be noted that electronic devices equipped with sensor unit 100, in addition to Figure 19 Personal computers Figure 20 Smartphones (portable phones) Figure 21 Besides digital cameras, it can also be applied to devices such as tablets, watches, inkjet printers, laptops, televisions, camcorders, video recorders, vehicle navigation systems, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, video game devices, word processors, workstations, videophones, anti-theft television monitors, electronic binoculars, POS terminals, medical devices (such as electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasound diagnostic devices, and electronic endoscopes), fish detectors, various measuring devices, metrological instruments (such as metrological instruments for vehicles, aircraft, and ships), flight simulators, seismographs, pedometers, inclinometers, vibration meters for measuring hard drive vibrations, attitude control devices for flying bodies such as robots or drones, and control equipment used in inertial navigation for autonomous driving in automobiles.

[0167] Portable electronic devices

[0168] Below, regarding portable electronic devices using sensor unit 100, based on Figure 22 and Figure 23 A detailed explanation will follow. Below, we will illustrate a watch-type activity tracker (activity tracker) as an example of a portable electronic device.

[0169] like Figure 22 As shown, the wrist-worn device 1400, which is a watch-type activity tracker, is worn on the user's wrist or other part (the object being tracked) via a strap 1401. It has a digital display 1402 and is capable of wireless communication. The sensor unit 100 of the present invention, which measures acceleration and angular velocity, is assembled in the wrist-worn device 1400 along with other sensors.

[0170] The wrist device 1400 includes a housing 1403 that houses at least a sensor unit 100 (not shown), and a processing unit 1410 housed in the housing 1403 that processes output data from the sensor unit 100 (see reference). Figure 23 The housing 1403 includes a display unit 1402 housed within the housing 1403, and a light-transmitting cover 1404 that blocks the opening of the housing 1403. A frame 1405 is provided on the outer periphery of the light-transmitting cover 1404 located on the side of the housing 1403. Multiple operation buttons 1406 and 1407 are provided on the side of the housing 1403. Referring also to the following... Figure 23 Further details will be provided.

[0171] The accelerometer 1408 included in the sensor unit 100 detects the accelerations of the three intersecting (ideally orthogonal) axes and outputs signals (accelerometer signals) corresponding to the magnitude and direction of the detected three-axis accelerations. Furthermore, the angular velocity sensor 1409 included in the sensor unit 100 detects the angular velocities of the three intersecting (ideally orthogonal) axes and outputs signals (angular velocity signals) corresponding to the magnitude and direction of the detected three-axis angular velocities.

[0172] The liquid crystal display (LCD) constituting the display unit 1402 displays various information depending on the detection mode, such as position information and movement amount using a GPS sensor 1411 or a geomagnetic sensor 1412, motion information such as movement amount using an accelerometer 1408 or an angular velocity sensor 1409, biological information such as pulse count using a pulse sensor 1413, or time information such as the current time. It should be noted that it can also display the ambient temperature using a temperature sensor 1414.

[0173] The communication unit 1415 performs various controls for establishing communication between the user terminal and an information terminal (not shown). The communication unit 1415 may include, for example, transceivers corresponding to short-range wireless communication standards such as Bluetooth (including BTLE: Bluetooth Low Energy), Wi-Fi (Wireless Fidelity), Zigbee (registered trademark), NFC (Nearfield communication), and ANT+ (registered trademark), and connectors corresponding to communication bus standards such as USB (Universal Serial Bus).

[0174] The processing unit 1410 (processor) is composed of, for example, an MPU (Micro Processing Unit), a DSP (Digital Signal Processor), or an ASIC (Application Specific Integrated Circuit). The processing unit 1410 performs various processes based on the program stored in the storage unit 1416 and signals input from the operation unit 1417 (e.g., operation buttons 1406, 1407). The processing of the processing unit 1410 includes data processing of output signals from various components, including a satellite positioning system (GPS sensor 1411), a geomagnetic sensor 1412, a pressure sensor 1418, an acceleration sensor 1408, an angular velocity sensor 1409, a pulse sensor 1413, a temperature sensor 1414, and a timing unit 1419; display processing to display images on the display unit 1402; sound output processing to output sound from the sound output unit 1420; communication processing to communicate with an information terminal via the communication unit 1415; and power control processing to supply power from the battery 1421 to various components.

[0175] Such a wrist device 1400 can have at least the following functions.

[0176] 1. Distance traveled: The total distance and movement trajectory from the start of the measurement are measured using high-precision GPS.

[0177] 2. Pace: Displays the current pace based on the pace distance meter reading.

[0178] 3. Average speed: Calculates and displays the average speed from the start of the journey to the present.

[0179] 4. Altitude: Measured and displayed using GPS.

[0180] 5. Stride length: Stride length is measured and displayed even in places where GPS signals cannot be received, such as tunnels.

[0181] 6. Cadence: Measure and display the number of steps per minute.

[0182] 7. Heart Rate: Heart rate is measured and displayed via a pulse sensor.

[0183] 8. Slope: Measure and display the slope of the ground during training in valleys and cross-country running.

