A pad structure, LED lamp bead, display module and packaging method

Abstract

This application relates to a pad structure, LED beads, display modules, and packaging methods. The pad structure includes: a substrate; the front side of the substrate has a shared pad for both positive and negative electrodes, a first electrode common pad, and multiple independent second electrode pads, all spaced apart. The shared pad is used to fix either the positive electrode red light chip or the negative electrode red light chip; the back side of the substrate has first electrode pins and multiple second electrode pins, all spaced apart. The first electrode pins are electrically connected to the first electrode common pad, and each second electrode pin is electrically connected to a corresponding independent second electrode pad; wherein the polarities of the first and second electrodes are opposite. This application allows for switching between positive and negative electrode red light chips without changing the pad structure, while maintaining the same pin definition, thus saving manufacturing costs.

Description

Technical Field

[0001] This application relates to the field of LED packaging pads, specifically to a pad structure, LED beads, display modules, and packaging methods. Background Technology

[0002] With the rapid development of the LED display industry, LED displays are increasingly favored by the market and are being used in a wider range of applications due to their excellent brightness and color performance, as well as seamless image integrity. In order to adapt to the needs of different applications, LED packaging manufacturers and screen manufacturers often need to develop products with different brightness gradients.

[0003] The brightness of LED components is primarily related to the LED chip. For chips of the same size, the chip structure affects the luminous brightness. Currently, the most common red LED chips on the market have a vertical structure, while blue and green chips have a horizontal structure. Vertical red LED chips can have either a positive electrode structure or a negative electrode structure (due to manufacturing differences, high-brightness red LED chips generally have a negative electrode structure, but due to cost considerations, a positive electrode structure is usually preferred during the manufacturing of red LED chips, and only replaced with a negative electrode structure when the brightness of the positive electrode structure is insufficient). Their polarity differences are as follows... Figure 1 and Figure 2 As shown.

[0004] In related technologies, the pin definitions of LED pads are generally determined during manufacturing. During die bonding, a specific structure of red LED chip can only be used based on the determined pins; that is, only a positive electrode structure or a negative electrode structure can be selected to ensure that the red LED chip and the pin definitions are consistent. For example... Figure 3 and Figure 4 , Figure 3 It has a common-anode structure, and the red light chip has a positive electrode structure. Figure 4 It is also a common anode structure, while the red light chip is a reverse electrode structure. Figure 3 and Figure 4 The chip layout remains the same, but the pad structure has been changed. It is evident that, with the chip layout unchanged, switching between positive and negative electrode red LED chips requires altering the pad structure to achieve the same pin definitions. Using the original pad support would lead to inconsistent LED pin definitions, necessitating the panel manufacturer to redesign the PCB board (modifying the pad definitions) to maintain consistent LED pin polarity. However, both of these methods increase management and design costs.

[0005] Therefore, it is necessary to design a new pad structure to overcome the above problems. Summary of the Invention

[0006] This application provides a pad structure, LED beads, display module, and packaging method, which can solve the problem of increased management and design costs caused by switching between positive and negative electrodes of red light chips in related technologies.

[0007] In a first aspect, embodiments of this application provide a pad structure, comprising: a substrate, the front side of which is provided with a common pad for positive and negative electrodes, a common pad for a first electrode, and a plurality of independent pads for a second electrode, the common pad for positive and negative electrodes, the common pad for the first electrode, and the plurality of independent pads for the second electrode all being spaced apart from each other, the common pad for positive and negative electrodes being used to fix a red light chip of the positive electrode or a red light chip of the negative electrode; the back side of the substrate is provided with a first electrode pin and a plurality of second electrode pins, the first electrode pin and the plurality of second electrode pins being spaced apart from each other, the first electrode pin being electrically connected to the first electrode common pad, and each second electrode pin being electrically connected to a corresponding independent pad for a second electrode; wherein the polarities of the first electrode and the second electrode are opposite.

[0008] In conjunction with the first aspect, in one embodiment, the common pad for the positive and negative electrodes has two notches, which divide the common pad for the positive and negative electrodes into three interconnected parts, one of which is a first die bonding region, and the other two parts are first wire bonding regions, with the two first wire bonding regions symmetrically distributed on opposite sides of the first die bonding region.

