A glue brushing mechanism for LED packaging based on COB technology

Abstract

The application discloses a glue brushing mechanism for LED packaging based on COB technology and relates to the technical field of LED packaging devices. The glue brushing mechanism for LED packaging based on COB technology comprises a base, the upper surface of the base is fixedly connected with a support, the surface of the support is provided with a transverse moving box, the upper surface of the base is provided with a longitudinal moving table, the upper portion of the longitudinal moving table is provided with a placing table, the front face of the transverse moving box is fixedly connected with a rubber tube through a clamp, the upper surface of the placing table is respectively provided with two groups of placing grooves, the inner wall of the placing groove is movably connected with a round box, the side face of the placing table is provided with a horizontal groove, and the inner wall of the horizontal groove is movably connected with the surface of a horizontal plate. The glue brushing mechanism solves the problem that the commonly used glue brushing machine is not convenient to take out the LED plate after the glue brushing is completed because the size of the placing hole is matched with the size of the LED plate, the uncured glue is possibly touched by mistake, and the glue brushing is failed.

Description

Technical Field

[0001] This invention relates to the field of LED packaging equipment technology, specifically to a glue-applying mechanism for LED packaging based on COB technology. Background Technology

[0002] COB technology is an emerging LED packaging technology. Unlike traditional SMD surface-mount packaging, it integrates the light-emitting chips onto the PCB board instead of soldering them one by one. COB effectively improves the light emission color of LED displays, reduces risks, and lowers costs. COB is a new product developed by combining die-bonding and SMD precise dispensing technology. COB full-color packaging first covers the silicon wafer placement points on the substrate surface with thermally conductive epoxy resin (usually epoxy resin with silver particles). Then, the silicon wafer is directly placed on the substrate surface and heat-treated until it is firmly fixed to the substrate. Finally, an electrical connection is directly established between the silicon wafer and the substrate using wire bonding.

[0003] In the LED dispensing process, a dispensing machine is usually used for applying glue. The longitudinal guide rail of the dispensing machine base can move back and forth longitudinally, and the dispensing tube is installed on the transverse guide rail frame, so that the LED board placed on the base can be glued evenly and quickly. There are two sets of placement holes on the left and right sides on the placement platform on the longitudinal guide rail. The LED board is placed in the slot and can be positioned for glue application. Because the placement holes of commonly used dispensing machines are matched with the size of the LED board, it is inconvenient to remove the LED board after the glue application is completed. If you are not careful, you may touch the uncured glue, which will lead to glue application failure. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a glue application mechanism for LED packaging based on COB technology. This solves the problem that common glue applicators, due to the size of the placement hole matching the LED board, make it inconvenient to remove the LED board after glue application, and the risk of accidentally touching uncured glue, leading to glue application failure.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a glue application mechanism for LED packaging based on COB technology, comprising a base, a bracket fixedly connected to the upper surface of the base, a transverse moving box disposed on the surface of the bracket, a longitudinal moving stage disposed on the upper surface of the base, a placement stage disposed above the longitudinal moving stage, a glue tube fixedly connected to the front of the transverse moving box by a clamp, two sets of placement slots respectively opened on the upper surface of the placement stage, a circular box movably connected to the inner wall of the placement slot, a transverse groove opened on the side of the placement stage, the inner wall of the transverse groove movably connected to the surface of a horizontal plate, a connecting plate fixedly connected to the bottom of the circular box, the bottom of the connecting plate fixedly connected to the upper surface of the horizontal plate, a material discharge mechanism disposed inside the circular box, and a fixing mechanism disposed between the horizontal plate and the circular box.

