A laser processing method for composite ceramic vias

Abstract

The application discloses a processing method of composite ceramic through holes, comprising the following steps: determining the processing path of the PET layer and the ceramic layer according to the shape and size of the through hole to be processed; controlling the laser to process each sub-path in turn from inside to outside along the determined processing path of the PET layer until the ceramic layer is exposed; and controlling the laser to process each through hole to be processed in turn along the determined processing path of the ceramic layer until all the through holes are obtained; wherein the processing path of the PET layer comprises a plurality of sub-paths which are similar in shape to the through hole to be processed, different in size and nested in turn, at least the outermost sub-path coincides with the center point of the through hole to be processed, and the size of the outermost sub-path is equal to or slightly smaller than the size of the through hole to be processed; and the processing path of the ceramic layer is a figure which is the same in shape and size as the through hole to be processed, or similar in shape and slightly smaller in size. The application processes the PET layer in a specific path combination form first, and then processes the ceramic part, reduces the heat accumulation of the laser heat in the PET layer, improves the quality of the through hole processing, and realizes a taper close to 0.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of multilayer ceramic processing, in particular to a processing method of composite ceramic through hole. BACKGROUND

[0002] Green ceramic sheet through hole processing is one of the key processes of multilayer ceramic technology. With the development of high and low temperature co-fired ceramic technology, the quality and efficiency of green ceramic through hole processing are increasingly required, and the processing of small diameter through holes is becoming more and more difficult. Laser processing through hole is widely used because of its high efficiency than mechanical punching. However, the disadvantage of laser processing is that the heat generated by laser will accumulate at the processing position, resulting in poor processing quality and large taper that is difficult to control. On the other hand, the green ceramic sheet of composite ceramic is generally composed of a certain thickness of green ceramic film layer and a certain thickness of PET layer. The combination of such heterogeneous materials also increases the difficulty of laser one-forming processing.

[0003] The current method for laser processing of green ceramic through hole is shown in the accompanying drawings Figure 1 For each hole with a certain diameter to be processed, the laser is incident from the green ceramic surface, a circular laser processing path with the same diameter is taken, and the path is repeated multiple times until the hole is punched through. Then the laser moves to the next position that needs to be punched and processes again until all the through holes are processed.

[0004] The above-mentioned existing through hole laser processing method, due to the large number of repeated times of laser path per unit time, will cause the material at the processing path to be repeatedly processed by laser, and the heat will easily accumulate at the processing path, resulting in the decline of the processing quality of the hole, including the excessive ablation of the material on the hole path, the blockage of the through hole by the residual PET, the serious accumulation and overflow of the molten PET near the hole mouth, even the formation of a crater, which affects the subsequent processing process, causes the large taper of the hole, the poor roundness of the hole and other defects. In order to solve the problem of PET melting and overflowing from the hole mouth, and the problem of difficult one-time laser processing of multiple materials, some process personnel usually remove the PET film before laser processing, and only punch the green ceramic part and perform subsequent hole filling, printing and other work. But this method makes the multilayer ceramic process very complicated. Moreover, after losing the support and protection of PET, the ceramic layer is easy to be damaged, causing material loss and process cycle increase. SUMMARY

[0005] The purpose of the present application is to provide a processing method of composite ceramic through hole, which first processes the PET layer of the composite ceramic in a specific path combination form, and then processes the ceramic part, reduces the heat accumulation of laser heat in the PET layer, improves the problems of excessive ablation of PET film, generation of difficult-to-handle residues and overflow of residues, and improves the quality of through hole processing.

[0006] The technical scheme adopted by the present application is as follows: a processing method of a composite ceramic via, comprising:

[0007] determining the shape and size of the via to be processed;

[0008] determining the processing path of the PET layer and the ceramic layer according to the shape and size of the via to be processed; wherein the processing path of the PET layer comprises a plurality of sub-paths similar to the shape of the via to be processed, the sizes of the plurality of sub-paths are different, and the plurality of sub-paths are nested in sequence, the center point of at least the outermost sub-path coincides with the center point of the via to be processed, and the size of the outermost sub-path is equal to or slightly smaller than the size of the via to be processed; the processing path of the ceramic layer is a figure with the same shape and size as the via to be processed, or a figure with a similar shape and a size slightly smaller than the size of the via to be processed;

[0009] controlling the laser emitted by the laser to process each sub-path in sequence from the inside to the outside along the determined processing path of the PET layer until the ceramic layer is exposed;

[0010] controlling the laser emitted by the laser to process each via to be processed in sequence along the determined processing path of the ceramic layer until all the vias are obtained.

