Method of manufacturing a ceramic matrix, an atomizing core, and an aerosol forming device

Abstract

The application provides a ceramic base preparation method, an atomization core and an aerosol forming device. The ceramic base preparation method comprises the following steps: providing a ceramic substrate; forming a protective layer covering part of the outer surface of the ceramic substrate to obtain a ceramic green body; and sintering the ceramic green body to make the protective layer form a plurality of through holes communicating with the ceramic substrate to obtain a ceramic base. The application improves the structural strength and toughness of the ceramic base by preparing a protective layer on part of the outer surface of the ceramic substrate, reduces the probability of the ceramic base falling off, prolongs the service life of the atomization core, and improves the user experience.

Description

Technical Field

[0001] This application belongs to the technical field of aerosol forming apparatus, specifically relating to a method for preparing a ceramic substrate, an atomizing core, and an aerosol forming apparatus. Background Technology

[0002] In the field of aerosol forming device technology, the atomizing core is composed of a ceramic substrate and a heating element. However, the ceramic substrate generally suffers from problems such as low strength, poor toughness, and easy powder shedding, which shortens the lifespan of the atomizing core and reduces the user experience. Summary of the Invention

[0003] In view of this, the first aspect of this application provides a method for preparing a ceramic matrix, the method comprising:

[0004] Provide ceramic substrates;

[0005] A protective layer is formed covering a portion of the outer surface of the ceramic substrate to obtain a ceramic green body; and

[0006] The ceramic blank is sintered to form a plurality of through holes that connect the protective layer to the ceramic substrate, thereby obtaining a ceramic matrix.

[0007] The method for preparing a ceramic substrate provided in the first aspect of this application involves first forming a protective layer on a portion of the outer surface of a ceramic substrate, and then forming through holes in the protective layer that connect to the ceramic substrate to obtain a ceramic substrate. The protective layer, covering the outer surface of the ceramic substrate, protects and fixes the ceramic substrate, improves the structural strength and toughness of the ceramic substrate, and reduces the probability of powder shedding from the ceramic substrate.

[0008] Furthermore, a protective layer is provided on a portion of the outer surface of the ceramic substrate, providing space for subsequent heating elements to be placed within the ceramic matrix. The protective layer also has through-holes connecting to the ceramic substrate, allowing the aerosol substrate to flow into the ceramic substrate through these holes, thereby improving the liquid conductivity of the ceramic matrix.

[0009] Therefore, this application improves the structural strength and toughness of the ceramic substrate and reduces the probability of powder shedding by preparing a protective layer on a portion of the outer surface of the ceramic substrate, thereby extending the service life of the atomizing core and improving the user experience.

[0010] The step of forming a protective layer covering a portion of the outer surface of the ceramic substrate includes:

[0011] A slurry is provided, the slurry being composed of metal powder, sintering aid, binder, dispersant, and solvent;

[0012] The paste is printed onto a portion of the outer surface of the ceramic substrate to form the protective layer.

[0013] The outer surface of the ceramic substrate includes a heating surface for mounting a heating element and a non-heating surface. The step of printing the paste onto a portion of the outer surface of the ceramic substrate includes:

[0014] The paste is printed onto the non-heated surface.

[0015] In the slurry, the mass percentages of the metal powder, the sintering aid, the binder, the dispersant, and the solvent are (80%-85%): (0.5%-3%): (1.5%-3%): (0.2%-0.6%): (10%-15%).

[0016] The step of sintering the ceramic preform to form a plurality of through holes communicating with the ceramic substrate in the protective layer includes:

[0017] The ceramic blank is heated from room temperature to a first temperature and held at that temperature for 30-60 minutes. The first temperature is 280℃-320℃.

[0018] The ceramic blank is heated from the first temperature to the second temperature and held at that temperature for 30-60 minutes, wherein the second temperature is 480℃-520℃.

[0019] The ceramic blank is heated from the second temperature to the third temperature and held at that temperature for 10-30 minutes, wherein the third temperature is 930℃-970℃.

[0020] The ceramic blank is heated from the third temperature to the fourth temperature and held for 1 min to 5 min, wherein the fourth temperature is 1130℃ to 1170℃.

[0021] The ceramic preform is cooled from the fourth temperature to room temperature to obtain the ceramic matrix.

