Electronic device and server system

Abstract

Embodiments of the present application provide an electronic device and a server system, the electronic device comprising: a shell, a device to be cooled, and a liquid blocking structure; the shell has a cavity therein, and a first opening is arranged on a side wall of the shell; the liquid blocking structure is surrounded at the first opening, and the liquid blocking structure divides the cavity into a first space and a second space, the first space and the second space are communicated, and the first opening is communicated with the first space; the device to be cooled and a cooling medium are located in the second space, and the liquid blocking structure is used for blocking the liquid cooling medium in the second space from entering the first space; wherein the cooling medium vaporized in the second space is discharged from the first opening through the first space. Therefore, the arrangement of the liquid blocking structure solves the problem of the first opening being submerged when the liquid cooling medium fluctuates.

Description

Technical Field

[0001] This invention relates to the field of data center technology, and more particularly to an electronic device and server system. Background Technology

[0002] Internet service providers, enterprise platforms, and research institutions all require significant computing power. The operating platforms that support these needs, including storage, computing, and networking, are called data centers. Furthermore, with the increasing demand for information and communication technologies (ICTs) in modern society, data centers have developed rapidly. This has led to a shift in the density of ICT equipment within data centers from low to high. High-density ICT equipment generates a large amount of heat during operation, necessitating cooling systems in data centers to ensure the proper functioning of the ICT equipment.

[0003] In related technologies, data centers include multiple full-scale servers and / or at least one server, each full-scale server comprising multiple server nodes and a liquid cooling system. A server can be understood as a single, usable server node. Each server node has a cavity for containing a cooling medium, into which components are immersed. Heat is dissipated from the components through the phase change characteristics of the cooling medium. However, fluctuations in the liquid cooling medium can flood the vents, thus affecting the cooling performance of the medium for the components.

[0004] Therefore, how to reduce the adverse effects of liquid cooling medium fluctuations on the heat dissipation performance of components has become an urgent problem to be solved. Summary of the Invention

[0005] This application provides an electronic device and server system in which the liquid cooling medium inside the electronic device does not submerge the air outlet, thus avoiding adverse effects on the heat dissipation performance of the components and ensuring the normal use of the electronic device.

[0006] In a first aspect, embodiments of this application provide an electronic device, including: a housing, a device to be cooled, and a liquid-blocking structure. The housing has a cavity for accommodating a cooling medium, the device to be cooled, and the liquid-blocking structure. A first opening is provided on the side wall of the housing. The liquid-blocking structure surrounds the first opening and divides the cavity into a first space and a second space, which are connected. The first opening is also connected to the first space. The device to be cooled and the cooling medium are located in the second space. The liquid-blocking structure prevents the liquid cooling medium in the second space from entering the first space. The vaporized cooling medium in the second space is discharged through the first opening via the first space.

[0007] When the electronic device of this application embodiment is working, under the heat generated by the device to be cooled, the liquid cooling medium in the second space will gradually transform into gas, thereby forming a state similar to boiling water on the upper surface of the liquid cooling medium. In other words, the liquid cooling medium will fluctuate. Subsequently, the liquid cooling medium will move from the second space to the first space. However, due to the existence of the liquid-blocking structure and the fact that the first opening is located in the first space, the liquid cooling medium cannot enter the first space from the second space. Therefore, the liquid-blocking structure prevents the liquid cooling medium from flooding the first opening, so that the vaporized cooling medium in the second space can be discharged from the first opening through the first space without air blockage, thus ensuring the heat dissipation performance of the electronic device and the sealing of the cavity.

[0008] In one possible implementation of the first aspect, the bottom end of the liquid-blocking structure is sealed to the inner bottom surface of the housing or the inner side surface of the sidewall of the housing, and there is a gap between the top end of the liquid-blocking structure and the inner top surface of the housing, the gap being used to connect the first space and the second space. The gap between the top end of the liquid-blocking structure and the inner top surface of the housing is not lower than the lowest inner wall of the first opening, and this gap allows the vaporized cooling medium to enter the first space from the second space, so that the vaporized cooling medium can smoothly exit from the first opening, avoiding excessive pressure within the cavity that could lead to loss of the electronic device's heat dissipation capacity and structural sealing function. Here, the structural sealing function refers to the sealing performance of the cavity.

[0009] In one possible implementation, the bottom end of the liquid-blocking structure is sealed to the inner bottom surface of the housing or the inner side surface of the housing's sidewall, and the top end of the liquid-blocking structure is sealed to the inner top surface of the housing. A vent is provided on the liquid-blocking structure to connect the first space and the second space. The vent allows the vaporized cooling medium to enter the first space from the second space, so that the vaporized cooling medium can smoothly exit from the first opening, preventing excessive pressure within the cavity from causing loss of heat dissipation capacity and structural sealing function of the electronic device.

[0010] In one possible implementation, the bottom of the second space is parallel to the bottom of the first space, and along the height direction of the electronic device, the bottom of the first space is at the same height as the lowest inner wall of the first opening. This configuration allows the gas-liquid mixture entering the first space from the second space to exit through the first opening, preventing liquid cooling medium from remaining in the first space and increasing the circulation rate of the cooling medium participating in the heat dissipation process. The gas-liquid mixture includes both vaporized and liquid cooling medium.

[0011] In one possible implementation, the bottom of the first space is a sloping surface facing downwards towards the first opening, and along the height direction of the electronic device, the lowest point of the bottom of the first space is at the same height as the lowest point of the inner wall of the first opening. This configuration allows the gas-liquid mixture entering the first space from the second space to be discharged through the first opening, preventing liquid cooling medium from remaining in the first space and increasing the circulation rate of the cooling medium participating in the heat dissipation process.

[0012] In one possible implementation, the liquid-blocking structure is integral with the housing, or the liquid-blocking structure is detachably connected to the housing. Integrating the liquid-blocking structure with the housing reduces manufacturing and sealing difficulties. Detachable connection allows one liquid-blocking structure to be matched with housings of different sizes, expanding its application range.

[0013] In one possible implementation, the system further includes a decomposition mesh disposed at the connection between the first space and the second space. The decomposition mesh is used to decompose large droplets in the gas-liquid mixture into multiple sub-droplets. The gas-liquid mixture includes both gaseous and liquid cooling media. The decomposition mesh serves two purposes: firstly, it prevents large droplets from entering the first space; secondly, it decomposes large droplets entering the first space into multiple sub-droplets, allowing the vaporized cooling media to carry the sub-droplets out. Furthermore, it prevents pressure fluctuations within the first opening, ensuring the smooth discharge of the gas-liquid mixture.

[0014] In one possible implementation, the decomposition mesh is a metal mesh structure, which can decompose large droplets into multiple sub-droplets and improve the service life of the decomposition mesh.

