Heat dissipation device and communication device thereof

Abstract

The application provides a heat dissipation device and a communication device thereof, and the heat dissipation device comprises a substrate, and a plurality of heat dissipation fins, at least one surface of the heat dissipation fins is attached to the substrate, and the heat dissipation fins are welded to the substrate. According to the technical scheme of the embodiment, the heat dissipation fins are directly welded in the substrate, no mold is needed, the connecting structure between the substrate and the heat dissipation fins is omitted, the manufacturing cost is saved, the welding is adopted in the fixing mode, the process complexity of the heat dissipation device is effectively reduced, at the same time, the heat dissipation fins are directly attached to the substrate, the heat transfer path is effectively reduced, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This invention relates to, but is not limited to, the field of communication technology, and particularly to a heat dissipation device and its communication equipment. Background Technology

[0002] Heat dissipation devices are essential components in communication equipment, dissipating heat generated by the equipment to the outside to ensure its normal operation. The main heat dissipation component is the heat dissipation fin, which is typically installed in the base of the heat dissipation device. Common methods include fixing the fins to the base using riveting or casting, or directly molding the fins and base into a single piece using die casting. However, these methods require large equipment or molds, resulting in high production costs, complex processes, low flexibility, and low yield rates. Some heat dissipation devices incorporate a connection structure within the base for mounting the fins. While this reduces installation complexity, it isolates the fins from the heat source, leading to poor heat dissipation. Summary of the Invention

[0003] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0004] This invention provides a heat dissipation device and its communication equipment, which can simplify the structure of the heat dissipation device and improve the heat dissipation effect.

[0005] In a first aspect, embodiments of the present invention provide a heat dissipation device applied to a communication device, comprising:

[0006] substrate;

[0007] Multiple heat dissipation fins, at least one surface of each heat dissipation fin is attached to the substrate, and the heat dissipation fins are soldered to the substrate.

[0008] In a second aspect, embodiments of the present invention provide a communication device, including: a heat dissipation device as described in the first aspect.

[0009] This invention includes: a substrate; and a plurality of heat dissipation fins, at least one surface of each heat dissipation fin being attached to the substrate and welded to the substrate. According to the technical solution of this embodiment, the heat dissipation fins can be directly welded into the substrate without the need for molds, eliminating the connection structure between the substrate and the heat dissipation fins, saving manufacturing costs. Furthermore, the welding method effectively reduces the process complexity of the heat dissipation device. Simultaneously, the direct attachment of the heat dissipation fins to the substrate effectively reduces the heat transfer path and improves the heat dissipation effect. Attached Figure Description

[0010] Figure 1 This is a perspective view of a heat dissipation device provided in one embodiment of the present invention;

[0011] Figure 2 This is a perspective view of a substrate provided in another embodiment of the present invention;

[0012] Figure 3 This is a perspective view of a substrate provided in another embodiment of the present invention;

[0013] Figure 4 This is a perspective view of the substrate and base provided in another embodiment of the present invention;

[0014] Figure 5 This is a perspective view of the substrate and base provided in another embodiment of the present invention;

[0015] Figure 6 This is a front view of a heat dissipation device provided in another embodiment of the present invention;

[0016] Figure 7 This is a front view of a heat dissipation device provided in another embodiment of the present invention;

[0017] Figure 8 This is a front view of a heat dissipation device provided in another embodiment of the present invention. Detailed Implementation

[0018] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, or the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0019] This invention provides a heat dissipation device and its communication equipment. The heat dissipation device includes: a substrate; and a plurality of heat dissipation fins, at least one surface of each heat dissipation fin being attached to the substrate and welded to the substrate. According to the technical solution of this embodiment, the heat dissipation fins can be directly welded into the substrate without the need for molds, eliminating the connection structure between the substrate and the heat dissipation fins, saving manufacturing costs. Furthermore, the welding method effectively reduces the process complexity of the heat dissipation device. Simultaneously, the direct attachment of the heat dissipation fins to the substrate effectively reduces the heat transfer path and improves the heat dissipation effect.

[0020] The technical solutions of various embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0021] like Figure 1 As shown, an embodiment of the present invention provides a heat dissipation device, including:

[0022] substrate 100;

[0023] Multiple heat dissipation fins 200, at least one surface of each heat dissipation fin 200 is attached to the substrate 100, and the heat dissipation fins 200 are soldered to the substrate 100.

