System and method for rotary blow-fill-seal (bfs) machine stage vacuum

Abstract

Systems and methods for changing a typical rotary blow-fill-seal (BFS) machine manufacturing process to implement a phased or staged vacuum application to the BFS mold.

Description

Background Technology

[0001] Blow-fill-seal (BFS) manufacturing is an advanced aseptic manufacturing technology first developed in the 1930s and has been used in the United States since the 1960s to produce various forms of plastic products. More recently, BFS manufacturing technology has been used to produce state-of-the-art pharmaceutical delivery products, such as those from ApiJect in Stamford, Connecticut. TM The products offered by the systems company have many advantages over standard multi-dose glass vials and individual syringes used for drug storage and delivery.

[0002] The basic BFS process includes: (1) vertically extruding plastic resin to form a tube called a preform, (2) joining the preform with a multi-part master die (to form the desired product container), (3) filling the desired product into the formed container through a filling mandrel, (4) joining the preform with a multi-part secondary die (to seal the container; in some cases), and (5) labeling, inspection, packaging, storage, and / or distribution. Currently, there are two different types of BFS machines in use: (i) shuttle machines (e.g., Blow molding / filling / sealing machines, such as Weiler in Elgin, Illinois TM (i) Model 640 manufactured by engineering companies) and (ii) rotary machines (e.g., Bottelpack manufactured by Rommelag Kunststoff-Maschinen Vertriebsgesellschaft GmbH in Wieblingen, Germany) TM bp434 and / or Bottelpack TM (bp460-20). Rotary BFS equipment has a much higher throughput than shuttle equipment, but it also has limitations that shuttle equipment may not have. For example, due to the dynamic movement of mold components in rotary machines, the ability to control certain manufacturing parameters will inevitably be reduced. Attached Figure Description

[0003] The embodiments depicted in the figures are for reference only. Those skilled in the art will readily recognize from the following description that other embodiments of the systems and methods described herein can be employed without departing from the principles set forth herein, wherein:

[0004] Figure 1 This is a block diagram of a rotary blow-fill-seal (BFS) manufacturing system drawn according to certain embodiments;

[0005] Figure 2 This is a side view of a rotary BFS machine mold support, drawn according to certain embodiments; and

[0006] Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E , Figure 3F and Figure 3G This is a continuous side view of a portion of a rotary BFS system according to certain embodiments;

[0007] Figure 4 This is a flowchart of a method according to certain embodiments;

[0008] Figure 5 These are block diagrams of a device according to certain embodiments; and

[0009] Figure 6A , Figure 6B , Figure 6C , Figure 6D and Figure 6E This is a perspective view of an exemplary data storage device according to certain embodiments. Detailed Implementation

[0010] I. introduction

[0011] While rotary blow-fill-seal (BFS) machines offer a significant throughput advantage over other BFS machines, such as shuttle machines, their speed comes at the cost of flexibility in setting up or adjusting various BFS production parameters. In many cases, despite this lack of flexibility, ideal production speeds and quality can still be achieved using rotary BFS machines. However, in certain situations, adjusting the manufacturing settings of a rotary BFS machine can be a factor in determining whether a particular BFS product design can be produced using this machine. One setting where rotary BFS machines lack sufficient adjustability is the application of vacuum to the BFS mold. While vacuum parameters have some degree of adjustability, this is very limited due to the nature of the rotary BFS process. One reason why vacuum parameter adjustments in rotary BFS machines are not readily customizable is that most BFS products are correctly molded under default vacuum settings.

[0012] However, the applicant has recognized that certain BFS products (and corresponding mold geometries) may exhibit various defects under the default vacuum settings of a rotary BFS machine. For example, due to excessive vacuum force and / or due to the duration of such vacuum force application, certain portions of the BFS product may develop wall thicknesses below the desired threshold (e.g., thinner). According to certain embodiments, these and other defects can be mitigated by providing systems and methods for staged (or phased) vacuum application in rotary BFS. For example, in some embodiments, the mold support of the rotary BFS machine is modified to (i) supplement the default or standard vacuum orifice with a sub-vacuum orifice, and / or (ii) reprogram the vacuum application path within the mold support to create multiple vacuum application stages for a particular mold.

[0013] For example, according to some embodiments, a first vacuum orifice, slot, and / or port may provide and / or apply a vacuum to a first portion of the mold (e.g., but limited to the first portion), while a second vacuum orifice, slot, and / or port may provide and / or apply a vacuum to a second portion of the mold (e.g., but limited to the second portion). In this case, multiple (e.g., two or more) time-separated vacuum application stages can be performed on the mold, for example, applying vacuum to selective portions of the mold. In some embodiments, a greater number, shape, and / or size of vacuum orifices, slots, and / or ports may be provided to apply vacuum to multiple different portions of the mold, and / or to apply vacuum in multiple time-separated stages. This capability can provide a similar level of customization for BFS products, which is currently only possible with low-throughput (e.g., shuttle) machines. Therefore, by allowing BFS products to be produced on the staged vacuum rotary BFS machine / system described herein, benefiting from (and / or requiring) specific vacuum settings in different areas of the BFS mold, BFS products can be produced in larger batches in a shorter time than before.

[0014] II. Rotary BFS stage vacuum manufacturing system

[0015] First refer to Figure 1 The figure shows a block diagram of a rotary BFS manufacturing system 100 according to some embodiments. In terms of BFS manufacturing and BFS manufacturing machines and processes, the term "rotary" generally refers to BFS machines and processes in which the preform remains continuous (e.g., without cutting) between cycles / product "cards". Rotary BFS machines are mainly of two types: (i) rotary tables, such as the Bottelpack manufactured by Rommelag Kunststoff-Maschinen Vertriebsgesellschaft GmbH in Weiblingen, Germany. TMThe bp460-20 machine employs a counter-rotating chain that matches the mold half, and (ii) a hybrid machine, such as the Bottelpack manufactured by Rommelag Kunststoff-Maschinen Vertriebsgesellschaft GmbH in Weiblingen, Germany. TM The bp434 machine employs a single-set mating mold half. In some embodiments, the rotary BFS manufacturing system 100 may include a rotary or hybrid machine. For ease of illustration, the rotary BFS manufacturing system 100 is described in the manner of a rotary BFS machine / process.

[0016] For example, a rotary BFS manufacturing system 100 may include a rotary BFS mold system 110, which is configured to dynamically rearrange (e.g., in a rotational manner) multiple corresponding mold halves 112. Although in Figure 1 While not explicitly described in detail, in some embodiments, each set of corresponding mold halves 112 can be configured to form the main part (such as a reservoir structure) of the desired BFS product / container. Figure 1 The mold half 112 (not shown) and secondary parts of the BFS product (such as its neck and / or seals) are formed, for example, in a rotational sequence. The mold half 112 may be carried by and / or connected to a corresponding mold support (not shown separately). In some embodiments, the rotary BFS manufacturing system 100 may include a mold cooling device 114 connected for cooling the rotary BFS mold system 110 (and / or its mold half 112) (e.g., removing heat from it).

[0017] According to some embodiments, mold half 112 may be associated with the product flow ( Figure 1 (Not shown) joining, for example, a preform extruded and / or formed by the preform system 120 of the rotary BFS manufacturing system 100 ( Figure 1 (Not shown in the text) to form BFS products ( Figure 1 (Not shown separately). According to some embodiments, the rotary BFS manufacturing system 100 may include a product source 130, such as a liquid product reservoir that supplies filling products (e.g., pharmaceuticals such as vaccines) to a product cooling device 134. In some embodiments, the filling product may be supplied from the product cooling device 134 to (or via) a filling mandrel array 140. For example, the filling mandrel array 140 may include a plurality of filling needles or mandrels 142 that automatically engage with the rotary BFS mold system 110 to fill the molded BFS product before sealing.