[0006] Furthermore, the discharge mechanism includes a top plate, a circular groove is formed at the bottom of the inner wall of the circular box, the inner wall of the circular groove is movably connected to the surface of the top plate, a T-shaped groove is formed at the bottom of the inner wall of the circular groove, a push rod is fixedly connected to the lower surface of the top plate, the surface of the push rod is movably connected to the inner wall of the T-shaped groove, the inner wall of the T-shaped groove is movably connected to the surface of the push rod, one end of the push rod is movably connected to the bottom of the push rod, the other end of the push rod movably passes through the T-shaped groove and extends to the side of the placement platform, a first limiting groove is formed at the inner wall of the T-shaped groove, a first fixing ring is fixedly sleeved on the surface of the push rod, the surface of the first fixing ring is movably connected to the inner wall of the first limiting groove, a first spring is movably sleeved on the surface of the push rod, one end of the first spring is fixedly connected to the inner wall of the first limiting groove, the other end of the first spring is fixedly connected to the surface of the first fixing ring, and baffles are fixedly connected to the left and right sides of the inner wall of the bracket corresponding to the push rod positions.

[0007] Further, the fixing mechanism includes a locking rod, a fixing rod is fixedly connected to the inner wall of the placement groove away from the support, a serrated groove is formed on the lower surface of the fixing rod, a positioning groove is formed on the side of the round box corresponding to the position of the fixing rod, the inner wall of the positioning groove is movably connected to the surface of the fixing rod, a second limiting groove is formed at the bottom of the inner wall of the positioning groove, the interior of the second limiting groove is connected to the interior of the transverse groove, the inner wall of the second limiting groove is movably connected to the surface of the locking rod, the top of the locking rod movably passes through the second limiting groove and is movably connected to the inner wall of the serrated groove, and a second fixing ring is fixedly sleeved on the surface of the locking rod. The surface of the second fixed ring is movably connected to the inner wall of the second limiting groove. A second spring is movably sleeved on the surface of the locking rod. One end of the second spring is fixedly connected to the surface of the second fixed ring, and the other end of the second spring is fixedly connected to the inner wall of the second limiting groove. A rectangular groove is formed in the inner wall of the second limiting groove. The inner wall of the rectangular groove is movably connected to the surface of the pull rod. The end of the pull rod away from the second limiting groove moves through the rectangular groove and extends to the side of the horizontal plate. A triangular block is fixedly connected to the lower surface of the pull rod. A through groove is formed in the side of the locking rod. The inner walls of the triangular block and the pull rod are movably connected to the inner wall of the through groove.

[0008] Furthermore, the top of the lever is beveled and conforms to the shape of the inner wall of the serrated groove.

[0009] Furthermore, the top of the push rod and the contact surface of the push rod are both inclined surfaces.

[0010] Furthermore, a ball bearing is movably embedded at the end of the push rod away from the top rod.

[0011] Furthermore, a handle is fixedly connected to the upper surface of the pull rod.

[0012] Furthermore, a guide rod is fixedly connected to the lower surface of the top plate, and a guide hole is provided at the bottom of the inner wall of the circular groove. The inner wall of the guide hole is movably connected to the surface of the guide rod.

[0013] Furthermore, the pull rods on one side of the placement platform are all fixedly connected by connecting rods.

[0014] The present invention has the following beneficial effects:

[0015] This COB-based LED encapsulation glue application mechanism facilitates accurate glue application by determining the position of the round box and the LED board. It features self-locking, convenient operation, and high efficiency. The LED board is secured by the top round box for easy access, preventing damage to the glue due to limited space. When applying glue to LED boards that haven't yet been glued, the low friction between the ball bearings and the baffle allows for smoother movement of the placement platform. The connecting rod allows for simultaneous movement of the pull rod on one side, further enhancing convenience. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a glue-applying mechanism for LED packaging based on COB technology according to the present invention.

[0017] Figure 2 This invention relates to a glue application mechanism for LED packaging based on COB technology. Figure 1 Enlarged view of the central placement platform;

[0018] Figure 3 This invention relates to a glue application mechanism for LED packaging based on COB technology. Figure 2 Enlarged view of the structure at point A in the middle;

[0019] Figure 4 This is a top view of a glue-applying mechanism for LED packaging based on COB technology according to the present invention.

