Display device

Abstract

The application discloses a display device, and belongs to the technical field of display. The display device comprises a display panel, a back plate and a circuit board, and the circuit board comprises a board body and a heating component on the board body. The application sets a first heat radiation reflection layer between the back plate and the circuit board. The first heat radiation reflection layer is separated from the back plate by a first interval, and separated from the circuit board by a second interval. The orthographic projection of the heating component on the back plate is located in the orthographic projection of the first heat radiation reflection layer on the back plate. The first interval and the second interval can avoid the direct contact between the first heat radiation reflection layer and the circuit board and the back plate. The first heat radiation reflection layer can reflect the heat radiation of the heating component, so as to avoid the situation that the temperature of the display panel is too high and the temperature of different areas of the display panel is uneven. The application solves the problem that the display effect of the display device is poor in the prior art, and improves the display effect of the display device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display device. BACKGROUND

[0002] The display device is a device for displaying images and texts.

[0003] A display device includes a display panel, a back plate and a circuit board, the back plate is located at the back of the display panel, the circuit board is located at the side of the back plate away from the display panel, and the circuit board includes a board body and a heating component on the board body which generates heat when powered on.

[0004] However, the heating component of the above-mentioned circuit board will emit a large amount of heat and transfer to the display panel, which will cause the temperature of part of the area of the display panel to rise, and further cause the display effect of the display device to be poor. SUMMARY

[0005] Embodiments of the present application provide a display device, which includes:

[0006] a display panel;

[0007] a back plate, the back plate is located at the back of the display panel;

[0008] a circuit board, the circuit board is located at the side of the back plate away from the display panel, and there is a gap between the circuit board and the back plate, the circuit board includes a board body and a heating component on the board body;

[0009] a first heat radiation reflection layer, the first heat radiation reflection layer is located between the circuit board and the back plate, there is a first gap between the first heat radiation reflection layer and the back plate, there is a second gap between the first heat radiation reflection layer and the circuit board, and the orthographic projection of the heating component of the circuit board on the back plate is located in the orthographic projection of the first heat radiation reflection layer on the back plate.

[0010] Optionally, the display device further includes a first spacer, the first spacer is located between the first heat radiation reflection layer and the back plate, and the first spacer is connected with the first heat radiation reflection layer and the back plate respectively.

[0011] Optionally, the orthographic projection of the first spacer on the back plate is located outside the orthographic projection of the heating component of the circuit board on the back plate.

[0012] Optionally, the number of the first spacers is at least 2, and the orthographic projections of the at least two first spacers on the back plate are respectively located on both sides of the orthographic projection of the first heat radiation reflection layer on the back plate in a first direction, and the first direction is a direction parallel to the back plate.

[0013] Optionally, the first spacer comprises a double-sided foam tape, and the first spacer is bonded to the first heat radiation reflection layer and the back plate respectively.

[0014] Optionally, the display device further comprises a second spacer between the circuit board and the back plate, the second spacer is connected to the circuit board and the back plate respectively, and a thickness of the second spacer in a direction perpendicular to the back plate is greater than a thickness of the first spacer in the direction perpendicular to the back plate.

[0015] Optionally, a number of the second spacers is at least two, and orthographic projections of the at least two second spacers on the back plate are located on two sides of an orthographic projection of the heat generating component on the back plate in a first direction, the first direction being a direction parallel to the back plate.

[0016] Optionally, the display device further comprises a second heat radiation reflection layer on a side of the circuit board close to the back plate, and an orthographic projection of the heat generating component of the circuit board on the back plate is located in an orthographic projection of the second heat radiation reflection layer on the back plate.

[0017] Optionally, a distance between the circuit board and the back plate in a direction perpendicular to the back plate is greater than 3 mm.

[0018] Optionally, the first heat radiation reflection layer comprises a copper leakage, a copper foil or an aluminum foil.

[0019] Optionally, a thickness of the first heat radiation reflection layer ranges from 0.05 mm to 0.2 mm.

[0020] Optionally, the display device further comprises a cover tape covering a side of the circuit board away from the back plate, and at least one edge of the cover tape is connected to the back plate.

[0021] Optionally, the cover tape comprises a wrapping layer and a heat conduction layer in the wrapping layer, an orthographic projection of the heat conduction layer on the back plate is located in an orthographic projection of the wrapping layer on the back plate, and a distance is provided between an edge of the orthographic projection of the heat conduction layer on the back plate and an edge of the orthographic projection of the wrapping layer on the back plate.

[0022] Optionally, the wrapping layer comprises a base layer and a first heat dissipation layer, the heat conduction layer is located between the base layer and the first heat dissipation layer, and the base layer is located on a side of the heat conduction layer close to the circuit board.

[0023] Optionally, the display device further includes a second heat dissipation layer, which is located on the side of the back plate away from the display panel, and the orthographic projection of the second heat dissipation layer on the back plate is located outside the orthographic projection of the circuit board on the back plate.

