Processing method of side-emitting surface-mount digital tube

Abstract

The present invention belongs to the technical field of display devices, and in particular, relates to a processing method for a side-emitting surface-mounted digital tube, specifically including S100: providing a row of needle seats, the needle seats including an integrally injection-molded plastic needle seat and a plurality of needles fixed on the plastic needle seat, the pins of each needle are bent to form a mounting surface; S200: providing a circuit board, the circuit board having a relatively arranged connection surface and a light-emitting surface, the connection surface and the needle heads of the needles are welded and fixed, and then a light-emitting structure is arranged on the light-emitting surface; S300: providing a REF shell, buckling the REF shell to the outside of the light-emitting surface to form a semi-finished digital tube; S400: providing a stainless steel shielding cover, and setting the stainless steel shielding cover outside the semi-finished digital tube to form a finished digital tube. The method of the present invention can ensure that the assembled digital tube can be installed in an area with narrow spacing, and the installation and use effects are much better than traditional digital tubes.

Description

Technical Field

[0001] The invention belongs to the technical field of display devices, and in particular relates to a processing method of a side-emitting surface-mounted digital tube. Background Art

[0002] LED digital tubes are devices that are packaged together to form an "8" shape, with the character display surface facing the pin setting surface, and the pins on the pin setting surface are connected to the external control circuit. After the most traditional LED digital tubes are installed, the character display surface is parallel to the surface of the device on which they are installed, and is used to display the device's operating information. The staff can judge the device's operating status and perform maintenance and repairs by viewing the displayed characters on the LED digital tubes. In some cases where the spacing between devices is narrow, such as in devices with multiple stacked circuit boards, it is difficult to view the characters displayed on the LED digital tubes installed on the circuit board from the side of the circuit board, making it inconvenient for staff to read the device data for maintenance.

[0003] Therefore, a side-emitting digital tube has appeared on the market. For example, the utility model patent with the Chinese publication number CN207663769U discloses an LED digital tube display device, which includes: an LED digital tube, a PCB board, and an electrical connection device; the area of ​​the LED digital tube pin setting surface is smaller than the area of ​​the PCB board, and the LED digital tube is set on the PCB board; an electrical connection device is set at the edge of the PCB board; one end of the electrical connection device is electrically connected to each pin of the LED digital tube, and the other end is electrically connected to the control circuit board, so that the PCB board is perpendicular to the control circuit board. In this solution, the LED digital tube is set on the PCB board to achieve integration, and an electrical connection device is set on the edge of the PCB board, and the electrical connection device is vertically connected to the control circuit board through the electrical connection device to achieve the side display effect of the LED digital tube.

[0004] Since side-emitting digital tubes are generally installed in areas with narrow spacing, the flatness of their installation is very important, otherwise it will interfere with the installation of other components and cause instability in their own connections, affecting the normal lighting effect. The main factor affecting the flatness of the installation of side-emitting digital tubes is the flatness of the installation of their electrical connectors. Among them, the pin headers of the electrical connectors of the above-mentioned improved side-emitting digital tubes are positioned by passing through plastic parts, and each pin is passed through a separate plastic part, and the plastic parts are connected together. Since each pin is passed through a separate plastic part, it is impossible for each pin to be aligned consistently, which in turn affects the overall flatness of the pin header. Moreover, some positions of the pin header need to be bent, which easily leads to the inability of each pin to achieve consistent flatness, which in turn affects the subsequent installation and use of the digital tube. Summary of the invention

[0005] The object of the present invention is to provide a method for processing a side-emitting surface-mounted digital tube, so as to at least solve the above-mentioned problems existing in the prior art.

[0006] To achieve the above object, an embodiment of the present invention provides a method for processing a side-emitting surface-mount digital tube, comprising the following steps:

[0007] S100: providing a needle header, wherein the needle header comprises an integrally injection-molded plastic needle header and a plurality of needle headers fixed on the plastic needle header, wherein pins of each of the needle headers are bent to form a mounting surface;

[0008] S200: providing a circuit board, the circuit board having a connecting surface and a light-emitting surface arranged opposite to each other, welding and fixing the connecting surface to the needle head of the pin header, and then arranging a light-emitting structure on the light-emitting surface;

[0009] S300: providing a REF housing, and buckling the REF housing onto the outer side of the light-emitting surface to form a semi-finished digital tube;

[0010] S400: providing a stainless steel shielding cover, and setting the stainless steel shielding cover outside the semi-finished digital tube to form a finished digital tube.

