A seedless plating process for ceramic packages

Abstract

The application provides an isolated guide plating process for ceramic packages, which comprises: preparing ceramic slurry, then injecting the slurry into a casting machine to form green tape, and then cutting the green tape into green sheets; punching, injecting slurry and printing corresponding circuit on each green sheet, then laminating and cutting; printing circuit on each green sheet respectively, so that the required lead is metallized and led out from a substrate, punching so that the isolated guide area on the substrate is communicated with another substrate, so that the isolated guide area is led out and conducted from the other substrate; printing end, metallizing the lead and the isolated guide and sealing area; sintering; chemical nickel plating, assembling, soldering and electroplating, and finally polishing the end to obtain a ceramic package; and the bonding area and the chip bonding area are free of bumps.

Description

Technical Field

[0001] This invention relates to an arc-guided plating process for ceramic packages. Background Technology

[0002] The current method uses gold wire bonding and arc plating. However, the gold wires on the bonded parts are not easy to remove, resulting in bumps on the product and affecting user experience. If the bumps need to be completely removed, the process requires high precision and strict concentration from the employees. Otherwise, the product is very likely to have bumps that cannot be completely removed. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide an orb-guided plating process for ceramic packages, so that there are no bumps on the bonding area and the chip bonding area.

[0004] This invention is implemented as follows: an arc-guided plating process for ceramic packages, comprising the following steps:

[0005] Step 1: Prepare ceramic slurry, then inject it into a casting machine for casting to form green strip, and then cut the green strip into slabs;

[0006] Step 2: Punch and inject grout into each board blank, and print the corresponding circuit on each board blank. Then, laminate and cut the board blanks. Print the circuit on the board blanks so that the required lead wires are metallized and brought out on one substrate. Punch the holes so that the arc conducting area on the substrate is connected to another substrate, so that the arc conducting area is brought out from the other substrate and conducts.

[0007] Step 3: Perform end printing to metallize and connect the leads to the arc conductor and the sealing area; and then perform sintering.

[0008] Step 4: Perform electroless nickel plating, assembly brazing and electroplating, and finally polish the ends to obtain a ceramic package.

[0009] Furthermore, in step 4, a grinding device is required for grinding. The grinding device includes a grinding machine, a base, a three-dimensional moving mechanism, a fixed plate, a grinding table, and a baffle. The grinding machine is placed on a workbench.

[0010] The platform is fixed to the worktable and located on one side of the grinding machine; the three-dimensional moving mechanism is fixed to the platform;

[0011] The fixing plate is mounted on the three-dimensional moving mechanism;

[0012] The polishing table is mounted on the fixed plate; the polishing table is provided with a guide groove; one end of the guide groove is fitted with the baffle.

[0013] The baffle is provided on one side of the fixed plate, and the baffle has an opening. The grinding machine is provided with a grinding disc, and the grinding disc passes through the opening.

[0014] The sintered ceramic package is placed on the guide groove, and then its end is polished using a polishing machine.

[0015] Furthermore, the polishing table is detachably mounted on the fixed plate.

[0016] Furthermore, the three-dimensional moving mechanism is a precision displacement slide.

[0017] The present invention has the following advantages: the process of the present invention eliminates bumps on the bonding area and chip bonding area, and the polishing device prevents ceramic chipping during the polishing process. Furthermore, it requires no technical skills from the polishing workers, allows for precise control of the polishing position, resulting in a more aesthetically pleasing product. Employees simply place the ceramic package on the polishing device's base and press it down to polish the end of the ceramic package. The polishing depth and position are consistent, and a baffle effectively protects the employee's hands. Employees can start working without training, significantly reducing enterprise costs. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a flowchart illustrating the execution of the method of the present invention;

[0020] Figure 2 This is a schematic diagram of a film of the present invention;

[0021] Figure 3 This is another schematic diagram of a film for the present invention;

[0022] Figure 4 This is a schematic diagram of the unpolished end of the present invention;

[0023] Figure 5 This is a schematic diagram of the polishing of the rear end head of the present invention;

[0024] Figure 6 This is a front view of the polishing device of the present invention;

[0025] Figure 7 This is a side view of the polishing device of the present invention. Detailed Implementation

[0026] like Figure 1 As shown, the present invention provides an arc-guided plating process for ceramic packages, comprising the following steps:

[0027] Step 1: Prepare ceramic slurry, then inject it into a casting machine for casting to form green strip, and then cut the green strip into slabs;

[0028] Step 2: Punch and inject grout into each slab, print corresponding circuits on each slab, then laminate and cut; for example... Figure 2 As shown, circuit lines are printed on the slabs, allowing the required leads to be metallized and brought out on one substrate. A punched hole F1 connects the arc-shaped conductive area F on this substrate to another substrate, as shown. Figure 3 As shown, this allows the isolated conduction region F to be led out from the lead-out terminal b in another film for conduction;

[0029] Step 3: Perform end printing to metallize and connect the leads to the arc conductor and the sealing area; and then perform sintering.

