A heterogeneous computing system and computing device for high-performance computing

Abstract

This invention discloses a heterogeneous computing system and its computing device for high-performance computing, comprising: acquiring and preprocessing the temperature of the CPU or FPGA through a body temperature module within a preset time period to obtain body temperature processing data; collecting temperature data reaching the cooling monitoring module and wind speed data reaching the wind speed monitoring module from the wind speed cooling module corresponding to the angle value data of the rotation of the angle module under the control of the rotation adjustment module, thereby forming an angle rotation set, a cooling temperature set, and a wind speed set. By making the adjacent diffuser blades at the bottom of the overclocking corresponding component or the adjustment blades adjacent to the bottom fixed adjustment unit form a preset angle to generate a rotation segment, the hot air of the adjacent diffuser blades is intercepted and rotated in advance and discharged from the heat dissipation holes on the top plate surface, thereby reducing the heat interference of the rotating air duct to the adjacent fixed adjustment unit below, facilitating the optimization of the air duct, and maintaining the stability of the heterogeneous computing power.

Description

Technical Field

[0001] This invention relates to the technical field of heterogeneous computing, and more particularly to a heterogeneous computing system and computing device for high-performance computing. Background Technology

[0002] Heterogeneous computing is a special form of parallel computing. Traditional parallel computing is performed on a multi-core CPU with a single architecture, while heterogeneous computing is parallel computing under different architectures. Existing methods include combining multiple architectures on a single chip or combining multiple architecture circuit boards to form a heterogeneous computing system.

[0003] Chinese patent CN202121194397.4 discloses a heterogeneous high-density server device and a heterogeneous computing platform. The heterogeneous high-density server device includes a rear panel and a switching chip, k VPX connectors, m ATCA connectors, n CPICI connectors, and a power supply mounted on the rear panel, where k, m, and n are all integers greater than 1. The power supply provides power to the VPX connectors, ATCA connectors, and CPICI connectors. Each of the VPX connectors, ATCA connectors, and CPICI connectors is connected to the switching chip via two network channels. This heterogeneous high-density server device is compatible with mainstream VPX server boards, ATCA server boards, and CPCI server motherboards on the market, providing a good heterogeneous computing platform for the design of biomimetic systems.

[0004] However, the existing technology and existing patents have the following problems:

[0005] 1. Heterogeneous computing requires the combination of various CPUs or FPGAs with different architectures. In actual operation, when heterogeneous systems or heterogeneous servers are overclocked, the heat dissipation will be aggravated during the overclocking process, which will affect the computing power of the device and thus make it impossible to maintain the stable performance of heterogeneous computing.

[0006] 2. For small heterogeneous computing systems, most are composed of chip boards with different architectures. However, the installation or maintenance of chip boards with different architectures requires complicated disassembly and assembly procedures, which is not conducive to the daily maintenance of high-performance heterogeneous systems. Summary of the Invention

[0007] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract and title of this application to avoid obscuring the purpose of this section, the abstract and the title of the invention, and such simplifications or omissions should not be used to limit the scope of the present invention.

[0008] In view of the problems existing in the above-mentioned heterogeneous computing systems and computing devices for high-performance computing, the present invention is proposed.

[0009] Therefore, the purpose of this invention is to provide a heterogeneous computing system for high-performance computing.

[0010] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0011] Within a preset time period, the temperature of the CPU or FPGA is collected and preprocessed by the body temperature module to obtain body temperature processing data; by collecting the angle value data of the angle module under the control of the rotation adjustment module, the temperature data reaching the cooling monitoring module and the wind speed data reaching the wind speed monitoring module are collected from the wind speed cooling module, thereby forming an angle turning set, a cooling temperature set and a wind speed set.

[0012] Based on the received temperature processing data, the control module performs joint calculations on the data within the cooling temperature set and the wind speed set to obtain temperature performance values. These values ​​are then compared with preset performance temperature ranges to obtain primary temperature performance values, secondary temperature performance values, and temperature performance sets for the first and second angle adjustment commands. This enables the monitoring, analysis, and adjustment of the overall heat dissipation performance of the heterogeneous computing system. The primary temperature performance value corresponds to the non-full-load operation of the heterogeneous computing system, while the secondary temperature performance value represents the overclocked operation of the heterogeneous computing system.

[0013] Adjustments are made based on the body temperature data, cooling temperature data, and wind speed data. Within a preset time period, different temperature performance values ​​adjust the air volume of the air supply module and the adjustment amount of the angle module, thereby achieving dynamic stability of the computing power of the heterogeneous computing system in the adaptive optimization of the heat dissipation duct.

[0014] As a preferred embodiment of the heterogeneous computing system for high-performance computing described in this invention, the temperature and wind speed information corresponding to the angle adjustment are obtained by collecting and processing the temperature and wind speed passing through the fixed adjustment unit.

[0015] As a preferred embodiment of the heterogeneous computing system for high-performance computing described in this invention, the specific processing of temperature and wind speed information for angle adjustment includes: acquiring and marking the real-time temperature and real-time wind speed passed by two adjacent fixed adjustment units; normalizing and calculating the marked data to obtain the temperature performance coefficient; combining the marked data with the temperature performance coefficient to form temperature performance information; and forming the temperature performance information corresponding to the angle adjustment.

[0016] As a preferred embodiment of the heterogeneous computing system for high-performance computing described in this invention, the corresponding prompting module records alarm logs at different levels based on the different primary and secondary temperature performance values.

[0017] Another objective of this invention is to address the shortcomings of existing technologies by providing a computing device for heterogeneous computing systems designed for high-performance computing, comprising:

[0018] System cabinet unit;

[0019] The housing unit, used to house the combined heterogeneous CPU and FPGA, is located inside the system cabinet unit.

[0020] Fixed adjustment unit; the fixed adjustment unit for fixing the CPU and FPGA and adjusting the wind speed and angle is disposed inside the housing unit;

[0021] The fixed adjustment unit includes a support plate and a circuit board. The circuit board is movably mounted on the top side of the support plate. The support plate is connected to the synchronous plate via a rotating screw. A clamping arm is mounted on the side of the synchronous plate. A moving block is linked to the side of the synchronous plate. A cooling adjustment diffusion assembly is mounted on the side of the moving block. A diffusion blade for adjusting heat dissipation is rotatably mounted on the top of the diffusion assembly.

