Pin-free adhesive LED lamp and preparation method thereof

Abstract

This invention belongs to the field of lighting technology and discloses an LED lamp without lead adhesive and its manufacturing method. The LED lamp without lead adhesive includes a lens assembly, a lead assembly, and a bracket encapsulation assembly. The bracket encapsulation assembly includes a bracket portion and an encapsulation portion. The lead assembly is disposed on the bracket portion, and the encapsulation portion is disposed on the bracket portion, with the encapsulation portion partially covering the lead assembly. The lens assembly is disposed at the end of the encapsulation portion away from the bracket portion. A raised adhesive-blocking platform is provided between the bracket portion and the encapsulation portion, and the adhesive-blocking platform is arranged correspondingly to the lead assembly. The adhesive-blocking platform is used to prevent the diffusion and adsorption of the encapsulation medium forming the encapsulation portion onto the lead assembly. By providing a raised adhesive-blocking platform corresponding to the lead assembly, the diffusion of the encapsulation medium is physically blocked, eliminating the risk of adhesive adhesion, improving encapsulation reliability, reducing the defect rate, and ensuring product lifespan.

Description

Technical Field

[0001] This invention relates to the field of lighting technology, and in particular to an LED lamp without lead adhesive and its manufacturing method. Background Technology

[0002] In the manufacturing of LED chips (especially RGB tri-color chip packages), the reliability of the pin circuit directly determines the product's lifespan and stability. In existing technologies, LED chip packaging requires filling with epoxy resin adhesive through a dispensing process to achieve sealing and protection of the chip and bonding wires. However, because the adhesive is fluid before curing, it easily spreads along the tiny gaps between the bracket and the pins through capillary action, or propagates towards the pin area due to gravity and flow inertia, leading to frequent pin adhesion problems. As the core conductive interface of the LED chip, pin adhesion can cause poor circuit contact, pin bending failure, and other malfunctions, severely affecting the LED chip's power supply and signal transmission functions. Simultaneously, adhesion also damages the integrity of the pin surface, accelerating its aging and corrosion, reducing the LED chip's durability in high-humidity outdoor environments, and restricting the reliability of the LED chip packaging process and product yield. Summary of the Invention

[0003] The main objective of this invention is to provide an LED lamp without lead adhesive and its manufacturing method, aiming to solve the technical problem that when applying adhesive to LED lamp beads during encapsulation, the adhesive easily spreads, causing lead adhesion, circuit failure, accelerated aging, and restricting the reliability of the encapsulation and the yield of the product.

[0004] To achieve the above-mentioned objectives, this invention proposes an LED lamp that does not require lead adhesive, comprising a lens assembly, a lead assembly, and a bracket packaging assembly;

[0005] The bracket packaging assembly includes a bracket portion and a packaging portion, the pin assembly is disposed on the bracket portion, the packaging portion is disposed on the bracket portion, and the packaging portion covers a portion of the pin assembly;

[0006] The lens assembly is disposed at the end of the encapsulation portion away from the support portion;

[0007] A raised adhesive baffle is provided between the support portion and the packaging portion. The adhesive baffle is arranged corresponding to the pin assembly. The adhesive baffle is used to prevent the packaging medium forming the packaging portion from diffusing and adsorbing onto the pin assembly.

[0008] Furthermore, the pin assembly includes two first pins arranged at a relative distance from each other. Each first pin includes a first bend, a second bend, a third bend, a fourth bend, and a fifth bend. The second bend is perpendicularly connected to one end of the first bend, the third bend is perpendicularly connected to the end of the second bend away from the first bend, the fourth bend is perpendicularly connected to the end of the third bend away from the second bend, and the fifth bend is perpendicularly connected to the end of the fourth bend away from the third bend.

[0009] Furthermore, the pin assembly also includes two second pins arranged at a relative distance from each other. The second pins are spaced apart from the first pins. Each second pin includes a first connecting portion, a second connecting portion, a third connecting portion, a fourth connecting portion, and a fifth connecting portion. The second connecting portion is perpendicularly connected to one end of the first connecting portion. The third connecting portion is perpendicularly connected to the end of the second connecting portion away from the first connecting portion. The fourth connecting portion is perpendicularly connected to the end of the third connecting portion away from the second connecting portion. The fifth connecting portion is perpendicularly connected to the end of the fourth connecting portion away from the third connecting portion.

[0010] Furthermore, the pin assembly also includes two relatively spaced third pins, which are spaced apart on the side of the second pin away from the first pin. Each third pin includes a first pin portion, a second pin portion, a third pin portion, a fourth pin portion, and a fifth pin portion. The second pin portion is vertically connected to one end of the first pin portion, the third pin portion is vertically connected to the end of the second pin portion away from the first pin portion, the fourth pin portion is vertically connected to the end of the third pin portion away from the second pin portion, and the fifth pin portion is vertically connected to the end of the fourth pin portion away from the third pin portion.

[0011] Furthermore, the pin assembly also includes a die bond plate, which is integrally formed with one of the first pins. The die bond plate includes a die bond horizontal plate and a die bond vertical plate. The die bond horizontal plate is connected to the end of the fifth bend away from the fourth bend, and the die bond vertical plate is vertically connected to the end of the die bond horizontal plate away from the fifth bend. The die bond vertical plate is spaced between two opposite fifth connecting portions and two opposite fifth pin portions.

[0012] Furthermore, a first waterproof groove is formed at the end of the fifth bend near the fourth bend, a second waterproof groove is formed at the end of the fifth connecting portion near the fourth connecting portion, and a third waterproof groove is formed at the end of the fifth pin near the fourth pin. The first waterproof groove, the second waterproof groove, and the third waterproof groove are arranged in the same radial direction.