[0022] The second aspect of this application provides an atomizing core, the atomizing core including a heating element and a ceramic substrate prepared by the method of preparing a ceramic substrate as provided in the first aspect of this application, wherein the heating element is disposed on a ceramic substrate of the ceramic substrate and is insulated from the protective layer of the ceramic substrate.

[0023] The atomizing core provided in the second aspect of this application uses a ceramic substrate prepared by the method provided in the first aspect of this application. A protective layer is provided on a portion of the outer surface of the ceramic substrate to improve the structural strength and toughness of the ceramic substrate and reduce the probability of powder shedding from the ceramic substrate, thereby extending the service life of the atomizing core and improving the user experience.

[0024] The ceramic substrate includes a first end face and a second end face disposed opposite to each other, and a peripheral side face bent and connected between the first end face and the second end face. The first end face is used to mount the heating element, and the second end face and the peripheral side face are used to mount the protective layer.

[0025] Wherein, a bend is formed at the connection between the second end face and the peripheral side face, the thickness of the protective layer located at the bend is greater than the thickness of the protective layer located at the second end face, and the thickness of the protective layer located at the bend is greater than the thickness of the protective layer located at the peripheral side face.

[0026] The ceramic substrate has micropores, and the diameter of the through-holes in the protective layer is larger than the diameter of the micropores.

[0027] A third aspect of this application provides an aerosol forming apparatus, the aerosol forming apparatus including a housing, a battery assembly, and an atomizing core as provided in the second aspect of this application, the battery assembly and the atomizing core being disposed within the housing, and the battery assembly being electrically connected to the atomizing core, the battery assembly being used to provide energy to the atomizing core and control atomization parameters, and the atomizing core being used to heat and atomize the aerosol substrate within the housing.

[0028] The aerosol forming apparatus provided in the third aspect of this application, by employing the atomizing core provided in the second aspect of this application, provides a protective layer on a portion of the outer surface of the ceramic substrate to improve the structural strength and toughness of the ceramic substrate, reduce the probability of powder shedding from the ceramic substrate, thereby extending the service life of the atomizing core and improving the user experience. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0030] Figure 1 The process flow of the method for preparing the ceramic matrix in one embodiment of this application is as follows. Figure 1 .

[0031] Figure 2 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 1 .

[0032] Figure 3 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 2 .

[0033] Figure 4 The process flow of the method for preparing the ceramic matrix in one embodiment of this application is as follows. Figure 2 .

[0034] Figure 5 The process flow of the method for preparing the ceramic matrix in one embodiment of this application is as follows. Figure 3 .

[0035] Figure 6 The process flow of the method for preparing the ceramic matrix in one embodiment of this application is as follows. Figure 4 .

[0036] Figure 7 This is a structural diagram of a ceramic substrate according to one embodiment of this application.

[0037] Figure 8 This is a partial enlarged view of the protective layer in one embodiment of this application.

[0038] Figure 9 This is a structural diagram of the ceramic matrix in one embodiment of this application.

[0039] Figure 10 This is a cross-sectional view of a ceramic substrate according to one embodiment of this application.

[0040] Figure 11 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 3 .

[0041] Figure 12 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 4 .

[0042] Figure 13 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 5 .

[0043] Labeling Explanation: Ceramic Substrate-1, Ceramic Base Plate-11, Heating Surface-111, Non-Heating Surface-112, First End Face-113, Second End Face-114, Peripheral Side Face-115, Liquid Guiding Channel-116, Bending Part-117, Connecting Channel-118, Protective Layer-12, First Part-121, Second Part-122, Atomizing Core-2, Heating Element-21. Detailed Implementation

[0044] The following are preferred embodiments of this application. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

[0045] Please refer to this as well. Figures 1-3 , Figure 1 The process flow of the method for preparing the ceramic matrix in one embodiment of this application is as follows. Figure 1 . Figure 2 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 1 . Figure 3 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 2 .

[0046] This embodiment provides a method for preparing a ceramic substrate 1, which includes steps S100, S200, and S300. Detailed descriptions of steps S100, S200, and S300 are as follows.

[0047] S100 provides a ceramic substrate 11.

[0048] The ceramic substrate 11 has a porous ceramic structure with multiple micropores, and the aerosol substrate can flow into the micropores of the ceramic substrate 11.

[0049] S200, a protective layer 12 is formed covering a portion of the outer surface of the ceramic substrate 11, resulting in a ceramic blank.

