Air conditioner control panel and air conditioner

Abstract

The application provides an air conditioner control panel and an air conditioner, and relates to the technical field of air conditioners. The air conditioner control panel comprises a substrate provided with a power device; a heat dissipation assembly is arranged on one side of the substrate provided with the power device; and a flexible heat conduction member is arranged between the heat dissipation assembly and the power device, and the heat dissipation assembly is closely arranged with the power device through the flexible heat conduction member. According to the application, the power device is arranged on the substrate, the heat dissipation assembly is arranged on one side of the substrate provided with the power device, that is, the heat dissipation assembly is mounted on the power device, and the flexible heat conduction member is arranged between the heat dissipation assembly and the power device, so that the heat dissipation assembly is closely arranged with the power device through the flexible heat conduction member, the assembly tolerance between the heat dissipation assembly and the power device can be effectively eliminated, and the heat dissipation efficiency and overall performance of the air conditioner are improved.

Description

Technical Field

[0001] This application relates to the field of air conditioning technology, and in particular to an air conditioner control board and an air conditioner. Background Technology

[0002] In current air conditioner controller designs, surface-mount power devices are commonly used to replace traditional through-hole power devices in order to achieve circuit board miniaturization. However, existing surface-mount power devices are usually equipped with independent heat sinks, which are mostly fixed by clips or soldering. Due to design flaws, there may be large assembly tolerances between the heat sink and the power device, such as clip tolerances, inconsistent printed circuit board thicknesses, or soldering fixture tolerances. These problems seriously affect the bonding quality between the heat sink and the power module, resulting in poor heat dissipation performance. Summary of the Invention

[0003] The main objective of this invention is to provide an air conditioner control board that aims to improve the heat dissipation efficiency and overall performance of the air conditioner.

[0004] To achieve the above objectives, the present invention provides an air conditioner control board, the air conditioner control board comprising: The substrate is equipped with power devices; A heat dissipation assembly is disposed on the side of the substrate where the power device is located; and A flexible thermal conductive element is disposed between the heat dissipation assembly and the power device, and the heat dissipation assembly is closely attached to the power device through the flexible thermal conductive element.

[0005] Optionally, the heat dissipation component includes: A heat dissipation bracket is disposed on the substrate, and the height of the heat dissipation bracket on the substrate is higher than the height of the power device on the substrate. A radiator, wherein the radiator is mounted on the heat dissipation bracket; The flexible thermal conductive element is disposed between the heat sink of the heat dissipation assembly and the power device.

[0006] Optionally, multiple power devices are provided, and the heat dissipation bracket is arranged to surround the multiple power devices. The heat dissipation bracket is provided with connecting ribs for supporting the heat sink on its periphery, and the height of the connecting ribs is higher than the height of the power devices.

[0007] Optionally, the heat sink has a protrusion on the side near the substrate; The connecting rib is provided with a groove corresponding to the protrusion, the protrusion is inserted into the groove, and the flexible heat-conducting element is disposed between the protrusion of the heat sink and the power device.

[0008] Optionally, the difference between the height of the groove on the substrate and the height of the power device on the substrate is less than 2 mm.

[0009] Optionally, the protrusion extends along the width direction of the heat sink.

[0010] Optionally, the heat sink has a connection hole on the side near the substrate that corresponds to the position of the through hole on the substrate. A connector passes through the through hole on the substrate and connects to the connection hole to fix the heat sink, heat sink bracket and substrate together.

[0011] Optionally, the vias are located on both sides of the long side of the power device.

[0012] Optionally, there are multiple power devices, and the multiple power devices are arranged on the same side of the substrate.

[0013] Optionally, the power devices include a fan power module, a compressor power module, an IGBT module, a fast recovery diode, and a rectifier bridge. The length directions of the fan power module, the compressor power module, and the rectifier bridge are respectively arranged along the length direction of the substrate. The IGBT module and the fast recovery diode are arranged in a row along the length of the substrate.

[0014] Optionally, the power devices include a fan power module, a compressor power module, an IGBT module, a fast recovery diode, and a rectifier bridge. The substrate includes a power input circuit, a PFC inductor, a high-voltage capacitor, and a switching power supply. The power input circuit, the rectifier bridge, the PFC inductor, the fast recovery diode, and the high-voltage capacitor are connected in sequence. The output terminal of the high-voltage capacitor is connected to the input terminal of the fan power module, the compressor power module, and the switching power supply, respectively. The IGBT module is connected in series between the ground of the rectifier bridge and the ground of the PFC inductor.

[0015] Optionally, the power input circuit, the PFC inductor, and the rectifier bridge are arranged sequentially along the length of the substrate.

[0016] Optionally, the long side of the PFC inductor is arranged along the length direction of the substrate.

[0017] Optionally, the substrate is provided with a fan interface, which is located near the high-voltage capacitor.

[0018] Optionally, the substrate includes a high-voltage capacitor, a switching power supply, a display circuit, and a water pump motor; The output terminal of the high-voltage capacitor is connected to the input terminal of the switching power supply, and the output terminal of the switching power supply is electrically connected to the display circuit and the water pump motor respectively. The display circuit and the water pump motor are located on the side of the substrate.

[0019] Optionally, the substrate is provided with a plurality of relays and a plurality of second interfaces, and the plurality of relays are connected to the plurality of second interfaces in a one-to-one correspondence; the second interface includes a first interface socket and a plurality of terminal groups disposed in the interface socket, the plurality of terminal groups being spaced apart along the length direction of the interface socket, or the second interface includes a plurality of second interface sockets arranged side by side and close together, each of the second interface sockets including a terminal group.