[0184] 9. Automatic lap measurement: After running a pre-set distance and time, the system automatically performs lap measurement.

[0185] 10. Calories burned during exercise: Displays the calories burned.

[0186] 11. Steps: Displays the total number of steps taken since the start of the exercise.

[0187] It should be noted that the wrist device 1400 can be widely used in running watches, athlete watches, athlete watches for various sports such as duathlon and triathlon, outdoor watches, and GPS watches equipped with satellite positioning systems such as GPS.

[0188] Furthermore, while the above description focuses on using GPS (Global Positioning System) as the satellite positioning system, other Global Navigation Satellite Systems (GNSS) can also be used. For example, one or more of the following satellite positioning systems can be used: EGNOS (European Geostationary-Satellite Navigation Overlay Service), QZSS (Quasi-Zenith Satellite System), GLONASS (GLONASS), GALILEO, and BeiDou (BeiDou Navigation Satellite System). Additionally, geostationary satellite-based augmentation systems (SBAS) such as WAAS (Wide Area Augmentation System) and EGNOS (European Geostationary-Satellite Navigation Overlay Service) can be used within at least one satellite positioning system.

[0189] The wrist device 1400, which is a portable electronic device, has excellent reliability because it has a sensor unit 100 and a processing unit 1410.

[0190] <Moving entity>

[0191] Below, regarding the moving body using sensor unit 100, refer to... Figure 24 Please provide a detailed explanation. Figure 24 This is a three-dimensional diagram showing the structure of a car as an example of a moving body.

[0192] like Figure 24As shown, a sensor unit 100 is built into the vehicle 1500, which can detect the posture of the vehicle body 1501. The detection signal from the sensor unit 100 is supplied to a vehicle posture control device 1502, which is a control unit for controlling the posture of the vehicle body. The vehicle posture control device 1502 can detect the posture of the vehicle body 1501 based on the signal and control the stiffness of the suspension or the brakes of each wheel 1503, which is a braking system, according to the detection result. In addition, the sensor unit 100 can also be widely used in keyless entry systems, anti-theft devices, in-vehicle navigation systems, in-vehicle air conditioning, anti-lock braking systems (ABS), airbags, tire pressure monitoring systems (TPMS), engine control systems (engine systems), control equipment for inertial navigation for autonomous driving, battery monitors for hybrid vehicles or electric vehicles, and other electronic control units (ECUs).

[0193] In addition to the examples shown above, the sensor unit 100 applied to moving bodies can also be used in posture control of, for example, bipedal walking robots, electric vehicles, model airplanes, radio-controlled helicopters and drones, remotely controlled or autonomous flying bodies, posture control of agricultural machinery (farm machinery) or construction machinery (engineering machinery), and the control of robots, artificial satellites, ships and AGVs (automated guided vehicles). As described above, when implementing posture control of various moving bodies, the sensor unit 100 and various control units (not shown) are assembled.

[0194] Such a moving body has excellent reliability because it has a sensor unit 100 and a control unit (such as a vehicle body posture control device 1502 as a posture control unit).

[0195] Driving Assistance Systems

[0196] Below, regarding the driving assistance system that uses sensor unit 100, please refer to... Figure 25 and Figure 26 Please provide an explanation. Figure 25 It is a diagram showing the general structure of a driving assistance system. Figure 26 This is a functional block diagram representing the general structure of a driving assistance system.

[0197] (Brief Structure of Driving Assistance Systems)

[0198] like Figure 25 As shown, the driving assistance system 4000 includes a control device 4100 and an information processing device 4200 mounted on each of the multiple vehicles.

[0199] The control unit 4100 is mounted on an autonomous vehicle (hereinafter referred to as an autonomous vehicle) that automatically controls at least one of the acceleration, braking, and steering functions, and communicates with the information processing unit 4200. The information processing unit 4200, for example, is a server unit that collects vehicle information sent from the control units 4100 mounted on multiple autonomous vehicles, or sends information obtained based on the collected vehicle information to each control unit 4100. It should be noted that the information processing unit 4200 can be composed of one server unit or multiple server units.

[0200] (Brief structure of the control device)

[0201] Next, use Figure 26 This describes the general structure of the control device 4100. The control device 4100 is mounted in an autonomous vehicle, such as... Figure 26 As shown, the system includes an autonomous driving unit 4010, a communication device 4020, an ADAS (Advanced Driver Assistance Systems) locator 4030, an HMI (Human Machine Interface) system 4040, a surrounding monitoring sensor 4050, and a vehicle control unit 4060. The autonomous driving unit 4010, communication device 4020, ADAS locator 4030, HMI system 4040, and vehicle control unit 4060, which serve as control units, are connected to, for example, the vehicle's in-vehicle LAN and can exchange information with each other through communication.

[0202] The communication device 4020 communicates with the outside of its own vehicle. For example, the communication device 4020 can wirelessly communicate with at least one of the following: in-vehicle communication devices installed in surrounding vehicles, or roadside equipment installed on the roadside. For instance, by communicating with the in-vehicle communication devices and with the roadside equipment, the communication device 4020 can obtain information such as the location and speed of surrounding vehicles.

