Display substrate, preparation method thereof and display panel

Abstract

This application provides a display substrate and its fabrication method, and a display panel, relating to the field of display technology. The display substrate includes: a substrate and a plurality of sub-pixels disposed on one side of the substrate. Each sub-pixel includes a reflective area and comprises: an organic material layer disposed on one side of the substrate; a protective layer disposed on the side of the organic material layer facing away from the substrate, the protective layer being made of a transparent metal oxide; and a reflective electrode layer disposed on the side of the protective layer facing away from the substrate. The reflective electrode layer comprises a first sub-layer, a second sub-layer, and a third sub-layer stacked sequentially. The first sub-layer is disposed close to the substrate, the second sub-layer is made of a reflective metal, and the materials of the first and third sub-layers are the same as those of the protective layer.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display substrate and its preparation method, and a display panel. Background Technology

[0002] In recent years, transflective LCD screens have been widely used in outdoor electronic bus stop signs, billboards, and vehicle displays due to their advantages such as good sunlight visibility, energy saving, and eye protection. Typically, reflective mode is used in high-brightness daytime environments, where the stronger the ambient light, the better the display effect. Transmissive mode is used on cloudy days or at night when ambient brightness is low.

[0003] However, in transflective displays, the reflective metal material, under relatively unstable conditions, leads to a significant decrease in reflectivity after the PI film coating process on the display substrate. Therefore, improving the reflectivity of display devices has become a pressing issue for those skilled in the art. Summary of the Invention

[0004] This application provides a display substrate and its preparation method, as well as a display panel, aiming to solve the problem of how to improve the reflectivity of a display device.

[0005] A first aspect of this application provides a display substrate, the display substrate comprising:

[0006] A substrate, and a plurality of sub-pixels disposed on one side of the substrate, each sub-pixel including a reflective region, the sub-pixel comprising:

[0007] An organic material layer is disposed on one side of the substrate.

[0008] A protective layer is disposed on the side of the organic material layer facing away from the substrate, and the material of the protective layer is a transparent metal oxide;

[0009] A reflective electrode layer is disposed on the side of the protective layer away from the substrate. The reflective electrode layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially. The first sublayer is disposed close to the substrate. The material of the second sublayer is a reflective metal. The materials of the first sublayer and the third sublayer are the same as those of the protective layer.

[0010] In one optional embodiment, the orthographic projection of the protective layer on the substrate overlaps with the orthographic projection of the reflective electrode layer on the substrate, and the distance between the edge of the orthographic projection of the protective layer on the substrate and the edge of the orthographic projection of the reflective electrode layer on the substrate is less than or equal to 2 μm.

[0011] In one alternative implementation, the sum of the thicknesses of the first sublayer and the protective layer is greater than or equal to eight times the thickness of the third sublayer.

[0012] In one alternative implementation, the sum of the thicknesses of the first sublayer and the protective layer is greater than or equal to 300 angstroms and less than or equal to 800 angstroms; the thickness of the third sublayer is less than or equal to 100 angstroms.

[0013] In one alternative implementation, the thickness of the first sublayer is less than or equal to 100 angstroms; the thickness of the second sublayer is greater than or equal to 500 angstroms and less than or equal to 3000 angstroms; and the thickness of the third sublayer is less than or equal to 100 angstroms.

[0014] In one alternative implementation, the material of the second sublayer is silver.

[0015] In one alternative implementation, the thickness of the protective layer is greater than or equal to 300 angstroms and less than or equal to 700 angstroms.

[0016] In one optional implementation, the sub-pixel further includes:

[0017] A pixel electrode layer is disposed on the side of the organic material layer near the substrate.

[0018] A thin-film transistor, wherein the thin-film transistor is disposed on the side of the pixel electrode layer near the substrate, the thin-film transistor including a source and a drain; and

[0019] An insulating layer is disposed between the thin-film transistor and the pixel electrode layer;

[0020] The pixel electrode layer is connected to the drain of the thin-film transistor via a via.

