A pretreatment device for diode assembly welding

Abstract

This invention provides a pre-processing device for diode assembly welding. A first soldering component is used to solder the upper diode motherboard, a second soldering component is used to solder the lower diode motherboard, and a core-planting component is used to implant cores into the soldered diode motherboard on the lower layer. The core-planted diode motherboard is then transported to a docking component. A first multi-degree-of-freedom robot picks up the soldered diode motherboard from the first soldering component and transports it to the top of a flipping plate. The flipping plate picks up the soldered diode motherboard on its top, flips it 180°, and then drops it vertically to dock with the core-planted diode motherboard on the first conveying platform, thereby achieving preliminary assembly and facilitating subsequent assembly welding. The overall automation level is high, and the yield rate is also high. Compared with manual production, it greatly improves production efficiency. It solves the problems of low efficiency of traditional manual pre-assembly and the inability to ensure consistent chip and pin connections, resulting in low product yield.

Description

Technical Field

[0001] This invention relates to the field of diode assembly welding equipment technology, and more specifically, to a pretreatment device for diode assembly welding. Background Technology

[0002] The traditional manufacturing method of surface mount diodes mainly involves assembling raw materials such as chips, jumpers, solder paste, and frames together. In the process of assembling the diode motherboard and the chip, the chip needs to be pre-assembled with the soldered diode motherboard before being soldered together. Finally, the chip is soldered to the pins on the diode motherboard. However, the traditional manual pre-assembly is inefficient and cannot guarantee that the chip and pin connections are consistent, resulting in problems such as low product yield. Summary of the Invention

[0003] The purpose of this invention is to provide a pre-processing device for diode assembly, which solves the problems of low efficiency, inability to guarantee consistent chip and pin connections, and low product yield associated with traditional manual pre-assembly.

[0004] The embodiments of the present invention are achieved through the following technical solutions: a pre-processing device for diode assembly welding, which places several chips between several pins corresponding to diode motherboards located on upper and lower layers, so that the chips and their corresponding pins are initially assembled and connected to facilitate subsequent assembly welding, including a first soldering component, which is used to solder the diode motherboard located on the upper layer;

[0005] The second soldering assembly is used to solder the diode motherboard located on the lower layer.

[0006] The docking assembly includes a first multi-degree-of-freedom manipulator, a flipping plate, a first conveying platform, and a second multi-degree-of-freedom manipulator. The flipping plate is rotatably mounted on the top of one end of the first conveying platform. The flipping plate is hollow inside, and a plurality of suction holes are arrayed on its top plate surface.

[0007] The first multi-degree-of-freedom robotic arm is used to transport the diode motherboard after the first soldering assembly has been soldered to the top of the flip plate;

[0008] The second multi-degree-of-freedom robot is used to transport the diode motherboard after the second soldering component has been soldered to the first conveying platform;

[0009] After the flipping plate picks up the diode motherboard located on its top and flips it 180°, it releases the diode motherboard, allowing it to fall vertically and dock with the diode motherboard located on the first conveying platform.

[0010] Furthermore, it also includes a core implantation component, which is disposed between the second solder implantation component and the docking component;

[0011] The core implantation assembly includes a third multi-degree-of-freedom robot, a second conveying platform, a fourth multi-degree-of-freedom robot, a third conveying platform, and a motherboard base. The two ends of the second conveying platform are respectively connected to the second solder implantation assembly and the first conveying platform. The third multi-degree-of-freedom robot is used to transfer the diode motherboard with solder implanted by the second solder implantation assembly to the second conveying platform.

[0012] The third conveying platform is arrayed with a plurality of the chips, and the third conveying platform and the motherboard socket are symmetrically arranged about the second conveying platform.

[0013] The fourth multi-degree-of-freedom manipulator is used to transfer the chip located on the third conveying platform to the diode motherboard on the second conveying platform; the fourth multi-degree-of-freedom manipulator can also move the diode motherboard on the second conveying platform to the motherboard seat, and can also move the diode motherboard on the motherboard seat to the second conveying platform.