[0013] Furthermore, a first protrusion is provided on the side of the fourth bend near the fourth connecting portion, a second protrusion is provided on the side of the fourth pin near the fourth connecting portion, a first groove and a second groove are provided on the side of the fourth connecting portion near the fourth bend and the fourth pin respectively, and the first groove and the second groove are located on the side of the fourth connecting portion near the fifth connecting portion, and an encapsulation filling notch is provided on the side of the fifth bend away from the fifth connecting portion, the encapsulation filling notch extending along the entire length of the fifth bend.

[0014] Furthermore, the surface of the encapsulation portion is arranged to be inclined outward from the end near the lens assembly to the end near the adhesive blocking platform, and the surface of the support portion is arranged to be inclined inward from the end near the adhesive blocking platform to the free end of the support portion. A pin receiving groove is provided at the end of the support portion away from the adhesive blocking platform, and a portion of the pin assembly is located in the pin receiving groove.

[0015] Furthermore, the lens assembly includes a lens base and a lens body. The lens base is disposed at one end of the encapsulation portion away from the adhesive blocking platform, and the lens body is disposed at one end of the lens base away from the encapsulation portion. A polarity marking notch is formed at the end corner of the lens base corresponding to the encapsulation portion.

[0016] This invention also proposes a method for manufacturing an LED lamp without lead adhesive, comprising the LED lamp without lead adhesive described in any of the above embodiments, including:

[0017] The preset chip is fixed onto the pin assembly and then baked using the corresponding equipment.

[0018] The welding operation is completed by bonding the electrodes of the preset chip to the pin assembly using wire bonding equipment.

[0019] Epoxy resin adhesive is used to fill part of the pin assembly on the bracket to form an encapsulation part, so that the amount of adhesive is flush with the bracket cup, and then baked and cured.

[0020] Using a custom mold, epoxy resin glue is first filled into the mold, and then the entire piece of the glued bracket is inserted into the mold. After baking, it is demolded to form the lens.

[0021] The completed lens molding process involves unloading the product to obtain the finished LED lighting fixture.

[0022] Beneficial effects:

[0023] This invention discloses an LED lamp without lead adhesive, comprising a lens assembly, a lead assembly, and a bracket encapsulation assembly. The bracket encapsulation assembly includes a bracket portion and an encapsulation portion. The lead assembly is disposed on the bracket portion, and the encapsulation portion is disposed on the bracket portion, with the encapsulation portion partially covering the lead assembly. The lens assembly is disposed at the end of the encapsulation portion away from the bracket portion. A raised adhesive-blocking platform is provided between the bracket portion and the encapsulation portion, corresponding to the lead assembly. The adhesive-blocking platform is used to prevent the encapsulation medium forming the encapsulation portion from diffusing and adsorbing onto the lead assembly. By providing a raised adhesive-blocking platform corresponding to the lead assembly between the bracket portion and the encapsulation portion, the diffusion and adsorption of the encapsulation medium onto the lead assembly can be physically blocked, structurally eliminating the risk of adhesive adhesion, effectively avoiding circuit failures caused by lead adhesive, slowing down lead aging, strengthening encapsulation sealing and structural stability, significantly improving the reliability of LED lamp bead encapsulation, reducing defect rate, ensuring product lifespan and operational stability, and optimizing production yield. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of an LED lamp without lead adhesive according to an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of a pin assembly according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the first pin and die bond plate according to an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of one side of the second pin according to an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the other side of the second pin according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the third pin according to an embodiment of the present invention;

[0030] Figure 7 This is a cross-sectional view of an LED lamp without lead adhesive according to an embodiment of the present invention;

[0031] Figure 8 This is a flowchart illustrating a method for preparing an LED lamp without lead adhesive according to an embodiment of the present invention.

[0032] in:

[0033] 1. Lens assembly; 2. Pin assembly; 3. Bracket packaging assembly;

[0034] 10. Lens base; 11. Lens body; 12. Polarity marking notch;

[0035] 20. First pin; 21. Second pin; 22. Third pin; 23. Die bond plate;

[0036] 201. First bend; 202. Second bend; 203. Third bend; 204. Fourth bend; 205. Fifth bend; 206. First waterproof groove; 207. First protrusion; 208. Encapsulation filling notch;

[0037] 210. First connecting part; 211. Second connecting part; 212. Third connecting part; 213. Fourth connecting part; 214. Fifth connecting part; 215. Second waterproof groove; 216. First groove; 217. Second groove;

[0038] 220. First pin portion; 221. Second pin portion; 222. Third pin portion; 223. Fourth pin portion; 224. Fifth pin portion; 225. Third waterproof groove; 226. Second protrusion;

[0039] 230. Horizontal die bonder; 231. Vertical die bonder;

[0040] 30. Support section; 31. Encapsulation section; 32. Adhesive shield; 33. Pin receiving slot.

[0041] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0042] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0043] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0044] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0045] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0046] Reference Figure 1 , Figure 7 This embodiment provides an LED lamp without lead adhesive, including a lens assembly 1, a lead assembly 2 and a bracket packaging assembly 3;

[0047] The bracket packaging assembly 3 includes a bracket portion 30 and a packaging portion 31. The pin assembly 2 is disposed on the bracket portion 30, and the packaging portion 31 is disposed on the bracket portion 30, and the packaging portion 31 covers part of the pin assembly 2.

[0048] The lens assembly 1 is disposed at the end of the encapsulation portion 31 away from the support portion 30;

[0049] A raised adhesive blocking platform 32 is provided between the support portion 30 and the packaging portion 31. The adhesive blocking platform 32 is arranged corresponding to the pin assembly 2. The adhesive blocking platform 32 is used to prevent the packaging medium forming the packaging portion 31 from diffusing and adsorbing onto the pin assembly 2.