[0024] It should be noted that the heat dissipation fins 200 can be of any shape, selected according to specific heat dissipation requirements. This embodiment does not impose excessive limitations on the shape of the heat dissipation fins 200. Taking a plate-like shape as an example, the heat dissipation fins 200 typically include two sides, a bottom surface, and a top surface. At least one of the sides and the bottom surface can serve as a bonding surface to be bonded to the substrate 100. It is worth noting that the specific welding position of the heat dissipation fins 200 can be adjusted according to actual needs. For example, if a groove is provided in the substrate 100, the two sides of the heat dissipation fins 200 can be bonded to the groove wall. Both bonding surfaces can be welded, or only one bonding surface can be welded, as long as the installation of the heat dissipation fins 200 is secure.

[0025] It is worth noting that after the heat dissipation fins 200 are attached to the substrate 100, there is a certain gap between the two attached surfaces. Welding can be performed through this gap. Welds can be formed in the gap by means of laser welding or brazing, so that the heat dissipation fins 200 can be welded to the substrate 100. This embodiment does not impose too many restrictions on the specific welding method, and can be selected according to actual needs.

[0026] It should be noted that welding through the gap formed by the bonding surface allows for direct heat transfer between the heat dissipation fins 200 and the substrate 100, improving heat transfer efficiency. Furthermore, the welding process is significantly simplified compared to stamping and casting, effectively reducing production complexity. During welding, the heat-affected zone is small, preventing deformation of the heat dissipation fins 200 at high temperatures and effectively protecting the refrigerant in the heat dissipation device. Additionally, welding eliminates the need for pre-prepared molds, and the shape of the heat dissipation fins 200 is not limited by the manufacturing process, enabling the heat dissipation device to meet a wider range of heat dissipation needs.

[0027] It should be noted that during the welding process, external tooling can be used to help the heat dissipation fins 200 adhere tightly to the substrate 100, thereby reducing gaps and improving welding effect. Welding can also be achieved with the help of other auxiliary tools according to actual needs. This embodiment will not go into too much detail about the welding process.

[0028] In another embodiment, the substrate 100 further includes:

[0029] Multiple bases 300, which protrude or are recessed on the outer surface of the substrate 100;

[0030] At least one surface of the heat dissipation fin 200 is attached to the base 300 and welded to the base by a weld seam.

[0031] It should be noted that the base 300 can be any structure that protrudes or recesses on the outer surface of the substrate 100, such as one or a combination of grooves, bosses, or ribs, for example... Figure 6 The base shown is a boss, and as... Figure 7 The base shown is a raised rib, as shown in the image. Figure 8 The base 300 shown is a groove, and the specific form of the base 300 is not limited in this embodiment.

[0032] It should be noted that the arrangement of the base 300 can be set according to the specific installation requirements of the heat sink fins 200. For example, if the heat sink fins 200 need to be parallel and distributed in a straight line, it can be set according to... Figure 2 The illustrated arrangement places bases 300 in the substrate 100, with adjacent bases 300 parallel to each other. This embodiment does not limit the specific orientation of the bases 300. For example, refer to… Figure 1 The multiple heat dissipation fins 200 have different shapes and sizes, and the arrangement and shape of the base 300 can be set according to the arrangement and shape of the heat dissipation fins 200 to obtain, as shown below. Figure 3 The multiple bases 300 shown are partially parallel to each other and partially non-parallel, which is sufficient to allow for the installation of the heat dissipation fins 200.

[0033] Additionally, in one embodiment, such as Figure 4 As shown, the surface of the heat dissipation fin 200 that is attached to the base 300 is parallel to the surface of the base 300 that is attached to by the heat dissipation fin 200 and has the same shape.

[0034] It should be noted that the side surface of the base 300 can be a continuous and complete plane, which can be a straight plane, a curved plane, or a combination of straight and curved planes along its length. This embodiment does not impose any limitations on this. After the heat dissipation fins 200 are attached to the base 300, the heat dissipation fins 200 can be welded to at least one surface of the base 300. Therefore, the contact surfaces of the heat dissipation fins 200 and the base 300 have the same shape and are parallel to each other to ensure the welding effect. Figure 5 As shown, the base 300 has multiple sides. The first side 301 is a continuous and complete plane, while the second side 302 is an irregular plane with a specific shape, such as a rectangle, wave, sawtooth, or square wave, or with cuts of different shapes. By setting different types of sides, the base 300 can accommodate more heat dissipation fins 200, for example... Figure 5 The base 300 shown can be welded with continuous and complete heat dissipation fins 200 on the first side 301, and with heat dissipation fins 200 of a specific shape on the second side 302. This ensures that the two planes of the heat dissipation fins 200 and the base 300 are matched in shape and can be welded together.

