A display device

Abstract

The display device comprises a display panel, a flexible circuit board and a driving chip; the display panel comprises a display area and a non-display area bent to the back of the display area, and the driving chip is bonded to the display panel in the non-display area; the flexible circuit board comprises a bonding area bonded to the non-display area, a first flat area, a bending area and a second flat area arranged in sequence in a direction away from the bonding area; the flexible circuit board is located on the back of the display area, the second flat area is located between the first flat area and the display area, and at least part of the side surface of the second flat area close to the display area is provided with a first electromagnetic shielding layer.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202211344097.9, filed on October 31, 2022, entitled "A Display Device and a Method for Manufacturing the Same", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of display technology, and in particular to a display device. Background Technology

[0004] Flexible organic light-emitting diodes (OLEDs) are bendable and are currently widely used in rigid mobile phones, foldable products, and wearable devices. To improve the battery life of electronic products, battery capacity needs to be increased, which in turn requires more space for battery installation. How to free up more space for the battery within the limited space of electronic products and increase battery capacity has become an urgent technical problem to be solved. Summary of the Invention

[0005] This disclosure provides a display device, the specific solution of which is as follows:

[0006] This disclosure provides a display device, comprising:

[0007] Display panels, flexible circuit boards, and driver chips;

[0008] The display panel includes a display area and a non-display area bent to the back of the display area, and the driver chip is bonded and connected to the display panel in the non-display area;

[0009] The flexible circuit board includes a bonding area bonded to the non-display area, and a first flat area, a bending area, and a second flat area arranged sequentially in a direction away from the bonding area; the flexible circuit board is located on the back of the display area, the second flat area is located between the first flat area and the display area, and at least a portion of the surface of the second flat area near the display area is provided with a first electromagnetic shielding layer.

[0010] Optionally, in this embodiment of the disclosure, the first flat region and the driver chip are located on opposite sides of the bonding region.

[0011] Optionally, in this embodiment of the disclosure, the first flat region and the driver chip are located on the same side of the bonding region.

[0012] Optionally, in this embodiment of the present disclosure, the flexible circuit board has an opening extending through the second flat region in the direction from the first flat region to the second flat region. The opening is used to accommodate the driver chip, and the first electromagnetic shielding layer is disposed around the driver chip.

[0013] Optionally, in this embodiment of the disclosure, the flexible circuit board includes a base layer, a first conductive layer, a first cover film, and a shielding film sequentially disposed on a first surface of the base layer, and a second conductive layer and a second cover film sequentially disposed on a second surface of the base layer; the second conductive layer is bonded to the display panel, and the portion of the shielding film located in the second flat area is reused as the first electromagnetic shielding layer.

[0014] Optionally, in this embodiment of the present disclosure, at least a portion of the surface of the first flat region facing away from the display area is provided with a second electromagnetic shielding layer, and the portion of the shielding film located in the first flat region is reused as the second electromagnetic shielding layer.

[0015] Optionally, in this embodiment of the disclosure, the thickness of the bending region is less than the thickness of the first flat region and less than the thickness of the second flat region.

[0016] Optionally, in an embodiment of this disclosure, the shielding film, the first conductive layer, and the second conductive layer are perforated in the bending area.

[0017] Optionally, in this embodiment of the present disclosure, a heat dissipation structure located on the back of the display area is further included, and the flexible circuit board is disposed on the side of the heat dissipation structure opposite to the display area.

[0018] Optionally, in this embodiment of the disclosure, a first adhesive backing located between the first flat area and the second flat area, and a second adhesive backing located on the surface of the first electromagnetic shielding layer near the display area.

[0019] Optionally, in this embodiment of the present disclosure, when the first flat area and the driving chip are located on opposite sides of the bonding area, the flexible circuit board is fixedly connected to the surface of the heat dissipation structure facing away from the display area via the second adhesive. Optionally, in this embodiment of the present disclosure, when the first flat area and the driving chip are located on the same side of the bonding area, the flexible circuit board is fixedly connected to the surface of the non-display area facing away from the display area via the second adhesive. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of one type of flexible OLED display module in related technologies;

[0021] Figure 2This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0022] Figure 3 This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0023] Figure 4 This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0024] Figure 5 for Figure 2 A magnified schematic diagram of one of the structures in the middle region Q;

[0025] Figure 6 This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0026] Figure 7 This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0027] Figure 8 This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0028] Figure 9 This is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0029] Figure 10 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0031] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains. As used in this disclosure, the words “comprising” or “including” and similar terms mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, but do not exclude other elements or objects.

