Stainless steel iron plate module paste printing and die bonding process

Abstract

The present application relates to notebook computer keyboard, desktop computer keyboard manufacturing technical field, solve the technical problem that stainless steel plate non-plane cannot carry out tin paste printing and die bonding process defect, especially related to this process based on printing tin paste after opening plate process, tin paste printing and die bonding process of stainless steel plate are completed in the sequential process flow, the backlight module and the stainless steel plate after tin paste printing and die bonding are integrated into one body to constitute the stainless steel plate module, the sequential process flow includes the following steps: S1, tin brushing: the stainless steel plate that integrates good circuit and has not been punched is sent to the printing machine through the plate feeding machine, and the amount of tin paste sufficient for die bonding is printed on the matching steel mesh, then the tin paste is printed on the stainless steel plate which has not been punched.The process method proposed in the present application not only solves the defect that the non-planar plate cannot be printed, but also continues the advantage of high printing capacity of the planar plate, and solves the technical problem of instability of needle transfer tin paste.

Description

TECHNICAL FIELD

[0001] The present application relates to notebook computer keyboard, desktop computer keyboard manufacturing technology field, especially to a kind of stainless steel iron plate module solder paste printing and die bonding process. BACKGROUND

[0002] The conventional keyboard is composed of three major module chains of key sheet, backlight module and punched stainless steel iron plate with hawk hook, and the keyboard backlight module is mostly FR4, BT plate and FPC material, which are all flat panels, and the finished product is then mounted on the stainless steel iron plate with hawk hook, the printing and die bonding process of the flat panel material of the module is relatively mature, and the solder paste printing can be completed well, but the above-mentioned traditional process is complicated, and the production cost cannot be further reduced.

[0003] The stainless steel iron plate module integrating the module circuit, i.e., integrating the backlight module and the stainless steel plate, can simplify the process and save production cost, but the stainless steel iron plate module faces the technical problems of solder paste printing and die bonding.

[0004] If the stainless steel iron plate is punched after completing the solder paste printing and die bonding before punching, the punching force will cause the deformation of the plate material to chip and crack, thus being risky and causing great economic loss; if the stainless steel iron plate is punched, the hawk hook faces the solder paste printing and die bonding surface, which cannot be realized by solder paste printing, and the die bonder cannot perfectly complete the task because the solder paste transferred by the die bonder is not uniform, which is prone to quality problems. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application provides a solder paste printing and die bonding process for stainless steel iron plate module, which solves the technical problems of solder paste printing and die bonding process defects of non-flat stainless steel plate.

[0006] To solve the above technical problems, the present application provides the following technical scheme: a solder paste printing and die bonding process for stainless steel iron plate module, which prints solder paste based on the opening process, and completes the solder paste printing and die bonding process of the stainless steel iron plate by a sequential process, integrates the backlight module and the stainless steel iron plate after solder paste printing and die bonding to form a stainless steel iron plate module, and the sequential process includes the following steps:

[0007] S1, tin brushing: the stainless steel iron plate integrating the circuit and not punched is sent to the printing machine by the plate feeding machine, and the amount of solder paste sufficient for die bonding is printed on the matching steel mesh, and then the stainless steel iron plate not punched is printed with solder paste;

[0008] S2, solder paste detection: the AOI solder paste detection machine is used to detect whether the solder paste is offset and the volume, area and height of the solder paste.

[0009] S3, First reflow soldering: Reflow soldering is performed, and the reflow temperature should reach the standard peak value of the solder paste. The molten solder allows the solder paste to adhere smoothly and evenly to the pads.

[0010] S4. Stamping: Stamping and forming the tin-coated stainless steel sheet into shape and extruding hooks.

[0011] S5. Cleaning: Use an ultrasonic cleaner to clean the stamped stainless steel plate in a cleaning solvent to remove oil stains, iron filings and foreign objects. The cleaning solvent used is alcohol.

[0012] S6. Die Bonding: On the cleaned stainless steel plate, the die bonder adds flux to the tray, performs pin transfer, and simultaneously performs the die bonding step.

[0013] S7. Secondary reflow soldering: The die-bonded stainless steel plate is reflowed to melt solder and secure the chip.