[0203] The communication device 4020 communicates with the information processing unit 4200. When communicating with the information processing unit 4200, it can be configured to communicate via a vehicle-mounted communication module used in vehicle-to-everything (V2X) communication, such as a DCM (Data Communication Module), through a communication network used in V2X communication. It should be noted that it can also be configured to communicate with the information processing unit 4200 via a roadside device and the communication network between the roadside device and the information processing unit 4200. The communication device 4020 outputs information obtained from the information processing unit 4200 to the in-vehicle LAN, or sends vehicle information sent from the autonomous driving unit 4010 via the in-vehicle LAN.

[0204] It should be noted that the vehicle communication module that communicates wirelessly with at least one of the vehicle communication devices installed in surrounding vehicles and the roadside devices installed on the roadside, and the vehicle communication module used for vehicle networking communication, can be configured as either separate units or as an integrated unit.

[0205] The ADAS locator 4030 includes a GNSS (Global Navigation Satellite System) receiver 4031, the aforementioned sensor unit 100, and a map database (hereinafter referred to as DB) 4033 storing map data. The GNSS receiver 4031 receives positioning signals from multiple artificial satellites. The sensor unit 100 includes, for example, a 3-axis gyroscope sensor and a 3-axis accelerometer sensor. The map DB 4033 is a non-volatile memory that stores map data such as online data, node data, road shapes, and structures.

[0206] The ADAS locator 4030 sequentially locates the vehicle position of its own vehicle by combining the positioning signal received by the GNSS receiver 4031 and the measurement results of the sensor unit 100. It should be noted that the vehicle position can also be determined by using the travel distance calculated from the pulse signals sequentially output from the wheel speed sensors (not shown) mounted on the vehicle. The located vehicle position is then output to the vehicle's LAN. Furthermore, the ADAS locator 4030 also reads map data from the map database 4033 and outputs it to the vehicle's LAN. It should be noted that the map data can also be acquired from outside the vehicle using an onboard communication module (not shown), such as a DCM, mounted on the vehicle.

[0207] HMI system 4040 Figure 26The device shown includes an HCU (Human Machine Interface Control Unit) 4041, an operation unit 4042, a steering sensor 4043, a display device 4044, and a sound output device 4045. It receives input operations from the driver of its own vehicle, provides prompts to the driver of its own vehicle, or detects the status of the driver of its own vehicle.

[0208] The operation unit 4042 is a switch assembly operated by the driver of the vehicle. The operation unit 4042 is used to make various settings. For example, the operation unit 4042 includes a turn signal switch provided on the steering spoke of the vehicle and a touch switch integrated with the display device 4044.

[0209] Steering sensor 4043 is a sensor used to detect when a passenger is touching the steering wheel of a vehicle. Examples of steering sensor 4043 include a touch sensor located on the steering wheel and a steering torque sensor that detects the steering torque of the vehicle. The detection result of steering sensor 4043 is output to HCU 4041.

[0210] Display devices 4044 may include, for example, an instrument cluster, a CID (Center Information Display), or a HUD (Head-Up Display). The instrument cluster is positioned in front of the driver's seat in the vehicle. The CID is positioned above the central instrument cluster within the vehicle's interior. Based on image data acquired from the HCU 4041, the instrument cluster and CID display various images for informational purposes on the display screen. The HUD projects light from an image based on image data acquired from the HCU 4041 onto a projection area defined on the vehicle's windshield. The image light reflected from the windshield into the vehicle's interior is perceived by the driver, who is seated in the driver's seat. The driver can visually recognize the image by superimposing a virtual image projected by the HUD onto the surrounding scenery in front of the vehicle.

[0211] As a sound output device 4045, there is, for example, an audio speaker. The audio speaker is, for example, installed inside the door lining of the vehicle itself. The audio speaker provides information prompts to passengers such as the driver through reproduced sound.

[0212] The HCU4041 includes a CPU, ROM, RAM, and other memories, I / O ports, and buses connecting them. It performs various processes by executing control programs stored in the memories. For example, the HCU4041, following instructions from the autopilot unit 4010, causes at least one of the display device 4044 and the sound output device 4045 to provide information prompts. It should be noted that the functions performed by the HCU4041 can also be partially or entirely implemented in hardware using one or more ICs.

[0213] The 4050 perimeter surveillance sensor detects moving objects such as pedestrians, animals other than humans, bicycles, motorcycles, and other vehicles, as well as stationary objects such as fallen objects on the road, guardrails, curbs, and trees. It also detects road markings such as lane lines and stop lines. The 4050 perimeter surveillance sensor can be, for example, a perimeter surveillance camera that captures images of a defined area around the vehicle, or a millimeter-wave radar, sonar, or LIDAR (Light Detection and Ranging / Laser Imaging Detection and Ranging) sensor that transmits detection waves to a defined area around the vehicle.