[0011] Optionally, the needle header is integrally injection molded in the following manner, specifically comprising the following steps:

[0012] S110: providing a needle seat mold, wherein the needle seat mold has a needle seat cavity, placing a plurality of row pins in the needle seat cavity, and completing positioning of the plurality of row pins;

[0013] S120: injecting molten plastic into the needle seat cavity, and forming a plastic needle seat after cooling, wherein the plastic needle seat fixes each of the row needles and forms a semi-finished needle seat;

[0014] S130: After taking out the semi-finished needle header, bend the pins of each of the needle headers to form a mounting surface, and form a finished needle header.

[0015] Optionally, in the step S120, injecting molten plastic into the needle seat cavity specifically includes the following steps:

[0016] S121: Execute the first injection, the injection molding machine ejects the molten plastic at an injection speed of 4-6 cm / s to form an inner layer of plastic needle seat covering each of the row needles;

[0017] S122: Execute the second injection, the injection molding machine ejects the molten plastic at an injection speed of 10-14 cm / s to form an outer layer of plastic needle seat to cover the inner layer of plastic needle seat, and finally form a semi-finished needle seat.

[0018] Optionally, in the step S130, after the pins of each pin header are bent to form a mounting surface, the mounting surface is tested for flatness; if the test result is that the flatness requirement is met, a finished pin header is formed, and if the test result is that the flatness requirement is not met, it is treated as a defective product.

[0019] Optionally, in step S200, setting the light emitting structure specifically includes:

[0020] Bonding a chip to the light-emitting surface, and then welding the chip to the circuit on the light-emitting surface;

[0021] Alternatively, solder paste is applied on the light-emitting surface, and then the LED is sealed on the solder paste, and finally subjected to a reflow soldering process.

[0022] Optionally, the plastic needle seat includes a needle seat body and extensions arranged on the two lower sides of the same side of the needle seat body, a step is provided at the bottom of the needle seat body, and the needle row includes the pins arranged vertically and the needle heads arranged horizontally, the pins of each of the needle rows extend downward from the step and are bent to fit the step to form a mounting surface, and the needle heads of each of the needle rows are located between the two extensions.

[0023] Optionally, the outer sides of the two extension parts are provided with positioning pins for positioning when the side-emitting surface-mounted digital tube is mounted.

[0024] Optionally, side holes are provided on the outer sides of the two extension parts, and the positioning pin is T-shaped. The T-shaped positioning pin is inserted downward from the side hole until it abuts against the top edge of the side hole.

[0025] Optionally, a leveling column is provided at the front end of each of the two extension portions, and the bottom end surfaces of the two leveling columns are in the same plane as the mounting surface.

[0026] Optionally, four continuous peripheral side surfaces of the front portion of the stainless steel shielding cover away from the mounting surface are provided with protective elastic sheets, and the protective elastic sheets are directly stamped and formed in the stainless steel shielding cover.

[0027] The above one or more technical solutions in the processing method of the side-emitting surface-mount digital tube provided by the embodiment of the present invention have at least one of the following technical effects: in the processing method of the side-emitting surface-mount digital tube of the present invention, the pin header is manufactured by integrated injection molding, that is, the plastic pin header and the plurality of pin headers are directly combined together during the injection molding process, which is completely different from the method of assembling the two later, and the pins of each row of pins of the molded pin header are bent to form a mounting surface, and the flatness of the mounting surface can be effectively guaranteed. The subsequent assembly of the circuit board, REF shell and stainless steel shielding cover will not affect the mounting surface formed by the pins of the pin header, thereby ensuring that the assembled digital tube can be installed in an area with a narrow spacing, and the installation and use effects are much better than traditional digital tubes. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 The present invention provides a flowchart of a method for processing a side-emitting surface-mount digital tube.