[0009] In conjunction with the first aspect, in one embodiment, the common pad for the positive and negative electrodes and a plurality of independent pads for the second electrodes are spaced apart around the common pad for the first electrodes.

[0010] In conjunction with the first aspect, in one embodiment, the first electrode common pad includes a second die bonding region and a second wire bonding region that are interconnected, the second wire bonding region sharing a pad with the positive and negative electrodes, and a plurality of independent second electrode pads distributed around the second die bonding region.

[0011] Secondly, embodiments of this application provide an LED lamp bead, comprising: a substrate, the front side of which is provided with a common pad for positive and negative electrodes, a common pad for a first electrode, and a plurality of independent pads for second electrodes, the common pad for positive and negative electrodes, the common pad for a first electrode, and the plurality of independent pads for second electrodes being spaced apart from each other; a first chip with a positive electrode or a first chip with a negative electrode is fixed on the common pad for positive and negative electrodes, and a plurality of second chips with different light emission colors are fixed on the common pad for a first electrode; the back side of the substrate is provided with a first electrode pin and a plurality of second electrode pins, the first electrode pin and the plurality of second electrode pins being spaced apart from each other; the first electrode pin is electrically connected to the common pad for a first electrode, and each second electrode pin is electrically connected to a corresponding independent pad for a second electrode; wherein the polarities of the first electrode and the second electrode are opposite; when the common pad for positive and negative electrodes is electrically connected to the common pad for a first electrode through a first wire, the first chip is electrically connected to one of the independent pads for a second electrode through a second wire; when the common pad for positive and negative electrodes is electrically connected to one of the independent pads for a second electrode through a first wire, the first chip is electrically connected to the common pad for a first electrode through a second wire.

[0012] Thirdly, embodiments of this application provide a display module, which includes a plurality of the aforementioned LED beads.

[0013] Fourthly, embodiments of this application provide a packaging method for the aforementioned LED beads, the packaging method comprising:

[0014] The first chip of the positive electrode is fixed to the common pad of the positive and negative electrodes, and multiple second chips with different light-emitting colors are fixed to the common pad of the first electrode.

[0015] The first wire connects the common pad for the positive and negative electrodes to one of the independent pads for the second electrode. The second wire connects the first electrode of the first chip to the common pad for the first electrode. The third wire connects the first electrode of the second chip to the common pad for the first electrode. The fourth wire connects the second electrode of the second chip to the corresponding independent pad for the second electrode.

[0016] Determine whether the brightness of the LED bead meets the preset conditions. If it does not meet the preset conditions, remove the first chip of the positive electrode, switch the first chip of the negative electrode to the common pad of the positive and negative electrodes, and connect the common pad of the positive and negative electrodes to the common pad of the first electrode through the first wire. Connect the second electrode of the first chip to one of the independent pads of the second electrode through the second wire.

[0017] In conjunction with the fourth aspect, in one embodiment, the packaging method further includes: forming the common pad for the positive and negative electrodes, the first common pad for the first electrode, and a plurality of independent pads for the second electrode on the front side of the substrate by means of exposure, development, and etching, such that the common pad for the positive and negative electrodes, the first common pad for the first electrode, and the plurality of independent pads for the second electrode are all spaced apart from each other.

[0018] The beneficial effects of the technical solutions provided in this application include at least the following:

[0019] By setting up independent shared pads for positive and negative electrodes, the red light chip can be fixed on the shared pads. When switching between positive and negative electrode red light chips, there is no need to change the pad structure. Only the wiring method of the red light chip and the shared pads needs to be changed to achieve the same pin definition. There is also no need to design two pad structures suitable for positive and negative electrode red light chips. The screen manufacturer's module does not need to set up a new PCB board, which can save manufacturing costs and solve the problem of increased management and design costs when switching between positive and negative electrode red light chips in related technologies. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a red light chip with a positive electrode in related technologies;

[0022] Figure 2 This is a schematic diagram of the structure of a red light chip with a reverse electrode in related technologies;

[0023] Figure 3 This is a schematic diagram of a lamp bead structure using a positive electrode red light chip in related technologies;

[0024] Figure 4 This is a schematic diagram of a lamp bead structure using a reverse electrode red light chip in a related technology;

[0025] Figure 5 This is a front view of a pad structure provided in an embodiment of this application;

[0026] Figure 6 This is a schematic diagram of the back structure of a pad structure provided in an embodiment of this application;

[0027] Figure 7 This is a schematic diagram of a lamp bead structure using a reverse electrode red light chip provided in an embodiment of this application;

[0028] Figure 8 This is a schematic diagram of a lamp bead structure using a positive electrode red light chip, provided in an embodiment of this application.

