Die cutting process for composite tapes, and light emitting module and electronic device

Abstract

The application provides a punching process for a composite strip, and a light-emitting module and an electronic device. The composite strip comprises a circuit board and a glue layer covering the circuit board. The punching process comprises the following steps: providing the composite strip and laying the composite strip on a cutting table; cutting the composite strip at a preset cutting position from a side of the glue layer away from the circuit board, and the cutting depth extends at least to a part of the thickness of the glue layer; and punching the target strip of the composite strip in a surrounding area of the preset cutting position from the side of the glue layer away from the circuit board until the target strip falls off from the composite strip. When the punching process is applied to the punching of the composite strip comprising a plurality of light-emitting modules, the phenomenon of the glue layer of the manufactured light-emitting module being convex can be reduced or even avoided, the delicacy of the light-emitting module is improved, and the problem of light leakage of the light-emitting module during light emission is avoided.

Description

Technical Field

[0001] This invention belongs to the field of punching processing technology, and particularly relates to a punching process for composite strips, a light-emitting module made using the punching process, and an electronic device including the light-emitting module. Background Technology

[0002] Existing LED strip products all include at least a circuit board encapsulating several light-emitting chips and a phosphor layer covering the chips, forming a composite material layer structure. In related technologies, LED strip products with composite material layer structures are primarily produced using a stamping process. Specifically, a strip containing multiple LED strip products is stamped to detach individual products from the strip, completing the product cutting process. However, due to the elasticity of the phosphor layer, it bulges outwards under the stamping pressure, reducing the product's precision and causing severe light leakage during illumination. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention provides a punching process for composite materials and a light-emitting module. The light-emitting module is manufactured using the punching process, which can reduce or even avoid the phenomenon of outward bulging of the adhesive layer in the light-emitting module, thereby improving the appearance refinement of the light-emitting module and avoiding the problem of light leakage when the light-emitting module emits light.

[0004] To achieve the above objectives, in a first aspect, the present invention provides a punching process for a composite strip, the composite strip comprising a circuit board and an adhesive layer covering the circuit board, the punching process comprising:

[0005] Provide the composite strip and lay it flat on the cutting table;

[0006] The composite strip is cut at a predetermined cutting point from the side of the adhesive layer away from the circuit board, the cutting depth being less than the thickness of the composite strip and extending at least into a portion of the thickness of the adhesive layer; and

[0007] From the side of the adhesive layer away from the circuit board, the target strip of the composite strip located within the area surrounded by the preset cut is stamped until the target strip falls off the composite strip.

[0008] In one embodiment, the composite tape further includes a film covering the adhesive layer, and the step of cutting the composite tape at a predetermined cutting point includes:

[0009] The composite strip is cut from the side of the diaphragm away from the adhesive layer at the preset cut point until the diaphragm is cut off along the thickness direction and the adhesive layer is cut off at least partially along the thickness direction.

[0010] In one embodiment, the preset cutting point includes two cutting lines that are parallel and spaced apart along a first direction. Each cutting line extends from one side of the composite strip to the other side along a second direction. The portion of the composite strip located between the two cutting lines is the target strip. The first direction and the second direction are not parallel.

[0011] The step of cutting the composite strip at the preset cutting point includes using a cutting die to mechanically cut the composite strip at both cutting lines simultaneously.

[0012] In one embodiment, the cutting die includes a pair of blades, each blade having a cutting edge angle of 20 to 25 degrees.

[0013] In one embodiment, the circuit board includes a substrate and conductive lines embedded in the substrate, the hardness of each blade is less than the hardness of the conductive line, and the cutting depth of the mechanical cutting is less than the distance between the surface of the composite strip away from the circuit board and the conductive line.

[0014] In one embodiment, the circuit board includes a substrate and conductive lines embedded in the substrate, the hardness of each blade is less than the hardness of the substrate, and the cutting depth of the mechanical cutting is less than the distance between the surface of the composite strip away from the circuit board and the substrate.

[0015] Secondly, the present invention provides a light-emitting module, wherein the light-emitting module is made of a composite strip comprising a plurality of the light-emitting modules using the punching process described in any of the above embodiments;

[0016] The composite strip includes a circuit board encapsulating multiple light-emitting chips and a light conversion dielectric layer disposed on the circuit board. The light conversion dielectric layer is used to cover the multiple light-emitting chips. Each portion of the strip containing the light-emitting module is a target strip. The multiple light-emitting chips are located within multiple target strips, and each target strip includes at least one light-emitting chip.

[0017] In one embodiment, the composite strip further includes a film covering the light conversion adhesive layer. After the composite strip is cut at a preset cutting point and stamped, each of the light-emitting modules also includes the film covering the light conversion adhesive layer.