[0022] The system cabinet unit includes support legs and a cabinet body. The bottom of the cabinet body is equipped with support legs. Sliding doors are movably installed on both the left and right sides of the cabinet body. The sliding doors are movably connected to the cabinet body through sliding door tracks. The top of the cabinet body is equipped with a top plate. The surface of the top plate is evenly provided with heat dissipation holes. The surface of the top plate is provided with two sets of mounting grooves in the horizontal direction. The inside of the mounting grooves is provided with locking blocks along their longitudinal direction.

[0023] The accommodating chamber unit includes a mounting column, which is installed on the bottom side of the top surface inside the accommodating chamber unit. A heat dissipation component is movably installed on the bottom surface of the mounting column. Several sets of limiting plates are evenly distributed inside the accommodating chamber unit. A fixing adjustment unit is snapped into the inside of the limiting plate. A bottom adjustment component is installed on the side of the limiting plate.

[0024] The bottom adjustment assembly includes a support frame, a linkage component, an adjustment blade, and an adjustment drive component. The support frame is located on the bottom surface inside the accommodating chamber unit. The top surface of the support frame is provided with a linkage component. The linkage component is linked to the adjustment drive component and several sets of adjustment blades. A partition plate is installed in the middle of each pair of limiting plates. Threading blocks are provided on the left and right sides of the partition plate. Threading grooves are provided through the surface of the threading blocks.

[0025] Wherein: the fixed adjustment unit includes a movable groove, which is disposed on its surface along the length side of the fixed adjustment unit. The movable groove is slidably connected to the bearing plate through a movable sliding leg. A bottom tooth plate is provided at the bottom of the forward side of the bearing plate. The bottom tooth plate is driven by meshing with a rotating screw through a mating part. The outer side of the rotating screw is rotatably disposed on the inner side of the side frame plate. A central support member is sleeved on the outer side of the middle part of the rotating screw.

[0026] Fasteners are installed on one side of the limiting groove plate. The limiting groove plate is engaged with the circuit board through a groove on its side. The circuit board is movably engaged between the limiting groove plate and the fasteners. A slot plate is provided on the side of the limiting groove plate. The limiting groove plate is engaged with a corresponding part on the top surface of the circuit board through the slot plate. A positioning block that cooperates with the fasteners is provided at the bottom of the bearing plate.

[0027] Wherein: the fixing adjustment unit further includes a wire frame assembly, the wire frame assembly is installed on the side of the positioning block, the wire frame assembly is set on the top of the fixing adjustment unit, the side of the wire frame assembly is provided with a wire bundling hole, the top of the wire frame assembly is provided with a wire storage groove, the bottom of the top of the wire frame assembly is provided with a side plate, and the inner side of the side plate is provided with a bottom protrusion.

[0028] Synchronizing plates are symmetrically arranged on the left and right sides of the rotating screw. The synchronizing plates are rotatably connected to the rotating screw through synchronizing sleeves. The central support is slidably connected to the synchronizing plates through auxiliary rods. A clamping arm is installed on the top of the synchronizing plates. A connecting rod is movably connected to the side of the synchronizing plates away from the positioning block.

[0029] Wherein: the clamping arm includes a trigger wheel, which is movably fitted to the bottom of the bottom protrusion. A connecting plate frame is installed at the bottom of the trigger wheel. The connecting plate frame is movably connected to the clamping arm and the dynamic pressure plate. An elastic element is provided between the clamping arm and the dynamic pressure plate. A stabilizing plate is provided at the bottom of the dynamic pressure plate. The bottom of the stabilizing plate is elastically connected to the clamping arm through the elastic element. The top surface of the stabilizing plate and the bottom surface of the inner groove of the limiting groove plate are coplanar. The distance between the stabilizing plate and the dynamic pressure plate is greater than the height of the inner groove of the limiting groove plate.

[0030] The synchronization plate is slidably connected to the trigger slider via a connecting rod. The trigger slider is slidably disposed inside the inner groove plate. The trigger slider is movably connected to the moving block via a diagonal rod. The moving block is slidably connected to the inner groove plate via a guide rod. The moving block is connected to the central through plate on its inner side via an extension rod. A central support member is movably disposed at the bottom of the central through plate.

[0031] Wherein: the diffusion assembly includes diffusion blades, and a plurality of diffusion blades are rotatably disposed on the top surface of the diffusion assembly. The diffusion blades are rotatably connected by a diffusion linkage and a diffusion adjustment component, and a protective shell is sleeved on the outer side of the diffusion linkage and the diffusion adjustment component.

[0032] The bottom of the diffusion assembly is provided with a bottom contact block, and a heat transfer cavity is provided inside the diffusion assembly, the diffusion blade and the bottom contact block. The extension rod is inserted into the side connecting block at the bottom of the diffusion assembly, and a cooling measuring element is installed on the side of the top surface diffusion blade of the diffusion assembly.

[0033] The beneficial effects of this invention are:

[0034] 1. When the corresponding components inside the housing unit are all at a safe temperature T1, the rotation angle Θ1 of the adjusting blade and the rotation angle Θ2 of the diffuser blade are controlled to form corresponding angles and complete the circulating air duct. This allows the coplanar fixed adjusting units separated by the partition plate to form a U-shaped air duct that blows out from the heat sink, passes through the coplanar fixed adjusting units, and is discharged through the heat dissipation holes on the top plate. This achieves efficient energy utilization and meets the daily cooling requirements of heterogeneous computers.

[0035] Second, when the corresponding components inside the housing unit are all at the overclocking temperature T2, the heat sink operates at high power. The control module searches the preset correspondence table of Θ1, Θ2 and WDXN, so that the diffuser blades adjacent to the bottom of the overclocked corresponding component or the adjustment blades adjacent to the bottom fixed adjustment unit form a preset angle to generate a rotation section. This allows the hot air from the adjacent diffuser blades to be intercepted and rotated in advance and discharged from the heat dissipation holes on the top plate surface, thereby reducing the heat interference of the rotating air duct to the adjacent fixed adjustment unit below. The early rotation of hot air can improve the heat dissipation efficiency. Furthermore, through the combination of WDXN and Θ1, Θ2 settings, the individual overclocked corresponding components inside the coplanar fixed adjustment unit can be processed independently, thereby improving the heat dissipation processing efficiency of heterogeneous computing components, facilitating the optimization of the air duct, and maintaining the stability of heterogeneous computing power.

