Product processing method, apparatus, terminal device, and medium
By controlling the laser beam emission and the path length of the product movement, uniform processing of the product surface is achieved, solving the problems of low efficiency and insufficient uniformity in existing technologies, and improving processing efficiency and accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN TETELASER TECH CO LTD
- Filing Date
- 2023-09-04
- Publication Date
- 2026-05-29
Smart Images
Figure CN117102660B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of product processing technology, and in particular to a product processing method, apparatus, terminal equipment, and computer-readable storage medium. Background Technology
[0002] Uniform surface finishing is a crucial step in the manufacturing process, ensuring consistent product quality and appearance.
[0003] Existing methods generally include chemical etching, machining, and electrical discharge machining to achieve uniform surface processing of products.
[0004] However, in the existing product surface processing methods, on the one hand, manual assistance from technicians is generally required, resulting in low product processing efficiency; on the other hand, it is impossible to guarantee uniform processing accuracy of the product surface, such as uneven coating coverage. Summary of the Invention
[0005] The main objective of this invention is to provide a product processing method, system, terminal equipment, and computer-readable storage medium, which aims to achieve efficient and precise uniform processing of product surfaces.
[0006] To achieve the above objectives, the present invention provides a product processing method, wherein the testing method includes:
[0007] Control the laser to emit light and irradiate the target product;
[0008] The laser focus is located at the calibrated position on the surface of the target product.
[0009] Control the laser to stop emitting light;
[0010] Control the movement of the target product and obtain the path length of the target product's movement, wherein the starting point for measuring the path length is the calibration position;
[0011] When the path length meets the preset light emission conditions, the laser is controlled to emit light again and irradiate the surface of the target product.
[0012] Optionally, the preset light emission conditions include: the path length is an integer multiple of a preset length threshold; and before the step of controlling the laser to emit light again and irradiate the surface of the target product, the conditions further include:
[0013] Determine whether the path length of the current movement path of the target product is an integer multiple of the preset length threshold;
[0014] If the path length is an integer multiple of the preset length threshold, then the step of controlling the laser to emit light again and irradiate the surface of the target product is executed.
[0015] Optionally, before the steps of controlling the movement of the target product and obtaining the path length of the target product's movement, the method further includes:
[0016] Determine the rotation axis center of the target product, and based on the rotation axis center, execute the step of controlling the target product to move.
[0017] Optionally, the step of determining the rotation center of the target product includes:
[0018] The target product is controlled to rotate, and the laser is controlled to emit light and irradiate the surface of the target product.
[0019] Collect multiple focused laser spots on the surface of the target product;
[0020] The position of the rotation axis center when the target product rotates is determined based on the position coordinates of multiple laser focused spots.
[0021] Optionally, the step of obtaining the path length of the target product includes:
[0022] The current rotation angle of the target product is determined based on the line connecting the rotation axis center and the calibrated position;
[0023] Determine the arc length corresponding to the current rotation angle, and obtain the mapping points of the two endpoints of the arc length on the surface of the target product;
[0024] Obtain the product surface length between the two mapping points, and use the product surface length as the path length of the target product movement path.
[0025] Optionally, the step of controlling the target product to move includes:
[0026] The target product is controlled to move according to a preset motion trajectory, wherein the laser focus remains on the surface of the target product while the target product moves according to the motion trajectory.
[0027] Optionally, before the step of controlling the target product to move according to a preset motion trajectory, the method further includes:
[0028] Control the laser to emit light and irradiate the surface of the target product;
[0029] The industrial camera is controlled to acquire laser marking points on the surface of the target product and the product parameters of the target product;
[0030] The motion trajectory of the target product is determined based on the product parameters and the laser marking points.
[0031] To achieve the above objectives, the present invention also provides a product processing apparatus, the product processing apparatus comprising:
[0032] The first control module is used to control the laser to emit light and irradiate the target product.