[0020] Figure 5 This invention relates to a glue application mechanism for LED packaging based on COB technology. Figure 4 Enlarged view of the structure at point B in the middle;

[0021] Figure 6 This is a left cross-sectional view of the connecting plate of the adhesive application mechanism for LED packaging based on COB technology according to the present invention.

[0022] Figure 7 This invention relates to a glue application mechanism for LED packaging based on COB technology. Figure 6 Enlarged view of the structure at point C.

[0023] In the diagram, 1. Base; 2. Bracket; 3. Horizontal moving box; 4. Vertical moving table; 5. Placement table; 6. Rubber tube; 7. Placement slot; 8. Round box; 9. Horizontal slot; 10. Horizontal plate; 11. Connecting plate; 12. Discharge mechanism; 1201. Top plate; 1202. Round slot; 1203. T-slot; 1204. Top rod; 1205. Push rod; 1206. First limiting slot; 1207. First fixing ring; 1208. First spring; 1209. Baffle; 13. Fixing mechanism; 1301. Locking rod; 1302. Fixing rod; 1303. Through groove; 1304. Serrated groove; 1305. Positioning groove; 1306. Second limiting groove; 1307. Second fixing ring; 1308. Second spring; 1309. Rectangular groove; 1310. Pull rod; 1311. Triangular block; 14. Ball bearing; 15. Handle; 16. Guide rod; 17. Guide hole; 18. Connecting rod. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0025] Please see Figure 1-7This invention provides a technical solution: a glue-applying mechanism for LED packaging based on COB technology, comprising a base 1, a support 2 fixedly connected to the upper surface of the base 1, a transverse moving box 3 disposed on the surface of the support 2, a longitudinal moving stage 4 disposed on the upper surface of the base 1, a placement stage 5 disposed above the longitudinal moving stage 4, a glue tube 6 fixedly connected to the front of the transverse moving box 3 by clamps, two sets of placement slots 7 respectively opened on the upper surface of the placement stage 5, a circular box 8 movably connected to the inner wall of the placement slot 7, and a transverse groove 9 opened on the side of the placement stage 5.The inner wall of the transverse groove 9 is movably connected to the surface of the transverse plate 10. A connecting plate 11 is fixedly connected to the bottom of the circular box 8, and the bottom of the connecting plate 11 is fixedly connected to the upper surface of the transverse plate 10. A discharge mechanism 12 is provided inside the circular box 8, and a fixing mechanism 13 is provided between the transverse plate 10 and the circular box 8. This glue-applying mechanism for LED packaging based on COB technology uses a clamping rod 1301, the transverse plate 10, and a connecting rod 18 to place the LED board inside the left circular box 8, so that the bottom of the LED board contacts the upper surface of the top plate 1201. After the glue is applied to the LED board on the right side, the glue tube 6 of the glue applicator is about to apply glue to the left LED board. At this time, the right connecting rod 18 is pulled, and the connecting rod 18 drives the right pull... Rod 1310 moves to the right together, pulling rod 1310 drives triangular block 1311 to press against the inner wall of through groove 1303, causing locking rod 1301 to move downward and separate from serrated groove 1304. At this time, fixing rod 1302 and positioning groove 1305 unlock each other. Continue to pull connecting rod 18, connecting rod 18 drives horizontal plate 10 and two sets of round boxes 8 to move to the right together through triangular block 1311 until the left fixing rod 1302 enters the positioning groove 1305. At this time, the position of round box 8 and LED board is determined, which is convenient for accurate glue application. Through the second spring 1308, serrated groove 1304 and fixing rod 1302, fixing rod 1302 presses locking rod 1301, causing locking rod 1301 to move downward until serrated groove 1304. 04. Upon reaching the position of lever 1301, under the reset action of the second spring 1308, lever 1301 enters the serrated groove 1304. Since the top side of lever 1301 is straight, lever 1301 will block the reverse movement of fixing rod 1302. At this time, lever 1301 locks fixing rod 1302 and positioning groove 1305, thus fixing the position of round box 8. Simultaneously, the left push rod 1205 separates from baffle 1209. Under the reset action of the first spring 1208, push rod 1205 moves to the left, causing top rod 1204 and top plate 1201 to move downwards and contact the bottom of the inner wall of round groove 1202. At this time, a set of LED boards on the left is stably installed in round box 8 and accurately achieves the gluing. The device is positioned and self-locking, easy to operate, and highly efficient. Through push rod 1205 and round box 8, the right push rod 1205 contacts the right baffle 1209, causing it to move to the left and press the inclined surface of top rod 1204. Top rod 1204 moves upward, driving top plate 1201 and the LED board with glue applied on the right side upward. The LED board is then placed in the top round box 8 for easy handling, avoiding damage to the glue due to limited space. Through ball bearings 14, baffle 1209, and connecting rod 18, when applying glue to the LED board without glue, the friction between the ball bearings 14 and baffle 1209 is low, resulting in smoother movement of the placement platform 5. The connecting rod 18 allows the pull rod 1310 on one side to move simultaneously, further enhancing convenience.