[0050] A protective layer 12 is provided on a portion of the outer surface of the ceramic substrate 11 to provide space for the subsequent heating element 21 to be disposed on the ceramic substrate 1. The atomizing core 2 includes a heating element 21 and a ceramic substrate 1. The heating element 21 is disposed on the ceramic substrate 11 of the ceramic substrate 1, and the heating element 21 is insulated from the protective layer 12.

[0051] S300, the ceramic blank is sintered to form a plurality of through holes in the protective layer 12 that connect to the ceramic substrate 11, thereby obtaining the ceramic substrate 1.

[0052] The protective layer 12 is also provided with through holes that connect to the ceramic substrate 11, so that the aerosol substrate can flow into the ceramic substrate 11 through the through holes, thereby improving the liquid conductivity of the ceramic substrate 1. The through holes of the protective layer 12 connect to the micropores of the ceramic substrate 11. The aerosol substrate can flow into the micropores of the ceramic substrate 11 through the through holes of the protective layer 12.

[0053] Therefore, by preparing a protective layer 12 on a portion of the outer surface of the ceramic substrate 11, the protective layer 12 covers the outer surface of the ceramic substrate 11, which can protect and fix the ceramic substrate 11, improve the structural strength of the ceramic substrate 1, improve the toughness of the ceramic substrate 1, reduce the probability of powder shedding from the ceramic substrate 1, thereby extending the service life of the atomizing core 2 and improving the user experience.

[0054] Please refer to Figure 4 , Figure 4 The process flow of the method for preparing the ceramic matrix in one embodiment of this application is as follows. Figure 2 In one embodiment, the step of forming a protective layer 12 covering a portion of the outer surface of the ceramic substrate 11 in S200 includes S210 and S220. Detailed descriptions of S210 and S220 are as follows.

[0055] S210 provides a slurry composed of metal powder, sintering aid, binder, dispersant, and solvent.

[0056] Optionally, in one embodiment, the mass percentages of the metal powder, the sintering aid, the binder, the dispersant, and the solvent in the slurry are (80%-85%):(0.5%-3%):(1.5%-3%):(0.2%-0.6%):(10%-15%).

[0057] Further optionally, the mass percentages of the metal powder, the sintering aid, the binder, the dispersant, and the solvent can be (82%-83%): (1%-2%): (2%-2.5%): (0.3%-0.5%): (12%-13%).

[0058] The mass percentages of the metal powder, sintering aid, binder, dispersant, and solvent are (80%-85%):(0.5%-3%):(1.5%-3%):(0.2%-0.6%):(10%-15%), which provide a foundation for obtaining a protective layer 12 with high shape temperature and structural strength, and also facilitate the formation of through-holes during subsequent sintering. If the mass percentages of the metal powder, sintering aid, binder, dispersant, and solvent are too high or too low, it will affect the resulting protective layer 12, potentially leading to problems such as difficulty in forming the protective layer 12, low structural strength of the protective layer 12, and difficulty in forming through-holes in the protective layer 12.

[0059] Optionally, the metal powder is made of nickel. The sintering aid is sodium carbonate, the binder includes at least one of polymethyl methacrylate and ethyl cellulose, the dispersant is oleic acid, and the solvent includes at least one of dipropylene glycol methyl propyl ether and terpineol.

[0060] By utilizing the high ductility and high strength of metallic nickel in the material, a composite ceramic matrix 1 consisting of a ceramic substrate 11 and a protective layer 12 is formed, thereby improving the strength and toughness of the ceramic matrix 1 and preventing particles from falling off and scattering on the surface of the ceramic matrix 1.

[0061] Further optionally, the adhesive comprises polymethyl methacrylate and ethyl cellulose, wherein the mass ratio of polymethyl methacrylate to ethyl cellulose is 1:2.

[0062] Further optionally, the solvent includes dipropylene glycol methyl propyl ether and terpineol, and the mass ratio of dipropylene glycol methyl propyl ether to terpineol is 1:5.

[0063] S220, the paste is printed on a portion of the outer surface of the ceramic substrate 11 to form the protective layer 12.

[0064] A paste is applied to the outer surface of the ceramic substrate 11 using a screen printing process. Optionally, the printing thickness of the protective layer 12 is 50um-250um, in other words, the thickness of the protective layer 12 is 50um-250um. Further optionally, the printing thickness can be 70um, 100um, 130um, 150um, 180um, 200um, or 230um, etc.