[0018] In one embodiment, the diaphragm includes a diaphragm body and a decorative layer disposed on the surface of the diaphragm body away from the light conversion adhesive layer, the decorative layer including a textured layer and / or an ink layer;

[0019] The textured layer is transparent or semi-transparent, and the ink layer includes a semi-transparent colored ink layer and / or a uniform gloss ink layer;

[0020] When the light-emitting chip is not emitting light, the texture layer enables the film to present at least one of the following appearance effects: pattern effect, dazzling effect, matte effect, and color-changing effect; the semi-transparent colored ink layer enables the film to present the same color as the semi-transparent colored ink layer.

[0021] When the light-emitting chip emits light, the homogenizing ink layer can uniformly disperse the light passing through it.

[0022] Thirdly, the present invention provides an electronic device, including a housing and a display panel disposed on the housing, the display panel including a display screen and a light-emitting module as described in any of the above embodiments, the light-emitting module being disposed on the non-display side of the display screen;

[0023] And / or, the housing has a transparent area, and the light-emitting module is provided on the inner side of the housing, and the light-emitting module is visualized on the housing through the transparent area.

[0024] Compared with the prior art, the present invention has the following advantages: In the punching process provided by the present invention, the composite strip is first cut so that the adhesive layer is cut into at least a portion of its thickness, and then the cut composite strip is punched until the target strip falls off. This means that at most a portion of the adhesive layer in the composite strip needs to break under the extrusion action, which is equivalent to reducing the thickness of the adhesive layer that breaks under the extrusion action. Moreover, as the depth of the adhesive layer cut into increases, the thickness of the adhesive layer that breaks under the extrusion action is reduced more, thereby helping to reduce or even avoid the phenomenon of the adhesive layer bulging outward under the extrusion action, and improving the appearance refinement of the target strip obtained by punching.

[0025] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This is a flowchart of the punching process for composite strips provided in an embodiment of the present invention.

[0028] Figure 2 yes Figure 1 The diagram shows the corresponding step S11.

[0029] Figure 3 yes Figure 2 Top view of the composite strip shown.

[0030] Figure 4 yes Figure 1 The diagram shows the corresponding step S12.

[0031] Figure 5 yes Figure 4 An enlarged schematic diagram of part V shown.

[0032] Figure 6 yes Figure 1 The diagram shows the corresponding step S13.

[0033] Figure 7 This is a cross-sectional structural diagram of the light-emitting module provided in an embodiment of the present invention.

[0034] Figure 8 yes Figure 7 The diagram shows a cross-sectional view of the diaphragm.

[0035] Figure 9 This is a three-dimensional structural diagram of the electronic device provided in an embodiment of the present invention.

[0036] Figure 10 yes Figure 9 The diagram shows a cross-sectional view of the display panel.

[0037] Figure 11 yes Figure 9 A three-dimensional structural diagram of the electronic device shown from another perspective.

[0038] Explanation of key component symbols:

[0039] Composite strip 1

[0040] Cutting table 2

[0041] Shape cutting die 3

[0042] punch 4

[0043] Die 5

[0044] Circuit board 20

[0045] LED chip 30

[0046] gelatinous layer 40

[0047] 60 membranes

[0048] 61 diaphragm body

[0049] Semi-transparent colored ink layer 63

[0050] Uniform ink layer 65

[0051] First texture layer 67

[0052] Second texture layer 69

[0053] Microstructure 692

[0054] Brightening film 694

[0055] Wireless charging module 70

[0056] Camera module 90

[0057] 100 light-emitting modules

[0058] Display panel 200

[0059] Casing 300

[0060] Transparent area 310

[0061] Display screen 400

[0062] 1000 electronic devices

[0063] First cutting line C1

[0064] Second cutting line C2

[0065] Target strip D

[0066] First direction X

[0067] Second direction Y

[0068] Cutting edge angle a

[0069] The following detailed description, in conjunction with the accompanying drawings, further illustrates the present invention. Detailed Implementation

[0070] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0071] Please refer to the following: Figures 1 to 6 The present invention provides a punching process for a composite strip 1, the composite strip 1 including a circuit board 20 and an adhesive layer 40 covering the circuit board 20. After punching the composite strip 1 using the punching process provided by the present invention, the phenomenon of the adhesive layer 40 protruding in the punched target strip D can be reduced or even avoided, thereby improving the precision of the target strip D.

[0072] Specifically, such as Figure 1 As shown, the punching process includes steps S11 to S13, and the details of each step will be explained in conjunction with... Figures 2 to 6 This will be described below.

