A visual laser cutting module

Abstract

The application provides a visual laser cutting module, comprising: a base; a laser cutting device arranged directly above the base, the top of the laser cutting device being fixed to the frame on the top of the machine tool; an AF positioning device arranged on both sides of the laser cutting device, the AF positioning device being provided with mounting plates at both ends and being connected to the support frame inside the machine tool; a monitoring and identifying device arranged on one side of the AF positioning device, the bottom of the monitoring and identifying device being connected with a camera, and the camera being horizontally arranged between the base and the laser cutting device. The AF positioning device and the monitoring and identifying device are adopted, the laser sensor in the AF positioning device emits laser to the wafer placed on the base before processing, the height and the surface flatness of the wafer are judged through the reflected laser, the output power of the laser controller is adjusted, the height of the laser processing point modification layer is confirmed through the camera positioning, and the quality problem of the wafer unsegmentation caused by the deviation of the modification layer due to the error of the laser processing point is prevented in advance.

Description

Technical Field

[0001] This invention relates to the field of semiconductor products, and more particularly to the field of wafer dicing technology, specifically a visual laser dicing module. Background Technology

[0002] Existing technology: In the SDBG process, after the wafer is advanced laser stealth dicing, it is thinned to a specified thickness by a grinding machine, and the wafer is then divided into specified chips.

[0003] Existing issues: If the laser cutting machine cuts the wafer in the wrong position, the wafer cannot be divided into the specified chips after the grinding machine thins it, resulting in poor quality; while the height of the modified layer cut by the stealth dicing machine is crucial to the cutting quality, but the height of the wafer modified layer can only be confirmed by observing it under a high-powered microscope after the chips are segmented after cutting, which adds uncertainty to the product processing and production.

[0004] There is a need for a laser cutting device that can locate the laser processing point and calculate the height of the modified layer before production. Summary of the Invention

[0005] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a visual laser cutting module to solve the difficulties of the prior art.

[0006] To achieve the above and other related objectives, the present invention provides a visual laser cutting module, comprising:

[0007] Base 1;

[0008] Laser cutting device 2, which is set directly above the base 1, and the top of the laser cutting device 2 is fixed to the frame on the top of the machine tool;

[0009] AF positioning device 3, which is set on both sides of the laser cutting device 2, and has mounting plates 4 at both ends that are connected to the support frame inside the machine tool.

[0010] The monitoring and identification device 5 is set on one side of the AF positioning device 3, and a camera 502 is connected to the bottom. The camera 502 is horizontally set between the base 1 and the laser cutting device 2.

[0011] According to a preferred embodiment, the laser cutting device 2 includes a laser controller 201 and a laser cutting head 202. The top of the laser controller 201 is fixed on the frame on the top of the machine tool to control the output power of the laser, and the bottom is connected to the laser cutting head 202.

[0012] According to the preferred embodiment, the AF positioning device 3 includes:

[0013] A laser sensor 301 is provided on both sides of the laser cutting device 2, and a positioning groove 302 is provided on the end of the laser sensor 301 facing the base 1.

[0014] The positioning groove 302 is a 60° right-angled triangular recessed groove. The opening of the positioning groove 302 faces the bottom base 1. A laser emission port 303 is provided on the inclined surface of the positioning groove 302.

[0015] The intersection of the extension lines of the laser emission port 303 at both ends coincides with the center point of the top of the base 1.

[0016] According to the preferred embodiment, the end of the mounting plate 4 away from the laser cutting device 2 is provided with a connection hole 401. The connection hole 401 is triangular in shape and is fixed to the internal support frame or track of the machine tool by bolts.

[0017] According to the preferred embodiment, the monitoring and identification device 5 includes:

[0018] The bracket 501 is bolted to one end of the mounting plate 4 away from the laser cutting device 2, located below the connection hole 401.

[0019] The camera 502 is fixedly mounted on the bottom of the bracket 501 near the laser cutting device 2 via the assembly block 503.

[0020] According to the preferred embodiment, the end of the camera 502 near the laser cutting device 2 is covered with a dustproof shell 504.

[0021] According to the preferred embodiment, the dustproof housing 504 is gray and made of PMMA material.

[0022] This invention employs an AF positioning device and a monitoring and identification device. Before processing, the laser sensor in the AF positioning device emits a laser to the wafer placed on the base. The reflected laser is used to determine the wafer height and surface flatness, and the output power of the laser controller is adjusted. The height of the modified layer at the laser processing point is confirmed by the camera positioning, thus preventing quality problems such as unsegmented wafers caused by deviations in the modified layer due to incorrect laser processing points.

[0023] The preferred embodiments of the invention will be described in more detail below with reference to the accompanying drawings, so as to facilitate an understanding of the features and advantages of the invention. Attached Figure Description

[0024] Figure 1 The diagram shown is a front view of the present invention.

[0025] Figure 2 The diagram shown is a three-dimensional structural schematic of the present invention.

[0026] Figure 3 The image shown is an axonometric view of the AF positioning device of the present invention.

[0027] Figure 4 This is a schematic diagram of the other side of the AF positioning device of the present invention;

[0028] Label Explanation

[0029] 1. Base; 2. Laser cutting device; 201. Laser controller; 202. Laser cutting head; 3. AF positioning device; 301. Laser sensor; 302. Positioning groove; 303. Laser emission port; 4. Mounting plate; 401. Connecting hole; 5. Monitoring and identification device; 501. Bracket; 502. Camera; 503. Assembly block; 504. Dustproof housing; Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0031] Compared to the embodiments shown in the accompanying drawings, feasible embodiments within the scope of protection of this invention may have fewer components, other components not shown in the drawings, different components, components arranged differently, or components with different connections, etc. Furthermore, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0032] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, “an” or “a” and similar terms do not necessarily indicate a quantity limitation. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0033] This invention proposes a visual laser cutting module for use in wafer cutting processes. This invention does not limit the type of chips to be produced, but the structure of the AF positioning device and monitoring and identification device is particularly suitable for laser cutting of wafers.