[0014] A motherboard clip holder is provided on one side of the motherboard base. A horizontally retractable first push head is provided on the side of the motherboard base away from the motherboard clip holder. The first push head can push the diode motherboard located on the motherboard base into the motherboard clip located on the motherboard clip holder. A horizontally retractable second push head is provided on the side of the motherboard clip holder away from the motherboard base. The second push head can push the diode motherboard in the motherboard clip back onto the motherboard base.

[0015] Furthermore, the fourth multi-degree-of-freedom manipulator includes a horizontally arranged first moving component, a cantilever base, a second moving component, a third moving component, a first motherboard suction cup, and a chip suction cup. The first moving component is arranged above the second conveying platform, the third conveying platform, and the motherboard base, and the first moving component drives the cantilever base to move horizontally.

[0016] The second and third moving parts are vertically arranged on the cantilever base, and the second and third moving parts respectively drive the first motherboard suction cup and the chip suction cup to move vertically.

[0017] Furthermore, the second multi-degree-of-freedom manipulator is used to transport the diode motherboard on the second conveying platform to the first conveying platform.

[0018] Furthermore, the first soldering assembly includes a first solder paste printer, a fourth conveying platform, a first printing table, and a first spring clip holder;

[0019] The fourth conveying platform is horizontally arranged, the first printing table and the first spring clip are spaced apart on the fourth conveying platform, and the first solder paste printer and the first multi-degree-of-freedom robot are spaced apart above the fourth conveying platform;

[0020] The distance between the first solder paste printer and the first multi-degree-of-freedom robot is the same as the distance between the first printing table and the first clip holder.

[0021] Furthermore, the second soldering assembly includes a second solder paste printer, a fifth conveying platform, a second printing table, a second spring clip holder, and a fifth multi-degree-of-freedom robot arm, wherein the fifth multi-degree-of-freedom robot arm and the third multi-degree-of-freedom robot arm are respectively disposed at both ends of the fifth conveying platform;

[0022] The second printing table is disposed on the fifth conveying platform, and the second solder paste printer is disposed above the fifth conveying platform;

[0023] The second magazine holder is disposed on one side of the fifth conveying platform, and the fifth multi-degree-of-freedom manipulator is used to move the diode motherboard on the second magazine holder to the fifth conveying platform.

[0024] Furthermore, it also includes an unloading assembly and a graphite disk holder, the unloading assembly being disposed at the end of the first conveying platform away from the tilting plate;

[0025] The unloading assembly includes a sixth multi-degree-of-freedom manipulator and a conveyor belt. The sixth multi-degree-of-freedom manipulator is used to move the graphite disk on the graphite disk holder to the first conveyor platform, and to transport the graphite disk loaded with the mated diode motherboard on the first conveyor platform to the conveyor belt.

[0026] Furthermore, the sixth multi-degree-of-freedom manipulator includes a fourth moving component, a fifth moving component, a mounting base, a slide bar, a clamping plate, and a cylinder. The fourth moving component is horizontally arranged above the first conveying platform and the graphite disk base, and is used to drive the fifth moving component to move horizontally.

[0027] The fifth movable component is used to drive the mounting base to move vertically. Two sliding rods are horizontally spaced at the lower end of the mounting base, and two clamping plates are slidably disposed at both ends of the two sliding rods.

[0028] Two fixed seats are spaced apart on the two sliding rods, and a cylinder is installed on each of the two fixed seats. The extension and retraction ends of the two cylinders are respectively connected to the two clamping plates.

[0029] Furthermore, the first multi-degree-of-freedom manipulator, the second multi-degree-of-freedom manipulator, the third multi-degree-of-freedom manipulator, and the fifth multi-degree-of-freedom manipulator have the same structure;

[0030] The fifth multi-degree-of-freedom manipulator includes a sixth moving part, a seventh moving part, a mounting head, and a second mother plate suction cup. The sixth moving part is used to drive the seventh moving part to move horizontally, and the seventh moving part is used to drive the mounting head to move vertically. The lower end of the mounting head is provided with the second mother plate suction cup.

[0031] Furthermore, the first, second, third, fourth, fifth, sixth, and seventh moving parts have the same structure and are all ball screw slides.