[0014] S8. Chip Inspection: The chip is inspected for misalignment, missing parts, or other abnormalities using an SPI detector.

[0015] If so, repair the chips with offset or missing parts, and then proceed to step S9;

[0016] If not, proceed directly to step S9;

[0017] S9. Integrated Welding: The backlight module FPC is hot-pressed and welded to the stainless steel plate after solder paste printing and die bonding to form an integrated stainless steel plate module.

[0018] Furthermore, the plate-opening process includes cutting stainless steel sheets of the appropriate size from stainless steel coils, applying a coating, copper plating, etching circuits, and applying ink.

[0019] Furthermore, the coating is an insulating and corrosion-resistant coating with a thickness of 10μm applied to the stainless steel plate, the copper plating is copper foil of matching thickness plated on the surface of the stainless steel plate with the coating and electroplating layers, and the etching is etching the lines on the stainless steel plate with the copper foil plated.

[0020] Furthermore, in step S6, the viscosity of the flux is 20 ± 5 Pa·s.

[0021] Furthermore, after step S9, the process also includes dispensing and baking, specifically:

[0022] Glue dispensing: Applying glue to the integrated stainless steel plate module using a glue dispensing machine;

[0023] Baking: The stainless steel plate module after dispensing is baked in a tunnel oven at 175℃ for 2.5 hours to allow the adhesive to cure sufficiently and reach a hard state, thus better protecting the chip and the solder joints between the backlight module FPC.

[0024] Furthermore, in the dispensing process, the adhesive material is epoxy resin, and the dispensing locations are all LED light positions and FPC solder joints.

[0025] Furthermore, the baking process includes testing, appearance inspection, product packaging, and warehousing processes, specifically:

[0026] Testing: The luminous efficacy and photoelectric parameters of each lamp position on the stainless steel plate module are tested using a fully automated CIE testing machine.

[0027] Visual inspection: Inspect the stainless steel plate module for any abnormalities in its appearance;

[0028] Product packaging: Stainless steel plate molds are assembled into blister boxes of matching sizes, and then packed into cartons;

[0029] Warehousing: Goods are stored in the warehouse pending shipment.

[0030] By means of the above technical solution, the present invention provides a solder paste printing and die bonding process for stainless steel plate modules, which has at least the following beneficial effects:

[0031] 1. The process method proposed in this invention not only solves the defect of non-planar boards being unprintable, but also continues the advantage of high printing capacity of planar boards, and solves the technical problem of instability of solder paste transfer by pins.

[0032] 2. This invention prints solder paste on the stainless steel plate while it is still flat before stamping, so that the surface of the plate is covered with a sufficient amount of solder paste for die bonding. This is also to ensure that the chip can be well melted and soldered during the later die bonding process, so as to achieve qualified chip push force.

[0033] 3. The process proposed in this invention integrates the backlight module and the stainless steel plate into a single module product, and simultaneously completes the solder paste printing and die bonding processes, which not only simplifies the process but also saves production costs. Attached Figure Description

[0034] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0035] Figure 1 This is a flowchart of the process proposed in Embodiment 1 of the present invention;

[0036] Figure 2 This is a flowchart of the process proposed in Embodiment 2 of the present invention;

[0037] Figure 3 This is a flowchart of the process proposed in Embodiment 3 of the present invention. Detailed Implementation

[0038] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. This will allow for a full understanding of how the present application uses technical means to solve technical problems and achieve technical effects, and to facilitate its implementation.

[0039] Example 1

[0040] Please refer to Figure 1 This embodiment proposes a solder paste printing and die bonding process for a stainless steel plate module. This process is based on printing solder paste after the board-opening process. The board-opening process includes cutting stainless steel plates of appropriate sizes from stainless steel coils, coating, copper plating, etching circuits, and applying ink. The coating involves applying a 10μm thick insulating and corrosion-resistant coating to the stainless steel plate. Copper plating involves plating copper foil of matching thickness onto the surface of the stainless steel plate with the coating and electroplating layers. Etching circuits involves etching circuits onto the copper-plated stainless steel plate. The solder paste printing and die bonding process for the stainless steel plate is completed sequentially. The backlight module and the stainless steel plate after solder paste printing and die bonding are integrated into a single stainless steel plate module. The sequential process includes the following steps:

[0041] S1. Soldering: The integrated circuit and unpressed stainless steel plate is fed to the printing machine by the board loading machine, and a sufficient amount of solder paste for die bonding is printed on the matching stencil. Then, solder paste is printed on the unpressed stainless steel plate. The solder paste is printed when the stainless steel plate is still in a flat state before pressing, so that a sufficient amount of solder paste is attached to its surface. This is also to ensure that the chip can be well melted and soldered during the later die bonding process, so as to achieve qualified chip push force.