[0029] In the picture:

[0030] 1. Substrate; 11. Common pad for positive and negative electrodes; 111. Notch; 112. First die bonding area; 113. First wire bonding area;

[0031] 12. First electrode common pad; 121. Second die bond area; 122. Second wire bonding area; 13. Second electrode independent pad; 14. First electrode pin; 15. Second electrode pin;

[0032] 2. First chip; 3. Second chip;

[0033] 4. First conductor; 5. Second conductor; 6. Third conductor; 7. Fourth conductor. Detailed Implementation

[0034] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0035] This application provides a pad structure that can solve the problem of increased management and design costs in related technologies.

[0036] To facilitate understanding of the technical solution of this application, the two structures of the red light chip are described below. The vertical structure red light chip has a positive electrode structure and a negative electrode structure, wherein... Figure 1 It has a positive electrode structure, with the negative electrode at the bottom and the positive electrode at the top of the red light chip; Figure 2 The red light chip with a reverse electrode structure has the positive electrode at the bottom and the negative electrode at the top. For red and reverse electrode chips of the same size, the brightness of the positive electrode structure is generally lower than that of the reverse electrode structure. However, the red light chip with the reverse electrode structure has a higher manufacturing cost, while the red light chip with the positive electrode structure has a lower manufacturing cost.

[0037] See Figure 5The diagram illustrates a pad structure provided in this application embodiment, which may include: a substrate 1. The front side of the substrate 1 is provided with a common pad 11 for positive and negative electrodes, a common pad 12 for the first electrode, and a plurality of independent pads 13 for the second electrode. The common pad 11 for positive and negative electrodes, the common pad 12 for the first electrode, and the plurality of independent pads 13 for the second electrode are all spaced apart from each other. The common pad 11 for positive and negative electrodes is used to fix the red light chip of the positive electrode or the red light chip of the negative electrode. The number of independent pads 13 for the second electrode is equal to the number of chips on the substrate 1. When three chips need to be set on the substrate 1, three independent pads 13 for the second electrode are formed on the front side of the substrate 1. When four chips need to be set on the substrate 1, four independent pads 13 for the second electrode are formed on the front side of the substrate 1. In this embodiment, one red light chip, one green light chip, and one blue light chip can be set, and three independent pads 13 for the second electrode are set accordingly. The common pad 11 for the positive and negative electrodes, the common pad 12 for the first electrode, and the multiple independent pads 13 for the second electrode are all spaced apart from each other. It can be understood that the common pad 11 for the positive and negative electrodes, the common pad 12 for the first electrode, and the multiple independent pads 13 for the second electrode are all spaced apart, not connected to each other, and not directly conductive to each other. Each pad is independent of the others.

[0038] Based on the above technical solutions, see [link to relevant documentation]. Figure 6 As shown, the back side of the substrate 1 is also provided with a first electrode pin 14 and a plurality of second electrode pins 15. The first electrode pin 14 and the plurality of second electrode pins 15 are spaced apart from each other. The first electrode pin 14 is electrically connected to the first electrode common pad 12, and each second electrode pin 15 is electrically connected to a corresponding second electrode independent pad 13. The polarities of the first electrode and the second electrode are opposite. The first electrode can be either positive or negative. When the first electrode is positive, the second electrode is negative, which can realize a common anode structure. When the first electrode is negative, the second electrode is positive, which can realize a common cathode structure. The number of second electrode pins 15 and the number of second electrode independent pads 13 are equal, so that one second electrode pin 15 can be electrically connected to one second electrode independent pad 13.