[0036] Third, the internal structure of the housing unit is equipped with multiple fixed adjustment units, which are sequentially inserted into the limiting plate to facilitate the assembly of multiple fixed adjustment units. Furthermore, the cooperation between the limiting plate and the card slot plate can enable the rapid combination of heterogeneous CPU or FPGA circuit boards of different types.

[0037] Fourth, by setting up fixed adjustment units distributed vertically inside the housing unit, under the control of the corresponding system, the angle of the diffuser blades of the fixed adjustment unit and the angle of the adjustment blades inside the bottom adjustment component can be rotated to complete the circulation and heat dissipation of the air blown out of the heat dissipation component inside the housing unit. The rotation angle of the diffuser blades inside the upper and lower fixed adjustment units can be adjusted in time to increase the return flow of the air duct while circulating heat dissipation, similar to a rotary section. This improves the heat dissipation of the circuit board and corresponding components, while optimizing the heat dissipation air duct. This improves energy efficiency and heat dissipation effect, thereby improving the computing power of heterogeneous computing in overclocking or daily use, and reducing the decline in high-performance computing power caused by heat dissipation problems.

[0038] 5. By inserting the circuit board into the inside of the limiting slot plate and making the corresponding parts snap into the slot plates to complete the positioning, the fasteners initially fix the circuit board to the top surface of the carrier plate. After the initial fixation is completed, by pushing the carrier plate forward, the bottom tooth plate at the front end of the carrier plate moves, driving the mating parts and rotating screw to rotate. The rotating screw drives the left and right synchronous plates to move inward. Then, when the carrier plate moves to the outside of the clamping arm, it stops. At this time, the left and right clamping arms complete the clamping and fixing of the left and right sides of the circuit board.

[0039] 6. By rotating the screw, the synchronous plate moves inward, causing the synchronous plate to move the connecting rod and the trigger slider outward. As the trigger slider moves inside the inner groove plate, it drives the moving block to move downward along the guide rod via the inclined rod. This causes the guide rod to engage the bottom contact block at the front end of the extension rod with the surface of the corresponding part. The heat inside the corresponding part is conducted by the copper bottom contact block to the diffuser assembly and diffuser blades of the same material. Thus, when the circuit board is self-locked, the diffuser assembly completes the fixation and heat dissipation of the corresponding part, thereby improving the ease of installation of the diffuser assembly with heat dissipation and heat transfer functions.

[0040] 7. The heat from the bottom contact block can be transferred to the interior of the heat transfer cavity through the heat transfer cavity inside the diffuser assembly and diffuser blades. The large-area heat dissipation of the planar diffuser assembly and the rotatable diffuser blades improves the cooling of the transferred heat, thereby improving the heat dissipation capacity of the corresponding components. Attached Figure Description

[0041] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0042] Figure 1 This is a schematic diagram of the overall process of the present invention;

[0043] Figure 2 This is a schematic diagram of the air supply module assembly of the present invention;

[0044] Figure 3 This is a schematic diagram of the temperature module assembly of the present invention;

[0045] Figure 4 This is a schematic diagram of the wind speed cooling module assembly of the present invention;

[0046] Figure 5 This is a schematic diagram of the angle module combination of the present invention;

[0047] Figure 6 This is a schematic diagram of the overall structure of the computing device of the present invention;

[0048] Figure 7 This is a schematic diagram of the internal length side section connection of the housing unit of the present invention;

[0049] Figure 8 for Figure 7 A magnified structural diagram of part A in the middle;

[0050] Figure 9 for Figure 7 A magnified structural diagram of part B in the middle section;

[0051] Figure 10 for Figure 7 A magnified structural diagram of section C;

[0052] Figure 11 This is a schematic diagram of the internal width side section connection of the accommodating chamber unit of the present invention;

[0053] Figure 12 for Figure 11 A magnified structural diagram of section D in the middle;

[0054] Figure 13 This is a schematic diagram illustrating the wind direction adjustment of the present invention;

[0055] Figure 14 This is a schematic diagram of the bottom adjustment component structure connection of the present invention;

[0056] Figure 15 This is a schematic diagram of the connection of the fixed adjustment unit structure of the present invention;

[0057] Figure 16 for Figure 15 A magnified structural diagram of section E in the middle;

[0058] Figure 17 This is a schematic diagram of the diagonal bar structure connection of the present invention;

[0059] Figure 18 This is a schematic diagram of the connecting rod structure of the present invention;

[0060] Figure 19 This is a schematic diagram of the clamping boom structure connection of the present invention;

[0061] Figure 20 This is a schematic diagram of the heat transfer cavity structure of the present invention.

[0062] In the picture:

[0063] 1. System cabinet unit; 101. Support leg; 102. Cabinet body; 103. Sliding door; 104. Sliding door track; 105. Top plate; 106. Mounting groove; 1061. Locking block;

[0064] 2. Reception chamber unit; 201. Mounting column; 202. Heat sink; 203. Limiting plate; 204. Bottom adjustment assembly; 2041. Support frame; 2042. Linkage component; 2043. Adjustment blade; 2044. Adjustment drive component; 205. Partition plate; 206. Cable guide block; 2061. Cable guide groove;

[0065] 3. Fixed adjustment unit; 301. Movable groove; 3011. Movable sliding leg; 3012. Bearing plate; 30121. Bottom tooth plate; 3013. Restriction groove plate; 3014. Slot plate; 3015. Circuit board; 30151. Corresponding part; 3016. Fastener; 302. Positioning block; 303. Wire frame assembly; 3031. Cable bundle hole; 3032. Cable storage groove; 3033. Side plate; 3034. Bottom protrusion; 304. Rotating screw; 3041. Mating part; 3042. Side frame plate; 3043. Central support; 305. Synchronization plate; 3051. Synchronization sleeve; 3052. Auxiliary rod; 3053. Connecting rod; 306 3061. Clamping boom; 3062. Trigger wheel; 3063. Connecting plate frame; 3064. Dynamic pressure plate; 3065. Stabilizing plate; 3066. Elastic element; 307. Trigger slider; 3071. Inner groove plate; 3072. Diagonal bar; 3073. Moving block; 3074. Guide rod; 3075. Extension rod; 30751. Center through plate; 308. Diffusion assembly; 3081. Diffusion blade; 3082. Diffusion linkage; 3083. Protective shell; 3084. Diffusion adjustment component; 3085. Bottom contact block; 3086. Heat transfer chamber; 3087. Side connecting block; 3088. Cooling measuring component; 3089. Body measuring component; 309. Rotary section. Detailed Implementation

[0066] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0067] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0068] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments.