[0034] Overall, the visual laser cutting module proposed in this invention mainly includes a base 1, a laser cutting device 2, an AF positioning device 3, and a monitoring and identification device 5. (See also...) Figure 1 It shows the arrangement of the base 1, the laser cutting device 2, the AF positioning device 3 and the monitoring and identification device 5.

[0035] The laser cutting device 2 is positioned directly above the base 1 and is fixed to the top of the machine tool frame. The laser cutting device 2 includes a laser controller 201 and a laser cutting head 202. The laser controller 201 is fixed to the top of the machine tool frame. Before use, it controls the output power of the laser according to the wafer thickness and transmits the laser to the laser cutting head 202 connected to the bottom. The laser cutting head 202 transmits the laser to the wafer placed on the base 1 below to cut the wafer.

[0036] To prevent excessive laser output power, this device includes AF positioning devices 3 on both sides of the laser cutting device 2. The AF positioning device 3 includes a laser sensor 301, a positioning groove 302, and a laser emission port 303. The laser sensor 301 generates a laser of a fixed wavelength, which is emitted from the laser emission port 303 located on the inclined surface of the positioning groove 302 at the bottom of the laser sensor 301, passes through the wafer, and is directed towards the center point at the top of the base 1. The reflected laser is used by the controller to calculate and determine the wafer height and surface flatness, and adjusts the output power of the laser controller 201 accordingly. This effectively prevents excessive laser output power from burning the wafer cutting surface and improves the quality of product production.

[0037] To prevent errors in laser processing, this device includes a monitoring and identification device 5 at the end of the mounting plate 4 furthest from the laser cutting device 2. The monitoring and identification device 5 includes a bracket 501 and a camera 502. The camera 502 is fixedly mounted on the bottom of the bracket 501 via a connecting block, and the bracket 501 is bolted to the mounting plate 4. During use, the camera 502 magnifies both ends of the wafer to determine the position of the modified layer. The processing position of the modified layer is calculated by the refraction of light in the silicon crystal. Furthermore, a dustproof shell 504 is fitted onto the end of the camera 502 closest to the laser cutting device 2. The dustproof shell 504 is gray and made of PMMA material. The gray dustproof shell 504 reduces the laser intensity received by the camera 502, preventing damage from the laser. PMMA material is lighter and cheaper than glass. This filter protection measure protects the camera 502 in case of operational errors. The camera 502 must be turned off before laser cutting can be performed.

[0038] It should be noted that the end of the mounting plate 4 away from the laser cutting device 2 is provided with a connection hole 401. The connection hole 401 is triangular in shape and is fixed to the internal support frame or track of the machine tool by bolts. The triangularly placed connection hole 401 provides stronger stability when fixed.

[0039] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A visual laser cutting module, characterized in that, include: Base (1); Laser cutting device (2), the laser cutting device (2) is set directly above the base (1), and the top of the laser cutting device (2) is fixed on the frame at the top of the machine tool; AF positioning device (3), the AF positioning device (3) is set on both sides of the laser cutting device (2), and the two ends of the AF positioning device (3) are provided with mounting plates (4) connected to the support frame inside the machine tool; The monitoring and identification device (5) is set on one side of the AF positioning device (3) and a camera (502) is connected to the bottom. The camera (502) is horizontally set between the base (1) and the laser cutting device (2). The AF positioning device and monitoring and identification device first emit lasers to the wafer placed on the base through the laser sensor in the AF positioning device before processing. The height and surface flatness of the wafer are judged by the reflected laser, and the output power of the laser controller is adjusted. The height of the modified layer at the laser processing point is also confirmed by the camera positioning. When in use, the camera (502) magnifies both ends of the wafer to determine the position of the modified layer, and calculates the processing position of the modified layer by the refraction of light in the silicon crystal.

2. The visual laser cutting module according to claim 1, characterized in that, The laser cutting device (2) includes a laser controller (201) and a laser cutting head (202). The laser controller (201) is fixed on the top of the frame on the top of the machine tool to control the output power of the laser, and the bottom is connected to the laser cutting head (202).

3. The visual laser cutting module according to claim 2, characterized in that, The AF positioning device (3) includes: A laser sensor (301) is provided on both sides of the laser cutting device (2), and a positioning groove (302) is provided on one end of the laser sensor (301) facing the base (1). The positioning groove (302) is a 60° right-angled triangular recessed groove. The opening of the positioning groove (302) faces the bottom base (1). A laser emission port (303) is provided on the inclined surface of the positioning groove (302). The intersection of the extension lines of the laser emission ports (303) at both ends coincides with the center point of the top of the base (1).

4. The visual laser cutting module according to claim 3, characterized in that, The mounting plate (4) has a connection hole (401) at one end away from the laser cutting device (2). The connection hole (401) is triangular in shape and is fixed to the internal support frame or track of the machine tool by bolts.

5. The visual laser cutting module according to claim 4, characterized in that, The monitoring and identification device (5) includes: The bracket (501) is bolted to the end of the mounting plate (4) away from the laser cutting device (2) and located below the connecting hole (401); The camera (502) and the bracket (501) are fixedly installed at the bottom of the bracket (501) near the laser cutting device (2) by the assembly block (503).

6. The visual laser cutting module according to claim 5, characterized in that, The camera (502) is fitted with a dustproof shell (504) at one end near the laser cutting device (2).

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