[0020] Optionally, the length of the first interface socket is 23.76-24.16 mm, the width of the first interface socket is 12.8-13.2 mm, the hole spacing of each terminal group of the first interface socket is 5.5-5.9 mm, and the hole spacing between the pads of any terminal group and the pads of the adjacent terminal group is 5.5-5.9 mm. The length of the second interface socket is 12.84-13.24mm, the width of the second interface socket is 7.62-8.02mm, and the hole spacing of the terminal group of the second interface socket is 7.72-8.12mm.

[0021] Optionally, the substrate is provided with a feedback circuit and a control circuit; The feedback circuit is electrically connected to the control circuit. The feedback circuit includes a first interface, which is used to receive a fan feedback signal or a water level switch signal.

[0022] Optionally, the feedback circuit further includes: The first jumper terminal is connected at its first end to the second end of the first interface; A first voltage divider circuit, wherein a first terminal of the first voltage divider circuit is connected to a second terminal of the first jumper terminal, a second terminal of the first voltage divider circuit is connected to a first terminal of the first interface, and a third terminal of the first voltage divider circuit is electrically connected to the control circuit; the third terminal of the first interface is grounded. The second jumper terminal has its first end connected to the second end of the first interface, and its second end grounded. The second voltage divider circuit has its second terminal connected to the fourth terminal of the first interface, and its third terminal electrically connected to the control circuit.

[0023] Optionally, the substrate is provided with an electronic expansion valve and a driver for driving the electronic expansion valve, the electronic expansion valve being connected to the output terminal of the driver; The controlled terminal of the driver is electrically connected to the third terminal of the first voltage divider circuit and the third terminal of the second voltage divider circuit, respectively.

[0024] Optionally, the substrate is provided with a plurality of relays; The controlled terminals of the multiple relays are respectively connected to the output terminals of the driver.

[0025] In addition, to achieve the above objectives, the present invention also provides an air conditioner, including the air conditioner control board as described above.

[0026] This invention provides a power device on a substrate and a heat dissipation assembly on the side of the substrate where the power device is located. The heat dissipation assembly is mounted on the power device, and a flexible heat-conducting element is provided between the heat dissipation assembly and the power device. This allows the heat dissipation assembly to be tightly attached to the power device through the flexible heat-conducting element, effectively eliminating assembly tolerances between the heat dissipation assembly and the power device, thereby improving the heat dissipation efficiency and overall performance of the air conditioner. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of an air conditioner control board according to an embodiment of the present invention; Figure 2 for Figure 1 A front view of the air conditioner control panel; Figure 3 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 6 for Figure 5 A three-dimensional structural diagram of the radiator; Figure 7 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 8 for Figure 7 A three-dimensional structural diagram of the heat sink in the image; Figure 9 for Figure 7 Top view of the radiator hidden in the middle; Figure 10 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 11 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 12 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 13 for Figure 12 The circuit diagram of the feedback circuit in the image; Figure 14 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 15 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 16 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 17 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 18 for Figure 17 A schematic diagram of the first implementation of the second interface in the diagram; Figure 19 for Figure 17 A schematic diagram of the second implementation of the second interface in the diagram; Figure 20 for Figure 17 A schematic diagram of the third implementation of the second interface in the diagram; Figure 21 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 22 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention; Figure 23 This is a schematic diagram of the structure of an air conditioner control board according to another embodiment of the present invention.

[0030] Explanation of icon numbers:

[0031] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Well-known modules, units, and their connections, links, communications, or operations are not shown or described in detail. Furthermore, the described features, architectures, or functions can be combined in any way in one or more embodiments. Those skilled in the art should understand that the various embodiments described below are only for illustrative purposes and are not intended to limit the scope of protection of the present invention.

[0033] In existing air conditioner controller designs, surface-mount power devices are commonly used to replace traditional through-hole power devices in order to achieve circuit board miniaturization. However, existing surface-mount power devices are usually equipped with independent heat sinks, which are mostly fixed by clips or soldering. Due to design flaws, there may be large assembly tolerances between the heat sink and the power device, such as clip tolerances, inconsistent printed circuit board thicknesses, or soldering fixture tolerances. These problems seriously affect the bonding quality between the heat sink and the power module, resulting in poor heat dissipation performance.

[0034] To address this issue, this application proposes an inventive approach: a flexible thermally conductive element is placed between the heat dissipation component and the power device. This allows for better pressure and contact between the heat dissipation component and the power device during installation. After installation, the heat dissipation component is tightly fitted to the power device via the flexible thermally conductive element, achieving improved heat transfer. Thus, this application not only provides cushioning and protection through the flexible thermally conductive element but also minimizes damage during installation, increases efficiency, and effectively eliminates assembly tolerances between the heat dissipation component and the power device after installation, resulting in better contact and improved heat transfer, thereby enhancing the air conditioner's heat dissipation efficiency and overall performance.

[0035] Based on the above-mentioned inventive concept, this application proposes an air conditioner control board, referring to... Figure 1 and Figure 2 In one embodiment of this application, the air conditioner control board includes a substrate 10, a heat dissipation assembly 20, and a flexible heat-conducting element 30, wherein: The substrate 10 is provided with a power device 11; a heat dissipation assembly 20 is provided on the side of the substrate 10 where the power device 11 is provided; and a flexible heat-conducting member 30 is provided between the heat dissipation assembly 20 and the power device 11, wherein the heat dissipation assembly 20 is closely attached to the power device 11 through the flexible heat-conducting member 30.

