A vertical structure LED chip and a manufacturing method thereof
By employing a combination of dielectric and metal reflective layers in a vertical LED chip to form an omnidirectional reflector, the problem of balancing poor reflection performance and current spread performance with cost is solved, achieving efficient light extraction and uniform current distribution, thus improving the overall performance and reliability of the chip.
CN117153985BActive Publication Date: 2026-07-07XIAMEN CHANGELIGHT CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAMEN CHANGELIGHT CO LTD
- Filing Date
- 2023-04-27
- Publication Date
- 2026-07-07
Smart Images
Figure CN117153985B_ABST
Abstract
The application provides a vertical structure LED chip and a manufacturing method thereof. An ODR omnidirectional reflector is formed by cooperation of a dielectric layer and a metal reflection layer on the surface of an epitaxial stack, so that light is reflected and taken out from the upper surface of the LED chip, thereby effectively improving the overall reflectivity of the chip and increasing the light extraction efficiency. Meanwhile, the integrated metal layer is embedded, Au-containing metal material is used in the process of manufacturing the integrated metal layer, and part of the surface of the integrated metal layer is exposed by etching. The exposed part bears the PAD function and can realize electrical connection with the outside.
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