[0018] In some embodiments, the filling mandrel array 140 (and / or its mandrel 142) may be connected to a mandrel cooling device 144. For example, the mandrel cooling device 144 may be connected to provide cooling (e.g., heat removal) to the filling mandrel array 140 (and / or its mandrel 142). In some embodiments, the rotary BFS manufacturing system 100 may include a vacuum device 150, for example, connected to and in communication with the rotary BFS mold system 110. While the BFS manufacturing process is generally referred to as, for example, “blow-fill-seal,” the BFS product process may utilize blowing and / or vacuum to engage the preform with the cavity (not shown separately) of the mating mold half 112. The vacuum device 150 may include a vacuum pump, vacuum tubing, connectors, hoses, and / or fittings, etc., connected to selectively apply a vacuum force to the mold half 112 of the rotary BFS mold system 110 (e.g., draw preform material into the cavity).

[0019] The rotary BFS manufacturing system 100 may include fewer or more components 110, 112, 114, 120, 130, 134, 140, 142, 144, 150 and / or various configurations of the described components 110, 112, 114, 120, 130, 134, 140, 142, 144, 150 without departing from the scope of the embodiments described herein. In some embodiments, components 110, 112, 114, 120, 130, 134, 140, 142, 144, 150 with similar configurations and / or functions may be similar to components with similar names and / or numbering as described herein. In some embodiments, the rotary BFS manufacturing system 100 (and / or portions thereof) may include a turntable or hybrid rotary BFS machine, system, and / or platform that is programmed and / or otherwise configured to perform (e.g., via a computerized controller device; not shown), conduct, and / or advance the methods described herein, as herein. Figure 4 The rotary BFS staged vacuum method 400 or a part thereof.

[0020] refer to Figure 2The figure shows a side view of a rotary BFS machine mold support 212 designed according to certain embodiments. While the term "mold support" is used for convenience and ease of description, in some embodiments, the mold support 212 may comprise only a mold half and / or a combination of mold halves and the mold support (e.g., incorporating elements typically used as both a mold support and a mold half – e.g., a one-piece or integral design). In some embodiments, the mold support 212 may include a mold support end body 212-1 through which bushing holes 212-2 and / or screw / bolt holes 212-3 may pass. As shown, the bushing holes 212-2 and screw / bolt holes 212-3 may pass laterally through the mold support end body 212-1 (e.g., from right to left as shown). In some embodiments, the mold support 212 may include and / or define a standard or main vacuum port 252. In a typical BFS mold support (not shown), vacuum can be applied simultaneously to all areas of the mold half through the main vacuum port 252. In a typical rotary BFS mold support system, such as Figure 2 As shown, according to some embodiments, the main vacuum hole 252 is arranged along the vertical axis below the screw / bolt hole 212-3 and has a first diameter "D1".

[0021] According to some embodiments, the mold support 212 may include a secondary or "rear" vacuum hole 254 disposed in and / or defined by the mold support end body 212-1. As shown, the rear vacuum hole 254 may include a second diameter "D2" and may be disposed between the screw / bolt hole 212-3 and the bushing hole 212-2. In some embodiments, the second diameter "D2" may be smaller than the first diameter "D1". In some embodiments, the mold support 212 may include a secondary or "rear" vacuum groove 256 communicating with the rear vacuum hole 254. According to some embodiments, the rear vacuum groove 256 may include a width "W". The rear vacuum groove 256 may be centered along the axis of the main vacuum hole 252 or offset from the axis of the main vacuum hole 252. The width "W" may be equal to the first diameter "D1", or smaller (as shown) or larger than the first diameter "D1". In some embodiments, the width "W" may be greater than the second diameter "D2", and / or the rear vacuum hole 254 may be disposed within the rear vacuum groove 256, and / or aligned or offset along the axial center (as shown) to coincide with the rear vacuum groove 256. According to some embodiments, the presence of the rear vacuum hole 254 and / or the rear vacuum groove 256 allows for the effective arrangement of different levels of vacuum in different parts of the rotary BFS injection molding process.

[0022] For example, in some embodiments, each of the main vacuum port 252 and the rear vacuum port 254 may communicate with one or more vacuum channels (not shown) within the mold support 212, such as those communicating with different portions of the mold half (e.g., different cavities and / or sections; not shown). According to some embodiments, the main vacuum port 252 may communicate with a first internal vacuum channel that provides vacuum to a first portion of the mold half, while the rear vacuum port 254 may communicate with a second internal vacuum channel that provides vacuum to a second portion of the mold half. In some embodiments, the rear vacuum groove 256 may not extend into the mold support 212 in the same way as the rear vacuum port 254. For example, the rear vacuum groove 256 may extend from the mold support end body 212-1 and / or surface to a first depth (not shown) of the mold support, while the rear vacuum port 254 extends deeper into (and / or through) the mold support 212, providing communication between the rear vacuum groove 256 and the second portion of the mold half. For example, in this case, the rear vacuum groove 256 may not extend to a position deep enough to interfere with or intersect with the screw / bolt hole 212-3.

[0023] The mold support 212 may include fewer or more components 212-1, 212-2, 212-3, 252, 254, 256 and / or various configurations of said components 212-1, 212-2, 212-3, 252, 254, 256 without departing from the scope of the embodiments described herein. In some embodiments, the configuration and / or function of components 212-1, 212-2, 212-3, 252, 254, 256 may be similar to components with similar naming and / or numbering as described herein. In some embodiments, the mold support 212 may include part of a rotary or hybrid rotary BFS machine, system, and / or platform that is programmed and / or otherwise configured to perform (e.g., via a computerized controller device; not shown), conduct, and / or advance the methods described herein, as described herein. Figure 4 The rotary BFS staged vacuum method 400 or a part thereof.

[0024] Now for reference Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E , Figure 3F and Figure 3GThe figure is a continuous side view of a portion of a rotary BFS system 300 according to certain embodiments. For example, the continuous side view shows how the operation of a portion of the rotary BFS system 300 enables vacuum-stage engagement with mating pairs of mold supports (and / or mold halves) 312-La, 312-Lb, 312-Ra, 312-Rb. First refer to... Figure 3A The figure describes a portion of the rotary BFS system 300 at a first time point. While the first pair of mold supports / mold halves 312-La, 312-Ra and the second pair of mold supports / mold halves 312-Lb, 312-Rb are depicted according to a rotary BFS machine, a hybrid rotary BFS machine configuration may also be used without departing from the scope of certain embodiments. Therefore, the movement arrows for the mold supports / mold halves 312-La, 312-Lb, 312-Ra, 312-Rb in the figure are for reference only and may vary when using different configurations of the rotary BFS system 300.

[0025] In some embodiments, the first pair of mold supports / mold halves 312-La, 312-Ra may include a first left mold support 312-La and a first right mold support 312-Ra. According to some embodiments, each first mold support 312-La, 312-Ra may include primary vacuum holes 352-L, 352-R, secondary (or "rear") vacuum holes 354-L, 354-R, and / or secondary (or "rear") vacuum grooves 356-L, 356-R. For example, as shown, each primary vacuum hole 352-L, 352-R may be located near a lower inner corner of its respective first mold support 312-La, 312-Ra. According to some embodiments, the primary vacuum holes 352-L, 352-R may communicate with a first region "A" of the mold half / cavity (not shown separately). In some embodiments, each secondary vacuum hole 354-L, 354-R may be vertically offset from and / or arranged above the corresponding primary vacuum holes 352-L, 352-R of the respective first mold supports 312-La, 312-Ra. According to some embodiments, the secondary vacuum holes 354-L, 354-R may communicate with the second region "B" of the mold half / cavity.

