Activation agent, bondline curing agent, and repair process for hot end component integration repair
By using an activator and adhesive layer curing agent for integrated repair of hot-end components, combined with specific process steps, the problem of substrate damage caused by coating peeling of hot-end components of heavy-duty gas turbines was solved, achieving efficient and low-cost repair results and improving interface bonding performance.
Patent Information
- Application Number
- CN202311140655.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-05
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2043-09-05
AI Technical Summary
The coating of hot-end components of existing heavy-duty gas turbines peels off during long-term service, causing damage to the substrate. The repair process requires the removal and re-spraying of the adhesive layer, which prolongs the repair cycle and increases costs.
An activator and adhesive layer curing agent for integrated repair of hot-end components are used, combined with specific process steps, to achieve integrated repair of the substrate and adhesive layer without removing the adhesive layer on the surface of the hot-end components. High entropy is achieved by adjusting the proportion of high-temperature alloy reinforcing elements, thereby improving the interface bonding performance.
It shortens the repair cycle, reduces repair costs, and improves the high-temperature performance and strength connection between the substrate repair area and the adhesive layer.
Smart Images

Figure CN117344188B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of heavy-duty gas turbine hot-end component repair, in particular to an activation agent for integrated repair of hot-end components, a bonding layer curing agent and a repair process. BACKGROUND
[0002] Heavy-duty gas turbines are core equipment in the field of power generation and driving, and are known as the "crown jewel" of the equipment manufacturing industry, which is a concentrated embodiment of the industrial level of a country. The maximum working temperature of such equipment is up to 1000℃ or above, and the hot-end components are made of high-performance and high-value nickel / cobalt-based superalloys (such as turbine blades, combustors, etc.). In order to further improve the temperature resistance of these hot-end components and protect the components from damage in extreme environments, MCrAlX coating or MCrAlX coating + thermal barrier coating (TBC) can be sprayed on the surface of these hot-end components, where "M" can be various metals or metal combinations, such as Fe, Ni or Co; "X" is usually Y, and can also be selected from one or a combination of Y, Ta, Hf, Ti, Zr, etc. However, this protection is limited, and during long-term service, foreign object impact, airflow scouring, and cold and hot fatigue can cause the coating to peel off and the substrate to be damaged, such as thinning and cracking.
[0003] Repairing damaged hot-end components can significantly reduce the operation and maintenance cost of the unit. Generally, when repairing hot-end components with substrate thinning and cracking, the MCrAlX adhesive coating and thermal barrier coating on the surface of the hot-end components are first removed, the substrate is then reshaped, and then the coating is resprayed. Coating peeling and respraying not only prolongs the repair cycle, but also greatly increases the repair cost, usually accounting for more than 40% of the repair cost. SUMMARY
[0004] The purpose of the present application is to provide an activation agent for integrated repair of hot-end components, a bonding layer curing agent and a repair process to improve the high-temperature performance of the substrate repair area, so that the bonding interface is well connected and has high-strength bonding. The removal and respraying process of the bonding layer on the surface of the hot-end component is omitted, the repair cycle is shortened, the repair efficiency is improved, and the repair cost is saved.
[0005] The technical solution adopted by the present application is as follows: an activation agent for integrated repair of hot-end components, the preparation of the activation agent includes at least the following elements with the following mass percentages:
[0006] Cr (16.2% - 19.7%), Co (19.1% - 25.8%), Al (1.3% - 2.8%), Ru (1.1% - 2.9%), Ti (10.1% - 13.3%), Ta (0.2% - 1.8%), Mo (4.2% - 7.8%), Hf (0% - 0.1%), Zr (0% - 0.1%), Y (0% - 0.1%), Ce (0% - 0.1%), the rest is Ni or / and inevitable impurity elements.
[0007] A bonding layer curing agent for hot end component integrated repair, the preparation of the curing agent comprises at least the following mass percentage of elements:
[0008] Ni (25.0% - 30.0%), Cr (25.0% - 30.0%), Al (12.1% - 14.9%), X (0% - 1.5%);
[0009] Wherein, "X" is selected from one or a combination of Y, Ta, Hf, Zr, Ce, and the rest is Co or / and inevitable impurity elements.