[0073] Step S11, as follows Figure 2 as well as Figure 3 As shown, the composite strip 1 is provided and laid flat on the cutting table 2. Preferably, in an embodiment of the present invention, without hindering the punching of the composite strip 1, the composite strip 1 laid flat on the cutting table 2 can be fixed to the cutting table 2 by means of, but not limited to, clamping, adsorption, binding, etc., to prevent the composite strip 1 from moving relative to the cutting table 2 during the punching process, thereby improving the accuracy of the punching process and the quality after punching. For example, in Figure 3 In the example, the two ends of the composite strip 1 along the first direction X can be clamped and fixed by a pair of fixing clamps (not shown in the figure) fixedly connected to the cutting table 2, so that the composite strip 1 is fixed relative to the cutting table 2.

[0074] Step S12, as follows Figure 4 as well as Figure 5 As shown, the composite strip 1 is cut at a predetermined cutting point from the side of the adhesive layer 40 away from the circuit board 20. The cutting depth is less than the thickness of the composite strip 1 and extends at least into a portion of the thickness of the adhesive layer 40. That is, in the embodiments of the present invention, when cutting the composite strip 1 from the side of the adhesive layer 40 away from the circuit board 20, the adhesive layer 40 can be cut into a portion of its thickness or completely severed, provided that the composite strip 1 is not completely cut off; this is not limited.

[0075] Step S13, as follows Figure 6As shown, from the side of the adhesive layer 40 away from the circuit board 20, the target strip D of the composite strip 1 located within the area surrounded by the preset cutting point is stamped until the target strip D detaches from the composite strip 1. It should be noted that, similar to existing stamping methods, stamping the composite strip 1 requires the aid of a punch 4 and a pair of dies 5. Specifically, in Figure 6 In the example, the pair of dies 5 are disposed on the side of the circuit board 20 away from the adhesive layer 40, and are respectively located on opposite sides of the target strip D. The punch 4 is disposed on the side of the composite strip 1 away from the circuit board 20. By controlling the punch 4 and the pair of dies 5 to move towards each other with sufficient stroke, the composite strip 1 can be stamped, so that the target strip D is separated from the composite strip 1.

[0076] Those skilled in the art will understand that during the stamping process, due to the extrusion action generated by the opposing movement of the punch 4 and the pair of dies 5, the portion of the target strip D connected to the composite strip 1 (i.e., the uncut portion) will sequentially undergo several stages: elastic deformation, plastic deformation, crack formation, crack penetration, and strip fracture. The uncut portion of the target strip D fractures under the extrusion action, thus detaching from the composite strip 1. Since the adhesive layer 40 is elastic, it is prone to bulging outwards when extruded. Therefore, to mitigate the bulging phenomenon of the adhesive layer 40 under extrusion, it is necessary to reduce the thickness of the adhesive layer 40 that fractures under extrusion. In the punching process provided by the present invention, the composite strip 1 is first cut along the thickness direction so that the adhesive layer 40 is cut into at least a portion of the thickness. Then, the cut composite strip 1 is punched until the target strip D falls off. This ensures that at most a portion of the thickness of the adhesive layer 40 in the composite strip 1 needs to break under the extrusion action, which is equivalent to reducing the thickness of the adhesive layer 40 that is broken under the extrusion action. Moreover, as the depth of the adhesive layer 40 cut into increases, the thickness of the adhesive layer 40 that is broken under the extrusion action is reduced more. This helps to reduce or even avoid the phenomenon of the adhesive layer 40 bulging outward under the extrusion action, thereby improving the appearance refinement of the target strip D obtained by punching.

[0077] Please refer to the following again. Figure 3In one embodiment of the present invention, the preset cutting point includes two cutting lines (denoted as the first cutting line C1 and the second cutting line C2) that are parallel and spaced apart along a first direction X. Each cutting line extends from one side of the composite strip 1 to the other side along a second direction Y. The portion of the composite strip 1 located between the two cutting lines is the target strip D to be obtained by punching. The first direction X and the second direction Y are not parallel. Specifically, in Figure 3 In the example, the composite strip 1 includes a plurality of preset cuts spaced apart along the first direction X, and each preset cut includes a cut line extending along a second direction Y perpendicular to the first direction X. It is understood that, in Figure 3 In the example, the composite strip 1 includes the preset cutting point, that is, multiple target strips D can be obtained by punching, which can improve the utilization rate of the composite strip 1.

[0078] Furthermore, please refer again. Figure 4 In some embodiments of the present invention, the step S12 of cutting the composite strip 1 at a preset cutting point includes: simultaneously mechanically cutting the composite strip 1 at the two cutting lines (i.e., the first cutting line C1 and the second cutting line C2) using a cutting die 3. In this embodiment, by simultaneously mechanically cutting the composite strip 1 at the first cutting line C1 and the second cutting line C2, it can be ensured that the target strip D is subjected to balanced forces on both sides along the first direction X, making the processing morphology of the two opposite processing surfaces of the target strip D obtained by punching nearly identical, which is beneficial to improving the aesthetic appearance of the target strip D.

[0079] The cutting die 3 can be made of materials such as aluminum, aluminum alloy, and stainless steel.