[0065] The protective layer 12 has a printing thickness of 50µm-250µm. This thickness not only protects and fixes the ceramic substrate 11 but also reduces the difficulty of forming through-holes during subsequent sintering. If the printing thickness of the protective layer 12 is less than 50µm, it will be too thin to effectively protect and fix the ceramic substrate 11. If the printing thickness of the protective layer 12 is greater than 250µm, it will increase the difficulty of forming through-holes during subsequent sintering, resulting in a reduction in the number of through-holes on the protective layer 12 and decreasing the liquid conductivity of the ceramic substrate 1.

[0066] Please refer to this as well. Figure 2 ,and Figure 5 , Figure 5 The process flow of the method for preparing the ceramic matrix in one embodiment of this application is as follows. Figure 3 In one embodiment, the outer surface of the ceramic substrate 11 includes a heating surface 111 for mounting the heating element 21 and a non-heating surface 112. In step S220, the step of printing the paste onto a portion of the outer surface of the ceramic substrate 11 includes:

[0067] S221, the paste is printed on the non-heated surface 112.

[0068] The ceramic substrate 11 includes a first end face 113 and a second end face 114 disposed opposite to each other, and a peripheral side face 115 bent and connected between the first end face 113 and the second end face 114. The first end face 113 is used to mount the heating element 21, and the second end face 114 and the peripheral side face 115 are used to provide the protective layer 12. The protective layer 12 is provided on the peripheral side face 115 and / or the second end face 114.

[0069] Furthermore, the protective layer 12 is insulated from the heating element 21. For example, there is a gap between the protective layer 12 and the heating element 21. Or, for example, an insulating element is provided between the protective layer 12 and the heating element 21.

[0070] This embodiment reduces the difficulty of printing paste onto the ceramic substrate 11 and improves the preparation efficiency by disposing the protective layer 12 on the non-heated surface 112 of the ceramic substrate 11.

[0071] In one embodiment, the step of sintering the ceramic blank to form a plurality of through holes communicating with the ceramic substrate 11 in the protective layer 12 includes: heating the ceramic blank from room temperature to a first temperature and holding it at that temperature for 30-60 minutes, wherein the first temperature is 280°C-320°C; heating the ceramic blank from the first temperature to a second temperature and holding it at that temperature for 30-60 minutes, wherein the second temperature is 480°C-520°C; heating the ceramic blank from the second temperature to a third temperature and holding it at that temperature for 10-30 minutes, wherein the third temperature is 930°C-970°C; heating the ceramic blank from the third temperature to a fourth temperature and holding it at that temperature for 1-5 minutes, wherein the fourth temperature is 1130°C-1170°C; and cooling the ceramic blank from the fourth temperature to room temperature to obtain the ceramic substrate 1.

[0072] Optionally, the first temperature is 290℃, 300℃, or 310℃, etc. The second temperature is 490℃, 500℃, or 510℃, etc. The third temperature is 940℃, 950℃, or 960℃, etc. The fourth temperature is 1140℃, 1150℃, or 1160℃, etc. Optionally, the temperature is held at the first temperature for 40 minutes or 50 minutes, at the second temperature for 40 minutes or 50 minutes, at the third temperature for 15 minutes, 20 minutes, or 25 minutes, etc., and at the fourth temperature for 2 minutes, 3 minutes, or 4 minutes, etc.

[0073] Optionally, the ceramic green body is heated from room temperature to a first temperature at a first heating rate of 10°C / min-15°C / min. The ceramic green body is then heated from the first temperature to a second temperature at a second heating rate of 3°C / min-5°C / min. The ceramic green body is then heated from the second temperature to a third temperature at a third heating rate of 5°C / min-10°C / min. Finally, the ceramic green body is heated from the third temperature to a fourth temperature at a fourth heating rate of 20°C / min-50°C / min.

[0074] Through sintering, the pore-forming agent and binder in the slurry decompose sequentially under temperature, leaving corresponding pores inside the protective layer 12. For example, when the ceramic body is at the first temperature, residual solvents and low-temperature volatile substances in the protective layer 12 can be removed. When the ceramic body is at the second temperature, the binder in the protective layer 12 can be removed, causing it to decompose and carbonize at high temperature. When the ceramic body is at the third temperature, residual carbon in the slurry can be removed, ensuring complete debinding before the sintering process. When the ceramic body is at the fourth temperature, rapid heating and high-speed sintering allow the metal powder to sinter together, simultaneously forming through-pores and improving the structural strength and shape stability of the protective layer 12.