[0069] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0070] Example 1

[0071] Reference Figure 1-5 and Figure 7-10 This provides an overall schematic diagram of a heterogeneous computing system for high-performance computing, such as... Figure 1 A heterogeneous computing system and computing device for high-performance computing includes:

[0072] Specifically, it includes: an air supply module, a body temperature module, a wind speed cooling module, and an angle module.

[0073] Within a preset time period, the temperature of the CPU or FPGA is collected and preprocessed by the body temperature module to obtain body temperature processing data; by collecting the angle value data of the angle module under the control of the rotation adjustment module, the temperature data reaching the cooling monitoring module and the wind speed data reaching the wind speed monitoring module are collected from the wind speed cooling module, thereby forming an angle turning set, a cooling temperature set and a wind speed set.

[0074] Based on the received temperature processing data, the control module performs joint calculations on the data within the cooling temperature set and the wind speed set to obtain temperature performance values. These values ​​are then compared with preset performance temperature ranges to obtain primary temperature performance values, secondary temperature performance values, and temperature performance sets for the first and second angle adjustment commands. This enables the monitoring, analysis, and adjustment of the overall heat dissipation performance of the heterogeneous computing system. The primary temperature performance value corresponds to the non-full-load operation of the heterogeneous computing system, while the secondary temperature performance value represents the overclocked operation of the heterogeneous computing system.

[0075] Adjustments are made based on the body temperature data, cooling temperature data, and wind speed data. Within a preset time period, different temperature performance values ​​adjust the air volume of the air supply module and the adjustment amount of the angle module, thereby achieving dynamic stability of the computing power of the heterogeneous computing system in the adaptive optimization of the heat dissipation duct.

[0076] Furthermore, by collecting and processing the temperature and wind speed passing through the fixed adjustment unit 3, the collected and processed information of temperature and wind speed corresponding to the angle adjustment is obtained.

[0077] Furthermore, the specific information processing of temperature and wind speed acquisition for angle adjustment includes: acquiring and marking the real-time temperature and real-time wind speed passing through two adjacent fixed adjustment units 3; normalizing and calculating the temperature performance coefficients of the marked data; combining the marked data with the temperature performance coefficients to form temperature performance information; and forming the temperature performance information corresponding to the angle adjustment.

[0078] By monitoring the temperature of the corresponding component 30151, and setting performance temperature thresholds for the temperature of the corresponding component 30151, which are respectively set as safe temperature T1 and overclocking temperature T2, the temperature range of safe temperature T1 is 30-50 degrees, at which time the first control command is generated. The temperature range of overclocking temperature T2 is 50-75 degrees, at which time the second control command is generated. The body temperature of the corresponding component 30151 is recorded in real time and marked as BTi, i = 1, 2, 3...n; the body temperatures are sorted by time to obtain the body temperature sorting set.

[0079] By monitoring the adjacent fixed adjustment units 3 inside the containment chamber unit 2, the main focus is on monitoring the temperature sensor data in the cooling measuring component 3088, and recording the real-time temperature difference. Specifically, the temperature flowing out of the first fixed adjustment unit 3 is set as Ta, and the temperature flowing out of the second fixed adjustment unit 3 is set as Tb. Since the first and second fixed adjustment units 3 are adjacent, the measured temperature difference is Tc = Tb - Ta. This temperature difference is recorded in real-time and labeled as Tc. i Let i = 1, 2, 3...n; sort the temperature differences by time to obtain the sorted set of temperature differences;

[0080] By monitoring the vertically adjacent fixed adjustment units 3 inside the containment chamber unit 2, the wind speed difference is recorded by the wind speed sensor in the cooling measuring component 3088. The real-time wind speed difference is recorded as follows: the wind speed flowing out of the first fixed adjustment unit 3 is set as Fa, and the wind speed flowing out of the second fixed adjustment unit 3 is set as Fb. Since the first and second fixed adjustment units 3 are adjacent, the measured wind speed difference is Fc = Tb - Ta. This wind speed difference is recorded in real time and marked as Fc.i Let i = 1, 2, 3...n; sort the wind speed differences by time to obtain the sorted set of wind speed differences;

[0081] The real-time wind speed difference Fc i and real-time temperature difference Tc i There is a positive correlation, i.e., Fci = ξTci, where ξ is a correlation constant greater than zero. The labeled data are normalized and their values ​​are taken, as shown in the formula:

[0082]

[0083] Wherein, WDXN is the temperature performance value, t1 and t2 represent different proportional coefficients and are both greater than zero, α is the dynamic temperature correction factor, and its value can be the thrust coefficient of the heat sink 202, i.e. the thrust coefficient of the fan. Its value can be found from the thrust coefficient fitting curve given by the fan manufacturer, and β∈(0,1) is used as the fitting correction coefficient.

[0084] By setting the rotation angle of the adjusting blade 2043 to Θ1 and the rotation angle of the diffuser blade 3081 to Θ2, and by pre-recording the WDXN corresponding to Θ1 and Θ2 in the range of (0,2π) under the safe temperature T1 and overclocking temperature T2 conditions, respectively, and establishing a preset correspondence table of Θ1, Θ2 and WDXN, the synergy of the angle turning set, the cooling temperature set and the wind speed set is realized.

[0085] When the corresponding components 30151 inside the housing unit 2 are all at a safe temperature T1, the control module searches the preset correspondence table of Θ1, Θ2 and WDXN, so that the rotation angle Θ1 of the adjusting blade 2043 and the rotation angle Θ2 of the diffuser blade 3081 are controlled to form corresponding angles and complete the circulating air duct. At this time, the air supply module controls the heat sink 202 to be at low power, so that the value of WDXN tends to be stable, and a U-shaped air duct is formed between the coplanar fixed adjusting units 3 separated by the partition plate 205: the air blown out from the heat sink 202, passes through the coplanar fixed adjusting units 3 and is discharged through the heat dissipation holes of the top plate 105, thereby realizing the efficient use of energy and meeting the daily cooling of the heterogeneous computer.