[0015] In one possible implementation, the liquid-blocking structure is provided with a first slot, and a portion of the decomposition mesh is inserted into the first slot and engaged with the liquid-blocking structure. The first slot allows the decomposition mesh to be fixed to the liquid-blocking structure, thereby enabling the decomposition mesh to decompose large droplets into multiple sub-droplets during long-term operation of the electronic device.

[0016] In one possible implementation, the first slot is located on the side wall of the liquid-blocking structure, or the first slot is located on the top surface of the liquid-blocking structure. Having the first slot on the side wall of the liquid-blocking structure reduces the assembly difficulty of the decomposition mesh and the liquid-blocking structure. Having the first slot on the top surface of the liquid-blocking structure reduces the cost of the decomposition mesh.

[0017] In one possible implementation, a second slot is provided on the inner wall of the cavity, and a portion of the decomposition mesh is inserted into the second slot and engaged with the housing. The decomposition mesh can be fixed to the liquid-blocking structure via the second slot, or the first and second slots can cooperate to fix the decomposition mesh in a predetermined position.

[0018] In one possible implementation, the top end of the mesh abuts against the top surface of the cavity. This contact between the mesh and the top surface of the cavity improves the mesh's fixation effect.

[0019] In one possible implementation, the housing is provided with a second opening that communicates with the second space, wherein the second opening is used to introduce a liquid cooling medium into the second space.

[0020] In one possible implementation, at least one nozzle is provided within the second space, the nozzle communicating with the second opening and positioned above the surface of the liquid cooling medium. The nozzle is used to spray the liquid cooling medium onto the device to be cooled. Because the nozzle is positioned above the surface of the liquid cooling medium, the amount of cooling medium used can be reduced, thereby lowering the cooling cost of the electronic device. Furthermore, the nozzle can enhance the single-point heat dissipation capability of the device to be cooled, meeting the needs of high-heat-generating scenarios in electronic devices.

[0021] In one possible implementation, the electronic device is any one of a server node, a storage device, or a communication device.

[0022] Secondly, embodiments of this application provide a server system, including: a cooling medium distribution device, a first pipe, a second pipe, and at least one of the aforementioned electronic devices. The input end of the cooling medium distribution device is connected to a first opening of the electronic device via the first pipe, and the output end of the cooling medium distribution device is connected to a second space of the electronic device via the second pipe. The cooling medium distribution device is used to condense the vaporized cooling medium into a liquid cooling medium and deliver the liquid cooling medium to the second space.

[0023] Thirdly, embodiments of this application provide a data center, including a computer room and at least one of the aforementioned server systems disposed within the computer room.

[0024] These and other aspects, embodiments, and advantages of the exemplary embodiments will become apparent from the accompanying drawings and the examples described below. However, it should be understood that the specification and drawings are for illustrative purposes only and are not intended to limit the scope of this application; details are provided in the appended claims. Other aspects and advantages of this application will be set forth in the following description, and in part will be obvious from the description or may be learned by practice of the application. Furthermore, various aspects and advantages of this application may be realized and obtained by means and combinations particularly pointed out in the appended claims. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the data center provided in the embodiments of this application;

[0026] Figure 2 This is a schematic diagram of the internal structure of a data center provided in an embodiment of this application;

[0027] Figure 3 This is a three-dimensional structural diagram of a server system provided in an embodiment of this application;

[0028] Figure 4 This is a three-dimensional structural diagram of another server system provided in an embodiment of this application;

[0029] Figure 5 This is a schematic diagram of the structure of another server system provided in the embodiments of this application;

[0030] Figure 6 This is a longitudinal sectional view of the first type of electronic device provided in the embodiments of this application;

[0031] Figure 7 This is a partial longitudinal sectional view of the second type of electronic device provided in the embodiments of this application;

[0032] Figure 8 This is a partial longitudinal sectional view of the third type of electronic device provided in the embodiments of this application;

[0033] Figure 9 This is a partial longitudinal sectional view of the fourth electronic device provided in the embodiments of this application;

[0034] Figure 10 This is a partial longitudinal sectional view of the fifth type of electronic device provided in the embodiments of this application;

[0035] Figure 11 This is a partial longitudinal sectional view of the sixth electronic device provided in the embodiments of this application;

[0036] Figure 12 This is a partial longitudinal sectional view of the seventh electronic device provided in the embodiments of this application;

[0037] Figure 13 This is a complete longitudinal sectional view of the seventh electronic device provided in the embodiments of this application;

[0038] Figure 14 This is a partial top sectional view of the first type of electronic device provided in the embodiments of this application;

[0039] Figure 15 This is a partial top sectional view of the seventh electronic device provided in the embodiments of this application;

[0040] Figure 16 This is a partial top sectional view of the fourth type of electronic device provided in the embodiments of this application;

[0041] Figure 17 This is a longitudinal sectional view of the eighth electronic device provided in the embodiments of this application;

[0042] Figure 18 yes Figure 17 A partial enlarged view of the exploded mesh in the illustrated embodiment;

[0043] Figure 19 This is a longitudinal sectional view of the ninth type of electronic device provided in the embodiments of this application;

[0044] Figure 20 Yes, yes Figure 19 A partial enlarged view of the exploded mesh in the illustrated embodiment;

[0045] Figure 21 This is a partial enlarged view of another decomposed mesh provided in an embodiment of this application;

[0046] Figure 22 This is a partial enlarged view of another decomposed mesh provided in an embodiment of this application;

[0047] Figure 23 This is a partial enlarged view of another decomposed mesh provided in an embodiment of this application;

[0048] Figure 24 This is a longitudinal sectional view of the tenth electronic device provided in the embodiments of this application;

[0049] Figure 25 This is a cross-sectional view of a housing provided in an embodiment of this application;

[0050] Figure 26 This is a cross-sectional view of another housing provided in an embodiment of this application;

[0051] Figure 27 This is a partial three-dimensional part of an electronic device provided in an embodiment of this application;

[0052] Figure 28 yes Figure 27A partial enlarged view of the first opening in the illustrated embodiment;

[0053] Figure 29 yes Figure 27 A partial sectional view of the embodiment shown;

[0054] Figure 30 yes Figure 29 A partial enlarged view of the first opening in the illustrated embodiment.