[0024] The beneficial effects of the technical solutions provided in this application include at least the following:

[0025] By setting a first thermal radiation reflective layer between the back panel and the circuit board, with a first gap between the first thermal radiation reflective layer and the back panel and a second gap between the first thermal radiation reflective layer and the circuit board, and the orthographic projection of the heating component of the circuit board on the back panel being located in the orthographic projection of the first thermal radiation reflective layer on the back panel, the first and second gaps can not only prevent the first thermal radiation reflective layer from directly contacting the circuit board and the back panel, but also prevent the circuit board and the back panel from directly contacting each other. This can limit the heat generated by the heating component from being transferred to the display panel. Furthermore, the first thermal radiation reflective layer can reflect the thermal radiation generated by the heating component, thereby preventing the display panel from overheating and the occurrence of uneven temperature in different areas of the display panel. This solves the problem of poor display effect in related technologies and improves the display effect of the display device. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a top view of the structure of a display device;

[0028] Figure 2 yes Figure 1 A cross-sectional structural schematic diagram of the provided display device;

[0029] Figure 3 yes Figure 1 Another cross-sectional structural diagram of the provided display device;

[0030] Figure 4 This is a top view of a display device provided in an embodiment of this application;

[0031] Figure 5 yes Figure 4 A cross-sectional structural schematic diagram of the provided display device;

[0032] Figure 6 yes Figure 4 A partial structural diagram of the provided display device;

[0033] Figure 7 yes Figure 4 Another schematic diagram of the provided display device structure;

[0034] Figure 8 This is a top view of another display device provided in an embodiment of this application;

[0035] Figure 9 yes Figure 8 A cross-sectional structural schematic diagram of the provided display device;

[0036] Figure 10 yes Figure 8 Another cross-sectional structural diagram of the provided display device;

[0037] Figure 11 This is a schematic diagram of the structure of a covering strip provided in an embodiment of this application;

[0038] Figure 12 yes Figure 9 A schematic diagram of heat transfer on the circuit board in the provided display device;

[0039] Figure 13 This is a schematic diagram of the structure of a backplate provided in an embodiment of this application;

[0040] Figure 14 yes Figure 10 A schematic diagram of heat transfer in the back panel of the provided display device;

[0041] Figure 15 This is a schematic diagram of the structure of a test model provided in an embodiment of this application;

[0042] Figure 16 This is a schematic diagram of another test model provided in an embodiment of this application.

[0043] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0045] Figure 1 A top view of the structure of a display device is provided. Figure 1 The specific heating components are not shown. Figure 1 The heating element shown is the area where the heating element is located, but this is not a limitation. Figure 2 yesFigure 1 A schematic diagram of the cross-sectional structure at point A1-A1. Figure 3 yes Figure 1 Please refer to the cross-sectional structural diagram at B1-B1. Figure 1 , Figure 2 and Figure 3 The display device includes a display panel 11, a back plate 12, and a circuit board 13. The back plate 12 is located behind the display panel 11, which is the opposite side to the front panel. The front panel of the display panel 11 can be the side with the display area. The circuit board 13 is located on the side of the back plate 12 away from the display panel 11, and an adhesive layer 14 is included between the circuit board 13 and the back plate 12, which is bonded to both the circuit board 13 and the back plate 12. The circuit board 13 includes a board body 131 and a heat-generating component 132 located on the board body 131.

[0046] The heating component 132 of the circuit board 13 may include one or more heating devices. These heating devices are electronic components that generate heat when powered on. Different heating devices can perform different functions. For example, heating devices include an electroluminescent chip, a timing control chip, and a display power supply chip. These heating devices generate heat during use. This heat is transferred to the display panel 11, causing some areas of the display panel 11 to become excessively hot, resulting in uneven temperature distribution. This uneven temperature distribution can be the area of ​​the display panel directly opposite the heating component. Furthermore, excessively hot areas of the display panel 11 can accelerate aging, leading to inconsistencies in color and brightness between this area and other areas. This is detrimental to the display effect and lifespan of the display device 10.

[0047] This application provides a display device; please refer to... Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 5 yes Figure 4 A cross-sectional structural diagram at A2-A2 shows that the display device 20 includes a display panel 21.

[0048] The back panel 22 is located on the back of the display panel 21. The back of the display panel 21 is the opposite side to the front. The front of the display panel 21 can be the side with the display area.

[0049] Circuit board 23 is located on the side of back plate 33 away from display panel 21, and there is a gap 21 between circuit board 23 and back plate. Circuit board 23 includes board body 231 and heat generation component 232 located on board body 231.

[0050] The first thermal radiation reflective layer 24 is located between the circuit board 23 and the back plate 22. There is a first gap 251 between the first thermal radiation reflective layer 24 and the back plate 22, and there is a second gap 252 between the first thermal radiation reflective layer 24 and the circuit board 23. The orthographic projection of the heating component 232 of the circuit board 23 on the back plate 22 is located in the orthographic projection of the first thermal radiation reflective layer 24 on the back plate 22.

[0051] It should be noted that the heating component 232 of the circuit board 23 may include multiple heating devices. Figure 4 The specific heating device is not shown. Figure 4 The heating element shown can be an area containing multiple heating devices, but this application is not limited to this. Additionally, the first thermal radiation reflective layer 24 is a structure capable of reflecting thermal radiation.