[0086] When the corresponding components 30151 inside the housing unit 2 are all at the overclocking temperature T2, the heat sink 202 operates at high power. The control module searches the preset correspondence table of Θ1, Θ2 and WDXN, so that the diffuser 3081 adjacent to the bottom of the overclocked corresponding component 30151 or the adjustment 2043 adjacent to the bottom fixed adjustment unit 3 forms a preset angle to generate a rotation section 309. This allows the hot air from the adjacent diffuser 3081 to be intercepted and rotated in advance and discharged from the heat dissipation holes on the surface of the top plate 105, thereby reducing the heat interference of the rotating air duct to the adjacent fixed adjustment unit 3 below. The early rotation of the hot air can improve the heat dissipation efficiency. Furthermore, through the combination of WDXN and Θ1, Θ2 settings, the individual overclocked corresponding components 30151 inside the coplanar fixed adjustment unit 3 can be processed independently, thereby improving the heat dissipation processing efficiency of heterogeneous computing components, facilitating the optimization of the air duct, and maintaining the stability of heterogeneous computing power.

[0087] Furthermore, the corresponding prompting module records alarm logs at different levels based on the different primary and secondary temperature performance values.

[0088] Example 2

[0089] Reference Figure 6-14 This embodiment differs from the first embodiment in that it provides a computing device for use in heterogeneous computing systems designed for high-performance computing, comprising:

[0090] System cabinet unit 1;

[0091] The housing unit 2, used to house the combined heterogeneous CPU and FPGA, is located inside the system cabinet unit 1.

[0092] Fixed adjustment unit 3; The fixed adjustment unit 3, used to fix the CPU and FPGA and adjust the wind speed and angle, is disposed inside the housing unit 2;

[0093] The fixed adjustment unit 3 includes a support plate 3012 and a circuit board 3015. The circuit board 3015 is movably mounted on the top side of the support plate 3012. The support plate 3012 is connected to the synchronous plate 305 via a rotating screw 304. A clamping arm 306 is mounted on the side of the synchronous plate 305. A moving block 3073 is linkedly arranged on the side of the synchronous plate 305. A cooling adjustment diffusion assembly 308 is mounted on the side of the moving block 3073. A diffusion blade 3081 for adjusting heat dissipation is rotatably arranged on the top of the diffusion assembly 308.

[0094] Furthermore, the system cabinet unit 1 includes support legs 101 and cabinet body 102. Support legs 101 are installed at the bottom of the cabinet body 102. Sliding doors 103 are movably provided on both the left and right sides of the cabinet body 102. The sliding doors 103 are movably connected to the cabinet body 102 through sliding door tracks 104. A top plate 105 is provided on the top of the cabinet body 102. Heat dissipation holes are evenly opened on the surface of the top plate 105. Two sets of mounting grooves 106 are horizontally opened on the surface of the top plate 105. A locking block 1061 is arranged longitudinally inside the mounting groove 106.

[0095] The accommodating chamber unit 2 includes a mounting column 201, which is installed on the bottom side of the top surface inside the accommodating chamber unit 2. It should be noted that the mounting column 201 is installed at the bottom of the locking block 1061. A heat sink 202 is movably installed on the bottom surface of the mounting column 201. The heat sink 202 is preferably an oscillating fan. Several sets of limiting plates 203 are evenly distributed inside the accommodating chamber unit 2. A fixing adjustment unit 3 is snapped into the inside of the limiting plate 203. A bottom adjustment component 204 is installed on the side of the limiting plate 203.

[0096] The bottom adjustment assembly 204 includes a support frame 2041, a linkage 2042, adjustment blades 2043, and an adjustment drive 2044. The support frame 2041 is located on the bottom surface inside the housing unit 2. The top surface of the support frame 2041 is provided with the linkage 2042, which is preferably composed of a belt and a synchronous pulley. The linkage 2042 is linked to the adjustment drive 2044 and several sets of adjustment blades 2043. The adjustment drive 2044 is preferably a servo motor that can rotate in both directions. A partition plate 205 is installed in the middle of each pair of limiting plates 203. The partition plate 205 is installed inside the housing unit 2. Wire-passing blocks 206 are provided on the left and right sides of the partition plate 205. Wire-passing grooves 2061 are provided through the surface of the wire-passing blocks 206. It should be noted that the partition plate 205 is used to reduce the wake effect of multiple fans. Cooling measuring devices 3088 for monitoring wind speed and temperature are also installed on the side of the support frame 2041.

[0097] The housing unit 2 is equipped with multiple fixed adjustment units 3, which are sequentially inserted into the limiting plate 203, thus facilitating the assembly of the multiple fixed adjustment units 3. The cooperation between the limiting plate 3013 and the card slot plate 3014 enables the rapid heterogeneous combination of different types of CPU or FPGA circuit boards 3015. The fixed adjustment units 3, which are distributed vertically inside the housing unit 2, can be rotated under the control of the corresponding system by rotating the angle of the diffuser blades 3081 of the fixed adjustment units 3 and the angle of the adjustment blades 2043 inside the bottom adjustment component 204. This completes the circulation and cooling of the air blown out of the heat sink 202 inside the housing unit 2, and timely adjusts the rotation angle of the diffuser blades 3081 inside the upper and lower fixed adjustment units 3. This increases the return airflow of the air duct, similar to the rotary section 309, while circulating the heat sink. This improves the heat dissipation of the circuit board 3015 and the corresponding component 30151, and optimizes the heat dissipation air duct. This improves both energy efficiency and heat dissipation, thereby improving the computing power of heterogeneous computing in overclocking or daily use, and reducing the decline in high-performance computing power caused by heat dissipation problems.

[0098] Example 3

[0099] Reference Figure 15-20 This embodiment differs from the above embodiments in that:

[0100] Specifically, the fixed adjustment unit 3 includes a movable groove 301, which is disposed on its surface along the length side of the fixed adjustment unit 3. The movable groove 301 is slidably connected to the support plate 3012 via a movable sliding leg 3011. A bottom toothed plate 30121 is disposed at the bottom of the forward side of the support plate 3012. The bottom toothed plate 30121 is driven by meshing with a mating part 3041 and a rotating screw 304. The outer side of the rotating screw 304 is rotatably disposed on the inner side of the side frame plate 3042. A central support member 3043 is sleeved on the outer side of the middle part of the rotating screw 304. The side frame plate 3042 is disposed on the top of the fixed adjustment unit 3. The mating part 3041 is preferably a gear.