[0050] In the above embodiment, the lead-free LED luminaire consists of three core components: a lens assembly 1, a lead assembly 2, and a bracket encapsulation assembly 3. The bracket encapsulation assembly 3 further includes a bracket portion 30 and an encapsulation portion 31. The bracket portion 30, serving as the basic support structure of the entire luminaire, is made of high-temperature resistant, high-dimensional stability PPA plastic material. Its main function is to support the lead assembly 2 and provide a structural foundation for subsequent encapsulation. The lead assembly 2 passes through the bracket portion 30, with its lower end completely hidden and encapsulated inside the bracket portion 30, while its upper end extends upward and is partially embedded in the encapsulation portion 31, enabling electrical connection between external circuitry and the internal chip. The encapsulation portion 31, formed by curing epoxy resin adhesive, covers the bracket portion 30 and seals and protects the upper part of the lead assembly 2 and the internal chip area. The lens assembly 1 is located at the end of the encapsulation portion 31 furthest from the bracket portion 30, i.e., at the top of the entire structure, serving as an optical focusing or diffusion element. A raised adhesive-blocking platform 32 is provided at the side junction between the support portion 30 and the encapsulation portion 31, particularly on the side where the lead assembly 2 is located. This adhesive-blocking platform 32 corresponds to the lead assembly 2 and effectively intercepts the flowing epoxy resin adhesive during the dispensing process, preventing it from diffusing upwards along the tiny gap between the support portion 30 and the lead assembly 2 due to capillary action or gravity, thereby avoiding adhesive contamination of the core conductive area of ​​the lead assembly 2. By providing a raised adhesive-blocking platform 32 corresponding to the lead assembly 2 between the support portion 30 and the encapsulation portion 31, the diffusion and adsorption of the encapsulation medium to the lead assembly 2 can be physically blocked, structurally eliminating the risk of adhesive adhesion. This effectively avoids circuit failures caused by lead adhesion, slows down lead aging, enhances encapsulation sealing and structural stability, significantly improves the reliability of LED chip encapsulation, reduces defect rates, ensures product lifespan and operational stability, and optimizes production yield.

[0051] Reference Figures 1-3 In one embodiment, the pin assembly 2 includes two first pins 20 arranged at a relative distance. The first pins 20 include a first bend 201, a second bend 202, a third bend 203, a fourth bend 204, and a fifth bend 205. The second bend 202 is vertically connected to one end of the first bend 201. The third bend 203 is vertically connected to the end of the second bend 202 away from the first bend 201. The fourth bend 204 is vertically connected to the end of the third bend 203 away from the second bend 202. The fifth bend 205 is vertically connected to the end of the fourth bend 204 away from the third bend 203.

[0052] In the above embodiment, the pin assembly 2 includes two first pins 20, which are arranged opposite to each other and spaced apart to meet the requirements of electrical isolation and structural stability. Each first pin 20 is composed of five sequentially connected bends, namely a first bend 201, a second bend 202, a third bend 203, a fourth bend 204, and a fifth bend 205. These five bends are not independent parts, but are integrally formed structures, ensuring the reliability of the pin in terms of mechanical strength and conductive continuity. The bends are connected vertically: the second bend 202 is vertically connected to one end of the first bend 201; the third bend 203 is vertically connected to the end of the second bend 202 away from the first bend 201; the fourth bend 204 is vertically connected to the end of the third bend 203 away from the second bend 202; and finally, the fifth bend 205 is vertically connected to the end of the fourth bend 204 away from the third bend 203. This multi-level vertical bending design gives the entire first pin 20 a spatially three-dimensional "stepped" or "Z-shaped extension" structure, enabling precise pin positioning and functional partitioning within a limited space. Furthermore, all corner connections between adjacent bends employ a chamfered connection structure, smoothing out right-angle transition areas to avoid sharp edges. The two first pins 20 are arranged in a mirror-symmetrical or parallel configuration, with their spacing precisely calculated to ensure electrical safety distances, improve pin mechanical strength and process compatibility, while also guaranteeing electrical reliability and package compatibility.

[0053] Reference Figures 1-4 In one embodiment, the pin assembly 2 further includes two second pins 21 arranged at a distance from each other. The second pins 21 are arranged at a distance from the first pin 20. The second pins 21 include a first connecting portion 210, a second connecting portion 211, a third connecting portion 212, a fourth connecting portion 213, and a fifth connecting portion 214. The second connecting portion 211 is perpendicularly connected to one end of the first connecting portion 210. The third connecting portion 212 is perpendicularly connected to the end of the second connecting portion 211 away from the first connecting portion 210. The fourth connecting portion 213 is perpendicularly connected to the end of the third connecting portion 212 away from the second connecting portion 211. The fifth connecting portion 214 is perpendicularly connected to the end of the fourth connecting portion 213 away from the third connecting portion 212.

[0054] In the above embodiment, the pin assembly 2 further includes two second pins 21, which are arranged opposite to each other and spaced apart, maintaining a predetermined distance between them to meet the requirements of electrical isolation and structural layout. Each second pin 21 consists of five sequentially connected connecting portions, namely a first connecting portion 210, a second connecting portion 211, a third connecting portion 212, a fourth connecting portion 213, and a fifth connecting portion 214. These five connecting portions are integral structures formed from the same metal material, ensuring a high degree of consistency in the pins in terms of conductive continuity and mechanical strength. The connection relationship between the connecting portions is a stepwise vertical extension: the second connecting portion 211 is vertically connected to one end of the first connecting portion 210; the third connecting portion 212 is vertically connected to the end of the second connecting portion 211 away from the first connecting portion 210; the fourth connecting portion 213 is vertically connected to the end of the third connecting portion 212 away from the second connecting portion 211; and the fifth connecting portion 214 is vertically connected to the end of the fourth connecting portion 213 away from the third connecting portion 212. This results in a three-dimensional, multi-directional pin configuration that precisely adapts to the three-dimensional layout requirements within the package. All corners of adjacent connections utilize a chamfered connection structure, smoothing out the original right-angle transitions. The two second pins 21 and the aforementioned two first pins 20 are configured collaboratively in the overall layout: the second pin 21 on each side and the corresponding first pin 20 on the same radial direction are positioned with a certain distance between them, avoiding mutual interference and facilitating chip bonding and external circuit identification. Furthermore, the two second pins 21 are preferably used as red and green control pins, respectively, enabling independent electrical control of different light-emitting chips. This improves the mechanical reliability and electrical independence of the second pins 21, facilitating precise control of the red and green light chips.