[0214] The surrounding surveillance camera can be either a stereo camera or a monocular camera. The surrounding surveillance camera sequentially captures images and outputs them as sensing information to the autonomous driving unit 4010. Sensors that transmit detection waves, such as sonar, millimeter-wave radar, and LiDAR, output the scanning results of the received signals obtained when receiving reflected waves from obstacles as sensing information to the autonomous driving unit 4010. It should be noted that a structure with multiple surrounding surveillance sensors 4050 having overlapping sensing ranges can also be used, such as using a surrounding surveillance camera and millimeter-wave radar for sensing in front of the vehicle, etc.

[0215] The vehicle control unit 4060 is an electronic control device that performs at least one of the following: acceleration / deceleration control and steering control of the vehicle itself. The vehicle control unit 4060 includes a steering ECU for steering control, a power unit control ECU for acceleration / deceleration control, and a braking ECU. The vehicle control unit 4060 acquires detection signals from various sensors installed in the vehicle, such as an accelerator pedal position sensor, brake pedal force sensor, steering angle sensor, and wheel speed sensor, and outputs control signals to various driving control devices, such as the electronic throttle, brake actuator, and EPS (Electric Power Steering) motor. Furthermore, the vehicle control unit 4060 can output the detection signals from the aforementioned sensors to the vehicle's LAN.

[0216] The autonomous driving unit 4010, serving as the control unit, includes a CPU, volatile memory, non-volatile memory, I / O ports, and a bus connecting them. It performs various processes by executing control programs stored in the non-volatile memory. For example, the autonomous driving unit 4010 identifies its own vehicle's driving environment based on sensing results from the surrounding monitoring sensors 4050. Furthermore, the autonomous driving unit 4010 also performs driving operations in place of the driver by controlling the vehicle control unit 4060. This autonomous driving unit 4010 functions as a driving assistance device.

[0217] It should be noted that the functions performed by the autonomous driving unit 4010 can also be part or all of the functions through one or more ICs in the hardware.

[0218] The autonomous driving unit 4010, acting as a control unit, can instruct the vehicle control unit 4060 to control at least one of acceleration, braking, and steering based on detection signals detected by the sensor unit 100. Furthermore, the autonomous driving unit 4010 can switch between implementing and not implementing autonomous driving based on changes in the detection signals detected by the sensor unit 100. Thus, by controlling at least one of acceleration, braking, and steering, the autonomous driving unit 4010, acting as a control unit, can switch between implementing and not implementing autonomous driving with high precision based on changes in the detection signals detected by the sensor unit.

[0219] Such a driving assistance system 4000 has excellent reliability because it has a sensor unit 100 and an automatic driving unit 4010, which includes the sensor unit 100 as a driving assistance device.

[0220] Head-mounted display devices

[0221] Below, regarding an example of a head-worn display device that uses the sensor unit 100 as a display device, refer to... Figure 27 Please provide an explanation. Figure 27 This is an explanatory diagram showing the schematic structure of a head-mounted display device.

[0222] like Figure 27 As shown, the head-mounted display device 5000 includes an image display unit 520 and a control device 510 for controlling the image display unit 520. The image display unit 520 allows the user to visually see a virtual image when worn on the head of a user. The control device 510 also functions as a controller for the user to operate the head-mounted display device 5000.

[0223] The image display unit 520 is a wearable device worn on the user's head, and in this embodiment, it has a frame 502 (main body) in the shape of glasses. The frame 502 has a right holding part 521 and a left holding part 523. The right holding part 521 is a component that extends from the other end, end ER, of the right optical image display unit 526 and is disposed at a position corresponding to the side of the user's head when the user wears the image display unit 520. Similarly, the left holding part 523 is a component that extends from the other end, end EL, of the left optical image display unit 528 and is disposed at a position corresponding to the side of the user's head when the user wears the image display unit 520. The right holding part 521 abuts against the right ear or its vicinity in the user's head, and the left holding part 523 abuts against the left ear or its vicinity in the user's head, thereby holding the image display unit 520 on the user's head.

[0224] The frame 502 includes a right display driver 522, a left display driver 524, a right optical image display 526, a left optical image display 528, and a microphone 563. In this embodiment, an eyeglasses-type frame 502 is shown as an example of the main body. The shape of the main body is not limited to eyeglasses; it can be worn and fixed to the user's head. A shape that spans across the front of the user's left and right eyes is more preferred. For example, besides the eyeglasses type described here, it could also be a shape like ski goggles covering the upper part of the user's face, or a shape like binoculars positioned in front of the user's left and right eyes respectively.

[0225] The eyeglasses frame 502 has a right portion 502A located in front of the user's right eye and a left portion 502B located in front of the left eye, and the right portion 502A and the left portion 502B are connected by a bridging portion 502C (connecting portion). When the user wears the image display unit 520, the bridging portion 502C connects the right portion 502A and the left portion 502B at a position corresponding to the user's brow.

[0226] The right portion 502A and the left portion 502B are connected to the temple portions 502D and 502E, respectively. The temple portions 502D and 502E support the frame 502 on the user's head, just like the temples of eyeglasses. In this embodiment, the temple portion 502D is composed of a right holding portion 521, and the temple portion 502E is composed of a left holding portion 523.