[0039] Furthermore, the common pad 11 for positive and negative electrodes can be used to fix red light chips, other chips with positive and negative electrode structures, or other scenarios that require switching between positive and negative electrodes. For example, sometimes it is necessary to connect the common pad 11 for positive electrodes to the positive electrode, and sometimes it is necessary to connect the common pad 11 for positive electrodes to the negative electrode.

[0040] This application embodiment designs a novel pad structure. By setting an independent shared pad 11 for both positive and negative electrodes, the red light chip of the positive electrode and the red light chip of the negative electrode can both be fixed on the shared pad 11. When the red light chip of the positive electrode is fixed on the shared pad 11, the shared pad 11 can be electrically connected to one of the independent second electrode pads 13 by wire bonding, and the positive electrode of the red light chip can be electrically connected to the first electrode common pad 12 by wire bonding to achieve a common anode structure. When the red light chip of the negative electrode is fixed on the shared pad 11, the shared pad 11 can be electrically connected to the first electrode common pad 12 by wire bonding. The common pad 12 is electrically connected, and the negative terminal of the red light chip is electrically connected to one of the independent pads 13 of the second electrode through wire bonding. This can also achieve a common anode structure. That is, when switching between the positive and negative electrodes of the red light chip, there is no need to change the pad structure. Only the wire bonding method of the red light chip and the common pad 11 of the positive and negative electrodes needs to be changed to achieve the same pin definition. There is also no need to design two pad structures suitable for the positive and negative electrodes of the red light chip. The screen manufacturer does not need to set up a new PCB board for the module. This can save manufacturing and management costs and solve the problem of increased management and design costs when switching between the positive and negative electrodes of the red light chip in related technologies.

[0041] Figure 6 The pin definitions for a pad structure are given. In the figure, "+" represents the positive pin, which is the first pin 14. "R-" represents the red light negative pin, "G-" represents the green light negative pin, "B-" represents the blue light negative pin, and "R-", "G-" and "B-" are the three second pins 15.

[0042] Preferably, the above-mentioned pad structure can be produced using existing processes. For example, the above-mentioned common pad 11 for positive and negative electrodes, common pad 12 for the first electrode, and multiple independent pads 13 for the second electrode can be formed on the front side of the substrate 1 by exposure, development, and etching, so that each pad is independent of the others. The first electrode pin 14 and multiple second electrode pins 15 can also be formed on the back side of the substrate 1 in the same way.

[0043] See Figure 5As shown, in some embodiments, the common pad 11 for both positive and negative electrodes has two notches 111. The two notches 111 divide the common pad 11 for both positive and negative electrodes into three interconnected parts. That is, the notches 111 do not disconnect the three parts of the common pad 11 for both positive and negative electrodes, but connect them to each other, enabling mutual conductivity. One part is the first die-bonding region 112, and the other two parts are the first wire bonding regions 113. The two first wire bonding regions 113 are symmetrically distributed on opposite sides of the first die-bonding region 112. It should be understood that the first die-bonding region 112 is used to fix the chip. In this embodiment, the first die-bonding region 112 is preferably used to fix a red light chip with positive and negative electrodes, but it can also be used to fix other chips with positive and negative electrodes. The first wire bonding regions 113 are used for wiring, to electrically connect the common pad 11 for both positive and negative electrodes to the first common pad 12 on one side, or to electrically connect the common pad 11 for both positive and negative electrodes to the second independent pad 13 on the other side. In this embodiment, by setting two notches 111, two areas can be divided more clearly, making it easier to find the die bonding and wire bonding positions during packaging. On the other hand, the notches 111 can also act as a barrier to prevent the conductive adhesive of the red light chip from spreading to the first wire bonding area 113 and affecting the wire bonding effect.

[0044] Furthermore, in some optional embodiments, the common pad 11 for the positive and negative electrodes and the plurality of independent pads 13 for the second electrodes are spaced apart around the common pad 12 for the first electrode. That is, the common pad 11 for the positive and negative electrodes and the plurality of independent pads 13 for the second electrodes are arranged around the common pad 12 for the first electrode, which makes the distribution of each pad on the substrate 1 more concentrated, which is beneficial to reducing the size of the entire substrate 1.