[0033] The acquisition module is used to acquire the calibrated position of the laser focus on the surface of the target product;
[0034] The second control module is used to control the laser to stop emitting light;
[0035] The third control module is used to control the movement of the target product and obtain the path length of the target product's movement, wherein the starting point for measuring the path length is the calibration position;
[0036] The fourth control module is used to control the laser to emit light again and irradiate the surface of the target product when the path length meets the preset light emission conditions.
[0037] The product processing apparatus of the present invention performs the steps of the product processing method described above during operation.
[0038] To achieve the above objectives, the present invention also provides a terminal device, the terminal device comprising: a memory, a processor, and a product processing program stored in the memory and executable on the processor, wherein the product processing program, when executed by the processor, implements the steps of the product processing method as described above.
[0039] Furthermore, to achieve the above objectives, the present invention also proposes a computer-readable storage medium storing a product processing program, which, when executed by a processor, implements the steps of the product processing method described above.
[0040] In addition, to achieve the above objectives, the present invention also provides a computer program product, which includes a computer program that, when executed by a processor, implements the steps of the product processing method described above.
[0041] This invention provides a product processing method, apparatus, terminal equipment, computer-readable storage medium, and computer program product. The method involves controlling a laser to emit light and irradiate a target product; acquiring a calibrated position of the laser focus on the surface of the target product; controlling the laser to stop emitting light; controlling the target product to move and obtaining the path length of the target product's movement, wherein the starting point for measuring the path length is the calibrated position; and when the path length meets preset light emission conditions, controlling the laser to emit light again and irradiate the surface of the target product.
[0042] Compared to existing product surface processing methods, this invention first determines a marked position on the product surface. Then, the product can be controlled to move, and the path length of the product's movement path can be obtained in real time. When the path length meets preset light emission conditions, the laser is controlled to emit light again to irradiate the product surface for processing. Therefore, this invention can automatically control laser light emission to process the product surface by detecting the product's movement path length, ensuring the uniformity of the surface processing without manual intervention. While ensuring uniform surface processing, it also improves the efficiency and accuracy of product surface processing, and reduces labor costs. Attached Figure Description
[0043] Figure 1 This is a schematic diagram of the hardware operating environment involved in the embodiments of the present invention;
[0044] Figure 2 This is a flowchart illustrating an embodiment of the product processing method of the present invention;
[0045] Figure 3-1 This is a first schematic diagram of the target product unfolded and laid out according to an embodiment of the product processing method of the present invention;
[0046] Figure 3-2 This is a second schematic diagram showing the unfolded and laid-out target product according to an embodiment of the product processing method of the present invention;
[0047] Figure 4 This is a third schematic diagram showing the unfolded and laid-out target product according to an embodiment of the product processing method of the present invention;
[0048] Figure 5 This is a schematic diagram of a module of an embodiment of the product processing device of the present invention.
[0049] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0050] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
[0051] like Figure 1 As shown, Figure 1 This is a schematic diagram of the device structure of the hardware operating environment involved in the embodiments of the present invention.
[0052] It should be noted that the terminal device in this embodiment of the invention can be used to realize automatic and uniform laser processing of product surfaces.
[0053] like Figure 1As shown, the device may include: a processor 1001, such as a CPU; a network interface 1004; a user interface 1003; a memory 1005; and a communication bus 1002. The communication bus 1002 is used to enable communication between these components. The user interface 1003 may include a display screen or an input unit such as a keyboard; optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface). The memory 1005 may be high-speed RAM or non-volatile memory, such as a disk drive. Optionally, the memory 1005 may also be a storage system independent of the aforementioned processor 1001.
[0054] Those skilled in the art will understand that Figure 1 The device structure shown does not constitute a limitation on the device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.
[0055] like Figure 1 As shown, the memory 1005, as a computer storage medium, may include an operating system, a network communication module, a user interface module, and product processing programs. The operating system is a program that manages and controls the device's hardware and software resources, supporting the operation of the product processing programs and other software or programs. Figure 1 In the device shown, the user interface 1003 is mainly used for data communication with the student terminal; the network interface 1004 is mainly used for establishing a communication connection with the server; and the processor 1001 can be used to call the product processing program stored in the memory 1005 and perform the following operations:
[0056] Control the laser to emit light and irradiate the target product;
[0057] The laser focus is located at the calibrated position on the surface of the target product.