[0032] The technical solutions of the embodiments of the present invention have at least the following advantages and beneficial effects:

[0033] 1. A first soldering assembly is used to solder the upper diode motherboard, and a second soldering assembly is used to solder the lower diode motherboard. A core-planting assembly is set between the second soldering assembly and the docking assembly. The core is implanted into the soldered diode motherboard in the lower layer, and then the core-planted diode motherboard is transported to the docking assembly. A first multi-degree-of-freedom robot picks up the soldered diode motherboard from the first soldering assembly and transports it to the top of the flipping plate. The flipping plate picks up the soldered diode motherboard on its top and flips it 180°. Then, it releases the diode motherboard, allowing it to fall vertically and dock with the core-planted diode motherboard on the first conveying platform, thereby achieving preliminary assembly and facilitating subsequent soldering. The overall automation level is high, the yield rate is also high, and the production efficiency is greatly improved compared to manual production.

[0034] 2. A horizontally retractable first pusher is provided on the side of the motherboard base away from the motherboard clip base. The first pusher can push the diode motherboard on the motherboard base into the motherboard clip on the motherboard clip base. Then, the diode motherboard with the soldering completed can be transported to the motherboard base by the fourth multi-degree-of-freedom robot, and pushed into the motherboard clip on the motherboard clip base by the first pusher. The motherboard clip is divided into several layers inside, and its two side walls have several pairs of grooves. Each groove can hold a diode motherboard. By moving the motherboard clip base up and down, in conjunction with the first pusher, the diode motherboard with the soldering completed by the second soldering component is pushed into the motherboard clip, so as to be moved to other machines to implant chips of different specifications.

[0035] 3. After the diode motherboard is implanted elsewhere, the motherboard clip is placed back into the motherboard clip seat. The motherboard clip seat is equipped with a horizontally retractable second pusher on the side away from the motherboard seat. The second pusher can push the diode motherboard in the motherboard clip back onto the motherboard seat. Then, the fourth multi-degree-of-freedom robot arm moves the implanted diode motherboard on the motherboard seat to the second conveying platform and then to the docking assembly for docking. Attached Figure Description

[0036] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 A three-dimensional structural schematic diagram of a pretreatment device for diode assembly welding provided by the present invention;

[0038] Figure 2 A three-dimensional structural schematic diagram of the first soldering component in a diode assembly pretreatment device provided by the present invention;

[0039] Figure 3 A three-dimensional structural diagram of the unloading component in a pretreatment equipment for diode assembly welding provided by the present invention;

[0040] Figure 4 for Figure 3 Enlarged schematic diagram of the structure at point A;

[0041] Figure 5 A three-dimensional structural diagram of a core-embedded assembly in a diode assembly pretreatment device provided by the present invention;

[0042] Figure 6 for Figure 5 Enlarged schematic diagram of the structure at point B;

[0043] Figure 7 A three-dimensional structural schematic diagram of the second soldering component in a diode assembly pretreatment device provided by the present invention;

[0044] Figure 8 for Figure 7 Enlarged schematic diagram of the structure at point C;

[0045] Icons: 100, First soldering assembly; 110, First solder paste printer; 120, Fourth conveyor platform; 130, First printing table; 140, First spring clip holder.

[0046] 200. Second soldering assembly; 210. Second solder paste printer; 220. Fifth conveyor platform; 230. Second printing table; 240. Second spring clip holder; 250. Fifth multi-degree-of-freedom robot; 251. Sixth moving part; 252. Seventh moving part; 253. Mounting head; 254. Second motherboard suction cup.

[0047] 300. Docking assembly; 310. First multi-DOF manipulator; 320. Flip plate; 321. Suction hole; 330. First conveying platform; 340. Second multi-DOF manipulator.

[0048] 400. Core implantation component; 410. Third multi-DOF manipulator; 420. Second conveying platform; 430. Fourth multi-DOF manipulator; 431. First moving component; 432. Cantilever base; 433. Second moving component; 434. Third moving component; 435. First motherboard suction cup; 436. Chip suction cup; 440. Third conveying platform; 450. Motherboard base; 451. Motherboard magazine base; 452. First pusher head; 453. Second pusher head.