[0042] S2. Solder paste inspection: The solder paste is inspected using an AOI solder paste inspection machine to check for misalignment, as well as the volume, area, and height of the solder paste.

[0043] S3, First reflow soldering: Reflow soldering is performed, and the reflow temperature should reach the standard peak value of the solder paste. The molten solder allows the solder paste to adhere smoothly and evenly to the pads.

[0044] S4. Stamping: The stainless steel plate with tin is stamped and extruded, and then the stainless steel plate with solder paste is stamped. At this time, the chip has not yet been die bonded, and the stamping will not affect the solder paste layer on the pad.

[0045] S5. Cleaning: Use an ultrasonic cleaner to clean the stamped stainless steel plate in a cleaning solvent to remove oil stains, iron filings and foreign objects. The cleaning solvent used is alcohol.

[0046] S6, Die Bonding: After cleaning, the stainless steel plate is placed on the die bonder. The flux is added to the tray, and the needle transfer is performed simultaneously with the die bonding step. The stainless steel plate with the hook is transferred with a special flux (viscosity of 20±5 Pa.s). The flux transfer and die bonding can be performed simultaneously. The flux has sufficient viscosity to adsorb the chip.

[0047] S7. Secondary Reflow Soldering: The die-bonded stainless steel plate is reflowed to melt the solder, which secures the chip. The flux paste is transferred to the die-bonded stainless steel plate and reflowed to melt the solder again, thereby fixing the chip.

[0048] S8. Chip Inspection: The chip is inspected for misalignment, missing parts, or other abnormalities using an SPI detector.

[0049] If so, repair the chips with offset or missing parts, and then proceed to step S9;

[0050] If not, proceed directly to step S9;

[0051] S9. Integrated Welding: The backlight module FPC is hot-pressed and welded to the stainless steel plate after solder paste printing and die bonding to form an integrated stainless steel plate module.

[0052] This embodiment prints solder paste on the stainless steel plate while it is still flat before stamping, ensuring sufficient solder paste for die bonding. This guarantees good soldering of the chip during later die bonding, achieving adequate chip push force. The tin-coated stainless steel plate is then stamped, and since the chip is not yet die bonded, the stamping does not affect the solder paste layer on the pads. Subsequently, the shaped stainless steel plate with hooks is needled to transfer specially formulated flux. Flux transfer and die bonding can be performed simultaneously, as the flux has sufficient viscosity to adhere to the chip. Finally, the stainless steel plate after flux transfer and die bonding undergoes a second reflow soldering process to fix the chip. This integrates the backlight module and the stainless steel plate into a single module product, simultaneously completing solder paste printing and die bonding operations. This not only simplifies the process but also saves production costs.

[0053] Example 2

[0054] Please refer to Figure 2Based on Example 1, this example proposes a solder paste printing and die bonding process for a stainless steel plate module. This process involves printing solder paste after the board-opening process. The board-opening process includes cutting stainless steel plates of appropriate sizes from stainless steel coils, coating, copper plating, etching circuits, and applying ink. The coating involves applying a 10μm thick insulating and corrosion-resistant coating to the stainless steel plate. Copper plating involves plating copper foil of matching thickness onto the surface of the stainless steel plate with the coating and electroplating layers. Etching circuits involves etching circuits onto the copper-plated stainless steel plate. The solder paste printing and die bonding process for the stainless steel plate is completed in a sequential flow. The backlight module and the stainless steel plate after solder paste printing and die bonding are integrated into a single stainless steel plate module. The sequential process includes the following steps:

[0055] S1. Soldering: The integrated circuit and unpressed stainless steel plate is fed to the printing machine by the board loading machine, and a sufficient amount of solder paste for die bonding is printed on the matching stencil. Then, solder paste is printed on the unpressed stainless steel plate. The solder paste is printed when the stainless steel plate is still in a flat state before pressing, so that a sufficient amount of solder paste is attached to its surface. This is also to ensure that the chip can be well melted and soldered during the later die bonding process, so as to achieve qualified chip push force.