[0058] Control the laser to stop emitting light;
[0059] Control the movement of the target product and obtain the path length of the target product's movement, wherein the starting point for measuring the path length is the calibration position;
[0060] When the path length meets the preset light emission conditions, the laser is controlled to emit light again and irradiate the surface of the target product.
[0061] Furthermore, the preset light emission conditions include: the path length is an integer multiple of a preset length threshold. Before the step of controlling the laser to emit light again and irradiate the surface of the target product, the processor 1001 can also be used to call the product processing program stored in the memory 1005 and perform the following operations:
[0062] Determine whether the path length of the current movement path of the target product is an integer multiple of the preset length threshold;
[0063] If the path length is an integer multiple of the preset length threshold, then the step of controlling the laser to emit light again and irradiate the surface of the target product is executed.
[0064] Furthermore, before the steps of controlling the movement of the target product and obtaining the path length of the target product's movement, the processor 1001 can also be used to call the product processing program stored in the memory 1005 and perform the following operations:
[0065] Determine the rotation axis center of the target product, and based on the rotation axis center, execute the step of controlling the target product to move.
[0066] Furthermore, the processor 1001 can also be used to call the product processing program stored in the memory 1005, and also perform the following operations:
[0067] The target product is controlled to rotate, and the laser is controlled to emit light and irradiate the surface of the target product.
[0068] Collect multiple focused laser spots on the surface of the target product;
[0069] The position of the rotation axis center when the target product rotates is determined based on the position coordinates of multiple laser focused spots.
[0070] Furthermore, the processor 1001 can also be used to call the product processing program stored in the memory 1005, and also perform the following operations:
[0071] The current rotation angle of the target product is determined based on the line connecting the rotation axis center and the calibrated position;
[0072] Determine the arc length corresponding to the current rotation angle, and obtain the mapping points of the two endpoints of the arc length on the surface of the target product;
[0073] Obtain the product surface length between the two mapping points, and use the product surface length as the path length of the target product movement path.
[0074] Furthermore, the processor 1001 can also be used to call the product processing program stored in the memory 1005, and also perform the following operations:
[0075] The target product is controlled to move according to a preset motion trajectory, wherein the laser focus remains on the surface of the target product while the target product moves according to the motion trajectory.
[0076] Furthermore, before the step of controlling the target product to move according to a preset motion trajectory, the processor 1001 can also call the product processing program stored in the memory 1005 and perform the following operations:
[0077] Control the laser to emit light and irradiate the surface of the target product;
[0078] The industrial camera is controlled to acquire laser marking points on the surface of the target product and the product parameters of the target product;
[0079] The motion trajectory of the target product is determined based on the product parameters and the laser marking points.
[0080] According to the background art description of the present invention, existing product processing methods are inefficient and cannot guarantee accuracy.
[0081] To address the aforementioned issues, this invention proposes a product processing method that achieves uniform processing of the product surface without requiring manual intervention, thereby improving the efficiency and precision of uniform processing of the product surface.
[0082] The product processing method of this invention is applied to a product processing system, which includes at least a laser, a target product, and an industrial camera. This invention does not specifically limit parameters such as the type and output power of the laser. Furthermore, the industrial camera in this embodiment can be a CCD camera.
[0083] Reference Figure 2 , Figure 2 This is a schematic diagram of the first process of the first embodiment of the product processing method of the present invention.
[0084] This embodiment provides an example of a product processing method. It should be noted that although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than that shown here.
[0085] The product processing method in this embodiment includes the following steps:
[0086] Step S10: Control the laser to emit light and irradiate the target product;
[0087] Step S20: Acquire the calibrated position of the laser focus on the surface of the target product;
[0088] It should be noted that, in this embodiment, the technician can pre-fix the target product to be processed in the fixture, so that the fixture can drive the target product to move, such as rotate, or translate in the X-axis or Y-axis direction.