[0026] Specifically, the discharge mechanism 12 includes a top plate 1201. A circular groove 1202 is formed at the bottom of the inner wall of the circular box 8. The inner wall of the circular groove 1202 is movably connected to the surface of the top plate 1201. A T-shaped groove 1203 is formed at the bottom of the inner wall of the circular groove 1202. A push rod 1204 is fixedly connected to the lower surface of the top plate 1201. The surface of the push rod 1204 is movably connected to the inner wall of the T-shaped groove 1203. The inner wall of the T-shaped groove 1203 is connected to the surface of the push rod 1205. The push rod 1205 is movably connected at one end to the bottom of the top rod 1204, and the other end of the push rod 1205 movably passes through the T-shaped groove 1203 and extends to the side of the placement platform 5. A first limiting groove 1206 is formed on the inner wall of the T-shaped groove 1203. A first fixing ring 1207 is fixedly sleeved on the surface of the push rod 1205, and the surface of the first fixing ring 1207 is movably connected to the inner wall of the first limiting groove 1206. A first spring 1208 is fixedly connected at one end to the inner wall of the first limiting groove 1206, and at the other end to the surface of the first fixing ring 1207. Baffles 1209 are fixedly connected to the left and right sides of the inner wall of the bracket 2, corresponding to the positions of the push rod 1205. The right push rod 1205 contacts the right baffle 1209, causing it to move to the left and press against the inclined surface of the top rod 1204. The top rod 1204 moves upward, driving the top plate... 1201 and the LED board with glue applied on the right move upwards. The LED board is placed in the top circular box 8 for easy access, avoiding damage to the glue due to limited space. The left push rod 1205 separates from the baffle 1209. Under the reset action of the first spring 1208, the push rod 1205 moves to the left, causing the top rod 1204 and the top plate 1201 to move downwards and contact the bottom of the inner wall of the circular groove 1202. At this time, a set of LED boards on the left are stably installed in the circular box 8 and accurately reach the glue application position.