[0026] According to some embodiments, a portion of the rotary BFS system 300 may include a vacuum slider 360 connected to provide (or apply) a vacuum to first mold supports 312-La, 312-Ra (and ultimately connected to a second pair of mold supports 312-Lb, 312-Rb, as they cycle to meet). For example, the vacuum slider 360 may include one or more vacuum ports 362-L, 362-R communicating with one or more vacuum slots 364-L, 364-R. In some embodiments, the vacuum slider 360 may include symmetrical and / or mirrored vacuum ports 362-L, 362-R and / or vacuum slots 364-L, 364-R, wherein the left vacuum port 362-L and the left vacuum slot 364-L selectively provide a vacuum to the first left mold support 312-La, while the right vacuum port 362-R and the right vacuum slot 364-R selectively provide a vacuum to the first right mold support 312-Ra. As shown in the figure, in some embodiments, a vacuum can be applied to the facing surface of the vacuum slider 360 through vacuum ports 362-L and 362-R, and guided to the opposite surface (hidden surface) through vacuum grooves 364-L and 364-R. Therefore, as Figure 3A As shown, at the first time point, the vacuum has not yet been applied to the first mold support 312-La, 312-Ra or their respective first and second regions “A” and “B”.

[0027] Reference Figure 3B The diagram depicts a portion of the rotary BFS system 300 at a second time point, where the first mold supports 312-La, 312-Ra proceed to the point of vacuum application slightly prior to the point of circulation. For example, as shown, the angled portions 366-L, 366-R of the vacuum tanks 364-L, 364-R are already (e.g., by the movement of the first mold supports 312-La, 312-Ra) near the main vacuum holes 352-L, 352-R, but are not yet in communication with them. With the movement of the first mold supports 312-La, 312-Ra, reference... Figure 3C In the portion of the rotary BFS system 300 at the third time point, the main vacuum holes 352-L, 352-R communicate with the angled portions 366-L, 366-R of the vacuum tanks 364-L, 364-R, and a vacuum has been accordingly applied / supplied to the first mold supports 312-La, 312-Ra and / or the first region "A" of the mold half. For example, a "first stage" or period of vacuum may be applied to the mold half / cavity portion placed within the first region "A". According to certain embodiments, such as Figure 3C As shown, the second region "B" of the mold half / cavity is not yet connected to the vacuum source provided by the vacuum slider 360 (e.g., at the third time point).

[0028] In some embodiments, the length and / or geometry of the vacuum chambers 364-L, 364-R (e.g., and / or their angled portions 366-L, 366-R) can be configured to adjust the application time of each vacuum stage. For example, as Figure 3C As shown, the first stage vacuum is selectively applied at the third time point of the rotating BFS cycle (actually starting slightly before the third time point and immediately after the second time point, since the vacuum channels 364-L, 364-R first communicate with the main vacuum holes 352-L, 352-R; this time point is not shown), which includes the time point before the first mold supports 312-La, 312-Ra and / or the mold halves close / contact. For example, in this configuration, the preform (not shown) can begin to be drawn into the mold half cavity in the first region "A" before the mold halves are mated / closed. The time interval between applying the first stage vacuum and the mold half closure can be configured according to the selected geometry of the vacuum channels 364-L, 364-R and / or their corner portions 366-L, 366-R. For example, the longer the designed length of the corner portions 366-L, 366-R, the longer the time length from the start of the first stage vacuum to the mold half closure.

[0029] According to certain embodiments, and with reference to Figure 3D The figure depicts a portion of a rotary BFS system 300 at a fourth time point, where the first mold supports 312-La, 312-Ra and / or their mold halves have been engaged and / or closed. A first-stage vacuum continues to be applied to the first region "A" through the main vacuum orifices 352-L, 352-R, while the second region "B" remains unvacuumed. For example, as shown, the angled portions 366-L, 366-R of the vacuum grooves 364-L, 364-R have been (e.g., by movement of the first mold supports 312-La, 312-Ra) positioned near, but not yet connected to, the secondary vacuum grooves 356-L, 356-R. As the movement of the first mold supports 312-La, 312-Ra continues (now primarily vertically downward, as the mold is horizontally closed), and referring to… Figure 3E In the portion of the rotary BFS system 300 described at the fifth time point, the sub-vacuum channels 356-L and 356-R are in communication with the angled portions 366-L and 366-R of the vacuum channels 364-L and 364-R, and a vacuum has been accordingly applied / supplied to the second region "B" of the first mold supports 312-La and 312-Ra and / or its mold half (e.g., through the channel between the sub-vacuum channels 356-L and 356-R and the sub-vacuum holes 354-L and 354-R). For example, a "second stage," "post-stage," or period of vacuum may be applied to the mold half / cavity portion located within the second region "B."

[0030] In some embodiments, the length and / or geometry of vacuum chambers 364-L, 364-R (e.g., and / or their angled portions 366-L, 366-R) and / or sub-vacuum chambers 356-L, 356-R can be configured to adjust the application time of the second or subsequent stage vacuum. For example, as Figure 3E As shown, at the fifth time point during the rotational BFS cycle (which includes the time delayed from the fourth time point), a second / post-stage vacuum is selectively applied based on the movement speed of the first mold supports 312-La, 312-Ra, the geometry of the vacuum tanks 364-L, 364-R (and / or their angled portions 366-L, 366-R), and the geometry (e.g., length) of the sub-vacuum tanks 356-L, 356-R. The length ratio of the sub-vacuum tanks 356-L, 356-R... Figure 3E In the short embodiments described herein, for example, the time between the start of the first stage vacuum and the start of the second / later stage vacuum can be longer.

[0031] According to certain embodiments, and with reference to Figure 3F (The rotary BFS system 300 at the sixth time point is described therein), as the closed first mold supports 312-La, 312-Ra and / or their mold halves continue to circulate (e.g., during the BFS product being filled with medical fluid; not shown in the figure), the vacuum of both stages can continue to be applied to regions “A” and “B”. In some embodiments, such as the turntable arrangement example described in the section on the rotary BFS system 300, the second mold supports 312-Lb, 312-Rb can begin to move inward / close, advancing toward the vacuum slider 360. As the first mold supports 312-La, 312-Ra (and the second mold supports 312-Lb, 312-Rb) move, refer to Figure 3G At the seventh time point, in the portion of the rotary BFS system 300, the main vacuum orifices 352-L and 352-R have disengaged from the vacuum tanks 364-L and 364-R, and the first stage vacuum ends accordingly (e.g., vacuum is no longer applied to the first region "A"). At the seventh time point, the second / post-stage vacuum continues to be applied, but as the communication between the secondary vacuum orifices 354-L and 354-R and the secondary vacuum tanks 356-L and 356-R and the vacuum tanks 364-L and 364-R nears its end, the second / post-stage vacuum is nearing its end. Also at the seventh time point, the second mold supports 312-Lb and 312-Rb continue to advance in their cycle and gradually approach the angled portions 366-L and 366-R of the vacuum tanks 364-L and 364-R, which will later (not shown) provide vacuum to the second mold supports 312-Lb and 312-Rb.