[0045] Preferred, see Figure 5 As shown, the first electrode common pad 12 includes a second die-bonding region 121 and a second wire bonding region 122 that are interconnected. The second wire bonding region 122 shares a pad 11 with the positive and negative electrodes, and multiple independent second electrode pads 13 are distributed around the second die-bonding region 121. It should be understood that the second die-bonding region 121 is used to fix the chip, and the second wire bonding region 122 is used to connect wires. With this arrangement, chips other than the red light chip, such as blue and green light chips, can be fixed on the second die-bonding region 121, so that the chip can be located in the middle of the substrate 1, and the pads are distributed around the chip, which facilitates wire bonding during connection and can also reduce the length of the wires. Of course, in other embodiments, chips other than the red light chip can also be fixed in other positions on the substrate 1, not limited to being fixed on the first electrode common pad 12.

[0046] This application embodiment also provides an LED lamp bead, which may include: a substrate 1, the front side of which is provided with a common pad 11 for positive and negative electrodes, a common pad 12 for the first electrode, and a plurality of independent pads 13 for the second electrode, the common pad 11 for positive and negative electrodes, the common pad 12 for the first electrode, and the plurality of independent pads 13 for the second electrode are all spaced apart from each other, a first chip 2 of the positive electrode or a first chip 2 of the negative electrode is fixed on the common pad 11, and a plurality of second chips 3 of different light-emitting colors are fixed on the common pad 12; the back side of the substrate 1 The LED is provided with a first electrode pin 14 and a plurality of second electrode pins 15, which are spaced apart from each other. The first electrode pin 14 is electrically connected to the first electrode common pad 12, and each second electrode pin 15 is electrically connected to a corresponding second electrode independent pad 13. The polarities of the first electrode and the second electrode are opposite. The LED bead in this embodiment can adopt the pad structure provided in any of the above embodiments, and the first chip 2 and a plurality of second chips 3 are fixed on the pad structure. The specific structure of the pad structure will not be described in detail here.

[0047] When the common pad 11 for both positive and negative electrodes is electrically connected to the common pad 12 for the first electrode via the first wire 4, the first chip 2 is electrically connected to one of the independent pads 13 for the second electrode via the second wire 5; when the common pad 11 for both positive and negative electrodes is electrically connected to one of the independent pads 13 for the second electrode via the first wire 4, the first chip 2 is electrically connected to the common pad 12 for the first electrode via the second wire 5. The first electrode can be either positive or negative. This embodiment uses the first electrode as positive and the first chip 2 as a red light chip as an example for explanation.

[0048] When using a red light chip with a reverse electrode, the wire connection method based on the pads proposed in this solution can be designed as follows: Figure 7 As shown. Figure 7 In this common-anode structure, the bottom of the red light chip is the positive electrode. The positive electrode at the bottom of the red light chip is electrically connected to the common pad 11 shared by the positive and negative electrodes. The common pad 11 shared by the positive and negative electrodes and the first electrode common pad 12 are connected by wire bonding, so that the positive electrode of the red light chip is electrically connected to the first electrode common pad 12 and the first electrode pin 14. The positive electrodes of the green light chip and the blue light chip are also wire bonded to the first electrode common pad 12. The negative electrodes of the red light chip, green light chip and blue light chip are respectively connected to the corresponding negative electrode pad (i.e., the second electrode independent pad 13) through wires.

[0049] When using a red light chip with a positive electrode, the wire connection method based on the pads proposed in this solution can be designed as follows: Figure 8 As shown. Figure 8In this common-anode structure, the bottom of the red light chip is the negative electrode. The negative electrode at the bottom of the red light chip is electrically connected to the common pad 11 of the positive and negative electrodes. The common pad 11 of the positive and negative electrodes and the negative electrode pad (i.e., the second independent pad 13) are connected by wire bonding, so that the negative electrode of the red light chip is electrically connected to the second independent pad 13 and the second electrode pin 15. The negative electrodes of the green light chip and the blue light chip are respectively connected to the corresponding negative electrode pad (i.e., the second independent pad 13) through wires. The positive electrodes of the red light chip, the green light chip, and the blue light chip are all connected to the first common pad 12 by wire bonding.