[0089] The terminal device can control the laser to emit light and illuminate the target product (at which time the target product is in a stationary state), and then control the CCD camera to collect the calibration position of the laser focus on the surface of the target product.
[0090] Step S30: Control the laser to stop emitting light;
[0091] Step S40: Control the movement of the target product and obtain the path length of the target product movement, wherein the starting point for measuring the path length is the calibration position;
[0092] After the terminal device acquires the marked position of the laser focus on the surface of the target product, it can control the laser to stop emitting light, and thus control the movement of the target product. It can be understood that, in order to achieve uniform surface processing, the target product rotates around a pivot axis.
[0093] At this time, the terminal device can obtain the path length of the target product's movement path in real time, wherein the starting point for measuring the path length can be the marked position of the aforementioned laser focus.
[0094] Step S50: When the path length meets the preset light emission conditions, control the laser to emit light again and irradiate the surface of the target product.
[0095] After the terminal device obtains the path length of the target product's movement path in real time, if it detects that the path length meets the preset light emission conditions, it can control the laser to emit light again and irradiate the surface of the target product to process the target product.
[0096] It is understood that in this embodiment, the terminal device can control the laser beam to process the product based on the path length of the product's movement path, without the need for manual intervention, and ensures uniform laser surface processing, which is suitable for processing various product surfaces, whether regular or irregular.
[0097] In this embodiment, the terminal device can control the laser to emit light and illuminate the target product. Furthermore, it can control the CCD camera to capture the calibrated position of the laser focus on the target product's surface. After capturing the calibrated position of the laser focus on the target product's surface, the terminal device can control the laser to stop emitting light, and then control the target product to move. After acquiring the path length of the target product's movement path in real time, if the terminal device detects that the path length meets preset light emission conditions, it can control the laser to emit light again and illuminate the target product's surface for processing.
[0098] Compared to existing product surface processing methods, this invention first determines a marked position on the product surface. Then, the product can be controlled to move, and the path length of the product's movement path can be obtained in real time. When the path length meets preset light emission conditions, the laser is controlled to emit light again to irradiate the product surface for processing. Therefore, this invention can automatically control laser light emission to process the product surface by detecting the product's movement path length, ensuring the uniformity of the surface processing without manual intervention. While ensuring uniform surface processing, it also improves the efficiency and accuracy of product surface processing, and reduces labor costs.
[0099] Furthermore, based on the first embodiment of the product processing method of the present invention described above, a second embodiment of the product processing method of the present invention is proposed.
[0100] In this embodiment, the preset light emission conditions include: the path length is an integer multiple of a preset length threshold. Based on this, before step S50, "controlling the laser to emit light again and irradiate the target product surface," the following is also included:
[0101] Step S60: Determine whether the path length of the current movement path of the target product is an integer multiple of the preset length threshold;
[0102] Step S70: If the path length is an integer multiple of the preset length threshold, then execute the step of controlling the laser to emit light again and irradiate the surface of the target product.
[0103] In this embodiment, the preset light emission condition may include: the path length of the target product's movement path is an integer multiple of the preset length threshold S. That is, according to the preset light emission condition, it can be guaranteed that for every movement path length S of the target product, the terminal device can control the laser to emit light and radiate the surface of the target product, thus ensuring uniform laser processing of the product surface.
[0104] Based on this, the terminal device needs to determine in advance whether the path length of the target product's current movement path is an integer multiple of the preset length threshold S, such as S, 2S, 3S, etc.
[0105] If the path length is determined to be an integer multiple of a preset length threshold, the laser can be controlled to emit light again and illuminate the surface of the target product. This is understandable. Figure 3-1 and 3-2 The target product unfolded diagram shown allows the laser to emit light once every preset length threshold S and irradiate the product surface.
[0106] Through the above methods, such as Figure 4 As shown, the laser can uniformly mark vertical lines on the product surface.
[0107] In this embodiment, the laser can be controlled to emit light by detecting the path length of the target product's movement path, so that the laser can emit light to illuminate the product surface every time the target product moves over a preset length threshold S, thereby achieving uniform laser processing of the product surface.