[0052] In summary, the display device provided in this application provides a first thermal radiation reflective layer between a back panel and a circuit board. This first thermal radiation reflective layer has a first gap with the back panel and a second gap with the circuit board. The projection of the heating element of the circuit board onto the back panel is located within the projection of the first thermal radiation reflective layer onto the back panel. Thus, the first and second gaps not only prevent direct contact between the first thermal radiation reflective layer and the circuit board and back panel, but also prevent direct contact between the circuit board and the back panel. This limits the transfer of heat emitted by the heating element to the display panel. Furthermore, the first thermal radiation reflective layer reflects the thermal radiation generated by the heating element, thereby preventing excessively high display panel temperatures and uneven temperatures in different areas of the display panel. This solves the problem of poor display performance in related technologies and improves the display effect of the display device.

[0053] The display panel in the display device provided in this application embodiment can be an organic light-emitting diode (OLED) display panel, and can be widely used in various electronic products. OLED display panels have flexibility and a more delicate display effect, and the display device provided in this application embodiment can be applied in the aerospace field or various other fields.

[0054] The first interval can be implemented in various ways according to the embodiments of this application. In one exemplary embodiment, the first interval can be implemented using a first spacer. Please refer to [reference needed]. Figure 5The display device 20 further includes a first spacer 261, which is located between the first thermal radiation reflective layer 24 and the back plate 22. The first spacer 261 is connected to both the first thermal radiation reflective layer 24 and the back plate 22. The first spacer 261 can provide support for the first thermal radiation reflective layer 24 to form a first gap 251 between the first thermal radiation reflective layer 24 and the back plate 22. The orthographic projection of the first spacer 261 on the back plate 22 is outside the orthographic projection of the heating element 232 on the display panel 21 of the circuit board 23. That is, the first spacer 261 and the heating element 232 are offset in a direction perpendicular to the back plate 22. This can avoid the problem of the heat of the heating element 232 being transferred to the first spacer 261 too quickly when the orthographic projection of the first spacer 261 on the back plate 22 is inside the orthographic projection of the heating element 232 on the back plate 21, and the first spacer 261 transferring the heat of the heating element 232 to the back plate 22, thereby causing the display panel 21 to have an excessively high and uneven temperature.

[0055] Optionally, the number of the first spacers can be 1. Figure 6 yes Figure 4 A schematic diagram of the structure of a first spacer in the provided display device (to clearly show the structure of the first spacer, Figure 6 The circuit board and the first thermal radiation reflective layer are not shown, but are not limited thereto; Figure 6 The cross-sectional structural diagram at A2-A2 can be shown below. Figure 5 Please refer to the following: Figure 6 , Figure 6 The display device shown includes a first spacer 261, which is shaped similarly to the first thermal radiation reflective layer 24. The shape of the first spacer 261 can be a rectangular frame. The orthographic projection of the first spacer 261 on the back plate 22 surrounds the edge of the orthographic projection of the first thermal radiation reflective layer 24 on the back plate 22. In this way, the first spacer 261 can provide more stable support for the first thermal radiation reflective layer 24 and form a first gap 251.

[0056] The number of the first spacers can be at least two; for example, please refer to [reference needed]. Figure 7 , Figure 7 yes Figure 4 A schematic diagram of another first spacer for the provided display device (to clearly show the structure of the first spacer, Figure 7 The circuit board and the first thermal radiation reflective layer are not shown, but are not limited thereto; Figure 7 The cross-sectional structural diagram at A2-A2 can be shown below. Figure 5 ), Figure 7The display device shown includes two first spacers 261. The orthographic projections of the two first spacers 261 on the back plate 22 are located on both sides of the orthographic projection of the first thermal radiation reflective layer 24 on the back plate 22 in a first direction X, which is parallel to the back plate 22. This allows the first spacers 261 to provide stable support for the first thermal radiation reflective layer 24 and avoids the problem of the back plate 22, the first thermal radiation reflective layer 24 and the first spacers 261 forming a closed first gap 251, which would cause the air temperature between the first gap 251 to be too high. Figure 7 The first direction X shown is parallel to the length direction of the back plate 22. The first direction X can also be parallel to the width direction of the back plate 22; this embodiment does not limit this. Furthermore, the number of first spacers can be related to the number and distribution of heat-generating devices on the circuit board; this embodiment does not limit this.

[0057] The first spacer 261 may include double-sided foam tape. The first spacer 261 is bonded to the first heat radiation reflective layer 24 and the backing plate 22 respectively, so that the first heat radiation reflective layer 24 is more firmly bonded to the backing plate 22 and deformation of the first heat radiation reflective layer 24 is avoided. For example, the double-sided foam tape may be polyacrylate double-sided foam tape (VHB).

[0058] The embodiments of this application can achieve the spacing between the backplane and the circuit board in various ways. In one exemplary embodiment, the spacing between the backplane and the circuit board can be achieved using a second spacer. Please refer to [reference needed]. Figure 5 The display device 20 further includes a second spacer 262 located between the circuit board 23 and the back plate 22. The second spacer 262 is connected to both the circuit board 23 and the back plate 22, and its thickness in the direction perpendicular to the back plate 22 is greater than that of the first spacer 261 in the same direction. The second spacer 262 provides support for the circuit board 23. The greater thickness of the second spacer 262 compared to the first spacer 261 allows the circuit board 23 to be higher than the first thermal radiation reflective layer 24 in the direction perpendicular to the back plate 22, thereby forming a second gap 252 between the circuit board 23 and the first thermal radiation reflective layer 24.

