A charging gun cooling system

Abstract

The application provides a charging gun cooling system, which comprises a liquid outlet device and a liquid return cooling device; the liquid outlet device comprises a liquid storage tank, a pump, a first pipeline and a liquid outlet manifold; the liquid return cooling device comprises a liquid return manifold, a micro-channel radiator, a fan, a flow guide pipe, an external filter and a semiconductor refrigeration component; at least one liquid return connector is arranged on the liquid return manifold, the liquid return connector is used for being connected with the charging gun, the micro-channel radiator is communicated with the liquid return manifold, the fan faces the micro-channel radiator, the first end of the flow guide pipe is connected with the micro-channel radiator, the second end of the flow guide pipe is connected with the liquid storage tank, the external filter is arranged outside the liquid storage tank and both ends of the external filter are connected with the flow guide pipe, the external filter comprises a metal shell and a detachable filter element accommodated in the metal shell, and the semiconductor refrigeration component is connected with the metal shell. The charging gun cooling system can reduce impurities, avoid the blockage of the system and efficiently cool.

Description

Technical Field

[0001] This invention relates to the field of new energy vehicle charging stations, and in particular to a charging gun cooling system. Background Technology

[0002] With the rapid development of the new energy vehicle industry, the driving range of electric vehicles is constantly increasing. During the process of electric vehicle users charging new energy vehicles with high power using charging guns, the charging guns get very hot and need to be cooled down quickly.

[0003] When existing cooling systems use water cooling, they often experience blockages and low fluid flow rates, requiring shutdown to locate the blockages and perform cleaning and maintenance, which is quite troublesome. Moreover, existing cooling systems are not effective at cooling the coolant in high-temperature environments, especially in the hot summer. Summary of the Invention

[0004] In view of the above-mentioned problems in the prior art, the purpose of the present invention is to provide a charging gun cooling system that can reduce impurities, avoid system blockage, and efficiently cool down the system.

[0005] To address the above problems, the present invention provides a charging gun cooling system, the charging gun cooling system comprising:

[0006] Liquid discharge device and liquid return cooling device;

[0007] The liquid outlet device includes a liquid storage tank, a pump, a first pipeline, and a liquid outlet manifold. The liquid storage tank is used to contain coolant. The inlet end of the pump is connected to the liquid storage tank to draw coolant from the liquid storage tank. The first end of the first pipeline is connected to the outlet end of the pump. The liquid outlet manifold is connected to the second end of the first pipeline to receive coolant from the first pipeline. The liquid outlet manifold is provided with at least one liquid outlet connector, which is used to connect to a charging gun to allow the coolant to flow out to the charging gun.

[0008] The liquid return cooling device includes a liquid return manifold, a microchannel radiator, a fan, a drain pipe, an external filter, and a semiconductor cooling device. The liquid return manifold has at least one liquid return connector for connecting to a charging gun to receive the coolant passing through the charging gun. The microchannel radiator is connected to the liquid return manifold to receive and cool the coolant. The fan faces the microchannel radiator to blow or draw air onto it. The first end of the drain pipe is connected to the microchannel radiator, and the second end is connected to the liquid storage tank to inject the coolant into the tank. The external filter is located outside the liquid storage tank and connected to the drain pipe at both ends. The external filter includes a metal housing and a removable filter element housed within the metal housing. The semiconductor cooling device is connected to the metal housing to cool it.

[0009] Furthermore, the liquid dispensing device also includes:

[0010] A temperature detector extends into the interior of the external filter to test the initial temperature of the coolant within the external filter.

[0011] A controller, connected to the temperature detector and the thermoelectric cooler, controls the thermoelectric cooler to activate when the temperature detected by the temperature detector exceeds a first predetermined temperature, so as to cool the metal casing.

[0012] Furthermore, the return liquid cooling device also includes a return liquid pressure sensor and a return liquid temperature sensor. The return liquid pressure sensor is connected to the return liquid manifold to test the pressure of the coolant in the return liquid manifold. The return liquid temperature sensor is connected to the return liquid manifold and spaced apart from the return liquid pressure sensor to test the second temperature of the coolant in the return liquid manifold.

[0013] The liquid outlet device further includes a liquid outlet pressure sensor and a liquid outlet temperature sensor. The liquid outlet pressure sensor is connected to the liquid outlet manifold to test the pressure of the coolant in the liquid outlet manifold. The liquid outlet temperature sensor is connected to the liquid outlet manifold and spaced apart from the liquid outlet pressure sensor to test the third temperature of the coolant in the liquid outlet manifold.

[0014] Furthermore, the microchannel heat sink includes:

[0015] The microchannel radiator is connected to the return liquid collector via the lower manifold.