[0021] In one alternative embodiment, the sub-pixel further includes a transmissive region, the orthographic projection of the pixel electrode layer on the substrate covers the transmissive region, the protective layer extends from the reflective region to the edge of the transmissive region, and the protective layer and the pixel electrode layer form an electrical connection in the transmissive region.

[0022] A second aspect of this application provides a display panel, including a display substrate and a color filter substrate as described in any one of the first aspects, wherein the display substrate and the color filter substrate are disposed opposite each other, a liquid crystal layer is disposed between the display substrate and the color filter substrate, and the sub-pixels are disposed close to the liquid crystal layer.

[0023] A third aspect of this application provides a method for preparing a display substrate, the method comprising:

[0024] Provide substrates;

[0025] A plurality of sub-pixels are formed on one side of the substrate, each sub-pixel including a reflective region, and the sub-pixel comprising:

[0026] An organic material layer is disposed on one side of the substrate.

[0027] A protective layer is disposed on the side of the organic material layer facing away from the substrate, and the material of the protective layer is a transparent metal oxide;

[0028] A reflective electrode layer is disposed on the side of the protective layer away from the substrate. The reflective electrode layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially. The first sublayer is disposed close to the substrate. The material of the second sublayer is a reflective metal. The materials of the first sublayer and the third sublayer are the same as those of the protective layer.

[0029] Beneficial effects:

[0030] This application provides a display substrate and its fabrication method, as well as a display panel. The display substrate includes: a substrate base, and a plurality of sub-pixels disposed on one side of the substrate base. Each sub-pixel includes a reflective area and comprises: an organic material layer disposed on one side of the substrate base; a protective layer disposed on the side of the organic material layer facing away from the substrate base, the protective layer being made of a transparent metal oxide; and a reflective electrode layer disposed on the side of the protective layer facing away from the substrate base. The reflective electrode layer comprises a first sub-layer, a second sub-layer, and a third sub-layer stacked sequentially. The first sub-layer is disposed close to the substrate base, the second sub-layer is made of a reflective metal, and the materials of the first and third sub-layers are the same as those of the protective layer. This application, by placing the pixel electrode layer in the protective layer between the reflective electrode layer and the organic material layer, avoids the decrease in reflectivity of the display substrate caused by the reaction between the organic material layer and the reflective metal in the reflective electrode layer, effectively improving the reflectivity of the display substrate. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1This is a schematic cross-sectional view of a sub-pixel of a display substrate according to an embodiment of this application;

[0033] Figure 2 This is a schematic cross-sectional view of a sub-pixel of a display substrate including a transmissive region, according to an embodiment of this application;

[0034] Figure 3 This is a schematic diagram of a raised structure surface according to an embodiment of this application;

[0035] Figure 4 This is a schematic diagram showing the orthographic projection relationship between the protective layer and the reflective electrode layer on the substrate according to an embodiment of this application;

[0036] Figure 5 This is a schematic diagram showing the orthographic projection relationship between the protective layer and the reflective electrode layer on the substrate according to another embodiment of this application;

[0037] Figure 6 This is a reflectivity curve of a display substrate with a protective layer according to an embodiment of this application;

[0038] Figure 7 This is a schematic diagram of a display substrate fabrication method according to an embodiment of this application.

[0039] Explanation of reference numerals in the attached figures: 101, substrate; 102, pixel electrode layer; 103, organic material layer; 104, reflective electrode layer; 105, insulating layer; 1051, via; 106, gate insulating layer; 107, source / drain electrode; 108, gate; 109, active layer; 110, protective layer; A1, reflective region; A2, transmissive region. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] In recent years, transflective LCD screens have been widely used in outdoor electronic bus stop signs, billboards, and vehicle displays due to their advantages such as good sunlight visibility, energy saving, and eye protection. Typically, reflective mode is used in high-brightness daytime environments, where the stronger the ambient light, the better the display effect. Transmissive mode is used on cloudy days or at night when ambient brightness is low.