[0056] S2. Solder paste inspection: The solder paste is inspected using an AOI solder paste inspection machine to check for misalignment, as well as the volume, area, and height of the solder paste.

[0057] S3, First reflow soldering: Reflow soldering is performed, and the reflow temperature should reach the standard peak value of the solder paste. The molten solder allows the solder paste to adhere smoothly and evenly to the pads.

[0058] S4. Stamping: The stainless steel plate with tin is stamped and extruded, and then the stainless steel plate with solder paste is stamped. At this time, the chip has not yet been die bonded, and the stamping will not affect the solder paste layer on the pad.

[0059] S5. Cleaning: Use an ultrasonic cleaner to clean the stamped stainless steel plate in a cleaning solvent to remove oil stains, iron filings and foreign objects. The cleaning solvent used is alcohol.

[0060] S6, Die Bonding: After cleaning, the stainless steel plate is placed on the die bonder. The flux is added to the tray, and the needle transfer is performed simultaneously with the die bonding step. The stainless steel plate with the hook is transferred with a special flux (viscosity of 20±5 Pa.s). The flux transfer and die bonding can be performed simultaneously. The flux has sufficient viscosity to adsorb the chip.

[0061] S7. Secondary Reflow Soldering: The die-bonded stainless steel plate is reflowed to melt the solder, which secures the chip. The flux paste is transferred to the die-bonded stainless steel plate and reflowed to melt the solder again, thereby fixing the chip.

[0062] S8. Chip Inspection: The chip is inspected for misalignment, missing parts, or other abnormalities using an SPI detector.

[0063] If so, repair the chips with offset or missing parts, and then proceed to step S9;

[0064] If not, proceed directly to step S9;

[0065] S9. Integrated Welding: The backlight module FPC is hot-pressed and welded to the stainless steel plate after solder paste printing and die bonding to form an integrated stainless steel plate module.

[0066] S10, Dispensing: Dispensing adhesive onto the integrated stainless steel plate module using a dispensing machine. In the dispensing process, the adhesive material is epoxy resin, and the dispensing locations are all LED light positions and FPC welding points.

[0067] S11. Baking: The stainless steel plate module after dispensing is baked in a tunnel oven at a temperature of 175℃ for 2.5 hours to allow the adhesive to cure sufficiently and reach a hard state, thus better protecting the chip and the solder joints between the backlight module FPC.

[0068] This embodiment prints solder paste on the stainless steel plate while it is still flat before stamping, ensuring sufficient solder paste for die bonding. This guarantees good soldering of the chip during later die bonding, achieving adequate chip push force. The tin-coated stainless steel plate is then stamped, and since the chip is not yet die bonded, the stamping does not affect the solder paste layer on the pads. Subsequently, the shaped stainless steel plate with hooks is needled to transfer specially formulated flux. Flux transfer and die bonding can be performed simultaneously, as the flux has sufficient viscosity to adhere to the chip. Finally, the stainless steel plate after flux transfer and die bonding undergoes a second reflow soldering process to fix the chip. This integrates the backlight module and the stainless steel plate into a single module product, simultaneously completing solder paste printing and die bonding operations. This not only simplifies the process but also saves production costs.

[0069] Example 3

[0070] Please refer to Figure 3Based on Example 2, this example proposes a solder paste printing and die bonding process for a stainless steel plate module. This process involves printing solder paste after the board-opening process. The board-opening process includes cutting stainless steel plates of appropriate sizes from stainless steel coils, coating, copper plating, etching circuits, and applying ink. The coating involves applying a 10μm thick insulating and corrosion-resistant coating to the stainless steel plate. Copper plating involves plating copper foil of matching thickness onto the surface of the stainless steel plate with the coating and electroplating layers. Etching circuits involves etching circuits onto the copper-plated stainless steel plate. The solder paste printing and die bonding process for the stainless steel plate is completed in a sequential flow. The backlight module and the stainless steel plate after solder paste printing and die bonding are integrated into a single stainless steel plate module. The sequential process includes the following steps:

[0071] S1. Soldering: The integrated circuit and unpressed stainless steel plate is fed to the printing machine by the board loading machine, and a sufficient amount of solder paste for die bonding is printed on the matching stencil. Then, solder paste is printed on the unpressed stainless steel plate. The solder paste is printed when the stainless steel plate is still in a flat state before pressing, so that a sufficient amount of solder paste is attached to its surface. This is also to ensure that the chip can be well melted and soldered during the later die bonding process, so as to achieve qualified chip push force.