[0080] Among them, such as Figure 4 and Figure 5As shown, in one embodiment of the present invention, the cutting die 3 includes a pair of blades, each blade including a straight cutting surface facing the other blade and a beveled cutting surface facing away from the other blade, with a cutting edge angle α between the straight cutting surface and the beveled cutting surface. It is understood that if the cutting edge angle α is too small, although the blade is sharp enough, it is relatively thin and has low strength, making it prone to damage; if the cutting edge angle α is too large, although the blade has sufficient strength, its sharpness is reduced, making it difficult to cut the composite strip 1. Furthermore, the composite strip 1 will exert significant resistance on the beveled cutting surface, further hindering the cutting of the composite strip 1. Therefore, the cutting edge angle α should be set within a reasonable range. Specifically, in an embodiment of the present invention, the cutting edge angle α is preferably 20 to 25 degrees, more preferably 25 degrees, to ensure that the blade can smoothly cut the composite strip 1 while maintaining sufficient structural strength.

[0081] Of course, in other embodiments, the cutting die 3 can also be a die with other structures, as long as it can mechanically cut the composite strip 1 at both cutting lines at the same time.

[0082] It should be noted that, in the embodiments of the present invention, the circuit board 20 includes a substrate and conductive lines embedded in the substrate. The material of the substrate may be, but is not limited to, polyimide, and the material of the conductive lines may be, but is not limited to, wire.

[0083] Optionally, in some embodiments, the hardness of each blade is less than the hardness of the conductive wire, and the cutting depth of the forming die 3 during mechanical cutting is less than the distance between the surface of the composite strip 1 away from the circuit board 20 and the conductive wire. That is, the blade of the forming die 3 will not cut into the conductive wire in the circuit board 20, thereby avoiding chipping of the blade during cutting and improving the service life of the forming die 3. In this embodiment, the blade does not need to cut into the conductive wire in the circuit board 20, which means that the forming die 3 can cut through the adhesive layer 40 during mechanical cutting, thereby completely avoiding the phenomenon of the adhesive layer 40 bulging outward under the extrusion, so that the target strip D obtained by punching has the best appearance refinement.

[0084] Optionally, in other embodiments, the hardness of each cutting edge is less than the hardness of the substrate, and the cutting depth of the forming die 3 during mechanical cutting is less than the distance between the surface of the composite strip 1 away from the circuit board 20 and the substrate. That is, the cutting edge of the forming die 3 will not cut into the substrate in the circuit board 20, which can also avoid chipping of the cutting edge during cutting and improve the service life of the forming die 3. In this embodiment, the cutting edge does not need to cut into the substrate in the circuit board 20, which means that the forming die 3 cannot reach the circuit board 20 during mechanical cutting. Therefore, it can only partially cut into the adhesive layer 40 along the thickness direction, thereby reducing the phenomenon of the adhesive layer 40 bulging outward under the extrusion action and improving the appearance refinement of the target strip D.

[0085] Please refer to it again. Figure 2 In one embodiment of the present invention, the composite tape 1 further includes a film 60 covering the adhesive layer 40, and the cutting of the composite tape 1 at the preset cutting point includes: cutting the composite tape 1 from the side surface of the film 60 away from the adhesive layer 40 at the preset cutting point until the film 60 is cut off in the thickness direction, and the adhesive layer 40 is cut at least partially in the thickness direction.

[0086] As is known to those skilled in the art, when the composite strip 1 with the diaphragm 60 is directly obtained by stamping, the diaphragm 60 is prone to burrs during the extrusion and breakage process. The direction of the burrs is opposite to the stamping direction. That is to say, in the target strip D obtained by direct stamping, the edge of the diaphragm 60 on the side surface away from the adhesive layer 40 will form outward-extending burrs, which will not only affect the appearance and refinement of the target strip D, but also easily injure the personnel picking up the target strip D. In contrast, in this embodiment, the diaphragm 60 in the composite tape 1 is cut off entirely. Since the blade of the aforementioned cutting die 3 is relatively sharp and the cutting is performed along the direction of the diaphragm 60 toward the adhesive layer 40, burrs are not easily generated on the cut surface of the diaphragm 60, or only burrs extending toward the adhesive layer 40 are generated. Burrs are not formed on the edge of the side surface of the diaphragm 60 away from the adhesive layer 40, thereby improving the appearance of the target tape D and making it less likely to injure the personnel picking up the target tape D.

[0087] Please see Figure 7The present invention also provides a light-emitting module 100, which is manufactured by a composite strip comprising a plurality of light-emitting modules 100 using the punching process described in any of the above embodiments. The composite strip 1 has the same structure as in any of the preceding embodiments, comprising a circuit board 20 encapsulating a plurality of light-emitting chips 30, and a light-conversion adhesive layer 40 disposed on the circuit board 20. The light-conversion adhesive layer 40 is used to cover the plurality of light-emitting chips 30 to convert the first color light emitted by the light-emitting chips 30 into a second color light.