[0016] Multiple flat tubes, all of which are arranged vertically and spaced apart, with their bottom ends connected to the lower manifold;

[0017] The upper manifold is connected to the top of all the flat tubes. The microchannel radiator is connected to the first end of the drain pipe through the upper manifold. The coolant can flow from the lower manifold through multiple flat tubes to the upper manifold.

[0018] Multiple sets of fins are respectively arranged between two adjacent flat tubes.

[0019] Furthermore, the fan is positioned behind the microchannel heat sink, and the airflow generated by the fan's rotation is from front to back. The liquid return cooling device also includes an atomizing device located on the windward side of the microchannel heat sink to spray water mist onto the microchannel heat sink. The atomizing device includes:

[0020] A mist box is vertically disposed in front of the microchannel heat sink and at a predetermined distance from the microchannel heat sink. The mist box has a plurality of spaced-apart mist holes on the side facing the microchannel heat sink.

[0021] An atomizer, which is connected to the mist box to provide mist to the atomizer box.

[0022] Furthermore, the liquid return cooling device also includes a thermometer for testing the fourth temperature of the flat tube.

[0023] The controller is connected to the thermometer, the return liquid temperature sensor and the atomizer. When the temperature difference between the second temperature and the fourth temperature is less than a predetermined temperature difference and the second temperature exceeds the second predetermined temperature, the controller controls the atomizer to start so as to spray the mist.

[0024] Furthermore, the liquid dispensing device also includes:

[0025] A metal component, which is inserted into the liquid storage tank from the outside;

[0026] A semiconductor cooler, wherein the semiconductor cooler is connected to the end of the metal component that is exposed to the outside;

[0027] The controller is also connected to the liquid outlet temperature sensor and the semiconductor cooler, so as to control the semiconductor cooler to cool the metal part if the third temperature detected by the liquid outlet temperature sensor is greater than the third predetermined temperature.

[0028] Furthermore, the liquid dispensing device also includes:

[0029] A liquid level sensor is provided, with its detection end disposed inside the liquid storage tank to detect the liquid level of the coolant contained in the tank.

[0030] Furthermore, the metal component is a metal tube, which is vertically arranged and open at both ends, with its bottom end located near the bottom of the liquid storage tank.

[0031] The liquid dispensing device further includes:

[0032] A replenishment tube, the first end of which is connected to the metal tube.

[0033] A replenishment tank, which is connected to the second end of the replenishment tube via a solenoid valve.

[0034] The controller is also connected to the liquid level sensor and the solenoid valve. When the liquid level detected by the liquid level sensor is lower than a first predetermined liquid level, the controller controls the solenoid valve to open so as to replenish the coolant to the storage tank through the replenishment tank, the replenishment pipe and the metal pipe. When the liquid level detected by the liquid level sensor is higher than a second predetermined liquid level, the controller controls the solenoid valve to close.

[0035] Furthermore, the liquid dispensing device also includes:

[0036] A replenishing filter screen is attached to the bottom end of the metal tube.

[0037] The controller controls the semiconductor cooler to cool the metal tube according to the opening state of the solenoid valve.

[0038] Due to the above technical solution, the present invention has the following beneficial effects:

[0039] According to the charging gun cooling system of the present invention, coolant is supplied to the charging gun through an inlet device, and the coolant passing through the charging gun is cooled and returned through a return cooling device to achieve the recycling of the coolant. A pump in the outlet device draws coolant from the storage tank and supplies it to an outlet manifold through a first pipeline. The outlet manifold supplies coolant to the charging gun through one or more outlet connectors, achieving rapid cooling of the charging gun. The coolant flowing through one or more charging guns enters the return manifold through the return connector, and then passes through a microchannel radiator for further cooling. A fan provides air cooling to the microchannel radiator. It has a high cooling capacity for coolant, and the fan, in conjunction with the microchannel radiator, has low wind resistance, which reduces noise. After being cooled by the microchannel radiator, the coolant flows through the drain pipe and external filter. Impurities generated during the assembly and use of the cooling system can be concentrated in the external filter, which facilitates the centralized cleaning of impurities and avoids the accumulation of impurities, which could block the cooling channels through which the coolant flows or reduce the coolant flow rate. The semiconductor cooling component rapidly and efficiently cools the metal shell of the external filter, thereby effectively cooling the coolant and reducing the impact of high external temperatures on the coolant. Attached Figure Description

[0040] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0041] Figure 1 This is a structural diagram of a charging gun cooling system according to an embodiment of the present invention;

[0042] Figure 2 yes Figure 1 The front-to-back view of the embodiment;

[0043] Figure 3 This is a structural diagram of the drainage tube, external filter, and temperature detector according to an embodiment of the present invention.

[0044] Figure 4 This is a structural diagram of a microchannel heat sink and atomizing device according to an embodiment of the present invention;

[0045] Figure 5 It is based on Figure 4 Rear view of the atomizing box in the embodiment;

[0046] Figure 6 This is a structural diagram of the liquid storage tank, semiconductor cooler, liquid replenishment pipe, solenoid valve, and liquid replenishment tank according to an embodiment of the present invention.