[0011] The meaning of the "size" described above is different according to the shape of the via to be processed. If the via to be processed is circular, the size can refer to the diameter or radius of the circle. If the via to be processed is square, the size can refer to the side length of the square, or the distance from the center point to the edge or corner. For other shapes, the same applies.

[0012] The meaning of "slightly smaller" described above is that, for micrometer-level vias to be processed, the size difference within 5 um should be within the range of slightly smaller when using a picosecond ultraviolet laser for processing. The range of slightly smaller between the sizes of two figures is also affected by the laser spot diameter and energy size. For example, if the laser spot is larger and the energy is larger, the size difference referred to by slightly smaller should also be adjusted in the direction of being larger.

[0013] As can be seen from the above technical scheme, the present application first processes the PET layer from the inside to the outside in multiple circles, and uses the effect of the PET layer shrinking when heated to make room for the processing of the ceramic layer. During the heating process of the ceramic layer, the laser almost does not act on the PET layer, thereby avoiding problems such as excessive ablation of the PET film and overflow of residues caused by the accumulation of laser heat on the PET layer.

[0014] Optionally, the outermost sub-path in the PET layer processing path coincides with the ceramic layer processing path, and the size of the two is slightly smaller than the size of the to-be-processed through hole. The size of the finally processed through hole can be avoided to be larger than the required size. The size difference between the outermost sub-path and the ceramic layer processing path and the to-be-processed through hole can be determined according to the laser spot diameter of the laser, the laser energy size (i.e. the heat affected zone), the number of processing times, etc.

[0015] Optionally, the to-be-processed through hole is circular, each sub-path in the PET layer processing path and the ceramic layer processing path are concentric circles with the to-be-processed through hole, and the outermost sub-path in the PET layer processing path coincides with the ceramic layer processing path, and the diameter of the two is slightly smaller than the diameter of the to-be-processed through hole. Of course, the to-be-processed through hole can be other shapes, such as square or other regular or irregular patterns, as long as the sub-paths in the PET layer processing path and the ceramic layer processing path are parallel to the to-be-processed through hole profile and the center points coincide.

[0016] Optionally, the processing path of the PET layer has at least three sub-paths, and the path line distance between each two is equal or the difference between the path line distances of different sub-paths is within a set difference range. The number of sub-paths can be adjusted according to the size of the through hole and the thickness of the PET layer, so that the PET layer can be more effectively retracted to the area that does not affect the processing of the ceramic layer after being processed by laser, and the overall through hole processing efficiency is not affected by the too long PET layer processing path.

[0017] Optionally, the control of the laser emitted by the laser along the determined ceramic layer processing path to process each to-be-processed through hole is: the laser processes all to-be-processed through holes along the determined ceramic layer processing path for multiple cycles, and each cycle processes the ceramic layer processing path of all to-be-processed through holes in the form of radial scanning for one cycle. Taking one cycle of laser processing as an element number and processing all to-be-processed through hole paths for one cycle as a layer number, the radial scanning processing mode of the single element number and the multiple layer numbers adopted by the present application can give each hole enough time to dissipate heat, reduce heat accumulation and achieve near 0 taper.

[0018] Optionally, for a circular to-be-processed through hole with a diameter of 150um, the PET layer processing path includes three concentric circular sub-paths with diameters of 60um, 100um and 137um, and the ceramic layer processing path is a circle with a diameter of 137um and a center coinciding with the center of the to-be-processed through hole; the laser adopts a picosecond ultraviolet laser.

[0019] Optionally, the process of laser processing a single composite ceramic green sheet includes:

[0020] S1, fix the green ceramic sheet and make its PET layer face the laser, and sequentially process the PET layer of each to-be-processed through hole; the process of processing each to-be-processed through hole is: control the laser to sequentially process each sub-path of the PET layer processing path from inside to outside, and each sub-path is processed to a molten state before processing the next sub-path, until the outermost sub-path is processed to expose the ceramic layer;

[0021] S2, after the PET layer of all to-be-processed through holes on the green ceramic sheet is processed, control the laser to process the exposed ceramic layer of all to-be-processed through holes along the ceramic layer processing path, and perform laser processing in cycles for multiple times, until the ceramic column in all to-be-processed through holes can be detached; in each cycle, the laser sequentially scans all to-be-processed through hole ceramic layer processing paths in the form of a radial scan for one cycle.