[0101] A fastener 3016 is installed on one side of the limiting slot plate 3013. The limiting slot plate 3013 is engaged with the circuit board 3015 through a groove on its side. The circuit board 3015 is movably engaged between the limiting slot plate 3013 and the fastener 3016. A slot plate 3014 is provided on the side of the limiting slot plate 3013. The limiting slot plate 3013 is engaged with the corresponding part 30151 on the top surface of the circuit board 3015 through the slot plate 3014. The corresponding part 30151 is preferably a CPU or FPGA. A positioning block 302 that cooperates with the fastener 3016 is provided at the bottom of the support plate 3012. The surface of the positioning block 302 is evenly distributed with threaded holes that are threaded to the fastener 3016.

[0102] Furthermore, the fixing and adjusting unit 3 also includes a wire frame assembly 303. The wire frame assembly 303 is installed on the side of the positioning block 302. The wire frame assembly 303 is disposed on the top of the fixing and adjusting unit 3. The side of the wire frame assembly 303 is provided with a wire bundling hole 3031. The top of the wire frame assembly 303 is provided with a wire storage groove 3032. The bottom end of the top of the wire frame assembly 303 is provided with a side plate 3033. The inner side of the side plate 3033 is provided with a bottom protrusion 3034. The bottom protrusion 3034 is an arc-shaped block that gradually increases in elevation from the left and right sides towards the center.

[0103] Synchronizing plates 305 are symmetrically arranged on the left and right sides of the rotating screw 304. The synchronizing plates 305 are rotatably connected to the rotating screw 304 via synchronizing sleeves 3051. The rotating screw 304 is preferably a positive and negative threaded screw. The left and right synchronizing sleeves 3051 are nuts that cooperate with the positive and negative threaded screws. That is, when the bottom toothed plate 30121 moves forward and drives the rotating screw 304 to rotate clockwise, the left and right synchronizing sleeves 3051 move inward and opposite to each other. Conversely, when the bottom toothed plate 30121 moves forward and drives the rotating screw 304 to rotate clockwise, the left and right synchronizing sleeves 3051 move inward and opposite to each other. 21. Reverse, the left and right synchronous sleeves 3051 move in opposite directions. The middle support 3043 is slidably connected to the synchronous plate 305 via the auxiliary rod 3052. The top of the synchronous plate 305 is equipped with a clamping arm 306. The side of the synchronous plate 305 away from the positioning block 302 is movably connected to a connecting rod 3053. The connecting rod 3053 is composed of a folding rod and a short rod. The middle part of the folding rod inside the connecting rod 3053 is fixedly connected to the side of the inner groove plate 3071.

[0104] Specifically, the clamping arm 306 includes a trigger wheel 3061, which is movably fitted to the bottom of the bottom protrusion 3034. A connecting plate frame 3062 is installed at the bottom of the trigger wheel 3061. The connecting plate frame 3062 is movably connected to the clamping arm 306 and the dynamic pressure plate 3063. An elastic element 3065 is provided between the clamping arm 306 and the dynamic pressure plate 3063. The elastic element 3065 is preferably a spring. A stabilizing plate 3064 is provided at the bottom of the dynamic pressure plate 3063. The bottom of the stabilizing plate 3064 is elastically connected to the clamping arm 306 through the elastic element 3065. The top surface of the stabilizing plate 3064 and the bottom surface of the inner groove of the limiting groove plate 3013 are coplanar. The distance between the stabilizing plate 3064 and the dynamic pressure plate 3063 is greater than the height of the inner groove of the limiting groove plate 3013.

[0105] The synchronization plate 305 is slidably connected to the trigger slider 307 via the connecting rod 3053. The trigger slider 307 is slidably disposed inside the inner groove plate 3071. The trigger slider 307 is movably connected to the moving block 3073 via the inclined rod 3072. The moving block 3073 is symmetrically provided with the inclined rods 3072 on its left and right sides. The moving block 3073 is slidably connected to the inner groove plate 3071 via the guide rod 3074. The moving block 3073 is connected to the central through plate 30751 on its inner side via the extension rod 3075. The bottom of the central through plate 30751 is movably provided with a central support member 3043.

[0106] Specifically, the diffusion assembly 308 includes diffusion blades 3081. A plurality of diffusion blades 3081 are rotatably disposed on the top surface of the diffusion assembly 308. The diffusion blades 3081 are rotatably connected by a diffusion linkage 3082 and a diffusion adjustment component 3084. The diffusion linkage 3082 is preferably composed of a belt and a synchronous pulley. The diffusion adjustment component 3084 is preferably a servo motor capable of forward and reverse rotation. A protective shell 3083 is sleeved on the outer side of the diffusion linkage 3082 and the diffusion adjustment component 3084.

[0107] The bottom of the diffuser assembly 308 is provided with a bottom contact block 3085. A heat transfer cavity 3086 is provided inside the diffuser assembly 308, the diffuser blade 3081, and the bottom contact block 3085. The extension rod 3075 is inserted into the side connecting block 3087 at the bottom of the diffuser assembly 308. A body measuring component 3089 is installed on the side of the side connecting block 3087. The body measuring component 3089 is preferably a temperature sensor. A cooling measuring component 3088 is installed on the side of the top diffuser blade 3081 of the diffuser assembly 308. The cooling measuring component 3088 is preferably composed of a wind speed measuring sensor and a temperature sensor. An angle sensor is installed on the top of both the diffuser blade 3081 and the adjusting blade 2043.