[0047] Figure label:

[0048] 1000, Liquid dispensing device; 1100, Liquid storage tank; 1200, First pipeline; 1300, Pump; 1410, Liquid dispensing manifold; 1420, Liquid dispensing pressure sensor; 1430, Liquid dispensing temperature sensor; 1510, Metal pipe; 1520, Semiconductor cooler; 1610, Liquid replenishment pipe; 1620, Solenoid valve; 1630, Liquid replenishment tank; 1700, Liquid level sensor; 2000, Liquid return cooling device; 2110, Liquid return manifold; 2120, Liquid return temperature sensor; 2130, Liquid return pressure sensor; 2200, Drainage tube; 2300, Microchannel radiator; 2310, Lower manifold; 2320, Flat tube; 2330, Fin; 2340, Upper manifold; 2410, External filter; 2411, Metal casing; 2412, Filter element; 2420, Semiconductor cooling component; 2430, Temperature detector; 2510, Atomizer; 2520, Fog box; 2521, Fog orifice; 2600, Fan; 3000, Controller. Implementation

[0049] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0051] According to the inventor's analysis, the existing cooling system experiences blockages and low flow rates because during equipment installation, impurities fall into the cooling channels through which the coolant flows, or during the connection between the cooling system and the cooling gun, impurities from the cooling gun or the connecting pipe are flushed into the cooling system by the coolant. During use, these impurities gradually accumulate, easily causing blockages in the cooling channels, resulting in poor coolant flow and reduced flow rate.

[0052] Based on this, the present invention provides an external filter 2410 in the cooling channel, which enables impurities to be concentrated in the external filter. As long as the external filter 2410 is maintained, the problems of cooling channel blockage and coolant flow rate reduction in the cooling system can be avoided.

[0053] The following describes the charging gun cooling system according to an embodiment of the present invention.

[0054] like Figures 1 to 3 As shown, the charging gun cooling system of this embodiment includes: a liquid outlet device 1000 and a liquid return cooling device 2000.

[0055] The liquid outlet device 1000 includes a liquid storage tank 1100, a pump 1300, a first pipeline 1200, and a liquid outlet manifold 1410. The liquid storage tank 1100 is used to hold coolant. The inlet end of the pump 1300 is connected to the liquid storage tank 1100 to draw coolant from the liquid storage tank 1100. The first end of the first pipeline 1200 is connected to the outlet end of the pump 1300. The liquid outlet manifold 1410 is connected to the second end of the first pipeline 1200 to receive coolant from the first pipeline 1200. The liquid outlet manifold 1410 is provided with at least one liquid outlet connector for connecting to a charging gun to allow coolant to flow out to the charging gun.

[0056] The reservoir 1100 is used to hold coolant. The inlet of the pump 1300 is connected to the reservoir 1100 to draw coolant from the reservoir 1100. The coolant can be water, oil, a mixture, etc. Optionally, the coolant can be water or oil with added antifreeze and anti-evaporation agents. The coolant contained in the reservoir 1100 can be quickly supplied to the charging gun, and the pump 1300 can provide coolant pressure, increasing the coolant flow rate, thereby allowing the coolant to pass through the charging gun more quickly and cool the charging gun more rapidly.

[0057] A first pipeline 1200 and a coolant manifold 1410. The first end of the first pipeline 1200 is connected to the outlet end of the pump 1300. The coolant manifold 1410 is connected to the second end of the first pipeline 1200 to receive coolant from the first pipeline 1200. The coolant manifold 1410 is provided with at least one outlet connector for connecting to a charging gun to allow coolant to flow out to the charging gun. The first pipeline 1200 supplies coolant pressurized by the pump 1300 to the coolant manifold 1410.

[0058] like Figure 1 As shown, the coolant manifold 1410 has two coolant outlet connectors, which can simultaneously supply coolant to the two outlet connectors, simultaneously supply coolant to the two charging guns, or simultaneously supply coolant to two positions of a single charging gun. It should be noted that there is no limitation on the number of coolant outlet connectors.

[0059] The liquid return cooling device 2000 includes a liquid return manifold 2110, a microchannel radiator 2300, a fan 2600, a drain pipe 2200, an external filter 2410, and a semiconductor cooling component 2420. The return liquid manifold 2110 is provided with at least one return liquid connector, which is used to connect to the charging gun to receive the coolant passing through the charging gun. The microchannel radiator is connected to the return liquid manifold 2110 to receive the coolant from the return liquid manifold 2110 and cool the coolant. The fan 2600 faces the microchannel radiator 2300 to blow or draw air onto the microchannel radiator 2300. The first end of the drain pipe 2200 is connected to the microchannel radiator 2300, and the second end of the drain pipe 2200 is connected to the liquid storage tank 1100 to inject coolant into the liquid storage tank 1100. The external filter 2410 is located outside the liquid storage tank 1100, and its two ends are connected to the drain pipe 2200. The external filter 2410 includes a metal shell 2411 and a removable filter element 2412 housed in the metal shell. The semiconductor cooling element 2420 is connected to the metal shell to cool the metal shell.