[0055] Explanation of reference numerals in the attached figures:

[0056] 100. Server system;

[0057] 110. Electronic devices;

[0058] 111. Shell; 1111. Upper shell; 11111. Second groove; 1112. Lower shell; 11121. First groove; 1113. Annular sealing strip;

[0059] 112. Components to be cooled;

[0060] 113. Liquid-blocking structure; 1131. Dashed line; 1132. Vent;

[0061] 114. Cavity; 1141. First space; 1142. Second space; 115. First opening; 116. Second opening; 117. Cooling medium; 118. Decomposition mesh;

[0062] 120. Cabinet body; 121. Cabinet door; 122. Cabinet frame;

[0063] 131. First slot; 132. Second slot; 133. Quick connector;

[0064] 140. Sprayer head;

[0065] 150. Cooling medium distribution device; 160. First pipe; 170. Second pipe;

[0066] 200. Computer room;

[0067] 300. Equipment cabinet;

[0068] 1000, Data Center;

[0069] X, length direction; Y, width direction; Z, height direction. Detailed Implementation

[0070] Data center 1000 is a globally collaborative network of specific devices used to transmit, accelerate, display, compute, and store data information over internet infrastructure. This application provides an embodiment of a data center 1000; see [link to embodiment]. Figure 1As shown, data center 1000 may include server room 200, see [link / reference] Figure 2 As shown, the computer room 200 is equipped with at least one equipment cabinet 300, and the number of equipment cabinets 300 may include, but is not limited to, those shown. Figure 2 The three shown may include, for example, 50-100 equipment cabinets 300. The computer room 200 is equipped with a cooling system. In this embodiment, the specific structure and working principle of the cooling system within the computer room 200 are not described in detail.

[0071] The equipment cabinet 300 can be a communication cabinet, a power supply cabinet, or a rack server, including at least one electronic device 110. Alternatively, the equipment cabinet 300 can be a cooling cabinet for heat dissipation of the server. Each server can have one cooling cabinet, or multiple servers can share one cooling cabinet. It should be noted that the cooling cabinet can include a frame and a heat dissipation device. The frame houses the heat dissipation device, which is used to cool the server. The frame can be the server cabinet 120; therefore, the heat dissipation device can be integrated into the server.

[0072] In this embodiment, a heat dissipation device integrated into a server is used as an example for explanation. The heat dissipation device and the server are defined as a server system 100, which includes at least: a cabinet 120, a cooling medium distribution device 150, a first pipe 160, a second pipe 170, and at least one electronic device 110. (Refer to...) Figure 3 The cabinet 120 may include a cabinet body 122 and cabinet doors 121. The number of cabinet doors 121 can be one, or two. The two cabinet doors 121 can be arranged opposite each other; for example, one cabinet door 121 can be located at the front of the cabinet body 120 (e.g.,...). Figure 3 As shown), another cabinet door 121 can be located at the rear of the cabinet body 120. It should be noted that in some examples, the cabinet body 120 may not have a cabinet door 121. For example, the front and back of the cabinet body 120 may be open structures, or the front, back, left and right sides of the cabinet body 120 may all be open structures.

[0073] Understandably, reference Figure 4 The cabinet 120 is used to support at least the cooling medium distribution device 150 and electronic equipment 110.

[0074] In this embodiment, the shape and structure of the cabinet 120 are not specifically limited. Furthermore, the shape of the cabinet 120 can be determined based on the shape of the electronic device 110. For example, if the electronic device 110 has a plate-like structure, the shape of the cabinet 120 can be a cuboid (see reference). Figure 3This reduces the size of a single server system 100, allowing multiple server systems 100 to be installed within the server room 200. Furthermore, it is understood that the inner wall of the cabinet 120 defines a cavity to accommodate multiple electronic devices 110 and a cooling medium distribution device 150. Additionally, the cabinet 120 is provided with a support structure (not shown in the figure) for supporting the electronic devices 110. For example, along the height direction of the cabinet 120, multiple support plates are spaced apart on the side walls of the cabinet 120, or multiple support rings are spaced apart on the side walls of the cabinet 120.

[0075] In the embodiments of this application, see Figure 4 As shown, at least one electronic device 110 is installed inside the cabinet 120, for example... Figure 4 The system includes multiple electronic devices 110, which are horizontally spaced apart within the cabinet 120. Furthermore, each electronic device 110 can be a computing device, storage device, or communication device, depending on the type of server system 100; no specific restrictions are imposed here.

[0076] In the embodiments of this application, reference is made to Figure 5 The electronic device 110 has a cavity 114 for containing a cooling medium 117. A first opening 115 and a second opening 116 are provided on the side wall of the cavity 114. The first opening 115 is connected to the input end of a cooling medium distribution device 150 via a first pipe 160, and the second opening 116 is connected to the output end of the cooling medium distribution device 150 via a second pipe 170. Thus, the vaporized cooling medium 117 in the second space 1142 passes through the first space 1141 and is discharged from the first opening 115 into the cooling medium distribution device 117. The cooling medium distribution device 150 can deliver liquid cooling medium 117 into the cavity 114 to dissipate heat from the heat-dissipating components 112 within the electronic device 110. It should be noted that, for better heat dissipation, the cavity 114 can be a sealed cavity, connected to the outside through the first opening 115 or other openings.

[0077] In this embodiment, the cooling medium distribution device 150 is used to condense the vaporized cooling medium 117 into a liquid cooling medium 117 to remove the heat generated by the device 112 to be cooled, thereby dissipating heat from the electronic device 110 and ensuring that the temperature of the electronic device 110 is within a predetermined range. One cooling medium distribution device 150 may be connected to one electronic device 110, or, as per [reference]... Figure 5 A cooling medium distribution device 150 can be connected to multiple electronic devices 110. Additionally, see reference... Figure 4 The cooling medium distribution device 150 can be installed on the cabinet 120.

[0078] It is understood that the server system 100 provided in this application embodiment can be set up in the computer room 200 of the data center 1000. Of course, in some examples, the server system 100 provided in this application embodiment can also be set up separately.

[0079] See Figure 5 As shown, the heat-dissipating device 112 in each electronic device 110 is immersed in the cooling medium 117. The phase change characteristics of the cooling medium 117 dissipate heat from the heat-dissipating device 112. The liquid cooling medium 117 absorbs the heat generated by the heat-dissipating device 112 and changes from liquid to gas. The vaporized cooling medium 117 is then discharged from the cavity 114 through the first opening 115 and enters the cooling medium distribution device 150. However, when the liquid cooling medium 117 fluctuates, it will submerge the first opening 115, causing the vaporized cooling medium 117 to be unable to be discharged from the first opening 115, resulting in an air blockage problem. As a result, the pressure inside the electronic device 110 is too high, causing the heat dissipation capacity and structural sealing of the electronic device 110 to be lost.

[0080] The immersion of the heat-dissipating device 112 in the cooling medium 117 can be understood as follows: along the height direction of the electronic device 110, a part of the heat-dissipating device 112 is submerged in the cooling medium 117, and another part of the heat-dissipating device 112 is located above the liquid surface of the cooling medium 117, or the heat-dissipating device 112 is completely immersed in the cooling medium 117.

[0081] It should be noted that "device to be cooled 112" is a general term for all heat-generating devices, which can be circuit boards, resistors, central processing units, graphics processing units, heat sinks, capacitors, power supplies, memory, etc. Furthermore, the number of each type of heat-generating device can be one or more, without specific limitations.