[0032] In related technologies, to make more space for the battery, it is necessary to minimize the thickness of the display module and the length of the MFPC (Main Flexible Printed Circuit) 01 extending into the motherboard. Figure 1 Taking the flexible OLED display module shown as an example, after the MFPC 01 is bonded to the panel 02, on the one hand, the distance value from the unbonded side of the MFPC 01 to the lower border of the display module (e.g.) Figure 1 The value shown in D is relatively large. This value often includes the extension length of MFPC 01, the safety distance between the integrated circuit (IC) chip 03 bonded to the side of MFPC 01 and the panel 02, the width of IC chip 03, and the width of the bottom bezel of the display module, thus encroaching on the overall space. On the other hand, since IC chip 03 is exposed, external interference can easily affect IC chip 03, thereby affecting the working performance of the display module.

[0033] In view of this, the present disclosure provides a display device that saves overall space while also providing electromagnetic protection.

[0034] Combination Figure 2 and Figure 3 As shown, this disclosure provides a display device, which includes:

[0035] Display panel 10, flexible circuit board 20 and driver chip 30;

[0036] The display panel 10 includes a display area A and a non-display area B bent to the back of the display area A, and the driving chip 30 is bonded to the flexible circuit board 20 in the non-display area B.

[0037] The flexible circuit board 20 includes a bonding area C1 bonded to the non-display area B, and a first flat area C2, a bending area C3, and a second flat area C4 arranged sequentially in a direction away from the bonding area C1; the flexible circuit board 20 is located on the back of the display area A, the second flat area C4 is located between the first flat area C2 and the display area A, and at least a portion of the surface of the second flat area C4 near the display area A is provided with a first electromagnetic shielding layer 40.

[0038] In a specific implementation, the display panel 10 includes a display area A and a non-display area B bent to the back of the display area A. One possible distribution of the display area A and the non-display area B is as follows: Figure 2As shown. Furthermore, the driver chip 30 is bonded to the display panel 10 in the non-display area B, specifically, the driver chip 30 is bonded to the surface of the non-display area B of the display panel 10 facing away from the display area A. Moreover, the flexible circuit board 20 includes a bonding area C1 bonded to the non-display area B, and a first flat area C2, a bending area C3, and a second flat area C4 sequentially arranged in a direction away from the bonding area C1. One possible distribution of the bonding area C1, the first flat area C2, the bending area C3, and the second flat area C4 is shown below. Figure 2 As shown. Of course, the distribution of display area A, non-display area B, binding area C1, first flat area C2, bending area C3 and second flat area C4 can be set according to actual application needs, and there are no restrictions here.

[0039] Still combined Figure 2 and Figure 3 As shown, the flexible circuit board 20 is located on the back of the display area A. Specifically, it is bonded to the side of the non-display area B opposite to the display area A via the bonding area C1, thereby ensuring the electrical connection between the display panel 10 and the flexible circuit board 20. In one exemplary embodiment, the display panel 10 and the flexible circuit board 20 can be connected together using one of a board-to-board (BTB) connector, a zero insertion force (ZIF) connector, and FOF bonding. In one exemplary embodiment, the electrical connection between the display panel 10 and the flexible circuit board 20 can be achieved using solder contact pads. Of course, the connection method between the display panel 10 and the flexible circuit board 20 can be set according to actual application needs, and is not limited here.

[0040] In the specific implementation process, the flexible circuit board 20 can be bent at an appropriate location. After bending, the second flat area C4 of the flexible circuit board 20 is located between the first flat area C2 and the display area A. Compared to... Figure 1In this embodiment, the flexible circuit board 20 of the display device is folded back to the back of the display area A, thereby reducing the distance between the flexible circuit board 20 and the outer boundary of the non-display area B and the lower edge of the display panel 10. This saves space in the display device and makes it possible to install a large-capacity battery. Furthermore, at least a portion of the surface of the second flat area C4 near the display area A is provided with a first electromagnetic shielding layer 40. In one exemplary embodiment, the entire surface of the second flat area C4 near the display area A may be provided with the first electromagnetic shielding layer 40. In another exemplary embodiment, only a portion of the surface of the second flat area C4 near the display area A may be provided with the first electromagnetic shielding layer 40. In this way, the first electromagnetic shielding layer 40 effectively prevents interference from external electromagnetic signals, improves the electrostatic discharge protection capability of the display device, and ensures the performance of the display device. Thus, while saving overall space, electromagnetic protection is also achieved.