[0060] The return manifold 2110 is equipped with at least one return connector, which is used to connect to the charging gun to receive the coolant passing through the charging gun. The return manifold 2110 can be equipped with 2, 5, or 7 return connectors, and can be connected to a single charging gun or to multiple charging guns simultaneously.

[0061] The coolant in the storage tank 1100 of the liquid outlet device 1000 flows into the charging gun, and after passing through the charging gun, it flows into the return liquid collector 2110 through the docking pipe and the return liquid connector.

[0062] The microchannel radiator 2300 is connected to the return coolant manifold 2110 (the microchannel radiator 2300 can be connected to the return coolant manifold 2110 via a return pipe) to receive coolant from the return coolant manifold 2110 and cool the coolant. A fan 2600 faces the microchannel radiator 2300 to blow or draw air onto it.

[0063] In operation, coolant flows into the microchannel radiator 2300. The fan 2600, using either a direct-blowing (blowing) or suction (drawing) method, forces air to flow over the surface of the microchannel radiator 2300 at a certain speed and volume, cooling the radiator and consequently the coolant inside. The microchannel radiator 2300 has a large surface area, resulting in a larger heat dissipation area, making it more susceptible to cooling by airflow. Using the microchannel radiator 2300 reduces air resistance without decreasing the heat exchange area, thus resulting in lower noise levels during operation of the liquid return cooling device 2000.

[0064] like Figure 3 As shown, the external filter 2410 is connected between the two drain pipes 2200. The external filter 2410 can block impurities outside the storage tank 1100. During the installation or use of the charging gun cooling system, impurities entering the cooling system can accumulate in the external filter 2410, preventing them from scattering and causing blockages in the cooling channels or malfunctions in the charging gun. The external filter 2410's location outside the storage tank 1100 facilitates maintenance, preventing impurities from entering the storage tank 1100 and avoiding maintenance hassles. When impurities accumulate to a certain level in the external filter 2410 or after a period of use, the metal casing 2411 can be opened to remove the filter element 2412 for cleaning or replacement, thereby reducing impurities within the cooling system.

[0065] The semiconductor cooling device 2420 is connected to the metal casing 2411 to cool the metal casing 2411. The coolant passes through the external filter 2410, and the semiconductor cooling device 2420 cools the metal casing of the external filter 2410, thus cooling the coolant inside the external filter 2410 and improving the system's cooling efficiency. The metal casing 2411 has increased thermal conductivity, facilitating the transfer of low temperatures from its surface to the coolant inside. In high-temperature environments, the semiconductor cooling device 2420 can cool the coolant, reducing the impact of external high temperatures on the coolant.

[0066] The above-described charging gun cooling system supplies coolant to the charging gun through an inlet device. A return cooling device 2000 cools and recirculates the coolant after it passes through the charging gun, achieving coolant recycling. A pump 1300 in the outlet device 1000 draws coolant from the storage tank 1100 and supplies it to the outlet manifold 1410 through the first pipeline 1200. The outlet manifold 1410 supplies coolant to the charging gun through one or more outlet connectors, achieving rapid cooling of the charging gun. The coolant flowing through one or more charging guns enters the return manifold 2110 through the return connector, and then passes through the microchannel radiator 2300 for further cooling. A fan 2600 ventilates the microchannel radiator 2300. The cooling system improves the ability to cool the coolant. Furthermore, the fan 2600, in conjunction with the microchannel radiator 2300, has low air resistance, reducing noise. The coolant, cooled by the microchannel radiator 2300, flows through the drain pipe 2200 and the external filter 2410. Impurities generated during the assembly and use of the cooling system are concentrated in the external filter 2410, facilitating their removal and preventing accumulation that could block the cooling channels or reduce coolant flow. The semiconductor cooling device 2420 rapidly and efficiently cools the metal casing 2411 of the external filter 2410, thus effectively cooling the coolant and reducing the impact of high external temperatures on the system.

[0067] In some embodiments of the present invention, the liquid outlet device 1000 further includes a temperature detector 2430 and a controller 3000. The temperature detector 2430 extends into the interior of the external filter 2410 to test a first temperature of the coolant inside the external filter 2410. The controller 3000 connects the temperature detector 2430 and the thermoelectric cooler 2420 to activate the thermoelectric cooler 2420 to cool the metal casing 2411 if the first temperature detected by the temperature detector 2430 exceeds a first predetermined temperature.

