High temperature strain adhesive, its preparation method and application

By preparing a high-temperature strain adhesive, the problem of insufficient performance of existing high-temperature strain adhesives is solved, achieving the effect of stable bonding of high-temperature metal strain gauges in high-temperature environments. It also has high-temperature insulation and impact resistance properties, and reduces the preparation cost.

CN117186778BActive Publication Date: 2026-07-03AECC COMML AIRCRAFT ENGINE CO LTD
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Patent Information

Application Number
CN202210605539.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-05-30
Publication Date
2026-07-03
Estimated Expiration
2042-05-30

AI Technical Summary

Technical Problem

Existing high-temperature strain adhesives have low operating temperatures in aero-engines, poor high-temperature insulation properties, and poor resistance to vibration, shock, and airflow erosion.

Method used

A high-temperature strain adhesive was prepared by using partially hydrolyzed ethyl silicate, ethyl cellosolve and white corundum micro powder. The high-temperature strain adhesive was prepared by mixing in a specific ratio and processing.

Benefits of technology

A stable bonding of high-temperature metal strain gauges was achieved at temperatures up to 1000℃, exhibiting high-temperature insulation properties and resistance to vibration, shock, and airflow erosion. Furthermore, the fabrication method is simple and low-cost.

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Abstract

The application discloses a high-temperature strain adhesive as well as a preparation method and application thereof. The preparation method of the high-temperature strain adhesive comprises the following steps: (1) mixing partially hydrolyzed ethyl silicate and ethyl cellosolve to obtain an adhesive solution; wherein the volume ratio of the partially hydrolyzed ethyl silicate and the ethyl cellosolve is (1.9-2.1):1; (2) mixing the adhesive solution obtained in the step (1) with white corundum micro powder to obtain the high-temperature strain adhesive; wherein the weight ratio of the adhesive solution and the white corundum micro powder is (1.8-2.2):1. The high-temperature strain adhesive disclosed by the application can be used at a temperature of 1000 DEG C, has high high-temperature insulation performance, good vibration impact resistance and airflow scouring resistance, and the preparation method of the high-temperature strain adhesive is simple in process and low in cost.
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Citation Information

Patent Citations

  • stabilization of PARTIALLY HYDROLYZED SILILIC ACID ESTERS

    BE808054A

  • Adhesive applying method of adhesive capable of resisting high temperature of 1,500 DEG C

    CN110105904A