[0108] Furthermore, before step S40, "controlling the movement of the target product and obtaining the path length of the target product's movement," the method further includes:
[0109] Step S80: Determine the rotation axis center of the target product, and based on the rotation axis center, execute the step of controlling the target product to move.
[0110] In this embodiment, before controlling the target product to move, the terminal device needs to pre-determine the rotation axis of the target product, so that the target product can rotate around the rotation axis.
[0111] Therefore, when using a laser to process the surface of a product, the position of the laser can be fixed and the product rotation can be controlled so that the product surface can be processed uniformly during the product rotation process.
[0112] Furthermore, by detecting the position of the product's rotating axis, it is possible to prevent the product from shifting during rotation, thereby ensuring the product's processing accuracy.
[0113] Furthermore, step S80 above may include:
[0114] Step S801: Control the target product to rotate, and control the laser to emit light and irradiate the surface of the target product;
[0115] Step S802: Collect multiple laser focused spots on the surface of the target product;
[0116] Step S803: Determine the rotation axis center position of the target product when it rotates based on the position coordinates of multiple laser focused spots.
[0117] In this embodiment, as described above, the terminal device can control the target product to rotate around the rotation axis. Therefore, the terminal device needs to pre-determine the rotation axis.
[0118] Specifically, for example, the terminal device can control the target product to rotate, and during the rotation, control the laser to emit light and irradiate the surface of the target product, thereby performing laser focused spot imaging on the surface of the target product.
[0119] Furthermore, the CCD camera can be controlled to acquire multiple focused laser spots on the surface of the target product. Based on the position coordinates of the multiple focused laser spots, the rotation axis center position of the target product during rotation can be calculated.
[0120] For example, the number of laser focused spots acquired by the CCD is at least three. When there are three laser focused spots, a circle connecting the three laser focused spots can be constructed based on their position coordinates. The center of this circle is the rotation center of the rotation axis.
[0121] In another embodiment, in addition to determining the rotation center position of the rotating shaft before product surface processing as described above, the rotation center position can also be determined in real time during product surface processing to avoid rotation center offset during product rotation and ensure product surface processing accuracy.
[0122] Furthermore, in step S40 above, "obtaining the path length of the target product's movement" may include:
[0123] Step S401: Determine the current rotation angle of the target product based on the line connecting the rotation center of the rotating shaft and the calibrated position;
[0124] Step S402: Determine the arc length corresponding to the current rotation angle, and obtain the mapping points of the two endpoints of the arc length on the surface of the target product;
[0125] Step S403: Obtain the product surface length between the two mapping points, and use the product surface length as the path length of the target product movement path.
[0126] In this embodiment, as described above, the target product can rotate around the rotation axis. Based on this, the terminal device can first determine the line connecting the marked position of the laser focus and the rotation axis. Then, based on this line, it can determine the current rotation angle of the target product, and determine the arc length corresponding to the current rotation angle and the two endpoints of that arc length. It is understood that one of the two endpoints is the marked position of the laser focus.
[0127] Furthermore, the two endpoints can be mapped to the surface of the target product to obtain the corresponding mapping points, and the length of the product surface between the two mapping points can be calculated as the path length of the target product's movement path.
[0128] It is understood that in this embodiment, the laser position remains constant while the target product rotates around the rotation axis. Therefore, the marked position of the laser focus can be used as the starting endpoint of the arc length (since this point is on the surface of the target product, the mapping point of this endpoint is itself). The product surface length between this marked position and another mapping point is calculated. Specifically, when the product surface is flat, the product surface length is the straight-line distance between the two mapping points; when the product surface is curved, the product surface length is the arc length between the two mapping points.
[0129] Specifically, for example, if the product has a curved surface, the arc length corresponding to the aforementioned rotation angle can be used as the path length of the movement path; if the product has a non-curved surface, such as a cuboid, the mapping point of the arc length corresponding to the rotation angle on the product surface can be determined, for example, as... Figure 3-1 And as shown in the product unfolding diagram in 3-2, the arc length between the two mapping points is the path length of the target product's movement path.