[0032] In some embodiments, the length and / or geometry of the vacuum grooves 364-L, 364-R (e.g., and / or their angled portions 366-L, 366-R) can be configured to adjust the time between applying the vacuum stage to the first mold support 312-La, 312-Ra and applying the vacuum stage to the second mold support 312-Lb, 312-Rb. If it is desired to end the application of a second-stage / post-stage vacuum to the first mold supports 312-La, 312-Ra before the first-stage vacuum is applied to the second mold supports 312-Lb, 312-Rb, for example, the length of the vacuum grooves 364-L, 364-R (e.g., and / or their angled portions 366-L, 366-R) can be configured to ensure that the secondary vacuum holes 354-L, 354-R and the secondary vacuum grooves 356-L, 356-R are removed from communication with the vacuum grooves 364-L, 364-R before the vacuum grooves 364-L, 364-R (e.g., and / or their angled portions 366-L, 366-R) begin to provide / apply vacuum to the second mold supports 312-Lb, 312-Rb. According to certain embodiments, for example, the second region "B" of the first mold supports 312-La, 312-Ra forms a first part of the BFS product, and the first region "A" (not shown) of the second mold supports 312-Lb, 312-Rb forms a second part of the same BFS product. It is preferable to continue to apply a second / post-stage vacuum to the second region "B" of the first mold supports 312-La, 312-Ra, so that it at least partially overlaps with the start time of the first stage vacuum provided to the first region "A" of the second mold supports 312-Lb, 312-Rb, for example, to maintain a constant vacuum throughout the formation process of a single BFS product (or a single set of BFS products formed together). In these embodiments, the length of the vacuum grooves 364-L, 364-R (and / or their angled portions 366-L, 366-R) can be configured to be long enough that, depending on the geometry / size of the first mold support members 312-La, 312-Ra and the second mold support members 312-Lb, 312-Rb, the vacuum grooves 364-L, 364-R can extend to communicate simultaneously with the two sub-vacuum holes 354-L, 354-R (and / or sub-vacuum grooves 356-L, 356-R) and the vacuum component (not labeled) of the second mold support members 312-Lb, 312-Rb.

[0033] According to some embodiments, vacuum orifices 352-L, 352-R, 352-L, 352-R and / or grooves 356-L, 356-R of varying numbers, shapes and / or sizes can be provided to apply vacuum to multiple different parts of the mold (e.g., regions "A" and / or "B") and / or to apply such vacuum in multiple stages. This capability allows for the customization of BFS product manufacturing, which is currently only possible (if any) with low-throughput shuttle machines. Therefore, by allowing the manufacture of BFS products on a BFS machine (not fully shown) that includes a portion of the rotary BFS system 300 as shown in the figure, BFS products that are advantageous and / or require specific vacuum settings for different areas of the BFS mold can be produced in a much shorter time than before.

[0034] Fewer or more components 312-La, 312-Lb, 312-Ra, 312-Rb, 352-L, 252-R, 354-L, 354-R, 356-L, 356-R, 360, 362-L, 362-R, 364-L, 364-R, 366-L, 366-R and / or said components 312-La, 312-Lb, 312-Ra, 352-L, 252- Various configurations of R, 354-L, 354-R, 356-L, 356-R, 312-Rb, 352-L, 252-R, 354-L, 354-R, 356-L, 356-R, 360, 362-L, 362-R, 364-L, 364-R, 366-L, 366-R may be included in portions of the rotating BFS system 300 without departing from the scope of the embodiments described herein. In some embodiments, components 312-La, 312-Lb, 312-Ra, 312-Rb, 352-L, 252-R, 354-L, 354-R, 356-L, 356-R, 360, 362-L, 362-R, 364-L, 364-R, 366-L, and 366-R may be similar in configuration and / or function to components with similar naming and / or numbering as described herein. In some embodiments, a portion 300 of the rotary BFS system 300 may include a portion of a rotary or hybrid rotary BFS machine, system, and / or platform that is programmed and / or otherwise configured to perform (e.g., via a computerized controller device; not shown), conduct, and / or advance the methods described herein, as described herein. Figure 4 The rotary BFS staged vacuum method 400 or a part thereof.

[0035] III. Rotary BFS stage vacuum manufacturing method

[0036] Please refer to the following: Figure 4The figure shows a flowchart of method 400 according to certain embodiments. In some embodiments, method 400 may be executed and / or implemented by one or more dedicated and / or specially programmed computing devices, computer terminals, computer servers, computer systems and / or networks and / or any combination thereof (e.g., one or more multi-threaded and / or multi-core processing units of a rotary BFS manufacturing system). In some embodiments, method 400 may be embodied, facilitated and / or otherwise associated with various input mechanisms and / or interfaces.

[0037] The process diagrams and flowcharts described herein do not necessarily imply a fixed order for any described actions, steps, and / or procedures. Unless otherwise specified, embodiments can generally be performed in any feasible order. While the order of operations, steps, and / or procedures described herein is generally not fixed, in some embodiments, operations, steps, and / or procedures may be specifically performed in the listed, described, and / or described order, and / or may be performed in response to any previously listed, described, and / or described operations, steps, and / or procedures. Any processes and methods described herein can be performed and / or facilitated by hardware, software (including microcode), firmware, or any combination thereof. For example, storage media such as hard disks, random access memory (RAM) devices, cache memory devices, universal serial bus (USB) mass storage devices, and / or digital video disks (DVDs); such as Figure 5 , Figure 6A , Figure 6B , Figure 6C , Figure 6D and / or Figure 6E The memory / data storage devices 540, 640a-e) in the document can store instructions that, when executed by a machine (such as a computer processor), can produce the performance of any one or more embodiments described herein.

[0038] In some embodiments, method 400 may include applying a vacuum (e.g., a first, primary, or "pre-" vacuum stage or phase) to a first vacuum port of the BFS mold at 402 (e.g., at a first time point). For example, a vacuum slider, hose, port, and / or device or system may selectively apply and / or provide a vacuum to the first vacuum port of the BFS mold (and / or its half) via connection, engagement, and / or communication between the vacuum device and the first vacuum port. In some embodiments, communication may be established via movement of the mold (and / or its half), movement of the vacuum device (such as a vacuum slider), and / or operation of switches, solenoid valves, valves, etc. According to some embodiments, the vacuum device may include vacuum holes, ports, slots, recesses, and / or channels of fixed size and / or fixed position, which are positioned in and / or move along a known path of movement of the BFS mold. The vacuum device may be configured with geometry such as holes / slots to work in conjunction with the BFS mold moving along a predetermined path, for example, to provide a vacuum for a predetermined time during a mold movement cycle.

[0039] According to some embodiments, method 400 may include applying a vacuum (e.g., a first stage) to a first portion of the BFS mold at 404 (e.g., at a first time point). For example, the mold and / or mold supports associated therewith may be configured to communicate a first vacuum port with a first portion of the mold region, cavity, feature, etc. In some embodiments, the first portion (or half) of the mold may communicate with the first vacuum port, while one or more second portions of the mold may not communicate with the first vacuum port. According to some embodiments, the first and second portions of the mold may be separated and / or isolated from each other, such that a vacuum may be applied to one portion while a vacuum may not be applied to the other.

[0040] In some embodiments, method 400 may include applying a vacuum (e.g., a second, secondary, or "post" vacuum stage or phase) to a second vacuum port of the BFS mold at 406 (e.g., at a second time point). For example, a vacuum slider, hose, port, and / or device or system may selectively apply and / or provide a vacuum to the second vacuum port of the BFS mold (and / or a half thereof) through connection, engagement, and / or communication between the vacuum device and the second vacuum port. In some embodiments, communication may be established by movement of the mold (and / or half), movement of a vacuum device (such as a vacuum slider), and / or operation of switches, solenoid valves, valves, etc. According to some embodiments, the vacuum device may include vacuum holes, ports, slots, recesses, and / or channels of fixed size and / or fixed position, which are positioned in and / or move along a known path of movement of the BFS mold. The vacuum device may be configured with geometry such as holes / slots to work in conjunction with the BFS mold moving along a predetermined path, for example, to provide a vacuum for a predetermined time during a mold movement cycle.