[0010] A repair process for hot end component integrated repair, using the activation agent for hot end component integrated repair, and the bonding layer curing agent for hot end component integrated repair; the hot end component comprises a substrate and a bonding layer on the surface of the substrate, the substrate is a precipitation strengthened nickel-based cast high-temperature alloy, and the bonding layer is a NiCoCrAlX coating, wherein "X" is selected from one or a combination of Y, Ta, Hf, Ti, Zr; comprising the following steps:
[0011] S1: defect polishing; cleaning the damage area of the hot end component;
[0012] S2: substrate skeleton shaping;
[0013] Mixing the substrate curing agent and the bonding agent in the required proportion and filling into the damage area of the hot end component, and drying to obtain the substrate skeleton;
[0014] S3: bonding layer skeleton shaping;
[0015] Mixing the bonding layer curing agent and the bonding agent in the required proportion and filling into the substrate skeleton, and drying to obtain the bonding layer skeleton;
[0016] S4: activation agent shaping;
[0017] Mixing the activation agent and the bonding agent in the required proportion and filling into the square of the bonding layer skeleton, shaping into "hills" and then drying;
[0018] S5: metallurgical holding;
[0019] The hot end part after step S4 is placed in a vacuum environment with a vacuum degree better than 1*10-3 Pa for heat preservation, and after the heat preservation is completed, the hot end part is cooled down with the furnace;
[0020] S6: post-processing; the hot end part after step S5 is subjected to a performance recovery heat treatment, and is shaped, so that the repair of the damaged area of the hot end part is completed.
[0021] Further, in step S2, the substrate curing agent and the binder are mixed in a mass ratio of 20:1 to prepare a paste-shaped substrate shaping paste, and the substrate shaping paste is subjected to a drying treatment to obtain a substrate skeleton, and the surface of the substrate skeleton is flush with the surface of the substrate.
[0022] Further, the substrate curing agent is a M-21 commercial alloy powder or a GTD111 commercial custom alloy powder with a particle size selected from the range of 85-106 mu m.
[0023] Further, in step S3, the bonding layer curing agent and the binder are mixed in a mass ratio of 20:1 to prepare a paste-shaped bonding layer shaping paste, and the bonding layer shaping paste is subjected to a drying treatment to obtain a bonding layer skeleton, and the surface of the bonding layer skeleton is flush with the surface of the bonding layer.
[0024] Further, in step S4, the amount of the activator is about 60-80% of the weight of the substrate skeleton.
[0025] Further, the binder in steps S2, S3 and S4 is a NICROBRA S-BINDR type commercial product.
[0026] Further, the drying treatment in steps S2, S3 and S4 is carried out in an atmospheric environment at 70 DEG C, and the drying time is 1-2 h.
[0027] Further, the metallurgical heat preservation temperature is 1170-1210 DEG C, and the heat preservation time is 30-45 min.
[0028] In summary, due to the adoption of the above technical solutions, the present application has the following advantages:
[0029] 1. The activator provided by the present application is used as a low-melting-point filler material, and compared with traditional low-melting-point filler materials, it does not add high-concentration B, Si, Hf and Zr as melting point inhibitors, but adjusts the mass ratio of high-temperature alloy strengthening elements to achieve high-entropy of the alloy, so as to achieve the purpose of inhibiting the melting point of the activator, and the interface connection of the substrate repair area obtained by the activator is good, and the substrate repair area does not contain low-melting-point B, Si, Hf and Zr compounds and / or eutectic phases, and the high-temperature performance of the substrate repair area is significantly improved.