[0030] Step 4: Perform electroless nickel plating, assembly brazing and electroplating, and finally grind the end d to obtain the ceramic package, such as... Figure 4 As shown, this is the ceramic shell before the end d has been polished. After polishing, it will look like this. Figure 5 As shown, half of the end d is ground off.

[0031] like Figure 6 and 7 As shown, a polishing device is required in step 4. The polishing device includes a polishing machine 1, a base 2, a three-dimensional moving mechanism 3, a fixed plate 4, a polishing table 5, and a baffle 6. The polishing machine 1 is placed on a worktable a, and the three-dimensional moving mechanism 3 is a precision displacement slide.

[0032] The base 2 is fixed to the worktable a and is located on one side of the grinding machine 1; the three-dimensional moving mechanism 3 is fixed to the base 2;

[0033] The fixed plate 4 is disposed on the three-dimensional moving mechanism 3;

[0034] The grinding table 5 is detachably mounted on the fixed plate 4; the grinding table 5 is provided with a guide groove 51; one end of the guide groove 51 is attached to the baffle 6. Since there are various models and sizes of ceramic packages that need to be ground, various grinding tables 5 can be set, and guide grooves 51 of different sizes can be set on the grinding tables 5. During grinding, the guide groove 51 can be adapted to the ceramic package by changing the corresponding grinding table 5, so that the ceramic package will not shake during the grinding process.

[0035] The baffle 6 is located on one side of the fixed plate 4, and the baffle 6 has an opening 61. The grinding machine 1 is provided with a grinding disc 11, which passes through the opening 61.

[0036] After identifying the model of the ceramic package that needs to be polished, the corresponding polishing table 5 is replaced. Then, by adjusting the three-dimensional moving mechanism 3, the position of the fixed plate 4 is adjusted so that the relative position of the baffle 6 and the polishing disc 11 is determined, so that the end of the ceramic package that needs to be polished is exactly facing the polishing disc 11. Then, the polishing machine 1 is turned on, and then the staff places the ceramic package into the guide groove 51 on the polishing table 5 and pushes it towards the baffle 6 so that the end of the ceramic package is polished by the polishing disc 11. After polishing is completed, a new ceramic package is placed for the next end polishing.

[0037] While specific embodiments of the present invention have been described above, those skilled in the art should understand that the specific embodiments described are merely illustrative and not intended to limit the scope of the present invention. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A process for arc-guided plating of ceramic packages, characterized in that: Includes the following steps: Step 1: Prepare ceramic slurry, then inject it into a casting machine for casting to form green strip, and then cut the green strip into slabs; Step 2: Punch and inject grout into each board blank, and print the corresponding circuit on each board blank. Then, laminate and cut the board blanks. Print the circuit on the board blanks so that the required lead wires are metallized and brought out on one substrate. Punch the holes so that the arc conducting area on the substrate is connected to another substrate, so that the arc conducting area is brought out from the other substrate and conducts. Step 3: Perform end printing to metallize and connect the leads to the arc conductor and the sealing area; and then perform sintering. Step 4: Perform electroless nickel plating, assembly brazing and electroplating, and finally polish the ends to obtain a ceramic package.

2. The arc-guided plating process for ceramic packages according to claim 1, characterized in that: In step 4, a grinding device is required for grinding. The grinding device includes a grinding machine, a base, a three-dimensional moving mechanism, a fixed plate, a grinding table, and a baffle. The grinding machine is placed on a workbench. The platform is fixed to the worktable and located on one side of the grinding machine; the three-dimensional moving mechanism is fixed to the platform; The fixing plate is mounted on the three-dimensional moving mechanism; The polishing table is mounted on the fixed plate; the polishing table is provided with a guide groove; one end of the guide groove is fitted with the baffle. The baffle is provided on one side of the fixed plate, and the baffle has an opening. The grinding machine is provided with a grinding disc, and the grinding disc passes through the opening. The sintered ceramic package is placed on the guide groove, and then its end is polished using a polishing machine.

3. The arc-guided plating process for ceramic packages as described in claim 2, characterized in that: The grinding table is detachably mounted on the fixed plate.

4. The arc-guided plating process for ceramic packages as described in claim 2, characterized in that: The three-dimensional moving mechanism is a precision displacement slide.

Images