[0041] According to some embodiments, method 400 may include applying a vacuum (e.g., a second stage) to a second portion of the BFS mold at 408 (e.g., at a second time point). For example, the mold and / or mold supports associated therewith may be configured to communicate a second vacuum port with a second portion of the mold region, cavity, feature, etc. In some embodiments, the second portion (or half) of the mold may communicate with the second vacuum port, while one or more remaining portions of the mold (e.g., the first portion) may not communicate with the first vacuum port. According to some embodiments, multiple portions of the mold may be separable and / or isolated from each other, such that one portion can withstand vacuum forces while another portion does not.

[0042] In some embodiments, method 400 may include removing a first stage vacuum (e.g., at a third time point) from a first vacuum port of the BFS mold at 410. For example, a vacuum slider, hose, port, and / or device or system may selectively refuse and / or remove vacuum from the first vacuum port of the BFS mold (and / or a half thereof) because communication between the vacuum device and the first vacuum port is not connected, not paired, and / or removed or interrupted. In some embodiments, communication may be removed by movement of the mold (and / or mold half), movement of the vacuum device (e.g., a vacuum slider), and / or operation of switches, solenoid valves, valves, etc. According to some embodiments, the vacuum device may be configured with a hole / groove / etc. geometry to cooperate with the BFS mold moving along a predetermined path to remove the first stage vacuum at predetermined times within a mold movement cycle. According to some embodiments, method 400 may include removing the vacuum (e.g., the first stage) from a first portion of the BFS mold (e.g., at a third time point) at 412. When the first vacuum port is connected to the first part of the mold area, cavity, features, etc., removing the vacuum from the first vacuum port can correspondingly remove or reject the first stage vacuum from the first part (or half of the mold).

[0043] According to some embodiments, method 400 may include a second stage (e.g., at a fourth time point) at 414 removing vacuum from a second vacuum port of the BFS mold. For example, a vacuum slider, hose, port, and / or device or system may selectively reject and / or remove vacuum from the second vacuum port of the BFS mold (and / or a half thereof) because communication between the vacuum device and the second vacuum port is not connected, not paired, and / or removed or interrupted. In some embodiments, communication may be removed by movement of the mold (and / or mold half), movement of the vacuum device (e.g., a vacuum slider), and / or operation of switches, solenoid valves, valves, etc. According to some embodiments, the vacuum device may be configured with a hole / groove / etc. geometry to cooperate with the BFS mold moving along a predetermined path to remove the second stage of vacuum at a predetermined time during a mold movement cycle. According to some embodiments, method 400 may include removing vacuum (e.g., the second stage) from a second portion of the BFS mold at 416 (e.g., at a fourth time point). When the second vacuum port communicates with the second part of the mold area, cavity, features, etc., removing the vacuum from the second vacuum port can correspondingly remove or reject the vacuum from the second part (or half of the mold) in the second stage.

[0044] Although two distinct phases or periods for applying and removing vacuum have been described, in some embodiments, additional phases and / or periods may be applied or alternatively applied, for example, by utilizing additional vacuum ports, slots, recesses, channels, etc. According to some embodiments, different vacuum phases or periods may include different levels of vacuum applied and / or achieved. For example, a first phase may apply a first-level vacuum to the mold, while a second phase may apply a second-level vacuum higher or lower than the first phase.

[0045] IV. Rotary BFS staged vacuum manufacturing equipment and the products manufactured therefrom

[0046] Go to Figure 5 The figure shows a block diagram of device 510 according to some embodiments. In some embodiments, device 510 may include a rotary BFS manufacturing apparatus or system, etc. For example, device 510 may perform, process, or facilitate Figure 4The method 400 and / or parts thereof, and / or otherwise associated therewith. In some embodiments, device 510 may include processing device 512, communication device 514, input device 516, output device 518, interface 520, storage device 540 (storing various programs and / or instructions 542 and data 544), vacuum device 550, cooling device 560, and / or BFS product 570. According to some embodiments, any or all components 512, 514, 516, 518, 520, 540, 542, 544, 550, 560, 570 of device 510 may be similar in configuration and / or function to any similarly named and / or numbered components described herein. Fewer or more components 512, 514, 516, 518, 520, 540, 542, 544, 550, 560, 570 and / or various configurations of components 512, 514, 516, 518, 520, 540, 542, 544, 550, 560, 570 may be included in device 510 without departing from the scope of the embodiments described herein.

[0047] According to some embodiments, processor 512 may be or include any known processor type, number, and / or configuration. Processor 512 may include, for example... IXP2800 network processor or with E7501 chipset connected XEON TM Processor. In some embodiments, processor 512 may include a plurality of interconnected processors, microprocessors, and / or microengines. According to some embodiments, processor 512 (and / or device 510 and / or other components) may be powered by a power source (not shown), such as a battery, AC power supply, DC power supply, AC / DC adapter, solar cell, and / or inertial generator. In the case where device 510 includes a manufacturing server, the necessary power may be provided through a standard (or high-ampere and / or high-voltage) AC outlet, power socket, surge protector, and / or uninterruptible power supply (UPS) device.

[0048] In some embodiments, the communication device 514 may include any type or configuration of communication device known or feasible. For example, the communication device 514 may include a network interface card (NIC), telephone equipment, cellular network equipment, router, hub, modem, and / or communication port or cable. According to some embodiments, the communication device 514 may also be connected to or alternatively connected to the processor 512. In some embodiments, the communication device 514 may include infrared, radio frequency, or Bluetooth communication technologies. TM Near Field Communication (NFC) and / or connection to Network devices, whose connections facilitate the interaction between processor 512 and another device ( Figure 5Communication between (not shown separately in the text).

[0049] In some embodiments, input device 516 and / or output device 518 are communicatively connected to processor 512 (e.g., via wired and / or wireless connections and / or paths), and they may typically include known input and output components and / or devices of any type or configuration. For example, input device 516 may include a keyboard, allowing an operator of device 510 (e.g., manufacturing maintenance and / or control personnel) to interact with device 510. In some embodiments, input device 516 may include sensors, such as temperature sensors, flow sensors, cameras, sound, light, radar, radio frequency and / or proximity sensors, configured to measure and / or record numerical values ​​by sending signals to device 510 and / or processor 512. According to some embodiments, output device 518 may include a display screen and / or other feasible output components and / or devices. For example, output device 518 may provide an interface (such as interface 520) through which staged vacuum rotary BFS manufacturing functionality is provided. According to some embodiments, input device 516 and / or output device 518 may include and / or be embodied in a single device, such as a touchscreen display.

[0050] Storage device 540 may include any suitable information storage device known or available, including but not limited to units and / or combinations of magnetic storage devices (such as hard disk drives), optical storage devices, and / or semiconductor storage devices such as RAM devices, read-only memory (ROM) devices, single data rate random access memory (SDR-RAM), dual data rate random access memory (DDR-RAM), and / or programmable read-only memory (PROM). According to some embodiments, storage device 540 may store one or more of operation instructions 542-1, interface instructions 542-2, temperature data 544-1, and / or vacuum data 544-2. In some embodiments, processor 512 may utilize operation instructions 542-1, interface instructions 542-2, temperature data 544-1, and / or vacuum data 544-2 to provide output information via output device 518 and / or communication device 514.

[0051] According to some embodiments, operation instructions 542-1 can be used to cause processor 512 to process temperature data 544-1 and / or vacuum data 544-2 according to the embodiments described herein. For example, temperature data 544-1 and / or vacuum data 544-2 received via input device 516 and / or communication device 514 can be analyzed, sorted, filtered, decoded, decompressed, sorted, scored, plotted, and / or otherwise processed by processor 512 according to operation instructions 542-1. In some embodiments, temperature data 544-1 and / or vacuum data 544-2 can be input by processor 512 according to operation instructions 542-1 via one or more mathematical and / or statistical formulas and / or models to cause device 510 to produce BFS product 570 using the rotary BFS staged vacuum application process described herein.