[0036] The substrate 10 is mainly a carrier for carrying circuit components. It can be the overall control board of the air conditioner, the drive board that drives the load, the power supply board that provides power, or the control board that performs the function.

[0037] The heat dissipation component 20 mainly serves to dissipate heat and can be various types of heat sinks. This embodiment mainly takes air cooling as an example.

[0038] The flexible thermal conductive component 30 mainly serves to buffer, transfer heat, and ensure better fit between the power device 11 and the heat dissipation assembly 20. It can be made of thermally conductive silicone pads, which have good thermal conductivity and flexibility, and can adapt to the gap between the heat dissipation assembly 20 and the power device 11 of different shapes and sizes, ensuring that heat can be efficiently conducted from the power device 11 to the heat dissipation assembly 20.

[0039] In air conditioner control boards, to achieve overall miniaturization, surface-mount power devices 11 are often mounted on a substrate 10. This allows for quick installation of the power devices 11 on the substrate 10 and enables the substrate 10 to be made smaller. However, the power devices 11 often generate a significant amount of heat during operation, necessitating the installation of heat dissipation components 20, such as heat sinks or cooling fans, to ensure the normal operating temperature of the power devices 11. Because the surface-mount power devices 11 are miniaturized, the heat dissipation components 20 also become smaller. This small size often leads to certain tolerances during manufacturing. If directly mounted onto the power devices 11, this can result in an interference fit between the heat dissipation components 20 and the power devices 11, causing damage to the power devices 11, or excessively large gaps between the heat dissipation components 20 and the power devices 11, hindering heat dissipation. In other words, significant tolerance issues exist, thus affecting the heat dissipation effect. This embodiment sets a certain gap between the heat dissipation component 20 and the power device 11, and then sets a flexible thermal conductive element 30 between the heat dissipation component 20 and the power device 11. The thickness of the flexible thermal conductive element 30 is greater than the gap between the heat dissipation component 20 and the power device 11, so that the heat dissipation component 20 and the power device 11 are indirectly and tightly in contact. Since the flexible thermal conductive element 30 is made of soft material, such as silicone or thermal conductive gel, it can effectively fill the gap between the heat dissipation component 20 and the power device 11, thereby effectively solving the tolerance problem caused by the miniaturization of the heat dissipation component 20. By using the flexible thermal conductive element 30 as a connecting medium, the shortcomings of the traditional heat dissipation component 20 installation method are effectively solved. It can also adapt to substrates 10 and power devices 11 of different thicknesses, ensuring tight contact between the heat dissipation component 20 and the power device 11, thereby improving heat dissipation efficiency.

[0040] Optionally, refer to Figure 3 Another embodiment of this application provides an air conditioner control board, based on the above... Figure 1 and Figure 2 In the embodiment shown, the heat dissipation assembly 20 includes a heat dissipation bracket 21 and a heat sink 22, wherein: The heat sink 21 is disposed on the substrate 10, and the height of the heat sink 21 on the substrate 10 is higher than the height of the power device 11 on the substrate 10; the heat sink 22 is disposed on the heat sink 21; the flexible heat conductor 30 is disposed between the heat sink 22 and the power device 11 of the heat sink assembly 20.

[0041] The heat sink bracket 21 can be made of metal or plastic. Its main function is to provide sufficient mechanical strength to support the heat sink 22 and ensure that there is a certain distance between the heat sink 22 and the power device 11, so that the flexible heat conductor 30 can be placed between the heat sink 22 and the power device 11. At the same time, it avoids the heat sink 22 being directly pressed against the power device 11, thereby avoiding the damage that may be caused by direct contact between the heat sink 22 and the power device 11.

[0042] The shape and size of the heat sink bracket 21 can be designed according to actual needs to accommodate substrates 10 and power devices 11 of different sizes and shapes. The heat sink bracket 21 may have mounting holes or slots on the side near the heat sink 22 to fix the heat sink 22 and ensure that it does not shift during use.

[0043] The radiator 22 can be made of a high thermal conductivity material such as aluminum or copper, and its surface is designed with heat dissipation fins to increase the heat dissipation area and improve heat dissipation efficiency. Supported by the heat dissipation bracket 21, the radiator 22 can effectively conduct and dissipate the heat generated by the power device 11 into the air. The radiator 22 and the flexible thermal conductive element 30 can be secured together using adhesives or other fixing methods to ensure tight contact and prevent loosening due to vibration or other reasons during air conditioner operation.

[0044] Optionally, refer to Figure 4 Another embodiment of this application provides an air conditioner control board, based on the above... Figure 3 In the embodiment shown, multiple power devices 11 are provided, and a heat dissipation bracket 21 is arranged around the multiple power devices 11. The periphery of the heat dissipation bracket 21 is provided with connecting ribs 211 for supporting the heat sink 22, and the height of the connecting ribs 211 is higher than the height of the power devices 11.

[0045] On the base plate 10 of the air conditioner control board, multiple power devices 11 are set to control components such as fans and compressors. The power devices 11 are set in the same area. When setting the heat dissipation bracket 21, the area where the power devices 11 are set can be enclosed according to the different layouts of the power devices 11, so as to ensure that each power device 11 can be effectively dissipated.

[0046] The connecting rib 211 not only enhances the overall structural strength of the heat dissipation bracket 21, but also ensures that the heat sink 22 will not directly contact the power device 11 during installation due to its height advantage, thereby avoiding damage that may be caused by direct contact. At the same time, it provides appropriate accommodation space for the flexible heat-conducting component 30, so that the heat sink 22 and the power device 11 can fit together better for heat dissipation.