[0082] To address the aforementioned problems, this application provides an electronic device 110, with reference to... Figure 6The electronic device 110 is equipped with a liquid-blocking structure 113, which divides the cavity 114 of the electronic device 110 into a first space 1141 and a second space 1142 that are connected. The device to be cooled 112 is placed in the second space 1142 and immersed in the cooling medium 117. The side wall of the first space 1141 is provided with a first opening 115. When the liquid-cooled cooling medium 117 in the second space 1142 fluctuates, the liquid-blocking structure 113 will prevent the liquid cooling medium 117 from entering the first space 1141 from the second space 1142, so as to prevent the liquid cooling medium 117 from flooding the first opening 115 and blocking the first opening 115. In this way, the vaporized cooling medium 117 in the second space 1142 can be discharged through the first space 1141 and the first opening 115, so as to ensure the heat dissipation capacity and structural sealing of the electronic device 110, thereby keeping the temperature of the electronic device 110 within a predetermined range.

[0083] The electronic device 110 provided in this application embodiment will be described in detail below through specific implementation methods.

[0084] Figure 6 This is a longitudinal sectional view of the first electronic device 110 provided in this application embodiment. (Reference) Figure 6 The electronic device 110 includes at least: a housing 111, a heat-dissipating device 112, and a liquid-blocking structure 113. The housing 111 can be a plate-like structure, a block-like structure, or a cylindrical structure, etc. Furthermore, the shape of the housing 111 can be determined according to the shape of the heat-dissipating device 112. For example, when the overall shape defined by the heat-dissipating device 112 is a plate-like structure, the shape of the housing 111 can also be a plate-like structure. Figure 6 As shown, the housing 111 has a cavity 114 that contains a cooling medium 117, a heat dissipation device 112, and a liquid-blocking structure 113. A first opening 115 is provided on the side wall of the housing 111. The cavity 114 is well-sealed to ensure that neither the gaseous nor the liquid cooling medium 117 leaks. Thus, under the pressure difference between the inside and outside of the housing 111, the gaseous cooling medium 117 can be discharged from the first opening 115 of the cavity 114.

[0085] It is understood that the first opening 115 is the air outlet of the cavity 114. In addition, besides being located on the side wall of the housing 111, the first opening 115 can also be located on the top or bottom wall of the housing 111 (not shown in the figure). In other words, the first opening 115 penetrates the bottom or top surface of the cavity 114. Here, the top surface of the cavity refers to the inner surface of the top wall of the housing 111, and the bottom surface of the cavity refers to the inner surface of the bottom wall of the housing 111.

[0086] It should be noted that the sidewall with the first opening 115 can be the left side wall, right side wall, front side wall, or rear side wall of the housing 111. The specific location can be determined according to the position of the electronic device 110 in the cabinet 120, and no specific limitation is made in this embodiment.

[0087] Among them, reference Figure 6 A liquid-blocking structure 113 surrounds the first opening 115. This means the liquid-blocking structure 113 surrounds the first opening 115. Furthermore, the liquid-blocking structure 113 divides the cavity 114 into a first space 1141 and a second space 1142, which are connected. The first opening 115 is connected to the first space 1141. The heat-dissipating device 112 and the cooling medium 117 are located within the second space 1142. The liquid-blocking structure 113 prevents the liquid cooling medium 117 in the second space 1142 from entering the first space 1141. The vaporized cooling medium 117 in the second space 1142 passes through the first space 1141 and exits through the first opening 115.

[0088] Among them, reference Figure 6 The first opening 115 is located on the side wall of the first space 1141. This ensures that the first opening 115 is not directly connected to the second space 1142 but is connected to the first space 1141. On the one hand, this ensures that the vaporized cooling medium 117 is discharged through the first space 1141 and then through the first opening 115. On the other hand, it prevents the liquid cooling medium 117 in the second space 1142 from flooding the first opening 115. Furthermore, the first opening 115 can be a circular hole or a polygonal hole; no specific limitation is made in this embodiment.

[0089] Among them, reference Figure 6 Along the height direction of the electronic device 110, the top of the liquid-blocking structure 113 is higher than the liquid surface of the liquid cooling medium 117. With this configuration, the liquid cooling medium 117 can be separated from the first opening 115. Thus, when the liquid cooling medium 117 fluctuates, it cannot enter the first space 1141 from the second space 1142 and flood the first opening 115, thereby preventing air blockage and ensuring the heat dissipation performance of the electronic device 110 and the sealing of the cavity 114.

[0090] In addition, the distance between the top of the liquid-blocking structure 113 and the liquid surface of the liquid cooling medium 117 along the height direction of the electronic device 110 is not specifically limited in this embodiment and can be determined according to the heat dissipation requirements of the electronic device 110.

[0091] In this embodiment, the bottom end of the liquid-blocking structure 113 can be sealed and connected to the inner bottom surface of the housing 111 or the inner side surface of the side wall of the housing 111. There can be a gap between the top end of the liquid-blocking structure 113 and the inner top surface of the housing 111. The gap is used to connect the first space 1141 and the second space 1142. With this configuration, when the electronic device 110 is working, the vaporized cooling medium 117 enters the first space 1141 from the second space 1142 through the gap. Subsequently, the vaporized cooling medium 117 is discharged from the first opening 115 to avoid the pressure in the cavity 114 being too high, which would cause the electronic device 110 to lose its heat dissipation capacity and structural sealing function.

[0092] The bottom end of the liquid-blocking structure 113 refers to the bottom of the liquid-blocking structure 113 along the height direction of the electronic device 110. Furthermore, "sealed connection" means that there is no gap between the bottom end face of the liquid-blocking structure 113 and the inner bottom surface of the housing 111, or no gap between the bottom end face of the liquid-blocking structure 113 and the inner side surface of the side wall of the housing 111. This prevents liquid cooling medium 117 and vaporized cooling medium 117 from entering the first space 1141 from between the bottom end face of the liquid-blocking structure 113 and the inner bottom surface or the inner side surface of the side wall of the housing 111.

[0093] It should be noted that, along the height direction of the electronic device 110, the inner top surface and inner bottom surface of the housing 111 are respectively the top surface and bottom surface of the cavity 114, or, the inner top surface of the housing 111 is the inner side surface of the top wall of the housing 111, and the inner bottom surface of the housing 111 is the inner side surface of the bottom wall of the housing 111. Here, the top surface and bottom surface of the cavity 114 refer to the top wall and bottom wall of the cavity 114 along the height direction of the electronic device 110.

[0094] In this embodiment of the application, along the height direction of the electronic device 110, the lowest inner wall of the first opening 115 is located above the top surface of the horizontal portion of the liquid-blocking structure 113, and the lowest inner wall of the first opening 115 is located below the top of the liquid-blocking structure 113.