[0088] It should be noted that each of the light-emitting modules 100 is a target strip, the plurality of light-emitting chips 30 are located within the plurality of target strips, and each target strip includes at least one light-emitting chip 30, so that each of the manufactured light-emitting modules 100 can emit light.

[0089] The circuit board 20 can be a flexible circuit board or a printed circuit board, preferably a flexible circuit board. The light-emitting module 100, made using a flexible circuit board as a carrier, can be bent and folded as needed, making it suitable for various applications and enhancing its versatility. The circuit board 20 contains driving traces for driving the plurality of light-emitting chips 30, which can be conductive lines made of materials such as copper, but are not limited to.

[0090] The plurality of light-emitting chips 30 include at least one of LED, MiniLED, and MicroLED, preferably all of the plurality of light-emitting chips 30 are MiniLEDs. Using the same type of light-emitting chip for the plurality of light-emitting chips 30 reduces the design complexity of the driving circuitry of the carrier circuit board 10. Furthermore, the size of MiniLEDs is smaller than that of LEDs and MicroLEDs, which can reduce the thickness of the light-emitting module 100 (i.e., the dimension perpendicular to the circuit board 20), thereby helping to reduce the thickness of electronic devices using the light-emitting module 100. The light-emitting module 100 may contain one or more light-emitting chips 30. Generally, multiple light-emitting chips 30 are arranged in a row-column array to ensure the uniformity of light emission from the light-emitting module 100.

[0091] The light conversion adhesive layer 40 can be a fluorescent adhesive layer or a QD adhesive layer, preferably a fluorescent adhesive layer. As those skilled in the art know, current LED, MiniLED, MicroLED, and other light-emitting chips can only emit one of the three primary colors of light (i.e., red, blue, and green). Therefore, the first color of light emitted by the light-emitting chip 30 is red, blue, or green light. The light conversion adhesive layer 40 is used to convert the three primary colors of light emitted by the light-emitting chip 30 into other colors of light (i.e., the second color of light), generally white light. The specific conversion principle of the light conversion adhesive layer 40 is the same as that of existing fluorescent adhesive layers or QD adhesive layers, and will not be elaborated further.

[0092] It is understood that the light-emitting module 100 is made from a composite strip comprising a plurality of light-emitting modules 100 using the punching process described in any of the above embodiments, and therefore has the beneficial effects brought about by the punching process mentioned in any of the above embodiments. That is to say, when the light-emitting module 100 is made using the punching process mentioned in any of the above embodiments, the phenomenon of outward protrusion of the adhesive layer (i.e., the light conversion adhesive layer 40) in the light-emitting module 100 can be reduced or even avoided, thereby improving the appearance refinement of the light-emitting module 100. In addition, the improvement of the outward protrusion phenomenon of the light conversion adhesive layer 40 can also avoid the problem of light leakage when the light-emitting module 100 emits light.

[0093] Furthermore, please refer to the following: Figure 7 and Figure 8 In an embodiment of the present invention, the composite strip used to prepare the light-emitting module 100 further includes a film 60 covering the light-conversion adhesive layer 40. After the composite strip is cut at a predetermined cutting point and stamped, each light-emitting module 100 also includes the film 60 covering the light-conversion adhesive layer 40. By covering the light-conversion adhesive layer 40 with the film 60, the light-conversion adhesive layer 40 can be protected, preventing damage to the light-conversion adhesive layer 40, thereby ensuring the light emission of the light-emitting module 100.

[0094] Preferably, such as Figure 8 As shown, in an embodiment of the present invention, the diaphragm 60 includes a diaphragm body 61 and a decorative layer disposed on the surface of the diaphragm body 61 away from the light-converting adhesive layer 40. The decorative layer includes a textured layer and / or an ink layer. The textured layer is transparent or translucent, and the ink layer includes a translucent colored ink layer 63 and / or a uniform ink layer 65.

[0095] The film body 61 can be made of, but is not limited to, one or a combination of PET, fiberglass board, glass, and PMMA. The semi-transparent colored ink layer 63, the uniform light ink layer 65, and the texture layer can all transmit the second color light (i.e., white light) converted by the light conversion adhesive layer 40 when the light-emitting chip 30 emits light. The semi-transparent colored ink layer 63 is used to make the film 60 present the same color as the semi-transparent colored ink layer 63 when the light-emitting chip 30 does not emit light. The texture layer is used to make the film 60 present at least one of the following appearance effects when the light-emitting chip 30 does not emit light: pattern effect, dazzling effect, matte effect, and color-changing effect. The uniform light ink layer 65 is used to uniformly disperse the light passing through the uniform light ink layer 65 when the light-emitting chip 30 emits light, thereby improving the light emission uniformity of the light-emitting module 100.