[0055] Reference Figures 1-6 In one embodiment, the pin assembly 2 further includes two relatively spaced third pins 22, which are spaced apart on the side of the second pin 21 away from the first pin 20. Each third pin 22 includes a first pin portion 220, a second pin portion 221, a third pin portion 222, a fourth pin portion 223, and a fifth pin portion 224. The second pin portion 221 is vertically connected to one end of the first pin portion 220, the third pin portion 222 is vertically connected to the end of the second pin portion 221 away from the first pin portion 220, the fourth pin portion 223 is vertically connected to the end of the third pin portion 222 away from the second pin portion 221, and the fifth pin portion 224 is vertically connected to the end of the fourth pin portion 223 away from the third pin portion 222.

[0056] In the above embodiment, the pin assembly 2 further includes two third pins 22, which are arranged opposite to each other and spaced apart, maintaining a predetermined distance to ensure electrical isolation and structural stability. Each third pin 22 consists of five pin portions connected in sequence: a first pin portion 220, a second pin portion 221, a third pin portion 222, a fourth pin portion 223, and a fifth pin portion 224. These five pin portions are integrally formed from the same conductive metal material, creating a continuous, weld-free integral structure. The connection between the pin portions is a progressively vertical extension: the second pin portion 221 is vertically connected to one end of the first pin portion 220; the third pin portion 222 is vertically connected to the end of the second pin portion 221 away from the first pin portion 220; the fourth pin portion 223 is vertically connected to the end of the third pin portion 222 away from the second pin portion 221; and the fifth pin portion 224 is vertically connected to the end of the fourth pin portion 223 away from the third pin portion 222. This constitutes a three-dimensional pin configuration with multi-directional spatial transition characteristics, which can accurately adapt to the complex three-dimensional wiring requirements within the package. All corner connections between adjacent pins employ a chamfered connection structure, smoothing out the original right-angle transition area. The third pin 22, second pin 21, and first pin 20 on each side are arranged sequentially along the same radial direction, with the second pin 21 positioned between the third pin 22 and the first pin 20. These three pins maintain a certain distance from each other, preventing electrical short circuits and reserving operating space for wire bonding and packaging. Of the two third pins 22, one is designated as the blue control pin, used to drive the blue light-emitting unit; the other serves as an auxiliary / extension pin, usable for signal feedback, backup functions, or future functional expansion. This enhances the device's flexibility and integration, fulfilling the dual requirements of blue light control and functional expansion, while ensuring electrical isolation and structural reliability.

[0057] Reference Figures 1-6 In one embodiment, the pin assembly 2 further includes a die bond plate 23, which is integrally formed with one of the first pins 20. The die bond plate 23 includes a die bond horizontal plate 230 and a die bond vertical plate 231. The die bond horizontal plate 230 is connected to the end of the fifth bend 205 away from the fourth bend 204, and the die bond vertical plate 231 is vertically connected to the end of the die bond horizontal plate away from the fifth bend 205. The die bond vertical plate 231 is spaced between two opposing fifth connecting portions 214 and two opposing fifth pin portions 224.

[0058] In the above embodiment, the pin assembly 2 further includes a die bond plate 23, which is integrally formed with one of the first pins 20. The fifth bend 205 of the first pin 20 is smaller than the fifth bend 205 of the other first pin 20, forming an integrated conductive and load-bearing structure. The die bond plate 23 is generally L-shaped and consists of two parts: a horizontal die bond plate 230 and a vertical die bond plate 231. One end of the horizontal die bond plate 230 is connected to the end of the smaller fifth bend 205 of the first pin 20 that is away from the fourth bend 204, while the vertical die bond plate 231 is vertically connected to the other end of the horizontal die bond plate 230 that is away from the fifth bend 205, thereby forming a stable right-angle support structure. In terms of spatial layout, the die bond vertical plate 231 is precisely positioned between the two relatively arranged fifth connecting portions 214 (belonging to the second pin 21) and the two relatively arranged fifth pin portions 224 (belonging to the third pin 22), maintaining a certain distance from them to avoid electrical short circuits and providing a central positioning area for chip mounting. The core function of the die bond plate 23 is to fix the RGB three-color chip, and its surface serves as a platform for chip mounting. It is worth noting that although the two first pins 20 have the same overall structure, there is a difference in the size of the fifth bend 205: the fifth bend 205 of the first pin 20 connected to the die bond plate 23 is smaller to accommodate the connection requirements of the die bond horizontal plate 230; while the fifth bend 205 of the other first pin 20 not connected to the die bond plate 23 is larger, for structural balance and redundancy design. Among them, the first pin 20 connected to the die bond plate 23 is defined as a common terminal pin, undertaking the main circuit conduction function; the first pin 20 not connected to the die bond plate 23 serves as a redundant backup pin, which can be enabled or reserved for use in specific circuit configurations. In addition, the upper surfaces of the die bond 23, the fifth bends 205 of all first pins 20, the fifth connection 214 of the second pin 21, and the fifth pin portion 224 of the third pin 22 are all designed to be on the same horizontal plane. This coplanar design ensures that the upper surfaces of these critical areas will not be covered by epoxy resin adhesive during the subsequent encapsulation dispensing process, thereby preserving good heat dissipation channels and bonding wire contact surfaces, and improving the thermal management performance and electrical reliability of the device.