[0049] 500. Unloading assembly; 510. Sixth multi-degree-of-freedom manipulator; 511. Fourth moving part; 512. Fifth moving part; 513. Mounting base; 514. Slide bar; 515. Clamping plate; 516. Cylinder; 517. Fixed base; 520. Conveyor belt.

[0050] 600. Graphite plate base. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0053] Example 1:

[0054] Reference Figures 1 to 8 As shown, this embodiment provides a pre-processing device for diode assembly soldering, which places several chips between several pins of diode motherboards located on the upper and lower layers respectively, so that the chips and their corresponding pins are initially assembled and connected to facilitate subsequent assembly soldering. It includes a first soldering component 100, which is used to solder the diode motherboard located on the upper layer.

[0055] like Figures 1-3 As shown, the first solder paste assembly 100 includes a first solder paste printer 110, a fourth conveying platform 120, a first printing table 130, and a first spring clip holder 140;

[0056] The fourth conveying platform 120 is set horizontally, the first printing table 130 and the first spring clip seat 140 are spaced apart on the fourth conveying platform 120, and the first solder paste printer 110 and the first multi-degree-of-freedom robot 310 are spaced apart above the fourth conveying platform 120.

[0057] The distance between the first solder paste printer 110 and the first multi-degree-of-freedom manipulator 310 is the same as the distance between the first printing table 130 and the first cartridge holder 140;

[0058] The first multi-degree-of-freedom robot 310 is used to transport the diode motherboard after it has been soldered by the first soldering assembly 100 to the top of the flip plate 320.

[0059] In practice, a magazine containing stacked diode motherboards to be printed is placed on the first magazine holder 140. When the first magazine holder 140 moves to the first multi-degree-of-freedom robot 310, the first multi-degree-of-freedom robot 310 picks up the diode motherboard. Then, the first magazine holder 140 and the first printing table 130 continue to move synchronously until the first printing table 130 moves below the first multi-degree-of-freedom robot 310. The first multi-degree-of-freedom robot 310 then places the picked-up diode motherboard onto the first printing table 130. Then, the first printing table 130 and the first magazine holder 140 return synchronously. The first printing table 130 moves to the first solder paste printer 110 to perform soldering on the diode motherboard it is loaded with. After the soldering is completed, it returns to the first multi-degree-of-freedom robot 310 and is moved by the first multi-degree-of-freedom robot 310 to the first conveying platform 330, and then transported to the docking assembly 300.

[0060] like Figure 1 , Figure 7 and Figure 8 As shown, it also includes a second soldering assembly 200, which is used to solder the diode motherboard located on the lower layer; the second soldering assembly 200 includes a second solder paste printer 210, a fifth conveying platform 220, a second printing table 230, a second spring clip 240 and a fifth multi-degree-of-freedom robot 250, the fifth multi-degree-of-freedom robot 250 and the third multi-degree-of-freedom robot 410 are respectively arranged at both ends of the fifth conveying platform 220;

[0061] The second printing table 230 is set on the fifth conveyor platform 220, and the second solder paste printer 210 is set above the fifth conveyor platform 220;

[0062] The second cartridge holder 240 is located on one side of the fifth conveying platform 220, and the fifth multi-degree-of-freedom manipulator 250 is used to move the diode motherboard on the second cartridge holder 240 onto the fifth conveying platform 220.

[0063] In practice, a magazine containing stacked diode motherboards is placed on the second magazine holder 240. First, the fifth multi-degree-of-freedom robot 250 picks up the diode motherboards from the magazine holder on the second magazine holder 240 and transports them to the second printing table 230 on the fifth conveying platform 220. The fifth conveying platform 220 then transports the diode motherboards to be printed to the second solder paste printer 210. After the solder is applied by the second solder paste printer 2210, the motherboards are transported to the third multi-degree-of-freedom robot 410. Finally, the third multi-degree-of-freedom robot 410 transports the solder-applied diode motherboards to the core-planting assembly 400.