[0059] Optionally, the number of the second spacer can be 1, please refer to [reference needed]. Figure 6 , Figure 6The illustrated display device includes a second spacer 262, which is shaped similarly to the backplate 22. The second spacer 262 can be a rectangular frame. The orthographic projection of the second spacer 261 on the backplate 22 surrounds the edge of the orthographic projection of the circuit board 23 on the backplate 22, and the orthographic projection of the second spacer 262 on the backplate 22 surrounds the orthographic projection of the first spacer 261 on the backplate 22. Thus, the second spacer 262 can provide more stable support for the circuit board 23 and form a gap between the backplate 22 and the circuit board 23, as well as a second gap 252 between the circuit board 23 and the first thermal radiation reflective layer 24.

[0060] The number of second spacers can be at least two; for example, please refer to [reference needed]. Figure 7 , Figure 7 The illustrated display device includes two second spacers 262. The orthographic projections of the two second spacers 262 on the back plate 22 are located on either side of the orthographic projection of the heating element 232 on the back plate 22 in a first direction X, which is parallel to the back plate 22. This avoids the problem of the second spacers 261 directly contacting the plate where the heating element 232 is located, which would transfer the heat radiation of the heating element 232 to the back plate 22, thus preventing the display panel 21 from becoming too hot and uneven. It also avoids the problem of the circuit board 23, the first heat radiation reflective layer 24, and the second spacers 262 forming a closed second gap 252, which would cause the air temperature between the second gap 252 to become too high. In addition, the number of second spacers may be related to the number and distribution of the heating devices on the circuit board, which is not limited in this embodiment.

[0061] The second spacer 262 may include double-sided foam tape, which is bonded to both the circuit board 23 and the backplate 22 to make the circuit board 23 more firmly bonded to the backplate 22. For example, the double-sided foam tape may be polyacrylate double-sided foam tape.

[0062] Optionally, in the direction perpendicular to the backplane, the spacing between the circuit board and the backplane is greater than 3 mm. Please refer to [reference needed]. Figure 5 The distance L between the circuit board 23 and the back plate 22 is greater than 3 mm, meaning the height of the second spacer 262 in the direction perpendicular to the back plate 22 is greater than 3 mm. The larger the distance between the circuit board and the back plate, the larger the first and second gaps become, thus further improving the heat insulation effect against heat generated by the heat-generating devices. Furthermore, the first and second gaps can include air, which has low thermal conductivity; therefore, the first and second gaps can effectively reduce the transfer of heat from the heat-generating devices to the display panel via thermal conduction.

[0063] In this embodiment, the first thermal radiation reflective layer can reflect the thermal radiation generated by the heat-generating device, thereby reducing the heat transferred to the display panel. The first thermal radiation reflective layer can be made of a material with low infrared emissivity and high reflectivity. Please refer to Table 1, which is a reference table of infrared emissivity of some material surfaces. For example, the first thermal radiation reflective layer provided in this embodiment can include polished copper. In addition, the first thermal radiation reflective layer can also include exposed copper, copper foil, or aluminum foil. Optionally, the thickness range of the first thermal radiation reflective layer can be 0.05 mm to 0.2 mm. Within this thickness range, the first thermal radiation reflective layer can ensure a certain reflectivity for the thermal radiation of the heat-generating component, and the first thermal radiation reflective layer will not be too thick, avoiding affecting the overall thickness and weight of the display device.

[0064] Table 1. Reference table of infrared emissivity of some material surfaces.

[0065]

[0066] In this embodiment of the application, the circuit board may include multiple heat-generating components, for example, Figure 8 A top view schematic diagram of a display device including two heating components is provided. Figure 9 yes Figure 8 A schematic diagram of the cross-sectional structure at point A2-A2. Figure 10 yes Figure 8 A schematic diagram of the cross-sectional structure at point B2-B2. Please refer to it. Figure 8 , Figure 9 and Figure 10 The display device 20 includes: a display panel 21; a back plate 22 located behind the display panel 21, the back of which is the opposite side to the front, and the front of which may be the side with a display area; a circuit board 23 located on the side of the back plate 23 away from the display panel 21, with a gap 21 between the circuit board 23 and the back plate; the circuit board 23 includes a board body 231 and two heat-generating components 232 located on the board body 231; and two first thermal radiation reflective layers 24 located between the circuit board 23 and the back plate 22, with two first gaps 251 between the two first thermal radiation reflective layers 24 and the back plate 22, and two second gaps 252 between the two first thermal radiation reflective layers 24 and the circuit board 23; the orthographic projection of the two heat-generating components 232 on the back plate 22 lies within the orthographic projection of the two first thermal radiation reflective layers 24 on the back plate 22.