[0059] Reference Figures 1-6 In one embodiment, a first waterproof groove 206 is formed at one end of the fifth bending portion 205 near the fourth bending portion 204, a second waterproof groove 215 is formed at one end of the fifth connecting portion 214 near the fourth connecting portion 213, and a third waterproof groove 225 is formed at one end of the fifth pin portion 224 near the fourth pin portion 223. The first waterproof groove 206, the second waterproof groove 215, and the third waterproof groove 225 are arranged in the same radial direction.

[0060] In the above embodiment, three waterproof grooves are provided at key locations of the pin assembly 2: a first waterproof groove 206, a second waterproof groove 215, and a third waterproof groove 225, which together form a secondary protective barrier against moisture intrusion. The first waterproof groove 206 is formed at the end of the fifth bend 205 near the fourth bend 204, the second waterproof groove 215 is formed at the end of the fifth connector 214 near the fourth connector 213, and the third waterproof groove 225 is formed at the end of the fifth pin 224 near the fourth pin 223. These three waterproof grooves extend along the entire width of their respective components, ensuring that the barrier effect covers the entire width of the pin, leaving no gaps for penetration. Structurally, all waterproof grooves are V-shaped grooves with a "V"-shaped concave cross-section. This geometry facilitates full filling and anchoring by molten epoxy resin during the encapsulation process, forming a dense physical barrier after curing. In terms of spatial layout, the first waterproof groove 206, the second waterproof groove 215, and the third waterproof groove 225 on each side are strictly located on the same radial straight line, that is, the three are aligned into a straight line in the horizontal projection, making the defense line continuous and uninterrupted in the radial direction. This collinear arrangement is not accidental, but based on the overall layout logic of the pin assembly 2. Since the fifth bend 205 (belonging to the first pin 20), the fifth connection 214 (belonging to the second pin 21), and the fifth pin 224 (belonging to the third pin 22) are arranged sequentially in the same radial direction, V-grooves are synchronously set in their adjacent bend / connection transition areas, which can effectively block the path of moisture penetration from the outside to the inside along the pin-package interface. When the encapsulation adhesive is injected and cured, the adhesive flows into and completely fills these V-grooves, significantly extending the moisture diffusion path, thereby greatly improving the long-term reliability of the device in high humidity environments.

[0061] Reference Figures 1-6 In one embodiment, a first protrusion 207 is provided on the side of the fourth bending portion 204 near the fourth connecting portion 213, a second protrusion 226 is provided on the side of the fourth pin portion 223 near the fourth connecting portion 213, a first groove 216 and a second groove 217 are provided on the side of the fourth connecting portion 213 near the fourth bending portion 204 and the fourth pin portion 223 respectively, and the first groove 216 and the second groove 217 are located on the side of the fourth connecting portion 213 near the fifth connecting portion 214, and an encapsulation filling notch 208 is provided on the side of the fifth bending portion 205 away from the fifth connecting portion 214, the encapsulation filling notch 208 extending along the entire length of the fifth bending portion 205.

[0062] In the above embodiment, a first protrusion 207 is provided on the side of the fourth bend 204 near the fourth connecting portion 213, and a second protrusion 226 is provided on the side of the fourth pin portion 223 near the fourth connecting portion 213. Correspondingly, a first groove 216 and a second groove 217 are respectively provided on both sides of the fourth connecting portion 213 near the fourth bend 204 and the fourth pin portion 223, and both grooves are located on the side of the fourth connecting portion 213 near the fifth connecting portion 214, forming a symmetrical concave structure. This convex-concave fit makes the total width of the fourth bend 204 after adding the first protrusion 207 greater than the width of its front third bend 203; similarly, the total width of the fourth pin portion 223 after adding the second protrusion 226 is also greater than the width of its front third pin portion 222. In addition, the width of the fifth pin portion 224 near the fourth pin portion 223 is designed to be equal to the overall width of the fourth pin portion 223 plus the second protrusion 226, ensuring a continuous contour without abrupt changes. For the fourth connecting portion 213, the total width of its outer surface (i.e., the area without grooves) is greater than the width of the fifth connecting portion 214, while the width of the fifth connecting portion 214 is precisely equal to the distance between the bottom surfaces of the first groove 216 and the second groove 217, forming a stable limiting structure. Simultaneously, on the side of the fifth bent portion 205 away from the fifth connecting portion 214, a packaging filling notch 208 is provided along its entire length. The presence of this notch makes the effective width of the fifth bent portion 205 near the fourth bent portion 204 smaller than the width of the fourth bent portion 204 itself, thus forming an inward-shrinking area on that side. This design not only provides additional flow and anchoring space for the encapsulating adhesive but also avoids stress concentration or adhesive overflow caused by material accumulation, further improving the bonding strength and sealing of the encapsulation interface, optimizing the adhesive flow path, and enhancing the pin positioning accuracy and encapsulation bonding strength.

[0063] Reference Figures 1-7 In one embodiment, the surface of the encapsulation portion 31 is arranged to be inclined outward from the end near the lens assembly 1 toward the end near the adhesive blocking platform 32, and the surface of the support portion 30 is arranged to be inclined inward from the end near the adhesive blocking platform 32 toward the free end of the support portion 30. A pin receiving groove 33 is provided at the end of the support portion 30 away from the adhesive blocking platform 32, and a portion of the pin assembly 2 is located in the pin receiving groove 33.