[0064] like Figure 1 , Figure 5 and Figure 6 As shown, it also includes a core implantation assembly 400, which is disposed between the second solder implantation assembly 200 and the docking assembly 300;

[0065] The core-planting assembly 400 includes a third multi-degree-of-freedom robot 410, a second conveying platform 420, a fourth multi-degree-of-freedom robot 430, a third conveying platform 440, and a motherboard base 450. The two ends of the second conveying platform 420 are respectively connected to the second solder-planting assembly 200 and the first conveying platform 330. The third multi-degree-of-freedom robot 410 is used to transfer the diode motherboard with solder-planted by the second solder-planting assembly 200 to the second conveying platform 420.

[0066] In practice, several stacks of chips are arrayed on the third conveying platform 440. By moving the third conveying platform 440 back and forth, the stacks of chips are moved to the fourth multi-degree-of-freedom manipulator. The third conveying platform 440 and the motherboard base 450 are symmetrically arranged about the second conveying platform 420.

[0067] The fourth multi-degree-of-freedom robot 430 is used to transfer the chip located on the third conveying platform 440 to the diode motherboard that has been tinned on the second conveying platform 420, and then assemble the chip with the diode motherboard located below, which is precise and efficient.

[0068] More specifically, such as Figure 1-3 As shown, it mainly includes a docking assembly 300, which includes a first multi-degree-of-freedom manipulator 310, a flipping plate 320, a first conveying platform 330, and a second multi-degree-of-freedom manipulator 340. The flipping plate 320 is rotatably mounted on the top of one end of the first conveying platform 330. The flipping plate 320 is hollow inside, and a plurality of suction holes 321 are arrayed on its top plate surface.

[0069] In specific implementation, the second multi-degree-of-freedom robot 340 is used to transport the diode motherboard after it has been soldered by the second soldering component 200 and cored by the core-planting component 400 to the first conveying platform 330; that is, to pick up the diode motherboard with cored ...

[0070] The first multi-degree-of-freedom robot 310 picks up the diode motherboard after tinning by the first tin-planting assembly 100 and transports it to the top of the flipping plate 320. The flipping plate 320 picks up the tin-planted diode motherboard located on its top and flips it 180°. Then, it releases the diode motherboard, allowing it to fall vertically and dock with the diode motherboard with core planting completed on the first conveying platform 330, thereby achieving preliminary assembly, which facilitates subsequent welding. The overall automation level is high, the yield rate is also high, and the production efficiency is greatly improved compared to manual production.

[0071] like Figures 1-4 As shown, it also includes an unloading assembly 500 and a graphite disk holder 600, with the unloading assembly 500 disposed at the end of the first conveying platform 330 away from the tilting plate 320;

[0072] The unloading assembly 500 includes a sixth multi-degree-of-freedom robot 510 and a conveyor belt 520. The sixth multi-degree-of-freedom robot 510 is used to move graphite disks stacked on the graphite disk holder 600 to the first conveyor platform 330, and to transport graphite disks loaded with mated diode motherboards on the first conveyor platform 330 to the conveyor belt 520.

[0073] In practice, before the second multi-degree-of-freedom robot 340 picks up and transports the diode motherboard with the implanted core to the first conveying platform 330, the sixth multi-degree-of-freedom robot 510 first transports the graphite disk stacked on the graphite disk holder 600 to the first conveying platform 330. The graphite disk has grooves that can be embedded to hold the diode motherboard. The second multi-degree-of-freedom robot 340 picks up and transports the diode motherboard with the implanted core to the graphite disk on the first conveying platform 330, and then transports it below the flip plate 320 to dock with the diode motherboard on the flip plate 320. The grooves on the graphite disk can limit the diode motherboard on the upper and lower sides to prevent its pins from being misaligned with the chip.

[0074] After docking is completed, the first conveyor platform 330 returns, and then the docked diode motherboard and chip are transported to the conveyor belt 520 by the sixth multi-degree-of-freedom robot arm 510 catties for assembly welding.

[0075] More specifically, such as Figure 3 and 4As shown, the sixth multi-degree-of-freedom manipulator 510 includes a fourth moving part 511, a fifth moving part 512, a mounting base 513, a slide bar 514, a clamping plate 515, and a cylinder 516. The fourth moving part 511 is horizontally arranged above the first conveying platform 330 and the graphite disk base 600. The fourth moving part 511 is used to drive the fifth moving part 512 to move horizontally.