[0068] like Figure 1 As shown, when the temperature detector 2430 detects that the temperature of the coolant inside the external filter 2410 exceeds the first predetermined temperature, it indicates that the temperature of the coolant about to flow into the reservoir 1100 is too high. This suggests that the microchannel radiator 2300, fan 2600, and atomizing device are experiencing insufficient heat dissipation or a problem. An alarm is triggered at this time to remind the user to take timely action. Cooling the coolant using the semiconductor cooling device 2420 minimizes the coolant temperature, preventing the coolant flowing into the reservoir 1100 from becoming too hot and affecting the cooling of the charging gun. The semiconductor cooling device only activates cooling when the coolant temperature exceeds the first predetermined temperature, preventing the semiconductor cooling device 2420 from remaining in a cooling state for extended periods, thus avoiding energy waste.

[0069] In some embodiments of the present invention, the return cooling device 2000 further includes a return pressure sensor 2130 and a return temperature sensor 2120. The return pressure sensor 2130 is connected to the return manifold 2110 to test the pressure of the coolant in the return manifold 2110. The return temperature sensor 2120 is connected to the return manifold 2110 and spaced apart from the return pressure sensor 2130 to test a second temperature of the coolant in the return manifold 2110. The outlet device 1000 further includes an outlet pressure sensor 1420 and an outlet temperature sensor 1430. The outlet pressure sensor 1420 is connected to the outlet manifold 1410 to test the pressure of the coolant in the outlet manifold 1410. The outlet temperature sensor 1430 is connected to the outlet manifold 1410 and spaced apart from the outlet pressure sensor 1420 to test a third temperature of the coolant in the outlet manifold 1410.

[0070] The return pressure sensor 2130 can promptly and accurately detect the coolant pressure, allowing for timely adjustments and maintenance to prevent malfunctions in the cooling system caused by excessively high or low coolant return pressure. The return temperature sensor 2120 can also promptly and accurately detect the coolant status, facilitating targeted adjustments to the coolant or cooling strategies. For example, if the temperature is too high, the coolant can be replaced or its temperature lowered. Alternatively, other methods can be used to cool the microchannel radiator 2300, preventing a decrease in the cooling effect of the charging gun and avoiding abnormalities during charging.

[0071] The outlet pressure sensor 1420 can promptly and accurately detect the coolant pressure, allowing for timely adjustments and maintenance to prevent malfunctions in the cooling system caused by excessively high or low outlet pressure. The outlet temperature sensor 1430 can accurately detect the temperature of the coolant supplying the charging gun, facilitating timely intervention by the user. For example, if the coolant temperature is too high, the cooling effect will decrease, and the user can cool the coolant or replace it.

[0072] In some embodiments of the present invention, the microchannel radiator 2300 includes a lower manifold 2310, multiple flat tubes 2320, an upper manifold 2340, and multiple sets of fins 2330. The microchannel radiator 2300 is connected to the return liquid collector 2110 through the lower manifold 2310. The multiple flat tubes 2320 are all vertically arranged and spaced apart, and their bottom ends are connected to the lower manifold 2310. The upper manifold 2340 is connected to the top of all the flat tubes 2320, and the upper manifold 2340 of the microchannel radiator 2300 is connected to the first end of the guide pipe 2200, allowing coolant to flow from the lower manifold 2310 through the multiple flat tubes 2320 to the upper manifold 2340. The multiple sets of fins 2330 are disposed between two adjacent flat tubes 2320.

[0073] like Figure 1 As shown, the coolant flows through the microchannel radiator 2300, first entering the lower manifold 2310, then the multiple flat tubes 2320, and finally passing through the lower manifold 2310. The coolant flows from bottom to top within the microchannel radiator 2300, which facilitates control of the coolant flow rate and prevents gravity from affecting the flow rate during top-down flow. Furthermore, it ensures that coolant remains within the microchannel radiator 2300 even when the return connector is closed, preventing coolant from automatically draining into the reservoir 1100 due to gravity. This avoids air accumulation in the flat tubes 2320, which would be expelled from the coolant upon system restart, reducing cooling efficiency.

[0074] Multiple fins 2330 can increase the heat dissipation area, thereby improving the cooling capacity of the microchannel heatsink 2300. For example... Figure 1 As shown, multiple sets of fins 2330 are arranged facing the edge of the fan blades of the fan 2600. The air velocity is low in the area corresponding to the center of the fan blades of the fan 2600. Fins 2330 are not placed in this area to reduce wind resistance and facilitate airflow. This avoids the situation where adding fins 2330 to this area would result in insufficient airflow and poor cooling effect. The air velocity is high in the area corresponding to the edge of the fan blades of the fan 2600. Adding fins 2330 to this area allows airflow to pass through the fins 2330, enhancing the cooling effect.