[0042] In related technologies, the reflective metal material in transflective displays, when coated with a PI film layer on the display substrate under relatively unstable conditions, can lead to a significant decrease in the reflectivity of the transflective display. Therefore, how to improve the reflectivity of display devices has become a problem that urgently needs to be solved by those skilled in the art.

[0043] In view of this, embodiments of this application propose a display substrate, Figure 1 This application illustrates a schematic cross-sectional view of a sub-pixel of a display substrate according to an embodiment of the present application, as shown below. Figure 1 As shown, the display substrate includes a substrate 101 and a plurality of sub-pixels disposed on one side of the substrate, each sub-pixel including a reflective region A1. Each sub-pixel includes: an organic material layer 103 disposed on one side of the substrate 101; a protective layer 110 disposed on the side of the organic material layer 103 facing away from the substrate 101, the protective layer 110 being made of a transparent metal oxide; and a reflective electrode layer 104 disposed on the side of the protective layer 110 facing away from the substrate 101.

[0044] In this embodiment, the display substrate is further provided with a PI (polyimide) film layer coated on the reflective electrode layer 104. The PI film layer is disposed on the side of the reflective electrode layer 104 away from the substrate 101. When the reflective metal material in the reflective electrode layer 104 is relatively unstable, for example, when the reflective metal material of the reflective electrode layer is Ag, the reflective metal material of the reflective electrode layer, the PI film layer, and the organic material layer 103 will react during the high-temperature annealing process when the PI film layer is formed, causing the reflectivity of the display substrate to decrease significantly after the PI film layer is coated.

[0045] Therefore, the display substrate provided in this application embodiment is provided with a protective layer 110. By providing the protective layer 110, the adverse phenomenon of decreased reflectivity caused by the reaction between the reflective metal material in the reflective electrode layer 104 and the PI film layer and the organic material layer 103 is avoided. The protective layer 110 is disposed on the side of the organic material layer 103 facing away from the substrate 101. The orthographic projection of the protective layer 110 on the substrate 101 completely covers the orthographic projection of the organic material layer 103 on the substrate 101, so that the protective layer 110 completely isolates the contact between the reflective metal material in the reflective electrode layer and the organic material layer 103. By providing the protective layer 110, the contact between the metal material in the reflective electrode layer 104 and the organic material layer 103 is isolated, preventing the metal material in the reflective electrode layer 104 from reacting with the PI film layer and the organic material layer 103, thereby improving the reflectivity of the display panel after the PI film layer is coated.

[0046] In one optional embodiment, the protective layer 110 is made of a transparent metal oxide. For example, the material of the protective layer 110 may be indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc.

[0047] In this embodiment, the reflective electrode layer 104 includes a first sub-layer, a second sub-layer, and a third sub-layer stacked sequentially. The first sub-layer is disposed close to the substrate 101. The material of the second sub-layer is a highly reflective metal, such as aluminum or silver. The materials of the first and third sub-layers are the same as those of the protective layer, such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO). Since the reflectivity of the display substrate is 93%-94% when the second sub-layer is made of silver after PI coating, and 80%-83% when the second sub-layer is made of aluminum, the second sub-layer is preferably made of silver.

[0048] In one optional embodiment, to ensure that no reaction occurs between the reflective metal of the second sub-layer and the organic material layer 103, the sum of the thicknesses of the first sub-layer and the protective layer 110 located between the second sub-layer and the organic material layer 103 is greater than or equal to eight times the thickness of the third sub-layer. Furthermore, since the first sub-layer and the protective layer 110 are made of the same transparent metal oxide, the thickness of the transparent metal oxide located between the second sub-layer and the organic material layer 103 is greater than or equal to eight times the thickness of the transparent metal oxide facing away from the second sub-layer.