[0076] The fifth moving part 512 is used to drive the mounting base 513 to move vertically. Two sliding rods 514 are horizontally spaced at the lower end of the mounting base 513, and two clamping plates 515 are slidably arranged at both ends of the two sliding rods 514.

[0077] Two fixed seats 517 are spaced apart on the two sliding rods 514. Each fixed seat 517 is equipped with a cylinder 516. The telescopic ends of the two cylinders 516 are connected to the two clamping plates 515 respectively.

[0078] In practice, the fourth moving part 511 and the fifth moving part 512 control the horizontal movement and the vertical movement respectively. The two cylinders 516 on the slide rod 514 control the two clamping plates 515 to move towards each other or away from each other, so as to clamp and place the graphite disk. In addition, the fourth moving part 511 and the fifth moving part 512 work together to pick up and put down the graphite disk.

[0079] More specifically, such as Figures 1-8 As shown, the first multi-degree-of-freedom robot 310, the second multi-degree-of-freedom robot 340, the third multi-degree-of-freedom robot 410, and the fifth multi-degree-of-freedom robot 250 have the same structure; they mainly realize the horizontal and vertical movement of the diode motherboard.

[0080] In specific implementation, the fifth multi-degree-of-freedom manipulator 250 includes a sixth moving part 251, a seventh moving part 252, a mounting head 253, and a second motherboard suction cup 254. The sixth moving part 251 is used to drive the seventh moving part 252 to move horizontally, and the seventh moving part 252 is used to drive the mounting head 253 to move vertically. The lower end of the mounting head 253 is provided with a second motherboard suction cup 254, which is used to pick up and drop diode motherboards.

[0081] More specifically, the first moving part 431, the second moving part 433, the third moving part 434, the fourth moving part 511, the fifth moving part 512, the sixth moving part 251 and the seventh moving part 252 have the same structure, all of which are ball screw slides, providing stable and reliable horizontal movement.

[0082] Example 2:

[0083] Based on Example 1, such as Figure 1-8As shown, the fourth multi-degree-of-freedom robot 430 can also move the tin-coated diode motherboard on the second conveying platform 420 to the motherboard holder 450. A motherboard clip holder 451 is provided on one side of the motherboard holder 450, and a horizontally retractable first pusher 452 is provided on the side of the motherboard holder 450 away from the motherboard clip holder 451. The first pusher 452 can push the diode motherboard located on the motherboard holder 450 into the motherboard clip located on the motherboard clip holder 451; thus, the tin-coated diode motherboard can be moved by the fourth multi-degree-of-freedom robot 430. The diode motherboard is transported to the motherboard holder 450 by the robotic arm 430 and pushed into the motherboard magazine on the motherboard magazine holder 451 by the first pusher 452. The motherboard magazine is divided into several layers, and its two side walls have several pairs of grooves. Each groove can hold a diode motherboard. By moving the motherboard magazine holder 451 up and down, in conjunction with the first pusher 452, the diode motherboard that has been tinned by the second tin-planting component is pushed into the motherboard magazine for movement to other machines to implant chips of different specifications.

[0084] Meanwhile, the diode motherboard loaded in the motherboard magazine here can also be completed by core implantation and transported to other places for docking of the top diode motherboard, especially when the first solder implantation assembly 100 or docking assembly 300 is faulty.

[0085] Example 3:

[0086] Based on Embodiment 2, after the diode motherboard is implanted elsewhere, the motherboard clip is placed back into the motherboard clip seat 451. The motherboard clip seat 451 is provided with a horizontally retractable second push head 453 on the side away from the motherboard seat 450. The second push head 453 can push the diode motherboard in the motherboard clip back onto the motherboard seat 450.

[0087] Then, the fourth multi-degree-of-freedom robot 430 moves the diode motherboard with the core implanted on the motherboard seat 450 to the second conveying platform 420 and then to the docking assembly 300 for docking processing.

[0088] More specifically, such as Figure 1 , Figure 5 and Figure 6 As shown, the fourth multi-degree-of-freedom manipulator 430 includes a horizontally arranged first moving member 431, a cantilever base 432, a second moving member 433, a third moving member 434, a first motherboard suction cup 435, and a chip suction cup 436. The first moving member 431 is arranged above the second conveying platform 420, the third conveying platform 440, and the motherboard base 450. The first moving member 431 drives the cantilever base 432 to move horizontally.