[0041] In this embodiment, the driver chip 30 and the flexible circuit board 20 can be configured as follows. In one exemplary embodiment, the first flat area C2 and the driver chip 30 are located on opposite sides of the bonding area C1.

[0042] Still combined Figure 2 As shown, in this exemplary embodiment, the first flat area C2 and the driver chip 30 are located on opposite sides of the bonding area C1, and the display panel 10 can be bonded to the flexible circuit board 20 using a forward bonding method. In this exemplary embodiment, the distance from the outer boundary of the flexible circuit board 20 away from the non-display area B to the lower border of the display panel 10 is as follows: Figure 2 As shown in E, compared to Figure 1 In general, assuming that the relevant structural parameters of each component in the display device are the same, E is significantly smaller than D, thus saving the overall space of the display device and making it possible to install a large-capacity battery.

[0043] In one exemplary embodiment, the first flat region C2 and the driver chip 30 are located on the same side of the bonding region C1.

[0044] Still combined Figure 3 As shown, in this exemplary embodiment, the first flat area C2 and the driver chip 30 are located on the same side of the bonding area C1, and the display panel 10 can be bonded to the flexible circuit board 20 using a reverse bonding method. In this exemplary embodiment, the distance from the outer boundary of the flexible circuit board 20 away from the non-display area B to the lower border of the display panel 10 is as follows: Figure 3 As shown in F, compared to Figure 1In general, assuming all structural parameters of the components in the display device are the same, F is significantly smaller than D, and compared to Figure 2 In terms of F, it is smaller than E, which further saves the overall space of the display device and makes it possible to install a large-capacity battery.

[0045] It should be noted that, in addition to the methods that can be used Figure 2 and Figure 3 In addition to the method shown, which is used to set the driver chip 30 and the flexible circuit board 20, other methods can be used according to the actual application needs, and no limitation is made here.

[0046] In this embodiment of the present disclosure, along the direction from the first flat region C2 to the second flat region C4, the flexible circuit board 20 has an opening 50 that penetrates the second flat region C4. The opening 50 is used to accommodate the driver chip 30, and the driver chip 30 is arranged around the driver chip 30.

[0047] Combination Figure 4 As shown, arrow X points from the first flat region C2 to the second flat region C4. Correspondingly, along the direction indicated by arrow X, the flexible circuit board 20 has an opening 50 penetrating the second flat region C4. This opening 50 is used to accommodate the driver chip 30, and the first electromagnetic shielding layer 40 is disposed around the driver chip 30. In one exemplary embodiment, clearance treatment can be applied to the area where the driver chip 30 overlaps with the flexible circuit board 20. In this way, the opening 50 on the flexible circuit board 20 effectively avoids damage to the driver chip 30 due to physical impact, ensuring the performance of the display device.

[0048] In the embodiments disclosed herein, such as Figure 5 As shown Figure 2 An enlarged schematic diagram of one possible structure of region Q. In one exemplary embodiment, the flexible circuit board 20 can be a two-layer board, thereby reducing the manufacturing cost of the flexible circuit board 20 while ensuring its bending performance. In this exemplary embodiment, it is still combined with... Figure 5 As shown, the flexible circuit board 20 includes a base layer 200, a first conductive layer 201, a first cover film 202 and a shielding film 203 sequentially disposed on a first surface 2001 of the base layer 200, and a second conductive layer 204 and a second cover film 205 sequentially disposed on a second surface 2002 of the base layer 200; the second conductive layer 204 is bonded to the display panel 10, and the portion of the shielding film 203 located in the second flat area C4 is reused as the first electromagnetic shielding layer 40.

[0049] In specific implementation, the flexible circuit board 20 includes a substrate layer 200. The material of the substrate layer 200 can be polyimide (PI) or polyethylene terephthalate (PET). Of course, the material of the substrate layer 200 can also be set according to the actual application needs, and is not limited here. In addition, the flexible circuit board 20 also includes a first conductive layer 201, a first cover film 202, and a shielding film 203 sequentially disposed on the first surface 2001 of the substrate layer 200, and a second conductive layer 204 and a second cover film 205 sequentially disposed on the second surface 2002 of the substrate layer 200. The shielding film 203 can be one or more of conductive rubber, conductive cloth, conductive foam, and conductive shielding adhesive. Of course, the shielding film 203 can be set according to the actual application needs, and is not limited here.