[0049] In one optional embodiment, the sum of the thicknesses of the first sublayer and the protective layer is greater than or equal to 300 angstroms and less than or equal to 800 angstroms; the thickness of the third sublayer is less than or equal to 100 angstroms. Preferably, the thickness of the first sublayer is less than or equal to 100 angstroms; the thickness of the second sublayer is greater than or equal to 500 angstroms and less than or equal to 3000 angstroms; the thickness of the third sublayer is less than or equal to 100 angstroms; and the thickness of the protective layer is greater than or equal to 300 angstroms and less than or equal to 700 angstroms. Exemplarily, the first and third sublayers are ITO, the second sublayer is Ag, wherein the thickness of the first sublayer is 70 angstroms, the thickness of the second sublayer is 1000 angstroms, and the thickness of the third sublayer is 30 angstroms.

[0050] In one optional embodiment, the protective layer 110 has the same electrode pattern as the reflective electrode layer 104. The orthographic projection of the protective layer 110 onto the substrate 101 overlaps with the orthographic projection of the reflective electrode layer 104 onto the substrate 101. The distance between the edge of the orthographic projection of the protective layer onto the substrate and the edge of the orthographic projection of the reflective electrode layer onto the substrate is less than or equal to 2 μm.

[0051] Figure 6 This application illustrates a reflectivity curve of a display substrate with a protective layer according to an embodiment of the present application. Figure 6 As shown, curve 1 is the reflectivity curve of the display substrate with a protective layer after coating with a PI film, and curve 2 is the reflectivity curve of the display substrate without a protective layer after coating with a PI film. The horizontal axis represents wavelength, and the vertical axis represents reflectivity. Specifically, the reflective electrode layer 104 of the display substrate corresponding to curve 1 is ITO / Ag / ITO with a thickness of 70 Å / 1000 Å / 30 Å; the organic material layer 103 has a thickness of 20000 Å; the PI film layer has a thickness of 1000 Å; the display substrate corresponding to curve 1 has a protective layer of ITO material with a thickness of 700 Å on the side of the reflective electrode layer 104 near the organic material layer 103. The reflective electrode layer 104 of the display substrate corresponding to curve 2 is ITO / Ag / ITO, with a thickness of 70 Å / 1000 Å / 30 Å; the organic material layer 103 is made of the same material as the display substrate corresponding to curve 1, and its thickness is 20000 Å; the PI film layer is made of the same material as the display substrate corresponding to curve 1, with a thickness of 1000 Å. The reflective electrode layer of the display substrate corresponding to curve 2 does not have a protective layer. Figure 6It can be seen that the reflectivity of the display substrate corresponding to curve 1 is 94.23% in the visible light wavelength range (380nm-780nm), and the reflectivity of the display substrate corresponding to curve 2 is 47% in the visible light wavelength range (380nm-780nm). By setting a protective layer 110 between the reflective electrode layer 104 and the organic material layer 103, the reflectivity of the display panel can be effectively improved.

[0052] In one alternative implementation, Figure 2 This application illustrates a schematic cross-sectional view of a sub-pixel of a display substrate including a transmissive region, according to an embodiment of this application. Figure 2 As shown, the sub-pixel also includes a transmissive region A2, and the substrate 101 covers the area where the reflective region A1 and the transmissive region A2 are located. The transmissive region A2 includes a central transmissive region located in the center and an edge region located around the central transmissive region.

[0053] In this embodiment, the sub-pixel further includes: a pixel electrode layer 102 disposed on the side of the organic material layer 103 near the substrate 101; a thin-film transistor (TFT) disposed on the side of the pixel electrode layer 102 near the substrate 101, the TFT being located in the reflective region A1 of each sub-pixel. The TFT includes source / drain electrodes 107; and an insulating layer 105 disposed between the TFT and the pixel electrode layer 102.

[0054] The pixel electrode layer 102 overlaps with the reflective region A1 in the orthographic projection of the substrate 101 and covers the transmissive region A2 (including the central transmissive region and the edge region). The reflective electrode layer 104 extends from the reflective region A1 to the edge (i.e., the edge region) of the transmissive region A2. In the edge region of the transmissive region A2, the reflective electrode layer 104 forms an electrical connection with the pixel electrode layer 102 located in the transmissive region A2 (including the central transmissive region and the edge region).