[0130] Using the above method, the path length of the product relative to the marked position can be calculated. Then, when the path length is an integer multiple of the preset length threshold S, the laser is controlled to emit light again, realizing automatic and uniform laser processing of the product surface. This can ensure processing accuracy and efficiency while reducing labor costs.
[0131] Furthermore, in step S40 above, "controlling the movement of the target product" may include:
[0132] Step S404: Control the target product to move according to the preset motion trajectory, wherein the laser focus remains on the surface of the target product while the target product moves according to the motion trajectory.
[0133] It should be noted that in this embodiment, when controlling the target product to rotate around the rotation axis, the laser focus may not always be on the product surface due to product movement, unstable laser light source, or other reasons, thus affecting the surface processing accuracy of the product.
[0134] Therefore, this embodiment can plan the trajectory of the target product in advance, so that the target product can always follow the laser focus when it moves along the trajectory.
[0135] Furthermore, before step S404, "controlling the target product to move according to a preset motion trajectory," the following is also included:
[0136] Step S405: Control the laser to emit light and irradiate the surface of the target product;
[0137] Step S406: Control the industrial camera to acquire laser marking points on the surface of the target product and the product parameters of the target product;
[0138] Step S407: Determine the motion trajectory of the target product based on the product parameters and the laser marking points.
[0139] In this embodiment, the laser focus can be controlled to fall on the surface of the target product and emit light to mark it, forming a laser marker point. Furthermore, the CCD camera can be controlled to position the laser marker point and obtain its position coordinates (X, Y). In this embodiment, the XY plane can be a reference plane that is horizontal to the Earth's surface.
[0140] Simultaneously, the CCD camera is controlled to acquire the current product parameters of the target product. These product parameters may include, but are not limited to, the position coordinates of the target product and the placement angle of the target product. It can be understood that the target product can be fixed on a rotating platform, and the rotating platform drives the target product to move. Therefore, the placement angle of the target product can be the angle relative to the baseline of the rotating platform (for example, if the platform is circular, the baseline can be a horizontal line passing through the center of the circle).
[0141] Furthermore, based on the target product's position coordinates, placement angle, and outer frame dimensions, the midpoint coordinates of the target product at each preset rotation angle can be calculated. The preset rotation angles can be predetermined based on actual working conditions; for example, multiple preset rotation angles could be 30°, 60°, 90°, ..., 330°.
[0142] Furthermore, the positional deviation between the coordinates of the intermediate position and the coordinates of the laser marker point can be obtained.
[0143] Determine whether the positional deviation is less than a preset deviation threshold. The preset deviation threshold can be understood as the laser focus being no longer on the surface of the target product once the positional deviation exceeds the threshold.
[0144] If a positional deviation is less than the preset deviation threshold, the intermediate position coordinates corresponding to the positional deviation can be used as a trajectory point.
[0145] Using the above method, multiple trajectory points can be determined, and a running trajectory containing each trajectory point can be constructed.
[0146] Therefore, in this embodiment, the running trajectory of the target product can be predicted based on the product parameters of the target product and the position of the laser marker point. The product outline size is taken into account, so that the target product always follows the laser focus when moving along the running trajectory. The focus following control method is simpler. While ensuring real-time tracking of the laser focus, it also reduces the control cost and is suitable for laser following of various types of products.
[0147] In this embodiment, the laser emission can be controlled by detecting the path length of the target product's movement path, ensuring that the laser emits light to illuminate the product surface every time the target product travels a preset length threshold S, thus achieving uniform laser processing of the product surface. Before controlling the target product's movement, the terminal device needs to pre-determine the target product's rotation axis center, allowing the target product to rotate around this center. Therefore, when processing the product surface with a laser, the laser position can be fixed, and the product rotation can be controlled, ensuring uniform processing of the product surface during rotation. Furthermore, by detecting the product's rotation axis center position, rotational deviation during rotation can be avoided, thereby ensuring product processing accuracy. Additionally, when processing the product surface with a laser, the laser position can be fixed, and the product rotation can be controlled, ensuring uniform processing of the product surface during rotation. Furthermore, by detecting the product's rotation axis center position, rotational deviation during rotation can be avoided, thereby ensuring product processing accuracy. In addition, the target product's trajectory can be predicted based on its product parameters and the position of the laser marker. Taking into account the product's outline dimensions, the target product always follows the laser focus when moving along the trajectory. The focus following control method is simpler, and while ensuring real-time laser focus following, it also reduces control costs. It is suitable for laser following of various types of products.