[0108] When the customer needs to install the circuit board 3015, the circuit board 3015 is inserted into the inside of the limiting slot plate 3013, and the corresponding part 30151 is snapped into the slot plate 3014 to complete the positioning. The fastener 3016 initially fixes the circuit board 3015 to the top surface of the support plate 3012. After the initial fixation is completed, by pushing the support plate 3012 forward, the bottom tooth plate 30121 at the front end of the support plate 3012 moves, driving the mating part 3041 and the rotating screw 3. 04. Rotation causes the rotating screw 304 to drive the left and right synchronous plates 305 to move inward. The screw stops when the bearing plate 3012 moves to the outer side of the clamping arm 306. At this point, the left and right clamping arms 306 clamp and fix the left and right sides of the circuit board 3015, thus initially completing the self-locking fixation of the left and right sides of the circuit board 3015. When the clamping arm 306 moves inward, the trigger wheel 3061 at the top of the clamping arm 306 will be triggered by the wire frame assembly 303. Pulled by the bottom protrusion 3034, the trigger wheel 3061 drives the dynamic pressure plate 3063 to move downward. When the circuit board 3015 stops pushing, the dynamic pressure plate 3063 and the stabilizing plate 3064 at the bottom of the trigger wheel 3061 complete the elastic clamping and self-locking fixation of the circuit board 3015. After the self-locking is completed, the fastener 3016 is inserted into the positioning block 302 by continuing to rotate to complete the self-locking fixation of the circuit board 3015, thereby improving the protection of the circuit board 3015. The elastic self-locking on the side of the circuit board 3015 can reduce the resonance damage to the circuit board 3015 caused by external movement vibration. The above-mentioned integrated self-locking fixation simplifies the user's fixation of the circuit board 3015 by multiple screws while self-locking and protecting the circuit board 3015, thereby reducing the cumbersome operation of fixing the circuit board 3015. The installation and fixation of multiple positioning screws is simplified to a single screw fixation, and self-locking protection is performed while fixing a single screw.

[0109] When the rotating screw 304 drives the synchronous plate 305 to move inward, the synchronous plate 305 will drive the connecting rod 3053 and the trigger slider 307 to move outward. As the trigger slider 307 moves inside the inner groove plate 3071, the trigger slider 307 drives the moving block 3073 to move downward along the guide rod 3074 via the inclined rod 3072. This causes the guide rod 3074 to drive the bottom contact block 3085 at the front end of the extension rod 3075 to contact the surface of the corresponding part 30151. The heat inside the corresponding part 30151 is conducted by the copper bottom contact block 3085 to the diffusion assembly 308 and the diffusion leaf 3081 of the same material. Thus, when the circuit board 3015 is self-locked, the diffusion assembly 308 completes the fixation and heat dissipation of the corresponding part 30151, thereby improving the installation convenience of the diffusion assembly 308 with heat dissipation and heat transfer functions.

[0110] To increase the accuracy of the mating between the corresponding part 30151 and the bottom contact block 3085, the diffuser assembly 308 can be adjusted on the surface of the extension rod 3075 with the cooperation of the side connecting block 3087, thereby increasing the accuracy of the mating between the corresponding part 30151 and the bottom contact block 3085. In addition, making the bottom area of ​​the bottom contact block 3085 larger than the area of ​​the corresponding part 30151 can also increase the accuracy of the mating between the corresponding part 30151 and the bottom contact block 3085. The heat transfer cavity 3086 inside the diffuser assembly 308 and the diffuser blade 3081 can transfer the heat of the bottom contact block 3085 to the interior of the heat transfer cavity 3086. The large area heat dissipation of the planar diffuser assembly 308 and the rotatable diffuser blade 3081 improves the cooling of the transferred heat, thereby improving the heat dissipation capacity of the corresponding part 30151.

[0111] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0112] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the invention as currently considered, or those features that are not relevant to implementing the invention) may be omitted.

[0113] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0114] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A heterogeneous computing system for high-performance computing, comprising: The air supply module, the body temperature module, the wind speed cooling module, and the angle module are characterized in that, Within a preset time period, the temperature of the CPU or FPGA is collected and preprocessed by the body temperature module to obtain body temperature processing data; by collecting the angle value data of the angle module under the control of the rotation adjustment module, the temperature data reaching the cooling monitoring module and the wind speed data reaching the wind speed monitoring module are collected from the wind speed cooling module, thereby forming an angle turning set, a cooling temperature set and a wind speed set. Based on the received temperature processing data, the control module performs joint calculations on the data within the cooling temperature set and the wind speed set to obtain temperature performance values. These values ​​are then compared with preset performance temperature ranges to obtain primary temperature performance values, secondary temperature performance values, and temperature performance sets for the first and second angle adjustment commands. This enables the monitoring, analysis, and adjustment of the overall heat dissipation performance of the heterogeneous computing system. The primary temperature performance value corresponds to the non-full-load operation of the heterogeneous computing system, while the secondary temperature performance value represents the overclocked operation of the heterogeneous computing system. Adjustments are made based on the body temperature data, cooling temperature data, and wind speed data, so that the air supply volume of the air supply module and the adjustment amount of the angle module are adjusted according to the temperature performance values ​​of different levels within a preset time period, thereby achieving dynamic stability of the computing power of the heterogeneous computing system in the adaptive optimization of the heat dissipation duct. When the corresponding components inside the containment chamber unit are all at a safe temperature T1, the rotation angle Θ1 of the adjusting blade and the rotation angle Θ2 of the diffuser blade are controlled to form corresponding angles and complete the circulating air duct, so that a U-shaped air duct is formed between the coplanar fixed adjusting units separated by the partition plate: the air blown out from the heat sink, passes through the coplanar fixed adjusting units, and is discharged through the heat sink holes of the top plate. When the corresponding components inside the housing unit are all at the overclocking temperature T2, the heat sink operates at high power. The control module searches the preset correspondence table of Θ1, Θ2 and temperature performance values, so that the diffuser blades adjacent to the bottom of the overclocked corresponding component or the adjustment blades adjacent to the bottom fixed adjustment unit form a preset angle to generate a rotation section. This causes the hot air from the adjacent diffuser blades to be intercepted and rotated in advance and discharged from the heat dissipation holes on the surface of the top plate, thereby reducing the heat interference of the rotating air duct to the adjacent fixed adjustment unit below.

2. The heterogeneous computing system for high-performance computing as described in claim 1, characterized in that: By collecting and processing the temperature and wind speed passing through the fixed adjustment unit (3), the collected and processed information of temperature and wind speed corresponding to the angle adjustment is obtained.

3. The heterogeneous computing system for high-performance computing as described in claim 2, characterized in that: The specific information collected and processed by the angle adjustment on temperature and wind speed includes: acquiring and marking the real-time temperature and real-time wind speed passed by two adjacent fixed adjustment units (3), normalizing the marked data and calculating the temperature performance coefficient, combining the marked data with the temperature performance coefficient to form temperature performance information, and forming the temperature performance information corresponding to the angle adjustment.