[0096] exist Figure 8 In the example, the decorative layer includes the translucent colored ink layer 63, the uniform ink layer 65, the first texture layer 67, and the second texture layer 69.

[0097] The translucent colored ink layer 63 allows the second color light (i.e., white light) converted by the light-converting adhesive layer 40 to pass through, and makes the light-emitting module 100 appear colored when the light-emitting module 100 is not emitting light, thereby enhancing the aesthetic appearance of the light-emitting module 100. The light-diffusing ink layer 65 can play a role in light diffusing, thereby improving the light emission uniformity of the light-emitting module 100.

[0098] The translucent colored ink layer 63 and the uniform light ink layer 65 are both formed on the surface of the film body 61 near the light conversion adhesive layer 40, with the translucent colored ink layer 63 located between the film body 61 and the uniform light ink layer 65. Alternatively, the translucent colored ink layer 63 can also be disposed on the side of the uniform light ink layer 65 away from the film body 61. Optionally, in embodiments of the present invention, the uniform light ink layer 65 can be one or more layers. Compared to a single uniform light ink layer, multiple uniform light ink layers can further improve the light emission uniformity of the light-emitting module 100.

[0099] It is understood that the semi-transparent colored ink layer 63 can be formed using existing semi-transparent colored inks and by printing or other methods. Similarly, any of the uniform gloss ink layers can be formed using existing uniform gloss inks (usually white inks) and by printing or other methods. This will not be elaborated further.

[0100] like Figure 8As shown, in one embodiment of the present invention, the second texture layer 69 includes a plurality of microstructures 692 disposed on the surface of the film body 61 away from the light conversion adhesive layer 40, and a brightening film 694 for covering the plurality of microstructures 692. Each microstructure 692 has at least one reflective surface, and the angle between the reflective surface and the film body 61 is greater than 90 degrees. The second texture layer 69 is used to present a glare effect. The first texture layer 67 is disposed on the surface of the brightening film 694 away from the film body 61. The first texture layer 67 includes at least one stripe texture selected from linear texture, coil texture, and wavy texture. The stripe texture can be arranged according to a preset pattern, so that the first texture layer 67 is used to present a pattern effect.

[0101] In this embodiment, by sequentially forming the second texture layer 69 and the first texture layer 67 on the membrane body 61 of the membrane 60, when the light-emitting module 100 is not emitting light and light shines on the membrane 60, the texture pattern of the first texture layer 67 can be clearly presented, allowing the user to see a preset pattern corresponding to the texture on the first texture layer 67, thus enhancing the aesthetic appeal of the membrane 60 to the light-emitting module 100. Furthermore, light can pass through the transparent or semi-transparent first texture layer 67 and further illuminate the second texture layer 69. Since the second texture layer 69 includes multiple microstructures 692 with reflective surfaces, the light illuminating the membrane 60 can be reflected from multiple angles and its brightness can be increased under the action of the brightening film 694, thereby presenting a glare effect and reducing the visual blind spots of the membrane 60, thus increasing the brightness of the membrane 60. Furthermore, the reflected light from the first texture layer 67 and the second texture layer 69 has a certain optical path difference, which distinguishes the brightness of the reflected light from different texture layers. This increases the contrast between different texture layers of the film 60, resulting in a more distinct layered appearance and a stronger three-dimensional effect. It can also be understood that the color of the translucent colored ink layer 63, combined with the shimmering effect produced by the second texture layer 69, can cause at least a portion of the film 60 to display a dazzling color. Moreover, the area and color of the dazzling effect on the film 60 will change depending on the user's viewing angle.

[0102] It should be noted that the brightening film 694 in the second texture layer 69 can be formed using existing coating processes. The brightening film 694 covers the plurality of microstructures 692, which not only increases the brightness of the light reflected by the microstructures 692, thereby further improving the brightness of the film 60, but also improves the flatness of the second texture layer 69 by covering the microstructures 692 with the brightening film 694. A flat second texture layer 69 is more conducive to the formation of the first texture layer 67. It should also be noted that both the first texture layer 67 and the second texture layer 69 can be prepared using any existing texture forming method, including but not limited to printing, pad printing, CNC machining, etc. Specifically, in the embodiments of the present invention, the first texture layer 67 and the second texture layer 69 can be formed by printing UV texture adhesive. By adjusting the thickness of the printed UV texture adhesive and controlling the printing process, a texture layer with a certain thickness can be formed to obtain a better texture effect.

[0103] Optionally, in an embodiment of the present invention, the stripe texture on the first texture layer 67 may be one or a combination of linear textures, spiral textures, coil textures, and wavy textures, and there is no limitation thereto.