[0089] The second moving part 433 and the third moving part 434 are vertically arranged on the cantilever base 432. The second moving part 433 and the third moving part 434 respectively drive the first motherboard suction cup 435 and the chip suction cup 436 to move vertically, so as to pick up the chip or diode motherboard respectively in different usage situations and embodiments.

[0090] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A pre-processing device for diode assembly welding, comprising placing a plurality of chips between corresponding pins on upper and lower diode motherboards, thereby initially assembling and connecting the chips and their corresponding pins to facilitate subsequent assembly welding, characterized in that: Includes a first soldering assembly (100) for soldering the diode motherboard located on the upper layer; The second soldering assembly (200) is used to solder the diode motherboard located on the lower layer; The docking assembly (300) includes a first multi-degree-of-freedom manipulator (310), a flip plate (320), a first conveying platform (330), and a second multi-degree-of-freedom manipulator (340). The flip plate (320) is rotatably disposed on the top of one end of the first conveying platform (330). The flip plate (320) is hollow inside, and a plurality of suction holes (321) are arranged in an array on its top plate surface. The first multi-degree-of-freedom manipulator (310) is used to transport the diode motherboard after being soldered by the first soldering assembly (100) to the top of the flip plate (320); The second multi-degree-of-freedom robot (340) is used to transport the diode motherboard after being soldered by the second soldering component (200) to the first conveying platform (330); After the flip plate (320) holds the diode mother plate located on its top and flips it 180°, it releases the diode mother plate, allowing it to fall vertically and dock with the diode mother plate located on the first conveying platform (330). It also includes a core implantation assembly (400), which is disposed between the second tin implantation assembly (200) and the docking assembly (300); The core-planting assembly (400) includes a third multi-degree-of-freedom robot (410), a second conveying platform (420), a fourth multi-degree-of-freedom robot (430), a third conveying platform (440), and a motherboard base (450). The two ends of the second conveying platform (420) are respectively connected to the second solder-planting assembly (200) and the first conveying platform (330). The third multi-degree-of-freedom robot (410) is used to transfer the diode motherboard with solder-planted by the second solder-planting assembly (200) to the second conveying platform (420). The third transport platform (440) has a plurality of chips arranged in an array, and the third transport platform (440) and the motherboard holder (450) are symmetrically arranged about the second transport platform (420). The fourth multi-degree-of-freedom manipulator (430) is used to transfer the chip located on the third transport platform (440) to the diode motherboard on the second transport platform (420); the fourth multi-degree-of-freedom manipulator (430) can also move the diode motherboard on the second transport platform (420) to the motherboard holder (450), and can also move the diode motherboard on the motherboard holder (450) to the second transport platform (420); A motherboard clip holder (451) is provided on one side of the motherboard base (450). A horizontally retractable first push head (452) is provided on the side of the motherboard base (450) away from the motherboard clip holder (451). The first push head (452) can push the diode motherboard located on the motherboard base (450) into the motherboard clip located on the motherboard clip holder (451). A horizontally retractable second push head (453) is provided on the side of the motherboard clip holder (451) away from the motherboard base (450). The second push head (453) can push the diode motherboard in the motherboard clip back onto the motherboard base (450).

2. The pretreatment equipment for diode assembly welding according to claim 1, characterized in that, The fourth multi-degree-of-freedom manipulator (430) includes a horizontally arranged first moving part (431), a cantilever base (432), a second moving part (433), a third moving part (434), a first motherboard suction cup (435), and a chip suction cup (436). The first moving part (431) is arranged above the second conveying platform (420), the third conveying platform (440), and the motherboard base (450). The first moving part (431) drives the cantilever base (432) to move horizontally. The second moving part (433) and the third moving part (434) are vertically arranged on the cantilever base (432). The second moving part (433) and the third moving part (434) respectively drive the first motherboard suction cup (435) and the chip suction cup (436) to move vertically.