[0227] The right optical image display unit 526 is located on the right side 502A, and the left optical image display unit 528 is located on the left side 502B. When the user wears the image display unit 520, they are located in front of the user's right eye and left eye, respectively.

[0228] The right display driver unit 522 and the left display driver unit 524 are positioned on the side opposite to the user's head when the user wears the image display unit 520. It should be noted that when collectively referred to as the right display driver unit 522 and the left display driver unit 524, they are also simply referred to as "display driver units," and when collectively referred to as the right optical image display unit 526 and the left optical image display unit 528, they are also simply referred to as "optical image display units." Furthermore, the display driver units 522 and 524 include a liquid crystal display (not shown), a projection optical system, etc.

[0229] The right optical image display unit 526 and the left optical image display unit 528 are equipped with a light guide plate and a dimming plate (not shown). The light guide plate is formed of a light-transmitting resin or the like and guides the image light output from the display driving units 522 and 524 to the user's eyes. The dimming plate is a thin plate-shaped optical element configured to cover the side opposite to the user's eye side, i.e., the surface side of the image display unit 520. The dimming plate can use various components, such as components with almost no light transmittance, near-transparent components, components that attenuate light to allow light to pass through, and components that attenuate or reflect light of a specific wavelength. By appropriately selecting the optical characteristics (transmittance, etc.) of the dimming plate, the amount of external light incident on the right optical image display unit 526 and the left optical image display unit 528 from the outside can be adjusted, thereby adjusting the visual recognition difficulty of the virtual image.

[0230] In this method, the use of a dimming plate with light transmittance sufficient to allow a user wearing the image display unit 520 to visually recognize the external scenery will be described. The dimming plate protects the right and left light guide plates, which are optical elements, and suppresses damage and dirt adhesion to the right and left light guide plates. It should be noted that the dimming plate can be detachable from the right optical image display unit 526 and the left optical image display unit 528, or multiple dimming plates can be installed and replaced, or it can be omitted.

[0231] Furthermore, a camera unit 503 is provided in the frame 502. The camera unit 503 has a camera base portion 503C for mounting an upper camera 561 and arms 503A and 503B supporting the camera base portion 503C. Arm 503A is rotatably connected to the right retaining portion 521 via a hinge 521A provided at the front end AP of the right retaining portion 521. Arm 503B is rotatably connected to the left retaining portion 523 via a hinge 523A provided at the front end AP of the left retaining portion 523. Therefore, the camera unit 503 as a whole can rotate up and down in the direction shown by arrow K in the figure, i.e., in the wearing state. The camera unit 503 contacts the frame 502 at the lower end of its rotation range. Furthermore, the upper end of the rotation range of the camera unit 503 is determined by the specifications of hinges 521A and 523A, etc.

[0232] The camera base 503C is a plate-shaped or rod-shaped component that positions the upper part of the right part 502A, the left part 502B, and the bridging part 502C. The upper camera 561 is embedded in a position corresponding to the bridging part 502C. The upper camera 561 is a digital camera equipped with imaging elements such as CCD and CMOS, as well as imaging lenses, and can be either a monocular camera or a stereo camera.

[0233] The upper camera 561 captures at least a portion of the external scene in the side direction of the head-mounted display device 5000, in other words, in the field of view of the user when the image display unit 520 is worn. The width of the field of view of the upper camera 561 can be appropriately set, for example, preferably at the lower end of the rotation range of the camera unit 503. The shooting range of the upper camera 561 includes the external world seen by the user through the right optical image display unit 526 and the left optical image display unit 528. Furthermore, it is more preferable to set the shooting range of the upper camera 561 to be able to capture the entire field of view of the user after using a dimmer plate.

[0234] The image display unit 520 is connected to the control device 510 via the connection unit 540. The connection unit 540 includes a main cable 548, a right cable 542, a left cable 544, and a connecting member 546, all connected to the control device 510. The right cable 542 and the left cable 544 are cables obtained by branching the main cable 548 into two separate cables. The right cable 542 is inserted into the housing of the right holding part 521 from its front end AP in the extending direction of the right holding part 521 and is connected to the right display drive unit 522.

[0235] Similarly, the left cable 544 is inserted into the housing of the left holding part 523 from the front end AP of the left holding part 523 in the extending direction and is connected to the left display driving part 524.

[0236] A connecting component 546 is located at the branch point of the main cable 548 and the right cable 542 and left cable 544, and has a socket for connecting the headphone plug 530. The right earphone 532 and left earphone 534 extend from the headphone plug 530. A microphone 563 is located near the headphone plug 530. A cable converges from the headphone plug 530 to the microphone 563, and the cable branches off from the microphone 563 and connects to the right earphone 532 and left earphone 534 respectively.

[0237] The microphone 563 is configured such that its sound-collecting part faces the user's line of sight, collects sound, and outputs a sound signal to a sound processing unit (not shown). The microphone 563 can be, for example, a mono microphone or a stereo microphone, or a directional microphone or an omnidirectional microphone.