[0050] In one exemplary embodiment, the first conductive layer 201 and the second conductive layer 204 can be made of copper foil. In specific implementation, the corresponding copper foil can be etched according to the required signal trace arrangement, which will not be described in detail here. In addition, the first cover film 202 can prevent the first conductive layer 201 from being exposed to air, thus preventing water and oxygen corrosion of the first conductive layer 201; the second cover film 205 can prevent the second conductive layer 204 from being exposed to air, thus preventing water and oxygen corrosion of the second conductive layer 204, thereby ensuring the performance of the display device.

[0051] Still combined Figure 2 and Figure 5 In the exemplary embodiment shown, the second conductive layer 204 is bonded to the flexible circuit board 20, and the portion of the shielding film 203 located in the second flat region C4 can be reused as the first electromagnetic shielding layer 40. In this way, the required first electromagnetic shielding layer 40 can be prepared at the same time as the flexible circuit board 20, realizing the integration of electromagnetic protection function of the flexible circuit board 20, thereby reducing the manufacturing cost of the display device while taking into account the electrostatic protection performance of the flexible circuit board 20.

[0052] In the embodiments disclosed herein, such as Figure 6 As shown, at least a portion of the surface of the first flat region C2 facing away from the display area A is provided with a second electromagnetic shielding layer 60, and the portion of the shielding film 203 located in the first flat region C2 is reused as the second electromagnetic shielding layer 60. In this way, the required second electromagnetic shielding layer 60 can be prepared simultaneously with the fabrication of the flexible circuit board 20, achieving the integration of electromagnetic protection functions in the flexible circuit board 20. This reduces the manufacturing cost of the display device while maintaining the electrostatic protection performance of the flexible circuit board 20.

[0053] In one exemplary embodiment, the thickness of the bending region C3 is less than the thickness of the first flat region C2 and less than the thickness of the second flat region C3. For example, the flexible circuit board 20 has only one first conductive layer 201 in the bending region C3. Alternatively, the flexible circuit board 20 has two film layers, including the first conductive layer 201 and the second conductive layer 204, in the first flat region C2. Or, the flexible circuit board 20 has two film layers, including the first conductive layer 201 and the second conductive layer 204, in the second flat region C4. Of course, the film layers in the bending region C3, the first flat region C2, and the second flat region C3 can be configured according to actual application needs, and are not limited here.

[0054] In one exemplary embodiment, the shielding film 203, the first conductive layer 201, and the second conductive layer 204 are perforated in the bending region C3. A corresponding schematic diagram may be as follows: Figure 6 As shown, this improves the bending performance of the flexible circuit board 20. In one exemplary embodiment, the shielding film 203, the first conductive layer 201, and the second conductive layer 204 are all hollowed out in the bending region C3, further improving the bending performance of the flexible circuit board 20.

[0055] In the embodiments disclosed herein, such as Figure 7 As shown, the display device also includes a heat dissipation structure 70 located on the back of the display area A, and the flexible circuit board 20 is disposed on the side of the heat dissipation structure 70 away from the display area A.

[0056] Still combined Figure 7 As shown, the display device also includes a heat dissipation structure 70 located on the back of the display area A, thereby ensuring the heat dissipation performance of the display device. In one exemplary embodiment, the heat dissipation structure 70 includes a mesh adhesive (EMBO), foam, and copper foil, etc., sequentially stacked on the back of the display area A. Furthermore, to ensure the adhesion between the various film layers of the heat dissipation structure 70, the heat dissipation structure 70 also includes adhesive layers disposed on opposite sides of the mesh adhesive, and an adhesive layer disposed between the foam and the copper foil. In this way, the heat dissipation structure 70 can block light, prevent light leakage, and shield related signals from affecting the noise of the flexible circuit board 20, thereby improving the performance of the display device.

[0057] In the embodiments disclosed herein, such as Figure 8 and Figure 9 As shown, the display device also includes a first adhesive 80 located between the first flat area C2 and the second flat area C4, and a second adhesive 90 located on the surface of the driving chip 30 near the display area A.