[0050] Thus, with the pad structure proposed in this solution, when switching between the positive and negative electrodes of the red light chip, only the wire bonding method needs to be changed to achieve conduction and achieve the same pin definition. Compared with the traditional pad structure, this solution does not require changes to the pad structure, which can effectively save management and design costs.

[0051] This application also provides a display module, which includes a plurality of the aforementioned LED beads. The LED beads in this embodiment can achieve the same technical effects as the aforementioned LED beads, and the specific structure of the LED beads will not be described in detail.

[0052] Furthermore, in some embodiments, among the multiple LED beads, some LED beads use the first chip 2 with a positive electrode, and some LED beads use the first chip 2 with a negative electrode. That is, all LED beads in a display module can use the first chip 2 with a positive electrode, or all LED beads can use the first chip 2 with a negative electrode. In this embodiment, a display module is designed such that some LED beads use the first chip 2 with a positive electrode, and some LED beads use the first chip 2 with a negative electrode. In this case, the area with high brightness requirements of the display module (such as the middle area of ​​the display module) can be set as the first chip 2 with a negative electrode, and the area with low brightness requirements (such as the edge area of ​​the display module) can be set as the first chip 2 with a positive electrode. This setting satisfies the brightness requirements of the display module and reduces the cost of the entire display module.

[0053] This application also provides a packaging method for the above-mentioned LED lamp beads, the packaging method may include the following steps:

[0054] Step 1: Fix the first chip 2 of the positive electrode to the common pad 11 of the positive and negative electrodes, and fix multiple second chips 3 with different light emission colors to the common pad 12 of the first electrode.

[0055] Step 2: Connect the common pad 11 of the positive and negative electrodes to one of the independent pads 13 of the second electrode through the first wire 4, connect the first electrode of the first chip 2 to the common pad 12 of the first electrode through the second wire 5, connect the first electrode of the second chip 3 to the common pad 12 of the first electrode through the third wire 6, and connect the second electrode of the second chip 3 to the corresponding independent pad 13 of the second electrode through the fourth wire 7.

[0056] Step 3: Determine if the brightness of the LED bead meets the preset conditions. If it does not meet the preset conditions, remove the first chip 2 of the positive electrode, switch the first chip 2 of the negative electrode to the common pad 11 for both positive and negative electrodes, and connect the common pad 11 to the common pad 12 of the first electrode through the first wire 4. Connect the second electrode of the first chip 2 to one of the independent pads 13 of the second electrode through the second wire 5. Here, the preset conditions are the set brightness values. When the brightness of the LED bead reaches the set brightness value, the preset conditions are met; when the brightness of the LED bead does not reach the set brightness value, the preset conditions are not met.

[0057] That is, in this embodiment, when packaging LED beads, the first chip 2 with the positive electrode is selected first. If the brightness of the first chip 2 with the positive electrode structure is insufficient, it can be switched to the reverse electrode structure.

[0058] Furthermore, the packaging method may also include: forming the common pad 11 for the positive and negative electrodes, the common pad 12 for the first electrode, and a plurality of independent pads 13 for the second electrode on the front side of the substrate 1 by means of exposure, development and etching, such that the common pad 11 for the positive and negative electrodes, the common pad 12 for the first electrode, and the plurality of independent pads 13 for the second electrode are all spaced apart from each other.

[0059] This application features a completely new pad structure that allows for conductive connection even when switching between positive and negative electrode red light chips. This ensures that the pin definitions of the device remain consistent after switching, eliminating the need for module redesign or changes to the pad structure design.

[0060] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0061] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0062] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A pad structure, characterized in that, It includes: The substrate (1) has a common pad for positive and negative electrodes (11), a common pad for the first electrode (12), and a plurality of independent pads for the second electrode (13) on its front side. The common pad for positive and negative electrodes (11), the common pad for the first electrode (12), and the plurality of independent pads for the second electrode (13) are all spaced apart from each other. The common pad for positive and negative electrodes (11) is used to fix the red light chip of the positive electrode or the red light chip of the negative electrode. The common pad for positive and negative electrodes (11) has two notches (111). The two notches (111) divide the common pad for positive and negative electrodes (11) into three interconnected parts. One part is the first die bonding area (112), and the other two parts are the first wire bonding areas (113). The two first wire bonding areas (113) are symmetrically distributed on opposite sides of the first die bonding area (112). The back side of the substrate (1) is provided with a first electrode pin (14) and a plurality of second electrode pins (15). The first electrode pin (14) and the plurality of second electrode pins (15) are spaced apart from each other. The first electrode pin (14) is electrically connected to the first electrode common pad (12), and each second electrode pin (15) is electrically connected to a corresponding second electrode independent pad (13). The polarities of the first electrode and the second electrode are opposite.