[0027] Specifically, the fixing mechanism 13 includes a locking rod 1301. A fixing rod 1302 is fixedly connected to the inner wall of the placement groove 7 away from the bracket 2. A serrated groove 1304 is formed on the lower surface of the fixing rod 1302. A positioning groove 1305 is formed on the side of the round box 8 corresponding to the position of the fixing rod 1302. The inner wall of the positioning groove 1305 is movably connected to the surface of the fixing rod 1302. A second limiting groove 1306 is formed at the bottom of the inner wall of the positioning groove 1305. The interior of the second limiting groove 1306 is connected to the interior of the transverse groove 9. The inner wall of the second limiting groove 1306 is movably connected to the surface of the locking rod 1301. The top of the locking rod 1301 movably passes through. The second limiting groove 1306 is movably connected to the inner wall of the serrated groove 1304. A second fixing ring 1307 is fixedly sleeved on the surface of the locking rod 1301. The surface of the second fixing ring 1307 is movably connected to the inner wall of the second limiting groove 1306. A second spring 1308 is movably sleeved on the surface of the locking rod 1301. One end of the second spring 1308 is fixedly connected to the surface of the second fixing ring 1307, and the other end of the second spring 1308 is fixedly connected to the inner wall of the second limiting groove 1306. A rectangular groove 1309 is formed in the inner wall of the second limiting groove 1306. The inner wall of the rectangular groove 1309 is movably connected to the surface of the pull rod 1310. One end of the horizontal plate 10, away from the second limiting groove 1306, moves through the rectangular groove 1309 and extends to the side of the horizontal plate 10. A triangular block 1311 is fixedly connected to the lower surface of the pull rod 1310. A through groove 1303 is opened on the side of the locking rod 1301. The inner walls of the triangular block 1311 and the pull rod 1310 are movably connected to the inner wall of the through groove 1303. Pulling the right connecting rod 18 causes the right pull rod 1310 to move to the right. The pull rod 1310 causes the triangular block 1311 to press against the inner wall of the through groove 1303, causing the locking rod 1301 to move downward and separate from the serrated groove 1304. At this time, the fixed rod 1302 and the positioning groove 1305 are unlocked. Continue pulling the connecting rod 1302. Rod 18, the connecting rod 18 drives the horizontal plate 10 and the two sets of round boxes 8 to move to the right together through the triangular block 1311 until the left fixed rod 1302 enters the positioning groove 1305. During this process, the fixed rod 1302 squeezes the locking rod 1301, causing the locking rod 1301 to move downward until the serrated groove 1304 reaches the position of the locking rod 1301. Under the reset action of the second spring 1308, the locking rod 1301 enters the serrated groove 1304. Since the top side of the locking rod 1301 is a straight surface, the locking rod 1301 will block the fixed rod 1302 from moving in the opposite direction. At this time, the locking rod 1301 locks the fixed rod 1302 and the positioning groove 1305, and the position of the round box 8 is fixed.

[0028] Specifically, the top of the locking rod 1301 is inclined and matches the shape of the inner wall of the serrated groove 1304, and the self-locking of the fixing rod 1302 is achieved by the inclined surface of the locking rod 1301.

[0029] Specifically, the top of the push rod 1204 and the contact surface of the push rod 1205 are both inclined surfaces, which enables the push rod 1205 to move laterally and drive the push rod 1204 to move up and down.

[0030] Specifically, a ball bearing 14 is movably embedded at the end of the push rod 1205 away from the top rod 1204. During the glue application process, the friction between the ball bearing 14 and the baffle 1209 is small, making the movement of the placement platform 5 smoother.

[0031] Specifically, a handle 15 is fixedly connected to the upper surface of the pull rod 1310, and the handle 15 facilitates pulling the pull rod 1310.

[0032] Specifically, a guide rod 16 is fixedly connected to the lower surface of the top plate 1201, and a guide hole 17 is provided at the bottom of the inner wall of the circular groove 1202. The inner wall of the guide hole 17 is movably connected to the surface of the guide rod 16. The guide rod 16 can only move up and down inside the guide hole 17, making the up and down movement of the top plate 1201 more stable.

[0033] Specifically, the pull rods 1310 on one side of the placement platform 5 are all fixedly connected by connecting rods 18. Pulling the connecting rods 18 can drive the pull rods 1310 on one side to move simultaneously, which is more convenient.