[0238] The right cable 542, left cable 544, and main cable 548 only need to be able to transmit digital data, and can be made of metal cables or optical fibers. Alternatively, the right cable 542 and left cable 544 can be combined into a single cable.

[0239] The image display unit 520 and the control device 510 transmit various signals via the connection part 540. Connectors (not shown) that engage with each other are provided at the end of the main cable 548 opposite to the connecting member 546 and on the control device 510. By engaging or disengaging the connectors of the main cable 548 and the control device 510, the control device 510 and the image display unit 520 can be connected or separated.

[0240] The control device 510 controls the head-worn display device 5000. The control device 510 includes an OK button 511, an illuminated section 512, a display switching button 513, a brightness switching button 515, directional buttons 516, a menu button 517, and a power switch 518. Furthermore, the control device 510 includes a touchpad 514 that can be operated by the user's fingers.

[0241] The confirmation key 511 detects the press operation and outputs a signal confirming the operation performed on the control device 510. The illumination unit 512 includes a light source such as an LED (Light Emitting Diode) and uses the illumination status of the light source to notify the head-worn display device 5000 of its operating status (e.g., power on / off). The display switching key 513, in response to a press operation, outputs a signal indicating, for example, switching between display modes for an image.

[0242] The touchpad 514 has an operating surface for detecting contact operations and outputs an operation signal in response to operations on the operating surface. The detection method for the operating surface is not limited and can be electrostatic, pressure-sensitive, optical, etc. The brightness switch 515 outputs a signal indicating whether the brightness of the image display unit 520 is increased or decreased in response to a press operation. The directional keys 516 output an operation signal in response to a press operation of the keys corresponding to the up, down, left, and right directions. The power switch 518 is a switch that toggles the power on / off of the head-worn display device 5000.

[0243] In addition, two motion sensors are installed in the frame 502. These motion sensors are inertial sensors, specifically a first sensor 566 and a second sensor 568. The first sensor 566 is located at the end of the temple 502D side in the right part 502A, and the second sensor 568 is located at the end of the temple 502E side in the left part 502B. That is, the first sensor 566 and the second sensor 568 are located on one side of the center of the head when the head-worn display device 5000 is worn. The first sensor 566 and the second sensor 568 are inertial sensors such as accelerometers and angular velocity sensors (gyroscopes). In this embodiment, the sensor unit 100 with a 3-axis gyroscope and a 3-axis accelerometer is used. The first sensor 566 and the second sensor 568 detect, for example, rotation about the X-axis (pitch), rotation about the Y-axis (yaw), and rotation about the Z-axis (tilt) at a measurement reference point of the built-in detection mechanism.

[0244] Either the first sensor 566 or the second sensor 568 is located to one side of the center of the user's head, and the other sensor is located to the other side of the center of the user's head. Specifically, the first sensor 566 is located on the right side of the user's head, and the second sensor 568 is located on the left side. It should be noted that, in this configuration, the center of the head refers to the center of the head on a horizontal plane perpendicular to the user's height. The positions of the first sensor 566 and the second sensor 568 on the horizontal plane are to the right and left sides, respectively, sandwiching the center of the head on that horizontal plane.

[0245] As an example of such a display device, a head-worn display device 5000 includes an image display unit 520 that illuminates image light to the user's eyes, and a first sensor 566 and a second sensor 568, which are multiple motion sensors. In the wearing state, either the first sensor 566 or the second sensor 568 is located on one side of the center of the head, while the other motion sensor is located on the other side of the center of the head. Therefore, when the user's head moves, the amount of movement at the center of motion, the direction of movement, etc., can be quickly determined.

[0246] Furthermore, in the head-worn display device 5000, either the first sensor 566 or the second sensor 568 is located to the left of the center of the head when worn, while the other motion sensor is located to the right of the center of the head. Therefore, based on the detection results of the motion sensor, the activity at the center of head motion can be quickly determined.

[0247] As an example of such a display device, the head-worn display device 5000 has excellent reliability because it has a sensor unit 100 as a first sensor 566 and a second sensor 568.

[0248] The sensor unit, mobile positioning device, electronic device, portable electronic device, mobile body, and display device have been described above with reference to the illustrated embodiments. However, the present invention is not limited thereto, and the structure of each part can be replaced with any structure having the same function. In addition, other arbitrary components can be added to the present invention.

[0249] The contents derived from the above embodiments will now be described in various aspects.

[0250] [Aspect 1] The sensor unit according to this aspect is characterized in that it includes: an inertial sensor; a circuit board having a plurality of electrode pads on a first surface of the circuit board, wherein a plurality of mounting terminals of the inertial sensor are respectively mounted on the plurality of electrode pads by connecting members; and a housing having the circuit board housed inside the housing, wherein the first surface of the circuit board includes: an insulating layer disposed on the outer side of the plurality of electrode pads when viewed from above; a first region where, when viewed from above, the insulating layer is not disposed in the portion of the first region overlapping with the central region of the inertial sensor that is further inward than the mounting terminals; and a second region where, when viewed from above, the insulating layer is not disposed in the second region from the first region to the outer side of the inertial sensor.