[0072] S2. Solder paste inspection: The solder paste is inspected using an AOI solder paste inspection machine to check for misalignment, as well as the volume, area, and height of the solder paste.

[0073] S3, First reflow soldering: Reflow soldering is performed, and the reflow temperature should reach the standard peak value of the solder paste. The molten solder allows the solder paste to adhere smoothly and evenly to the pads.

[0074] S4. Stamping: The stainless steel plate with tin is stamped and extruded, and then the stainless steel plate with solder paste is stamped. At this time, the chip has not yet been die bonded, and the stamping will not affect the solder paste layer on the pad.

[0075] S5. Cleaning: Use an ultrasonic cleaner to clean the stamped stainless steel plate in a cleaning solvent to remove oil stains, iron filings and foreign objects. The cleaning solvent used is alcohol.

[0076] S6, Die Bonding: After cleaning, the stainless steel plate is placed on the die bonder. The flux is added to the tray, and the needle transfer is performed simultaneously with the die bonding step. The stainless steel plate with the hook is transferred with a special flux (viscosity of 20±5 Pa.s). The flux transfer and die bonding can be performed simultaneously. The flux has sufficient viscosity to adsorb the chip.

[0077] S7. Secondary Reflow Soldering: The die-bonded stainless steel plate is reflowed to melt the solder, which secures the chip. The flux paste is transferred to the die-bonded stainless steel plate and reflowed to melt the solder again, thereby fixing the chip.

[0078] S8. Chip Inspection: The chip is inspected for misalignment, missing parts, or other abnormalities using an SPI detector.

[0079] If so, repair the chips with offset or missing parts, and then proceed to step S9;

[0080] If not, proceed directly to step S9;

[0081] S9. Integrated Welding: The backlight module FPC is hot-pressed and welded to the stainless steel plate after solder paste printing and die bonding to form an integrated stainless steel plate module.

[0082] S10, Dispensing: Dispensing adhesive onto the integrated stainless steel plate module using a dispensing machine. In the dispensing process, the adhesive material is epoxy resin, and the dispensing locations are all LED light positions and FPC welding points.

[0083] S11. Baking: The stainless steel plate module after dispensing is baked in a tunnel oven at a temperature of 175℃ for 2.5 hours to allow the adhesive to cure sufficiently and reach a hard state, thus better protecting the chip and the solder joints between the backlight module FPC.

[0084] S12. Testing: Using a fully automated CIE testing machine, test the luminous efficacy and photoelectric parameters of each lamp position on the stainless steel plate module;

[0085] S13. Appearance inspection: Inspection of the appearance of the stainless steel plate module for any abnormalities.

[0086] S14. Product Packaging: Assemble the stainless steel plate mold into a blister box of matching size, and then pack it into a carton.

[0087] S15. Warehousing: The goods are put into storage pending shipment.

[0088] This embodiment prints solder paste on the stainless steel plate while it is still flat before stamping, ensuring sufficient solder paste for die bonding. This guarantees good soldering of the chip during later die bonding, achieving adequate chip push force. The tin-coated stainless steel plate is then stamped, and since the chip is not yet die bonded, the stamping does not affect the solder paste layer on the pads. Subsequently, the shaped stainless steel plate with hooks is needled to transfer specially formulated flux. Flux transfer and die bonding can be performed simultaneously, as the flux has sufficient viscosity to adhere to the chip. Finally, the stainless steel plate after flux transfer and die bonding undergoes a second reflow soldering process to fix the chip. This integrates the backlight module and the stainless steel plate into a single module product, simultaneously completing solder paste printing and die bonding operations. This not only simplifies the process but also saves production costs.