[0075] In some embodiments of the present invention, the fan 2600 is positioned behind the microchannel heat sink 2300, and the airflow generated by the rotation of the fan 2600 is from front to back. The liquid return cooling device 2000 also includes an atomizing device located on the windward side of the microchannel heat sink 2300 to spray water mist onto the microchannel heat sink 2300. The atomizing device includes a mist box 2520 and an atomizer 2510. The mist box 2520 is vertically positioned in front of the microchannel heat sink 2300 and at a predetermined distance from the microchannel heat sink 2300. The mist box 2520 has a plurality of spaced-apart mist holes 2521 on the side facing the microchannel heat sink 2300. The atomizer 2510 communicates with the mist box 2520 to provide mist to the mist box.

[0076] like Figure 4 As shown, the liquid return cooling device 2000 also includes an atomizing device located on the upwind side of the microchannel radiator 2300 to spray water mist onto the microchannel radiator 2300. The atomizing device can be a humidifier or other device capable of atomizing water.

[0077] Since the atomizer 2510 is located on the upwind side of the microchannel radiator 2300, the water mist sprayed by the atomizer will drift towards the microchannel radiator 2300 due to the wind force of the fan 2600, evaporate on the microchannel radiator 2300, thereby cooling the microchannel radiator 2300 and further cooling the coolant inside the microchannel radiator 2300, increasing the cooling rate of the coolant.

[0078] Furthermore, the atomizing device can clean dust and contaminants on the microchannel radiator 2300, reducing wind resistance as the air passes through the microchannel radiator 2300.

[0079] Furthermore, the fan 2600 is positioned behind the microchannel heatsink 2300, and the airflow generated by the fan 2600 is from front to back. The atomizing device includes a mist box 2520 and an atomizer 2510. The mist box 2520 is vertically positioned in front of the microchannel heatsink 2300 and at a predetermined distance from the microchannel heatsink 2300. The side of the mist box 2520 facing the microchannel heatsink 2300 has multiple spaced-apart mist holes 2521. The atomizer 2510 communicates with the mist box 2520 to provide mist to the mist box.

[0080] like Figure 4 and Figure 5 As shown, the atomizer 2510 generates mist that fills the mist box 2520 and drifts towards the microchannel heat sink 2300 through the mist holes 2521. The rear surface of the atomizer box can face the entire area of ​​the microchannel heat sink 2300. The mist holes 2521 are evenly distributed, thereby achieving uniform heat dissipation of the microchannel heat sink 2300.

[0081] The distance between the mist box 2520 and the microchannel heat sink 2300 is predetermined. This predetermined distance can be set so as not to affect the air intake of the microchannel heat sink 2300. Moreover, the outside air passes through the mist box 2520, and the temperature of the mist box 2520 is low, which will also reduce the temperature of the air, thereby increasing the cooling efficiency.

[0082] Furthermore, the return liquid cooling device 2000 also includes a thermometer, which is used to test the fourth temperature of the flat tube 2320. The controller 3000 is connected to the thermometer, the return liquid temperature sensor 2120 and the atomizer 2510. When the temperature difference between the second temperature and the fourth temperature is less than a predetermined temperature difference and the second temperature exceeds the second predetermined temperature, the atomizer 2510 is controlled to start to spray mist.

[0083] The temperature difference between the fourth temperature of the flat tube 2320 and the second temperature of the coolant before entering the flat tube 2320 can be used to estimate the temperature drop of the coolant after passing through the flat tube 2320. Adding the second temperature of the coolant, the temperature of the coolant after passing through the microchannel radiator 2300 can be calculated. If the first temperature exceeds a first predetermined temperature, and the temperature difference between the second and fourth temperatures is less than the predetermined temperature difference, it can be determined that the temperature after passing through the microchannel radiator 2300 is too high. At this time, the atomizing device is activated to cool the microchannel radiator 2300, allowing the coolant to cool to a suitable temperature before flowing into the reservoir 1100.

[0084] In some embodiments of the present invention, the liquid dispensing device 1000 further includes a metal component and a thermoelectric cooler 1520. The metal component is inserted into the liquid storage tank 1100 from the outside. The thermoelectric cooler 1520 is connected to the external end of the metal component. The controller 3000 is also connected to the liquid dispensing temperature sensor 1430 and the thermoelectric cooler 1520 to control the thermoelectric cooler 1520 to cool the metal component if the temperature detected by the liquid dispensing temperature sensor 1430 is greater than a predetermined threshold. The metal component can be a metal rod, a metal tube 1510, a metal block, etc. Figure 6 As shown, the metal part is formed in an inverted U-shape, with its bottom end extending into the liquid storage tank 1100 and its top end connected to the semiconductor cooler 1520. It should be noted that the shape of the metal part is not limited here.

[0085] Semiconductor cooling can operate continuously, has a long lifespan, does not require refrigerant, is relatively environmentally friendly, and is easy to install. It can quickly cool metal components. The high thermal conductivity of metal components allows them to transfer their low temperature to the coolant in a timely manner.

