A glue brushing mechanism for LED packaging based on COB technology
By designing a glue-applying mechanism based on COB technology, and utilizing structures such as clamps, push rods, and pull rods to achieve accurate positioning and self-locking of LED boards, the problem of difficult removal of glue from the glue applicator is solved, improving operational efficiency and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING INST OF TECH
- Filing Date
- 2022-04-25
- Publication Date
- 2026-06-16
AI Technical Summary
Because the mounting holes of commonly used glue applicators are designed to fit the size of LED boards, it is inconvenient to remove the LED boards after the glue application is completed. Carelessness may result in touching uncured glue, causing the glue application to fail.
A glue-applying mechanism for LED packaging based on COB technology was designed, including a base, a bracket, a vertical moving stage, and a horizontal moving box. It is equipped with a placement slot and a circular box. Through clamps, push rods, pull rods, and fixing mechanisms, the LED board can be accurately positioned and self-locked, making it easy to pick up.
It achieves accurate positioning and self-locking of LED boards, is easy to operate, improves work efficiency, avoids damage to the adhesive during handling, and ensures a smooth adhesive application process.
Smart Images

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