[0067] The display device 20 further includes four first spacers 261 located between the first thermal radiation reflective layer 24 and the back plate 22. Two of the four first spacers 261 are connected to one of the first thermal radiation reflective layers 24 and the back plate 22, respectively, and the other two are connected to the other first thermal radiation reflective layer 24 and the back plate 22, respectively. Each first spacer 261 corresponds to a connected first thermal radiation reflective layer 24. The first spacers 261 can provide support for the first thermal radiation reflective layer 24 to form a first gap 251 between the first thermal radiation reflective layer 24 and the back plate 22. The orthographic projection of the first spacer 261 on the back plate 22 is outside the orthographic projection of the heating element 232 on the display panel 21 of the circuit board 23. That is, the first spacer 261 and the heating element 232 are offset in a direction perpendicular to the back plate 22. This can avoid the problem of the heat of the heating element 232 being transferred to the first spacer 261 too quickly when the orthographic projection of the first spacer 261 on the back plate 22 is inside the orthographic projection of the heating element 232 on the back plate 21, and the first spacer 261 transferring the heat of the heating element 232 to the back plate 22, thereby causing the display panel 21 to have an excessively high and uneven temperature. The orthographic projection of each pair of first spacers 261 on the back plate 22 is located on both sides of the orthographic projection of the corresponding first thermal radiation reflective layer 24 on the back plate 22 in the first direction X, which is parallel to the back plate 22. This allows the first spacers 261 to provide more stable support for the first thermal radiation reflective layer 24 and avoids the problem of the back plate 22, the first thermal radiation reflective layer 24 and the first spacers 261 forming a closed first gap 251, which would cause the air temperature between the first gap 251 to be too high.

[0068] The display device 20 also includes three second spacers 262 located between the circuit board 23 and the back plate 22. The second spacers 262 are connected to both the circuit board 23 and the back plate 22, and their thickness in the direction perpendicular to the back plate 22 is greater than that of the first spacer 261 in the same direction. The second spacers 262 provide support for the circuit board 23 and form a gap between the back plate and the circuit board. Furthermore, the greater thickness of the second spacers 262 than the first spacers 261 allows the circuit board 23 to be higher than the first thermal radiation reflective layer 24 in the direction perpendicular to the back plate 22, thereby forming a second gap 252 between the circuit board 23 and the first thermal radiation reflective layer 2422. The orthographic projections of the three second spacers 262 on the back plate 22 are respectively located on both sides of the orthographic projection of the circuit board 23 on the back plate 22 in the first direction X, and between the orthographic projections of the two heat-generating components 232 on the back plate 22. The first direction X is a direction parallel to the back plate 22. This can avoid the problem that the heat radiation of the heat-generating components 232 will be transferred to the back plate 22 if the second spacers 262 directly contact the plate in the area where the heat-generating components 232 are located, thus preventing the display panel 21 from having an excessively high and uneven temperature. It can also avoid the problem that the circuit board 23, the first heat radiation reflective layer 24 and the second spacers 262 form a closed second gap 252, which would cause the air temperature between the second gap 252 to be too high.

[0069] Optionally, the display device 20 further includes a second thermal radiation reflective layer 27, which is located on the side of the circuit board 23 near the back plate 22, and the orthographic projection of the heat-generating component 232 of the circuit board 23 on the back plate 22 is located in the orthographic projection of the second thermal radiation reflective layer 27 on the back plate 22. Figure 7 The display device shown includes two second thermal radiation reflective layers 27, for Figure 4 and Figure 5The illustrated device includes a heating element. The number of second thermal radiation reflective layers 27 can be one, and this embodiment is not limited in this respect. The second thermal radiation reflective layer 27 can further reflect the thermal radiation generated by the heating element, thereby reducing the heat transferred to the display panel. Therefore, the second thermal radiation reflective layer 27 can use the same material with low infrared emissivity and high reflectivity as the first thermal radiation reflective layer 26. For example, the second thermal radiation reflective layer can include surface-polished copper. Additionally, the first thermal radiation reflective layer can also include exposed copper, copper foil, or aluminum foil. Optionally, the thickness of the second thermal radiation reflective layer 27 can range from 0.05 mm to 0.2 mm. Within this thickness range, the second thermal radiation reflective layer can ensure a certain reflectivity for the thermal radiation from the heating element, and the second thermal radiation reflective layer will not be too thick. This not only avoids the second thermal radiation reflective layer occupying too much space in the second gap, leading to a decrease in the blocking effect of the second gap on the heat generated by the heating device, but also avoids affecting the overall thickness and weight of the display device.

[0070] In addition, an adhesive layer may be provided between the second thermal radiation reflective layer 27 and the circuit board 23. The adhesive layer is bonded to both the second thermal radiation reflective layer 27 and the circuit board 23. For example, the adhesive layer may be a pressure-sensitive adhesive (PSA) including graphite, wherein graphite has high thermal conductivity. Thus, the adhesive layer can disperse the heat of the heating component 232. According to the thermal conduction characteristics, graphite can reduce the temperature at the highest point and increase the temperature at the lowest point, thereby achieving uniformity of heat transferred to the second thermal radiation reflective layer 27 and preventing excessive local heat.