[0095] It should be noted that the liquid-blocking structure 113 can be a plate-shaped structure, a cylindrical structure, a tubular structure, etc. For example, when the liquid-blocking structure 113 is a cylindrical structure, the open end of the cylindrical structure is sealed to the inner wall of the cavity 114, so that the first opening 115 is located inside the cylindrical structure, and an air inlet for the vaporized cooling medium 117 to enter is provided on the cylindrical structure. When the liquid-blocking structure 113 is a plate-shaped structure, the liquid-blocking structure 113 can be an arc-shaped plate structure, or the liquid-blocking structure 113 can be an L-shaped plate structure. In addition, the specific shape of the plate-shaped liquid-blocking structure 113 can be determined according to the specific position of the first opening 115 on the housing 111, and no specific limitation is made here.

[0096] The following section uses a partial longitudinal sectional view of the electronic device 110 as an example to introduce several specific implementation methods of the liquid-blocking structure 113. It should be noted that these implementation methods do not constitute a limitation on the specific shape of the liquid-blocking structure 113.

[0097] In some possible implementations, the longitudinal section of the liquid-blocking structure 113 is L-shaped, and the liquid-blocking structure 113 is a plate-like structure. Figure 7 This is a partial longitudinal sectional view of the second type of electronic device provided in the embodiments of this application, with reference to... Figure 7 The horizontal portion of the L-shaped liquid-blocking structure 113 is sealed to the inner side of the side wall of the housing 111, and there is a gap between the bottom surface of the horizontal portion of the L-shaped liquid-blocking structure 113 and the inner bottom surface of the housing 111. The top end of the vertical portion of the L-shaped liquid-blocking structure 113 is spaced from the inner top surface of the housing 111, so that the vaporized cooling medium 117 enters the first space 1141 from the second space 1142 through this gap.

[0098] In addition, the lowest inner wall of the first opening 115 is located above the top surface of the horizontal portion of the liquid-blocking structure 113, or is tangent to the top surface of the horizontal portion of the liquid-blocking structure 113, and the lowest inner wall of the first opening 115 is located below the top of the liquid-blocking structure 113.

[0099] The surface of the liquid-blocking structure 113 facing the first opening 115 and the inner side of the side wall of the housing 111 define the first space 1141, and the top surface of the horizontal part of the liquid-blocking structure 113 is the bottom of the first space 1141.

[0100] It should be noted that the bottom of the first space 1141 refers to the inner bottom surface of the first space 1141 along the height direction of the electronic device 110.

[0101] Optionally, when the lowest inner wall of the first opening 115 is tangent to the top surface of the horizontal portion of the liquid-retaining structure 113, see [reference needed]. Figure 7 The dashed line 1131 in the figure is designed to prevent liquid cooling medium 117 in the gas-liquid mixture from remaining in the first space 1141, thereby increasing the circulation of cooling medium 117 participating in the heat dissipation process.

[0102] In some possible implementations, the top surface of the horizontal portion of the liquid-blocking structure 113 can be a sloped surface, an arc-shaped surface, or other similar shapes. For example, Figure 8 This is a partial longitudinal sectional view of the third type of electronic device provided in the embodiments of this application, such as... Figure 8 As shown, the top surface of the horizontal portion of the liquid-retaining structure 113 is a slope. Optionally, the bottom surface of the horizontal portion of the liquid-retaining structure 113 can also be a slope, an arc surface, or other shapes. In some possible implementations, the liquid-retaining structure 113 can also be an arc-shaped plate surrounding the first opening 115. For example, as... Figure 9 As shown, Figure 9 This is a partial longitudinal sectional view of the fourth electronic device provided in an embodiment of this application. Figure 7 Similarly, the bottom end of the curved plate is located below the lowest inner wall of the first opening 115, or the bottom end of the curved plate is tangent to the lowest inner wall of the first opening 115.

[0103] In some possible implementations, the bottom end of the liquid-blocking structure 113 may also be in contact with and sealed to the inner bottom surface of the housing 111. Figure 10 This is a partial longitudinal sectional view of the fifth type of electronic device provided in the embodiments of this application, such as... Figure 10 As shown, taking the longitudinal section of the liquid-blocking structure 113 as L-shaped and the liquid-blocking structure 113 as a plate-like structure as an example, the bottom surface of the horizontal part of the L-shaped liquid-blocking structure 113 contacts and seals the inner bottom surface of the housing 111. This can prevent some liquid cooling medium 117 from not covering the heat-dissipating device 112, so as to avoid some cooling medium 117 not participating in heat dissipation, thereby reducing the amount of cooling medium 117 used.

[0104] In some possible implementations, the bottom end of the liquid-blocking structure 113 may only contact and seal against the inner bottom surface of the housing 111, without sealing against the inner surface of the sidewall of the housing 111. For example, as Figure 11 As shown, Figure 11 This is a partial longitudinal sectional view of the sixth electronic device provided in the embodiments of this application.

[0105] In some possible implementations, the top of the liquid-blocking structure 113 can also be sealed to the inner top surface of the housing 111, and a vent 1132 is provided on the liquid-blocking structure 113. The vent 1132 is used to connect the first space 1141 and the second space 1142, so that the vaporized cooling medium 117 can enter the first space 1141 from the second space 1142 and be smoothly discharged from the first opening 115, so as to avoid the pressure in the cavity 114 being too high, which would cause the electronic device 110 to lose its heat dissipation capacity and structural sealing function. Figure 12 This is a partial longitudinal sectional view of the seventh electronic device provided in the embodiments of this application, such as... Figure 12 As shown, taking the liquid-blocking structure 113 as a plate-like structure with an L-shaped longitudinal section as an example, the left and right ends of the liquid-blocking structure 113 are respectively connected to two adjacent side walls of the shell 111, and the top of the vertical part of the liquid-blocking structure 113 is sealed to the top surface of the cavity 114. The vent 1132 is located on the vertical part of the liquid-blocking structure 113, thereby connecting the first space 1141 and the second space 1142, and the lowest inner wall of the first opening 115 is located below the vent 1132. Figure 13This is a complete longitudinal sectional view of the seventh electronic device provided in this application embodiment, which clearly shows that the vaporized cooling medium 117 can enter the first space 1141 from the second space 1142 and be smoothly discharged from the first opening 115.

[0106] It should be noted that the vent 1132 includes at least one vent hole, which can be a circular hole or a polygonal hole. For example, the vent 1132 includes one vent hole, and the vent hole is a circular hole or a square hole; or, the vent 1132 includes multiple vent holes, all of which have at least partially the same shape.

[0107] The following section describes possible implementations of the liquid-blocking structure 113 from a partial top sectional view of the electronic device 110. It should be noted that these implementations do not constitute a limitation on the specific shape of the liquid-blocking structure 113.