[0052] According to some embodiments, interface instructions 542-5 can be used to cause processor 512 to process temperature data 544-1 and / or vacuum data 544-2 according to the embodiments described herein. For example, temperature data 544-1 and / or vacuum data 544-2 received via input device 516 and / or communication device 514 can be analyzed, sorted, filtered, decoded, decompressed, ranked, plotted, and / or otherwise processed by processor 512 according to interface instructions 542-5. In some embodiments, temperature data 544-1 and / or vacuum data 544-2 can be input by processor 512 according to interface instructions 542-5 via one or more mathematical and / or statistical formulas and / or models to generate an interface that allows the operator of device 510 to provide input and receive output for performing the rotary BFS staged vacuum manufacturing described herein (e.g., via a graphical user interface (GUI)).

[0053] In some embodiments, device 510 may include vacuum device 550. For example, vacuum device 550 may include any type and / or configuration of means that can supply vacuum to device 510 (e.g., its BFS mold assembly); Figure 5 Vacuum (e.g., vacuum force) is applied and / or provided to the device 510 (not shown separately). According to some embodiments, vacuum device 550 may include vacuum sliders, vacuum ports, pipes, slots, channels, holes and / or connectors that can selectively apply multiple time-separated vacuum stages to device 510.

[0054] According to some embodiments, device 510 may include a cooling device 560. According to some embodiments, cooling device 560 may be (physical, thermal, and / or electrical) connected to processor 512 and / or storage device 540. For example, cooling device 560 may include a fan, heat sink, heat pipe, radiator, cold plate, and / or other cooling components or devices or combinations thereof, configured to remove heat from portions or components of device 510.

[0055] In some embodiments, device 510 may include BFS product 570. For example, BFS product 570 may include one or more BFS containers, vials, bottles, ampoules, and / or other devices or articles manufactured using the rotary BFS staged vacuum process described herein. According to some embodiments, BFS product 570 may include one or more BFS containers, vials, bottles, ampoules, and / or other devices or articles manufactured (e.g., formed and filled) using the rotary BFS staged vacuum process described herein.

[0056] Any or all exemplary instructions and data types described herein, as well as other feasible data types, can be stored in any known or known number, type, and / or configuration of storage devices. For example, storage device 540 may include one or more data tables or files, databases, tablespaces, registers, and / or other storage structures. In some embodiments, multiple databases and / or storage structures (and / or multiple storage devices 540) may be utilized to store information associated with device 510. According to some embodiments, storage device 540 may be integrated into and / or otherwise connected to device 510 (e.g., as shown), or may simply be utilized by device 510 (e.g., located externally and / or in a specific location).

[0057] Reference Figure 6A , Figure 6B , Figure 6C , Figure 6D and Figure 6E The image shows a perspective view of an exemplary data storage device 640a-e according to certain embodiments. For example, the data storage device 640a-e can be used to store instructions and / or data, such as operation instructions 542-1, interface instructions 542-2, temperature data 544-1, and / or vacuum data 544-2, wherein each instruction and / or data will be referenced to... Figure 5 This will be demonstrated. In some embodiments, instructions stored on data storage devices 640a-e, when executed by a processor, may lead to the implementation and / or facilitate the present document. Figure 4 Method 400 and / or parts thereof.

[0058] According to some embodiments, the first data storage device 640a may include one or more internal and / or external hard disk drives of various types. For example, the first data storage device 640a may include a data storage medium 646 that can be read, queried, and / or otherwise communicatively connected to / or via a disk read device 648. In some embodiments, the first data storage device 640a and / or the data storage medium 646 may be configured to store information using one or more magnetic, inductive, and / or optical means (e.g., magnetic, inductive, and / or optical encoding). The data storage medium 646, such as described as the first data storage medium 646a (e.g., section “A”), may include one or more of a polymer layer 646a-1, a magnetic data storage layer 646a-2, a non-magnetic layer 646a-3, a magnetic substrate layer 646a-4, a contact layer 646a-5, and / or a substrate layer 646a-6. According to some embodiments, a magnetic read head 648a may be connected and / or configured to read data from the magnetic data storage layer 646a-2.

[0059] In some embodiments, the data storage medium 646 (described as a second data storage medium 646b) (e.g., with an open cross-section "B") may include, for example, a plurality of data points 646b-2 arranged together with the second data storage medium 646b. In some embodiments, the data points 646b-2 may be read by and / or otherwise connected by a laser-driven read head 648b, which is configured and / or connected to guide a laser beam through the second data storage medium 646b.

[0060] In some embodiments, the second data storage device 640b may include a CD, CD-ROM, DVD, Blu-ray, etc. TM Disc and / or other types of optically encoded disks and / or other known or feasible storage media. In some embodiments, the third data storage device 640c may include a USB messaging terminal, a software protector, and / or other known or feasible flash memory data storage devices. In some embodiments, the fourth data storage device 640d may include any type, quantity, and / or configuration of RAM that is feasible and / or desirable. In some embodiments, the fourth data storage device 640d may include an off-chip cache, such as a Level 2 (L2) cache storage device. According to some embodiments, the fifth data storage device 640e may include an on-chip memory device, such as a Level 1 (L1) cache storage device.

[0061] Figure 6A , Figure 6B , Figure 6C , Figure 6D and Figure 6EThe data storage devices 640a-e described herein are representative of a class and / or group of computer-readable media as defined herein as "computer-readable storage" (e.g., a non-temporary storage device as opposed to a transmission device or medium). Data storage devices 640a-e typically store program instructions, algorithms, software engines, code, and / or modules that, when executed by a processing device, cause a particular machine to operate according to one or more embodiments described herein.

[0062] V. Interpretation rules

[0063] Throughout this description, unless otherwise stated, the following terms may include and / or contain the example meanings provided. These terms and example meanings are provided to clarify the language used to describe embodiments in the specification and appended claims, and are therefore not intended to be generally limiting. While not generally limiting, and not limiting all described embodiments, in some embodiments, terms are specifically limited to the example definitions and / or examples provided. Other terms are defined herein.

[0064] Neither the title (listed at the beginning of the first page of this patent application) nor the abstract (listed at the end of this patent application) shall limit the scope of the disclosed invention in any way. The section headings provided in this patent application are for convenience only and shall not be construed as limiting the disclosure in any way.

[0065] All definitions defined and used herein should be understood as those defined in dictionaries, in referenced documents, and / or in their ordinary meaning. The terminology and expressions used herein are descriptive and not restrictive, and in using these terms and expressions, no equivalents of the features shown and described (or portions thereof) are intended to be excluded, and it is recognized that various modifications may be made within the scope of the claims. Therefore, the claims are intended to cover all such equivalents.

[0066] The indefinite articles “a” and “an” used in the specification and claims herein shall be understood as “at least one” or “one or more” unless there is an explicit opposite meaning.

[0067] The phrase “and / or” as used herein in the specification and claims should be understood as “any one or two” of elements that are combined in such a way that they appear together in some cases but not in others. In addition to the elements expressly indicated by the “and / or” clause, other elements may be optionally present, whether related to or unrelated to the expressly indicated elements, unless expressly stated to the contrary.