[0035] In another embodiment, the angle between the heat dissipation fins 200 and the substrate 100 ranges from 0 to 180 degrees.

[0036] It should be noted that, since the heat dissipation fins 200 are installed by welding in this embodiment, the installation angle of the heat dissipation fins 200 can be more flexible. Not only can the angle between the heat dissipation fins 200 and the substrate 100 in the length direction be 0 to 180 degrees, but the angle between the heat dissipation fins 200 and the substrate 100 in the height direction can also be 0 to 180 degrees. The appropriate angle can be selected according to the actual needs.

[0037] To better illustrate the technical solution of the present invention, based on the above embodiments, the specific structure of the heat dissipation device is described below through three specific embodiments:

[0038] Example 1:

[0039] In this embodiment, the base is based on Figure 6 Taking the protrusion protruding from the surface of the substrate 100 as an example, the protrusion recessed in the substrate 100 can also be set on the inner side of the substrate 100 by referring to a similar principle, which will not be repeated hereafter.

[0040] Reference Figure 6 The first heat dissipation fin 210, the second heat dissipation fin 220, the third heat dissipation fin 230 and the fourth heat dissipation fin 240 are used to illustrate four different configuration methods. These four configuration methods can appear in the same heat dissipation device, or a heat dissipation device can use only one configuration method, or any combination of configuration methods can be used. Those skilled in the art are motivated to adjust according to actual needs.

[0041] Reference Figure 6 The first boss 310 is attached to one side of the first heat dissipation fin 210, forming a gap 400 at the contact surface. A weld 410 is formed in the gap 400 by laser welding or brazing, thus welding the first heat dissipation fin 210 to the side of the first boss 310, thereby achieving the installation of the first heat dissipation fin 210. At the same time, the bottom of the first heat dissipation fin 210 is attached to the substrate 100, allowing heat to enter the first heat dissipation fin 210 through the bottom of the first heat dissipation fin 210 and the side welded to the first boss 310, effectively shortening the heat dissipation path and improving the heat dissipation effect.

[0042] The second protrusion 321 and the third protrusion 322 form another base. The second protrusion 321 and the third protrusion 322 have different shapes. The second heat dissipation fin 220 is inserted into the groove formed by the second protrusion 321 and the third protrusion 322, and its two sides are respectively attached to the second protrusion 321 and the third protrusion 322. A gap 400 is formed on both sides of the second heat dissipation fin 220, and welds are made in the two gaps 400 to form a weld 410. The bottom of the second heat dissipation fin 220 is attached to the substrate 100, so that heat can be transferred from the two sides and the bottom of the second heat dissipation fin 220, effectively improving the heat dissipation effect.

[0043] The fourth protrusion 331 and the fifth protrusion 332 form another base. The fourth protrusion 331 and the fifth protrusion 332 have the same shape and size. The third heat dissipation fin 230 is inserted into the groove formed by the fourth protrusion 331 and the fifth protrusion 332, and its two sides are respectively attached to the fourth protrusion 331 and the fifth protrusion 332. Its bottom is attached to the substrate 100. The two sides of the third heat dissipation fin 230 form gaps 400. When welding on one side is sufficient to ensure stable installation, welding is only performed on the gap 400 between the third heat dissipation fin 230 and the fourth protrusion 331 to form a weld 410. Although no welding is performed on the other side, heat transfer can still be achieved because the third heat dissipation fin 230 is attached to the fifth protrusion 332, ensuring the heat dissipation effect.

[0044] The sixth boss 340 and the fourth heat dissipation fin 240 are attached to form a gap 400. Welding is carried out in the gap 400 to form a weld 410, and welding can also be carried out between the other side of the fourth heat dissipation fin 240 and the substrate 100 to form a weld 410, thereby improving the stability of the fourth heat dissipation fin 240.

[0045] In addition, to further improve the heat dissipation effect, a cover plate 500 can be provided on the top of the first heat dissipation fin 210, the second heat dissipation fin 220, the third heat dissipation fin 230, and the fourth heat dissipation fin 240. The cover plate 500 can be fixedly connected to the heat dissipation fins by riveting or welding, thereby increasing the heat dissipation area at the far end of the heat dissipation fins and improving the heat dissipation effect. It can also fix the far end of the heat dissipation fins and improve the strength of the heat dissipation device. In addition, the top of multiple heat dissipation fins can be provided as a bent part (not shown in the figure), and the equivalent function of the cover plate can be achieved by the abutment of the bent part.