[0064] In the above embodiment, the encapsulation part 31 and the support part 30 form a pair of inverted boss structures, and the two achieve functional partitioning and process coordination through precise geometric fit. The surface of the encapsulation part 31 is inclined outward from the end near the lens assembly 1 to the end near the retaining platform 32, forming a slope that facilitates demolding and optical performance; while the surface of the support part 30 is inclined inward from the end near the retaining platform 32 to its free end (i.e., the end away from the retaining platform 32, which is the bottom of the support part 30), forming an inward structure. Six pin receiving slots 33 are provided at the end of the support part 30 away from the retaining platform 32. These pin receiving slots 33 are arranged in an array, and the end near the side of the support part 30 is an open structure, which facilitates the insertion and positioning of the bottom of the pin assembly 2. The components of the pin assembly 2 are embedded in the support portion 30 and the encapsulation portion 31 in a hierarchical manner: Specifically, the two first bending portions 201, the two first connecting portions 210, and the two first pin portions 220 are respectively located within the six pin receiving slots 33; portions of the second bending portion 202, the third bending portion 203, the second connecting portion 211, the third connecting portion 212, the second pin portion 221, and the third pin portion 222 are encapsulated inside the support portion 30; while the fourth bending portion 204 and the fifth bending portion 205, the fourth connecting portion 213 and the fifth connecting portion 214, and the fourth pin portion 223 and the fifth pin portion 224 are encapsulated within the encapsulation portion 31.

[0065] A retaining plate 32 is provided at the junction of the top of the support portion 30 and the encapsulation portion 31. Its size is larger than the top of the support portion 30, thus forming a protruding structure similar to an "eaves" above the support portion 30. On the side corresponding to the lead assembly 2, the width of the bottom of the encapsulation portion 31 is smaller than the width of the retaining plate 32, creating a horizontal retaining platform between the encapsulation portion 31 and the retaining plate 32 on that side to intercept adhesive flow. On the two sides corresponding to the absence of the lead assembly 2, the bottom edge of the encapsulation portion 31 is flush with the side edge of the retaining plate 32, maintaining a consistent appearance. Furthermore, an open receiving groove is provided at the end of the encapsulation portion 31 away from the support portion 30 for placing the LED chip. It is worth noting that approximately one-quarter of the width of each of the second bending portion 202, the second connecting portion 211, and the second lead portion 221 is not encapsulated. The width of this exposed area is less than or equal to the outward protrusion width of the retaining plate 32, ensuring that even if a small amount of adhesive creeps up, it will not contaminate the critical conductive areas of the lead. The inclined boss structure and the eaves-type adhesive shield 32 work together to precisely control the adhesive coverage area, effectively preventing the pins from sticking with adhesive and improving the sealing performance of the package.

[0066] Reference Figures 1-7In one embodiment, the lens assembly 1 includes a lens base 10 and a lens body 11. The lens base 10 is disposed at one end of the encapsulation portion 31 away from the adhesive blocking platform 32, and the lens body 11 is disposed at one end of the lens base 10 away from the encapsulation portion 31. A polarity marking notch 12 is formed at the end corner of the lens base 10 corresponding to the encapsulation portion 31.

[0067] In the above embodiment, the lens assembly 1 consists of two parts: a lens base 10 and a lens body 11. These two parts work together to achieve optical functions and polarity identification. The lens base 10, as an intermediate structure connecting the encapsulation part 31 and the lens body 11, is located at the end of the encapsulation part 31 away from the adhesive blocking platform 32, i.e., at the top bottom of the entire device, directly attached to the upper surface of the encapsulation part 31. The lens body 11 is located at the end of the lens base 10 away from the encapsulation part 31, i.e., at the top of the entire device, and is used to focus, diffuse, or distribute the light emitted by the LED chip. The lens body 11 has a geometric shape composed of a cylindrical portion and a semi-circular portion: the cylindrical portion is located at the bottom, adjacent to and connected to the lens base 10; the semi-circular portion is located at the top, forming a curved light-emitting surface at the top. This overall outline spatially corresponds to the opening receiving groove provided inside the encapsulation part 31, ensuring that light emitted from the chip can efficiently enter the lens body 11 to achieve the desired optical effect. At one corner of the area where the lens base 10 meets the package 31, a polarity marking notch 12 is provided. This notch is formed by cutting a triangular portion at one corner of the lens base 10 and simultaneously cutting a matching triangular notch at the corresponding corner of the package 31. Together, they form a continuous and distinct notch structure, namely the polarity marking notch 12. This notch is not decorative but serves as a direction identification mark during device installation, used to quickly and accurately determine the positive and negative terminals or pin numbers of LED lamps during automated surface mounting or manual assembly, avoiding circuit failures caused by reverse installation. The lens base 10 and the package 31 jointly form the polarity marking notch 12, combined with the composite curved lens body 11, balancing optical performance and assembly direction identification, improving production efficiency and reliability.

[0068] Reference Figures 1-8 The present invention also proposes a method for manufacturing an LED lamp without lead adhesive, comprising the LED lamp without lead adhesive described in any of the above embodiments, including:

[0069] S1: Fix the preset chip onto pin assembly 2 and bake it using the corresponding equipment;

[0070] S2: The electrodes of the preset chip are bonded to the pin assembly 2 using wire bonding equipment to complete the bonding operation;

[0071] S3: Use epoxy resin adhesive to fill part of the pin assembly 2 on the bracket 30 to form the encapsulation part 31, so that the amount of adhesive is flush with the bracket cup, and then bake and cure.

[0072] S4: Using a custom mold, first fill the mold with epoxy resin glue, then insert the entire piece of the glued bracket upside down into the mold, and after baking, demold to form the lens;

[0073] S5: Perform the unloading operation on the completed lens-forming product to obtain the finished LED lamp.