[0108] In some possible implementations, the top view shape of the liquid-blocking structure 113 along the height direction of the electronic device 110 can be quadrilateral. Figure 14 This is a partial top sectional view of the first type of electronic device provided in the embodiments of this application, such as... Figure 14 As shown, the top of the liquid-blocking structure 113 includes three flat plate segments, which define a U-shaped flat plate structure. The left and right ends of the U-shaped flat plate structure are respectively connected to the same side wall of the housing 111. The top and bottom ends of the U-shaped flat plate structure are respectively sealed and connected to the top and bottom surfaces of the cavity 114 to define the first space 1141 and the second space 1142.

[0109] Alternatively, the U-shaped flat plate structure can also be sealed to at least two sidewalls of the housing 111 to define a first space 1141 and a second space 1142.

[0110] Optionally, Figure 15 This is a partial top sectional view of the seventh electronic device provided in the embodiments of this application, such as... Figure 15 As shown, when the top view of the liquid-blocking structure 113 is quadrilateral, the vent 1132 can be provided on at least one side of the liquid-blocking structure 113.

[0111] In some possible implementations, the top view shape of the liquid-blocking structure 113 can be arc-shaped. For example, as... Figure 16 As shown, Figure 16 This is a partial top sectional view of the fourth type of electronic device provided in the embodiments of this application.

[0112] In some possible implementations, the liquid-blocking structure 113 is a tubular structure (not shown in the figure), with the two open ends of the tubular structure being sealed and connected to the top surface of the cavity 114 and the inner side surface of the side wall of the shell 111, respectively. The vent 1132 is located on the side of the tubular structure facing the second space 1142, and the first opening 115 is located inside the tubular structure.

[0113] In some possible implementations, the liquid-blocking structure 113 is a cylindrical structure (not shown in the figure), with its open end sealed to the inner side of the sidewall of the housing 111, and the first opening 115 located inside the cylindrical structure. The outer side of the closed end of the cylindrical structure contacts and abuts against the top surface of the cavity 114, or the closed end of the cylindrical structure is located above the liquid surface of the cooling medium 117. The vent 1132 is located on the cylindrical wall of the cylindrical structure and is located above the liquid surface of the cooling medium 117 to prevent the liquid cooling medium 117 from submerging the first opening 115.

[0114] The liquid-blocking structure 113 described above can prevent the liquid cooling medium 117 from flooding the first opening 115 during the movement of the electronic device 110, thereby reducing the possibility of air blockage and ensuring the heat dissipation performance of the electronic device 110 and the sealing of the cavity 114.

[0115] It should be noted that, in one possible implementation, the liquid-blocking structure 113 and the housing 111 are an integral structure. This arrangement can reduce the manufacturing difficulty and sealing difficulty of the liquid-blocking structure 113.

[0116] In another possible implementation, the liquid-blocking structure 113 is detachably connected to the housing 111. This arrangement allows one liquid-blocking structure 113 to be matched with housings 111 of different sizes, thereby increasing the application range of the liquid-blocking structure 113.

[0117] The liquid-blocking structure 113 can be detachably connected to the housing 111 by means of snap-fit, threaded connection, etc.

[0118] Furthermore, the electronic device 110 may also include a disintegration mesh 118. Figure 17 This is a longitudinal sectional view of the eighth electronic device provided in the embodiments of this application. Figure 18 yes Figure 17 A partial enlarged view of the exploded mesh in the illustrated embodiment. (Refer to...) Figure 18The decomposition mesh 118 is disposed at the connection between the first space 1141 and the second space 1142. The decomposition mesh 118 is used to decompose large droplets in the gas-liquid mixture into multiple sub-droplets. The gas-liquid mixture includes gaseous cooling medium 117 and liquid cooling medium 117. The decomposition mesh 118 can, on the one hand, prevent large droplets from entering the first space 1141, and on the other hand, decompose large droplets that enter the first space 1141 into multiple sub-droplets, so that the vaporized cooling medium 117 can carry the sub-droplets out. Furthermore, it can prevent pressure fluctuations within the first opening 115, ensuring the smooth discharge of the gas-liquid mixture.

[0119] Understandably, the range of large droplet sizes that the decomposition mesh 118 can decompose can be increased by changing the mesh size of the decomposition mesh 118.

[0120] It should be noted that the specific shape of the decomposition mesh 118 can be determined based on the specific structure of the connection between the first space 1141 and the second space 1142, and is not specifically limited here. For example, refer to... Figure 17 and Figure 18 The decomposition mesh 118 can be a plate-like structure, which can reduce the size of the decomposition mesh 118 and cover the connection between the first space 1141 and the second space 1142. The connection between the first space 1141 and the second space 1142 can be the aforementioned gap and vent 1132.

[0121] In some possible implementations, the decomposition mesh 118 is a metal mesh structure, which can decompose large droplets into multiple sub-droplets on the one hand, and improve the service life of the decomposition mesh 118 on the other hand.

[0122] In some possible implementations, the decomposition mesh 118 may be fastened to the liquid-blocking structure 113, or the decomposition mesh 118 may be fastened to the housing 111, or the decomposition mesh 118 may be fastened to both the liquid-blocking structure 113 and the housing 111.

[0123] The decomposition mesh 118 can be fastened to the liquid-blocking structure 113 and / or the housing 111 by means of snap-fit, welding, abutment, threaded connection, etc. Alternatively, the decomposition mesh 118 can be fastened to the liquid-blocking structure 113 and the housing 111 by the same connection method. For example, the decomposition mesh 118 can be snapped to the liquid-blocking structure 113 and the housing 111 respectively, or the first end of the decomposition mesh 118 can be snapped to the liquid-blocking structure 113 and the second end of the decomposition mesh 118 can abut to the housing 111.

[0124] In some possible implementations, the decomposition mesh 118 can be used in conjunction with any of the liquid-blocking structures 113 described above. The following example illustrates the connection method and positional relationship between the liquid-blocking structure 113 and the decomposition mesh 118, with the liquid-blocking structure 113 having an L-shaped longitudinal section, the bottom end face of the liquid-blocking structure 113 being in contact with and sealed to the bottom surface of the cavity 114, and the horizontal portion of the liquid-blocking structure 113 being sealed to the inner side surface of the side wall of the housing 111.

[0125] Figure 19 This is a longitudinal sectional view of the ninth type of electronic device provided in the embodiments of this application. Figure 20 Yes, yes Figure 19 A partial enlarged view of the exploded mesh in the illustrated embodiment. (Refer to...) Figure 19 and Figure 20 The liquid-blocking structure 113 is provided with a first slot 131. Part of the decomposition net 118 is inserted into the first slot 131 and engaged with the liquid-blocking structure 113. It can be understood that the first slot 131 allows the decomposition net 118 to be fixed on the liquid-blocking structure 113, so that during the long-term operation of the electronic device 110, the decomposition net 118 can stably decompose large droplets into multiple sub-droplets.