[0055] When the sub-pixel has a reflective region A1 and a transmissive region A2, the orthographic projection of the protective layer 110 on the substrate 101 overlaps with the orthographic projection of the reflective electrode layer 104 on the substrate 101. Specifically, Figure 4 This illustration shows a schematic diagram of the orthographic projection relationship between a protective layer and a reflective electrode layer on a substrate according to an embodiment of this application. Figure 4As shown, within the reflective region A1 of each sub-pixel, the orthographic projection of the protective layer 110 on the substrate 101 lies inside the orthographic projection of the reflective electrode layer 104 on the substrate 101. Within the transmissive region A2 of each sub-pixel, the orthographic projection of the protective layer 110 on the substrate 101 covers the transmissive region A2, and an electrical connection is formed between the transmissive region A2 and the pixel electrode 102; the orthographic projection of the reflective electrode layer 104 on the substrate 101 lies only within the reflective region A1, and the reflective electrode layer 104 forms an electrical connection between the reflective region A1, the protective layer 110, the pixel electrode layer 102, and the source / drain electrode 107.

[0056] Figure 5 This illustration shows a schematic diagram of the orthographic projection relationship between the protective layer and the reflective electrode layer on the substrate according to an embodiment of this application, as shown below. Figure 5 As shown, within the reflective region A1 of each sub-pixel, the orthographic projection of the reflective electrode layer 104 onto the substrate 101 lies inside the orthographic projection of the protective layer 110 onto the substrate 101. Within the transmissive region A2 of each sub-pixel, the orthographic projection of the protective layer 110 onto the substrate 101 covers the transmissive region A2, and an electrical connection is formed between the protective layer 110 and the pixel electrode 102 in the transmissive region A2; the orthographic projection of the reflective electrode layer 104 onto the substrate 101 lies only within the reflective region A1, and the reflective electrode layer 104 forms an electrical connection with the pixel electrode 102 and the source / drain electrode 107 in the reflective region A1 through the protective layer 110.

[0057] In one optional embodiment, the distance 'a' between the first orthographic projection edge of the protective layer 110 on the substrate 101 and the first orthographic projection edge of the reflective electrode layer 104 on the substrate 101 is less than or equal to 2 μm. Wherein, the first orthographic projection edge is the orthographic projection edge excluding the orthographic projection edge near the transmission region A2, so as to... Figure 4 and Figure 5 For example, the orthographic projection edge near the transmission area A2 is the lower edge of the sub-pixel, and the first orthographic projection edge is the left edge, right edge and upper edge of the sub-pixel.

[0058] In this embodiment, the insulating layer 105 covers the areas where the reflective region A1 and the transmissive region A2 are located. Within the reflective region A1, a via 1051 is provided on the insulating layer 105, and the pixel electrode layer 102 and the drain of the thin-film transistor are electrically connected through the via 1051. The orthographic projection of the via 1051 onto the substrate 101 is located within the orthographic projection of the drain of the thin-film transistor onto the substrate 101.

[0059] In transflective displays, excessive cell thickness at the organic film apertures in the reflective zone leads to increased brightness in reflective mode L0, light leakage at the organic film apertures, and consequently, reduced contrast and deteriorated display performance. While black matrices can be used to block the organic film apertures to improve contrast, this also reduces the aperture ratio of the reflective zone. This embodiment addresses this by extending a reflective electrode layer 104 to the transmissive zone, forming an electrical connection between the reflective electrode layer 104 and the pixel electrode layer 102 and source / drain electrodes 107 at the edge of the transmissive zone A2. This avoids forming organic apertures in the organic material layer located in the reflective zone A1, thus achieving the connection between the reflective electrode, pixel electrode, and source / drain electrodes. Therefore, the display substrate provided in this embodiment avoids the reduced contrast and aperture ratio caused by light leakage due to the presence of organic apertures. Furthermore, the display substrate provided in this application does not have organic film apertures, eliminating the need for black matrices at the corresponding positions, further improving the contrast and aperture ratio of the display device. Experimental tests showed that the aperture ratio of the display substrate with organic perforations was 58% at 5.0WVGA, while the aperture ratio of the display substrate provided in this application embodiment was 66% at 5.0WVGA. It can be seen that the display substrate provided in this application embodiment can effectively improve the aperture ratio of the display device.