[0030] Figure 2 This is a flow chart of step S100 in the method for processing a side-emitting surface-mount digital tube provided in an embodiment of the present invention.

[0031] Figure 3 This is a flow chart of step S120 in the method for processing a side-emitting surface-mount digital tube provided in an embodiment of the present invention.

[0032] Figure 4 This is a flow chart of step S130 in the method for processing a side-emitting surface-mount digital tube provided in an embodiment of the present invention.

[0033] Figure 5 The present invention provides a flowchart of step S200 in the method for processing a side-emitting surface-mount digital tube according to an embodiment of the present invention.

[0034] Figure 6 This is a flow chart of another step S200 in the method for processing a side-emitting surface-mount digital tube provided by an embodiment of the present invention.

[0035] Figure 7 A schematic structural diagram of a side-emitting surface-mount digital tube processed by the processing method of the side-emitting surface-mount digital tube provided in an embodiment of the present invention.

[0036] Figure 8 for Figure 7A structural diagram of the side-emitting surface-mount digital tube from another perspective.

[0037] Fig. 9 for Figure 7 The structural breakdown diagram of the side-emitting surface-mount digital tube.

[0038] Fig.10 for Figure 7 Schematic diagram of the pin header structure of the side-emitting surface-mount digital tube.

[0039] Among them, the reference numerals in the figure are:

[0040] 10—Plastic needle seat 11—Needle seat body 12—Extension part

[0041] 13—Step 14—Positioning pin 15—Side socket

[0042] 16 - leveling column 20 - needle row 21 - needle

[0043] 22-pin 100-pin header 200-REF housing

[0044] 221—mounting surface 300—stainless steel shielding cover 301—protective elastic sheet. DETAILED DESCRIPTION

[0045] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. Figure 1-10 The described embodiments are exemplary and are intended to be used to explain the embodiments of the present invention, but should not be construed as limiting the present invention.

[0046] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0049] In one embodiment of the present invention, Figure 1 , 7 -10, a method for processing a side-emitting surface-mount digital tube is provided, comprising the following steps:

[0050] S100: A needle header 100 is provided, wherein the needle header 100 comprises an integrally injection-molded plastic needle header 10 and a plurality of pin headers 20 fixed on the plastic needle header 10, wherein the pins 22 of each pin header 20 are bent to form a mounting surface 221; the plastic needle header 10 and the plurality of pin headers 20 can be effectively combined by integrally injection-molding, and the product structure of the formed needle header 100 is consistent and not easy to be loose, and then the pins 22 of each pin header 20 are processed and bent to form a mounting surface 221, and the mounting surface 221 is jointly constituted by the surfaces of each pin header 20, and since the positions of each pin header 20 are fixed by injection molding, the formed mounting surface 221 will not be easily misaligned, and the flatness can be effectively guaranteed.

[0051] S200: Provide a circuit board, the circuit board having a connecting surface and a light-emitting surface that are relatively arranged, the connecting surface is welded and fixed to the needle head 21 of the pin header 20, and then a light-emitting structure is arranged on the light-emitting surface; in this way, the circuit board can be placed on its side, the connecting surface and the light-emitting surface are both arranged vertically, the connecting surface is effectively welded and fixed to the needle head 21 of the pin header 20, and the light-emitting surface is used to set the light-emitting structure, and the light-emitting structure is on the side to form a side-emitting effect.

[0052] S300: Provide a REF shell 200, and buckle the REF shell 200 to the outer side of the light-emitting surface to form a semi-finished digital tube; the REF shell 200 is buckled to the outer side of the light-emitting structure to protect the light-emitting structure, and can form different light-emitting shapes according to actual needs.

[0053] S400: providing a stainless steel shielding cover 300, and covering the semi-finished digital tube with the stainless steel shielding cover 300 to form a finished digital tube.