[0251] According to this aspect, the sensor unit includes an inertial sensor, a circuit board, and a housing. A plurality of electrode pads are provided on a first surface of the circuit board, and a plurality of mounting terminals of the inertial sensor are respectively mounted to the plurality of electrode pads via connecting members. Furthermore, the circuit board is housed inside the housing. An insulating layer is provided on the first surface of the circuit board, outside the electrode pads. In other words, electrode pads are formed at openings in the insulating layer. Furthermore, the first surface of the circuit board includes a first region and a second region without an insulating layer. The first region is a central region located further inward than the mounting terminals of the inertial sensor, and the second region extends from the first region to the outer side of the inertial sensor.

[0252] In other words, the sensor unit is configured such that, by not providing an insulating layer between the central region of the inertial sensor and the circuit board, the gap between the inertial sensor and the circuit board is larger than when an insulating layer is provided. This allows cleaning fluid used to remove foreign matter present between the inertial sensor and the circuit board to easily enter the space between them, improving the cleaning effect. Consequently, foreign matter is less likely to remain in the gap between the inertial sensor and the circuit board, reducing the stress generated in the inertial sensor due to changes in the state of the foreign matter caused by temperature variations (e.g., thermal expansion, thermal contraction). Therefore, the occurrence of temperature hysteresis in the bias signal (detection output signal) caused by foreign matter residue can be reduced, providing an inertial sensor capable of high-precision detection.

[0253] [Aspect 2] In the sensor unit described above, it is preferable that recesses are provided in the first region and the second region of the first surface of the circuit board.

[0254] According to this aspect, recesses are provided in a first region and a second region on the first surface of the circuit board. This further widens the gap between the inertial sensor and the circuit board, making it more difficult for foreign objects to remain.

[0255] [Aspect 3] In the sensor unit described above, it is preferable that a through hole penetrating the circuit board is provided in the first region of the circuit board.

[0256] According to this aspect, since a through-hole is provided in the first region of the circuit board, the residue of foreign matter can be reduced.

[0257] [Aspect 4] In the sensor unit described above, it is preferable that the second region is disposed between adjacent electrode pads.

[0258] According to this aspect, the second region is located between adjacent electrode pads. As a result, the area of ​​the second region, which is connected to the first region, is increased, and the cleaning fluid spreads more effectively, thus further reducing the occurrence of residual foreign matter.

[0259] [Aspect 5] In the sensor unit described above, it is preferable that, when viewed from above, a circumferential protrusion or an unconnected protrusion is provided between the center of the inertial sensor and the electrode pad.

[0260] According to this aspect, a circumferential protrusion or an unconnected protrusion is provided between the center of the inertial sensor and the electrode pad. This allows the protrusion to prevent foreign objects from entering the center of the inertial sensor, where foreign objects are prone to remain.

[0261] [Aspect 6] In the sensor unit described above, it is preferable that the circumferential protrusion or the unconnected protrusion is closer to the electrode pad than to the center side of the inertial sensor.

[0262] According to this aspect, the circumferential protrusion or unconnected protrusion is configured to be closer to the electrode pad than the center side of the inertial sensor. This makes it difficult for foreign objects to reach the center of the inertial sensor, where foreign objects tend to remain.

[0263] [Aspect 7] In the sensor unit described above, it is preferable that the circumferential protrusion or the unconnected protrusion is an insulating layer.

[0264] According to this aspect, the circumferential protrusion or the unconnected protrusion is made of an insulating layer. Therefore, the circumferential protrusion or the unconnected protrusion can be easily formed.

[0265] [Aspect 8] In the sensor unit described above, it is preferred that, when viewed from above, the inertial sensor is quadrilateral and the plurality of mounting terminals are disposed on a pair of opposite sides of the quadrilateral.

[0266] According to this aspect, the mounting terminals of the quadrilateral inertial sensor are arranged on a pair of opposite sides of the quadrilateral, thus enabling a second region to be provided in the direction of the other pair of sides of the inertial sensor where no mounting terminals are provided. This allows for the formation of a wider second region, thereby facilitating the removal of foreign matter remaining in the gap between the inertial sensor and the circuit board through cleaning.

[0267] [Aspect 9] In the sensor unit described above, it is preferred that the inertial sensor is an acceleration sensor.

[0268] According to this aspect, the sensor unit has an accelerometer as an inertial sensor, thereby enabling high-precision detection of acceleration.

[0269] [Aspect 10] The mobile body positioning device according to this aspect is characterized in that it includes: a sensor unit as described in any one of aspects 1 to 9 above; a receiving unit that receives satellite signals superimposed with position information from a positioning satellite; an acquisition unit that acquires position information of the receiving unit based on the received satellite signals; a calculation unit that calculates the posture of the mobile body based on inertial data output from the sensor unit; and a calculation unit that calculates the position of the mobile body by correcting the position information based on the calculated posture.

[0270] According to this aspect, the sensor unit of the present invention can be utilized to obtain a moving body positioning device with high inertial measurement accuracy.