[0046] Example 2:

[0047] The structure of the heat dissipation device in this embodiment is similar to that in Embodiment 1, and it also provides four different configuration methods, mainly with the following differences:

[0048] Reference Figure 7In this embodiment, the base is a rib. The first rib 312 forms a base and is welded to the first heat dissipation fin 210. The second rib 323 and the third rib 324 form a base and are welded to the second heat dissipation fin 220. The heights of the second rib 323 and the third rib 324 may be different. The fourth rib 333 and the fifth rib 334 form a base, and the fourth rib 333 is welded to the third heat dissipation fin 230. The sixth rib 341 forms a base and is welded to the fourth heat dissipation fin 240. The other side of the fourth heat dissipation fin 240 is welded to the substrate 100.

[0049] The difference between this embodiment and Embodiment 1 lies in the difference between the boss and the rib. In Embodiment 1, the boss can form a weld with the heat dissipation fins on its entire side and be welded together. In this embodiment, the rib is a protruding part that is welded to the heat dissipation fins. Apart from this, the principle is similar to that of Embodiment 1, and will not be repeated here.

[0050] Example 3:

[0051] The structure of the heat dissipation device in this embodiment is similar to that in Embodiment 1, but the main differences are as follows:

[0052] Reference Figure 8 In this embodiment, the base 300 is a groove recessed in the substrate 100. The two sides of the first groove 313 have different heights. The first heat dissipation fin 210 is inserted into the first groove 313 and fits against the groove wall to form a gap 400, and a weld 410 is formed by welding. The second groove 325 is a groove with equal heights on both sides. The second heat dissipation fin 220 is inserted into the second groove 325 and fits against the groove walls on both sides to form a gap 400. One side of the second heat dissipation fin 220 is welded to the second groove 325 to form a weld 410.

[0053] Apart from the differences mentioned above, the principle of this embodiment is roughly the same as that of Embodiment 1, and will not be repeated here.

[0054] In addition, another embodiment of the present invention provides a communication device, including the heat dissipation device as described in the above embodiment.

[0055] It should be noted that by applying the aforementioned heat dissipation device in communication equipment, since the heat dissipation fins in the heat dissipation device are welded to the substrate, not only are intermediate connecting structures and molds eliminated, achieving weight reduction and cost reduction of communication equipment, but the welding process is also simple and flexible, which can improve the production efficiency and yield of communication equipment, and can reduce the limitations of the manufacturing process on the shape and arrangement of the heat dissipation fins; the heat dissipation fins of the heat dissipation device are directly attached to the substrate, and the heat generated by the communication equipment can be directly transferred from the substrate to the heat dissipation fins for heat dissipation, thereby improving the heat dissipation effect by reducing the distance of the heat transfer path.

[0056] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of the present invention.

Claims

1. A heat dissipation device, applied to communication equipment, characterized in that, include: substrate; Multiple heat dissipation fins, at least one surface of each heat dissipation fin is attached to the substrate, and the heat dissipation fins are soldered to the substrate; The substrate includes multiple bases, each base having multiple sides, including a continuous and complete first side and an irregular second side. The first side is used for welding continuous and complete heat dissipation fins, and the second side is used for welding heat dissipation fins with a specific shape.

2. The heat dissipation device according to claim 1, characterized in that, The substrate further includes: The base protrudes or is recessed on the outer surface of the substrate; The heat dissipation fins have at least one surface that is in contact with the base and are welded to the base by a weld seam.

3. The heat dissipation device according to claim 2, characterized in that: At least one side of the heat dissipation fin is in contact with at least one side of the base and is welded to the base through the weld seam.

4. The heat dissipation device according to claim 3, characterized in that, The base includes at least one of the following: Boss; sinew; Groove.

5. The heat dissipation device according to claim 2, characterized in that: The surface of the heat dissipation fins that are attached to the base is parallel to and has the same shape as the surface of the base to which the heat dissipation fins are attached.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that, Also includes: A cover plate, which is fixedly connected to the top of the plurality of heat dissipation fins.

7. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The top of each of the heat dissipation fins is provided with a bend, and the bends of two adjacent heat dissipation fins abut against each other.

8. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The two adjacent heat dissipation fins are parallel to each other. Alternatively, at least two of the aforementioned heat dissipation fins are not parallel to each other.

9. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The angle between the heat dissipation fins and the substrate ranges from 0 to 180 degrees.

10. A communication device, comprising: The heat dissipation device as described in any one of claims 1 to 9.

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