3. The pretreatment equipment for diode assembly welding according to claim 2, characterized in that, The second multi-degree-of-freedom manipulator (340) is used to transport the diode motherboard on the second conveying platform (420) to the first conveying platform (330).

4. The pretreatment equipment for diode assembly welding according to claim 3, characterized in that, The first soldering assembly (100) includes a first solder paste printer (110), a fourth conveying platform (120), a first printing table (130), and a first spring clip holder (140). The fourth conveying platform (120) is horizontally arranged, the first printing table (130) and the first spring clip (140) are spaced apart on the fourth conveying platform (120), and the first solder paste printer (110) and the first multi-degree-of-freedom robot (310) are spaced apart above the fourth conveying platform (120); The distance between the first solder paste printer (110) and the first multi-degree-of-freedom manipulator (310) is the same as the distance between the first printing table (130) and the first cartridge holder (140).

5. The pretreatment equipment for diode assembly welding according to claim 4, characterized in that, The second solder paste assembly (200) includes a second solder paste printer (210), a fifth conveying platform (220), a second printing table (230), a second spring clip holder (240), and a fifth multi-degree-of-freedom robot (250). The fifth multi-degree-of-freedom robot (250) and the third multi-degree-of-freedom robot (410) are respectively disposed at both ends of the fifth conveying platform (220). The second printing table (230) is disposed on the fifth conveying platform (220), and the second solder paste printer (210) is disposed above the fifth conveying platform (220); The second cartridge holder (240) is disposed on one side of the fifth conveying platform (220), and the fifth multi-degree-of-freedom manipulator (250) is used to move the diode motherboard on the second cartridge holder (240) onto the fifth conveying platform (220).

6. A pretreatment device for diode assembly welding according to any one of claims 1-5, characterized in that, It also includes a discharge assembly (500) and a graphite disk holder (600), the discharge assembly (500) being disposed at one end of the first conveying platform (330) away from the tilting plate (320); The unloading assembly (500) includes a sixth multi-degree-of-freedom manipulator (510) and a conveyor belt (520). The sixth multi-degree-of-freedom manipulator (510) is used to move the graphite disk on the graphite disk holder (600) onto the first conveyor platform (330) and to transport the graphite disk loaded with the mated diode motherboard on the first conveyor platform (330) onto the conveyor belt (520).

7. The pretreatment equipment for diode assembly welding according to claim 6, characterized in that, The sixth multi-degree-of-freedom manipulator (510) includes a fourth moving part (511), a fifth moving part (512), a mounting base (513), a slide bar (514), a clamping plate (515), and a cylinder (516). The fourth moving part (511) is horizontally arranged above the first conveying platform (330) and the graphite disk base (600). The fourth moving part (511) is used to drive the fifth moving part (512) to move horizontally. The fifth moving part (512) is used to drive the mounting base (513) to move vertically. The mounting base (513) has two sliding rods (514) horizontally spaced at the lower end, and two clamping plates (515) are slidably arranged at both ends of the two sliding rods (514). Two fixed seats (517) are provided at intervals on the two sliding rods (514), and cylinders (516) are provided on both fixed seats (517). The telescopic ends of the two cylinders (516) are respectively connected to the two clamps (515).

8. The pretreatment equipment for diode assembly welding according to claim 5, characterized in that, The first multi-degree-of-freedom manipulator (310), the second multi-degree-of-freedom manipulator (340), the third multi-degree-of-freedom manipulator (410), and the fifth multi-degree-of-freedom manipulator (250) have the same structure; The fifth multi-degree-of-freedom manipulator (250) includes a sixth moving part (251), a seventh moving part (252), a mounting head (253), and a second mother plate suction cup (254). The sixth moving part (251) is used to drive the seventh moving part (252) to move horizontally, and the seventh moving part (252) is used to drive the mounting head (253) to move vertically. The second mother plate suction cup (254) is provided at the lower end of the mounting head (253).

9. The pretreatment equipment for diode assembly welding according to claim 8, characterized in that, The first moving part (431), the second moving part (433), the third moving part (434), the fourth moving part (511), the fifth moving part (512), the sixth moving part (251) and the seventh moving part (252) have the same structure and are all ball screw slides.

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