[0060] In an optional embodiment, the surface of the organic material layer 103 near the protective layer 110 and the surface of the reflective electrode layer 104 away from the protective layer 110 can be planarized surfaces (e.g., Figure 1 The organic material layer 103 in the sub-pixel shown is near the surface of the protective layer 110. Preferably, in order to convert specular reflection into diffuse reflection when light is reflected by the reflective electrode layer 104, the surface of the organic material layer 103 near the protective layer 110 and the surface of the reflective electrode layer 104 away from the protective layer 110 are set as uneven surfaces. Specifically, the shape of the uneven surface structure can be a zigzag, an arc, or a combination of zigzag and arc shapes. The uneven surface structure on the surface of the organic material layer 103 near the protective layer 110 and the surface of the reflective electrode layer 104 away from the protective layer 110 can be arranged regularly or irregularly. The specific shape and arrangement of the uneven surface structure can be determined according to the actual situation, and this application does not limit it.

[0061] In one alternative implementation, Figure 3 A schematic diagram of a raised structural surface according to an embodiment of this application is shown, as follows: Figure 3As shown, the organic material layer 103 near the protective layer 110 and the reflective electrode layer 104 away from the protective layer 110 have at least one protrusion. The protrusion is a hemispherical arc-shaped structure (bulge structure) regularly arranged on the organic material layer 103 near the protective layer 110 and the reflective electrode layer 104 away from the protective layer 110. The protrusion protrudes towards the side away from the substrate 101, and the orthographic projection size of the protrusion on the substrate 101 is greater than or equal to 3 μm and less than or equal to 10 μm. When light reaches the reflective electrode layer 104, it is scattered in different directions due to its arc-shaped surface structure, forming diffuse reflection and preventing specular reflection, thereby further increasing the viewing angle of the display substrate in reflective mode.

[0062] In one optional embodiment, the sub-pixel further includes: a gate 108 disposed between the source / drain 107 and the substrate 101; a gate insulating layer 106 disposed on the side of the gate 108 facing away from the substrate 101; and an active layer 109 disposed between the source / drain 107 and the gate insulating layer 106.

[0063] This application provides a display substrate, comprising: a substrate and a plurality of sub-pixels disposed on one side of the substrate. Each sub-pixel includes a reflective area and comprises: an organic material layer disposed on one side of the substrate; a protective layer disposed on the side of the organic material layer facing away from the substrate, the protective layer being made of a transparent metal oxide; and a reflective electrode layer disposed on the side of the protective layer facing away from the substrate. The reflective electrode layer comprises a first sub-layer, a second sub-layer, and a third sub-layer stacked sequentially. The first sub-layer is disposed close to the substrate, the second sub-layer is made of a reflective metal, and the materials of the first and third sub-layers are the same as those of the protective layer. This application, by placing the pixel electrode layer in the protective layer between the reflective electrode layer and the organic material layer, avoids the decrease in reflectivity of the display substrate caused by the reaction between the organic material layer and the reflective metal in the reflective electrode layer, effectively improving the reflectivity of the display substrate.

[0064] Based on the same inventive concept, this application discloses a display panel, including a display substrate as described in the embodiments of this application, and a color filter substrate. The display substrate and the color filter substrate are disposed opposite each other, and a liquid crystal layer is disposed between the display substrate and the color filter substrate. The sub-pixels are disposed close to the liquid crystal layer.

[0065] Based on the same inventive concept, this application provides a display device including a backlight module and a display panel as described in the embodiments of this application, wherein the backlight module is located on the backlight side of the display panel.