4. The heterogeneous computing system for high-performance computing as described in claim 1, characterized in that: The corresponding prompting module records alarm logs at different levels based on the different primary and secondary temperature performance values.

5. A computing device employing a heterogeneous computing system for high-performance computing as described in any one of claims 1-4, characterized in that, include: System cabinet unit (1); Container unit (2); The housing unit (2) for accommodating the combined heterogeneous CPU and FPGA is located inside the system cabinet unit (1); Fixed adjustment unit (3); The fixed adjustment unit (3) for fixing the CPU and FPGA and adjusting the wind speed and angle is disposed inside the housing unit (2); The fixed adjustment unit (3) includes a support plate (3012) and a circuit board (3015). The circuit board (3015) is movably mounted on the top side of the support plate (3012). The support plate (3012) is connected to the synchronous plate (305) via a rotating screw (304). A clamping arm (306) is installed on the side of the synchronous plate (305). A moving block (3073) is linked to the side of the synchronous plate (305). A cooling adjustment diffusion assembly (308) is installed on the side of the moving block (3073). A diffusion blade (3081) for adjusting heat dissipation is rotatably provided on the top of the diffusion assembly (308).

6. The computing device as claimed in claim 5, characterized in that: The accommodating chamber unit (2) includes a mounting column (201), which is installed on the bottom side of the top surface inside the accommodating chamber unit (2). A heat sink (202) is movably installed on the bottom surface of the mounting column (201). Several sets of limiting plates (203) are evenly distributed inside the accommodating chamber unit (2). A fixing adjustment unit (3) is snapped into the inside of the limiting plate (203). A bottom adjustment component (204) is installed on the side of the limiting plate (203). The bottom adjustment assembly (204) includes a support frame (2041), a linkage (2042), an adjustment blade (2043), and an adjustment drive (2044). The support frame (2041) is located on the bottom surface inside the accommodating chamber unit (2). The top surface of the support frame (2041) is provided with a linkage (2042). The linkage (2042) is linked to the adjustment drive (2044) and several sets of adjustment blades (2043). A partition plate (205) is installed in the middle of each pair of limiting plates (203). Threading blocks (206) are provided on the left and right sides of the partition plate (205). Threading grooves (2061) are provided through the surface of the threading blocks (206).

7. The computing device as claimed in claim 6, characterized in that: The fixed adjustment unit (3) includes a movable groove (301), which is disposed on its surface along the length side of the fixed adjustment unit (3). The movable groove (301) is slidably connected to the support plate (3012) via a movable sliding leg (3011). A bottom tooth plate (30121) is provided at the bottom of the forward side of the support plate (3012). The bottom tooth plate (30121) is meshed and driven by a mating part (3041) and a rotating screw (304). The outer side of the rotating screw (304) is rotatably disposed on the inner side of the side frame plate (3042). A middle support member (3043) is sleeved on the outer side of the middle part of the rotating screw (304). A fastener (3016) is installed on one side of the limiting groove plate (3013). The limiting groove plate (3013) is engaged with the circuit board (3015) through the groove on its side. The circuit board (3015) is movably engaged between the limiting groove plate (3013) and the fastener (3016). A slot plate (3014) is provided on the side of the limiting groove plate (3013). The limiting groove plate (3013) is engaged with the corresponding part (30151) on the top surface of the circuit board (3015) through the slot plate (3014). A positioning block (302) that cooperates with the fastener (3016) is provided at the bottom of the bearing plate (3012).

8. The computing device as claimed in claim 7, characterized in that: The fixed adjustment unit (3) further includes a wire frame assembly (303). The wire frame assembly (303) is installed on the side of the positioning block (302). The wire frame assembly (303) has a wire bundling hole (3031) on its side. The top of the wire frame assembly (303) has a wire storage groove (3032). The bottom of the top of the wire frame assembly (303) has a side plate (3033). The inner side of the side plate (3033) has a bottom protrusion (3034). Synchronous plates (305) are symmetrically arranged on the left and right sides of the rotating screw (304). The synchronous plates (305) are rotatably connected to the rotating screw (304) through synchronous sleeves (3051). The middle support (3043) is slidably connected to the synchronous plates (305) through auxiliary rods (3052). A clamping arm (306) is installed on the top of the synchronous plates (305). A connecting rod (3053) is movably connected to the side of the synchronous plates (305) away from the positioning block (302).

9. The computing device as claimed in claim 8, characterized in that: The clamping boom (306) includes a trigger wheel (3061), which is movably fitted to the bottom of the bottom protrusion (3034). A connecting plate frame (3062) is installed at the bottom of the trigger wheel (3061). The connecting plate frame (3062) is movably connected to the clamping boom (306) and the dynamic pressure plate (3063). An elastic element (3065) is provided between the clamping boom (306) and the dynamic pressure plate (3063). A stabilizing plate (3064) is provided at the bottom of the dynamic pressure plate (3063). The bottom of the stabilizing plate (3064) is elastically connected to the clamping boom (306) through the elastic element (3065). The synchronization plate (305) is slidably connected to the trigger slider (307) via a connecting rod (3053). The trigger slider (307) is slidably disposed inside the inner groove plate (3071). The trigger slider (307) is movably connected to the moving block (3073) via a diagonal rod (3072). The moving block (3073) is slidably connected to the inner groove plate (3071) via a guide rod (3074). The moving block (3073) is connected to the central through plate (30751) on its inner side via an extension rod (3075). A central support member (3043) is movably disposed at the bottom of the central through plate (30751).

10. The computing device as claimed in claim 9, characterized in that: The diffusion assembly (308) includes diffusion blades (3081). A plurality of diffusion blades (3081) are rotatably disposed on the top surface of the diffusion assembly (308). The diffusion blades (3081) are rotatably connected by diffusion linkage (3082) and diffusion adjustment (3084). A protective shell (3083) is sleeved on the outer side of the diffusion linkage (3082) and diffusion adjustment (3084). The bottom of the diffusion assembly (308) is provided with a bottom contact block (3085). The diffusion assembly (308), the diffusion blade (3081), and the bottom contact block (3085) are internally connected to a heat transfer cavity (3086). The extension rod (3075) is inserted into the side connecting block (3087) at the bottom of the diffusion assembly (308). A cooling measuring element (3088) is installed on the side of the top diffusion blade (3081) of the diffusion assembly (308).

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