[0104] Alternatively, such as Figure 8 As shown, in embodiments of the present invention, each microstructure 692 in the second texture layer 69 may be, but is not limited to, a pyramidal structure or a frustum structure. Specifically, in Figure 8 In the example, the plurality of microstructures 692 are a plurality of square pyramid structures arranged in an array, each of the microstructures 692 comprising four reflective surfaces (i.e., the side surfaces of the square pyramid). Of course, the plurality of microstructures 692 may also be a plurality of triangular pyramid structures, or a plurality of pentagonal pyramid structures, or other pyramid structures with multiple reflective surfaces arranged in an array; there is no limitation thereto. Figure 2 In the illustrated embodiment, each microstructure 692 in the second texture layer 69 has multiple reflective surfaces, thereby enabling multi-angle reflection of light. This allows the user to receive light reflected from the diaphragm 60 over a wide range, which is beneficial for improving the brightness and smoothness of the diaphragm 60. Of course, in other embodiments, the microstructures 692 can also be several frustum structures arranged in an array, each microstructure 692 including an annular reflective surface (i.e., the annular cone surface of the frustum structure), which can also achieve multi-angle reflection of light and improve the brightness and smoothness of the diaphragm 60. Further details are omitted here.

[0105] It is understood that, in the embodiments of the present invention, the reflective surface of each microstructure 692 has an angle exceeding 90 degrees with the diaphragm body 61. If the angle is too small, meaning the inclination of the reflective surface relative to the diaphragm body 61 is too large, the user can only receive the light reflected from the reflective surface from a side view, reducing the perceived surface smoothness of the diaphragm 60. Conversely, if the angle is too large, meaning the inclination of the reflective surface relative to the diaphragm body 61 is too small, the user can only receive the light reflected from the reflective surface from a frontal or near-frontal view, but the user often views the diaphragm 60 from the side, which reduces the brightness of the diaphragm 60. Therefore, the angle between the reflective surface of each microstructure 692 and the diaphragm body 61 should be reasonably designed, preferably within the range of 120 degrees to 160 degrees.

[0106] Furthermore, please refer to the following: Figures 9 to 11 The present invention also provides an electronic device 1000, which may be, but is not limited to, mobile phones, tablets, displays, and other electronic devices. Figure 9 As shown, the electronic device 1000 includes a housing 300 and a display panel 200 disposed on the housing 300. The display panel 200 includes a display screen 400 and a light-emitting module 100 as described in any of the above embodiments. The light-emitting module 100 is disposed on the non-display side of the display screen 400 to serve as a backlight for the display screen 400. The light-emitting module 100 can avoid light leakage, improve the display effect of the display panel 200, and provide users with a good visual experience.

[0107] Please see Figure 11 In some embodiments of the present invention, the housing 300 is provided with a transparent area 310, and the light-emitting module 100 is provided on the inner side of the housing 300. The light-emitting module 100 is visualized on the housing 300 through the transparent area 310.

[0108] It should be noted that, similar to existing electronic devices, the electronic device 1000 also includes a control module, a camera module, a wireless charging module, a memory, sensors, and other electronic components. The circuit board 20 in the light-emitting module 100 can be electrically connected to the control module of the electronic device 1000. The control module can control the light-emitting chip 30 on the circuit board 20 to emit or not emit light, thereby using the light-emitting chip 30 to indicate the charging status, new information, and other states of the electronic device 1000, realizing interaction between the light-emitting module 100 and the state of the electronic device 1000.

[0109] like Figure 11As shown, in an embodiment of the present invention, the housing 300 includes a back cover opposite to the display screen of the electronic device 1000, and a middle frame for fixing the display screen and the back cover. Optionally, both the back cover and the middle frame may be made wholly or partially of a transparent material (not limited to glass, transparent plastic, etc.), and the transparent portions of the back cover and the middle frame constitute the transparent area 310. Figure 11 In the example, the entire back cover of the housing 300 is made of transparent material, that is, the entire back cover is a transparent area 310. Making the entire back cover into the transparent area 310 not only facilitates processing and manufacturing, but also allows multiple electronic components inside the electronic device 1000, such as the camera module 90 and the wireless charging module 70, to be visually displayed on the housing 300 through the transparent back cover (i.e., the transparent area 310). This allows users to see various electronic components and their arrangement on the back of the electronic device 1000, which helps to enhance the technological feel and overall aesthetics of the electronic device 1000.

[0110] Preferably, in an embodiment of the invention, the light-emitting module 100 is provided around a portion of the electronic components visually displayed on the housing 300. For example, in Figure 11 In the example, both the camera module 90 and the wireless charging module 70 of the electronic device 1000 are visualized on the housing 300 through the transparent area 310, and each is surrounded by a light-emitting module 100. Thus, when the camera module 90 is used to take a picture, the control module of the electronic device 1000 can control the light-emitting modules 100 around the camera module 90 to provide supplementary lighting, improving the picture quality and avoiding defects such as overexposure from the built-in flash of the electronic device 1000. Similarly, when the wireless charging module 70 is used to charge, the control module of the electronic device 1000 can control the light-emitting modules 100 around the wireless charging module 70 to provide a notification, indicating the current charging progress of the electronic device 1000 to the user.