[0075] Please refer to Figure 6 , Figure 6 The process flow of the method for preparing the ceramic matrix in one embodiment of this application is as follows. Figure 4 In one embodiment, the step of sintering the ceramic blank in S300 to form a plurality of through holes communicating with the ceramic substrate 11 in the protective layer 12 includes: S310, the ceramic blank is sintered in an environment with a vacuum degree of 1-100 Pa.

[0076] Optionally, the vacuum degree can be 20 Pa, 40 Pa, 60 Pa, or 80 Pa, etc. Since metal powder is easily oxidized when sintered at high temperatures in air, this embodiment reduces the probability of oxidation of metal powder in the slurry by sintering the ceramic green body in an environment of 1-100 Pa, that is, by sintering the ceramic green body in an environment of less than 100 Pa, thus reducing the difficulty of preparation and improving the preparation efficiency.

[0077] Please refer to this as well. Figures 7-10 , Figure 7 This is a structural diagram of a ceramic substrate according to one embodiment of this application. Figure 8 This is a partial enlarged view of the protective layer in one embodiment of this application. Figure 9 This is a structural diagram of the ceramic matrix in one embodiment of this application. Figure 10 This is a cross-sectional view of the ceramic substrate in one embodiment of this application. In one embodiment, the method for preparing the atomizing core 2 includes:

[0078] Step 1: Take the ceramic substrate 11 and place it in an ultrasonic cleaner. Clean it using a cleaning agent and then pure water. Afterward, place the ceramic substrate 11 in a drying oven to dry it. Drying conditions: 100-150℃, heat preservation for 1-5 hours. Figure 7 As shown, Figure 7 The outer surface of the ceramic substrate 11 is not provided with a protective layer 12.

[0079] The second step involves printing a paste onto the non-heating surface of the ceramic substrate 11 using a screen printing process to form a protective layer 12 with a printing thickness of 50-200 μm, thereby obtaining a ceramic blank.

[0080] The third step is to place the ceramic blank in a drying oven and dry it at 60-120℃ for 30-120 minutes.

[0081] Step 4: Place the dried ceramic blank into a vacuum furnace, requiring a vacuum level of less than 100 Pa.

[0082] Step 5: The sample is sintered at high temperature using a rapid high-temperature firing method, so that the protective layer 12 is sintered and through-holes are formed simultaneously. Figure 8 As shown. It should be noted that, in Figure 8 In the image, the magnification is 200k and the scale bar is 100μm.

[0083] Sintering process conditions: ① Room temperature - 300℃, heating rate 10-15℃ / min; ② 300℃-300℃, holding for 30-60min; ③ 300-500℃, heating rate 3-5℃ / min; ④ 500℃-500℃, holding for 30-60min; ⑤ 500-950℃, heating rate 5-10℃ / min; ⑥ 950℃-950℃, holding for 10-30min; ⑦ 950℃-1150℃, heating rate 20-50℃ / min; ⑧ 1150℃-1150℃, holding for 1-5min, then stop heating and cool down with the furnace.

[0084] Step 6: Sintering completes, yielding ceramic matrix 1. (Example:...) Figure 9 and Figure 10 As shown.

[0085] Step 7: Print the heating resistor paste onto the heating surface of the ceramic substrate 1 obtained in step 6 again using the screen printing process.

[0086] Step 8: Place the sample obtained in step 7 into a drying oven and dry it at 60-120℃ for 30-120 minutes.

[0087] Step 9: Place the sample obtained in step 8 into a vacuum furnace, requiring a vacuum level of less than 50 Pa.

[0088] Step 10: Vacuum sinter the sample from Step 9. Sintering process conditions: ① Room temperature - 500℃, heating rate 3-8℃ / min; ② 500℃ - 500℃, holding for 30-60min; ③ 500℃ - sintering temperature (950-1050℃), heating rate 5-10℃ / min; ④ Holding at sintering temperature for 60-180min, then stop heating and cool down with the furnace.

[0089] Step 11: Complete sintering and remove the sample to obtain atomizing core 2.