[0030] 2、The activator used in the application can produce various combinations according to the element content of the bonding layer of the hot end component, and is used in combination with the bonding layer curing agent provided by the application, so that the bonding layer repair area obtained is very close to the composition of the bonding layer of the hot end component, also has the protection effect on the hot end component, and the interface between the original bonding layer and the repair bonding layer is well connected;
[0031] 3、The repair process disclosed by the application can realize integrated repair of the base material and the bonding layer of the damaged part without removing the bonding coating on the surface of the hot end component; compared with the existing repair process, the removal and respraying process of the bonding layer on the surface of the hot end component is omitted, the repair period is greatly shortened, the repair efficiency is improved, and the repair cost is saved;
[0032] 4、The base material repair area and the bonding layer repair area obtained by the repair process disclosed by the application are integrally repaired and formed, so that high-strength connection between the base material repair area and the bonding layer repair area can be realized. BRIEF DESCRIPTION OF DRAWINGS
[0033] The application will be described by way of example and with reference to the accompanying drawings, in which:
[0034] Figure 1 It is a schematic view of the structure of the hot end component needing repair;
[0035] Figure 2 It is a schematic view of the hot end component of step S1;
[0036] Figure 3 It is a schematic view of the hot end component of step S2;
[0037] Figure 4 It is a schematic view of the hot end component of step S3;
[0038] Figure 5 It is a schematic view of the hot end component of step S4;
[0039] Figure 6 It is a schematic view of the hot end component of step S5;
[0040] Figure 7 It is a schematic view of the hot end component of step S6;
[0041] Marked in the figure: 1-base material; 2-coating; 3-damaged area of the hot end component; 4-base material skeleton; 5-bonding layer skeleton; 6-activator plastic paste. DETAILED DESCRIPTION
[0042] All features disclosed in this specification, or all steps of any method or process disclosed in this specification, can be combined in any combination, except combinations where at least some features and / or steps are mutually exclusive.
[0043] Any feature in the foregoing description, and / or shown in the accompanying drawings, is presented by way of example only and is not limiting as to the subject matter of the application. That is, the subject matter of the application should not be construed as being limited to only those features that are explicitly described or shown in the foregoing description or in the accompanying drawings.
[0044] Embodiment 1
[0045] An activation agent for hot end component integrated repair, the preparation of the activation agent at least includes the following mass percentage of elements:
[0046] Cr (16.2% - 19.7%), Co (19.1% - 25.8%), Al (1.3% - 2.8%), Ru (1.1% - 2.9%), Ti (10.1% - 13.3%), Ta (0.2% - 1.8%), Mo (4.2% - 7.8%), Hf (0% - 0.1%), Zr (0% - 0.1%), Y (0% - 0.1%), Ce (0% - 0.1%), the rest is Ni or / and inevitable impurity elements.
[0047] In this embodiment, the activation agent can be prepared by atomization method, the particle size is 23 μm ~ 30 μm, the melting temperature range is 1120 ℃ - 1160 ℃, and the activation agent will melt during the metallurgical insulation.
[0048] It should be noted that the atomization method for preparing the activation agent is known to those skilled in the art, and the specific steps are not described in detail in the specification.
[0049] For the activation agent proposed in this embodiment, in order to further clearly set forth and illustrate the technical scheme of the application, the following non-limiting embodiments are provided, which are shown in detail in Table 1.
[0050] Table 1: Embodiments of activation agent
[0051]
[0052] In this embodiment, it can be known from Table 1 that high concentrations of B, Si, Hf and Zr are not added in the activation agents DFB-L, DFB-O, DFB-V and DFB-E as melting point depressants, but the mass ratio of high-temperature alloy strengthening elements is adjusted to achieve high-entropy alloying, so as to achieve the purpose of inhibiting the melting point of the activation agent. Therefore, the interface of the substrate repair area is well connected, does not contain low melting point B, Si, Hf, Zr compounds and / or eutectic phase, and the high-temperature performance of the substrate repair area is significantly improved.
[0053] Embodiment 2
[0054] A bonding layer curing agent for hot end component integrated repair, the preparation of the bonding layer curing agent at least includes the following mass percentage of elements:
[0055] Ni (25.0% - 30.0%), Cr (25.0% - 30.0%), Al (12.1% - 14.9%), X (0% - 1.5%);
[0056] wherein "X" is selected from one or a combination of Y, Ta, Hf, Zr, Ce, and the rest is Co or / and inevitable impurity elements.