2. The pad structure as described in claim 1, characterized in that, The common pad (11) for the positive and negative electrodes and a plurality of independent pads (13) for the second electrodes are distributed at intervals around the common pad (12) for the first electrode.

3. The pad structure as described in claim 2, characterized in that, The first electrode common pad (12) includes a second die bonding region (121) and a second wire bonding region (122) that are connected to each other. The second wire bonding region (122) shares a pad (11) with the positive and negative electrodes. A plurality of second electrode independent pads (13) are distributed around the second die bonding region (121).

4. An LED lamp bead, characterized in that, It includes: The substrate (1) has a common pad for positive and negative electrodes (11), a common pad for the first electrode (12), and a plurality of independent pads for the second electrode (13) on its front side. The common pad for positive and negative electrodes (11), the common pad for the first electrode (12), and the plurality of independent pads for the second electrode (13) are all spaced apart from each other. A first chip (2) of the positive electrode or a first chip (2) of the negative electrode is fixed on the common pad for positive and negative electrodes (11). A plurality of second chips (3) with different light emission colors are fixed on the common pad for the first electrode (12). The back side of the substrate (1) is provided with a first electrode pin (14) and a plurality of second electrode pins (15). The first electrode pin (14) and the plurality of second electrode pins (15) are spaced apart from each other. The first electrode pin (14) is electrically connected to the first electrode common pad (12), and each second electrode pin (15) is electrically connected to a corresponding second electrode independent pad (13). The polarities of the first electrode and the second electrode are opposite. When the common pad (11) of the positive and negative electrodes is electrically connected to the first common pad (12) of the first electrode through the first wire (4), the first chip (2) is electrically connected to one of the second independent pads (13) of the second electrode through the second wire (5); when the common pad (11) of the positive and negative electrodes is electrically connected to one of the second independent pads (13) of the second electrode through the first wire (4), the first chip (2) is electrically connected to the first common pad (12) of the first electrode through the second wire (5).

5. A display module, characterized in that, The display module includes a plurality of LED beads as described in claim 4.

6. A method for packaging LED beads as described in claim 4, characterized in that, The encapsulation method includes: The first chip (2) of the positive electrode is fixed to the common pad (11) of the positive and negative electrodes, and multiple second chips (3) with different light emission colors are fixed to the common pad (12) of the first electrode. The first wire (4) connects the common pad (11) of the positive and negative electrodes to one of the independent pads (13) of the second electrode; the second wire (5) connects the first electrode of the first chip (2) to the common pad (12) of the first electrode; the third wire (6) connects the first electrode of the second chip (3) to the common pad (12) of the first electrode; and the fourth wire (7) connects the second electrode of the second chip (3) to the corresponding independent pad (13) of the second electrode. Determine whether the brightness of the LED bead meets the preset conditions. If it does not meet the preset conditions, remove the first chip (2) of the positive electrode, switch the first chip (2) of the reverse electrode to the common pad (11) of the positive and negative electrodes, and connect the common pad (11) of the positive and negative electrodes to the common pad (12) of the first electrode through the first wire (4), and connect the second electrode of the first chip (2) to one of the independent pads (13) of the second electrode through the second wire (5).

7. The packaging method as described in claim 6, characterized in that, The encapsulation method further includes: The common pad (11) for the positive and negative electrodes, the common pad (12) for the first electrode, and a plurality of independent pads (13) for the second electrode are formed on the front side of the substrate (1) by means of exposure, development and etching, such that the common pad (11) for the positive and negative electrodes, the common pad (12) for the first electrode, and the plurality of independent pads (13) for the second electrode are all spaced apart from each other.

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