[0090] The following provides detailed descriptions of the preparation method of the atomizing core 2 of this application using Examples 1-3 and comparative examples:

[0091] In Example 1, the printing thickness of the protective layer 12 is 120 μm. The sintering process conditions for the sintered ceramic blank are as follows: vacuum degree less than 100 Pa, ① room temperature - 300℃, heating rate 15℃ / min; ② 300℃ - 300℃, holding for 30 min; ③ 300 - 500℃, heating rate 4℃ / min; ④ 500℃ - 500℃, holding for 35 min; ⑤ 500 - 950℃, heating rate 10℃ / min; ⑥ 950℃ - 950℃, holding for 15 min; ⑦ 950℃ - 1150℃, heating rate 30℃ / min; ⑧ 1150℃ - 1150℃, holding for 3 min, then heating is stopped and the furnace is cooled down. The remaining steps are as described in the above method for preparing the atomizing core 2.

[0092] In Example 2, the printing thickness of the protective layer 12 is 200 μm. The sintering process conditions for the sintered ceramic blank are as follows: vacuum degree less than 100 Pa, ① room temperature - 300℃, heating rate 15℃ / min; ② 300℃ - 300℃, holding for 30 min; ③ 300 - 500℃, heating rate 4℃ / min; ④ 500℃ - 500℃, holding for 35 min; ⑤ 500 - 950℃, heating rate 10℃ / min; ⑥ 950℃ - 950℃, holding for 15 min; ⑦ 950℃ - 1150℃, heating rate 30℃ / min; ⑧ 1150℃ - 1150℃, holding for 5 min, then heating is stopped and the furnace is cooled down. The remaining steps are as described in the above method for preparing the atomizing core 2.

[0093] In Example 3, the printing thickness of the protective layer 12 is 50 μm, and the sintering process conditions of the sintered ceramic blank are as follows: vacuum degree less than 100 Pa, ① room temperature - 300℃, heating rate 15℃ / min; ② 300℃ - 300℃, holding for 30 min; ③ 300 - 500℃, heating rate 4℃ / min; ④ 500℃ - 500℃, holding for 35 min; ⑤ 500 - 950℃, heating rate 10℃ / min; ⑥ 950℃ - 950℃, holding for 15 min; ⑦ 950℃ - 1150℃, heating rate 30℃ / min; ⑧ 1150℃ - 1150℃, holding for 1 min, and then heating is stopped and the furnace is cooled down.

[0094] In the comparative example: the ceramic substrate 11 without the protective layer 12 was not prepared, and was the same as the ceramic substrate 11 used in the example.

[0095] Under the same conditions, the compressive strength N of ceramics was tested using a pressure machine, and the results are shown in the table below:

[0096] category Comparative Example Example 1 Example 2 Example 3 Compressive strength N 180 650 860 490

[0097] As shown in the table above, after the protective layer 12 is prepared on the surface of the ceramic substrate 11, the strength of the ceramic substrate 11 with the protective layer 12 is significantly enhanced under the same testing conditions. Furthermore, as the thickness of the protective layer 12 increases, the strength of the ceramic substrate 1 gradually increases, indicating that the protective layer 12 can improve the structural strength of the atomizing core 2.

[0098] The compressive strength of the ceramic matrix 1 is 490N-900N. Optionally, the compressive strength of the ceramic matrix 1 can be 550N, 600N, 650N, 700N, 750N, 800N, or 850N, etc.

[0099] Please refer to Figures 1-3 This application also provides an atomizing core 2, which includes a heating element 21 and a ceramic substrate 1 prepared by the method of ceramic substrate 1 provided above. The heating element 21 is disposed on the ceramic substrate 11 of the ceramic substrate 1 and is insulated from the protective layer 12 of the ceramic substrate 1.

[0100] The protective layer 12 is insulated from the heating element 21. For example, a gap exists between the protective layer 12 and the heating element 21. Alternatively, an insulating element is provided between the protective layer 12 and the heating element 21. Optionally, the thickness ratio of the protective layer 12 to the ceramic substrate 11 is less than 1:10. Optionally, the thickness of the ceramic substrate 11 is 2mm-5mm, and the thickness of the protective layer 12 is 50um-250um.

[0101] The atomizing core 2 provided in this embodiment uses a ceramic substrate 1 prepared by the above-described preparation method of this application. A protective layer 12 is provided on a portion of the outer surface of the ceramic substrate 11 to improve the structural strength and toughness of the ceramic substrate 1 and reduce the probability of powder shedding from the ceramic substrate 1, thereby extending the service life of the atomizing core 2 and improving the user experience.