[0126] Understandably, the first slot 131 allows the decomposition mesh 118 to be detachably connected to the liquid-blocking structure 113 by means of a snap-fit.

[0127] It should be noted that the reference Figure 20 Along the height direction of the electronic device 110, the bottom of the decomposition mesh 118 is inserted into the first slot 131, and the top of the decomposition mesh 118 contacts the top surface of the cavity 114. In this way, the decomposition mesh 118 can contact all the gas-liquid mixture passing through the connection between the first space 1141 and the second space 1142.

[0128] Figure 21 This is a magnified view of another decomposed mesh provided in an embodiment of this application.

[0129] refer to Figure 21 The first slot 131 is located on the side wall of the liquid-blocking structure 113, wherein, it can be understood that, with reference to Figure 20 The sidewall of the liquid-blocking structure 113 with the first slot 131 can be located within the first space 1141, that is, the decomposition mesh 118 is located within the first space 1141, or, refer to Figure 21 The sidewall of the liquid-blocking structure 113 with the first slot 131 can be located in the second space 1142, that is, the decomposition net 118 is located in the second space 1142.

[0130] Figure 22 This is a magnified view of another decomposed mesh provided in an embodiment of this application.

[0131] refer to Figure 22 The first slot 131 is located on the top surface of the liquid-blocking structure 113, which can reduce the size of the decomposition net 118, thereby reducing the cost of the decomposition net 118.

[0132] It is understood that, along the height direction of the electronic device 110, the bottom of the decomposition mesh 118 is inserted into the first slot 131, and the top of the decomposition mesh 118 is in contact with the top surface of the cavity 114.

[0133] Figure 23 This is a magnified view of another decomposed mesh provided in an embodiment of this application.

[0134] refer to Figure 23 A second slot 132 is provided on the inner wall of the cavity 114, and part of the decomposition net 118 is inserted into the second slot 132 and engaged with the housing 111.

[0135] It is understood that the second slot 132 can be located on the side wall, top wall or bottom wall of the cavity 114. In addition, when there are multiple second slots 132, some of the second slots 132 are located on one of the inner walls of the cavity 114, and other second slots 132 are located on another inner wall of the cavity 114. In other words, multiple second slots 132 can be located on different inner walls of the cavity 114, without specific restrictions.

[0136] In some examples, when the second slot 132 exists alone, the decomposition mesh 118 is engaged with the liquid-blocking structure 113 through the second slot 132 to fix the decomposition mesh 118. Alternatively, the decomposition mesh 118 may be located within the first space 1141, or the decomposition mesh 118 may be located within the second space 1142, or the decomposition mesh 118 may be located between the top surface of the liquid-blocking structure 113 and the top surface of the cavity 114, and the decomposition mesh 118 abuts against the liquid-blocking structure 113.

[0137] Figure 24 This is a longitudinal sectional view of the tenth electronic device provided in the embodiments of this application.

[0138] In other examples, refer to Figure 24 The second slot 132 and the first slot 131 mentioned above exist simultaneously, that is, the decomposition net 118 is engaged with the housing 111 and the liquid-blocking structure 113 respectively. For example, the second slot 132 is located on the top surface of the cavity 114, and the first slot 131 is located on the top surface of the liquid-blocking structure 113. In this way, the first slot 131 and the second slot 132 together fix the decomposition net 118, so that the position of the decomposition net 118 is always at the predetermined position.

[0139] In some possible implementations, the top of the decomposition mesh 118 abuts against the top surface of the cavity 114, so that the decomposition mesh 118 abuts against the shell 111, which can improve the fixing effect of the decomposition mesh 118.

[0140] It is understandable that the decomposition mesh 118 abuts against the shell 111, which can be matched with the connection method of the decomposition mesh 118 and the liquid-blocking structure 113 mentioned above. On the one hand, it can further improve the fixing effect of the decomposition mesh 118, and on the other hand, it can reduce the fixing difficulty of the decomposition mesh 118.

[0141] Through the aforementioned decomposition mesh 118, large droplets entering the first space 1141 can be decomposed into multiple sub-droplets, thereby allowing the vaporized cooling medium 117 to carry the sub-droplets out, ensuring the smooth discharge of the gas-liquid mixture and preventing pressure fluctuations within the first opening 115 that could affect heat dissipation efficiency.

[0142] Among some possible implementations, refer to Figure 5 The housing 111 is provided with a second opening 116, which is connected to the second space 1142. The second opening 116 is used to input liquid cooling medium 117 into the second space 1142.

[0143] It is understood that the number of second openings 116 is at least one. In addition, when there are multiple second openings 116, the shapes of all the second openings 116 may be the same or different.

[0144] Figure 25 This is a cross-sectional view of a housing provided in an embodiment of this application. Figure 26 This is a cross-sectional view of another housing provided in an embodiment of this application.

[0145] Among some possible implementations, refer to Figure 25 The housing 111 includes an upper housing 1111, a lower housing 1112, and an annular sealing strip 1113. The annular sealing strip 1113 is disposed at the connection between the upper housing 1111 and the lower housing 1112 and is used to seal the connection. The annular sealing strip 1113 ensures the airtightness between the upper housing 1111 and the lower housing 1112 to prevent leakage of liquid and gaseous cooling media 117. The upper housing 1111 covers the top surface of the lower housing 1112 and is securely connected to the lower housing 1112. The inner walls of the upper housing 1111 and the lower housing 1112 together define the cavity 114.

[0146] It should be noted that the upper shell 1111 and the lower shell 1112 can be detachably connected by means of threaded connection, snap-fit, or other methods. Furthermore, the upper shell 1111 can be a flat plate structure or a cylindrical structure. The lower shell 1112 is a cylindrical structure, thus the upper shell 1111 and the lower shell 1112 together define the cavity 114. For example, the lower shell 1112 is a rectangular cylindrical structure; in other words, the cross-section of the lower shell 1112 is rectangular, and the cross-section of the lower shell 1112 is parallel to the length and height directions of the electronic device 110.

[0147] The first opening 115 is located on the side wall of the lower shell 1112, and the two ends of the liquid-blocking structure 113 are respectively sealed and connected to the inner side wall of the lower shell 1112, so that the liquid-blocking structure 113 surrounds the first opening 115.

[0148] Optionally, the top surface of the lower shell 1112 is provided with a first groove 11121 for the insertion of a portion of the annular sealing strip 1113, and the annular sealing strip 1113 abuts against the upper shell 1111.

[0149] Optionally, refer to Figure 26 The top surface of the lower shell 1112 is provided with a first groove 11121 for inserting part of the annular sealing strip 1113, and the upper shell 1111 is provided with a second groove 11111 for inserting part of the annular sealing strip 1113.