[0057] In the present embodiment, the bond coat solidifier can be prepared by a rotating motor method, and the particle size of the prepared bond coat solidifier is 30 μm - 75 μm; the rotating electrode method is known to those skilled in the art, and will not be described in detail in the present specification.
[0058] For the bond coat solidifier proposed in the present embodiment, in order to further clearly set forth and illustrate the technical solutions of the present application, the following non-limiting embodiments are provided, and see Table 2 in detail.
[0059] Table 2: Embodiments of the bond coat solidifier
[0060]
[0061] In the present embodiment, the activator used in Example 1 can produce various combinations according to the element content of the bond coat of different hot end components, and is used in combination with the bond coat solidifier. The obtained bond coat repair area is very close to the composition of the bond coat of the hot end component, also has the protective effect on the hot end component, and the interface between the original bond coat and the repair bond coat is well connected.
[0062] Example 3
[0063] A repair process for hot end component integration repair, which utilizes the activator for hot end component integration repair described in Example 1, and the bond coat solidifier for hot end component integration repair described in Example 2; the hot end component comprises a base material 1 and a bond coat 2 located on the surface of the base material 1, the base material 1 is a precipitation-strengthened nickel-based cast high-temperature alloy, such as Mar-M247, CM247LC, IN738LC, IN939, MGA2400, GTD-111, GTD-222, etc. nickel-based alloy; the bond coat is a NiCoCrAlX coating 2, wherein "X" is selected from one or a combination of Y, Ta, Hf, Ti, Zr; comprising the following steps:
[0064] S1: Defect polishing; cleaning the damage area 3 of the hot end component;
[0065] The oxide layer of the damage area 3 of the hot end component is removed by mechanical polishing, the length x width x height of the polished damage area is not more than 30 mm x 5 mm x 5 mm, and the polished damage area is placed in an alcohol or acetone solution for ultrasonic cleaning for 60 min, taken out and dried for standby use.
[0066] S2: shaping the substrate skeleton 4; specifically, as steps S21-S25:
[0067] S21: selecting the substrate skeleton 4 shaping material; selecting M-21 commercial alloy powder or GTD111 commercial custom alloy powder with titanium removed as the substrate solidification agent, with a particle size of 85-106 μm; selecting NICROBRAZ S-BINDR type commercial as the binder;
[0068] S22: preparing the substrate shaping paste; mixing the substrate solidification agent and the binder in a mass ratio of 20:1 to prepare the substrate shaping paste in the form of a paste;
[0069] S23: filling the substrate shaping paste; filling the substrate shaping paste into the damaged area 3 of the hot end component after polishing and cleaning in step S1, and scraping off the excess paste until the paste height is flush with the profile of the hot end component;
[0070] S24: drying treatment; placing the hot end component filled with the substrate shaping paste in a 70°C atmospheric environment for 1-2 h to obtain the substrate skeleton 4, and an atmospheric furnace can be selected to provide the drying environment;
[0071] S25: trimming; scraping off the substrate skeleton 4 layer of 0.1-1.0 mm (equivalent to the thickness of the bonding layer) from the surface of the substrate skeleton 4 to make the surface of the substrate skeleton 4 flush with the surface of the substrate 1.
[0072] S3: shaping the bonding layer skeleton 5; specifically, as steps S31-S35;
[0073] S31: selecting the bonding layer skeleton 5 shaping material; selecting the bonding layer solidification agent disclosed in Example 2; selecting NICROBRAZ S-BINDR type commercial as the binder;
[0074] S32: preparing the bonding layer shaping paste; mixing the bonding layer solidification agent and the binder in a mass ratio of 20:1 to prepare the bonding layer shaping paste in the form of a paste;
[0075] S33: filling the bonding layer shaping paste; filling the bonding layer shaping paste into the part of the substrate skeleton 4 scraped off in step S2;
[0076] S34: drying treatment; placing the hot end component filled with the bonding layer shaping paste in a 70°C atmospheric environment for 1-2 h to obtain the bonding layer skeleton 5, and an atmospheric furnace can be selected to provide the drying environment;
[0077] S35: removing material; scraping off the excess bonding layer skeleton 5 with a trimming knife or other tools until the bonding layer skeleton 5 is flush with the bonding layer surface.