[0034] During use (operation), place the LED board inside the left circular box 8, ensuring the bottom of the LED board contacts the upper surface of the top plate 1201. After the glue application is completed on the right side of the LED board, the glue applicator's tube 6 will apply glue to the left LED board. At this time, pull the right connecting rod 18. The connecting rod 18 will cause the right pull rod 1310 to move to the right. The pull rod 1310 will cause the triangular block 1311 to press against the inner wall of the through groove 1303, causing the locking rod 1301 to move downwards and separate from the serrated groove 1304. At this time, the fixing rod 1302 and the positioning groove 130... 5. Unlock each other and continue pulling the connecting rod 18. The connecting rod 18, through the triangular block 1311, drives the horizontal plate 10 and the two sets of round boxes 8 to move to the right until the left fixed rod 1302 enters the positioning groove 1305. During this process, the fixed rod 1302 squeezes the locking rod 1301, causing the locking rod 1301 to move downwards until the serrated groove 1304 reaches the position of the locking rod 1301. Under the reset action of the second spring 1308, the locking rod 1301 enters the serrated groove 1304. Since the top side of the locking rod 1301 is a straight surface, the locking rod 1301... 01 will prevent the fixed rod 1302 from moving in the opposite direction. At this time, the locking rod 1301 will lock the fixed rod 1302 and the positioning groove 1305, and the position of the round box 8 will be fixed. At the same time, the left push rod 1205 will separate from the baffle 1209. Under the reset action of the first spring 1208, the push rod 1205 will move to the left, causing the top rod 1204 and the top plate 1201 to move downward and contact the bottom of the inner wall of the round groove 1202. At this time, a set of LED boards on the left side will be stably installed in the round box 8 and accurately reach the glue application position. At the same time, the right push rod 1 When 205 contacts the baffle 1209 on the right, the push rod 1205 moves to the left to press the inclined surface of the top rod 1204. The top rod 1204 moves upward, causing the top plate 1201 and the LED board with glue applied on the right to move upward. The LED board is placed in the top round box 8, which is convenient to pick up and avoids damage to the glue due to the small picking space. After picking up, the LED board without glue can be placed in the round box 8 on the right in the same way as above. When applying glue to the LED board on the left, the friction between the right ball bearing 14 and the baffle 1209 is small, which makes the movement of the placement platform 5 smoother.

[0035] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A glue-applying mechanism for LED packaging based on COB technology, comprising a base (1), characterized in that: A bracket (2) is fixedly connected to the upper surface of the base (1). A transverse moving box (3) is provided on the surface of the bracket (2). A longitudinal moving platform (4) is provided on the upper surface of the base (1). A placement platform (5) is provided above the longitudinal moving platform (4). A rubber tube (6) is fixedly connected to the front of the transverse moving box (3) by a clamp. Two sets of placement slots (7) are respectively opened on the upper surface of the placement platform (5). A round box (8) is movably connected to the inner wall of the placement slot (7). A transverse groove (9) is opened on the side of the placement platform (5). The inner wall of the transverse groove (9) is movably connected to the surface of the horizontal plate (10). A connecting plate (11) is fixedly connected to the bottom of the round box (8). The bottom of the connecting plate (11) is fixedly connected to the upper surface of the horizontal plate (10). A discharge mechanism (12) is provided inside the round box (8). A fixing mechanism (13) is provided between the horizontal plate (10) and the round box (8). The fixing mechanism (13) includes a locking rod (1301). A fixing rod (1302) is fixedly connected to the inner wall of the placement groove (7) away from the bracket (2). A serrated groove (1304) is formed on the lower surface of the fixing rod (1302). A positioning groove (1305) is formed on the side of the round box (8) corresponding to the position of the fixing rod (1302). The inner wall of the positioning groove (1305) is movably connected to the surface of the fixing rod (1302). A second limiting groove (1306) is provided at the bottom. The interior of the second limiting groove (1306) is connected to the interior of the transverse groove (9). The inner wall of the second limiting groove (1306) is movably connected to the surface of the locking rod (1301). The top of the locking rod (1301) movably passes through the second limiting groove (1306) and is movably connected to the inner wall of the serrated groove (1304). A second fixing ring (1307) is fixedly sleeved on the surface of the locking rod (1301). 07) The surface of the locking rod (1301) is movably connected to the inner wall of the second limiting groove (1306). A second spring (1308) is movably sleeved on the surface of the locking rod (1301). One end of the second spring (1308) is fixedly connected to the surface of the second fixing ring (1307), and the other end of the second spring (1308) is fixedly connected to the inner wall of the second limiting groove (1306). A rectangular groove (1309) is formed in the inner wall of the second limiting groove (1306). The inner wall is movably connected to the surface of the pull rod (1310). The end of the pull rod (1310) away from the second limiting groove (1306) movably passes through the rectangular groove (1309) and extends to the side of the horizontal plate (10). A triangular block (1311) is fixedly connected to the lower surface of the pull rod (1310). A through groove (1303) is opened on the side of the locking rod (1301). The inner walls of the triangular block (1311) and the pull rod (1310) are movably connected to the inner wall of the through groove (1303).