[0022] It can be seen that the above processing process of the PET layer adopts a laser scanning mode of multiple element times and single layer times, and the processing process of the ceramic layer adopts a laser scanning mode of single element times and multiple coating times. The combination of the two laser scanning modes takes into account the characteristics of the PET layer shrinking under heat and the laser heat accumulation effect, ensures that the ceramic layer processing process is not interfered by the PET layer, and makes each hole have sufficient time to dissipate heat, reduces heat accumulation and achieves a taper close to 0.

[0023] Optionally, in the above laser processing process, the laser feeding distance is 0mm, the scanning speed is 200mm / s, the jump speed is 5000mm / s, the scanning delay is 150ms, the jump delay is 150ms, the light-on delay is 150ms, and the light-off delay is 150ms.

[0024] Optionally, the method further comprises: before controlling the laser to work, facing the PET layer to the laser, and the ceramic layer is adsorbed on the sample table through the vacuum suction table.

[0025] Optionally, the method further comprises: during the laser processing process and after the through hole is obtained after the laser processing process, using the air sweeping to clean the debris generated during the processing.

[0026] Beneficial effects

[0027] The composite ceramic processing method of this invention involves laser incidence from the PET surface of a green ceramic sheet. Different laser parameters and paths are used to process the PET layer and ceramic layer sequentially. For the PET carrier film, processing is performed step-by-step from the inside out using multiple concentric circles. This allows the PET within the entire processing aperture range to melt, shrink, migrate upwards, and solidify sequentially from the inside out under the laser's influence. The shrinkage and upward migration of the PET create a channel for laser processing of the green ceramic, ensuring that the laser almost no longer interacts with the PET during the green ceramic processing. This reduces heat buildup in the PET layer and improves problems such as excessive PET film ablation, difficult-to-handle residue, and residue overflow. A simple annular path is then used to complete the through-hole processing of the green ceramic layer. During the green ceramic processing, a single-element, multi-layer scanning mode is used, allowing each hole sufficient time to dissipate heat and reducing heat buildup. Practice has shown that the combination of the PET and ceramic layer processing methods of this invention can achieve a near-zero taper, significantly improving the quality of the through-holes, and achieving an average processing efficiency of approximately 100 holes / second, which is at a high level. Attached Figure Description

[0028] Figure 1 The diagram shows a laser processing path in the existing through-hole processing of raw ceramic sheets.

[0029] Figure 2 The diagram shows a laser processing schematic of a through hole in an existing green ceramic sheet.

[0030] Figure 3 The diagram shows the laser processing path of the PET layer during through-hole processing of a green ceramic sheet in one application example of the present invention.

[0031] Figure 4 The diagram shows the laser processing path of the ceramic layer during through-hole processing of a raw ceramic sheet in one application example of the present invention.

[0032] Figure 5 The diagram shown is a schematic flowchart of the through-hole processing procedure for a green ceramic sheet in one application example of the present invention. Detailed Implementation

[0033] The technical concept of the present application is that: by using the heat shrinkage characteristics of the PET layer material, when the composite ceramic via processing is carried out, the laser is incident from the PET surface, first processes the PET layer in a specific path combination form to give a passageway for the ceramic layer processing, and then processes the ceramic layer, so that the laser almost does not act on the PET material in the processing process, reduces the heat accumulation of the laser in the PET layer, and improves the problems of excessive ablation of the PET film, generation of difficult-to-handle residues and overflow of residues, etc. affecting the via taper and quality. When processing the ceramic layer, a simple annular path can be used, combined with a single element frequency and multiple layer frequency of the width scanning form, to further reduce the heat accumulation around each hole, further improve the via quality, and reduce the taper of the hole.

[0034] Further described below are the drawings and specific embodiments.