[0089] The process proposed in this embodiment not only solves the problem of non-planar boards being unprintable, but also continues the advantage of high printing capacity of planar boards, and solves the technical problem of instability in pin-transfer solder paste.

[0090] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. Since the above embodiments are substantially similar to the method embodiments, their descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0091] The above embodiments provide a detailed description of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A solder paste printing and die bonding process for stainless steel plate modules, wherein the process is based on printing solder paste after the board opening process, characterized in that, The solder paste printing and die bonding processes of the stainless steel plate are completed in a sequential process. The backlight module and the stainless steel plate after solder paste printing and die bonding are integrated into one stainless steel plate module. The opening process includes cutting stainless steel plates of corresponding sizes from stainless steel coils, coating, copper plating, etching lines, and ink application. The sequential process flow includes the following steps: S1. Soldering: The integrated circuit and unpressed stainless steel plate is fed to the printing machine by the board loading machine, and a sufficient amount of solder paste for die bonding is printed on the matching stencil. Then, solder paste is printed on the unpressed stainless steel plate. The solder paste is printed when the stainless steel plate is still in a flat state before pressing, so that a sufficient amount of solder paste is attached to its surface to ensure that the chip can be well melted and soldered during the later die bonding process, and the qualified chip push force is achieved. S2. Solder paste inspection: The solder paste is inspected using an AOI solder paste inspection machine to check for misalignment, as well as the volume, area, and height of the solder paste. S3, First reflow soldering: Reflow soldering is performed, and the reflow temperature should reach the standard peak value of the solder paste. The molten solder allows the solder paste to adhere smoothly and evenly to the pads. S4. Stamping: Stamping and forming the tin-coated stainless steel sheet into shape and extruding hooks; S5. Cleaning: Use an ultrasonic cleaner to clean the stamped stainless steel plate in a cleaning solvent to remove oil stains, iron filings and foreign objects. The cleaning solvent used is alcohol. S6. Die Bonding: On the cleaned stainless steel plate, the solder paste is added to the glue tray, and the solder paste is transferred by needle and the die bonding step is performed simultaneously. The viscosity of the solder paste is 20±5 Pa.s. S7. Secondary reflow soldering: The die-bonded stainless steel plate is reflowed to melt solder and secure the chip. S8. Chip Inspection: The chip is inspected for misalignment, missing parts, or other abnormalities using an SPI detector. If so, repair the chips with offset or missing parts, and then proceed to step S9; If not, proceed directly to step S9; S9. Integrated Welding: The backlight module FPC is hot-pressed and welded to the stainless steel plate after solder paste printing and die bonding to form an integrated stainless steel plate module.

2. The solder paste printing and die bonding process according to claim 1, characterized in that, The coating is an insulating and corrosion-resistant coating with a thickness of 10μm applied to a stainless steel plate. The copper plating is a copper foil of matching thickness plated on the surface of the stainless steel plate with the coating and electroplating layers. The etching is a line etching process on the stainless steel plate with the copper foil plated.

3. The solder paste printing and die bonding process according to claim 1, characterized in that, Following step S9 are dispensing and baking processes, specifically: Glue dispensing: Applying glue to the integrated stainless steel plate module using a glue dispensing machine; Baking: The stainless steel plate module after dispensing is baked in a tunnel oven at 175℃ for 2.5 hours to allow the adhesive to cure sufficiently and reach a hard state, thus better protecting the chip and the solder joints between the backlight module FPC.

4. The solder paste printing and die bonding process according to claim 3, characterized in that, In the dispensing process, the adhesive material is epoxy resin, and the dispensing locations are all LED light positions and FPC solder joints.

5. The solder paste printing and die bonding process according to claim 1, characterized in that, Following the baking process are testing, appearance inspection, product packaging, and warehousing processes, specifically: Testing: The luminous efficacy and photoelectric parameters of each lamp position on the stainless steel plate module are tested using a fully automated CIE testing machine. Visual inspection: Inspect the stainless steel plate module for any abnormalities in its appearance; Product packaging: The stainless steel plate mold is assembled into a blister box of matching size, and then packed into a carton; Warehousing: Goods are stored in the warehouse pending shipment.

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