[0047] Furthermore, the peripheral design of the connecting rib 211 can provide additional support points for the radiator 22, thereby improving the stability and heat dissipation effect of the radiator 22. In practical applications, the material selection and size design of the heat dissipation bracket 21 and the connecting rib 211, as well as the installation method of the radiator 22, need to be comprehensively considered based on the heat output of the specific power device 11 and the overall design requirements of the air conditioner to achieve the best heat dissipation effect and structural stability.

[0048] Optionally, refer to Figure 5 and Figure 6 In another embodiment of this application, an air conditioner control board is provided, based on the above... Figure 4 In the embodiment shown, the heat sink 22 has a protrusion 221 on the side near the substrate 10, wherein: The connecting rib 211 is provided with a groove 2111 corresponding to the protrusion 221. The protrusion 221 is inserted into the groove 2111. The flexible heat-conducting element 30 is provided between the protrusion 221 of the heat sink 22 and the power device 11.

[0049] By providing a protrusion 221 on one side of the radiator 22 and a groove 2111 on the connecting rib 211, and by having the protrusion 221 and the groove 2111 interlock, the fixing strength between the radiator 22 and the heat dissipation bracket 21 is enhanced, preventing loosening due to vibration or other reasons during air conditioner operation. It also allows for a certain gap between the radiator 22 and the power device 11, which can be filled by the flexible heat-conducting component 30, thus ensuring close contact between the radiator 22 and the power device 11. Furthermore, the design of the protrusion 221 provides additional support points for the radiator 22, improving its stability and heat dissipation effect.

[0050] The difference between the height of the groove on the substrate and the height of the power device on the substrate is less than 2mm. This height difference allows for better installation of the flexible heat-conducting component 30, enabling the flexible heat-conducting component 30 to form an effective buffer and heat-conducting layer between the heat sink 22 and the power device 11.

[0051] Optionally, refer to Figure 6 This application also provides an embodiment of an air conditioner control board, based on the above... Figure 5 and Figure 6In the embodiment shown, the protrusion 221 of the heat sink 22 extends along the width direction of the heat sink 22.

[0052] In this design, the protrusions 221 of the radiator 22 extend to both sides along the width direction of the radiator 22 to the position where the radiator 22 connects with the grooves 2111 of the connecting rib 211, or the protrusions 221 of the radiator 22 are set to the same length as the width direction of the radiator 22, that is, they extend through the entire width direction of the radiator 22, so as to achieve a fit with the grooves 2111, thereby supporting the radiator 22 and providing a corresponding gap between the radiator 22 and the power device 11 for the flexible heat-conducting component 30 to fill. This design not only ensures a tight contact between the radiator 22 and the power device 11, but also enhances the structural stability of the radiator 22 through the extension of the protrusions 221, preventing displacement caused by vibration or impact during the operation of the air conditioner.

[0053] Optionally, refer to Figures 7 to 9 Another embodiment of this application provides an air conditioner control board, based on the above... Figure 3 In the embodiment shown, the heat sink 22 is provided on the side near the substrate 10 with a connection hole 222 corresponding to the position of the through hole 18 of the substrate 10. A connector passes through the through hole 18 of the substrate 10 and connects to the connection hole 222 to fix the heat sink 22, the heat sink bracket 21 and the substrate 10 together.

[0054] The heat sink 22 is mounted on the heat sink bracket 21, which is pressed firmly against the substrate 10. The heat sink 22 is then connected to the substrate 10 via a connecting hole 222 through a through hole 18, thus fixing the heat sink bracket 21 and the heat sink 22 to the substrate 10. The height of the heat sink bracket 21 on the substrate 10 is maintained higher than the height of the power device 11 on the substrate 10, allowing for a certain gap between the heat sink 22 and the power device 11. Furthermore, the method of connecting the heat sink 22 to the substrate 10 via a connector through the through hole 18 and the connecting hole 222 not only simplifies the installation process but also enhances the stability between the heat sink 22 and the substrate 10 through the fixing effect of the connector. This ensures that the heat sink 22 will not shift during air conditioner operation, thereby guaranteeing the continuity and reliability of the heat dissipation effect.

[0055] The connectors can be bolts, screws, or other types of fasteners. Their material and size should be selected based on the materials of the heat sink 22 and the substrate 10, as well as the heat dissipation requirements, to ensure sufficient mechanical strength and durability. Furthermore, the design of the connection hole 222 allows for fine-tuning of the heat sink 22 during installation to accommodate substrates 10 and power devices 11 of varying thicknesses, thereby better optimizing heat dissipation performance.

[0056] Since the surface-mount power device 11 does not have holes for connectors to pass through, when fixing the heat sink 22, heat sink bracket 21 and substrate 10, in order to better fix the flexible thermal conductive element 30 between the power device 11 and the heat sink 22, through holes are provided on both sides of the long side of the power device 11. In this way, when the connector passes through the through hole 18 and is fixedly connected to the connection hole 222, the flexible thermal conductive element 30 can be better fixed between the power device 11 and the heat sink 22, thereby achieving a tight fit between the flexible thermal conductive element 30 and the power device 11 and the heat sink 22.

[0057] Optionally, refer to Figure 10 Another embodiment of this application provides an air conditioner control board, based on the above... Figure 1 and Figure 2 In the embodiment shown, there are multiple power devices 11, and the multiple power devices 11 are disposed on the same side of the substrate 10.