[0074] In the above embodiment, the preset RGB three-color chips are first precisely fixed on the die-bonding plate 23 of the pin assembly 2, and the chips are then baked at a specific temperature to achieve a stable bond between the chips and the die-bonding plate 23. As mentioned above, the die-bonding plate 23 has an L-shaped structure (die-bonding horizontal plate 230 + die-bonding vertical plate 231), which is integrally formed with one of the first pins 20. The surface of the die-bonding plate 23 is coplanar with the upper surfaces of the fifth bending portion 205 of the first pin 20, the fifth connecting portion 214 of the second pin 21, and the fifth pin portion 224 of the third pin 22. This coplanar design provides a flat support platform for chip fixing. In specific operation, the red chip, green chip, and blue chip are first bonded to the designated areas of the die-bonding vertical plate 231 by the high-precision positioning mechanism of the die-bonding machine. A small amount of thermally and electrically conductive adhesive is applied to the chip bonding surface to enhance the connection reliability. Then, the pin assembly 2 with the chips is placed in the baking equipment and baked continuously at a temperature of 170°C for 2.5 hours to ensure the chip installation accuracy and the continuity of electrical and thermal conductivity.

[0075] Next, the electrodes of the RGB three-color chips are electrically connected to the corresponding pins of the pin assembly 2 using wire bonding equipment to construct a complete circuit path. The functional division of the pin assembly 2 has been clearly defined above: the first pin 20 contains a common terminal pin, the second pins 21 are the red and green control pins respectively, and the third pin 22 contains a blue control pin. During operation, the metal welding pins of the wire bonding machine first lead metal wires from the positive and negative electrodes of the red chip and precisely bind them to the fifth connecting part 214 of one of the second pins 21 (red control pins) and the fifth bending part 205 of the common terminal first pin 20; then, the electrodes of the green chip are bound to the fifth connecting part 214 of another second pin 21 (green control pin) and the common terminal first pin 20 via metal wires; finally, the electrodes of the blue chip are bound to the fifth pin part 224 of one of the third pins 22 (blue control pins) and the common terminal first pin 20. During the soldering process, the metal wires must avoid the waterproof groove areas of the die bonder 23 and each pin, and the bonding points must be in close contact with the "coplanar surfaces" mentioned above to ensure that the contact resistance is minimized and to prevent the metal wires from short-circuiting with other pins, thereby realizing the independent electrical control function of the three-color chip.

[0076] Next, epoxy resin adhesive is used to fill the support portion 30, forming the encapsulation portion 31, and curing is achieved through staged baking. Simultaneously, the adhesive barrier 32 structure prevents the leads from sticking. As previously mentioned, the surface of the support portion 30 is inclined inwards, with a lead receiving groove 33 at the bottom, and a raised adhesive barrier 32 between the support portion 30 and the encapsulation portion 31. During operation, the dispensing nozzle of the dispensing machine is aligned with the chip receiving area at the top of the support portion 30, and epoxy resin adhesive is injected, strictly controlling the amount of adhesive to be level with the support cup—this amount ensures that the chip, bonding wires, and the fourth to fifth bends 205 / connection / lead portion of the leads are completely covered, without overflowing due to excessive adhesive. The subsequent baking and curing process begins: first, baking at a low temperature of 120℃ for 2 hours to allow the adhesive to initially solidify and set; then, the temperature is increased to a high temperature of 150℃ for 3 hours to ensure complete curing of the adhesive, forming a dense encapsulation portion 31. During this process, the adhesive blocking platform 32 plays a key role in physically blocking the diffusion of the flowing adhesive to the first to third bending portions 203 / connection portions / pin portions of the pins, completely preventing the pins from sticking with adhesive. At the same time, the adhesive will fill the first, second, and third V-shaped waterproof grooves mentioned above, forming a moisture barrier and enhancing the reliability of the packaging.

[0077] Then, the lens assembly 1 is integrally molded using a custom mold, simultaneously achieving a stable connection between the lens and the encapsulation part 31. As mentioned earlier, the lens assembly 1 includes a lens base 10 and a "cylindrical + semi-circular" composite curved surface lens body 11, and the lens base 10 and the encapsulation part 31 need to form a polarity marking notch 12. During operation, first clean the inner wall of the cavity of the custom mold, and then evenly fill the cavity with epoxy resin glue, the amount of glue needing to match the volume of the lens body 11; then, insert the entire piece of the bracket that has been glued and encapsulated upside down into the mold, so that the end of the encapsulation part 31 away from the bracket part 30 is in full contact with the glue in the mold, and ensure that the inclined surface of the bracket part 30 fits the mold positioning structure, and the preset notch position of the lens base 10 is aligned with the notch marking of the mold. The mold is then placed in a baking device and baked at 150°C for 1 hour to cure the adhesive and firmly bond it to the encapsulation part 31. After baking, the product is removed by the mold demolding mechanism. At this time, the lens is integrally formed—the composite curved surface of the lens body 11 corresponds precisely to the chip position in the encapsulation part 31, and the lens base 10 and the end corner of the encapsulation part 31 together form the polarity marking notch 12, perfectly matching the structure of the lens assembly 1 described above.

[0078] Finally, the LED lamp with the completed lens molding is removed from the production line, completing the final product manufacturing process. After the first four steps, the product has formed a complete structure: the bracket part 30 carries the pin assembly 2, the encapsulation part 31 seals the core components, and the lens assembly 1 realizes optical and recognition functions. All structures meet the design requirements mentioned above—the glue-blocking platform 32 has no glue overflow, the waterproof groove is completely filled, the pins are free of adhesive, and the polarity notches are clear. During operation, the product is removed from the conveyor line after demolding using automated unloading equipment or manually, avoiding contact with the surface of the lens body 11 and the exposed parts of the pins to prevent scratches or pin deformation. After unloading, the product can enter the subsequent testing and packaging stages, ultimately forming a finished LED lamp without pin adhesive. Its structure and function fully match all the design features mentioned above, achieving a closed-loop product manufacturing process, ensuring that the finished product quality meets the design standards, laying the foundation for subsequent testing, packaging, and market application, and realizing a closed loop in the entire manufacturing process.