[0066] The display device can be a monitor or a product containing a monitor. The monitor can be a flat panel display (FPD), a micro-display, etc. Depending on whether the user can see the back of the monitor, the monitor can be a transparent monitor or an opaque monitor. It should be noted that the specific display device can be determined according to the actual situation, and this application embodiment does not impose any limitations.

[0067] Based on the same inventive concept, embodiments of this application provide a method for preparing a display substrate. Figure 7 A schematic flowchart of a display substrate fabrication method according to an embodiment of this application is shown, as follows: Figure 7 As shown, the preparation method includes the following steps:

[0068] S101, Provide a substrate.

[0069] S102, A plurality of sub-pixels are formed on one side of the substrate, the sub-pixels including a reflective area.

[0070] A plurality of sub-pixels are formed on one side of the substrate, each sub-pixel including a reflective region, and the sub-pixel comprising:

[0071] An organic material layer is disposed on one side of the substrate.

[0072] A protective layer is disposed on the side of the organic material layer facing away from the substrate, and the material of the protective layer is a transparent metal oxide;

[0073] A reflective electrode layer is disposed on the side of the protective layer away from the substrate. The reflective electrode layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially. The first sublayer is disposed close to the substrate. The material of the second sublayer is a reflective metal. The materials of the first sublayer and the third sublayer are the same as those of the protective layer.

[0074] In specific implementation step S102, a gate 108, an active layer 109, a gate insulating layer 106, and a source / drain electrode 107 are sequentially fabricated on the substrate. Subsequently, an insulating layer 105 is formed on the source / drain electrode 107 and the side of the gate insulating layer 106 facing away from the substrate 101, and a via 1051 is formed on the insulating layer at a position corresponding to the drain electrode. A pixel electrode layer 102 is formed on the side of the insulating layer 105 facing away from the substrate 101, and the pixel electrode layer 102 is connected to the drain electrode through the via 1051.

[0075] An organic material layer 103 is formed in the reflective region A1 on the side of the pixel electrode layer 102 facing away from the substrate 101. Optionally, an uneven surface structure is formed on the surface of the organic material layer 103 facing away from the substrate 101 to increase the viewing angle of the display substrate in reflective mode. Finally, a reflective electrode layer 104 is formed on the side of the pixel electrode layer 103 facing away from the substrate 101.

[0076] Since the pixel electrode layer 102 is prepared before the organic material layer 103 in the process of preparing the display substrate in this application, it is not necessary to form organic film holes on the organic material layer 103 to connect the reflective electrode layer to the drain electrode through the pixel electrode layer. Therefore, in the method of preparing the display substrate in this application, after the organic material layer 103 is formed, it is not necessary to prepare a PVX protective layer. Thus, the conventional low-temperature PVX film deposition process after the organic material layer 103 is formed is avoided in the method of preparing the display substrate in this application. This eliminates the equipment cooling process and adverse effects on production capacity caused by the low-temperature PVX film deposition process, effectively improves the production capacity of the display substrate preparation process, and reduces production costs.

[0077] A protective layer 110 and a reflective electrode layer 104 are sequentially formed on the side of the organic material layer 103 facing away from the substrate 101. The reflective electrode layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially, with the first sublayer disposed close to the substrate 101. To ensure that the reflective metal of the second sublayer does not react with the organic material layer 103, the sum of the thicknesses of the first sublayer and the protective layer 110 located between the second sublayer and the organic material layer 103 is greater than or equal to eight times the thickness of the third sublayer. Furthermore, since the first sublayer and the protective layer 110 are made of the same transparent metal oxide, the thickness of the transparent metal oxide located between the second sublayer and the organic material layer 103 is greater than or equal to eight times the thickness of the transparent metal oxide facing away from the second sublayer.