[0111] In other embodiments, the electronic device 1000 may also have multiple light-emitting modules 100 arranged at different positions inside the housing 300, so that the multiple light-emitting modules 100 together form a preset pattern, which will not be elaborated further.

[0112] It is easy to understand that the light-emitting module 100 included in the electronic device 1000 can be the light-emitting module 100 described in any of the above embodiments. Therefore, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments. For a more specific description, please refer to the relevant content of the light-emitting module 100 in the foregoing embodiments, which will not be repeated here.

[0113] In the description of this invention, the terms "embodiment," "specific embodiment," "example," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0114] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A punching process for composite strip, the composite strip comprising a circuit board and an adhesive layer covering the circuit board, characterized in that, The punching process includes: Provide the composite strip and lay it flat on the cutting table; Starting from the side of the adhesive layer away from the circuit board, the composite strip is cut at a predetermined cutting point using a cutting die, with the cutting depth extending at least into a portion of the adhesive layer's thickness; and From the side of the adhesive layer away from the circuit board, the target strip of the composite strip located within the area surrounded by the preset cut is stamped until the target strip falls off the composite strip; The circuit board includes a substrate and conductive lines embedded in the substrate. The cutting die includes a pair of blades, the hardness of each blade is less than the hardness of the conductive line, and the cutting depth is less than the distance between the surface of the composite strip away from the circuit board and the conductive line.

2. The punching process for composite strips as described in claim 1, characterized in that, The composite tape further includes a film covering the adhesive layer, and the step of cutting the composite tape at the preset cutting point includes: The composite strip is cut from the side of the diaphragm away from the adhesive layer at the preset cut point until the diaphragm is cut off along the thickness direction and the adhesive layer is cut off at least partially along the thickness direction.

3. The punching process for composite strips as described in claim 1 or 2, characterized in that, The preset cutting point includes two cutting lines that are parallel and spaced apart along a first direction. Each cutting line extends from one side of the composite strip to the other side along a second direction. The portion of the composite strip located between the two cutting lines is the target strip. The first direction and the second direction are not parallel. The step of cutting the composite strip at the preset cutting point includes using a cutting die to mechanically cut the composite strip at both cutting lines simultaneously.

4. The punching process for composite strips as described in claim 3, characterized in that, The cutting edge angle of each of the blades is 20 to 25 degrees.

5. The punching process for composite strips as described in claim 4, characterized in that, The cutting edge angle of each blade is 25 degrees.

6. The punching process for composite strips as described in claim 4 or 5, characterized in that, The edge hardness of each blade is less than the hardness of the substrate, and the cutting depth of the mechanical cutting is less than the distance between the surface of the composite strip away from the circuit board and the substrate.

7. A light-emitting module, characterized in that, The light-emitting module is made of a composite strip comprising a plurality of the light-emitting modules using the punching process described in any one of claims 1 to 6; The composite strip includes a circuit board encapsulating multiple light-emitting chips and a light-conversion adhesive layer disposed on the circuit board. The light-conversion adhesive layer is used to cover the multiple light-emitting chips. Each portion of the strip containing the light-emitting module is a target strip. The multiple light-emitting chips are located within multiple target strips, and each target strip includes at least one light-emitting chip.

8. The light-emitting module as described in claim 7, characterized in that, The composite strip also includes a film covering the light conversion adhesive layer. Each light-emitting module made by cutting the composite strip at a preset cutting point and stamping the composite strip also includes the film covering the light conversion adhesive layer.

9. The light-emitting module as described in claim 8, characterized in that, The diaphragm includes a diaphragm body and a decorative layer disposed on the surface of the diaphragm body away from the light conversion adhesive layer, the decorative layer including a textured layer and / or an ink layer; The textured layer is transparent or semi-transparent, and the ink layer includes a semi-transparent colored ink layer and / or a uniform gloss ink layer; When the light-emitting chip is not emitting light, the texture layer enables the film to present at least one of the following appearance effects: pattern effect, dazzling effect, matte effect, and color-changing effect; the semi-transparent colored ink layer enables the film to present the same color as the semi-transparent colored ink layer. When the light-emitting chip emits light, the homogenizing ink layer can uniformly disperse the light passing through it.

10. An electronic device, characterized in that, The device includes a housing and a display panel disposed on the housing, the display panel including a display screen and a light-emitting module as described in any one of claims 7 to 9, the light-emitting module being disposed on the non-display side of the display screen; And / or, the housing has a transparent area, and the light-emitting module is provided on the inner side of the housing, and the light-emitting module is visualized on the housing through the transparent area.

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