[0102] Please refer to Figure 2 In one embodiment, the ceramic substrate 11 includes a first end face 113 and a second end face 114 disposed opposite to each other, and a peripheral side face 115 bent and connected between the first end face 113 and the second end face 114. The first end face 113 is used to mount the heating element 21, and the second end face 114 and the peripheral side face 115 are used to provide the protective layer 12.

[0103] The first end face 113 is a heating surface 111, used to mount the heating element 21. The second end face 114 and the peripheral side face 115 are non-heating surfaces 112. For example, a protective layer 12 is disposed on the second end face 114. For another example, a protective layer 12 is disposed on the peripheral side face 115. For yet another example, a protective layer 12 is disposed on both the second end face 114 and the peripheral side face 115.

[0104] This embodiment reduces the difficulty of printing paste onto the ceramic substrate 11 and improves the manufacturing efficiency by placing the protective layer 12 on the non-heated surface 112 of the ceramic substrate 11. Furthermore, it avoids interference between the protective layer 12 and the heating element 21, thus improving the stability of the atomizing core 2.

[0105] Please refer to Figure 11 , Figure 11 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 3 In one embodiment, the second end face 114 is recessed with a liquid guiding groove 116, and the protective layer 12 is also provided on at least a portion of the wall of the liquid guiding groove 116.

[0106] The second end face 114 is the surface facing away from the heating surface 111. A liquid guiding groove 116 is recessed on the second end face 114. The liquid guiding groove 116 can increase the contact area between the aerosol substrate and the ceramic substrate 11, and improve the liquid guiding performance of the ceramic substrate 1. A protective layer 12 is provided on the side wall and / or bottom wall of the liquid guiding groove 116.

[0107] The protective layer 12 of this embodiment is also provided on at least part of the wall of the liquid guiding tank 116, thereby further improving the structural strength of the ceramic substrate 1, further improving the toughness of the ceramic substrate 1, and further reducing the probability of powder shedding from the ceramic substrate 1.

[0108] Please refer to Figure 11 In one embodiment, the protective layer 12 located on the wall of the liquid guiding groove 116 is mesh-like.

[0109] In this embodiment, the protective layer 12 provided on the wall of the liquid guiding tank 116 is mesh-like, which facilitates the aerosol substrate to quickly pass through the mesh protective layer 12 and flow into the ceramic substrate 11, thereby improving the liquid guiding performance of the ceramic substrate 1.

[0110] Please refer to Figure 12 , Figure 12 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 4 In one embodiment, a bend 117 is formed at the connection between the second end face 114 and the peripheral side face 115, the thickness of the protective layer 12 located in the bend 117 is greater than the thickness of the protective layer 12 located in the second end face 114, and the thickness of the protective layer 12 located in the bend 117 is greater than the thickness of the protective layer 12 located in the peripheral side face 115.

[0111] The thickness of the protective layer 12 at the bend 117 is greater than the thickness of the protective layer 12 at the second end face 114 and the peripheral side face 115. The bend 117 can also be understood as the corner of the ceramic substrate 11. Since the bend 117 is prone to chipping and powdering, increasing the thickness of the protective layer 12 at the bend 117 can further improve the structural strength and toughness of the ceramic substrate 1, and further reduce the probability of chipping from the ceramic substrate 1.

[0112] Please refer to Figure 13 , Figure 13 A schematic diagram of the structure of the atomizing core provided in one embodiment of this application. Figure 5 In one embodiment, a connecting groove 118 is recessed on the outer surface of the ceramic substrate 11, and the protective layer 12 includes a first part 121 and a second part 122 connected to each other. The first part 121 covers the outer surface of the ceramic substrate 11, and the second part 122 is disposed in the connecting groove 118.

[0113] The second end face 114 and / or the peripheral side face 115 are recessed with a connecting groove 118. A portion of the protective layer 12 is disposed within the connection, and another portion is disposed on the outer surface of the ceramic substrate 11. Alternatively, it can be understood that a portion of the protective layer 12 is embedded in the ceramic substrate 11. This arrangement can improve the connection performance between the ceramic substrate 11 and the protective layer 12, further improve the structural strength of the ceramic substrate 1, further improve the toughness of the ceramic substrate 1, and further reduce the probability of powder shedding from the ceramic substrate 1.

[0114] In one embodiment, the ceramic substrate has micropores, and the through-hole diameter of the protective layer is larger than the micropore diameter.