[0054] Specifically, in the processing method of the side-emitting surface-mount digital tube of the embodiment of the present invention, the pin header 100 is manufactured by integral injection molding, that is, the plastic pin header 10 and the plurality of pin headers 20 are directly combined together during the injection molding process, which is completely different from the method of assembling the two later, and the pins 22 of each pin header 20 of the molded pin header 100 are bent to form a mounting surface 221, and the flatness of the mounting surface 221 can be effectively guaranteed. The subsequent assembly of the circuit board, the REF shell 200 and the stainless steel shielding cover 300 will not affect the mounting surface 221 formed by the pins 22 of the pin header 20, thereby ensuring that the assembled digital tube can be installed in an area with a narrow spacing, and the installation and use effects are much better than those of traditional digital tubes.

[0055] In another embodiment, if Figure 2 As shown, the needle header 100 is integrally injection molded in the following manner, specifically comprising the following steps:

[0056] S110: Provide a needle seat mold, wherein the needle seat mold has a needle seat cavity, place a plurality of pin headers 20 in the needle seat cavity, and complete the positioning of the plurality of pin headers 20; before injecting molten plastic, first position each pin header 20 placed in the needle seat cavity in the needle seat mold to ensure that each pin header 20 is accurately positioned and has uniform flatness.

[0057] S120: Injecting molten plastic into the needle seat cavity to form a plastic needle seat 10 after cooling. The plastic needle seat 10 fixes each of the pin headers 20 to form a semi-finished needle seat 100; injecting molten plastic outside the positioned pin headers 20 to cover each of the pin headers 20. The molten plastic will harden after cooling, thereby fixing each of the pin headers 20, so that the positions of the positioned pin headers 20 are solidified, thereby forming a semi-finished needle seat 100.

[0058] S130: After taking out the semi-finished needle header 100, bend the pins 22 of each pin header 20 to form a mounting surface 221, and form a finished needle header 100. Finally, process the pins 22 of each pin header 20 of the semi-finished needle header 100 so that each pin 22 forms a mounting surface 221, thereby forming a finished needle header 100.

[0059] In this embodiment, the positions of the pin headers 20 of the finished pin header 100 are positioned and solidified during the injection molding process without deformation, so that the flatness of the mounting surface 221 of the pins 22 processed later is more guaranteed.

[0060] In another embodiment, if Figure 3 As shown, in the step S120, injecting molten plastic into the needle seat cavity specifically includes the following steps:

[0061] S121: Perform the first injection, the injection molding machine injects molten plastic at an injection speed of 4-6 cm / s to form an inner layer of plastic needle seat to cover each of the row pins 20; in this step, the molten plastic injected at a slower injection speed of 4-6 cm / s can effectively and fully cover each of the row pins 20, and after cooling to a certain extent, the following second injection of molten plastic is performed;

[0062] S122: Perform the second injection, the injection molding machine ejects the molten plastic at an injection speed of 10-14 cm / s to form an outer layer of plastic needle seat to cover the inner layer of plastic needle seat, and finally form a semi-finished needle seat 100. In this step, the molten plastic ejected at a faster injection speed of 10-14 cm / s can quickly combine with the inner layer of plastic needle seat to avoid the formation of faults, thereby forming an outer layer of plastic needle seat, and then forming a complete shape of the plastic needle seat 10.

[0063] This embodiment creatively adopts slow speed injection molding to effectively fix the position of the header pin 20, and then adopts fast speed to effectively combine with the inner plastic pin seat, and finally forms a complete plastic pin seat 10, which is completely different from the traditional fast-first-slow-speed injection molding process, and can also effectively prevent the problem of misalignment of the positioning position of the header pin 20 caused by the injection molding speed being too fast.

[0064] Further, in this embodiment, the speed of the first injection may be 4 cm / s, 5 cm / s or 6 cm / s, and the speed of the second injection may be 10 cm / s, 11 cm / s, 12 cm / s, 13 cm / s or 14 cm / s.

[0065] In another embodiment, if Figure 4 As shown, in the step S130, after the pins 22 of each of the pin headers 20 are bent to form the mounting surface 221, the mounting surface 221 is tested for flatness; if the test result is in compliance with the flatness requirement, a finished pin header 100 is formed, and if the test result is not in compliance with the flatness requirement, it is treated as a defective product. In this embodiment, after the mounting surface 221 is manufactured, an additional step of flatness testing of the mounting surface 221 is added, which is specifically performed manually or with a flatness tester. Through this step, it can be screened whether the mounting surface 221 meets the requirements, so that defective products that do not meet the requirements are processed separately to ensure that each produced pin header 100 is of high quality.