[0078] S4: Activator shaping; Specifically, as steps S41-S44;
[0079] S41: Activator shaping material selection and dosage; Select the activator disclosed in Example 1, and the dosage of the activator is 60% to 80% of the weight of the substrate skeleton 4; Select NICROBRAZ S-BINDR type commercial as binder;
[0080] S42: Modulate the activator shaping paste 6; Mix the activator and the binder in a mass ratio of 20:1 to modulate the activator shaping paste 6 into a paste;
[0081] S43: Stack the activator shaping paste 6; Place the activator shaping paste 6 on top of the adhesive layer skeleton 5 in step S3, and shape it into a nearly "hill" shape;
[0082] S44: Drying treatment; Stack the activator shaping paste 6 in the hot end part in an atmospheric environment of 70℃ for 1-2h, and select an atmospheric furnace to provide a drying environment.
[0083] S5: Metallurgical heat preservation;
[0084] Place the hot end part completed in step S4 in a vacuum environment with a vacuum degree better than 1×10 -3 Pa for heat preservation, and the metallurgical heat preservation temperature is 1170℃-1210℃, and the heat preservation time is 30min-45min; After the heat preservation is completed, the furnace is cooled; A vacuum furnace can be selected to provide a vacuum environment;
[0085] S6: Post-processing;
[0086] The hot end part completed in step S5 is subjected to performance recovery heat treatment, and is shaped with a shaping knife to remove excess metal, so as to complete the remolding of the substrate 1-adhesive layer integration shape of the damaged area.
[0087] It should be noted that the paste is viscous, and has low flowability. When filling the substrate shaping paste, the adhesive layer paste, and the activator shaping paste 6, the filling position is stable, and the repair position is avoided. The viscous substrate shaping paste, the adhesive layer paste, and the activator shaping paste 6 are more convenient to fill, which is specifically manifested as follows: The viscous paste has a certain flowability. When the substrate shaping paste, the adhesive layer paste, and the activator shaping paste 6 are filled in the corresponding position, because of the flowability, they can change their shape according to the size of the filling position, meet the filling of irregular areas, and can be completely filled under the action of their flowability, reducing the existence of defects and gaps.
[0088] In the present embodiment, the base material 1 and the bond coat at the damaged site can be integrally repaired without removing the bond coat 2 on the surface of the hot end component. Compared with the repair process without using one or more features described herein, the removal and respraying process of the bond coat on the surface of the hot end component is omitted, the repair cycle is greatly shortened, the repair efficiency is improved, and the repair cost is saved.
[0089] In the present embodiment, the base material repair area and the bond coat repair area obtained by the repair process described above are integrally repaired, so that a high-strength connection between the base material repair area and the bond coat repair area can be achieved.
[0090] Embodiment 4
[0091] On the basis of Embodiment 3, a specific application implementation of the repair process on the N4 guide vane is proposed.
[0092] The base material 1 of the N4 guide vane is an IN738LC precipitation-strengthened nickel-based cast high-temperature alloy, and the nominal chemical composition is Ni-16wt%Cr-8.5wt%Co-2.5wt%W-3.5wt%Al-3.5wt%Ti-1.7wt%Ta-1.7wt%Mo-0.8wt%Nb-0.09wt%C-0.01wt%B-0.05wt%Zr. The protective coating 2 (bond coat) on the surface of the vane is NiCoCrAlY, and the chemical composition is Ni-28wt%Co-23wt%Cr-8.5wt%Al-0.6wt%Y.
[0093] The repair process is carried out according to the steps described in Embodiment 3; wherein:
[0094] The selected base material curing agent is a commercial custom alloy powder GTD111 with titanium removed, with a particle size of 85μm-106μm, and the composition is as follows:
[0095] C (0.1wt%), Cr (14.0wt%), Co (9.5wt%), Mo (1.6wt%), W (3.8wt%), Ta (2.8wt%), Al (3.0wt%), Zr (0.02wt%), B (0.012wt%);
[0096] The selected bond coat curing agent is the bond coat curing agent with the brand DF-L in Embodiment 2, with a particle size of 30μm-75μm;
[0097] The selected activator is the activator with the brand DFB-L in Embodiment 1, with a particle size of 23μm-30μm.