[0148] Furthermore, embodiments of the present invention also propose a product processing apparatus, such as... Figure 5 As shown, the product processing apparatus of the present invention includes:
[0149] The first control module 10 is used to control the laser to emit light and irradiate the target product.
[0150] Acquisition module 20 is used to acquire the calibration position of the laser focus on the surface of the target product;
[0151] The second control module 30 is used to control the laser to stop emitting light;
[0152] The third control module 40 is used to control the movement of the target product and obtain the path length of the target product movement, wherein the starting point for measuring the path length is the calibration position;
[0153] The fourth control module 50 is used to control the laser to emit light again and irradiate the surface of the target product when the path length meets the preset light emission conditions.
[0154] Furthermore, the preset light emission conditions include: the path length is an integer multiple of a preset length threshold; the product processing device further includes:
[0155] The judgment module is used to determine whether the path length of the current movement path of the target product is an integer multiple of the preset length threshold;
[0156] An execution module is configured to execute the step of controlling the laser to emit light again and irradiate the surface of the target product if the path length is an integer multiple of the preset length threshold.
[0157] Furthermore, the product processing apparatus further includes:
[0158] The determining module is used to determine the rotation center of the target product's rotation axis, and based on the rotation center of the rotation axis, execute the step of controlling the target product to move.
[0159] Furthermore, the determining module also includes:
[0160] The first control unit is used to control the target product to rotate and to control the laser to emit light and irradiate the surface of the target product.
[0161] The acquisition unit is used to acquire multiple focused laser spots on the surface of the target product;
[0162] The rotation center determination unit is used to determine the rotation center position of the target product when it rotates based on the position coordinates of multiple laser focusing spots.
[0163] Furthermore, the third control module 40 also includes:
[0164] The acquisition unit is used to determine the current rotation angle of the target product based on the line connecting the rotation center of the rotation axis and the calibration position;
[0165] The mapping point acquisition unit is used to determine the arc length corresponding to the current rotation angle, and to acquire the mapping points corresponding to the two endpoints of the arc length on the surface of the target product.
[0166] The path determination unit is used to obtain the product surface length between the two mapping points and use the product surface length as the path length of the target product movement path.
[0167] Furthermore, the third control module 40 also includes:
[0168] The second control unit is used to control the target product to move according to a preset motion trajectory, wherein the laser focus remains on the surface of the target product while the target product moves according to the motion trajectory.
[0169] Furthermore, the third control module 40 also includes:
[0170] The third control unit is used to control the laser to emit light and irradiate the surface of the target product.
[0171] The fourth control unit is used to control the industrial camera to acquire laser marking points on the surface of the target product and the product parameters of the target product;
[0172] The trajectory determination unit is used to determine the motion trajectory of the target product based on the product parameters and the laser marker points.
[0173] The specific implementation of the product processing device of the present invention is basically the same as the embodiments of the above-described product processing method, and will not be described in detail here.
[0174] Furthermore, embodiments of the present invention also propose a computer-readable storage medium storing a product processing program, which, when executed by a processor, implements the steps of the product processing method described above.
[0175] The various embodiments of the product processing system and computer-readable storage medium of the present invention can be referred to the various embodiments of the product processing method of the present invention, and will not be repeated here.
[0176] Furthermore, embodiments of the present invention also provide a computer program product, the computer program product including a computer program, which, when executed by a processor, implements the steps of the product processing method as described in any of the embodiments of the above product processing method.
[0177] The specific embodiments of the computer program product of the present invention are basically the same as the embodiments of the above-described product processing method, and will not be described in detail here.
[0178] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.