[0066] In another embodiment, if Figure 5 As shown, in the step S200, the light-emitting structure is set specifically by bonding a chip on the light-emitting surface, and then welding the chip to the circuit on the light-emitting surface; specifically, this method can realize the processing of the light-emitting structure, that is, it is realized by using a method of solid crystal and welding, which can meet the needs of manufacturing a digital tube with a structure.

[0067] In another embodiment, if Figure 6 As shown, in step S200, the light emitting structure is specifically set by brushing solder paste on the light emitting surface, then sealing the LED on the solder paste, and finally reflow soldering. Specifically, this method can also realize the processing of the light emitting structure, that is, the LED is sealed with solder paste and reflow soldering, which can meet the needs of manufacturing a digital tube of another structure.

[0068] In another embodiment, if Fig.10 As shown, the plastic needle seat 10 includes a needle seat body 11 and extensions 12 arranged on the lower sides of the same side of the needle seat body 11. A step 13 is arranged at the bottom of the needle seat body 11. The extension 12 and the step 13 are formed during the injection molding process. Although the overall structure is heterogeneous, it is produced during the injection molding process, so it does not affect the production effect and efficiency. And because the structure is set, it is also beneficial to the installation and protection of the remaining components. Further, the pin header 20 includes the pins 22 arranged vertically and the needle heads 21 arranged horizontally. The pins 22 of each of the pin headers 20 extend downward from the step 13 and are bent to fit the step 13 to form a mounting surface 221. The needle heads 21 of each of the pin headers 20 are located between the two extensions 12. Specifically, the step 13 provided at the bottom of the needle seat body 11 is used to assist in bending the pins 22 and to position the bent pins 22, so that the mounting surface 221 formed by the bent pins 22 is not easily deformed under the limit of the step 13. The needle head 21 of the pin header 20 can be protected by the two extension parts 12 between the two extension parts 12, ensuring that the needle head 21 is not easily deformed by impact during the assembly of other components.

[0069] In another embodiment, if Figure 9-10 As shown, the outer sides of the two extensions 12 are provided with positioning pins 14 for positioning when the side-emitting surface-mounted digital tube is mounted. In this embodiment, the two positioning pins 14 can play a role in initial positioning when installing the digital tube, which is more conducive to the mounting positioning of the mounting surface 221 of the digital tube, and the flatness after mounting is better.

[0070] In another embodiment, if Fig.10As shown, the outer sides of the two extensions 12 are provided with side insertion holes 15, and the positioning pins 14 are T-shaped. The T-shaped positioning pins 14 are inserted downward from the side insertion holes 15 and abut against the top edge of the side insertion holes 15. Specifically, the pins are made of metal parts, and the whole is T-shaped. Then, the T-shaped positioning pins 14 are inserted downward into the side insertion holes 15 from top to bottom until the upper part of the structure abuts against the top edge of the side insertion holes 15, and the positioning pins 14 are inserted and installed in place. The assembly is very fast, and it can also be effectively judged whether they are installed in place during the assembly process.

[0071] In another embodiment, if Fig.10 As shown, the front ends of the two extensions 12 are provided with leveling columns 16, and the bottom end surfaces of the two leveling columns 16 are in the same plane as the mounting surface 221. Specifically, since the leveling columns 16 and the mounting surface 221 are in the same plane, when the entire digital tube is installed, it can be determined whether the mounting surface 221 is mounted in place by its contact with the mounting plane, which is more conducive to the flatness judgment of the digital tube installed in a narrow area.

[0072] In another embodiment, if Fig. 9 As shown, the four continuous circumferential sides of the front of the stainless steel shielding cover 300 away from the mounting surface 221 are provided with protective elastic sheets 301, and the protective elastic sheets 301 are directly stamped and formed in the stainless steel shielding cover 300. Specifically, the provision of the protective elastic sheet 301 is conducive to its buffering and protective effect in contact with other components, thereby reducing the damage of other components to the digital tube of this embodiment. In addition, since the protective elastic sheet 301 is directly stamped and formed in the stainless steel shielding cover 300, since no additional connecting parts are required, only one procedure is required when processing the stainless steel shielding cover 300, which is very practical.