[0098] The thickness of the bond coat skeleton 5 is 0.5mm.
[0099] The amount of activator is about 60% of the weight of the matrix.
[0100] The metallurgical holding temperature is 1190°C and the holding time is 40 minutes.
[0101] After the repair, the repaired area of the matrix is made into a tensile piece, and the tensile strength at room temperature is measured to be 875 MPa, reaching 87.7% of the strength of the matrix 1, and the tensile strength at 900°C is 486 MPa, reaching 85.9% of the strength of the matrix 1.
[0102] After the repair, the repaired area of the matrix is made into a tensile piece, and the tensile strength at room temperature is measured to be 875 MPa, reaching 87.7% of the strength of the matrix 1, and the tensile strength at 900°C is 486 MPa, reaching 85.9% of the strength of the matrix 1.
[0103] Cr (22.7wt%), Co (23.6wt%), Al (9.9wt%), Ti (4.4wt%), Ta (0.7wt%), Hf (0.2wt%), Ru (1.2wt%), Mo (3.1wt%), Y (0.8wt%).
[0104] Example 5
[0105] On the basis of Example 3, a specific application embodiment of the repair process is proposed for repairing a Mar-m247 precipitation-strengthened nickel-based cast high-temperature alloy structural part with a NiCoCrAlY coating 2 (bonding layer).
[0106] The nominal chemical composition of the Mar-m247 precipitation-strengthened nickel-based cast high-temperature alloy is Ni-8wt%Cr-10wt%Co-10wt%W-5.5wt%Al-1wt%Ti-3wt%Ta-1.5wt%Hf-0.6wt%Mo-0.15wt%C-0.015wt%B-0.03wt%Zr; the chemical composition of the NiCoCrAlY coating 2 is Ni-28wt%Co-25wt%Cr-8.8wt%Al-0.6wt%Y.
[0107] The repair process is carried out according to the steps described in Example 3; wherein:
[0108] The selected matrix solidification agent is a commercial alloy powder of M-21, with a particle size of 75μm-150μm, and a nominal chemical composition of:
[0109] C (0.13wt%), B (0.02wt%), Cr (5.7wt%), Mo (2.0wt%), Al (6.0wt%), W (11.0wt%), Nb (1.5wt%), Zr (0.12wt%);
[0110] The selected bonding layer solidification agent is the bonding layer solidification agent of Example 2 with a brand of DF-0, with a particle size of 30μm-75μm;
[0111] The selected activator is the one with the trade name DFB-0 in Example 1, and the particle size is 23-30 μm.
[0112] The thickness of the substrate skeleton 4 is 0.5 mm.
[0113] The amount of the activator is about 65% of the weight of the substrate skeleton 4.
[0114] The metallurgical holding temperature is 1210°C, and the holding time is 30 min.
[0115] After the repair is completed, the repaired area of the substrate is made into a tensile piece, and the tensile strength at room temperature is measured to be 825 MPa, which is 84.9% of the strength of the substrate 1, and the tensile strength at 900°C is 491 MPa, which is 75.8% of the strength of the substrate 1.
[0116] After the repair is completed, the EDS energy spectrum analysis is performed on the repaired area of the bonding layer, and the results are as follows:
[0117] Cr (22.5 wt%), Co (29.5 wt%), Al (9.4 wt%), Ti (4.7 wt%), Ta (0.6 wt%), Ru (0.4 wt%), Y (0.8 wt%).
[0118] The present application is not limited to the foregoing specific embodiments. The present application extends to any novel one, or any new combination, of the characteristics disclosed in this specification, as well as to any novel method or process disclosed in any step or any new combination of steps.