[0035] Embodiment 1

[0036] The present embodiment introduces a processing method of a composite ceramic via, comprising:

[0037] determining the shape and size of the via to be processed;

[0038] determining the processing path of the PET layer and the ceramic layer according to the shape and size of the via to be processed; wherein the processing path of the PET layer comprises a plurality of sub-paths similar to the shape of the via to be processed, the sizes of the plurality of sub-paths are different and are nested in turn, the center point of at least the outermost sub-path coincides with the center point of the via to be processed, and the size of the outermost sub-path is equal to or slightly smaller than the size of the via to be processed; the processing path of the ceramic layer is a pattern with the same shape and size as the via to be processed, or a pattern with a similar shape and a size slightly smaller than the size of the via to be processed;

[0039] controlling the laser emitted by the laser to process each sub-path in turn from the inside to the outside along the determined processing path of the PET layer until the ceramic layer is exposed;

[0040] controlling the laser emitted by the laser to process each via to be processed in turn along the determined processing path of the ceramic layer until all the vias are obtained.

[0041] In the above scheme, if the via to be processed is circular, its size can refer to the diameter or radius of the circle, if the via to be processed is square, its size can refer to the side length of the square, or the distance from the center point to the side or corner, and for other shapes, the same applies. That is, the meaning of "size" is different according to the shape of the via to be processed, which is not described in detail in the prior art.

[0042] The "slightly smaller" size means that, for a micron-level circular through hole to be processed, the size difference between the diameter of the through hole and the diameter of the annular path is within 5 um when using a picosecond ultraviolet laser for processing. The slightly smaller range between the two pattern sizes is also affected by the laser spot diameter and energy size. For example, if the laser spot is larger and the energy is larger, the size difference indicated by slightly smaller should also be adjusted in the direction of larger.

[0043] In this embodiment, the sub-paths of the PET layer processing path are at least 3, and the path line distances between each other are equal or the difference between the path line distances of different sub-paths is within a set difference range. The number of sub-paths can be adjusted according to factors such as the size of the through hole and the thickness of the PET layer, so that the PET layer can be more effectively retracted to an area that does not affect the processing of the ceramic layer after laser processing, and the overall through hole processing efficiency is not affected by the too long PET layer processing path.

[0044] Further, the center points of all sub-paths in the PET layer processing path coincide, the outermost sub-path coincides with the ceramic layer processing path, and the size of the two is slightly smaller than the size of the through hole to be processed, so that the PET layer can leave a passage for the ceramic layer processing after processing, and the size of the finally processed through hole is not larger than the required size.

[0045] In this embodiment, the method of laser processing of the ceramic layer is: laser processing of all through holes to be processed along the determined ceramic layer processing path for multiple cycles. Each cycle is scanned in the form of a radial scan to process the ceramic layer processing path of all through holes to be processed for one cycle.

[0046] In summary, the process of laser processing of a single composite ceramic green sheet in this embodiment includes:

[0047] S1, fix the green sheet and make its PET layer face the laser, and process the PET layer of each through hole to be processed in turn; the process of processing each through hole to be processed is: control the laser to process each sub-path of the PET layer processing path from inside to outside in turn, process each sub-path to a molten state, and then process the next sub-path, until the outermost sub-path is processed to expose the ceramic layer, leaving a processing passage for the ceramic layer processing path;

[0048] S2, after the PET layer of all through holes to be processed on the green sheet is processed, control the laser to process the exposed ceramic layer of all through holes to be processed along the ceramic layer processing path, and perform laser processing for multiple cycles until the ceramic column in all through holes to be processed can be removed; in each cycle, the laser scans the ceramic layer processing path of all through holes to be processed in the form of a radial scan for one cycle.

[0049] Take a path of laser processing as an element time, and take a group of same type paths to be processed as a layer time. In this embodiment, the laser scanning mode of multiple element times and single layer times is adopted for the PET layer, and the surface scanning processing mode of single element time and multiple layer times is adopted for the ceramic part. The cooperation of the two laser scanning modes effectively improves the quality and efficiency of the through hole processing.

[0050] Embodiment 2

[0051] This embodiment is described with a specific processing requirement. The green ceramic sheet material is composed of white LTCC aluminum oxide ceramic and transparent PET carrier film. The green ceramic sheet is 200mm long and 200mm wide. The ceramic layer is 0.15mm thick, and the PET film layer is 0.075mm thick. The reference is shown in Figure 5 A group of circular through holes with a diameter of 150um need to be processed on the composite ceramic, such as the hole combination shown in Figure 4 .

[0052] After determining the shape and size of the through holes to be processed, the laser processing path of the PET layer and the laser processing path of the ceramic layer can be determined comprehensively by referring to the spot and energy size of the laser used.