[0115] Optionally, the micropore diameter of the ceramic substrate is 15µm-35µm. Optionally, the through-hole diameter of the protective layer is 20µm-50µm. The through-hole diameter of the protective layer is larger than the minimum micropore diameter of the ceramic substrate.

[0116] This embodiment improves the flow rate of aerosol substrate from the through holes to the micropores by making the diameter of the through holes in the protective layer larger than the diameter of the micropores in the ceramic substrate, thereby improving the liquid conductivity of the ceramic matrix.

[0117] This application also provides an aerosol forming apparatus, which includes a housing, a battery assembly, and an atomizing core as described above. The battery assembly and the atomizing core are disposed within the housing, and the battery assembly is electrically connected to the atomizing core. The battery assembly is used to provide energy to the atomizing core and control atomization parameters. The atomizing core is used to heat and atomize the aerosol substrate within the housing.

[0118] The aerosol forming apparatus provided in this embodiment, by employing the atomizing core provided in this application above, provides a protective layer on a portion of the outer surface of the ceramic substrate to improve the structural strength and toughness of the ceramic substrate, reduce the probability of powder shedding from the ceramic substrate, thereby extending the service life of the atomizing core and improving the user experience.

[0119] The above provides a detailed description of the embodiments provided in this application. This document elucidates and explains the principles and implementation methods of this application. The above description is only intended to help understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for producing a ceramic matrix, characterized by, The method for preparing the ceramic substrate comprises: providing a ceramic substrate, an outer surface of the ceramic substrate comprising a heating surface for installing a heating element and a non-heating surface; providing a slurry, the slurry consisting of metal powder, sintering aid, binder, dispersant and solvent, the material of the metal powder being nickel; printing the slurry on the non-heating surface to form a protective layer covering the non-heating surface, obtaining a ceramic green body; and sintering the ceramic green body to make the protective layer form a plurality of through holes communicating with the ceramic substrate, obtaining a ceramic substrate.

2. The method for preparing the ceramic matrix as described in claim 1, characterized in that, In the slurry, the mass percentage of the metal powder, the sintering aid, the binder, the dispersant and the solvent is (80%-85%):(0.5%-3%):(1.5%-3%):(0.2%-0.6%):(10%-15%).

3. The method for preparing the ceramic matrix as described in claim 1, characterized in that, In the step of sintering the ceramic green body to make the protective layer form a plurality of through holes communicating with the ceramic substrate, comprising: warming the ceramic green body from room temperature to a first temperature and keeping for 30-60 minutes, the first temperature being 280-320℃; warming the ceramic green body from the first temperature to a second temperature and keeping for 30-60 minutes, the second temperature being 480-520℃; warming the ceramic green body from the second temperature to a third temperature and keeping for 10-30 minutes, the third temperature being 930-970℃; warming the ceramic green body from the third temperature to a fourth temperature and keeping for 1-5 minutes, the fourth temperature being 1130-1170℃; cooling the ceramic green body from the fourth temperature to room temperature to obtain the ceramic substrate.

4. An atomizing core characterized by, The atomizing core comprises a heating element and a ceramic substrate prepared by the method for preparing the ceramic substrate according to any one of claims 1-3, the heating element being arranged on the ceramic substrate of the ceramic substrate and being insulated from the protective layer of the ceramic substrate.

5. The atomizer wick of claim 4, wherein, The ceramic substrate comprises a first end surface and a second end surface arranged oppositely and a circumferential surface connected between the first end surface and the second end surface, the first end surface being used for installing the heating element, and the second end surface and the circumferential surface being used for arranging the protective layer.

6. The atomizer wick of claim 5, wherein, The connection between the second end surface and the circumferential surface forms a bending part, the thickness of the protective layer at the bending part being greater than the thickness of the protective layer at the second end surface, and the thickness of the protective layer at the bending part being greater than the thickness of the protective layer at the circumferential surface.

7. The atomizer wick of claim 4, wherein, The ceramic substrate has micropores, and the pore size of the through holes of the protective layer is greater than the pore size of the micropores.

8. An aerosol forming device, characterised in that, The aerosol forming device comprises a shell, an electric core assembly and the atomizing core according to any one of claims 4-7, the electric core assembly and the atomizing core being arranged in the shell, and the electric core assembly being electrically connected to the atomizing core, the electric core assembly being used for providing energy to the atomizing core and controlling atomization parameters, and the atomizing core being used for heating and atomizing aerosol substrates in the shell.

Images