[0058] In one exemplary embodiment, still combined Figure 8 As shown, when the first flat area C2 and the driving chip 30 are located on opposite sides of the bonding area C1, the flexible circuit board 20 is fixedly connected to the surface of the heat dissipation structure 70 away from the display area A via the second adhesive 90. This ensures the structural stability between the display panel 10 and the flexible circuit board 20. Furthermore, still combined with... Figure 8 As shown, the display device provided in this embodiment further includes a cover tape 100 disposed on the side of the driver chip 30 away from the display area. One end of the cover tape 100 is attached to the non-display area B, and the other end is attached to the first flat area C2. The orthographic projection of the driver chip 30 onto the display area A completely falls within the area of ​​the orthographic projection of the cover tape 100 onto the display area A. The cover tape 100 is used to shield the driver chip 30 from interference by external electromagnetic signals, thereby ensuring the working performance of the driver chip 30 and improving the performance of the display device. It should be noted that in actual manufacturing... Figure 8 During the process of displaying the device shown, the coverage strip 100 can be set individually according to the specific location of the driver chip 30.

[0059] In one exemplary embodiment, still combined Figure 9 As shown, when the first flat area C2 and the driving chip 30 are located on the same side of the bonding area C1, the flexible circuit board 20 is fixedly connected to the surface of the non-display area B opposite to the display area A via the second adhesive 90. This ensures the structural stability between the display panel 10 and the flexible circuit board 20.

[0060] In this disclosed embodiment, it is still combined with Figure 9 As shown, the display device also includes at least one component 110 disposed on the surface of the first flat area C2 facing away from the display area A. The at least one component 110 may be at least one of a resistor, capacitor, inductor, etc., and the choice of at least one component 110 is based on actual application needs and is not limited herein.

[0061] It should be noted that, in Figure 9 In the exemplary embodiment shown, the first electromagnetic shielding layer 40 is disposed around the driving chip 30, and its corresponding Figure 9 The display device shown is compared to Figure 8 For the display device shown, there is no need to set up a separate cover strip 100. The shielding film 203 on the flexible circuit board 20 can be directly reused as the driving chip 30. This simplifies the manufacturing process, saves overall space, and improves the protection capability of the display device.

[0062] In the specific implementation process, it is still combined with Figure 9As shown, along the direction from the first flat area C2 to the display area A, the total thickness of the first adhesive 80, the second flat area C4, the first electromagnetic shielding layer 40, and the second adhesive 90 is greater than the height of the driver chip 30, and the depth of the opening 50 is greater than the height of the driver chip 30. Still using... Figure 9 Taking the exemplary embodiment shown as an example, the height of the driver chip 30 is H1, and the depth of the opening 50 is H2, where H2 is greater than H1. In this way, the opening 50 effectively avoids the driver chip 30 while saving space along the thickness direction of the display device, ensuring a thinner design. Of course, the specific thicknesses of the first adhesive 80, the second flat area C4, the driver chip 30, and the second adhesive 90 can be set according to the specific thickness of the driver chip 30 in actual applications, and are not limited here.

[0063] In the process of preparing the flexible circuit board 20 provided in this embodiment, the first adhesive 80 can be pre-attached to the first flat area C2, and the second adhesive 90 can be pre-attached to the area of ​​the first electromagnetic shielding layer 40 located in the second flat area C4. Then, the second flat area C4 is bent along the bending area C3 to the back of the first flat area C2; then, the flexible circuit board 20 with the desired bending shape is formed. In the actual preparation process, the display panel 10 and the flexible circuit board 20 can be prepared separately, thereby improving the preparation efficiency of the display device. Then, the bent flexible circuit board 20 is bonded to the display panel 10; then, the bonded flexible circuit board 20 is bent to the back of the display panel 10, thereby obtaining the desired display device.

[0064] It should be noted that, in addition to the film layers mentioned above, the display device provided in this disclosure may also include other film layer structures. Specific configurations can be implemented with reference to related technologies and will not be detailed here. Furthermore, the display device provided in this disclosure can be an OLED flexible display device, and the corresponding products can be any product or component with display functions, such as mobile phones, tablets, televisions, monitors, laptops, digital photo frames, and navigators. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting this disclosure.