[0053] In this embodiment, the laser is a picosecond ultraviolet laser with a fundamental frequency of 150kHz, a selected frequency of 4, and a power factor of 45%. The PET layer laser processing path is three concentric circles nested from inside to outside with diameters of 60um, 100um, and 137um. The ceramic layer laser processing path coincides with the outermost sub-path of the PET layer laser processing path.

[0054] The processing flow of this embodiment is as follows with reference to the process flow shown in Figure 5 .

[0055] S1, fix the green ceramic sheet so that the PET layer faces the laser, and the ceramic surface is adsorbed on the sample table by the vacuum suction table;

[0056] Turn on the laser. First, process the PET layer of each through hole to be processed in turn. For the three concentric circular sub-paths of the PET layer at each through hole to be processed, process them from inside to outside in turn. The process is shown in Figure 5 .

[0057] ①Unprocessed state;

[0058] ②The laser scans along the innermost sub-path, and the PET at the center is processed to a molten state. The molten PET shrinks towards the center under the influence of tension and stretches towards the light source height direction under the influence of the laser heat source;

[0059] ③ Laser scans along the second layer sub-path from inside to outside, the molten PET continues to shrink to the center and stretch to the light source height direction;

[0060] ④ Laser scans along the outermost layer sub-path, the outer circle of the shrunk and stretched PET layer approaches the target circle diameter level, at this time the PET above the target hole position shrinks to the center and stretches upward, solidifies above the green porcelain, and the shrinkage generates a deep groove with a certain width, which provides a channel for laser cutting of the ceramic layer;

[0061] At this time, control the laser to scan along the ceramic layer processing path according to state ⑤, and after multiple layer times and element times, state ⑥ is formed, and the porcelain column in the through hole together with the solidified PET material thereon can fall off from the hole.

[0062] According to the above steps ①-④, the PET layer at each to-be-processed through hole on the green porcelain sheet is processed, and each sub-path is processed to the molten state before processing the next sub-path, until the outermost layer sub-path at all to-be-processed through holes is processed to expose the ceramic layer, then the PET layer at all to-be-processed through holes on the green porcelain sheet is processed.

[0063] S2, control the laser to scan along the ceramic layer processing path of all to-be-processed through holes, and cycle multiple times for laser processing, until the porcelain column in all to-be-processed through holes can fall off; in each round of cycle, the laser scans the ceramic layer processing path of all to-be-processed through holes in turn in the form of surface scanning for one cycle, so that the material in the processed area of each target through hole has sufficient time to dissipate heat, the heat accumulation is minimized, and the processing taper is ensured to be small enough.

[0064] In the above S1 and S2, the PET carrier film part processing parameters are: element times 3 times, layer times 1 time, feed distance 0 mm, scanning speed 200 mm / s, jump speed 5000 mm / s, scanning delay 150 ms, jump delay 150 ms, light-on delay 150 ms, light-off delay 150 ms;

[0065] The ceramic part processing parameters are: element times 1 time, layer times 9 times, feed distance 0 mm, scanning speed 200 mm / s, jump speed 5000 mm / s, scanning delay 150 ms, jump delay 150 ms, light-on delay 150 ms, light-off delay 150 ms.

[0066] During the above processing, the air blowing can be turned on at the same time to clean the debris generated during processing in time; after the through hole processing is completed, the air blowing and the stage suction are turned off to recover the sample.

[0067] In this embodiment, after the laser processing is completed, the PET is melted and peeled off together with the green ceramic column, and the processing process produces less residue and debris, and finally the diameter of the hole is 150um, the processing efficiency is about 10 holes per second on average, after the PET film is torn off, the difference between the diameter of the laser inlet and outlet through hole is less than 1um, and the processing quality of the hole is obviously improved. Moreover, since the present application processes from the PET surface, the green ceramic surface is clean, which is beneficial to the subsequent printing process.

[0068] In addition to the above-mentioned embodiments, the present application has wide applicability and is suitable for LTCC green ceramic through hole processing of various material composites. The composite ceramic can also be an LTCC or HTCC green ceramic sheet, and the ceramic composition can be various common ceramic materials such as alumina and barium titanate. The carrier film can be various high molecular thin film materials such as PET. The length and width of the green ceramic sheet can be arbitrary, the thickness of the ceramic layer of the green ceramic sheet can be 0.01mm-1mm, and the thickness of the carrier film can be 0-0.1mm. The hole shape to be processed can be circular, square or any other shape, and the diameter or side length can be 0.03mm or more.