[0068] When ordinal numbers (such as “first,” “second,” “third,” etc.) are used as adjectives preceding a term, the ordinal number (unless otherwise explicitly stated) is used only to indicate a particular characteristic, such as distinguishing that particular characteristic from another characteristic described by the same or similar terms. For example, “first component” can be named to distinguish it from “second component.” Therefore, the use of the ordinal numbers “first” and “second” only before the word “component” does not indicate any other relationship between the two components, nor any other characteristic of one or both components. For example, the use of the ordinal numbers “first” and “second” only before the word “component” (1) does not indicate that either component is preceding or following any other component in order or position; (2) does not indicate that either component occurs or acts before or after any other component in time; (3) does not indicate that either component is superior or inferior to any other component in importance or quality. Furthermore, the use of ordinal numbers alone does not define numerical restrictions on the characteristics identified by the ordinal number. For example, the use of the ordinal numbers “first” and “second” only before the word “component” does not indicate that there must be no more than two components.

[0069] Unless otherwise expressly stated, the list of items (which may or may not be numbered) does not imply that any or all items are mutually exclusive. For example, a list of “computers, laptops, PDAs” does not mean that any or all three items in the list are mutually exclusive, nor does it mean that any or all three items in the list are a combination of any category.

[0070] Some of the implementations described herein relate to "user equipment" or "network equipment." The terms "user equipment" and "network equipment" are used interchangeably as used herein and generally refer to any device that can communicate via a network. Examples of users or network equipment include personal computers, workstations, servers, printers, scanners, fax machines, copiers, personal digital assistants (PDAs), storage devices (such as disk drives), hubs, routers, switches and modems, video game consoles, or cordless phones. Users and network equipment may include one or more communication or network components. As used herein, "user" generally refers to any individual and / or entity operating a user equipment. Users may include customers, consumers, product underwriters, product distributors, customer service representatives, agents, brokers, etc.

[0071] As used herein, the term "network component" can refer to user equipment or network equipment, or a component, part, section, or combination of user equipment or network equipment. Examples of network components may include static random access memory (SRAM) devices or modules, network processors, and network communication paths, connections, ports, or cables.

[0072] Furthermore, some implementations also relate to a “network” or “communication network.” The terms “network” and “communication network” as used herein are used interchangeably and can refer to any object, entity, component, device, and / or any combination thereof that permits, facilitates, and / or otherwise enables the transmission of information, data packets, signals, and / or other forms of information between and / or within one or more network devices. A network can be or comprises multiple interconnected network devices. In some implementations, a network can be hardwired, wireless, virtual, neural, and / or any other known type of configuration. For example, a communication network may include one or more networks that conform to the Fast Ethernet LAN transmission standard published by the Institute of Electrical and Electronics Engineers (IEEE). Configure the network. In some embodiments, the network may include one or more wired and / or wireless networks operating according to known or feasible communication standards or protocols.

[0073] The terms “information” and “data” as used herein are used interchangeably and can refer to any data, text, voice, video, image, message, bit, data packet, pulse, tone, waveform, and / or other type or configuration of signal and / or information. For example, information may include packets transmitted in accordance with the Internet Protocol Version 6 (IPv6) standard as defined in RFC 1883 (December 1995), “Internet Protocol Version 6 (IPv6) Specification,” published by the Internet Engineering Task Force (IETF) Networking Working Group, S. Deering et al. According to some embodiments, information may be compressed, encoded, encrypted, and / or otherwise packaged or processed using any known or feasible method.

[0074] Furthermore, certain embodiments described herein relate to the term "instruction." The term "instruction" as used herein can be used to refer to any indicator and / or other information that indicates, or is associated with, a subject, article, entity, and / or other object and / or idea. The phrases "instruction information" and "instruction symbol" as used herein can be used to refer to any information that represents, describes, and / or otherwise associates with a relevant entity, subject, or object. For example, an information indicator may include codes, references, links, signals, identifiers, and / or any combination thereof and / or any other information representation associated with information. In some embodiments, an information indicator (or a marker of information) may be or include the information itself and / or any part or component of the information. In some embodiments, an instruction may include a request, solicitation, broadcast, and / or any other form of information collection and / or dissemination.

[0075] In this document, the term "program" or "computer program" may refer to one or more formatted algorithms that are executed by a computer. The term "module" or "software module" refers to any number of algorithms and / or programs written to achieve a specific output and / or output target—for example, a "login authentication" module (or program) may provide functionality that allows a user to log in to computer software and / or hardware resources, and / or a "transportation" module (or program) may be programmed to transport goods through known and / or available transportation companies and / or services (such as...). The transportation of goods is initiated electronically. The term "engine" or "software engine" refers to any combination of software modules and / or algorithms that operate on one or more inputs to define one or more outputs in a continuous, periodic, repetitive, and / or cyclical manner. For example, data transformation scripts and / or algorithms that query data from a data source, transform the data, and load the transformed data into a target data repository can be called "data transformation engines" because they iteratively operate on each row of data repeatedly to produce the desired result.

[0076] Numerous embodiments are described in this patent application for reference only. The described embodiments are not, and are not intended to be, limiting in any sense. The invention disclosed herein is broadly applicable to numerous embodiments, as will be readily apparent from the disclosure. Those skilled in the art will recognize that the disclosed invention can be implemented with various modifications and variations, such as structural, logical, software, and electrical modifications. Although specific features of the disclosed invention may be described with reference to one or more particular embodiments and / or drawings, it should be understood that, unless expressly stated otherwise, these features are not limited to use in the one or more particular embodiments or drawings referenced.

[0077] Unless otherwise explicitly stated, devices that communicate with each other do not need to communicate continuously. Instead, these devices only need to transfer data to each other when necessary or required, and in fact, they do not need to exchange data most of the time. For example, a machine communicating with another machine via the Internet may not transfer data to the other machine for several weeks. Furthermore, devices that communicate with each other can communicate directly or indirectly through one or more intermediaries.

[0078] The description of embodiments having multiple components or functions does not imply the need for all or even any of these components and / or functions. Rather, various optional components are described to illustrate different possible embodiments of the invention. Unless otherwise expressly stated, any component and / or function is essential or necessary.

[0079] Furthermore, although process steps, algorithms, and the like can be described sequentially, these processes can be configured to operate in different orders. In other words, any order or sequence of steps that may be explicitly described does not necessarily imply that these steps must be performed in that order. The process steps described herein can be performed in any actual order. Additionally, some steps, although described or implied to be non-simultaneous (e.g., because one step is described after another), may be performed simultaneously. Moreover, illustrating a process in drawings does not imply that the illustrated process does not include other variations and modifications thereof, nor does it imply that the illustrated process or any of its steps are necessary for the invention, nor does it imply that the illustrated process is preferred.

[0080] "Determine" can be done in many ways, so the word "determine" (and similar terms) includes counting, calculating, deducing, looking up (e.g. in tables, databases, or data structures), determining, etc.

[0081] It is evident that the various methods and algorithms described herein can be implemented by a suitably and / or specially programmed computer and / or computing device. Typically, a processor (such as one or more microprocessors) receives instructions from memory or similar devices and executes these instructions to perform one or more flows defined by those instructions. Furthermore, programs implementing these methods and algorithms can be stored and transmitted in various ways using a variety of media (such as computer-readable media). In some embodiments, hardwired circuitry or custom hardware may be used in place of, or in combination with, software instructions to implement the flows of various embodiments. Therefore, the implementation is not limited to any particular combination of hardware and software.

[0082] "Processor" generally refers to any one or more microprocessors, CPU devices, computing devices, microcontrollers, digital signal processors, or similar devices, as further described herein.

[0083] The term "computer-readable medium" refers to any medium that participates in providing data (such as instructions or other information) and can be read by a computer, processor, or similar device. Such media can take many forms, including but not limited to non-volatile media, volatile media, and transmission media. For example, non-volatile media include optical discs or magnetic disks and other persistent storage. Volatile media include DRAM, which typically constitutes main memory. Transmission media include coaxial cables, copper wires, and optical fibers, including wires that form the system bus connected to the processor. Transmission media may include or transmit sound waves, light waves, and electromagnetic radiation, such as electromagnetic radiation generated during radio frequency and infrared data communications. Common forms of computer-readable media include floppy disks, floppy disks, hard disks, magnetic tape, any other magnetic media, CD-ROMs, DVDs, any other optical media, punched cards, paper tape, any other physical media with perforated patterns, RAM, PROMs, EPROMs, FLASH-EEPROMs, any other memory chips or cassette tapes, carrier waves, or any other computer-readable media.