[0086] When the outlet temperature sensor 1430 detects that the temperature of the coolant is greater than a predetermined threshold, the controller 3000 controls the semiconductor cooler 1520 to cool the metal parts. The metal parts promptly transmit the temperature value of the coolant, thereby enabling convenient cooling of the coolant.

[0087] The controller 3000 controls the operation of the pump 1300 based on the coolant temperature detected by the outlet temperature sensor 1430. When the detected temperature is high, the speed of the pump 1300 is increased accordingly, increasing the coolant flow rate and thus maintaining the cooling rate of the cooling gun, preventing a decrease in the cooling effect of the cooling gun. In some embodiments of the present invention, the outlet device 1000 also includes a level sensor 1700. The detection end of the level sensor 1700 is disposed in the storage tank 1100 to detect the coolant level contained in the storage tank 1100.

[0088] like Figure 1As shown, the liquid level sensor 1700 is located at the bottom of the liquid storage tank 1100, and its sensing end is located inside the liquid storage tank 1100. The liquid level sensor 1700 allows the user to accurately know the liquid level in the liquid storage tank 1100, enabling timely replenishment of coolant and preventing insufficient coolant in the tank, which could reduce the cooling effect on the charging gun.

[0089] Further, the metal component is a metal tube 1510, which is vertically arranged and open at both ends, with its bottom end adjacent to the bottom of the liquid storage tank 1100. The liquid outlet device 1000 also includes a replenishment pipe 1610, a solenoid valve 1620, and a replenishment tank 1630. The first end of the replenishment pipe 1610 is connected to the metal tube 1510. The replenishment tank 1630 is connected to the second end of the replenishment pipe 1610 via the solenoid valve 1620. The controller 3000 is also connected to a liquid level sensor 1700 and a solenoid valve 1620. If the liquid level detected by the liquid level sensor 1700 is lower than a first predetermined liquid level, the controller controls the solenoid valve 1620 to open, so as to replenish coolant to the liquid storage tank 1100 through the replenishment tank 1630, the replenishment pipe 1610, and the metal tube 1510. If the liquid level detected by the liquid level sensor 1700 is higher than a second predetermined liquid level, the controller controls the solenoid valve 1620 to close.

[0090] like Figure 6 As shown, the coolant tank 1630 is connected to the coolant storage tank 1100 through the coolant supply pipe 1610. A solenoid valve 1620 is installed on the coolant supply pipe 1610 to realize the switching of coolant supply.

[0091] When the level sensor 1700 detects that the liquid level in the storage tank 1100 is lower than the first predetermined level (minimum level), the controller 3000 opens the solenoid valve 1620, and the replenishment pipe 1610 delivers coolant from the replenishment tank 1630 to the storage tank 1100. When the level sensor 1700 detects that the liquid level in the storage tank 1100 is higher than the second predetermined level (maximum level), the controller 3000 closes the solenoid valve 1620, and the replenishment pipe 1610 stops delivering coolant. This allows for intelligent and timely replenishment of the storage tank 1100.

[0092] Coolant is replenished via a metal tube 1510. The bottom end of the metal tube 1510 is adjacent to the bottom of the coolant tank 1100, and can be located below the first predetermined liquid level in the tank 1100. This avoids the situation where coolant splashes or produces a large number of air bubbles in the coolant due to direct pouring, thus preventing air bubbles from reducing the cooling effect of the coolant on the charging gun. Moreover, the metal tube 1510 has a larger contact area with the coolant, which improves the cooling efficiency of the coolant compared to a metal rod.

[0093] Furthermore, the liquid outlet device 1000 also includes a replenishment filter. The replenishment filter is connected to the bottom end of the metal tube 1510. The controller 3000 controls the semiconductor cooler 1520 to cool the metal tube 1510 according to the opening state of the solenoid valve 1620.

[0094] The coolant filter prevents impurities from entering the reservoir 1100 from the coolant tank 1630. During the coolant replenishment process, the semiconductor cooler 1520 cools the replenished coolant to prevent the coolant temperature in the coolant tank 1630 from becoming too high, which would cause the temperature of the reservoir 1100 to be too high.