[0069] The laser can be a nanosecond laser, a picosecond laser, a femtosecond laser, an infrared laser, an ultraviolet laser, a carbon dioxide laser, etc.

[0070] To ensure processing quality and efficiency, the parameters of the laser can be adjusted according to actual conditions, such as jump delay, switch light delay, scanning speed, etc. Tests have shown that the processing efficiency can reach 100 holes / s or higher, the PET is melted and peeled off together with the green ceramic column, the residue and debris are less, and the taper of the through hole is close to zero taper.

[0071] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, the above specific embodiments are only illustrative and not limiting, and those skilled in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, which are all within the protection of the present application.

Claims

1. A method for processing through holes in composite ceramics, characterized in that, include: Determine the shape and size of the through hole to be processed; Based on the shape and size of the through-hole to be processed, the processing paths for the PET layer and the ceramic layer are determined respectively. The processing path for the PET layer includes multiple sub-paths that are similar in shape to the through-hole to be processed. The sub-paths have different sizes and are nested sequentially. At least the center point of the outermost sub-path coincides with the center point of the through-hole to be processed, and the size of the outermost sub-path is equal to or slightly smaller than the size of the through-hole to be processed. The processing path for the ceramic layer is a graphic with the same shape and size as the through-hole to be processed, or a graphic with a similar shape but slightly smaller size than the through-hole to be processed. The laser is controlled to process each sub-path sequentially from the inside out along the predetermined PET layer processing path until the ceramic layer is exposed. The laser is controlled to perform laser processing on all the through holes to be processed multiple times along the predetermined ceramic layer processing path. In each cycle, the ceramic layer processing path of all the through holes to be processed is processed in turn in the form of radial scanning until all the through holes are obtained.

2. The method according to claim 1, characterized in that, The outermost sub-path in the PET layer processing path overlaps with the ceramic layer processing path, and the size of both is slightly smaller than the size of the through hole to be processed.

3. The method according to claim 1 or 2, characterized in that, The through hole to be processed is circular. Each sub-path in the PET layer processing path and the ceramic layer processing path are circular and concentric with the through hole to be processed. The outer sub-path in the PET layer processing path coincides with the ceramic layer processing path, and their diameters are slightly smaller than the diameter of the through hole to be processed.

4. The method according to claim 1, characterized in that, The processing path of the PET layer has at least 3 sub-paths, and the path distance between any two sub-paths is the same or the difference between the path distances of different sub-paths is within a set difference range.

5. The method according to claim 1, characterized in that, For a circular through-hole with a diameter of 150µm, the PET layer processing path includes three concentric circular sub-paths with diameters of 60µm, 100µm, and 137µm, respectively. The ceramic layer processing path is a circle with a diameter of 137µm that coincides with the center of the through-hole. A picosecond ultraviolet laser is used.

6. The method according to claim 1, characterized in that, The process of laser processing a single composite ceramic green ceramic sheet includes: S1, fix the green ceramic sheet and make its PET layer face the laser, and process the PET layer of each through hole to be processed in sequence; the process of processing each through hole to be processed is as follows: control the laser to process from the inside to the outside along each sub-path of the PET layer processing path in sequence, process each sub-path to the molten state before processing the next sub-path, until the outermost sub-path is processed to expose the ceramic layer. S2, after all the PET layers of the through holes to be processed on the green ceramic sheet have been processed, control the laser to process the exposed ceramic layers at all the through holes to be processed multiple times along the ceramic layer processing path until the ceramic pillars in all the through holes to be processed can be detached; during each cycle, the laser scans the ceramic layer processing path of all the through holes to be processed in a radial scanning manner.

7. The method according to claim 6, characterized in that, During laser processing, the laser feed distance is 0mm, the scanning speed is 200mm / s, the jump speed is 5000mm / s, the scanning delay is 150ms, the jump delay is 150ms, the light-on delay is 150ms, and the light-off delay is 150ms.

8. The method according to claim 6, characterized in that, Also includes: Before controlling the laser to work, the PET surface is placed facing the laser, and the ceramic surface is adsorbed onto the sample stage by a vacuum stage.

9. The method according to claim 6, characterized in that, Also includes: During laser processing and after obtaining through holes, the debris generated during processing is cleaned up using air sweeping.

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