[0179] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.
[0180] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a terminal device to execute the methods described in the various embodiments of the present invention.
[0181] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.
Claims
1. A product processing method, characterized in that, The product processing method includes: Control the laser to emit light and irradiate the target product; The laser focus is located at the calibrated position on the surface of the target product. Control the laser to stop emitting light; Control the movement of the target product and obtain the path length of the target product's movement, wherein the starting point for measuring the path length is the calibration position; When the path length meets the preset light emission conditions, the laser is controlled to emit light again and irradiate the surface of the target product. Before the steps of controlling the movement of the target product and obtaining the path length of the target product's movement, the method further includes: Determine the rotation axis center of the target product, and based on the rotation axis center, execute the step of controlling the target product to move; The step of obtaining the path length of the target product includes: The current rotation angle of the target product is determined based on the line connecting the rotation axis center and the calibrated position; Determine the arc length corresponding to the current rotation angle, and obtain the mapping points of the two endpoints of the arc length on the surface of the target product; Obtain the product surface length between the two mapping points, and use the product surface length as the path length of the target product's movement path. When the product surface is a plane, the product surface length is the straight-line distance between the two mapping points; when the product surface is an arc, the product surface length is the arc length between the two mapping points.
2. The product processing method as described in claim 1, characterized in that, The preset light emission conditions include: the path length is an integer multiple of a preset length threshold; and before the step of controlling the laser to emit light again and irradiate the surface of the target product, the conditions further include: Determine whether the path length of the current movement path of the target product is an integer multiple of the preset length threshold; If the path length is an integer multiple of the preset length threshold, then the step of controlling the laser to emit light again and irradiate the surface of the target product is executed.
3. The product processing method as described in claim 1, characterized in that, The step of determining the rotation center of the target product includes: The target product is controlled to rotate, and the laser is controlled to emit light and irradiate the surface of the target product. Collect multiple focused laser spots on the surface of the target product; The position of the rotation axis center when the target product rotates is determined based on the position coordinates of multiple laser focused spots.
4. The product processing method as described in claim 1, characterized in that, The step of controlling the movement of the target product includes: The target product is controlled to move according to a preset motion trajectory, wherein the laser focus remains on the surface of the target product while the target product moves according to the motion trajectory.
5. The product processing method as described in claim 4, characterized in that, Before the step of controlling the target product to move according to a preset motion trajectory, the method further includes: Control the laser to emit light and irradiate the surface of the target product; Control the industrial camera to acquire laser marking points on the surface of the target product and the product parameters of the target product; The motion trajectory of the target product is determined based on the product parameters and the laser marking points.
6. A product processing apparatus, characterized in that, The product processing device includes: The first control module is used to control the laser to emit light and irradiate the target product. The acquisition module is used to acquire the calibrated position of the laser focus on the surface of the target product; The second control module is used to control the laser to stop emitting light; The determining module is used to determine the rotation center of the target product's rotation axis, and based on the rotation center of the rotation axis, execute the step of controlling the target product to move; The third control module is used to control the movement of the target product, obtain the path length of the target product's movement, wherein the starting point for measuring the path length is the calibration position; determine the current rotation angle of the target product based on the line connecting the rotation axis center and the calibration position; determine the arc length corresponding to the current rotation angle, and obtain the mapping points corresponding to the two endpoints of the arc length on the surface of the target product; obtain the product surface length between the two mapping points, and use the product surface length as the path length of the target product's movement path, wherein when the product surface is a plane, the product surface length is the straight-line distance between the two mapping points; when the product surface is an arc surface, the product surface length is the arc length between the two mapping points. The fourth control module is used to control the laser to emit light again and irradiate the surface of the target product when the path length meets the preset light emission conditions.
7. A terminal device, characterized in that, The terminal device includes a memory, a processor, and a product processing program stored in the memory and executable on the processor, wherein the product processing program, when executed by the processor, implements the steps of the product processing method as described in any one of claims 1 to 5.
8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a product processing program, which, when executed by a processor, implements the steps of the product processing method as described in any one of claims 1 to 5.