Claims
1. An activator for integrated repair of hot end components, characterized in that: The preparation of the activator includes at least the following elements in mass percentage: Cr: 16.2%-19.7%, Co: 19.1%-25.8%, Al: 1.3%-2.8%, Ru: 1.1%-2.9%, Ti: 10.1%-13.3%, Ta: 0.2%-1.8%, Mo: 4.2%-7.8%, Hf: 0%-0.1%, Zr: 0%-0.1%, Y: 0%-0.1%, Ce: 0%-0.1%, the rest is Ni and unavoidable impurity elements; The activator has a particle size of 23 μm to 30 μm and a melting temperature range of 1120° C. to 1160° C.
2. A repair process for integrated repair of hot end components, characterized in that: The activator for integrated repair of hot end components according to claim 1 and the adhesive layer curing agent for integrated repair of hot end components are used, and the preparation of the adhesive layer curing agent for integrated repair of hot end components includes at least the following elements in percentage by mass: Ni: 25.0%-30.0%, Cr: 25.0%-30.0%, Al: 12.1%-14.9%, X: 0%-1.5%; Wherein, "X" is selected from one of Y, Ta, Hf, Zr, Ce or a combination thereof, and the remainder is Co and unavoidable impurity elements; the hot end component comprises a substrate (1) and a bonding layer located on the surface of the substrate (1), the substrate (1) is a precipitation-strengthened nickel-based cast high-temperature alloy, and the bonding layer is a NiCoCrAlX coating (2), wherein "X" is selected from one of Y, Ta, Hf, Ti, Zr or a combination thereof; and the method comprises the following steps: S1: Defect polishing; cleaning the damaged area (3) of the hot end component; S2: Shaping of the substrate skeleton (4); Mixing the base material curing agent and the adhesive in a required proportion and filling the mixture into the damaged area (3) of the hot end component, and drying the mixture to obtain the base material skeleton (4); S3: shaping of the bonding layer skeleton (5); The adhesive layer curing agent and the adhesive are mixed in a required proportion and then filled into the base material skeleton (4), and dried to obtain the adhesive layer skeleton (5); S4: activator shaping; The activator and the adhesive are mixed in the required proportion and then filled onto the top of the adhesive layer skeleton (5), and then shaped into a "hill" shape and dried; S5: Metallurgical insulation; Place the hot end component after step S4 in a vacuum chamber with a pressure of better than 1×10 -3 Keep warm in a vacuum environment of Pa, and cool with the furnace after the insulation is completed; S6: Post-processing: Performing a performance recovery heat treatment on the hot end component that has completed step S5, reshaping, and completing the repair of the damaged area (3) of the hot end component.
3. The repair process according to claim 2, characterized in that: In step S2, the substrate curing agent and the binder are mixed in a mass ratio of 20:1 to form a paste-like substrate shaping paste, and the substrate shaping paste is dried to obtain a substrate skeleton (4), the surface of the substrate skeleton (4) being flush with the surface of the substrate (1).
4. The repair process according to claim 3, characterized in that: The substrate curing agent is M-21 commercial alloy powder or detitaniumized GTD111 commercial customized alloy powder, and the particle size range is 85 μm to 106 μm.
5. The repair process according to claim 2, characterized in that: In step S3, the bonding layer curing agent and the bonding agent are mixed in a mass ratio of 20:1 to form a pasty bonding layer shaping paste, and the bonding layer shaping paste is dried to obtain a bonding layer skeleton (5), the surface of the bonding layer skeleton (5) being flush with the surface of the bonding layer.
6. The repair process according to claim 2, characterized in that: In step S4, the amount of the activator used is 60% to 80% of the weight of the substrate skeleton (4).
7. The repair process according to any one of claims 2 to 6, characterized in that: The adhesive in steps S2, S3 and S4 is commercially available NICROBRAZ S-BINDR.
8. The repair process according to any one of claims 2 to 6, characterized in that: The drying environment of the drying treatment in steps S2, S3 and S4 is an atmospheric environment at 70°C, and the drying time is 1-2 hours.
9. The repair process according to claim 2, characterized in that: The metallurgical insulation temperature is 1170° C.-1210° C., and the insulation time is 30 minutes to 45 minutes.
Citation Information
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