[0150] Among some possible implementations, refer to Figure 26 At least one nozzle 140 is provided within the second space 1142. The nozzle 140 communicates with the second opening 116 and is positioned above the surface of the liquid cooling medium 117. The nozzle 140 is used to spray the liquid cooling medium 117 onto the device 112 to be cooled. Because the nozzle 140 is positioned above the surface of the liquid cooling medium 117, the amount of cooling medium 117 used can be reduced, thereby reducing the cooling cost of the electronic device 110. In addition, the nozzle 140 can improve the single-point heat dissipation capacity of the device 112 to meet the high-heat scenarios of the electronic device 110.

[0151] Figure 27 This is a partial three-dimensional part of an electronic device provided in an embodiment of this application. Figure 28 yes Figure 27 A magnified view of a portion of the first opening in the illustrated embodiment. Figure 29 yes Figure 27 A partial sectional view of the embodiment shown. Figure 30 yes Figure 29 A partially enlarged view of the first opening in the illustrated embodiment. The positions of the liquid-blocking structure 113 and the disintegration mesh 118 within the electronic device 110 can be further shown.

[0152] like Figures 27-30As shown, the housing 111 has a first opening 115 and a second opening 116, wherein the first opening 115 is used to discharge vaporized cooling medium, and the second opening 116 is used to input liquefied cooling medium. A liquid-blocking structure 113 divides the cavity 114 of the electronic device 110 into a communicating first space 1141 and a second space 1142. The device to be cooled 112 is placed in the second space 1142 and immersed in the cooling medium. The side wall of the first space 1141 has the first opening 115. A decomposition mesh 118 covers the connection between the first space 1141 and the second space 1142, ensuring that all gas-liquid mixtures passing through the connection between the first space 1141 and the second space 1142 come into contact with the decomposition mesh 118. An annular sealing strip 1113 is provided at the connection between the upper housing 1111 (not shown in the figure) and the lower housing 1112. Figure 27 As shown, when the first opening 115 is at the upper left corner of the housing 111, the liquid-blocking structure 113 can also be located at the upper left corner of the housing 111, as long as it can block the first opening 115.

[0153] In summary, the liquid-blocking structure 113 provided in this embodiment can prevent the liquid surface fluctuation of the liquid cooling medium 117 from submerging the gas outlet (the first opening 115 in this embodiment); and by combining with the decomposition mesh 118, it reduces the large droplets carried by the bubbles, so that the gas formed by heating can leave smoothly, and the pressure inside the node will not be too high, resulting in loss of heat dissipation and structural sealing function.

[0154] Among some possible implementations, refer to Figure 27 and Figure 28 The electronic device 110 may further include at least one quick connector 133. The first opening 115 can be connected to the input terminal of the cooling medium distribution device 150 via the quick connector 133. Additionally, the second opening 116 described above can also be connected to the output terminal of the cooling medium distribution device 150 via the quick connector 133.

[0155] Optionally, each quick connector 133 includes at least one first connector and at least one second connector (not shown in the figure). The first connector communicates with either the first opening 115 or the second opening 116, and the second connector communicates with either the input or output end of the cooling medium distribution device 150.

[0156] Among some possible implementations, refer to Figure 27 The first opening 115 and the second opening 116 on each housing 111 are located at the same end of the housing 111. This arrangement can reduce the length or width of the electronic device 110. In addition, the center of the first opening 115 and the center of the second opening 116 are set at the same height along the height direction of the electronic device 110.

[0157] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0158] The devices or elements referred to in this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. In the description of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0159] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0160] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: Housing, components to be cooled, and liquid-blocking structure; The housing has a cavity inside, and a first opening is provided on the side wall of the housing; The liquid-blocking structure surrounds the first opening and divides the cavity into a first space and a second space, the first space and the second space are connected, and the first opening is connected to the first space; The bottom end of the liquid-blocking structure is sealed to at least one of the inner bottom surface of the housing or the inner side surface of the side wall of the housing. There is a gap between the top of the liquid-blocking structure and the inner top surface of the shell; Alternatively, the top of the liquid-blocking structure is sealed to the inner top surface of the housing, and a vent is provided on the liquid-blocking structure. The vent is not lower than the lowest inner wall of the first opening, and the vent is used to connect the first space and the second space. The heat dissipation device and the cooling medium are located in the second space, and the liquid-blocking structure is used to prevent the liquid cooling medium in the second space from entering the first space; The cooling medium, after being vaporized in the second space, is discharged from the first opening through the first space. It also includes: a decomposition mesh, which is disposed at the connection between the first space and the second space, and is used to decompose large droplets in the gas-liquid mixture into multiple sub-droplets; wherein the gas-liquid mixture includes a gaseous cooling medium and a liquid cooling medium; The bottom of the second space is parallel to the bottom of the first space, and along the height direction of the electronic device, the bottom of the first space is at the same height as the lowest inner wall of the first opening.

2. The electronic device according to claim 1, characterized in that, The liquid-blocking structure is integral with the housing, or the liquid-blocking structure is detachably connected to the housing.

3. The electronic device according to claim 1, characterized in that, The decomposition mesh is a metal mesh structure.

4. The electronic device according to claim 1 or 3, characterized in that, The liquid-blocking structure is provided with a first slot, and part of the decomposition mesh is inserted into the first slot and engaged with the liquid-blocking structure.

5. The electronic device according to claim 1, characterized in that, The top of the decomposition mesh abuts against the top surface of the cavity.

6. The electronic device according to any one of claims 1-3 and 5, characterized in that, The housing is provided with a second opening, which communicates with the second space, wherein the second opening is used to input a liquid cooling medium into the second space.

7. The electronic device according to claim 6, characterized in that, The second space is provided with at least one nozzle, which is connected to the second opening. The nozzle is located above the liquid surface of the cooling medium and is used to spray the liquid cooling medium onto the device to be cooled.

8. The electronic device according to any one of claims 1-3, 5, and 7, characterized in that, The electronic device can be any one of a computing device, a storage device, or a communication device.

9. The electronic device according to any one of claims 1-3, 5, and 7, characterized in that, The liquid-blocking structure is parallel to the sidewall, or the tangent of the liquid-blocking structure is parallel to the sidewall.

10. A server system, characterized in that, It includes a cooling medium distribution device, a first pipe, a second pipe, and at least one electronic device as described in any one of claims 1-9; The input end of the cooling medium distribution device is connected to the first opening of the electronic device through the first pipe, and the output end of the cooling medium distribution device is connected to the second space of the electronic device through the second pipe; The cooling medium distribution device is used to condense the vaporized cooling medium into a liquid cooling medium and deliver the liquid cooling medium to the second space.

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