[0071] In one exemplary embodiment, the display device may further include a cover strip, see reference. Figure 8 , Figure 9 and Figure 10 (To clearly show the structure of the circuit board) Figure 8 (The cover strip is not shown, but is not a limitation thereof). The cover strip 28 covers the side of the circuit board 23 away from the back plate 22, and at least one edge of the cover strip 28 is connected to the back plate 22, so that the cover strip 28 can protect the covered circuit board 23. Figure 11 yes Figure 7 Please refer to the schematic diagram of some structures in the provided display device. Figure 11The cover strip 28 includes a wrapping layer 281 and a thermally conductive layer 282 located within the wrapping layer 281. The orthographic projection of the thermally conductive layer 282 on the back plate 22 lies within the orthographic projection of the wrapping layer 281 on the back plate 22, and there is a gap between the edge of the orthographic projection of the thermally conductive layer 282 on the back plate 22 and the edge of the orthographic projection of the wrapping layer 281 on the back plate 22. That is, the wrapping layer 281 overlaps the back plate 22, the thermally conductive layer 282 is wrapped by the wrapping layer 281, the thermally conductive layer 282 does not extend to the back plate 22, and there is a certain gap between the thermally conductive layer 282 and the back plate 22. This avoids the problem of the thermally conductive layer 282 transferring heat from the heat-generating device 232 to the back plate 22 when the thermally conductive layer 282 is in contact with the back plate 22. The thermally conductive layer 282 may include graphite, which has the advantage of high thermal conductivity. Therefore, the thermally conductive layer 282 can quickly disperse the heat transferred from the circuit board 23 to the cover strip 28, and according to the thermal conduction characteristics, it can prevent excessive local heat.

[0072] Optionally, the encapsulation layer 281 includes a base layer 2811 and a first heat dissipation layer 2812, with a thermally conductive layer 282 located between the base layer 2811 and the first heat dissipation layer 2812, and the base layer 2811 located on the side of the thermally conductive layer 282 closer to the circuit board 23. The base layer 2811 can provide a substrate for the thermally conductive layer 282 and the first heat dissipation layer 2812, which can radiate the heat from the heat-generating device 232 into the environment for heat dissipation. In addition, the base layer 2811 may include a polyester film (mylar), and the first heat dissipation layer 2812 may include a conductive cloth. The material of the conductive cloth may include a black conductive material. The conductive cloth can improve the electromagnetic interference immunity of the display device 20 and prevent unwanted voltages or currents from affecting the circuit board 23.

[0073] Figure 12 Provided Figure 9 The diagram shown illustrates the heat transfer of the circuit board in the display device (for clarity, the structure of the display device is not shown). Figure 12 (Only one heat transfer path of the heating element is shown; the other heating element follows the same path), where the arrows indicate the direction of heat transfer. Heat from the heating element 232 of circuit board 23 is transferred to both the side closer to the back plate 22 and the side farther from the back plate 22. Heat from the side closer to the back plate 22 is effectively reduced after being reflected and blocked by the second thermal radiation reflective layer 27, the second gap 252, the first thermal radiation reflective layer 24, and the first gap 251. Heat from the side farther from the back plate 22 is evenly dispersed by the thermally conductive layer 282 of the cover strip 28 and radiated into the environment through the first heat dissipation layer 2812 of the cover strip 28 for heat dissipation.

[0074] In one exemplary embodiment, the display device may further include other display components, please refer to... Figure 8 , Figure 9 andFigure 10 Other display components include a polarizer 291, optically clear adhesive 292 (OCA), a cover plate 293, connecting lines 294, and a second heat dissipation layer 295. The polarizer 291 is located on the side of the display panel 21 away from the backplate 22, and reduces the reflection of ambient light by the display panel 21. The cover plate 293 is located on the side of the polarizer 291 away from the display panel 21. The cover plate 293 may include a glass cover. Optical adhesive 292 is present between the polarizer 291 and the cover plate 293, and is used to bond the polarizer 291 and the cover plate 293. The optical adhesive 292 is colorless, transparent, and has high light transmittance. One end of the connecting line 294 is bonded to the circuit board 23, and the other end is bonded to the display panel 21, enabling the circuit board 23 to drive the display panel 21. The connection line 294 may include a chip-on-film (COF) film, which is flexible and bendable, thus enabling bonding and connection of the display panel 21 and the circuit board 23 folded to the back of the display panel 21, thereby enabling the display device 20 to achieve a narrow bezel effect.

[0075] Furthermore, the second heat dissipation layer 295 is located on the side of the back plate 22 away from the display panel 21. The second heat dissipation layer 295 can radiate heat transferred from the display panel 21 to the back plate 22 into the environment for heat dissipation. The orthographic projection of the second heat dissipation layer 295 on the back plate 22 is outside the orthographic projection of the circuit board 23 on the back plate 22, thus preventing the second heat dissipation layer 295 from absorbing heat from the circuit board 23. The second heat dissipation layer 295 may include a material with high infrared emissivity; for example, the second heat dissipation layer 295 may include black paint, white paint, and anodized aluminum. Additionally, the thickness of the second heat dissipation layer 295 can range from 0.01 mm to 0.1 mm. Within this thickness range, the second heat dissipation layer 295 can dissipate heat transferred from the display panel 21 to the back plate 22 without being excessively thick, thus avoiding the absorption of heat from other components.