[0084] The term "computer-readable storage" generally refers to a subset and / or category of computer-readable media, excluding transmission media such as waveforms, carrier waves, electromagnetic radiation, etc. Computer-readable storage typically includes physical media that store data (such as instructions or other information), such as optical discs or magnetic disks and other persistent storage, DRAM, floppy disks, flexible disks, hard disks, magnetic tape, any other magnetic media, CD-ROMs, DVDs, any other optical media, punched cards, paper tape, any other physical media with perforated patterns, RAM, PROMs, EPROMs, FLASH-EEPROMs, any other memory chips or cassette tapes, computer hard disks, backup tapes, Universal Serial Bus (USB) storage devices, etc.

[0085] Various forms of computer-readable media can transmit data to a processor, including sequences of instructions. For example, sequences of instructions (i) can be transferred from RAM to the processor, (ii) can be transmitted via wireless transmission media, and / or (iii) can be transmitted according to various formats, standards, or protocols (such as Bluetooth). TM Format (TDMA, CDMA, 3G).

[0086] In describing databases, those skilled in the art will understand that: (i) other database structures may be used at any time besides the database structure described; and (ii) other storage structures may be used at any time besides databases. Any illustrations or descriptions of example databases provided herein are illustrative arrangements of information storage representation. Any other arrangement may be used besides the arrangement suggested by tables in drawings or elsewhere. Similarly, any illustrated entries for a database represent exemplary information only; those skilled in the art will understand that the number and content of entries may differ from those described herein. Furthermore, although databases are described as tabular, other formats (including relational databases, object-based models, and / or distributed databases) may also be used to store and process the data types described herein. Similarly, object methods or behaviors of databases may be used to implement various processes as described herein. Furthermore, databases may also be stored locally or remotely from devices accessing database data in known manners.

[0087] This invention can be configured to operate in a network environment, which includes a computer communicating with one or more devices via a communication network. The computer can communicate directly or indirectly with the devices via wired or wireless media, such as the Internet, local area network, wide area network, Ethernet, token ring, or any suitable communication means or combination thereof. Each device may include a computer, for example, based on… Or Swift TM Computers with processors that can communicate with each other. Any number and type of machines can communicate with computers.

[0088] This disclosure provides an illustration of several embodiments and / or inventions that will be apparent to those skilled in the art. Some of these embodiments and / or inventions may not be claimed in this application but may be claimed in one or more continuation applications that claim priority to this application. The applicant intends to file further applications to patent the subject matter disclosed and enabled in this application but not claimed.

[0089] It is understood that various modifications can be made to the embodiments of this disclosure without departing from the scope of this disclosure. Therefore, the above description should not be construed as limiting the content of this disclosure, but merely as embodiments thereof. Those skilled in the art will contemplate other modifications within the scope defined by the appended claims.

Claims

1. A rotary BFS manufacturing system, comprising: BFS mold, which includes two mating mold halves, each mold half defining multiple vacuum chambers; A mold support connected to each mold half, each mold support including (i) a first vacuum port communicating with a first subset of the plurality of vacuum cavities of the corresponding mold half and (ii) a second vacuum port communicating with a second subset of the plurality of vacuum cavities of the corresponding mold half; as well as A vacuum slider connected to a mold support includes two vacuum slots, each operable to engage (i) a first vacuum port of the corresponding mold support at a first time point of a rotating BFS cycle, and (i) a second vacuum port of the corresponding mold support at a second time point of a rotating BFS cycle.

2. The rotary BFS manufacturing system of claim 1, wherein the second vacuum port of each corresponding mold half is offset perpendicularly from the first vacuum port of each corresponding mold half.

3. The rotary BFS manufacturing system according to claim 1, wherein the second vacuum port of each corresponding mold half includes a vacuum hole located within a vacuum tank.

4. The rotary BFS manufacturing system according to claim 1, further comprising: A controller device that communicates with the mold support components; as well as A non-temporary storage device that communicates with the controller device, which stores instructions that, when executed by the controller device, cause: According to the rotational BFS cycle, the mold support moves along the turntable path, where the movement results in the following sequence: (i) At the first time point of the rotating BFS cycle, the vacuum tank engages with the first vacuum port of the corresponding mold support; as well as (ii) At the second time point of the rotating BFS cycle, the vacuum tank engages with the second vacuum port of the corresponding mold support.

5. The rotary BFS manufacturing system according to claim 4, further comprising: A mold positioning system that communicates with a controller device, the mold positioning system being connected to at least one of a BFS mold and a corresponding mold support, and operable to selectively change the vertical position of at least one half of the mold and the corresponding mold support according to the turntable path.

6. The rotary BFS manufacturing system according to claim 4, further comprising: The preform head is connected to the plastic resin supply device and can be operated to produce plastic preforms. The preform head communicates with the controller device. as well as A filling mandrel installed inside the preform head and communicating with the controller device.

7. The rotary BFS manufacturing system of claim 6, wherein the instructions, when executed by the controller device, further cause: By closing the BFS mold, the plastic preforms are joined together to form at least one BFS product; Position the filling mandrel to fill at least one BFS product; Filling a fluid product with at least one BFS product via a filling mandrel; and Seal at least one BFS product.

8. A rotary BFS staged vacuum manufacturing method, comprising: Initiate a rotary BFS forming cycle, in which the matching BFS mold half moves and engages with the preform to form the BFS product; Molded BFS products, through: (i) At the first time point, a first-stage vacuum is applied to the first vacuum port of the rotary BFS mold support connected to each BFS mold half; (ii) After the first time point, move the BFS mold half from the first position of the rotating BFS forming cycle to the second position; as well as (iii) At the second time point, the second stage of vacuum is applied to the second vacuum port of the rotating BFS mold support connected to each BFS mold half; Filling the finished BFS product with the drug; and BFS products that are sealed and filled.

9. The method of claim 8, further comprising: The second BFS product is formed by: (i) At the third time point, the first stage vacuum is applied to the first vacuum port of the rotating BFS mold support connected to each BFS mold half; (ii) After the third time point, move the BFS mold half from the first position of the rotating BFS molding cycle to the second position; as well as (iii) At the fourth time point, the second stage of vacuum is applied to the second vacuum port of the rotating BFS mold support connected to each BFS mold half; Filling the formed second BFS product with the drug; and The second BFS product is sealed, molded, and filled.

10. The method of claim 9, wherein, according to the rotary BFS forming cycle, the preform is not cut between the formed BFS product and the formed second BFS product.

11. The method of claim 9, wherein the molding of the second BFS product is performed by a mating second BFS mold half.

12. The method of claim 8, wherein the first and second stages of vacuum are performed by engaging a BFS mold half with a vacuum slider in a fixed position, the vacuum slider defining two mating vacuum grooves.

13. The method of claim 8, wherein the first vacuum port communicates with the first cavity of the mating BFS mold half.

14. The method of claim 8, wherein the second vacuum port communicates with the second cavity of the mating BFS mold half.

15. The method of claim 8, wherein the molding further comprises: (iv) At the third time point, the first stage of vacuum removal is performed from the first vacuum port of the rotating BFS mold support connected to each BFS mold half; as well as (v) At the fourth time point, the second stage of vacuum is removed from the second vacuum port of the rotating BFS mold support connected to each BFS mold half.

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