[0073] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A processing method for a side-emitting surface-mount digital tube. Features: The following steps are involved: S100: providing a needle header, wherein the needle header comprises an integrally injection-molded plastic needle header and a plurality of needle headers fixed on the plastic needle header, wherein pins of each of the needle headers are bent to form a mounting surface; S200: providing a circuit board, the circuit board having a connecting surface and a light-emitting surface arranged opposite to each other, welding and fixing the connecting surface to the needle head of the pin header, and then arranging a light-emitting structure on the light-emitting surface; S300: providing a REF housing, and buckling the REF housing onto the outer side of the light-emitting surface to form a semi-finished digital tube; S400: providing a stainless steel shielding cover, and placing the stainless steel shielding cover outside the semi-finished digital tube to form a finished digital tube; The needle header is integrally injection molded in the following manner, specifically comprising the following steps: S110: providing a needle seat mold, wherein the needle seat mold has a needle seat cavity, placing a plurality of row pins in the needle seat cavity, and completing positioning of the plurality of row pins; S120: injecting molten plastic into the needle seat cavity, and forming a plastic needle seat after cooling, wherein the plastic needle seat fixes each of the row needles and forms a semi-finished needle seat; S130: after taking out the semi-finished needle header, bend the pins of each of the needle headers to form a mounting surface, and form a finished needle header; In the step S120, injecting molten plastic into the needle seat cavity specifically includes the following steps: S121: Execute the first injection, the injection molding machine ejects the molten plastic at an injection speed of 4-6 cm / s to form an inner layer of plastic needle seat covering each of the row needles; S122: Execute the second injection, the injection molding machine ejects the molten plastic at an injection speed of 10-14 cm / s to form an outer layer of plastic needle seat to cover the inner layer of plastic needle seat, and finally form a semi-finished needle seat.

2. The processing method of the side-emitting surface-mount digital tube according to claim 1, Features: In the step S130, after the pins of each pin header are bent to form a mounting surface, the mounting surface is tested for flatness; if the test result is in compliance with the flatness requirement, a finished pin header is formed, and if the test result is not in compliance with the flatness requirement, it is treated as a defective product.

3. The processing method of the side-emitting surface-mount digital tube according to claim 1, Features: In step S200, the light emitting structure is specifically provided as follows: Bonding a chip to the light-emitting surface, and then welding the chip to the circuit on the light-emitting surface; Alternatively, solder paste is applied on the light-emitting surface, and then the LED is sealed on the solder paste, and finally subjected to a reflow soldering process.

4. The processing method of the side-emitting surface-mount digital tube according to claim 1, Features: The plastic needle seat includes a needle seat body and extensions arranged on the two lower sides of the same side of the needle seat body. A step is arranged at the bottom of the needle seat body. The needle row includes the pins arranged vertically and the needle heads arranged horizontally. The pins of each of the needle rows extend downward from the step and are bent and fit onto the step to form a mounting surface. The needle heads of each of the needle rows are located between the two extensions.

5. The processing method of the side-emitting surface-mount digital tube according to claim 4, Features: The outer sides of the two extension parts are both provided with positioning pins for positioning when the side-emitting surface-mounted digital tube is mounted.

6. The method for processing a side-emitting surface-mount digital tube according to claim 5, Features: Side insertion holes are provided on the outer sides of the two extension parts. The positioning pin is T-shaped. The T-shaped positioning pin is inserted downward from the side insertion hole until it abuts against the top edge of the side insertion hole.

7. The method for processing a side-emitting surface-mount digital tube according to claim 4, Features: The front ends of the two extension parts are each provided with a leveling column, and the bottom end surfaces of the two leveling columns are in the same plane as the mounting surface.

8. The method for processing a side-emitting surface-mount digital tube according to any one of claims 1 to 7, Features: Four continuous peripheral side surfaces of the front portion of the stainless steel shielding cover away from the mounting surface are all provided with protective elastic sheets, and the protective elastic sheets are directly stamped and formed in the stainless steel shielding cover.

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