[0076] In this embodiment, the backplate 22 can provide support for the display panel 21, and the backplate 22 can be made of super clean foam (SCF) or aluminum plate. Please refer to... Figure 13 , Figure 13A schematic diagram of a backplate using ultra-clean foam is provided. The backplate includes a grid adhesive 221 (embo), a graphite layer 222, foam 223, and copper foil 224, stacked sequentially away from the display panel. Graphite has high thermal conductivity. Since the display panel 21 itself generates heat, the graphite layer 222 can quickly disperse the heat transferred from the display panel 21 to the backplate 22, preventing excessive localized heat due to its thermal conductivity. The grid adhesive 221 is bonded to both the display panel 21 and the graphite layer 222. The grid adhesive 221 can expel air bubbles generated during the bonding process by squeezing them out through its grid pattern, thus ensuring the flatness of the graphite layer 222. The foam 223 can quickly transfer the heat dispersed by the graphite layer 222 to the copper foil layer 224, which dissipates the heat through natural convection and radiation. Furthermore, the softness of the foam 223 provides protection for the display panel 21. For example, foam 223 may include polyurethane foam, conductive foam, aluminum foil foam, or other foams with high thermal conductivity. Furthermore, copper foil 224 can also serve as electromagnetic shielding and electrostatic discharge.

[0077] Figure 14 Provided Figure 10 The diagram shows the heat transfer of the back panel in the display device. The arrows indicate the direction of heat transfer. The heat generated by the display panel 21 is transferred to the back panel 22. After passing through the graphite layer 222 in the back panel 22, the heat can be evenly dispersed and transferred to the second heat dissipation layer 295. The second heat dissipation layer 295 has a high infrared emissivity, so it can radiate the heat into the environment for heat dissipation. This can reduce the temperature of the display panel 21 and prevent the display device from overheating, which would affect the user experience and service life.

[0078] This application's embodiments compare and test the blocking effects of heat radiation reflective layers and gaps on the heat radiation of circuit boards. Figure 15 This is a schematic diagram of the structure of a test model provided in an embodiment of this application. Figure 16 This is a schematic diagram of another test model provided in an embodiment of this application. Please refer to it. Figure 15 and Figure 16The test model 30 includes a circuit board 31, an intermediate dielectric layer 32, and a temperature testing layer 33. The circuit board 31 includes a board body 311 and a heating element 312 located on the board body 311. The intermediate dielectric layer 32 is located on the side of the board body 311 away from the heating element 312. The temperature testing layer 33 is located on the side of the intermediate dielectric layer 32 away from the circuit board 312. The test model 30 uses the heating element 312 as the heat source and the side C of the temperature testing layer 33 away from the circuit board 31 as the temperature testing surface. The intermediate dielectric layer 32 can be a heat radiation reflective layer or a polyethylene terephthalate (PET) film. The temperature testing layer 33 is a PET film. In the test model provided in this application embodiment, copper foil is used as an exemplary heat radiation reflective layer, but this is not a limitation. Furthermore, Figure 15 In the test model 30 shown, the intermediate dielectric layer 32 is in direct contact with the plate 311; Figure 16 In the test model 30 shown, there is a gap D between the intermediate medium layer 32 and the plate 311 in a direction perpendicular to the plate 311.

[0079] The comparative test includes four groups, where group 1 corresponds to test model 1. Please refer to [link / reference needed]. Figure 15 The intermediate dielectric layer 32 is a PET film, meaning that Group 1 does not use a heat radiation reflective layer and has no gaps. The test temperature of test model 1 on the side C of the temperature test layer 33 away from the circuit board 31 is 41.1℃. Please refer to the test model 2 corresponding to Group 2. Figure 15 The intermediate dielectric layer 32 is copper foil, meaning test model 2 uses a heat radiation reflective layer. However, there is no gap between the heat radiation reflective layer and the circuit board. The test temperature of test model 2 on the side C of the temperature test layer 33 away from the circuit board 31 is 38.2℃. This proves that the heat radiation reflective layer has a blocking effect on the heat generated by the heat-generating devices on the circuit board. The heat radiation reflective layer can reduce the temperature of the film layer on the side of the heat-generating device 312 away from the circuit board 31. Please refer to the test model 3 corresponding to group 3. Figure 16 The intermediate dielectric layer 32 is a PET film, and the spacing D is equal to 7 mm. This means that test model 3 does not use a heat radiation reflective layer. However, there is a gap between the first heat radiation reflective layer and the circuit board. The test temperature of test model 3 on the side C of the temperature test layer 33 away from the circuit board 31 is 39.1℃. This proves that the gap can effectively reduce the heat transfer of the heating device through heat conduction, and that the gap can reduce the temperature of the film layer on the side of the heating device 312 away from the circuit board 31. Please refer to test model 4 for group 4. Figure 16The intermediate dielectric layer 32 is copper foil, and the spacing D is equal to 7 mm. That is, group 4 adopts a heat radiation reflection layer, and there is a gap between the heat radiation reflection layer and the circuit board. The test temperature of the test model 4 on the side C of the temperature test layer 33 away from the circuit board 31 is 28.9℃. This proves that the combination of the heat radiation reflection layer and the gap can further reduce the temperature of the film layer on the side of the heat-generating device 312 away from the circuit board 31.