2. The adhesive application mechanism for LED packaging based on COB technology according to claim 1, characterized in that: The discharge mechanism (12) includes a top plate (1201). A circular groove (1202) is provided at the bottom of the inner wall of the circular box (8). The inner wall of the circular groove (1202) is movably connected to the surface of the top plate (1201). A T-shaped groove (1203) is provided at the bottom of the inner wall of the circular groove (1202). A push rod (1204) is fixedly connected to the lower surface of the top plate (1201). The surface of the push rod (1204) is movably connected to the inner wall of the T-shaped groove (1203). The inner wall of the T-shaped groove (1203) is movably connected to the surface of a push rod (1205). One end of the push rod (1205) is movably connected to the bottom of the push rod (1204). The other end of the push rod (1205) movably passes through the T-shaped groove (1203) and... Extending to the side of the placement platform (5), the inner wall of the T-shaped groove (1203) is provided with a first limiting groove (1206). The surface of the push rod (1205) is fixedly sleeved with a first fixing ring (1207). The surface of the first fixing ring (1207) is movably connected to the inner wall of the first limiting groove (1206). The surface of the push rod (1205) is movably sleeved with a first spring (1208). One end of the first spring (1208) is fixedly connected to the inner wall of the first limiting groove (1206), and the other end of the first spring (1208) is fixedly connected to the surface of the first fixing ring (1207). The left and right sides of the inner wall of the bracket (2) are fixedly connected with baffles (1209) corresponding to the position of the push rod (1205).

3. The adhesive application mechanism for LED packaging based on COB technology according to claim 1, characterized in that: The top of the lever (1301) is sloping and is adapted to the shape of the inner wall of the serrated groove (1304).

4. The adhesive application mechanism for LED packaging based on COB technology according to claim 2, characterized in that: The top of the top rod (1204) and the contact surface of the push rod (1205) are both inclined surfaces.

5. The adhesive application mechanism for LED packaging based on COB technology according to claim 2, characterized in that: The push rod (1205) has a ball bearing (14) movably embedded at the end away from the top rod (1204).

6. The adhesive application mechanism for LED packaging based on COB technology according to claim 1, characterized in that: A handle (15) is fixedly connected to the upper surface of the pull rod (1310).

7. The adhesive application mechanism for LED packaging based on COB technology according to claim 2, characterized in that: A guide rod (16) is fixedly connected to the lower surface of the top plate (1201), and a guide hole (17) is provided at the bottom of the inner wall of the circular groove (1202). The inner wall of the guide hole (17) is movably connected to the surface of the guide rod (16).

8. The adhesive application mechanism for LED packaging based on COB technology according to claim 1, characterized in that: The pull rods (1310) on one side of the placement platform (5) are all fixedly connected by connecting rods (18).

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