[0078] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0079] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0080] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this disclosure. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0081] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this disclosure may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0082] In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. This disclosure can be implemented by means of hardware comprising a plurality of different elements and by means of a suitably programmed computer. In a unit claim enumerating a plurality of means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

[0084] The above provides a detailed description of a display substrate, its preparation method, and the display panel provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display substrate, characterized by, The display substrate includes: A substrate, and a plurality of sub-pixels disposed on one side of the substrate, each sub-pixel including a reflective region, the sub-pixel comprising: An organic material layer is disposed on one side of the substrate. A protective layer is disposed on the side of the organic material layer opposite to the substrate, and the material of the protective layer is a transparent metal oxide; the orthogonal projection of the protective layer on the substrate completely covers the orthogonal projection of the organic material layer on the substrate. A reflective electrode layer is disposed on the side of the protective layer away from the substrate. The reflective electrode layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially. The first sublayer is disposed close to the substrate. The material of the second sublayer is a reflective metal. The materials of the first sublayer and the third sublayer are the same as those of the protective layer. The sum of the thicknesses of the first sublayer and the protective layer is greater than or equal to eight times the thickness of the third sublayer.

2. The display substrate according to claim 1, characterized in that, The orthographic projection of the protective layer on the substrate overlaps with the orthographic projection of the reflective electrode layer on the substrate, and the distance between the edge of the orthographic projection of the protective layer on the substrate and the edge of the orthographic projection of the reflective electrode layer on the substrate is less than or equal to 2 μm.

3. The display substrate according to claim 1, characterized in that, The sum of the thicknesses of the first sublayer and the protective layer is greater than or equal to 300 angstroms and less than or equal to 800 angstroms; the thickness of the third sublayer is less than or equal to 100 angstroms.

4. The display substrate according to claim 1, characterized in that, The thickness of the first sublayer is less than or equal to 100 angstroms; the thickness of the second sublayer is greater than or equal to 500 angstroms and less than or equal to 3000 angstroms; the thickness of the third sublayer is less than or equal to 100 angstroms.

5. The display substrate according to any one of claims 1 to 4, characterized in that, The material of the second sub-layer is silver.

6. The display substrate according to claim 1, characterized in that, The sub-pixel also includes: A pixel electrode layer is disposed on the side of the organic material layer near the substrate. A thin-film transistor, wherein the thin-film transistor is disposed on the side of the pixel electrode layer near the substrate, the thin-film transistor including a source and a drain; and An insulating layer is disposed between the thin-film transistor and the pixel electrode layer; The pixel electrode layer is connected to the drain of the thin-film transistor via a via.

7. The display substrate according to claim 6, characterized in that, The sub-pixel also includes a transmissive region, the orthographic projection of the pixel electrode layer on the substrate covers the transmissive region, the protective layer extends from the reflective region to the edge of the transmissive region, and the protective layer and the pixel electrode layer form an electrical connection in the transmissive region.

8. A display panel comprising a display substrate as described in any one of claims 1-7 and a color filter substrate, wherein the display substrate and the color filter substrate are disposed opposite each other, a liquid crystal layer is disposed between the display substrate and the color filter substrate, and the sub-pixels are disposed close to the liquid crystal layer.

9. A method for preparing a display substrate, characterized in that, The method includes: Provide substrates; A plurality of sub-pixels are formed on one side of the substrate, each sub-pixel including a reflective region, and the sub-pixel comprising: An organic material layer is disposed on one side of the substrate. A protective layer is disposed on the side of the organic material layer opposite to the substrate, and the material of the protective layer is a transparent metal oxide; the orthogonal projection of the protective layer on the substrate completely covers the orthogonal projection of the organic material layer on the substrate. A reflective electrode layer is disposed on the side of the protective layer away from the substrate. The reflective electrode layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially. The first sublayer is disposed close to the substrate. The material of the second sublayer is a reflective metal. The materials of the first sublayer and the third sublayer are the same as those of the protective layer. The sum of the thicknesses of the first sublayer and the protective layer is greater than or equal to eight times the thickness of the third sublayer.

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