[0080] The above comparative tests show that the spacing can reduce heat transfer from the heating components, and the heat radiation reflection layer can reflect the heat radiation from the heating components, thereby preventing the temperature of some areas of the display panel directly facing the heating components from becoming too high. This helps to improve the temperature uniformity of the display panel. In addition, the temperature uniformity of the display panel can prevent different aging rates in different areas of the display panel, which helps to improve the uniformity of the display effect in different areas of the display device, thereby increasing the service life of the display device.

[0081] In summary, the display device provided in this application provides a first thermal radiation reflective layer between a back panel and a circuit board. This first thermal radiation reflective layer has a first gap with the back panel and a second gap with the circuit board. The projection of the heating element of the circuit board onto the back panel is located within the projection of the first thermal radiation reflective layer onto the back panel. Thus, the first and second gaps not only prevent direct contact between the first thermal radiation reflective layer and the circuit board and back panel, but also prevent direct contact between the circuit board and the back panel. This limits the transfer of heat emitted by the heating element to the display panel. Furthermore, the first thermal radiation reflective layer reflects the thermal radiation generated by the heating element, thereby preventing excessively high display panel temperatures and uneven temperatures in different areas of the display panel. This solves the problem of poor display performance in related technologies and improves the display effect of the display device.

[0082] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0083] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0084] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display device, characterized in that, The display device includes: Display panel; A back panel, located on the back of the display panel; A circuit board, the circuit board being located on the side of the back panel away from the display panel, and there is a gap between the circuit board and the back panel, the circuit board including a board body and a heat-generating component located on the board body; A first thermal radiation reflective layer is located between the circuit board and the back plate. A first gap exists between the first thermal radiation reflective layer and the back plate, and a second gap exists between the first thermal radiation reflective layer and the circuit board. The orthographic projection of the heating component of the circuit board on the back plate is located in the orthographic projection of the first thermal radiation reflective layer on the back plate.

2. The display device according to claim 1, characterized in that, The display device further includes a first spacer, which is located between the first thermal radiation reflective layer and the back plate, and is connected to both the first thermal radiation reflective layer and the back plate.

3. The display device according to claim 2, characterized in that, The orthographic projection of the first spacer on the back plate is located outside the orthographic projection of the heating element of the circuit board on the back plate.

4. The display device according to claim 3, characterized in that, The number of the first spacers is at least two, and the orthographic projections of at least two of the first spacers on the back panel are respectively located on both sides of the orthographic projection of the first thermal radiation reflective layer on the back panel in a first direction, which is a direction parallel to the back panel.

5. The display device according to claim 2, characterized in that, The first spacer includes double-sided foam tape, and the first spacer is bonded to the first heat radiation reflective layer and the back plate respectively.

6. The display device according to claim 2, characterized in that, The display device further includes a second spacer located between the circuit board and the back plate. The second spacer is connected to both the circuit board and the back plate, and the thickness of the second spacer in the direction perpendicular to the back plate is greater than the thickness of the first spacer in the direction perpendicular to the back plate.

7. The display device according to claim 6, characterized in that, The number of the second spacers is at least two, and the orthographic projections of at least two of the second spacers on the back plate are respectively located on both sides of the orthographic projection of the heating element on the back plate in a first direction, the first direction being a direction parallel to the back plate.

8. The display device according to any one of claims 1 to 7, characterized in that, The display device further includes a second thermal radiation reflective layer, which is located on the side of the circuit board near the back plate. The orthographic projection of the heat-generating component of the circuit board on the back plate is located in the orthographic projection of the second thermal radiation reflective layer on the back plate.

9. The display device according to any one of claims 1 to 7, characterized in that, In a direction perpendicular to the backplate, the distance between the circuit board and the backplate is greater than 3 mm.

10. The display device according to any one of claims 1 to 7, characterized in that, The first thermal radiation reflective layer includes copper foil, copper foil, or aluminum foil.

11. The display device according to any one of claims 1 to 7, characterized in that, The thickness of the first thermal radiation reflective layer ranges from 0.05 mm to 0.2 mm.

12. The display device according to claim 1, characterized in that, The display device further includes a cover strip that covers the side of the circuit board away from the back panel, and at least one edge of the cover strip is connected to the back panel.

13. The display device according to claim 12, characterized in that, The covering strip includes: a wrapping layer and a thermally conductive layer located within the wrapping layer, wherein the orthographic projection of the thermally conductive layer on the back plate is located within the orthographic projection of the wrapping layer on the back plate, and there is a gap between the edge of the orthographic projection of the thermally conductive layer on the back plate and the edge of the orthographic projection of the wrapping layer on the back plate.

14. The display device according to claim 13, characterized in that, The encapsulation layer includes a base layer and a first heat dissipation layer, the thermally conductive layer is located between the base layer and the first heat dissipation layer, and the base layer is located on the side of the thermally conductive layer closer to the circuit board.

15. The display device according to claim 1, characterized in that, The display device further includes a second heat dissipation layer, which is located on the side of the back plate away from the display panel, and the orthographic projection of the second heat dissipation layer on the back plate is located outside the orthographic projection of the circuit board on the back plate.

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