[0079] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A lead-free LED lamp, characterized in that, Includes lens assembly, pin assembly, and bracket packaging assembly; The bracket packaging assembly includes a bracket portion and a packaging portion, the pin assembly is disposed on the bracket portion, the packaging portion is disposed on the bracket portion, and the packaging portion covers a portion of the pin assembly; The lens assembly is disposed at the end of the encapsulation portion away from the support portion; A raised adhesive baffle is provided between the support portion and the packaging portion. The adhesive baffle is arranged corresponding to the pin assembly. The adhesive baffle is used to prevent the packaging medium forming the packaging portion from diffusing and adsorbing onto the pin assembly. The pin assembly includes two first pins arranged at a relative interval. Each first pin includes a first bend, a second bend, a third bend, a fourth bend, and a fifth bend. The second bend is perpendicularly connected to one end of the first bend. The third bend is perpendicularly connected to the end of the second bend away from the first bend. The fourth bend is perpendicularly connected to the end of the third bend away from the second bend. The fifth bend is perpendicularly connected to the end of the fourth bend away from the third bend. The pin assembly further includes two second pins arranged at a relative distance from each other. The second pins are spaced apart from the first pins. Each second pin includes a first connecting portion, a second connecting portion, a third connecting portion, a fourth connecting portion, and a fifth connecting portion. The second connecting portion is perpendicularly connected to one end of the first connecting portion. The third connecting portion is perpendicularly connected to the end of the second connecting portion away from the first connecting portion. The fourth connecting portion is perpendicularly connected to the end of the third connecting portion away from the second connecting portion. The fifth connecting portion is perpendicularly connected to the end of the fourth connecting portion away from the third connecting portion. The pin assembly further includes two relatively spaced third pins, which are spaced apart on the side of the second pin away from the first pin. Each third pin includes a first pin portion, a second pin portion, a third pin portion, a fourth pin portion, and a fifth pin portion. The second pin portion is vertically connected to one end of the first pin portion, the third pin portion is vertically connected to the end of the second pin portion away from the first pin portion, the fourth pin portion is vertically connected to the end of the third pin portion away from the second pin portion, and the fifth pin portion is vertically connected to the end of the fourth pin portion away from the third pin portion. The fifth bend, fifth connecting portion, and fifth pin portion are arranged sequentially at intervals in the same direction, and the fifth bend, fifth connecting portion, and fifth pin portion are arranged on the side closer to the lens assembly relative to the first bend, first connecting portion, and first pin portion. The fourth bend portion has a first protrusion on the side closer to the fourth connecting portion, and the fourth pin portion has a second protrusion on the side closer to the fourth connecting portion. The fourth connecting portion has a first groove and a second groove on the side closer to the fourth bend portion and the fourth pin portion, respectively, and the first groove and the second groove are located on the side of the fourth connecting portion closer to the fifth connecting portion. The fifth bend portion has an encapsulation filling notch on the side away from the fifth connecting portion, and the encapsulation filling notch extends along the entire length of the fifth bend portion, and the width of the fifth bend portion on the side closer to the fourth bend portion is smaller than the width of the fourth bend portion.

2. The LED lamp without lead adhesive according to claim 1, characterized in that, The pin assembly further includes a die bonder plate, which is integrally formed with one of the first pins. The die bonder plate includes a die bonder horizontal plate and a die bonder vertical plate. The die bonder horizontal plate is connected to the end of the fifth bend portion away from the fourth bend portion, and the die bonder vertical plate is vertically connected to the end of the die bonder horizontal plate away from the fifth bend portion. The die bonder vertical plate is spaced between two opposite fifth connecting portions and two opposite fifth pin portions.

3. The LED lamp without lead adhesive according to claim 1, characterized in that, A first waterproof groove is formed at the end of the fifth bend near the fourth bend, a second waterproof groove is formed at the end of the fifth connecting part near the fourth connecting part, and a third waterproof groove is formed at the end of the fifth pin near the fourth pin. The first waterproof groove, the second waterproof groove, and the third waterproof groove are arranged in the same radial direction.

4. The LED lamp without lead adhesive according to claim 1, characterized in that, The surface of the encapsulation portion is arranged to be inclined outward from the end near the lens assembly towards the end near the adhesive blocking platform, and the surface of the support portion is arranged to be inclined inward from the end near the adhesive blocking platform towards the free end of the support portion. A pin receiving groove is provided at the end of the support portion away from the adhesive blocking platform, and part of the pin assembly is located in the pin receiving groove.

5. The LED lamp without lead adhesive according to claim 1, characterized in that, The lens assembly includes a lens base and a lens body. The lens base is disposed at the end of the encapsulation portion away from the adhesive blocking platform, and the lens body is disposed at the end of the lens base away from the encapsulation portion. A polarity marking notch is formed at the end corner of the lens base corresponding to the encapsulation portion.

6. A method for manufacturing a lead-free LED lamp, comprising the lead-free LED lamp as described in any one of claims 1-5, characterized in that, include: The preset chip is fixed onto the pin assembly and then baked using the corresponding equipment. The welding operation is completed by bonding the electrodes of the preset chip to the pin assembly using wire bonding equipment. Epoxy resin adhesive is used to fill part of the pin assembly on the bracket to form an encapsulation part, so that the amount of adhesive is flush with the bracket cup, and then baked and cured. Using a custom mold, epoxy resin glue is first filled into the mold, and then the entire piece of the glued bracket is inserted into the mold. After baking, it is demolded to form the lens. The completed lens molding process involves unloading the product to obtain the finished LED lighting fixture.

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