[0065] Based on the same publicly disclosed concept, such as Figure 10 As shown, this disclosure also provides a method for manufacturing a display device as described above, the method comprising:

[0066] S101: The flexible circuit board is bonded to the display panel through the bonding area;

[0067] S102: Bend the flexible circuit board to the back of the display area.

[0068] In one exemplary embodiment, the specific implementation process of steps S101 to S102 may be as follows: First, the film layer pattern of the display panel 10 in the display area A and the non-display area B is prepared using relevant manufacturing processes, and the film layer pattern of the flexible circuit board 20 in each area is prepared; then, the flexible circuit board 20 is bonded to the display panel 10 through the bonding area C1; then, the flexible circuit board 20 is bent to the back side of the display area A.

[0069] It should be noted that in the preparation Figure 9 When making the display device shown, it is necessary to pre-open an opening 50 through the second flat area C4 on the flexible circuit board 20 so as to open a window to avoid the driver chip 30. The relevant manufacturing process will not be described in detail.

[0070] In a display device provided in this embodiment, the display device includes a display panel 10, a flexible circuit board 20, and a driver chip 30. The display panel 10 includes a display area A and a non-display area B bent to the back of the display area A. The driver chip 30 is bonded to the display panel 10 in the non-display area B. The flexible circuit board 20 includes a bonding area C1 bonded to the non-display area B, and a first flat area C2, a bent area C3, and a second flat area C4 sequentially arranged along a direction away from the bonding area C1. The flexible circuit board 20 is located on the back of the display area A, and the second flat area C4 is located between the first flat area C2 and the display area A. That is, the folded flexible circuit board 20 is located on the back of the display area A, thereby reducing the distance between the flexible circuit board 20 and the outer boundary of the non-display area B from the bottom edge of the display panel 10, saving overall space in the display device and making it possible to install a large-capacity battery. Furthermore, at least a portion of the surface of the second flat area C4 near the display area A is provided with a first electromagnetic shielding layer 40. In this way, the first electromagnetic shielding layer 40 effectively avoids interference from external electromagnetic signals, improves the electrostatic protection capability of the display device, and ensures the performance of the display device. Thus, it saves overall space while also achieving effective electromagnetic protection.

[0071] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0072] Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.

Claims

1. A display device, characterized in that, include: Display panels, flexible circuit boards, and driver chips; The display panel includes a display area and a non-display area bent to the back of the display area, and the driver chip is bonded and connected to the display panel in the non-display area; The flexible circuit board includes a bonding area bonded to the non-display area, and a first flat area, a bending area, and a second flat area arranged sequentially in a direction away from the bonding area; the flexible circuit board is located on the back of the display area, the second flat area is located between the first flat area and the display area, and at least a portion of the surface of the second flat area near the display area is provided with a first electromagnetic shielding layer; The display device further includes a heat dissipation structure located on the back of the display area, and a second adhesive on the surface of the first electromagnetic shielding layer near the display area; the flexible circuit board is fixedly connected to the surface of the heat dissipation structure away from the display area via the second adhesive.

2. The display device as claimed in claim 1, characterized in that, The first flat region and the driver chip are located on opposite sides of the bonding region.

3. The display device as claimed in claim 1, characterized in that, The flexible circuit board includes a base layer, a first conductive layer, a first cover film, and a shielding film sequentially disposed on a first surface of the base layer, and a second conductive layer and a second cover film sequentially disposed on a second surface of the base layer; the second conductive layer is bonded to the display panel, and the portion of the shielding film located in the second flat area is reused as the first electromagnetic shielding layer.

4. The display device as claimed in claim 3, characterized in that, At least a portion of the surface of the first flat region facing away from the display area is provided with a second electromagnetic shielding layer, and the portion of the shielding film located in the first flat region is reused as the second electromagnetic shielding layer.

5. The display device as claimed in claim 4, characterized in that, The thickness of the bending region is less than the thickness of the first flat region and less than the thickness of the second flat region.

6. The display device as claimed in claim 4, characterized in that, The shielding film, the first conductive layer, and the second conductive layer are arranged in a perforated manner in the bending area.

7. The display device as claimed in claim 4, characterized in that, The flexible circuit board is disposed on the side of the heat dissipation structure opposite to the display area.

8. The display device as claimed in claim 7, characterized in that, It also includes a first adhesive backing located between the first flat area and the second flat area.

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