[0058] Power devices 11 may include multiple different semiconductor elements, such as transistors and diodes, which perform switching and current regulation tasks in the air conditioner control board. By arranging multiple power devices 11 on the same side, not only can the device loop be optimized to achieve the connection between power devices 11 through a smaller loop, but the layout of power devices 11 can also be better optimized. Furthermore, with power devices 11 arranged on the same side of the substrate 10, the corresponding heat sinks 22 can be better positioned to dissipate heat from the power devices 11. This layout also helps to reduce the overall size of the air conditioner control board and improve space utilization. When power devices 11 are arranged on the same side, the heat sinks 22 can be designed with a shape that matches the layout of power devices 11 to achieve more efficient heat dissipation.

[0059] Furthermore, since all power devices 11 are located on the same side of the substrate 10, the heat sink 22 can be designed to cover a large area of ​​all power devices 11, thereby improving heat dissipation efficiency.

[0060] Optionally, refer to Figure 11 In another embodiment of this application, an air conditioner control board is provided, based on the above... Figure 10 In the embodiment shown, the power device 11 includes a fan power module 111, a compressor power module 112, an IGBT module 113, a fast recovery diode 114, and a rectifier bridge 115, wherein; The length directions of the fan power module 111, the compressor power module 112, and the rectifier bridge 115 are respectively arranged along the length direction of the substrate 10; the IGBT module 113 and the fast recovery diode 114 are arranged in a row along the length direction of the substrate 10.

[0061] By arranging the long sides on the same side, that is, arranging the length direction of the fan power module 111, the compressor power module 112, and the rectifier bridge 115 along the length direction of the substrate 10 respectively, the layout of the power devices 11 on the substrate 10 can be better controlled, making the layout more compact and reasonable, which helps to reduce the overall size of the substrate 10, and can also improve the connection efficiency between the power devices 11 and reduce the wiring complexity.

[0062] like Figure 11 As shown, when the IGBT module 113 and fast recovery diode 114 are arranged in a row along the length of the substrate 10, they not only occupy less space on the substrate 10, but also achieve a shorter current path, thereby reducing inductance and resistance losses and improving the overall power conversion efficiency.

[0063] Furthermore, this layout, where the arrangement of the power devices 11 matches the shape of the heat sink 22, allows the heat sink 22 to better cover all the power devices 11, ensuring that each power device 11 receives effective cooling. When designing the heat sink 22, the thermal output characteristics of the power devices 11 and their arrangement density on the substrate 10 can be considered to optimize the shape and size of the heat sink 22 for the best heat dissipation effect.

[0064] Optionally, refer to Figure 12 and Figure 13 This application also provides an embodiment of an air conditioner control board, based on the above... Figures 1 to 9 In any of the embodiments shown, the substrate 10 is provided with a feedback circuit 12 and a control circuit 13, wherein; The feedback circuit 12 is electrically connected to the control circuit 13. The feedback circuit 12 includes a first interface 121, which is used to receive the fan feedback signal or the water level switch signal.

[0065] The first interface 121 can be a standard electrical connection interface, such as an RJ45 interface, RJ11 interface, or BNC interface, to accommodate different types of sensors or switching devices. The control circuit 13 is responsible for processing the feedback signal and adjusting the air conditioner's operating state according to the signal content, such as adjusting the fan speed and controlling the compressor's start and stop. This interface is designed to withstand the electrical load of the air conditioner under various operating conditions and has good anti-interference performance to ensure the stability and accuracy of signal transmission. The first interface 121 is a selective interface; in a single product, only one signal can be connected. For example, in air conditioner control board A, only the fan feedback signal can be connected, while in air conditioner control board B, only the water level switch signal can be connected. This design is because different products may have different signal access requirements, but generally, two signals are not connected simultaneously. To facilitate convenient connection in different products and without occupying too much space on the substrate 10, the original two interfaces are merged into one interface to achieve connection with external signals. With this design, the air conditioner control board can effectively receive and process feedback signals from the fan or other sensors, thereby achieving precise control over the air conditioner's operating status.

[0066] Optionally, refer to Figure 14 Another embodiment of this application provides an air conditioner control board, based on the above... Figure 12 and Figure 13 In the embodiment shown, the feedback circuit 12 further includes a first jumper terminal J1, a first voltage divider circuit 122, a second jumper terminal J2, and a second voltage divider circuit 123, wherein: The first end of the first jumper terminal J1 is connected to the second end of the first interface 121; the first end of the first voltage divider circuit 122 is connected to the second end of the first jumper terminal J1, the second end of the first voltage divider circuit 122 is connected to the first end of the first interface 121, and the third end of the first voltage divider circuit 122 is electrically connected to the control circuit 13; the third end of the first interface 121 is grounded; the first end of the second jumper terminal J2 is connected to the second end of the first interface 121, and the second end of the second jumper terminal J2 is grounded; the second end of the second voltage divider circuit 123 is connected to the fourth end of the first interface 121, and the third end of the second voltage divider circuit 123 is electrically connected to the control circuit 13.

[0067] The first jumper terminal J1 and the second jumper terminal J2 can be 0Ω resistors or pin headers, and are used with jumper caps inserted. The first jumper terminal J1 and the second jumper terminal J2 can be selectively connected, allowing the feedback circuit 12 to adjust according to the signal characteristics of different sensors or switching devices to adapt to different working environments and requirements. The use of the first jumper terminal J1 and the second jumper terminal J2 provides additional flexibility, enabling the air conditioner control board to select the appropriate feedback signal for processing according to actual needs, while maintaining the simplicity and stability of the circuit.

