A testing method for fingerprint modules

Abstract

This invention discloses a testing method for fingerprint modules. The method utilizes a fingerprint module testing device. A mounting frame is evenly distributed at the lower part of a mounting plate, and a contact assembly is disposed within each frame. A test seat, opposite to the contact assembly, is located on the upper part of a testing platform. A material feeding groove, opposite to the test seat, is provided on the testing platform. A flip plate, symmetrically rotatable on the inner side of the test seat, is used to support the fingerprint module under test. A conductive sheet, for contacting the I / O terminals of the fingerprint module, is embedded on the upper side of the flip plate and electrically connected to an MCU control unit located on the test seat. The MCU control unit and a driving mechanism drive the two flip plates to flip and guide the material. A control mechanism, operating on one side of the test seat, manipulates the downward movement of a U-shaped pressure strip. This invention can automatically test the performance of fingerprint modules and screen the tested modules, improving the testing efficiency.

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