[0271] [Aspect 11] The portable electronic device according to this aspect is characterized in that it includes: a sensor unit as described in any one of aspects 1 to 9 above; a housing housing the sensor unit; a processing unit housing the housing for processing output data from the sensor unit; a display unit housing the housing; and a light-transmitting cover blocking the opening of the housing.

[0272] According to this aspect, the sensor unit of the present invention can be utilized to obtain a portable electronic device with high inertial measurement accuracy.

[0273] [Aspect 12] In the portable electronic device described above, it is preferred to include a satellite positioning system for measuring the user's moving distance and movement trajectory.

[0274] In this respect, the convenience of portable electronic devices is improved.

[0275] [Aspect 13] The electronic device according to this aspect is characterized in that it includes: a sensor unit as described in any one of aspects 1 to 9 above; and a control unit that performs control based on a detection signal output from the sensor unit.

[0276] According to this aspect, the sensor unit of the present invention can be utilized to obtain an electronic device with high inertial measurement accuracy.

[0277] [Aspect 14] The mobile body according to this aspect is characterized by comprising: a sensor unit as described in any one of aspects 1 to 9 above; and a control unit that performs control based on a detection signal output from the sensor unit.

[0278] According to this aspect, the sensor unit of the present invention can be used to obtain a moving body with high inertial measurement accuracy.

[0279] [Aspect 15] In the mobile body described above, it is preferred to include at least one of an engine system, a braking system, and a keyless entry system, wherein the control unit controls the system based on the detection signal.

[0280] According to this aspect, it is possible to control at least one of the engine system, braking system, and keyless entry system with high precision.

[0281] [Aspect 16] The mobile body according to this aspect is characterized by comprising: a sensor unit as described in any one of aspects 1 to 9 above; and a control unit that controls at least one of acceleration, braking and steering based on a detection signal detected by the sensor unit, and switches between implementing or not implementing autonomous driving based on changes in the detection signal from the sensor unit.

[0282] According to this aspect, by controlling at least one of acceleration, braking and steering, the implementation or non-implementation of autonomous driving can be switched with high precision based on changes in the detection signals detected by the sensor unit.

[0283] [Aspect 17] The display device according to this aspect is characterized in that it includes: a display unit worn on the head of a user and illuminating image light to the eyes of the user; and a sensor unit as described in any one of aspects 1 to 9 above, wherein the sensor unit is located on one side of the center of the head when worn.

[0284] According to this aspect, the sensor unit of the display device is located on one side of the center of the head when worn. Therefore, when the user's head moves, the amount of movement at the center of motion and the direction of movement can be quickly determined. Furthermore, the sensor unit of this invention provides the advantages of a display device with high accuracy in inertial measurement.

Claims

1. A sensor unit, characterized by include: Inertial sensor; The circuit board includes a plurality of electrode pads on its first surface, and the plurality of mounting terminals of the inertial sensor are respectively mounted on the plurality of electrode pads via connecting components. as well as The housing contains the circuit board. The first surface of the circuit board includes: An insulating layer, when viewed from above, is disposed on the outer side of the plurality of electrode pads; In the first region, when viewed from above, the portion of the first region overlapping with the central region of the inertial sensor, which is further inward than the mounting terminal, does not have the insulating layer; and In the second region, when viewed from above, the insulating layer is not present from the first region to the outer side of the inertial sensor. A gap greater than the thickness of the insulating layer is provided between the inertial sensor and the first surface of the circuit board. The gap extends from a position overlapping the central portion of the inertial sensor to the outer periphery of the inertial sensor.

2. The sensor unit according to claim 1, characterized in that, The gap is formed by providing recesses in the first and second regions of the first surface of the circuit substrate, which together constitute the thickness of the insulating layer and the depth of the recesses.

3. The sensor unit according to claim 1 or 2, characterized in that, In the circuit board, a through hole is provided in the first region, which penetrates the circuit board.

4. The sensor unit according to claim 1 or 2, characterized in that, The second region is located between adjacent electrode pads.

5. The sensor unit according to claim 1 or 2, characterized in that, When viewed from above, the inertial sensor is quadrilateral in shape. The plurality of mounting terminals are configured on a pair of opposite sides of the quadrilateral.

6. The sensor unit according to claim 1 or 2, characterized in that, The inertial sensor is an accelerometer.

7. A mobile body positioning device, characterized in that, include: The sensor unit according to any one of claims 1 to 6; The receiving unit receives satellite signals superimposed with location information from positioning satellites; The acquisition unit acquires the location information of the receiving unit based on the received satellite signal; The computing unit calculates the posture of the moving body based on the inertial data output from the sensor unit; as well as The calculation unit calculates the position of the moving body by correcting the position information based on the calculated posture.

8. A mobile body, characterized in that, include: The sensor unit according to any one of claims 1 to 6; as well as The control unit, based on the detection signals detected by the sensor unit, controls at least one of acceleration, braking, and steering. In the mobile body, the implementation or non-implementation of autonomous driving is switched according to changes in detection signals from the sensor unit.

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