[0068] Furthermore, the voltage divider circuit design allows for appropriate signal adjustment, ensuring that the signal received by the control circuit 13 is within the appropriate voltage range, thereby improving control accuracy and system reliability. This feedback circuit 12 design significantly enhances the adaptability of the air conditioner control board.

[0069] Optionally, refer to Figure 15 Another embodiment of this application provides an air conditioner control board, based on the above... Figure 14 In the embodiment shown, the substrate 10 is provided with an electronic expansion valve 141 and a driver 142, wherein: The electronic expansion valve 141 is connected to the output terminal of the driver 142, which is used to drive the electronic expansion valve 141. The controlled terminal of the driver 142 is electrically connected to the third terminal of the first voltage divider circuit 122 and the third terminal of the second voltage divider circuit 123.

[0070] The electronic expansion valve 141 is used to regulate the refrigerant flow rate to control the cooling or heating effect of the air conditioner. Precise control of the electronic expansion valve 141 is crucial for maintaining the efficient operation of the air conditioner. The actuator 142, as the control unit of the electronic expansion valve 141, can adjust the opening degree of the electronic expansion valve 141 according to the instructions of the control circuit 13, thereby achieving fine regulation of the refrigerant flow rate. Through this design, the air conditioner can automatically adjust the refrigerant flow rate according to changes in indoor and outdoor temperatures and the user-set temperature requirements to achieve optimal cooling or heating effects, while improving the energy efficiency ratio and reducing energy consumption.

[0071] Optionally, refer to Figure 16 In another embodiment of this application, an air conditioner control board is provided, based on the above... Figure 15 In the embodiment shown, the substrate 10 is provided with a plurality of relays 143, wherein: The controlled terminals of multiple relays 143 are respectively connected to the output terminals of driver 142.

[0072] By electrically connecting multiple relays 143 to the driver 142, that is, by multiplexing the output terminals of the driver 142, it is possible to control multiple relays 143 while controlling the electronic expansion valve 141. This design not only improves the control capability of the control board but also makes more efficient use of space. The use of relays 143 allows the air conditioner control board to flexibly control both the relays 143 and the electronic expansion valve 141 according to different control requirements. The design of relays 143 takes into account their durability and response speed, ensuring long-term stable operation even under frequent switching. Through this multi-level control strategy, the air conditioner control board can more intelligently manage the operation of the air conditioning system, meeting the comfort and energy efficiency needs of different users.

[0073] Optionally, refer to Figures 17 to 20 This application also provides an embodiment of an air conditioner control board, based on the above... Figures 1 to 9 In any of the embodiments shown, the substrate 10 is provided with a plurality of relays 143 and a plurality of second interfaces 144, wherein: Multiple relays 143 are connected to multiple second interfaces 144 in a one-to-one correspondence; the second interface 144 includes a first interface 121 base and multiple terminal groups disposed in the interface base, the multiple terminal groups are spaced apart along the length direction of the interface base, or the second interface 144 includes multiple second interface bases arranged side by side and close to each other, each second interface base including a terminal group.

[0074] The relay 143 is connected to the outside via a second interface 144, which can be as follows: Figure 19 The diagram shows multiple independent 2-pin connectors, meaning each 2-pin connector constitutes a terminal group. Alternatively, it can be like... Figure 20 The interface shown is a 4*2PIN connector. To ensure compatibility with different interfaces and save on the cost of materials for another 4*2PIN connector, a method is used as follows... Figure 18 As shown, some of the pads of the 4*2PIN terminal are overlapped with some independent 2PIN second interface sockets, realizing the function of replacing the 4*2PIN interface with independent second interface sockets. This design makes the air conditioner control board more flexible in installation and maintenance, allowing users to select different types of interfaces for connection according to actual needs, thereby improving the product's applicability and economy. Furthermore, the corresponding connection of multiple relays 143 with multiple second interfaces 144 ensures that the air conditioner control board can simultaneously control multiple external devices, such as cooling fans and compressors, enhancing the air conditioner's control capabilities and the overall system performance. Through this modular design, the air conditioner control board can not only meet the control requirements of different air conditioner models but also facilitate future upgrades and expansions.

[0075] Specifically, if the second interface is a 4*2PIN interface, the length of the first interface socket is 23.76-24.16mm, the width of the first interface socket is 12.8-13.2mm, the hole spacing of each terminal group of the first interface socket is 5.5-5.9mm, and the hole spacing between the pads of any terminal group and the pads of the adjacent terminal group is 5.5-5.9mm. If the second interface is an independent 2PIN interface, the length of the second interface socket is 12.84-13.24mm, the width of the second interface socket is 7.62-8.02mm, and the hole spacing of the terminal groups of the second interface socket is 7.72-8.12mm. Through the design of the second interface with these specific parameters, the connection requirements of different devices can be adapted simultaneously. The size of the second interface socket and the layout of the terminal groups have been optimized to ensure maximum connection efficiency and reliability within a limited space.

[0076] Optionally, refer to Figure 21 Another embodiment of this application provides an air conditioner control board, based on the above... Figures 1 to 9 In any of the embodiments shown, the power device 11 includes a fan power module 111, a compressor power module 112, an IGBT module 113, a fast recovery diode 114, and a rectifier bridge 115, wherein: The substrate 10 is provided with a power input circuit 151, a PFC inductor 152, a high-voltage capacitor 153, and a switching power supply 154. The power input circuit 151, the rectifier bridge 115, the PFC inductor 152, the fast recovery diode 114, and the high-voltage capacitor 153 are connected in sequence. The output terminal of the high-voltage capacitor 153 is connected to the input terminal of the fan power module 111, the compressor power module 112, and the switching power supply 154, respectively. The IGBT module 113 is connected in series between the ground of the rectifier bridge 115 and the ground of the PFC inductor 152.