Claims

1. A charging gun cooling system, characterized in that, The charging gun cooling system includes a liquid outlet device and a liquid return cooling device; The liquid outlet device includes a liquid storage tank, a pump, a first pipeline, and a liquid outlet manifold. The liquid storage tank is used to contain coolant. The inlet end of the pump is connected to the liquid storage tank to draw coolant from the liquid storage tank. The first end of the first pipeline is connected to the outlet end of the pump. The liquid outlet manifold is connected to the second end of the first pipeline to receive coolant from the first pipeline. The liquid outlet manifold is provided with at least one liquid outlet connector, which is used to connect to a charging gun to allow the coolant to flow out to the charging gun. The liquid return cooling device includes a liquid return manifold, a microchannel radiator, a fan, a drain pipe, an external filter, and a thermoelectric cooler. The liquid return manifold has at least one liquid return connector for connecting to a charging gun to receive the coolant passing through the charging gun. The microchannel radiator is connected to the liquid return manifold to receive and cool the coolant. The fan faces the microchannel radiator to blow or draw air onto it. The first end of the drain pipe is connected to the microchannel radiator, and the second end is connected to the liquid storage tank to inject the coolant into the tank. The external filter is located outside the liquid storage tank and connected to the drain pipe at both ends. The external filter includes a metal housing and a removable filter element housed within the metal housing. The thermoelectric cooler is connected to the metal housing to cool it. The liquid dispensing device further includes: The system includes an outlet pressure sensor and an outlet temperature sensor. The outlet pressure sensor is connected to the outlet manifold to test the pressure of the coolant in the outlet manifold. The outlet temperature sensor is connected to the outlet manifold and spaced apart from the outlet pressure sensor to test the third temperature of the coolant in the outlet manifold. A metal component, which is inserted into the liquid storage tank from the outside of the liquid storage tank, is a metal tube. The metal tube is vertically arranged and has openings at both ends. The bottom end of the metal tube is located near the bottom of the liquid storage tank. A semiconductor cooler, wherein the semiconductor cooler is connected to the end of the metal component that is exposed to the outside; A liquid level sensor, wherein the detection end of the liquid level sensor is disposed inside the liquid storage tank to detect the liquid level of the coolant contained in the liquid storage tank; A replenishment tube, the first end of which is connected to the metal tube; A replenishing filter screen is attached to the bottom end of the metal tube. A replenishment tank, which is connected to the second end of the replenishment tube via a solenoid valve. A controller, connected to the liquid outlet temperature sensor and the thermoelectric cooler, controls the thermoelectric cooler to cool the metal component if the third temperature detected by the liquid outlet temperature sensor is greater than a third predetermined temperature. The controller is also connected to the liquid level sensor and the solenoid valve. When the liquid level detected by the liquid level sensor is lower than a first predetermined level, the controller controls the solenoid valve to open, allowing coolant to be added to the storage tank through the replenishment tank, the replenishment pipe, and the metal pipe. When the liquid level detected by the liquid level sensor is higher than a second predetermined level, the controller controls the solenoid valve to close. The controller also controls the semiconductor cooler to cool the metal tube according to the opening state of the solenoid valve.

2. The charging gun cooling system according to claim 1, characterized in that, The liquid dispensing device further includes: A temperature detector extends into the interior of the external filter to test the initial temperature of the coolant within the external filter. The controller is also connected to the temperature detector and the semiconductor cooling device to control the semiconductor cooling device to start and cool the metal casing if the temperature detected by the temperature detector exceeds a first predetermined temperature.

3. The charging gun cooling system according to claim 2, characterized in that, The return liquid cooling device further includes a return liquid pressure sensor and a return liquid temperature sensor. The return liquid pressure sensor is connected to the return liquid manifold to test the pressure of the coolant in the return liquid manifold. The return liquid temperature sensor is connected to the return liquid manifold and spaced apart from the return liquid pressure sensor to test the second temperature of the coolant in the return liquid manifold.

4. The charging gun cooling system according to claim 3, characterized in that, The microchannel heat sink includes: The microchannel radiator is connected to the return liquid collector via the lower manifold. Multiple flat tubes, all of which are arranged vertically and spaced apart, with their bottom ends connected to the lower manifold; The upper manifold is connected to the top of all the flat tubes. The microchannel radiator is connected to the first end of the drain pipe through the upper manifold. The coolant can flow from the lower manifold through multiple flat tubes to the upper manifold. Multiple sets of fins are respectively arranged between two adjacent flat tubes.

5. The charging gun cooling system according to claim 4, characterized in that, The fan is positioned behind the microchannel heat sink, and the airflow generated by the fan's rotation is from front to back. The liquid return cooling device also includes an atomizing device located on the windward side of the microchannel heat sink to spray water mist onto the microchannel heat sink. The atomizing device includes: A mist box is vertically disposed in front of the microchannel heat sink and at a predetermined distance from the microchannel heat sink. The mist box has a plurality of spaced-apart mist holes on the side facing the microchannel heat sink. An atomizer, which is connected to the mist box to provide mist to the mist box.

6. The charging gun cooling system according to claim 5, characterized in that, The liquid return cooling device also includes a thermometer, which is used to test the fourth temperature of the flat tube. The controller is connected to the thermometer, the return liquid temperature sensor and the atomizer. When the temperature difference between the second temperature and the fourth temperature is less than a predetermined temperature difference and the second temperature exceeds the second predetermined temperature, the controller controls the atomizer to start so as to spray the mist.

Images