[0077] The power input circuit 151 can connect to an AC power source, performs initial filtering, and converts the AC power to DC power. The PFC inductor 152 and fast recovery diode 114 work together to improve the power factor and reduce harmonic interference, thereby improving the overall system efficiency. The high-voltage capacitor 153 stabilizes the DC output, ensuring a stable power supply to the fan power module 111, compressor power module 112, and switching power supply 154. The IGBT module 113, as a switching element, can quickly switch current, control the start and stop of the compressor and fan, and adjust their operating states, thus achieving precise control of the air conditioner's cooling and heating functions. Through this circuit design, the air conditioner control board can efficiently manage the air conditioner's power output, ensuring optimal performance in various operating modes.

[0078] The power input circuit 151, the PFC inductor 152, and the rectifier bridge 115 are arranged sequentially along the length of the substrate 10.

[0079] Since the power input circuit 151, PFC inductor 152, and rectifier bridge 115 are electrically connected, their sequential arrangement along the length of the substrate 10 effectively reduces the width of the circuit board, thereby saving space and reducing material costs. Furthermore, placing the PFC inductor 152 close to the power input circuit 151 reduces the length of the current transmission path, further reducing circuit losses and improving the energy efficiency ratio of the air conditioner control board.

[0080] In this circuit, the long side of the PFC inductor 152 is aligned with the length of the substrate 10. Since the long side of the PFC inductor 152 is aligned with the length of the substrate 10, the width of the circuit board can be effectively reduced. Furthermore, this layout facilitates heat dissipation, as the PFC inductor 152 generates heat during operation. Aligning its long side with the length of the substrate 10 helps dissipate heat along the length of the substrate 10, thereby improving overall heat dissipation performance.

[0081] Optionally, refer to Figure 22 Another embodiment of this application provides an air conditioner control board, based on the above... Figure 21 In the embodiment shown, the substrate 10 is provided with a fan interface 16, wherein: The fan interface 16 is positioned close to the high-voltage capacitor 153, which can shorten the connection line between the fan and the high-voltage capacitor 153, thereby reducing the line resistance. It also makes use of the space around the high-voltage capacitor 153, improving the space utilization of the substrate 10 and enabling a better reduction in the area of ​​the substrate 10.

[0082] Optionally, refer to Figure 23 In another embodiment of this application, an air conditioner control board is provided, based on the above... Figure 1 and Figure 2 In the embodiment shown, the substrate 10 includes a high-voltage capacitor 153, a switching power supply 154, a display circuit 171, and a water pump motor 172, wherein: The output terminal of the high-voltage capacitor 153 is connected to the input terminal of the switching power supply 154. The output terminal of the switching power supply 154 is electrically connected to the display circuit 171 and the water pump motor 172 respectively. The display circuit 171 and the water pump motor 172 are located on the side of the substrate 10.

[0083] Since both the display circuit 171 and the water pump motor 172 are electrically sensitive devices, they are susceptible to electromagnetic interference, which can lead to malfunctions. Furthermore, both circuits are externally connected. By placing them on the side of the substrate 10, a separate isolation zone can be created to isolate these two circuits, and they are powered by the switching power supply 154. This effectively reduces electromagnetic interference and ensures the stability of the display circuit 171 and the normal operation of the water pump motor 172. In addition, placing the display circuit 171 and water pump motor 172 on the side of the substrate 10 not only facilitates user viewing of displayed information and operation of the water pump motor 172 but also optimizes the overall layout of the circuit board, making the air conditioner control board more compact and rational. Through this layout optimization, the air conditioner control board can provide a better user experience and more efficient system performance in practical applications.

[0084] This application also proposes an air conditioner, which includes an air conditioner control board as described in the above embodiments.

[0085] It is worth noting that since the air conditioner of this application is based on the air conditioner control board described above, the embodiments of the air conditioner of this application include all the technical solutions of all embodiments of the air conditioner control board described above, and the technical effects achieved are exactly the same, so they will not be repeated here.

[0086] Optionally, the air conditioner includes window unit, portable air conditioner, dehumidifier, central air conditioner, indoor unit and / or outdoor unit.

[0087] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. An air conditioner control board, characterized in that, The air conditioner control board includes: The substrate is equipped with power devices; A heat dissipation assembly is disposed on the side of the substrate where the power device is located; and A flexible thermal conductive element is disposed between the heat dissipation assembly and the power device, and the heat dissipation assembly is closely attached to the power device through the flexible thermal conductive element.

2. The air conditioner control board as described in claim 1, characterized in that, The heat dissipation component includes: A heat dissipation bracket is disposed on the substrate, and the height of the heat dissipation bracket on the substrate is higher than the height of the power device on the substrate. A radiator, wherein the radiator is mounted on the heat dissipation bracket; The flexible thermal conductive element is disposed between the heat sink of the heat dissipation assembly and the power device.

3. The air conditioner control board as described in claim 2, characterized in that, The power devices are provided in multiple ways, and the heat dissipation bracket is arranged to surround the multiple power devices. The heat dissipation bracket is provided with connecting ribs on its periphery for supporting the heat sink, and the height of the connecting ribs is higher than the height of the power devices.

4. The air conditioner control board as described in claim 3, characterized in that, The heat sink has a protrusion on the side near the substrate; The connecting rib is provided with a groove corresponding to the protrusion, the protrusion is inserted into the groove, and the flexible heat-conducting element is disposed between the protrusion of the heat sink and the power device.

5. The air conditioner control board as described in claim 4, characterized in that, The difference between the height of the groove on the substrate and the height of the power device on the substrate is less than 2 mm.

6. The air conditioner control board as described in claim 4, characterized in that, The protrusion extends along the width direction of the radiator.

7. The air conditioner control board as described in claim 2, characterized in that, The heat sink has a connection hole on the side near the substrate that corresponds to the position of the through hole on the substrate. A connector passes through the through hole on the substrate and connects to the connection hole to fix the heat sink, heat sink bracket and substrate together.

8. The air conditioner control board as described in claim 7, characterized in that, The vias are located on both sides of the long side of the power device.

9. The air conditioner control board as described in claim 1, characterized in that, There are multiple power devices, and the multiple power devices are arranged on the same side of the substrate.

10. The air conditioner control board as described in claim 9, characterized in that, The power devices include a fan power module, a compressor power module, an IGBT module, a fast recovery diode, and a rectifier bridge. The length directions of the fan power module, the compressor power module, and the rectifier bridge are respectively arranged along the length direction of the substrate. The IGBT module and the fast recovery diode are arranged in a row along the length of the substrate.

11. The air conditioner control panel according to any one of claims 1 to 10, characterized in that, The power devices include a fan power module, a compressor power module, an IGBT module, a fast recovery diode, and a rectifier bridge. The substrate includes a power input circuit, a PFC inductor, a high-voltage capacitor, and a switching power supply. The power input circuit, the rectifier bridge, the PFC inductor, the fast recovery diode, and the high-voltage capacitor are connected in sequence. The output terminal of the high-voltage capacitor is connected to the input terminal of the fan power module, the compressor power module, and the switching power supply, respectively. The IGBT module is connected in series between the ground of the rectifier bridge and the ground of the PFC inductor.

12. The air conditioner control board as described in claim 11, characterized in that, The power input circuit, the PFC inductor, and the rectifier bridge are arranged sequentially along the length of the substrate.

13. The air conditioner control board as described in claim 12, characterized in that, The long side of the PFC inductor is arranged along the length direction of the substrate.

14. The air conditioner control board as described in claim 11, characterized in that, The substrate is provided with a fan interface, which is located close to the high-voltage capacitor.

15. The air conditioner control board as described in claim 1, characterized in that, The substrate is equipped with a high-voltage capacitor, a switching power supply, a display circuit, and a water pump motor; The output terminal of the high-voltage capacitor is connected to the input terminal of the switching power supply, and the output terminal of the switching power supply is electrically connected to the display circuit and the water pump motor respectively. The display circuit and the water pump motor are located on the side of the substrate.

16. The air conditioner control panel according to any one of claims 1 to 10, characterized in that, The substrate is provided with multiple relays and multiple second interfaces, and the multiple relays are connected to the multiple second interfaces one by one; the second interface includes a first interface socket and multiple terminal groups disposed in the interface socket, and the multiple terminal groups are spaced apart along the length direction of the interface socket, or the second interface includes multiple second interface sockets arranged side by side and close together, and each second interface socket includes a terminal group.

17. The air conditioner control board as described in claim 16, characterized in that, The length of the first interface socket is 23.76-24.16mm, the width of the first interface socket is 12.8-13.2mm, the hole spacing of each terminal group of the first interface socket is 5.5-5.9mm, and the hole spacing between the pads of any terminal group and the pads of the adjacent terminal group is 5.5-5.9mm. The length of the second interface socket is 12.84-13.24mm, the width of the second interface socket is 7.62-8.02mm, and the hole spacing of the terminal group of the second interface socket is 7.72-8.12mm.

18. The air conditioner control panel as described in any one of claims 1 to 10, characterized in that, The substrate is equipped with a feedback circuit and a control circuit; The feedback circuit is electrically connected to the control circuit. The feedback circuit includes a first interface, which is used to receive a fan feedback signal or a water level switch signal.

19. The air conditioner control board as described in claim 18, characterized in that, The feedback circuit also includes: The first jumper terminal is connected at its first end to the second end of the first interface; A first voltage divider circuit, wherein a first terminal of the first voltage divider circuit is connected to a second terminal of the first jumper terminal, a second terminal of the first voltage divider circuit is connected to a first terminal of the first interface, and a third terminal of the first voltage divider circuit is electrically connected to the control circuit; the third terminal of the first interface is grounded. The second jumper terminal has its first end connected to the second end of the first interface, and its second end grounded. The second voltage divider circuit has its second terminal connected to the fourth terminal of the first interface, and its third terminal electrically connected to the control circuit.

20. The air conditioner control board as described in claim 19, characterized in that, The substrate is provided with an electronic expansion valve and a driver for driving the electronic expansion valve, and the electronic expansion valve is connected to the output terminal of the driver; The controlled terminal of the driver is electrically connected to the third terminal of the first voltage divider circuit and the third terminal of the second voltage divider circuit, respectively.

21. The air conditioner control board as described in claim 20, characterized in that, The substrate is equipped with multiple relays; The controlled terminals of the multiple relays are respectively connected to the output terminals of the driver.

22. An air conditioner, characterized in that, Includes the air conditioner control panel as described in any one of claims 1 to 21.

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